CN113819676A

CN113819676A - Wearable device non-inductive cooling system

Info

Publication number: CN113819676A
Application number: CN202111109516.6A
Authority: CN
Inventors: 耿凯峰; 张政; 张晓民
Original assignee: Nanyang Institute of Technology
Current assignee: Nanyang Institute of Technology
Priority date: 2021-09-22
Filing date: 2021-09-22
Publication date: 2021-12-21

Abstract

The present invention relates to a non-inductive heat dissipation system for wearable devices. By arranging an inner tube in the accessory that communicates with the lower cavity in the outer shell, and using a refrigerator to communicate with the inner tube to supply cold air into the lower cavity, the hot air in the lower cavity is discharged from the inner tube on the other side, the entire The process does not touch the skin; multiple heat dissipation channels are separated by the baffle assembly to cover the heating area of the entire PCB board, so that regardless of the size of the PCB board, uniform heat dissipation can be obtained. The solution of the present application can play a greater role when targeting wearable devices with high power consumption, because wearable devices with high power consumption generate a large amount of heat, and traditional heat dissipation methods can cure the symptoms but not the root cause, and cannot completely solve the problem of heat generation. The solution can completely solve the problem of heating, and greatly improve the skin comfort.

Description

Non-inductive heat dissipation system of wearable equipment

Technical Field

The invention relates to a wearable device non-inductive heat dissipation system.

Background

With the development of science and technology, the intelligent device comes to be endless, and the wearable device is a portable device which is directly worn on the body or integrated into the clothes or accessories of a user. Wearable equipment is not only a hardware equipment, realizes powerful function through software support and data interaction, high in the clouds interaction more, and wearable equipment will bring very big transition to our life, perception. Common wearable devices such as smart watches, smart bracelets, smart glasses, smart foot rings, smart clothing, and the like. Wearable equipment is widely applied to sports, medical treatment and the like, and the relationship between people's daily life and wearable equipment is more and more tight. Most of them require contact with the skin of the human body, for example, attaching the wearable device to the surface of the human body by means of a headband, armband, legband, ankle band, wrist band, belt, etc. Because the inside battery and various electronic components that need set up of casing of wearable equipment, these electronic components can produce the heat when the operation, especially along with smart machine's function is more and more powerful, more and more, the produced heat of electronic components is also more and more, consider that people are required waterproof in the use, it is rain-proof, functions such as sweat-proof, airtight structure need be made to general casing, this just leads to the heat to gather in a large number in the casing, not only can lead to rather uncomfortable rather than direct contact's skin, further lead to the sweat discharge to increase, but also can influence the life-span of inside components and parts when equipment long-time operation.

In order to increase the heat dissipation capacity, the conventional method, such as two methods disclosed in the patent specification of application publication No. CN107850871A, the first method is the most original heat dissipation method, in which a heat sink (substantially a heat dissipation metal sheet) is disposed in close proximity to the PCB board to absorb the heat of the PCB board, and then the heat is transferred to a heat sink (substantially a heat dissipation metal sheet) in close proximity thereto, so that the heat on the PCB board is mainly transferred to the air in the housing by means of heat conduction, and then the air transfers the heat to the housing (on the side close to the skin) in the heat dissipation environment (actually transfers the heat to the skin in contact therewith), which can reduce the heat on the PCB board to some extent, but the temperature in the closed space in the housing is still relatively high, and the skin in contact with the housing feels a higher temperature, the skin is extremely uncomfortable.

For this reason, the improvement point of the patent is that the surface area of the heat sink (substantially, a heat dissipation metal sheet) is increased, and a part of the metal sheet is disposed in the accessory (such as a wrist strap), so as to increase the dissipation speed of heat inside the housing, but this structure still adopts a metal sheet heat conduction manner, and the dissipation speed of heat inside the housing is still very slow, the heat dissipation efficiency is low, and is acceptable for general wearable devices with low power consumption, but for devices with high power consumption (such as wearable devices in the medical field, wearable devices in the sports field, etc.), especially under the trend that the functions of wearable devices are more and more increased and the power consumption is more and more increased, this solution is not a whole and is merely a temporary means for addressing symptoms and not addressing the root causes.

Therefore, nowadays and in the future that wearable equipment power consumption is bigger and bigger, the function is more and more, want the popularization that wearable equipment can the wider, need urgently to solve wearable equipment's travelling comfort problem really and thoroughly for wearable equipment's the problem of generating heat can obtain effectively solving.

