CN113351514B - Wafer thickness sorting method - Google Patents

Abstract

The invention discloses a wafer thickness sorting method, which is characterized in that wafers after thickness detection are sorted and stored, a storage device is respectively provided with a top sensor and a bottom sensor at two ends of a conveying belt for storing and conveying the wafers, a driving motor is arranged for driving the conveying belt, when the wafers in the storage device are conveyed after storage is finished, the driving motor drives the conveying belt to drive the wafers to ascend, when the top sensor detects that the wafers exist at the top of the conveying belt, the top sensor sends an interrupt signal to the driving motor, the driving motor stops rotating to enable the wafers to be kept at a set height, and at the moment, a manipulator takes the wafers at the top and continuously and circularly finishes transfer. The top sensor is triggered to send an interrupt signal through each wafer, so that the conveyor belt is immediately stopped, and the consistency of the lifting height of the wafers is ensured.

Description

A kind of wafer thickness sorting method

technical field

The invention belongs to the technical field of wafer sorting, in particular to a wafer thickness sorting method.

Background technique

At present, various processes or sorting processes are required in the production and manufacture of wafers. The manipulator often puts and takes out the wafers from the storage box, and the fork of the manipulator needs to be moved to the wafer storage box. Take or put wafers in each slot. When using the automatic wafer storage box, the manipulator only needs to pick up the wafer from the uppermost slot of the automatic wafer storage box. The automatic wafer storage box can automatically lift each slot in the storage box, and can always move the slot that needs to be picked and placed to the top, which is convenient for the manipulator to pick and place wafers. The position accuracy of the manipulator is very high, so it is required that the automatic wafer storage box lifts the wafers in each slot to the top with at least the same position accuracy, otherwise the distance will be too far, and the manipulator cannot take the wafer; or It is too close and the wafer is crushed.

Each slot in the automated wafer storage box is formed by teeth attached to four movable belts, which are driven by servo motors to raise or lower each slot by one step. On the one hand, the accuracy of the belt slots is not up to standard, and on the other hand, due to the differences in the belt tension and installation of each automatic wafer storage box, the distance between the slots of each group of automatic wafer storage boxes is different. difference. The current control method considers the distance between the slots to be the same, that is, the motor moves the same distance for one slot, and the pulse value converted into the motor is also the same. The automatic wafer storage box uses a relatively common position control method. The control board issues a command to move to the target position, the motor starts to rotate, and the encoder rotates with it. When the encoder rotates, it sends out a pulse signal. The pulse signal is compared with the target position value, until the pulse value is equal to the target value, the pulse is stopped and the motor stops moving. The same pulse value and phase value are issued, and the motor movement distance is the same. Due to the substandard belt accuracy and installation differences, there is a difference in the rise or fall of one slot, and the consistency of the wafer lifting height cannot be guaranteed.

Contents of the invention

1. The technical problem to be solved by the invention

The purpose of the present invention is to solve the problem that the existing wafer thickness sorting system is difficult to ensure the consistency of wafer lifting height during the process of automatic storage.

2. Technical solution

In order to achieve the above object, the technical scheme provided by the invention is:

A wafer thickness sorting method of the present invention is to sort and store the wafers after thickness detection, and the storage device is respectively provided with top sensors and bottom sensors at both ends of the conveyor belt for storing and transporting the wafers. There is a drive motor for driving the conveyor belt. When the storage device is finished storing and transporting the wafers in it, the drive motor drives the conveyor belt to drive the wafer up. When the top sensor detects that there is a wafer on the top of the conveyor belt, the top sensor Send an interrupt signal to the drive motor, and the drive motor stops rotating to keep the wafer at the set height. At this time, the robot arm takes the top wafer away and completes the transfer in a continuous cycle.

Preferably, a storage device is also included to store the wafers, the manipulator places the wafers on the top of the conveyor belt, the top sensor detects the existence of the wafers and sends a control signal to the drive motor, and the drive motor rotates so that the conveyor belt drives the wafers down by one slot pitch.

Preferably, the method further includes detecting the number of fixed teeth of the passing conveyor belt through the bottom sensor, and calculating the distance between adjacent fixed teeth by calculating the number of fixed teeth and the corresponding encoding value of the encoder of the drive motor.

Preferably, the method is specifically to first drive the conveyor belt by driving the motor so that all the fixed teeth are located above the bottom sensor, then drive the motor to drive the conveyor belt down, and when the bottom sensor detects the first fixed tooth, the motor code value is reset to zero , this position is the zero position, and then the conveyor belt continues to descend so that the last fixed tooth stops moving when it is detected by the bottom sensor, and the distance between adjacent fixed teeth is calculated by calculating the number of fixed teeth and the encoding value of the encoder of the corresponding drive motor is the slot spacing.

