CN113816332A

CN113816332A - Optical chip packaging structure and packaging method

Info

Publication number: CN113816332A
Application number: CN202010565846.5A
Authority: CN
Inventors: 李明; 褚朝军; 徐景辉
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2020-06-19
Filing date: 2020-06-19
Publication date: 2021-12-21
Anticipated expiration: 2040-06-19
Also published as: CN113816332B

Abstract

The embodiment of the application discloses an optical chip packaging structure and a packaging method, relates to packaging technology, and can be used in the field of optical communication. The optical chip packaging structure provided by the embodiment of the application comprises: an optical window, an optical chip and a bottom cover plate; the optical chip is fixed between the optical window and the bottom cover plate, the optical chip comprises a first area and a second area, the first area comprises a functional element of the optical chip, and the second area of the optical chip is connected with the optical window through a first boss; the packaging structure utilizes the first boss to mount the optical chip and the optical window, thereby not only reserving the moving space required by the optical chip, but also adding a new heat dissipation path for the optical chip, and improving the working performance of the chip.

Description

Optical chip packaging structure and packaging method

Technical Field

The present disclosure relates to packaging technologies, and in particular, to an optical chip package structure and a packaging method.

Background

Micro Electro Mechanical Systems (MEMS) are a controllable MEMS structure formed of semiconductor materials and other materials suitable for micro processing, and usually, sensors, actuators, signal sampling, etc. of electricity, machinery, light, etc. can be integrated into a chip system; it is widely used because of its advantages of miniaturization, low power consumption, high precision, etc. The MEMS micro-mirror is an optical device manufactured based on a micro-nano processing technology, and the working principle of the MEMS micro-mirror is that the reflector is twisted or deformed under the action force of a micro driving structure, and the transmission direction of a light beam is changed through deflection of the micro-mirror at a certain angle; the method can be widely applied to the fields of optical exchange, spectral analysis instruments, optical projection imaging and the like in optical communication.

The MEMS chip is integrated with a plurality of rotatable MEMS micro-mirrors on the same substrate, and comprises a plurality of planar coils, the planar coils interact with an external magnet to generate Lorentz force, and the MEMS micro-mirrors are driven to rotate by the Lorentz force to receive a light source. Therefore, when the MEMS chip is packaged, the chip is suspended and fixed between the optical window and the external magnet, and a reserved space is reserved between the chip and the optical window and between the chip and the external magnet for ensuring that the MEMS micro-mirror on the chip can rotate.

Because the reserved space between the upper device and the lower device is air, the heat conductivity of the air is not as good as that of a solid, so that the heat dissipation of the chip is not facilitated, when the heat dissipation performance of the chip is poor, the loss of the chip is often caused, and the performance of the chip is greatly reduced.

Disclosure of Invention

The embodiment of the application provides an optical chip packaging structure and a packaging method, which are used for solving the problem that a chip cannot effectively dissipate heat in the chip packaging process.

A first aspect of an embodiment of the present application provides an optical chip package structure, including:

when the optical chip is packaged, the optical chip can be fixed between the optical window and the bottom cover plate, and the optical window can be used as a substrate, and the optical chip and the optical window are mounted through the first boss; generally, an optical chip may be divided into a first region and a second region, the first region may include functional elements for implementing functions of the optical chip, the functional elements are fragile and cannot be directly attached to an optical window, the second region may be an operable region on the optical chip, the second region may be connected to the optical window through a boss, and the first boss is used for heat conduction, and may transfer heat generated by the optical chip to the optical window through the boss and then dissipate heat through the optical window.

In a sealed environment, when air is arranged above and below the optical chip, the air becomes a heat insulation layer due to poor heat conduction capability, the heat dissipation of the optical chip is seriously influenced, and the optical chip cannot normally work; the optical chip is connected with the optical window through the first boss, so that heat can be transferred through the solid structure, a new heat dissipation way is added for the optical chip, the working performance of the chip is provided, and meanwhile, the optical window becomes a substrate of the optical chip, so that the packaging structure is more compact.

Based on the first aspect of the embodiments of the present application, an embodiment of the present application further provides a first implementation manner of the first aspect:

because the first area of the optical chip comprises the functional element and is the core area of the whole chip, the first boss can be arranged on the second area of the optical chip, the position of the optical window can be adjusted according to the arranged boss, and the auxiliary structure is arranged on the position of the optical window corresponding to the first boss; the attachment structure is configured to attach the first boss to the optical window, and thus corresponds to the first boss.