Disclosure of Invention

The invention aims to provide a non-inductive heat dissipation system of wearable equipment, which is used for solving the technical problem of poor heat dissipation of the wearable equipment, particularly the wearable equipment with high power consumption.

The technical scheme of the invention is as follows:

wearable equipment noninductive cooling system includes:

a housing having at least one PCB board containing a plurality of electronic components therein that emit heat during operation of the wearable device;

an attachment attached to the housing, including left and right attachments on either side of the housing, respectively;

the periphery of the screen plate is abutted against the inner peripheral wall of the shell to divide the shell into an upper cavity and a lower cavity which are mutually communicated through meshes of the screen plate, the middle part of the screen plate is provided with a mounting hole with the same size as that of a PCB (printed circuit board), the PCB is embedded in the mounting hole, and the surface with larger heat productivity of the PCB is arranged towards the lower cavity;

the inner pipe comprises a left inner pipe and a right inner pipe which are respectively positioned in the left accessory and the right accessory, one end of each of the left inner pipe and the right inner pipe is communicated with the lower cavity through a first joint, the other end of each of the left inner pipe and the right inner pipe extends out of one end, far away from the shell, of the corresponding accessory, a second joint is arranged at the extending end, and a sealing plug is detachably connected to the second joint;

the partition plate assembly is positioned in the lower cavity and comprises a plurality of partition plates arranged in the direction vertical to the PCB, the partition plates enclose a plurality of heat dissipation channels of which two ends are respectively communicated with the two first connectors, and the range of the heat dissipation channels covers the surface of the whole PCB with larger heat productivity;

the refrigerator is used for being fixed on clothes through a clamp and comprises a shell and a semiconductor refrigerating sheet positioned in the shell, the semiconductor refrigerating sheet divides the shell into a hot cavity and a cold cavity, the semiconductor refrigerating sheet is provided with a hot end facing the hot cavity and a cold end facing the cold cavity, the hot end and the cold end are respectively connected with a first fin group and a second fin group, the hot cavity and the cold cavity are respectively provided with a first air inlet and a second air inlet communicated with the atmosphere, the hot cavity and the cold cavity are respectively provided with a first air outlet and a second air outlet, the first air outlet is communicated with the atmosphere, the second air outlet is connected with an air supply pipe, the air supply pipe is provided with a third joint, the third joint is detachably connected with one of the two second joints, the first air outlet is provided with a first fan for discharging hot air in the hot cavity, the second air outlet is provided with a second fan for guiding cold air in the cold cavity into the lower cavity, a power module and a control switch are also arranged in the shell.

Further, the shell comprises an upper shell and a lower shell which are connected with each other, and the partition plate assembly and the lower shell are integrally manufactured. Baffle subassembly and integrative structure of inferior valve, for example injection moulding, processing convenient and fast, low cost.

Further, the baffle plate assembly comprises a middle rectangular section and T-shaped sections at two ends, the rectangular section covers the PCB, and the thin ends of the T-shaped sections are connected with the first connectors. The structure is convenient to be butted (shunted or converged) with the first connector under the condition that the PCB with larger size can be ensured to be well radiated.

Further, the accessory is a flexible body, and the inner pipe and the air supply pipe are hoses. When the accessories are flexible bodies, such as wristbands, waistbands, head bands and the like, the flexible tubes can deform along with the deformation of the accessories, and the wearing comfort is improved.

Further, the inner pipe and the gas supply pipe are plastic pipes. The cost is low by adopting the heat-resistant plastic pipe.

Further, the second connector is located on a side of the corresponding attachment facing away from the skin. The arrangement position of the second connector not only facilitates the detachment and connection with the refrigerator, but also prevents the hot air from contacting the skin of a human body when flowing out of the second connector, thereby avoiding the discomfort of the skin.

Further, the power module includes a rechargeable battery.

Furthermore, the sealing plug is a rubber cover, and the back of the rubber cover is connected with the accessory through a string. The rubber cover is convenient to detach and connect the second connector, and good sealing performance is ensured on the premise of low cost, so that water cannot enter the shell when the refrigerator is not connected.

Further, the side of the attachment adjacent to the skin is provided with a heat insulating layer. The heat of the inner tube can be prevented from being transferred to the skin through the accessory, so that the comfort of the skin is further improved.

