CN113900003A - Chip pin disconnection detection device and detection method - Google Patents
Chip pin disconnection detection device and detection method Download PDFInfo
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- CN113900003A CN113900003A CN202010648822.6A CN202010648822A CN113900003A CN 113900003 A CN113900003 A CN 113900003A CN 202010648822 A CN202010648822 A CN 202010648822A CN 113900003 A CN113900003 A CN 113900003A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
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Abstract
本发明公开了一种芯片引脚的断线检测装置及检测方法，该装置包括：电压源，与待测芯片的至少一个输入引脚连接，用于向待测芯片提供测试电压；开关模块，其多个输入端分别与待测芯片的多个输出引脚一一对应连接；电压测量模块，与开关模块的输出端连接，用于测量待测芯片的多个输出引脚的输出电压，其中，当测量的输出电压存在异常时，判定待测芯片对应该输出电压的输出引脚存在断线；开关模块基于第一控制信号一次连通多个输出引脚中的一个输出引脚与电压测量装置的电连接通道，以依次判断待测芯片的多个输出引脚是否存在断线。本发明能够实现对芯片的每个引脚的分别检测，极大地提高了断线检测的准确率。
The invention discloses a chip pin disconnection detection device and a detection method. The device comprises: a voltage source connected to at least one input pin of a chip to be tested and used for providing a test voltage to the chip to be tested; a switch module, The multiple input terminals are respectively connected with the multiple output pins of the chip to be tested in one-to-one correspondence; the voltage measurement module is connected to the output terminal of the switch module, and is used to measure the output voltage of the multiple output pins of the chip to be tested, wherein , when the measured output voltage is abnormal, it is determined that the output pin corresponding to the output voltage of the chip to be tested is disconnected; the switch module connects one output pin of the multiple output pins with the voltage measurement device based on the first control signal at a time The electrical connection channel is used to determine whether the multiple output pins of the chip to be tested are disconnected in turn. The invention can realize the separate detection of each pin of the chip, and greatly improves the accuracy of wire break detection.
Description
Technical Field
The invention relates to the technical field of chip testing, in particular to a device and a method for detecting broken wires of chip pins.
Background
In a factory test of a chip, a defective product is often selected. In the process of detecting a plurality of pins of the same network, the prior art can only detect whether the networks such as the input and the output of one chip are broken, but cannot detect whether each pin of the chip is not broken.
The accuracy is poor when the existing pin disconnection detection method is used for disconnection detection, and the error rate is very high.
Therefore, there is a need to provide an improved technical solution to overcome the above technical problems in the prior art.
Disclosure of Invention
In order to solve the technical problems, the invention provides a device and a method for detecting the disconnection of the chip pins, which can realize the respective detection of each pin of the chip and greatly improve the accuracy of the disconnection detection.
The invention provides a device for detecting the disconnection of a chip pin, which comprises: the voltage source is connected with at least one input pin of the chip to be tested and used for providing test voltage for the chip to be tested; the switch module comprises a plurality of input ends, and the plurality of input ends of the switch module are respectively connected with the plurality of output pins of the chip to be tested in a one-to-one correspondence manner; the voltage measuring module is connected with the output end of the switch module and used for measuring the output voltages of a plurality of output pins of the chip to be measured, wherein when the measured output voltages are abnormal, the output pins of the chip to be measured corresponding to the output voltages are judged to be broken; and the switch module is communicated with an electric connection channel of one output pin in the output pins of the chip to be tested and the voltage measuring device at a time based on a first control signal so as to sequentially judge whether the output pins of the chip to be tested have broken lines.
Preferably, the switch module is a plurality of first relays, a first end of each of the plurality of first relays is correspondingly connected to one of the plurality of output pins of the chip to be tested, and a second end of each of the plurality of first relays is connected to the voltage measurement module.