The first boss is arranged in the operable area of the optical chip, and the optical window is connected with the second area through the first boss, so that the processing operation on the core area of the optical chip is avoided, the basic function of the functional element is ensured, the loss of the optical chip in the packaging process is reduced, and meanwhile, the optical window covers the optical chip and plays a role in protecting the functional element on the optical chip.

Based on the first implementation manner of the first aspect of the embodiments of the present application, the embodiments of the present application further provide a second implementation manner of the first aspect:

the auxiliary structure connected with the first boss can be a metallization structure, an adhesive structure, a welding structure, a heat conducting glue or graphene.

Metallization structure, adhesive structure, welded structure, heat-conducting glue or graphite alkene all have stronger heat conductivility, can the rapid transfer heat, and more effectual dispels the heat.

Based on the first aspect of the embodiments of the present application to the second implementation manner of the first aspect, the embodiments of the present application further provide a third implementation manner of the first aspect:

when the optical chip is packaged, the optical window sheet may be larger than the area of the whole optical chip, and then completely cover the top of the optical chip, or may be smaller than the area of the optical chip, but needs to be larger than the area of the first region, and cover the first region of the optical chip, so as to provide an optical window for a functional element on the optical chip.

The area of the optical window is larger than that of the first region in the optical chip, so that the functional elements of the optical chip can better receive optical signals, the operability region of the optical window is increased, and the optical chip can be protected more effectively.

Based on the first implementation manner of the first aspect to the third implementation manner of the first aspect of the embodiments of the present application, the embodiments of the present application further provide a fourth implementation manner of the first aspect:

after the top of the optical chip is connected with the optical window through the first boss, the bottom of the optical chip can also be connected with the bottom cover plate through the second boss, the second boss is arranged at the bottom of the second area of the optical chip, and the composition structure of the second boss can refer to the first boss.

The optical chip is connected with the bottom cover plate through the second boss, so that heat can be dissipated through the second boss, heat is transferred to the bottom cover plate, more heat dissipation ways are increased, the working performance of the chip is improved, meanwhile, the optical window, the optical chip and the bottom cover plate are connected into a complete packaging structure, and the packaging structure is more compact.

Based on the fourth implementation manner of the first aspect of the embodiments of the present application, the embodiments of the present application further provide a fifth implementation manner of the first aspect:

specifically, the first boss and the second boss may correspond to each other, that is, in one position of the second region, the top is provided with the first boss, and the bottom is provided with the second boss.

Based on the first aspect of the embodiments of the present application to the fifth implementation manner of the first aspect, the embodiments of the present application further provide a sixth implementation manner of the first aspect:

the optical chip needs a driving structure to drive functional elements on the optical chip, the optical chip needs to be packaged together with an external driving structure, the driving structure can be fixed between the optical chip and the bottom cover plate, then the second boss at the bottom of the second area of the optical chip needs to be connected with the top of the driving structure, and then the bottom of the driving structure is connected with the bottom cover plate through the heat dissipation structure.

When the optical chip is connected with the driving structure through the second boss, a bottom heat dissipation path is provided for the optical chip, meanwhile, a certain moving space is reserved for the optical chip by the second boss, and the working performance of the optical chip is improved.

Based on the sixth implementation manner of the first aspect of the embodiments of the present application, embodiments of the present application further provide a seventh implementation manner of the first aspect:

the bottom of the driving structure is connected with the bottom cover plate through a heat dissipation structure, and the heat dissipation structure may include a Thermal Electric Cooler (TEC) coating; because the drive structure needs to transmit the heat to the bottom cover plate, and then is transmitted to the external environment by the bottom cover plate, the cold side of the TEC needs to be connected with the bottom of the drive structure, and the hot side of the TEC needs to be connected with the bottom cover plate, so that the packaging structure can radiate heat more effectively.

Based on the first aspect of the embodiments of the present application to the seventh implementation manner of the first aspect, the embodiments of the present application further provide an eighth implementation manner of the first aspect:

the bottom of the bottom cover plate is also required to be connected with radiating fins, so that the radiating of the bottom cover plate is more facilitated.

Based on the first implementation manner of the first aspect to the eighth implementation manner of the first aspect of the embodiments of the present application, the embodiments of the present application further provide a ninth implementation manner of the first aspect:

the first boss may include a plurality of boss structures, when the functional element of the optical chip is a single element, the boss may be established in one or more number, and all the boss structures need to be established outside the optical chip, and when the functional element is an array type element, the number of the boss structures may be multiple, and the boss structures may be arranged outside the array or between the elements, so as to be better connected with the optical window and the driving structure.