Preferably, the conveyor belt drives the wafer to rise with the slot pitch each time. During the movement, the top sensor continues to detect. When the top sensor detects that there is a wafer on the top of the conveyor belt, the top sensor sends an interrupt signal to the drive motor; when the top sensor When no wafer is detected on top of the belt, the belt continues to move at slot pitch.

Preferably, the method is carried out using the following equipment: including a thickness detection component and a sorting component, the sorting component includes a wafer input mechanism and a wafer storage mechanism, and the wafer detected by the thickness detection component is transported to the wafer The circular input mechanism, the wafer storage mechanism includes at least one set of conveyor belts arranged symmetrically, the opposite sides of at least one set of the conveyor belts are provided with corresponding fixed teeth for supporting wafers, and at least one set of the conveyor belts is provided with corresponding fixed teeth for supporting wafers. Both ends of the conveyor belt are respectively provided with a top sensor and a bottom sensor, the top sensor is used to detect whether there is a wafer on the top of the conveyor belt, and the bottom sensor is used to detect whether a fixed tooth passes by.

Preferably, a number of uniformly distributed wafer storage mechanisms are provided in the sorting assembly, and symmetrically parallel wafer input mechanisms and wafer output mechanisms are provided on the periphery of the plurality of wafer storage mechanisms.

Preferably, the sorting assembly is also provided with a storage box, the storage box is set at the end of the wafer input mechanism away from the thickness detection assembly, and the storage box is used to receive the dropped end of the wafer input mechanism. of wafers.

Preferably, the transport track of the wafer input mechanism is provided with a detection mechanism for detecting the integrity of the wafer, and the outlet of the wafer output mechanism is connected to a guide assembly one, and the guide assembly one includes a wafer Transfer mechanism 1, guide mechanism 1, guide lift mechanism 1, the wafer transfer mechanism 1 docks with the wafer output mechanism, the guide lift mechanism drives the guide mechanism 1 to move, the guide Sheet mechanism 1 transfers the guide sheet lifting mechanism 1 and the wafer transfer mechanism 1.

Preferably, the wafer transfer mechanism one is connected with a transmission component one, and the transmission component one includes a loading transmission mechanism one for placing the wafer cassette one to be stored and an unloading transmission mechanism one for placing the stored wafer cassette one.

Preferably, the thickness detection assembly includes a fixed bracket and several detection mechanisms arranged side by side, the fixed bracket is provided with several height adjustment mechanisms, and the detection mechanisms are respectively arranged on individual height adjustment mechanisms.

Preferably, one side of the symmetrical sorting assembly of the thickness detection assembly is provided with a guide assembly 2, and the guide assembly 2 is provided with a wafer transfer mechanism 2, a guide mechanism 2, and a guide lifting mechanism 2, and the wafer The second circular transfer mechanism extends outward and connects with the thickness detection component, the second guide vane lifting mechanism drives the second guide vane mechanism to move, and the second guide vane mechanism transfers the second guide vane lifting mechanism and the wafer transfer Institution Two.

Preferably, the second guide mechanism is connected with a transmission component 2, and the transmission component 2 includes a loading transmission mechanism 2 for placing the wafer box to be taken and a blanking transmission mechanism 2 for placing the taken wafer box, so The above-mentioned feeding transmission mechanism 2 and unloading transmission mechanism 2 are transferred through a vertical moving mechanism.

Preferably, the wafer storage mechanism also includes a base and a drive motor fixed on the base, a fixed bracket is vertically provided on the base, driven shafts are provided on the upper and lower sides of the fixed bracket, and the The driven shaft is provided with a rotating wheel for driving the conveyor belt, and the rotating wheel is connected with the driving wheel of the driving motor through a driving belt.

Preferably, two sets of conveyor belts are included and arranged parallel to each other, each set of conveyor belts includes two symmetrically arranged conveyor belts, and the number of fixed teeth on the two sets of conveyor belts is the same.

Preferably, the fixed bracket includes a lower fixed bracket and an upper fixed bracket, the lower fixed bracket and the upper fixed bracket are provided with shaft fixing holes for fixing the driven shaft, the top sensor is fixed with the upper fixed bracket, The bottom sensor is fixed with the lower fixing bracket.

Preferably, a fixing device is provided on the base or the lower fixing bracket, and the fixing device is used to fix the rotating shaft and the driving shaft of the driving motor. The rotating shaft and the driving shaft are arranged in parallel and are transmitted through a gear set. Both the rotating shaft and the driving shaft are provided with drive wheels.

