CN113381176A - Antenna processing technology and antenna - Google Patents
Antenna processing technology and antenna Download PDFInfo
- Publication number
- CN113381176A CN113381176A CN202110642519.XA CN202110642519A CN113381176A CN 113381176 A CN113381176 A CN 113381176A CN 202110642519 A CN202110642519 A CN 202110642519A CN 113381176 A CN113381176 A CN 113381176A
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- metal layer
- antenna
- plastic substrate
- metal
- antenna pattern
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- 238000012545 processing Methods 0.000 title claims abstract description 34
- 238000005516 engineering process Methods 0.000 title claims abstract description 19
- 239000002184 metal Substances 0.000 claims abstract description 128
- 229910052751 metal Inorganic materials 0.000 claims abstract description 128
- 239000000758 substrate Substances 0.000 claims abstract description 75
- 238000000034 method Methods 0.000 claims abstract description 31
- 239000000463 material Substances 0.000 claims abstract description 29
- 238000007747 plating Methods 0.000 claims abstract description 27
- 238000001746 injection moulding Methods 0.000 claims abstract description 26
- 239000000126 substance Substances 0.000 claims abstract description 15
- 239000011265 semifinished product Substances 0.000 claims abstract description 11
- 238000010329 laser etching Methods 0.000 claims description 9
- 238000003780 insertion Methods 0.000 claims description 6
- 230000037431 insertion Effects 0.000 claims description 6
- 239000003973 paint Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 4
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 238000007639 printing Methods 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000000047 product Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052705 radium Inorganic materials 0.000 description 1
- HCWPIIXVSYCSAN-UHFFFAOYSA-N radium atom Chemical compound [Ra] HCWPIIXVSYCSAN-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
Landscapes
- Details Of Aerials (AREA)
Abstract
The invention relates to the technical field of antennas, and particularly discloses an antenna processing technology and an antenna, wherein the antenna processing technology comprises the following steps: providing a first plastic substrate; processing a first antenna pattern on the surface of the first plastic substrate; plating a first metal layer at the position of the first antenna pattern by adopting a chemical plating process to obtain a semi-finished product; injecting a second plastic base material on the semi-finished product through an injection molding process; processing a second antenna pattern on the surface of the second plastic base material; plating a second metal layer at the position of the second antenna pattern by adopting a chemical plating process; the first metal layer and the second metal layer are connected by a conductive metal. The first metal layer and the second metal layer are arranged through the chemical plating process, and the second plastic base material is processed through the injection molding process, so that the whole space is compact, and the whole space occupation is reduced.
Description
Technical Field
The invention relates to the technical field of antennas, in particular to an antenna processing technology and an antenna.
Background
At present, an antenna is generally manufactured by welding an FPC (Flexible printed Circuit) or a cable on an insulating main body, and since the antenna is manufactured by using the FPC or the cable, the volume of a product is large and the cost is relatively high; meanwhile, the welding operation is difficult to ensure the operation quality, which results in low yield in the manufacturing process.
Disclosure of Invention
The invention aims to: an antenna processing technology and an antenna are provided to reduce the whole volume of the antenna.
In one aspect, the present invention provides an antenna processing process, including:
providing a first plastic substrate;
processing a first antenna pattern on the surface of the first plastic substrate;
plating a first metal layer at the position of the first antenna pattern by adopting a chemical plating process to obtain a semi-finished product;
injecting a second plastic base material on the semi-finished product through an injection molding process;
processing a second antenna pattern on the surface of the second plastic base material;
plating a second metal layer at the position of the second antenna pattern by adopting a chemical plating process;
connecting the first metal layer and the second metal layer by a conductive metal.
As a preferred technical scheme of the antenna processing technology, when the second plastic substrate is molded by an injection molding process, a connecting hole is formed at the same time, and the connecting hole is opposite to the first metal layer; when a second antenna pattern is processed on the surface of the second plastic base material, the second antenna pattern extends to the connecting hole;
connecting the first metal layer and the second metal layer by a conductive metal material comprises filling the connecting hole with a conductive metal, wherein one end of the conductive metal is connected with the first metal layer, and the other end of the conductive metal is connected with the second metal layer.