Based on the fifth implementation manner of the first aspect to the ninth implementation manner of the first aspect of the embodiments of the present application, the embodiments of the present application further provide a tenth implementation manner of the first aspect:

in the optical chip, the functional element of the optical chip can be a micromirror, when the driving mode of the micromirror is electromagnetic driving, the driving structure can be a magnet, the magnet can interact with a coil on the optical chip to generate Lorentz force, and then the Lorentz force drives the micromirror to rotate; the optical chip is also electrically connected with the outside, so that the optical chip packaging structure also needs to comprise an electric lead structure which provides an electric signal interface for the optical chip; the electrical lead structure may be attached to the optical window and then the electrical lead structure and the optical chip may be connected by wires.

The optical chip is connected with the optical window by the first boss, and the optical chip is connected with the magnet by the second boss, so that a plurality of heat dissipation ways are provided for the optical chip, the rotating space of the micro mirror is reserved, the problem that the optical chip cannot work normally is avoided, and meanwhile, the exposed movable element on the optical chip is protected by the packaging structure, and the loss of the optical chip is reduced.

A second aspect of the embodiments of the present application provides an optical chip packaging method, including:

the optical chip can be divided into a first area and a second area, the first area may contain functional elements for realizing the functions of the optical chip, the functional elements are fragile and cannot be directly attached to the optical window, and the second area can be an operable area on the optical chip, so that a first boss can be firstly processed on the top of the second area of the optical chip, and then the processing position on the optical window can be determined according to the structure of the first boss; and adding an auxiliary structure on the processing position, wherein the auxiliary structure can comprise a metalized structure, an adhesive structure, a welding structure, heat-conducting glue or graphene and the like, and finally fixing the first boss and the auxiliary structure.

Based on the second aspect of the embodiments of the present application, the embodiments of the present application further provide a first implementation manner of the second aspect:

Based on the second aspect of the embodiments of the present application to the first implementation manner of the second aspect, the embodiments of the present application further provide a second implementation manner of the second aspect:

after the top of the optical chip is connected with the optical window through the first boss, the bottom of the optical chip can also be connected with the bottom cover plate through the second boss, and the second boss can be arranged at the bottom of the second area of the optical chip; specifically, a second boss corresponding to the first boss may be formed at the bottom of the second region of the optical chip, and then the bottom of the optical chip may be connected to the top of the bottom cover plate through the second boss.

Based on the second implementation manner of the second aspect of the embodiments of the present application, the embodiments of the present application further provide a third implementation manner of the second aspect:

the optical chip needs a driving structure to drive the functional elements on the optical chip, the optical chip needs to be packaged together with an external driving structure, specifically, the driving structure can be fixed between the optical chip and the bottom cover plate, and then the bottom of the optical chip is connected with the top of the driving structure through a second boss; connecting the bottom of the driving structure with the bottom cover plate through a heat dissipation structure, wherein the heat dissipation structure can comprise a TEC coated with heat-conducting grease; the cold surface of the TEC needs to be connected with the bottom of the driving structure, the hot surface of the TEC needs to be connected with the top of the bottom cover plate, and the bottom of the bottom cover plate can be connected with the radiating fins.

Based on the second aspect of the embodiments of the present application to the third implementation manner of the second aspect, the embodiments of the present application further provide a fourth implementation manner of the second aspect:

Based on the third implementation manner of the second aspect to the fourth implementation manner of the second aspect of the embodiments of the present application, the embodiments of the present application further provide a fifth implementation manner of the second aspect:

In the embodiment of the invention, when the optical chip is packaged, the operable second area on the optical chip is connected with the optical window through the first boss, so that the optical chip is directly attached to the optical window, therefore, the problem that the heat dissipation of the optical chip is seriously influenced by poor heat conduction capability of air above and below the optical chip in a sealed environment can be solved, heat can be transferred through a solid structure, a new heat dissipation way is added for the optical chip, the working performance of the chip is provided, meanwhile, the optical window has the functions of protection, light transmission and a base, on one hand, the new heat dissipation way is added, the whole packaging structure is more compact, functional elements on the optical chip are effectively protected, and the loss of the optical chip is reduced.