Preferably, the switch module is a one-out-of-multiple selection switch, a plurality of input ends of the one-out-of-multiple selection switch are respectively connected with a plurality of output pins of the chip to be tested in a one-to-one correspondence manner, and an output end of the one-out-of-multiple selection switch is connected with the voltage measurement module.
Preferably, the voltage measurement module is a high-precision measurement board card or a high-precision digital multimeter.
Preferably, the disconnection detecting device further includes: and the control signal generating module is connected with the switch module and used for providing the first control signal for the switch module.
Preferably, the disconnection detecting device further includes: and the second relay is connected between the switch module and the voltage measuring module and is used for connecting or disconnecting the electric connection channel of the switch module and the voltage measuring module based on a second control signal.
Preferably, the disconnection detecting device further includes: and the control signal generating module is respectively connected with the switch module and the second relay and is used for providing the first control signal for the switch module and providing the second control signal for the second relay.
The invention provides a method for detecting disconnection of a chip pin, which is characterized by comprising the following steps: providing a test voltage to at least one input end of a chip to be tested by a voltage source; sequentially measuring the output voltage of each output end in a plurality of output ends of the chip to be measured by a voltage measuring module; judging whether the output voltage obtained by measurement is abnormal or not, and judging that the output pin of the chip to be measured corresponding to the output voltage has a broken line when the output voltage is abnormal, wherein the method for measuring the output voltage of each output end in a plurality of output ends of the chip to be measured by the voltage measurement module sequentially comprises the following steps: a switch module is arranged between a plurality of output ends of the chip to be tested and the voltage measuring module; a switch module sequentially selects a connecting channel which is communicated with the plurality of output ends of the chip to be measured and the voltage measuring module based on a first control signal; and the voltage measuring module is used for sequentially measuring the output voltage of each output end in the plurality of output ends of the chip to be measured based on the communicated connecting channel.
Preferably, the switch module is a one-out-of-multiple selection switch or a plurality of first relays.
Preferably, the disconnection detecting method further includes: a second relay is arranged between the switch module and the voltage measuring module; and the second relay is used for communicating the switch module with a connecting channel of the voltage measuring module when detecting the pin disconnection of the chip to be detected based on a second control signal.
Preferably, the control signal generating module provides a first control signal to the switch module and a second control signal to the second relay, respectively.
Preferably, when the number of the measured abnormal output voltages corresponding to the output pins of the chip to be tested exceeds a preset threshold, it is determined that the input pin of the chip to be tested is disconnected.
The invention has the beneficial effects that: the invention discloses a device and a method for detecting broken lines of chip pins, wherein a switch module with a plurality of input ends is arranged at a plurality of output pins of a chip to be detected, the switch module is controlled to be communicated with an electric connecting channel of one output pin of the plurality of output pins of the chip to be detected and a voltage measuring device at one time based on a first control signal, and the voltage measuring module tests the plurality of output pins of the chip to be detected one by one based on the communicated connecting channel so as to sequentially judge whether the plurality of output pins of the chip to be detected have broken lines. Because only one of a plurality of output pins of the chip to be detected is measured at a time, each pin of the chip can be detected respectively, and the accuracy of the broken line detection of the chip is greatly improved.
Choose for use a plurality of first relays as switch module, not only can realize detecting one by one to a plurality of output pin of chip that awaits measuring, also can realize the basic test to the chip that awaits measuring through whole closed these a plurality of first relays, can not influence the basic capability test to the chip.
And a more-than-one selection switch is selected as a switch module, so that the required control signals are few, and the optimization of the circuit structure is facilitated.
When chooseing for use a plurality of first relays as switch module, through set up the second relay between these a plurality of first relays and voltage measurement device, can not influence the broken string detection to the chip pin promptly, also can realize the control to the basic capability test of chip through second control signal simultaneously, reduced the total test cost of chip.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.
Drawings
The above and other objects, features and advantages of the present invention will become more apparent from the following description of the embodiments of the present invention with reference to the accompanying drawings.