As a preferred technical scheme of the antenna processing technology, when the first plastic base material is formed by an injection molding process, a plurality of jacks are formed at the same time;
when the second plastic base material is formed through an injection molding process, a plurality of inserting columns are formed at the same time, and the inserting columns are correspondingly inserted into the inserting holes one by one.
As a preferred technical solution of the antenna processing technology, the antenna processing technology further includes, after the first metal layer and the second metal layer are connected by a conductive metal:
and printing a tin paste layer on the part of the second metal layer.
As a preferred technical scheme of the antenna processing technology, after a second plastic base material is injected, a paint layer is sprayed or printed on the surface of the second plastic base material, and a second antenna pattern is processed on the paint layer through a laser etching technology.
In another aspect, the present invention also provides an antenna, including:
the plastic substrate comprises a first plastic substrate, a second plastic substrate, a first metal layer, a second metal layer and a conductive metal, wherein the second plastic substrate is formed on the first plastic substrate in an injection molding mode, the first metal layer is arranged on the surface of the first plastic substrate, the second metal layer is arranged on the surface of the second plastic substrate, and the conductive metal is connected with the first metal layer and the second metal layer.
As an optimal technical scheme of the antenna, the second plastic substrate is provided with a connecting hole, the connecting hole is opposite to the first metal layer, the second metal layer extends to the connecting hole, and the conductive metal is filled in the connecting hole.
As an optimal technical scheme of the antenna, the first plastic substrate is provided with a plurality of jacks, the second plastic substrate is provided with a plurality of inserting columns, and the inserting columns are correspondingly inserted into the jacks one by one.
As a preferable technical solution of the antenna, the antenna further includes a solder paste layer disposed on the surface of the second metal layer.
As a preferred technical scheme of the antenna, the first plastic substrate and the second plastic substrate are both made of liquid crystal polymer materials.
The invention has the beneficial effects that:
the invention provides an antenna processing technology and an antenna, wherein the antenna processing technology comprises the following steps: providing a first plastic substrate; processing a first antenna pattern on the surface of the first plastic substrate; plating a first metal layer at the position of the first antenna pattern by adopting a chemical plating process to obtain a semi-finished product; injecting a second plastic base material on the semi-finished product through an injection molding process; processing a second antenna pattern on the surface of the second plastic base material; plating a second metal layer at the position of the second antenna pattern by adopting a chemical plating process; the first metal layer and the second metal layer are connected by a conductive metal. The first metal layer and the second metal layer are arranged through the chemical plating process, and the second plastic base material is processed through the injection molding process, so that the whole space is compact, and the whole space occupation is reduced.
Drawings
Fig. 1 is a flow chart of an antenna processing process in an embodiment of the present invention;
FIG. 2 is an exploded view of an antenna in an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a first plastic substrate and a first metal layer according to an embodiment of the invention;
fig. 4 is a schematic structural diagram of a second plastic substrate, a second metal layer and a solder paste layer according to an embodiment of the invention.
In the figure:
1. a first plastic substrate; 11. a jack;
2. a first metal layer; 21. a first body; 22. a first extension body;
3. a second plastic substrate; 31. inserting a column; 32. connecting holes;
4. a second metal layer; 41. a second body; 42. a second extension body; 43. a third extension body;
5. a conductive metal;
6. and (7) a tin paste layer.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Where the terms "first position" and "second position" are two different positions, and where a first feature is "over", "above" and "on" a second feature, it is intended that the first feature is directly over and obliquely above the second feature, or simply means that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
As shown in fig. 1, the present embodiment provides an antenna processing process, which includes the following steps:
s1: a first plastic substrate 1 is provided.
Specifically, in the present embodiment, the first plastic substrate 1 is made of a Liquid Crystal Polymer (LCP), which has an insulating property and is a good electronic component carrier. In other embodiments, the material of the first plastic substrate 1 can be set according to the requirement. In this embodiment, the first plastic substrate 1 is processed by an injection molding process.
S2: processing a first antenna pattern on the surface of the first plastic substrate 1.
Specifically, in the present embodiment, a first antenna pattern (not shown in the drawings) is processed on the surface of the first plastic substrate 1 through a laser etching process, wherein the first antenna pattern is embodied on the surface of the first plastic substrate 1 in a first groove pattern. The first antenna patterns in various shapes can be processed through the laser etching process so as to meet different requirements. Of course, in other embodiments, the first antenna pattern may be directly injection-molded during the injection molding of the first plastic substrate 1 according to requirements.