Drawings

FIG. 1 is a schematic diagram of a package structure in the prior art;

fig. 2 is a schematic structural diagram of an optical chip package structure in an embodiment of the present application;

FIG. 3A is a schematic diagram of an optical chip according to an embodiment of the present disclosure;

FIG. 3B is a schematic diagram of another optical chip according to an embodiment of the present disclosure;

FIG. 4A is a schematic view of a boss in the embodiment of the present application;

FIG. 4B is a schematic view of another boss configuration in the embodiment of the present application;

FIG. 4C is a schematic view of another boss configuration in the embodiment of the present application;

FIG. 4D is a schematic view of another boss configuration in the embodiment of the present application;

FIG. 4E is a schematic view of another boss configuration in the embodiment of the present application;

FIG. 4F is a schematic view of another boss configuration in the embodiment of the present application;

FIG. 5 is a schematic structural diagram of another optical chip package structure in the embodiment of the present application;

FIG. 6 is a schematic structural diagram of another optical chip package structure in the embodiment of the present application;

fig. 7 is a flowchart illustrating an optical chip packaging method according to an embodiment of the present application.

Detailed Description

The embodiment of the application provides an optical chip packaging structure and an optical chip packaging method, which can protect a chip and effectively dissipate heat of the chip.

Optical chips are electronic components for performing photoelectric signal conversion, and are widely used in core switching network equipment, wavelength division multiplexing equipment, and 5G equipment to be popularized of communication carriers; the MEMS system is developed on the basis of microelectronic technology, and integrates a microsensor, a micro actuator, a micro mechanical structure, a micro power supply micro energy source, a signal processing and control circuit, a high-performance electronic integrated device, an interface and communication into a whole; the MEMS micro-mirror on the optical chip is an optical device manufactured based on a micro-nano processing technology, and the basic principle is that the transmitting mirror is twisted or deformed under the action force of a micro driving structure, and the transmission direction of a light beam is changed through deflection of the micro-mirror at a certain angle. One driving mode of the MEMS micro-mirror is electromagnetic driving, Lorentz force is generated by interaction of a coil on a chip and an external magnet, the Lorentz force is used for driving a reflecting mirror to deflect, the propagation direction of a light beam is changed, and a light source signal is received.

The chip packaging means that a chip mounting shell is used for placing, fixing, sealing, protecting the chip and enhancing the electrothermal performance, meanwhile, the connection points on the chip can be connected to the pins of the packaging shell by wires, and the pins are connected with other components; because the optical chip needs to receive a light source, an optical window needs to be added when the optical chip is packaged; fig. 1 is a package structure in the prior art, as shown in fig. 1:

the optical chip is fixed in the middle of optical window and magnet, coil for the optical chip through the wire provides the power, then coil and magnet interact produce the lorentz force, the micro-mirror on the drive optical chip rotates, because the micro-mirror needs to rotate, so when the encapsulation, the optical chip is unsettled and optical window and between the magnet, all remain certain space from top to bottom, the upper and lower of optical chip all is the air, and in sealed environment, the heat-sinking capability of air is extremely poor, consequently, the heat that the optical chip produced can not in time transmit to the external world, lead to the loss of chip very high, the working property descends.

Fig. 2 is a schematic structural diagram of an optical chip package structure in an embodiment of the present application, and as shown in fig. 2, a partial structure of the package structure shows a package manner of an optical window 201 and an optical chip 202.

The package structure uses the optical window 201 as a substrate for bearing the optical chip 202, and is directly attached to the optical window 201 through the boss 203.

The optical chip 202 includes a functional area for implementing chip functions, which may include exposed functional elements and is easily damaged, so that a more sensitive functional area to be protected may be determined as the first area of the optical chip 202; it will be appreciated that during mounting, the first area needs to be protected from consumption by the photonic chip 202.

The second region may be a non-functional region on the optical chip 202, and therefore, the second region of the optical chip may be connected to the optical window through the boss 203, so that the optical window 201 covers the functional region of the optical chip 202, and the optical chip 202 and the optical window 201 are mounted, so that the package structure is more compact. As shown in fig. 3A, a schematic structural diagram of an optical chip 202 is shown, where the optical chip 202 may be a single device, a first region may be a chip core region that is inoperable during a packaging process, and a second region is an operable region during the packaging process and may be used to provide a bump; meanwhile, the optical window sheet can cover the whole optical chip and also can cover a part of the optical chip, but needs to cover the first area on the optical chip, and has the functions of protection, light transmission and base.

As shown in fig. 3B, the optical chip 202 may also be an array type device, wherein the first region may include a functional element of the optical chip 202, i.e., a functional region of the optical chip body; for example, when the optical chip 202 is a MEMS chip, the first region may be a region including MEMS micro-mirrors, when the optical chip 202 is an LED chip, the first region may be a region including a light-emitting semiconductor, or the like, and the functional element on the optical chip may also be a laser, a photodetector, or the like; the second area is an operable area in the packaging process and can be used for arranging a boss; similarly, the optical window 201 may cover the entire optical chip 202, or may be interleaved with the optical chip 202, but need cover a first area on the optical chip 202. Optionally, a heat conducting material may be further added above the boss, so that the optical chip 202 and the optical window 201 are more attached, and the heat dissipation capability is increased; the electrical lead structure is used for electrically connecting the optical chip 202 with the outside, and the electrical lead structure can also be attached to the optical window.