Fig. 1 is a schematic structural diagram illustrating a device for detecting a disconnection of a chip pin according to a related art;
fig. 2 is a system block diagram of a device for detecting a disconnection of a chip pin according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram illustrating a device for detecting a wire break of a chip pin according to a first embodiment of the present invention;
fig. 4 is a schematic structural diagram illustrating a device for detecting a wire break of a chip pin according to a second embodiment of the present invention;
FIG. 5 is a flow chart of a method for detecting a disconnection of a chip pin according to an embodiment of the present invention;
fig. 6 is a flowchart illustrating a method for sequentially measuring output voltages of a chip to be measured one by the voltage measurement module in the disconnection detection of the chip pin according to an embodiment of the present invention.
Detailed Description
In order to facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
The present invention will be described in detail below with reference to the accompanying drawings.
Fig. 1 is a schematic structural diagram illustrating a device for detecting a disconnection of a chip pin according to a related art.
As shown in fig. 1, the device for detecting a disconnection of a chip pin includes: a voltage source U1, a relay 11 and a high-precision board card 12.
The voltage source U1 is connected to at least one input pin of the chip 10 to be tested, and is configured to provide a test voltage to the chip 10 to be tested. One end of the relay 11 is connected with all output pins of the chip 10 to be tested, and the other end of the relay 11 is connected with the high-precision board card 12. The relay 11 is used for connecting or disconnecting an electrical connection channel between an output pin of the chip 10 to be tested and the high-precision board card 12 according to the control signal. The high-precision board card 12 is used for measuring the output voltage of the output pin of the chip 10 to be measured when the relay 11 is turned on.
Further, whether the output pin of the chip 10 to be tested has a broken line or not can be determined by determining whether the output voltage of the output pin of the chip 10 to be tested is abnormal or not. For example, when the output voltage of the output pin of the chip 10 under test obtained by measurement is abnormal (for example, the output voltage is close to zero, or the difference value with the standard output voltage exceeds a threshold), it can be determined that the output pin of the chip 10 under test has a wire break.
The chip 10 to be tested is, for example, an LDO (Low Dropout Regulator), which includes input pins VIN and Vcon, output pins VOUT1, VOUT2, VOUT3, VOUT4, VOUT5, VOUT6 and VOUT7, and a reset pin RET. The input pins VIN and Vcon are connected to a voltage source U1, the output pins VOUT 1-VOUT 7 are connected to the high-precision board 12 through the relay 11, and the reset pin RET is grounded through a first resistor R1.
It should be noted that the chip pin structure of the chip 10 under test shown in fig. 1 is only understood as an exemplary embodiment, and the device for detecting a broken wire of a chip pin disclosed herein can also detect a broken wire of other types or structures of chips by using the same or similar principles.
The device for detecting the disconnection of the chip pin can detect whether the input pin of the chip 10 to be detected is disconnected, but can not detect each output pin of the chip 10 to be detected respectively. When the device is used for detecting the broken line of the chip, the accuracy rate is lower.
Fig. 2 is a system block diagram of a device for detecting a disconnection of a chip pin according to an embodiment of the present invention, fig. 3 is a schematic structural diagram of the device for detecting a disconnection of a chip pin according to a first embodiment of the present invention, and fig. 4 is a schematic structural diagram of the device for detecting a disconnection of a chip pin according to a second embodiment of the present invention.
As shown in fig. 2, in this embodiment, the device for detecting a wire break of a chip pin includes: a voltage source U2, a switching module 13, and a voltage measurement module 12.
The voltage source U2 is connected to at least one input pin of the chip 10 to be tested, and is configured to provide a test voltage to the chip 10 to be tested.
The switch module 13 includes a plurality of input terminals, and the plurality of input terminals of the switch module 13 are respectively connected to the plurality of output pins of the chip 10 to be tested in a one-to-one correspondence manner.