S3: and plating a first metal layer 2 at the position of the first antenna pattern by adopting a chemical plating process to obtain a semi-finished product.
The chemical plating process is the prior art and is not described herein again. Preferably, after the first metal layer 2 is processed by the chemical plating process, the first metal layer 2 fills the first groove. Preferably, the outer surface of the first metal layer 2 is flush with the outer surface of the first plastic substrate 1. The material of the first metal layer 2 may include one or more of copper, nickel, gold, and silver. This embodiment is processed first metal level 2 at first plastic substrate 1 through laser radium carving technology with the cooperation process of plating, and first metal level 2 and 1 inseparable laminating of first plastic substrate compare FPC or cable among the prior art, and first metal level 2 need not to occupy extra space, can guarantee that whole volume is less.
Specifically, referring to fig. 3, the first metal layer 2 has a first body 21 and three strip-shaped first extending bodies 22 extending from the first body 21. Of course, in other embodiments, the first metal layer 2 may be disposed as required.
S4: and (3) injection molding a second plastic base material 3 on the semi-finished product through an injection molding process.
And a second plastic base material 3 is injected and molded on the basis of the semi-finished product through an embedded injection molding process. In this embodiment, a portion of the first metal layer 2 is located between the second plastic substrate 3 and the first plastic substrate 1. Specifically, the first body 21 and the three first extending bodies 22 are at least partially located between the first plastic substrate 1 and the second plastic substrate 3.
S5: and processing a second antenna pattern on the surface of the second plastic substrate 3.
Specifically, after the second plastic substrate 3 is injection-molded, a paint layer is sprayed or printed on the surface of the second plastic substrate 3, the oil-gas layer can be subjected to laser etching processing through laser, and then the second antenna pattern is processed on the paint layer through a laser etching process. In the embodiment, a second antenna pattern (not shown in the drawings) is processed on the surface of the second plastic substrate 3 through a laser etching process, wherein the second antenna pattern is embodied on the surface of the second plastic substrate 3 in a second groove pattern. In this embodiment, the second antenna patterns with various shapes may be processed through a laser etching process to meet different requirements. Of course, in other embodiments, the second antenna pattern may be directly injection-molded during the injection molding of the second plastic substrate 3 according to the requirement.
S6: and plating a second metal layer 4 at the position of the second antenna pattern by adopting a chemical plating process.
Preferably, after the second metal layer 4 is processed by the chemical plating process, the second metal layer 4 fills the second groove. Preferably, the outer surface of the second metal layer 4 is flush with the outer surface of the second plastic substrate 3. The material of the second metal layer 4 may include one or more of copper, nickel, gold, and silver. In the embodiment, the second metal layer 4 is processed on the second plastic base material 3 through the laser etching process and the matched plating process, so that the second metal layer 4 does not occupy extra space and the whole volume can be ensured to be small; in addition, the injection molding of the second plastic substrate 3 also plays a role in separating the first metal layer 2 from the second metal layer 4, so that the overall space occupation can be further reduced, and the miniaturization and improvement of the product can be realized.
Specifically, referring to fig. 4, in the embodiment, the second metal layer 4 has a second body 41, two strip-shaped second extending bodies 42 extending from the second body 41, and a strip-shaped third extending body 43 disposed at an interval with the second body 41 and the two second extending bodies 42. In other embodiments, the second metal layer 4 may be disposed as required.
S7: the first metal layer 2 and the second metal layer 4 are connected by a conductive metal 5.
Specifically, referring to fig. 2, when the second plastic substrate 3 is formed by an injection molding process, a connection hole 32 is formed at the same time, and the connection hole 32 faces the first metal layer 2; when the second antenna pattern is processed on the surface of the second plastic substrate 3, the second antenna pattern extends to the connection hole 32. The first metal layer 2 and the second metal layer 4 are connected through the conductive metal 5 by filling the conductive metal 5 in the connection hole 32, and one end of the conductive metal 5 is connected to the first metal layer 2, and the other end is connected to the second metal layer 4. In this embodiment, the connection hole 32 may be formed in the injection molding process of the second plastic substrate 3, and in the operation of connecting the first metal layer 2 and the second metal layer 4, a welding process in the prior art is not required, so that the process is simple, the control is easier, and the yield of the product is improved. Of course, in other embodiments, the first metal layer 2 and the second metal layer 4 may be connected by other external connecting members as needed.