As shown in the several bump forms provided for the embodiments of the present application, when the optical chip is a single functional element, the packaging manner thereof may be as shown in fig. 4A, 4B or 4C, in fig. 4A, a part of the area of the window is outside the chip region and covers the chip core region, and the chip core region is fully surrounded by the bumps; in fig. 4B, the area of the window is larger than the chip area, and the window covers the entire optical chip, and the chip core area is completely surrounded by the bumps; in fig. 4B, a portion of the area of the window is outside the chip region, the bump is a semi-closed structure, and the chip core region surrounds the center of the chip. When the optical chip is an array-type functional element, the packaging manner may be as shown in fig. 4D, 4E or 4F, in fig. 4D, the whole area of the window is larger than the area of the optical chip, wherein the optical device core array units are separated by the strip-shaped bosses; in fig. 4E, the total area of the window is larger than the area of the optical chip, wherein the optical device core array units are separated by the grid-shaped bosses; in fig. 4F, the whole area of the window is larger than the area of the optical chip, wherein the core array units of the optical device are separated by the dotted bosses, the boss forms may be various, and the specific form is not limited.

In the embodiment, the optical chip main body and the optical window are pasted, so that the chip is protected, and the yield of the chip in the subsequent chip sucking and packaging processes can be improved.

FIG. 5 is a schematic structural diagram of another optical chip package structure in the embodiment of the present application, as shown in FIG. 5, an optical chip 501 is fixed between an optical window 502 and a bottom cover plate 503; the photonic chip 501 is attached to the optical window 502 by a first boss 504 and connected to the bottom cover plate 503 by a second boss 505, and the electrical lead structure 506 is attached to the optical window 502, and the photonic chip body 501 is connected to the electrical lead structure 506 by a wire.

The first and second bosses 504 and 505 may be used for heat conduction, i.e., heat generated by the chip is transferred to the optical window 502 through the first boss 504, transferred to the bottom cover plate 503 through the second boss 505, and then dissipated to the external environment through the optical window 502 and the bottom cover plate 503; the heat conductivity of the solid is greater than that of the gas, so that the first boss 504 and the second boss 505 provide a new heat dissipation path for the optical chip main body 501, and the heat dissipation capability of the packaging structure is improved; for example, the first and second bosses 504 and 505 may be made of a material having a better thermal conductivity, such as silicon, so that the bosses have a stronger thermal conductivity.

First mesa 504 may be disposed on top of the operational area, i.e., the second area, of optical chip 501 as the highest point of optical chip 501 to which optical louver 502 is connected. When the position of the first boss 504 on the optical chip 501 is determined, the position of the optical window 502 may be adjusted to cover the sensitive end surface of the optical chip 501, and then the attachment structure 507 connected to the first boss 504 on the optical window 502 is processed, in a preferred embodiment, the attachment structure 507 is a metallization structure corresponding to the bosses one-to-one; the connection structure between the first boss 504 and the attachment structure 507 may also include glue, silk screen, solder, thermal conductive glue, graphene, other thermal conductive materials, and the like, and the specific process is not limited.

The bottom of the optical chip 501 may further be provided with a second boss 505 corresponding to the first boss 504, and then connected with the bottom cover plate 503 through the second boss 505 to complete a complete package structure, so that a new heat dissipation path may be added; it is understood that the processing position may be determined in the second region of the optical chip 501, the first bump 504 is disposed on the top of the optical chip 501, the second bump 505 is disposed on the bottom of the optical chip 501, and the first bump 504 may be made of the same material or different materials, which is not limited specifically.

Optionally, the electrical lead structure 506 may also be attached to the optical window 502, and the electrical lead structure 506 may include a PCB, a ceramic substrate, or the like, or a metal structure may be directly imprinted on the window, and then the optical chip body 501 is connected to the electrical lead structure 506, so that the chip is connected to the outside.

In order to enable the package structure to have better heat dissipation capability, the following measures may be specifically adopted: the forced heat dissipation can be carried out by means of air cooling and the like above the optical window sheet; the optical window sheet can be made of materials with better heat conductivity, such as silicon, crystal, polymer and the like, or glass with a heat-conducting coating (graphene and the like) is selected; meanwhile, the heat sources of the window and the optical chip can be filled with high-heat-conductivity gas and mixed gas thereof, such as helium, neon and the like, so that the heat exchange between the heat sources and the window is improved; the specific heat dissipation method is not limited.