The voltage measurement module 12 is connected to an output terminal of the switch module 13, and is configured to measure output voltages of a plurality of output pins of the chip to be tested one by one when the switch module 13 is at least partially turned on. The voltage measurement module 12 may provide a high-precision voltage measurement device for a high-precision measurement board card or a high-precision digital multimeter.
Further, the switch module 13 is configured to communicate with an electrical connection channel between one of the output pins of the chip 10 to be tested and the voltage measurement device 12 at a time based on the first control signal, so as to sequentially determine whether the output pins of the chip 10 to be tested are broken. When the output voltage measured by the voltage measuring device 12 is abnormal (for example, the output voltage is nearly zero or the difference between the output voltage and the standard output voltage exceeds the threshold), it is determined that the output pin of the chip 10 to be tested corresponding to the output voltage with the abnormality has a wire break. And further, when the output voltages of all the output pins of the chip 10 to be tested measured by the voltage measuring device 12 are abnormal, or the number of the abnormal output voltages exceeds a threshold value, it can be determined that the input pins of the chip 10 to be tested are disconnected.
Illustratively, the chip 10 under test is, for example, an LDO (Low Dropout Regulator), which includes input pins VIN and Vcon, output pins VOUT1, VOUT2, VOUT3, VOUT4, VOUT5, VOUT6 and VOUT7, and a reset pin RET. The input pins VIN and Vcon are connected to a voltage source U2, the output pins VOUT1 to VOUT7 are connected to a plurality of input terminals of the switch module 13 in a one-to-one correspondence, and the reset pin RET is grounded through a second resistor R2.
It should be noted that the chip pin structure of the chip 10 under test shown in fig. 1 is only understood as an exemplary embodiment, and the device for detecting a broken wire of a chip pin disclosed herein can also detect a broken wire of other types or structures of chips by using the same or similar principles.
Furthermore, the device for detecting the disconnection of the chip pin disclosed by the invention also comprises a control signal generating module. The control signal generating module is connected to a control terminal of the switch module 13, and is configured to provide a first control signal to the switch module 13.
Further, the device for detecting the disconnection of the chip pin disclosed by the invention further comprises a second relay 11. The second relay 11 is connected between the switching module 13 and the voltage measuring module 12, and connects or disconnects an electrical connection path of the switching module 13 and the voltage measuring module 12 based on a second control signal. The second relays are arranged between the plurality of first relays and the voltage measuring device, so that the disconnection detection of chip pins cannot be influenced, meanwhile, the control of the basic performance test of the chip can be realized through the second control signals, and the total test cost of the chip is reduced. At this time, the second relay 11 is connected to the control signal generating module, and the control signal generating module provides a second control signal required by the second relay 11. Alternatively, the second relay 11 may also be connected to another separate control signal generating module, which provides the second control signal required by the second relay 11. The invention is not limited in this regard.
Fig. 3 and 4 show two different embodiments of the device shown in fig. 2, and only the differences between the two embodiments will be described below, and the same parts can be understood by referring to the description of fig. 2, and will not be described again here.
As shown in fig. 3, in the first embodiment of the present invention, the switch module 13 is a one-out-of-multiple selection switch 131. The one-out-of-multiple selection switch 131 has a plurality of input terminals and an output terminal, the plurality of input terminals of the one-out-of-multiple selection switch 131 are respectively connected with the plurality of output pins of the chip 10 to be tested in a one-to-one correspondence, and the output terminal of the one-out-of-multiple selection switch 131 is connected with the voltage measurement module 12 or connected with the voltage measurement module 12 through the second relay 11.