In the present embodiment, a scheme of three connection holes 32 is exemplarily given, in which the conductive metal 5 in two connection holes 32 connects two first extension bodies 22 and two second extension bodies 42 one by one, respectively, and the conductive metal 5 in another connection hole 32 connects another first extension body 22 and a third extension body 43.
In this embodiment, the material of the conductive metal 5 is preferably tin or silver. Of course, in other embodiments, the material of the conductive metal 5 may be selected according to the requirement.
Optionally, S8 after step S7 is further included.
S8: a layer of solder paste 6 is printed on a part of the second metal layer 4.
Specifically, the solder paste layers 6 are provided on the two second extensions 42 and the third extension 43, respectively, to facilitate the soldering work and the testing work which are required later.
Preferably, when the first plastic substrate 1 is formed by an injection molding process, a plurality of insertion holes 11 are formed at the same time; when the second plastic substrate 3 is formed by injection molding, a plurality of inserting posts 31 are formed at the same time, and the plurality of inserting posts 31 are inserted into the plurality of inserting holes 11 in a one-to-one correspondence manner. Therefore, the first plastic substrate 1 and the second plastic substrate 3 can be stably connected.
As shown in fig. 2 to 4, the present embodiment further provides an antenna, which includes a first plastic substrate 1, a second plastic substrate 3, a first metal layer 2, a second metal layer 4, and a conductive metal 5. The second plastic substrate 3 is injection molded on the first plastic substrate 1, the first metal layer 2 is disposed on the surface of the first plastic substrate 1, the second metal layer 4 is disposed on the surface of the second plastic substrate 3, and the conductive metal 5 is connected to the first metal layer 2 and the second metal layer 4. It can be understood that the antenna can be processed by the antenna processing technology, and other processing modes can be selected according to requirements.
Optionally, a connection hole 32 is formed on the second plastic substrate 3, the connection hole 32 is opposite to the first metal layer 2, the second metal layer 4 extends to the connection hole 32, and the conductive metal 5 is filled in the connection hole 32.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (10)
1. An antenna processing technology is characterized by comprising the following steps:
providing a first plastic substrate (1);
processing a first antenna pattern on the surface of the first plastic base material (1);
plating a first metal layer (2) at the position of the first antenna pattern by adopting a chemical plating process to obtain a semi-finished product;
injecting a second plastic base material (3) into the semi-finished product through an injection molding process;
processing a second antenna pattern on the surface of the second plastic base material (3);
plating a second metal layer (4) at the position of the second antenna pattern by adopting a chemical plating process;
the first metal layer (2) and the second metal layer (4) are connected by a conductive metal (5).
2. The antenna processing technology according to claim 1, wherein when the second plastic substrate (3) is formed by an injection molding process, a connecting hole (32) is formed at the same time, and the connecting hole (32) is opposite to the first metal layer (2); when a second antenna pattern is processed on the surface of the second plastic base material (3), the second antenna pattern extends to the connecting hole (32);
connecting the first metal layer (2) and the second metal layer (4) through a conductive metal (5) material comprises filling the conductive metal (5) in the connecting hole (32), wherein one end of the conductive metal (5) is connected with the first metal layer (2), and the other end of the conductive metal is connected with the second metal layer (4).
3. The antenna processing technology according to claim 1 or 2, wherein the first plastic substrate (1) is formed with a plurality of insertion holes (11) simultaneously when being formed by an injection molding process;
when the second plastic base material (3) is formed through an injection molding process, a plurality of inserting columns (31) are formed at the same time, and the inserting columns (31) are correspondingly inserted into the inserting holes (11) one by one.
4. The antenna processing process according to claim 1 or 2, characterized in that it further comprises, after said connecting of said first metal layer (2) and said second metal layer (4) by a conductive metal (5):
and printing a tin paste layer (6) on the part of the second metal layer (4).
5. The antenna processing process according to claim 1 or 2, characterized in that after the injection molding of the second plastic substrate (3), a paint layer is sprayed or printed on the surface of the second plastic substrate (3), and the second antenna pattern is processed on the paint layer by a laser etching process.