The optical chip is connected with the bottom cover plate through the second boss, heat can be dissipated through the second boss, heat is transferred to the bottom cover plate, more heat dissipation ways are increased, the working performance of the chip is improved, meanwhile, the optical window, the optical chip and the bottom cover plate are connected into a complete packaging structure, and the packaging structure is more compact.

Fig. 6 is a schematic structural diagram of another optical chip package structure in the embodiment of the present application, and as shown in fig. 6, a functional element MEMS micro-mirror exists on an optical chip 601, and the driving manner of the MEMS micro-mirror is electromagnetic driving; therefore, the optical chip 601 is connected with the optical window 603 through the first boss 602, the ceramic substrate 604 and the optical window 603 are fixedly overlapped in a bonding or welding manner, and the connection point on the optical chip 601 and the connection point on the ceramic substrate 604 are electrically connected through the routing 605; meanwhile, a driving structure is further included between the optical chip 601 and the bottom cover plate 609, in this embodiment, the driving structure may be a magnet 606, the upper portion of the magnet 606 is connected with the bottom of the optical chip 601 through a second boss 607, and the bottom of the magnet 606 is connected with the bottom cover plate 609 through a heat dissipation structure 608; optionally, the bottom of the bottom cover 609 may further be connected to a heat dissipation fin to complete a closed package structure.

Optionally, the first bosses 602 are disposed in the non-functional area of the optical chip 601, and then may be attached to the optical window 603 through an attachment structure, and since the MEMS micro-mirror needs to rotate, the height of the first bosses 602 needs to be designed reasonably, so that the MEMS micro-mirror cannot touch the optical window 603 during the rotation process.

When the first boss 602 is attached to the optical window 603, the optical window 603 may include a metallization structure or an adhesive structure corresponding to the first boss 602, or a structure such as solder, thermal conductive adhesive, graphene, and thermal conductive material for adhering/welding/overlapping with the first boss 602, and the specific connection manner is not limited.

It is understood that if the MEMS micro-mirror is driven by electromagnetic driving, there should be a coil on the optical chip 601 to interact with the magnet 606 to generate lorentz force to drive the MEMS micro-mirror; the ceramic substrate 604 may serve as an electrical lead structure to electrically connect the optical chip 601 with the outside, the electrical lead structure may be used to supply power to the coil, and the ceramic substrate 604 and the optical window 603 may be fixedly connected by bonding or welding.

Optionally, the bottom of the optical chip main body 601 may be further connected to the top of the magnet 606 through a second boss 607, for example, the second boss 607 may be a metal mesh corresponding to the first boss 602, and a heat conducting grease is filled in the metal mesh for transferring heat, and the second boss 607 and the first boss 602 may be made of the same material or different materials; similarly, the metal mesh also needs to control the height of the magnet 606 and the optical chip 601 to avoid the MEMS micro-mirror touching the magnet 606 during rotation.

The bottom of the magnet 606 may be connected to a heat dissipation structure 608, wherein the heat dissipation structure 608 may include a TEC, and since the photonic chip 601 may transmit heat to the magnet 606 through the second boss 607, a cold side of the TEC needs to be connected to the magnet 606, a hot side of the TEC needs to be connected to a bottom cover 609, and a bottom of the bottom cover 609 may be connected to a heat dissipation fin, so as to transmit heat to the external environment through the heat dissipation structure 608 and the bottom cover 609.

It should be noted that the magnet 606 may be disposed between the optical chip 601 and the bottom cover 609, or may be stacked with the optical chip 601 in a spatially staggered manner, when the optical chip 601 is stacked in a spatially staggered manner, a part of the second bosses 607 in the optical chip 601 is connected to the magnet 606, and then the magnet 606 is connected to the bottom cover 609 through the heat dissipation structure 608; one part of the gas-liquid separator can be directly connected with the bottom cover plate 609; the magnet 606 may be a plurality of magnets, and may be located on the left and right sides of the optical chip 601, and the specific location is not limited.

Meanwhile, Ne, He and other gases can be filled into the cavity to enhance heat exchange, so that the heat dissipation capability of the whole packaging structure is improved, and the working performance of the chip is improved.

Specifically, an optical chip packaging method, i.e., a processing process flow, is described below, and fig. 7 is a schematic flow chart of an optical chip packaging method in an embodiment of the present application, including:

701. a core area of the optical chip is identified, and a first area and a second area of the optical chip are determined.