The invention has the beneficial effects that: when the wearable device non-inductive heat dissipation system is used, wearable electronic equipment is worn on a human body, when heat dissipation is needed, a refrigerator is fixed on clothes or a belt through a clamp, two sealing plugs on a left accessory and a right accessory are taken down from corresponding second connectors, an air supply pipe of the refrigerator is communicated with one of the second connectors, a switch of the refrigerator is turned on, a semiconductor refrigerating sheet starts to work, a thermocouple pair works, a hot end releases heat, a cold end absorbs heat, heat generated by the hot end is conducted to a first fin group, the cold end absorbs heat to enable the temperature of the second fin group to be lower, for the hot end, a first fan works to drive outside air to enter a hot cavity from a first air inlet, exchange heat with the first fin group to form hot air, and then the hot air is discharged along a first air outlet; for the cold end, the second fan works to drive the outside air to enter the cold cavity from the second air inlet and exchange heat with the second fin group to form cold air, the cold air then enters the inner tube through the air supply tube and enters the lower cavity through the corresponding first joint along the inner tube, due to the action of the partition plate assembly, the cold air is dispersed and simultaneously enters each heat dissipation channel, and as each heat dissipation channel completely covers the whole back of the PCB in a uniform mode, the heat of each electronic component in each area on the PCB can be cooled by the cold air and taken away (if the partition plate assembly is not arranged, the heat dissipation of the area far away from the connecting line of the two first joints is slow for the PCB with larger size), the hot air after heat exchange flows into the inner tube of another accessory through the first joint at the other end and is discharged from the other second joint, and all the heat cannot contact with a human body in the whole process, can improve human comfort greatly, through the mode cooperation baffle subassembly structure of external refrigerator, realize very efficient radiating effect, to the wearable equipment of big consumption and even future bigger consumption, its heat dissipation problem thoroughly solves.

Drawings

Fig. 1 is a schematic structural diagram (cross-sectional view) of an embodiment of a wearable device non-inductive heat dissipation system of the present invention;

FIG. 2 is an enlarged view of a portion of FIG. 1 at A;

FIG. 3 is a cross-sectional view of a wearable device;

FIG. 4 is a schematic diagram showing the structure of the position relationship between the screen and the PCB;

FIG. 5 is a schematic structural view showing the positional relationship between the diaphragm assembly and the lower case;

FIG. 6 is a perspective view of the lower shell and baffle plate assembly in an integral construction;

FIG. 7 is an enlarged view of a portion of FIG. 6 at B;

FIG. 8 is a schematic diagram of the operation of a thermocouple of the refrigerator;

in FIGS. 1-7: 1-shell, 101-lower shell, 2-PCB board, 3-chip, 4-display; 5-left attachment, 6-right attachment, 7-otter board, 71-mesh, 8-upper chamber, 9-lower chamber, 10-left inner tube, 11-right inner tube, 12-first joint, 13-second joint, 103-sealing plug, 131-string, 14-partition, 141-rectangular section, 142-T-shaped section, 15-heat dissipation channel, 16-refrigerator, 161-shell, 162-semiconductor refrigeration sheet, 163-hot chamber, 164-cold chamber, 165-first fin group, 166-second fin group, 167-first air inlet, 168-second air inlet, 169-first air outlet, 170-second air outlet, 171-first fan, 172-second fan, 173-third joint, and 174-air supply tube.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the detailed description and specific examples, while indicating the preferred embodiment of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.

It is noted that relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The features and properties of the present invention are described in further detail below with reference to examples.

The wearable device noninductive heat dissipation system comprises the following implementation modes: referring to fig. 1 and 2, the wearable device non-inductive heat dissipation system comprises: a housing 1, at least one PCB board 2 containing a plurality of electronic components being provided in the housing 1, which generates heat during operation of the wearable device; accessories attached to the casing 1, including a left accessory 5 and a right accessory 6 respectively located on both sides of the casing 1; the housing 1 and the accessories are prior art, such as the patent specification of application publication No. 107850871 a. In brief, the housing 1 is a casing 161 of an electronic module of a wearable device, and the casing encloses various electronic components, a PCB board 2, a chip 3, and the like, and is generally provided with a display 4, such as a smart watch, and the components such as a battery and a memory in the housing 1 are not shown in the figure. The accessories are generally located on the outside of the housing 1 and are primarily used to secure the housing 1 to the person or to facilitate the attachment of the device to the person. Such as wristbands of smart watches, temples of smart glasses, headbands of VR glasses, headbands of eye massage therapy instruments, and armbands, legbands, ankle bands, waistbands, and the like of other types of smart wearable devices.