6. An antenna, characterized in that the antenna comprises:
first plastic substrate (1), injection moulding in second plastic substrate (3) of first plastic substrate (1), set up in first metal level (2) on first plastic substrate (1) surface, set up in second metal level (4) on second plastic substrate (3) surface, and connect first metal level (2) with electrically conductive metal (5) of second metal level (4).
7. The antenna according to claim 6, wherein the second plastic substrate (3) is provided with a connection hole (32), the connection hole (32) is opposite to the first metal layer (2), the second metal layer (4) extends to the connection hole (32), and the conductive metal (5) is filled in the connection hole (32).
8. The antenna according to claim 6, wherein the first plastic substrate (1) is provided with a plurality of insertion holes (11), the second plastic substrate (3) is provided with a plurality of insertion posts (31), and the plurality of insertion posts (31) are inserted into the plurality of insertion holes (11) in a one-to-one correspondence manner.
9. An antenna according to claim 6, characterized in that it further comprises a layer of solder paste (6) provided on the surface of the second metal layer (4).
10. The antenna according to any of claims 6-9, wherein the first plastic substrate (1) and the second plastic substrate (3) are both made of liquid crystal polymer materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110642519.XA CN113381176A (en) | 2021-06-09 | 2021-06-09 | Antenna processing technology and antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110642519.XA CN113381176A (en) | 2021-06-09 | 2021-06-09 | Antenna processing technology and antenna |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113381176A true CN113381176A (en) | 2021-09-10 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110642519.XA Pending CN113381176A (en) | 2021-06-09 | 2021-06-09 | Antenna processing technology and antenna |
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| CN (1) | CN113381176A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115863959A (en) * | 2021-09-26 | 2023-03-28 | 荣耀终端有限公司 | A kind of terminal equipment, motherboard antenna bracket and preparation method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202488928U (en) * | 2012-03-13 | 2012-10-10 | 青岛长弓塑模有限公司 | Base material comprising lead connector of antenna |
| CN104466367A (en) * | 2013-09-13 | 2015-03-25 | 比亚迪股份有限公司 | Antenna manufacturing method, antenna apparatus and mobile terminal |
| CN104882671A (en) * | 2015-05-11 | 2015-09-02 | 深圳天珑无线科技有限公司 | Method for realizing chemical plated antenna on plastic housing embedded with metal |
| CN105428780A (en) * | 2014-09-23 | 2016-03-23 | 联想(北京)有限公司 | A workpiece manufacturing method, workpiece and electronic equipment |
| CN209401809U (en) * | 2019-03-22 | 2019-09-17 | 京信通信技术(广州)有限公司 | Dielectric Waveguide Filter Components |
| CN112235438A (en) * | 2019-06-30 | 2021-01-15 | Oppo广东移动通信有限公司 | Shell assembly and preparation method thereof, antenna assembly and electronic equipment |
-
2021
- 2021-06-09 CN CN202110642519.XA patent/CN113381176A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202488928U (en) * | 2012-03-13 | 2012-10-10 | 青岛长弓塑模有限公司 | Base material comprising lead connector of antenna |
| CN104466367A (en) * | 2013-09-13 | 2015-03-25 | 比亚迪股份有限公司 | Antenna manufacturing method, antenna apparatus and mobile terminal |
| CN105428780A (en) * | 2014-09-23 | 2016-03-23 | 联想(北京)有限公司 | A workpiece manufacturing method, workpiece and electronic equipment |
| CN104882671A (en) * | 2015-05-11 | 2015-09-02 | 深圳天珑无线科技有限公司 | Method for realizing chemical plated antenna on plastic housing embedded with metal |
| CN209401809U (en) * | 2019-03-22 | 2019-09-17 | 京信通信技术(广州)有限公司 | Dielectric Waveguide Filter Components |
| CN112235438A (en) * | 2019-06-30 | 2021-01-15 | Oppo广东移动通信有限公司 | Shell assembly and preparation method thereof, antenna assembly and electronic equipment |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115863959A (en) * | 2021-09-26 | 2023-03-28 | 荣耀终端有限公司 | A kind of terminal equipment, motherboard antenna bracket and preparation method thereof |
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