The optical chip comprises a functional area for realizing the functions of the chip, the functional area can comprise exposed functional elements and is easy to damage, so that a sensitive functional area needing to be protected can be determined as a first area of the optical chip; it is understood that during mounting, the first region needs to be protected to prevent consumption of the optical chip during packaging.

The second region may be a non-functional region on the optical chip, that is, an operable region on the optical chip, and the optical chip may be processed in the second region to complete a corresponding package structure.

702. Machining a first boss at the top of the second region and a second boss at the bottom of the second region.

When a first region and a second region on the optical chip are determined, the optical chip can be processed on the second region, specifically, a position on the second region can be determined, then a first boss is processed on the top of the position, and a second boss is processed on the bottom of the position, the first boss and the second boss can be made of the same or different materials, but the first boss and the second boss need to be made of materials with good thermal conductivity, the first boss needs to be connected with an optical window sheet on the optical chip, and the second boss needs to be connected with a bottom cover plate below the optical chip, so that the optical chip is fixed between the optical window sheet and the bottom cover plate.

703. And determining the processing position of the optical window according to the structure of the first boss.

The first boss is used as the highest point of the optical chip and connected with the optical window sheet; when the position of the first boss is determined, the position of the optical window can be adjusted to cover the sensitive end face of the optical chip, and then the processing position of the optical window is determined.

704. And adding an auxiliary structure at the processing position and fixing the boss and the auxiliary structure.

Processing an auxiliary structure connected with the first boss at the processing position of the optical window, wherein in a preferred embodiment, the auxiliary structure is a metalized structure, an adhesive structure, a welding structure, heat-conducting glue or graphene and the like which correspond to the first boss one by one; the connection structure between the first boss and the accessory structure can use glue, silk screen, solder, heat conducting glue, graphene, other heat conducting materials and the like, and the specific process is not limited.

Specifically, the optical chip can be connected to the electrical lead structure through a wire, and then the electrical lead structure is attached to the optical window.

705. And connecting the bottom of the optical chip with the top of the driving structure through a second boss.

The optical chip needs a driving structure to drive the functional elements on the optical chip, the optical chip needs to be packaged together with an external driving structure, the driving structure can be fixed between the optical chip and the bottom cover plate, and then a second boss at the bottom of a second area of the optical chip needs to be connected with the top of the driving structure; optionally, the driving structure may be spatially staggered with the optical chip, and when the driving structure is spatially staggered with the optical chip, a part of the second plurality of bosses in the optical chip is connected with the driving structure, which is not limited specifically.

706. The bottom of the driving structure is connected with the bottom cover plate through the heat dissipation structure.

The bottom of drive structure can connect heat radiation structure, and wherein heat radiation structure can include TEC and radiating fin, because the optical chip can transmit the heat to drive structure through the second boss, so the drive structure need be connected to TEC's cold side, and the bottom apron is connected to the hot side, accomplishes whole encapsulation.

707. And connecting the bottom of the bottom cover plate with the radiating fins.

Because the drive structure transmits heat to the bottom cover plate through the heat dissipation structure, the bottom cover plate can be connected with the heat dissipation fins for better heat dissipation, Ne, He and other gases can be filled into the cavity, heat exchange is enhanced, the heat dissipation capability of the whole packaging structure is improved, and the working performance of the chip is improved.

When the method is used for packaging the optical chip, the operable second area on the optical chip is required to be connected with the optical window through the first boss, so that the optical chip is directly attached to the optical window, the problem that the heat dissipation of the optical chip is seriously influenced due to poor heat conduction of air above and below the optical chip in a sealed environment can be solved, heat can be transferred through the solid structure, a new heat dissipation way is added for the optical chip, the working performance of the chip is provided, meanwhile, the optical window has the functions of protection, light transmission and base, on one hand, the new heat dissipation way is added, the whole packaging structure can be more compact, functional elements on the optical chip are effectively protected, and the loss of the optical chip is reduced.

It is clear to those skilled in the art that, for convenience and brevity of description, the specific working processes of the above-described systems, apparatuses and units may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.

In the several embodiments provided in the present application, it should be understood that the disclosed system, apparatus and method may be implemented in other manners. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the units is only one logical division, and other divisions may be realized in practice, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form.

The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.

In addition, functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, and can also be realized in a form of a software functional unit.

The integrated unit, if implemented in the form of a software functional unit and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present application may be substantially implemented or contributed to by the prior art, or all or part of the technical solution may be embodied in a software product, which is stored in a storage medium and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a read-only memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and the like.