In this embodiment, if it is necessary to detect whether one of the output pins of the chip 10 to be tested, such as the output pin VOUT3, is broken, the second relay 11 is controlled to be turned on by the second control signal, and the one-out-of-multiple selection switch 131 is controlled by the first control signal to connect the input terminal of the one-out-of-multiple selection switch 131 corresponding to the output pin VOUT3 to the output terminal of the one-out-of-multiple selection switch 131, so that the voltage measurement module 12 performs voltage measurement on the output pin VOUT3 of the chip 10 to be tested, and then determines whether the output pin VOUT3 is broken according to the measured output voltage. Further, when the disconnection of all the output pins of the chip 10 to be tested needs to be detected, the second relay 11 may be controlled to be turned on by the second control signal, and the first control signal controls the one-out-of-multiple selection switch 131 to sequentially connect all the input terminals thereof to the output terminals once (this connection is one connection, that is, when the input terminals are connected to the output terminals, other input terminals are all disconnected from the output terminals), the voltage measurement module 12 sequentially measures the output voltages of all the output pins of the chip 10 to be tested, and then the disconnection of all the output pins of the chip 10 to be tested is determined according to the output voltages obtained by the measurement. Through the implementation mode, one of the corresponding measuring channels of the output pins can be switched on only by one control signal, the number of required signal connection paths is small, optimization of chip layout is facilitated, and miniaturization of the monitoring device is facilitated.
As shown in fig. 4, in the second embodiment of the present invention, the switch module 13 is a plurality of first relays 132. The first end of each of the plurality of first relays 132 is correspondingly connected to one of the plurality of output pins of the chip 10 to be tested, and the second end of each of the plurality of first relays 132 is connected to the voltage measurement module 12, or connected to the voltage measurement module 12 through the second relay 11. The plurality of first relays 132 receive a plurality of first control signals (each of the plurality of first relays 132 receives a corresponding first control signal), and the plurality of first control signals are used to turn on/off each of the plurality of first relays 132.
In this embodiment, if it is necessary to detect whether one of the output pins of the chip 10 to be tested, such as the output pin VOUT3, is disconnected, the second relay 11 may be controlled to be turned on by the second control signal, and the first relays corresponding to the output pin VOUT3 in the first relays 132 are controlled to be turned on and the other first relays are controlled to be turned off by the first control signals, so that the voltage measurement module 12 measures the voltage of the output pin VOUT3 of the chip 10 to be tested, and then determines whether the output pin VOUT3 is disconnected according to the measured output voltage. Further, when it is necessary to perform disconnection detection on all output pins of the chip 10 to be detected, the second control signal may control the second relay 11 to be turned on, and the plurality of first control signals control each of the plurality of first relays 132 to be turned on once (when one of the plurality of first relays is turned on, the other first relays are turned off), the voltage measurement module 12 sequentially measures the output voltages of all output pins of the chip 10 to be detected, and then determines disconnection conditions of all output pins of the chip 10 to be detected according to the output voltages obtained by measurement. Through this kind of embodiment, not only can realize detecting one by one to a plurality of output pin of chip that awaits measuring, also can realize the basic test to the chip that awaits measuring through whole closed these a plurality of first relays, can not influence the basic capability test to the chip.
Fig. 5 is a flowchart illustrating a method for detecting a disconnection of a chip pin according to an embodiment of the present invention, and fig. 6 is a flowchart illustrating a method for sequentially measuring output voltages of a chip to be measured one by a voltage measurement module in the disconnection detection of the chip pin according to the embodiment of the present invention.
In this embodiment, the method for detecting the disconnection of the chip pin can be understood with reference to fig. 2 to 4. As shown in fig. 5, the method specifically includes:
in step S1, a test voltage is provided by a voltage source to at least one input terminal of the chip under test.
At least one input end of the chip 10 to be tested is connected with the voltage source U2, and the voltage source U2 provides the measurement voltage required by the test to the chip 10 to be tested.
In step S2, the voltage measurement module sequentially measures the output voltage of each of the plurality of output terminals of the chip to be tested one by one.
As shown in fig. 6, in the present embodiment, executing step S2 further includes executing the following steps:
in step S21, a switch module is disposed between the plurality of output terminals of the chip under test and the voltage measurement module.