As shown in fig. 1 to 4, the screen 7 abuts on the inner peripheral wall of the housing 1 at its periphery to divide the housing 1 into an upper chamber 8 and a lower chamber 9 which are communicated with each other through the screen 71 of the screen 7, a mounting hole having a size identical to that of the PCB 2 is formed in the middle of the screen 7, the PCB 2 is embedded in the mounting hole, and the surface of the PCB 2 having a large heat generation amount is disposed toward the lower chamber 9. The inner tube, it is including being located left inner tube 10 and the right inner tube 11 in left annex 5 and the right annex 6 respectively, and the one end of left and right inner tube is through first joint 12 intercommunication with cavity 9, and the other end stretches out from the one end of keeping away from shell 1 that corresponds the annex, and is provided with the second at the end that stretches out and connects 13, and second joint 13 department releasable connection has sealed end cap 103.

As shown in fig. 5-7, the partition assembly, located in the lower cavity 9, includes a plurality of partitions 14 disposed along a direction perpendicular to the PCB 2, the partitions 14 enclose a plurality of heat dissipation channels 15 having two ends respectively connected to the two first connectors 12, and the range of the heat dissipation channels 15 covers a side of the PCB 2 having a large heat dissipation amount;

as shown in fig. 1, the refrigerator 16 is used for being fixed on clothes by a clamp, the refrigerator 16 includes a housing 161 and a semiconductor refrigerating sheet 162 positioned in the housing 161, the semiconductor refrigerating sheet 162 divides the housing 161 into a hot chamber 163 and a cold chamber 164, the semiconductor refrigerating sheet 162 has a hot end facing the hot chamber 163 and a cold end facing the cold chamber 164, the hot end and the cold end are respectively connected with a first fin set 165 and a second fin set 166, the hot chamber 163 and the cold chamber 164 are respectively provided with a first air inlet 167 and a second air inlet 168 communicated with the atmosphere, the hot chamber 163 and the cold chamber 164 are respectively provided with a first air outlet 169 and a second air outlet 170, the first air outlet 169 is communicated with the atmosphere, the second air outlet 170 is connected with an air supply pipe 174, the air supply pipe 174 is provided with a third joint 173, the third joint 173 is detachably connected with one of the two second joints 13, the first fan 171 is arranged at the first air outlet 169 for discharging hot air in the hot chamber 163, a second fan 172 is disposed at the second air outlet 170 to guide the cold air in the cold chamber 164 into the lower chamber 9, and a power module and a control switch are disposed in the housing 161.

The housing 1 includes upper and lower cases 101 coupled to each other, as shown in fig. 5, and a diaphragm assembly is integrally formed with the lower case 101. The baffle plate assembly and the lower shell 101 are integrated, such as injection molding, and the baffle plate assembly is convenient and quick to process and low in cost. The partition assembly includes a middle rectangular section 141 and T-shaped sections 142 at both ends, the rectangular section 141 is covered on the PCB board 2, and the thin ends of the T-shaped sections 142 are connected to the first connector 12. This structure also facilitates the butt joint (shunting or converging) with the first connector 12 while ensuring that the PCB 2 of a large size can be well heat-dissipated.

The attachment is a flexible body and the inner tube and gas supply tube 174 is a hose. When the accessories are flexible bodies, such as wristbands, waistbands, head bands and the like, the flexible tubes can deform along with the deformation of the accessories, and the wearing comfort is improved. The inner tube and the gas supply tube 174 are plastic tubes. The cost is low by adopting the heat-resistant plastic pipe. The second connector 13 is located on the side of the corresponding attachment facing away from the skin. The arrangement position of the second connector 13 not only facilitates the detachment of the refrigerator 16, but also prevents the hot air from contacting the skin of the human body when flowing out of the second connector 13, thereby avoiding the discomfort of the skin. The power module includes a rechargeable battery. As shown in fig. 2, the sealing plug 103 is a rubber cover, and the back of the rubber cover is connected to the accessory through a string 131. The provision of the rubber cover facilitates the removal and attachment of the second connector 13 and ensures good sealing at low cost to ensure that water does not enter the housing 1 when the refrigerator 16 is not attached.

The side of the accessory close to the skin is provided with a heat insulating layer. The heat of the inner tube can be prevented from being transferred to the skin through the accessory, so that the comfort of the skin is further improved.