Claims

1. An optical chip packaging structure, wherein the optical chip packaging structure comprises an optical window, an optical chip and a bottom cover;

The optical chip is fixed between the optical window and the bottom cover, the optical chip includes a first area and a second area, the first area includes the functional elements of the optical chip, the first area The two regions are connected to the optical window through a first boss, wherein the first boss is used for heat conduction.

2 . The optical chip packaging structure according to claim 1 , wherein the first boss is disposed on the top of the second area and is connected to an accessory structure of the optical window, and the accessory structure is connected to the optical window. 3 . The first bosses are in one-to-one correspondence.

3 . The optical chip packaging structure according to claim 2 , wherein the auxiliary structure comprises a metallization structure, an adhesive structure, a welding structure, a thermally conductive adhesive or graphene. 4 .

4 . The optical chip packaging structure according to claim 1 , wherein the area of the optical window is larger than that of the first area, and the optical window is used to cover the optical chip. 5 . the first area.

5 . The optical chip package structure according to claim 2 , wherein the bottom of the second region is connected to the bottom cover through a second boss. 6 .

6 . The optical chip package structure according to claim 5 , wherein the positions where the first boss and the second boss are connected to the second region correspond to. 7 .

7 . The optical chip packaging structure according to claim 1 , wherein the optical chip packaging structure further comprises a driving structure, and the driving structure is fixed to the optical chip and the bottom cover plate. 8 . In between, the bottom of the second region is connected to the top of the driving structure through the second boss, and the bottom of the driving structure is connected to the bottom cover plate through the heat dissipation structure.

8 . The optical chip packaging structure according to claim 7 , wherein the heat dissipation structure is coated with thermally conductive grease (TEC); wherein the cold surface of the TEC is connected to the bottom of the driving structure, and the TEC The hot side is connected to the bottom cover.

9 . The optical chip packaging structure according to claim 1 , wherein the bottom of the bottom cover is connected with heat dissipation fins, and the heat dissipation fins are used to dissipate heat for the bottom cover. 10 .

10 . The optical chip package structure according to claim 2 , wherein the first boss comprises a plurality of boss structures; when the functional element is a single component, the first boss The bosses are arranged outside the functional elements, and when the functional elements are array-type elements, the first bosses are arranged between or outside the array-type elements.

11. The optical chip packaging structure according to any one of claims 6 to 10, wherein the functional element is a micromirror, the driving structure is a magnet, and the magnet is used to interact with a coil on the optical chip. act to drive the micromirror; the optical chip packaging structure further includes an electrical lead structure, the electrical lead structure is used to provide an electrical signal interface for the optical chip; wherein, the electrical lead structure and the optical window Mounting, the electrical lead structure is connected with the optical chip through wires.

12. An optical chip packaging method, comprising:

A first boss is processed on top of the second area of the optical chip; wherein, the optical chip body includes a first area and a second area, the first boss is used for heat conduction, and the first area includes the light The functional elements of the chip;

According to the structure of the first boss, determine the processing position of the optical window;

An attachment structure is added at the machining position and the boss and the attachment structure are fixed.

13. The method of claim 12, wherein the auxiliary structure comprises a metallized structure, an adhesive structure, a welded structure, a thermally conductive adhesive or graphene.

14. The method according to any one of claims 12-13, wherein the method further comprises:

A second boss is processed at the bottom of the second area of the optical chip, the first boss corresponds to the second boss;

The bottom of the optical chip is connected to the top of the bottom cover plate through the second boss.

15. The method of claim 14, wherein the method further comprises:

fixing the driving structure between the optical chip and the bottom cover;

The connecting the bottom of the optical chip to the top of the bottom cover through the second boss includes:

connecting the bottom of the optical chip to the top of the driving structure through the second boss;

The bottom of the driving structure is connected to the bottom cover plate through a heat dissipation structure, and the heat dissipation structure includes a TEC coated with thermally conductive gel; wherein, the cold surface of the TEC is connected to the bottom of the driving structure, and the heat of the TEC is connected to the bottom of the driving structure. surface is connected to the top of the bottom cover;

Connect the bottom of the bottom cover to the cooling fins.

16. The method according to any one of claims 12 to 15, wherein an area of the optical window sheet is larger than that of the first area; and the optical window sheet covers the first area.

17. The method according to any one of claims 15 to 16, wherein the functional element is a micromirror; the driving structure is a magnet; the optical chip further comprises a coil, the coil is used to communicate with all interacting with the magnets to drive the micromirrors; the method further includes:

connecting the optical chip with an electrical lead structure through wires, and the electrical lead structure is used to provide an electrical signal interface for the optical chip;

The electrical lead structure is attached to the optical window.