A switch module 13 is arranged between the plurality of output ends of the chip 10 to be tested and the voltage measurement module 12, and the switch module 13 controls the voltage measurement module 12 to independently measure the output voltage of each output end of the plurality of output ends of the chip 10 to be tested.
The switch module 13 has a plurality of input terminals and an output terminal, and the plurality of input terminals of the switch module 13 are connected to the plurality of output terminals of the chip 10 to be tested in a one-to-one correspondence manner. The output of the switching module 13 is connected to the voltage measuring module 12 or further to the voltage measuring module 12 via a second relay 11.
In step S22, a switch module sequentially selects a connection channel connecting the output terminals of the chip to be tested and the voltage measurement module based on the first control signal.
Optionally, the switch module 13 is a one-out-of-multiple selection switch or a plurality of first relays. Further, when the switch module 13 is a multi-select multiplexer, one of the inputs of the multi-select multiplexer can be connected to the output thereof by one selection in turn based on the first control signal, so as to provide an output voltage measurement channel for the voltage measurement module 12, which can be understood with reference to fig. 3. When the switch module 13 is a plurality of first relays, it receives a plurality of first control signals, and can select one of the plurality of first relays to turn on one of the plurality of first relays in sequence based on the plurality of first control signals, so as to provide an output voltage measurement channel for the voltage measurement module 12, which can be understood with reference to fig. 4 and will not be described herein again.
Based on step S21, the method for detecting a wire break of a chip pin further includes: a second relay is arranged between the switch module and the voltage measuring module; and the second relay is used for communicating the switch module with a connecting channel of the voltage measuring module when detecting the pin disconnection of the chip to be detected based on the second control signal.
In step S23, the voltage measurement module sequentially measures the output voltage of each of the plurality of output terminals of the chip under test based on the connected connection channels.
The voltage measurement module 12 can provide a high-precision voltage measurement device for a high-precision measurement board card or a high-precision digital multimeter or the like. And the voltage measurement module 12 may sequentially measure the output voltage of each output terminal of the plurality of output terminals of the chip to be tested based on the connected connection channels.
Further, when the second relay 11 is provided between the switch module 13 and the voltage measuring device 14, the second relay 11 should be controlled to be in a conductive state according to the second control signal in the process of performing the output voltage measurement.
In this embodiment, the control signal generating module provides the first control signal and the second control signal to the switch module and the second relay, respectively.
In step S3, it is determined whether the output voltage obtained by measurement is abnormal, and when the output voltage is abnormal, it is determined that the output pin of the chip to be tested corresponding to the output voltage is disconnected.
Based on the foregoing steps, when the output voltage measured by the voltage measuring device 12 is abnormal (for example, the output voltage is nearly zero, or the difference between the output voltage and the standard output voltage exceeds the threshold), it is determined that the output pin of the chip 10 to be tested corresponding to the output voltage with the abnormality has a wire break. And further, when the output voltages of all the output pins of the corresponding chip to be tested 10 measured by the voltage measuring device 12 are abnormal, or the number of the abnormal output voltages exceeds a threshold value, determining that the input pins of the chip to be tested are disconnected.
In summary, the switch module having a plurality of input terminals is disposed at the plurality of output pins of the chip to be tested, the switch module is controlled to once communicate with the electrical connection channel of the voltage measurement device through one of the plurality of output pins of the chip to be tested based on the first control signal, and the voltage measurement module performs one-by-one test on the plurality of output pins of the chip to be tested based on the communicated connection channel, so as to sequentially determine whether the plurality of output pins of the chip to be tested have a wire break. Because only one of a plurality of output pins of the chip to be detected is measured at a time, each pin of the chip can be detected respectively, and the accuracy of the broken line detection of the chip is greatly improved.
It should be noted that, in this document, the contained terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Finally, it should be noted that: it should be understood that the above examples are only for clearly illustrating the present invention and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications of the invention may be made without departing from the scope of the invention.