When the wearable device heat-transfer system is used, as shown in fig. 1, the wearable electronic device is worn on a human body, when heat dissipation is needed, the refrigerator 16 is fixed on clothes or a belt through a clamp, two sealing plugs 103 on the left and right accessories are taken down from the corresponding second connectors 13, an air supply pipe 174 of the refrigerator 16 is communicated with one of the second connectors 13, a switch of the refrigerator 16 is turned on, the semiconductor refrigeration sheet 162 starts to work, the thermocouple pair works, the hot end releases heat, the cold end absorbs heat, heat generated by the hot end is conducted to the first fin group 165, the cold end absorbs heat to enable the temperature of the second fin group 166 to be lower, and for the hot end, the first fan 171 works to drive outside air to enter the hot cavity 163 from the first air inlet 167, and to exchange heat with the first fin group 165 to form hot air, and then the hot air is discharged along the first air outlet 169; for the cold end, the second fan 172 works to drive the external air to enter the cold chamber 164 from the second air inlet 168 and exchange heat with the second fin group 166 to form cold air, the cold air then enters the inner tube through the air supply pipe 174 and enters the lower chamber 9 through the corresponding first joint 12 along the inner tube, due to the action of the partition plate assembly, the cold air is dispersed and enters each heat dissipation channel 15 at the same time, since each heat dissipation channel 15 completely covers the whole back of the PCB board 2 in a uniform manner, the heat of each electronic component in each area on the PCB board 2 can be cooled by the cold air and taken away (if the partition plate assembly is not provided, the heat dissipation in the area far away from the connection line of the two first joints 12 is slow for the PCB board 2 with larger size), wherein the air with less heat in the upper chamber 8 also enters the heat dissipation channel 15 through the mesh plate 71 of the mesh plate 7, the hot air after heat exchange flows into the inner tube of another accessory through the first joint 12 at the other end, and discharge from another second joint 13, all heats can not contact with the human body in whole process, can improve human comfort greatly, through the mode cooperation baffle subassembly structure of external refrigerator 16, realized very high-efficient radiating effect, to the wearable equipment of big consumption even future bigger consumption, its heat dissipation problem thoroughly solves. When heat dissipation is no longer required, or when it is temporarily inconvenient, refrigerator 16 can be turned off and third connector 173 can be removed from second connector 13, sealing plugs 103 at the two second connectors 13 can be covered, and refrigerator 16 can be removed from the clothes.

As shown in fig. 8, when the power is turned on and direct current flows from N-type to P-type, the refrigerator generates heat absorption on the copper connection pads at the 2 and 3 ends, which is called cold end, and generates heat release on the copper connection pads at the 1 and 4 ends, which is called hot end; if the current direction is reversed, the cold and hot ends are interchanged. Several pairs of thermocouples are connected to form a common thermopile, and with the help of various heat transfer devices, the hot end of the thermopile can fully dissipate heat and keep a certain temperature, and the cold end of the thermopile is placed in a working environment to realize heat absorption and temperature reduction.

The above description is only a preferred embodiment of the present invention, and not intended to limit the present invention, the scope of the present invention is defined by the appended claims, and all structural changes that can be made by using the contents of the description and the drawings of the present invention are intended to be embraced therein.

Claims

1. Wearable equipment noninductive cooling system includes:

it is characterized by also comprising:

2. The wearable device non-inductive heat dissipation system of claim 1, wherein the housing comprises an upper shell and a lower shell connected to each other, and the baffle assembly is integrally formed with the lower shell.

3. The wearable device heat-dissipation system of claim 1 or 2, wherein the baffle plate assembly comprises a middle rectangular section and two T-shaped sections at two ends, the rectangular section is covered on the PCB, and the thin ends of the T-shaped sections are connected with the first joints.

4. The system of claim 1, wherein the accessory is a flexible body and the inner tube and air supply tube are hoses.

5. The system of claim 4, wherein the inner tube and the air supply tube are plastic tubes.

6. The wearable device heat-sensible system of claim 1, wherein the second joint is located on a side of the corresponding accessory that is distal from the skin.

7. The wearable device sensible heat removal system of claim 1, wherein the power module comprises a rechargeable battery.

8. The wearable device heat-dissipation system of claim 1, wherein the sealing plug is a rubber cover, and the back of the rubber cover is connected with an accessory through a string.

9. The wearable device heat-sensible system of claim 1, wherein the attachment is provided with a heat-insulating layer on a side thereof adjacent to the skin.