Claims (12)
1. The utility model provides a disconnected line detection device of chip pin which characterized in that includes:
the voltage source is connected with at least one input pin of the chip to be tested and used for providing test voltage for the chip to be tested;
the switch module comprises a plurality of input ends, and the plurality of input ends of the switch module are respectively connected with the plurality of output pins of the chip to be tested in a one-to-one correspondence manner;
a voltage measuring module connected with the output end of the switch module and used for measuring the output voltage of a plurality of output pins of the chip to be measured,
when the measured output voltage is abnormal, judging that the output pin of the chip to be tested corresponding to the output voltage has a broken line; and
the switch module is communicated with an electric connection channel of one output pin in the output pins of the chip to be tested and the voltage measuring device at a time based on a first control signal so as to sequentially judge whether the output pins of the chip to be tested are broken.
2. The disconnection detecting device according to claim 1, wherein the switch module is a plurality of first relays, a first end of each of the plurality of first relays is correspondingly connected to one of the plurality of output pins of the chip under test, and a second end of each of the plurality of first relays is connected to the voltage measuring module.
3. The disconnection detecting device according to claim 1, wherein the switch module is a one-out-of-many selection switch, a plurality of input terminals of the one-out-of-many selection switch are respectively connected to a plurality of output pins of the chip to be tested in a one-to-one correspondence, and an output terminal of the one-out-of-many selection switch is connected to the voltage measuring module.
4. The disconnection detection device of any one of claims 1 to 3, wherein the voltage measurement module is a high-precision measurement board or a high-precision digital multimeter.
5. The disconnection detection device according to claim 4, further comprising:
and the control signal generating module is connected with the switch module and used for providing the first control signal for the switch module.
6. The disconnection detection device according to claim 2, further comprising:
and the second relay is connected between the switch module and the voltage measuring module and is used for connecting or disconnecting the electric connection channel of the switch module and the voltage measuring module based on a second control signal.
7. The disconnection detection device according to claim 6, further comprising:
and the control signal generating module is respectively connected with the switch module and the second relay and is used for providing the first control signal for the switch module and providing the second control signal for the second relay.
8. A method for detecting disconnection of a chip pin is characterized by comprising the following steps:
providing a test voltage to at least one input end of a chip to be tested by a voltage source;
sequentially measuring the output voltage of each output end in a plurality of output ends of the chip to be measured one by a voltage measuring module;
judging whether the output voltage obtained by measurement is abnormal or not, and judging that the output pin of the chip to be tested corresponding to the output voltage has a broken line when the output voltage is abnormal,
the method for sequentially measuring the output voltage of each output end in the plurality of output ends of the chip to be measured by the voltage measuring module comprises the following steps:
a switch module is arranged between a plurality of output ends of the chip to be tested and the voltage measuring module;
a switch module sequentially selects a connecting channel which is communicated with the plurality of output ends of the chip to be measured and the voltage measuring module based on a first control signal;
and the voltage measuring module is used for sequentially measuring the output voltage of each output end in the plurality of output ends of the chip to be measured based on the communicated connecting channel.
9. The disconnection detection method according to claim 8, wherein the switch module is a one-out-of-multiple selection switch or a plurality of first relays.
10. The disconnection detection method according to any one of claims 8 and 9, further comprising:
a second relay is arranged between the switch module and the voltage measuring module;
and the second relay is used for communicating the switch module with a connecting channel of the voltage measuring module when detecting the pin disconnection of the chip to be detected based on a second control signal.
11. The disconnection detection method of claim 10, wherein a control signal generation module provides a first control signal to the switch module and a second control signal to the second relay, respectively.
12. The disconnection detecting method of claim 8, wherein when the number of the measured output voltages corresponding to the output pins of the chip under test having the abnormality exceeds a preset threshold, it is determined that the input pin of the chip under test has a disconnection.
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