Preferably, the gear set is a pair of gears with the same specifications and meshing with each other.

Preferably, the drive motor is an integrated servo drive motor, the drive motor includes an encoder, a control board and a brake mechanism, and the control board is connected to the top sensor and the bottom sensor in communication.

Preferably, the first transmission component is provided with upper and lower cavities or left and right cavities that are connected to each other, and the upper and lower cavities or the left and right cavities are respectively provided with a feeding transmission mechanism 1 and an unloading transmission mechanism 1.

Preferably, the transmission component 2 is provided with upper and lower cavities or left and right cavities that communicate with each other, and the upper and lower cavities or the left and right cavities are respectively provided with a feeding transmission mechanism 2 and an unloading transmission mechanism 2.

3. Beneficial effect

Compared with the prior art, the technical solution provided by the invention has the following beneficial effects:

A wafer thickness sorting method of the present invention is to sort and store the wafers after thickness detection, and the storage device is respectively provided with top sensors and bottom sensors at both ends of the conveyor belt for storing and transporting the wafers. There is a drive motor for driving the conveyor belt. When the storage device is finished storing and transporting the wafers in it, the drive motor drives the conveyor belt to drive the wafer up. When the top sensor detects that there is a wafer on the top of the conveyor belt, the top sensor Send an interrupt signal to the drive motor, and the drive motor stops rotating to keep the wafer at the set height. At this time, the robot arm takes the top wafer away and completes the transfer in a continuous cycle. Each time the above wafer is triggered, the top sensor sends an interrupt signal to make the conveyor belt stop immediately, ensuring the consistency of the wafer lifting height.

Description of drawings

Fig. 1 is the structural representation of the equipment that the method of the present embodiment just adopts;

FIG. 2 is a schematic structural diagram of a transmission component 1 of the present embodiment;

FIG. 3 is a schematic structural view of the first guide assembly of the present embodiment;

Fig. 4 is the structural representation of the sorting assembly of the present embodiment;

FIG. 5 is a schematic structural diagram of the thickness detection component of the present embodiment;

FIG. 6 is a schematic structural view of the second guide assembly of the present embodiment;

FIG. 7 is a schematic structural diagram of the transmission component 2 of this embodiment;

FIG. 8 is a schematic structural diagram of the wafer storage mechanism of this embodiment;

FIG. 9 is a front view of the wafer storage mechanism of this embodiment;

FIG. 10 is a side view of the wafer storage mechanism of this embodiment;

FIG. 11 is a partial schematic diagram of the driving motor of the wafer storage mechanism of this embodiment.

Explanation of the labels in the schematic diagram:

100. One transmission component; 110. One loading and conveying mechanism; 120. One unloading and conveying mechanism; 130. One wafer box to be stored; 140. One stored wafer box; 150. One wafer box moving mechanism;

200, guide piece assembly one; 210, wafer transfer mechanism one; 220, guide piece mechanism one; 230, guide piece lifting mechanism one;

300, sorting component; 310, wafer output mechanism; 320, storage box; 410, wafer input mechanism; 420, moving arm; 430, gripper; 440, wafer storage mechanism; 450, manipulator; 460, wafer Circle tracking detection component;

500, thickness detection component; 510, fixed bracket; 520, detection mechanism; 530, height adjustment mechanism;

600, the second guide assembly; 610, the second wafer transfer mechanism; 620, the second guide mechanism; 630, the second guide lifting mechanism;

700, transmission component two; 710, unloading transmission mechanism two; 720, loading transmission mechanism two; 730, wafer box has been taken; 740, wafer box to be taken; 750, wafer box moving mechanism two; 760 , vertical movement mechanism;

4100, base; 4101, base fixing hole; 4110, lower fixing bracket; 4111, rotating shaft fixing hole; 4112, bracket fixing hole; 4113, bottom sensor; 4114, driving shaft; 4115, rotating shaft; 4116, fixing device; 4120, Drive motor; 4121, transmission wheel; 4122, transmission belt; 4123, driven wheel; 4124, rotating wheel; 4125, driven shaft; 4126, conveyor belt; 4127, fixed teeth; 4128, gear set; 4130, upper fixed bracket; 4131, horizontal fixing rod; 4132, top sensor; 4140, fixing plate; 4150, wafer.

Detailed ways

In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the accompanying drawings, in which several embodiments of the present invention are shown, however, the present invention can be realized in many different forms and is not limited herein The described embodiments are, on the contrary, provided so that the disclosure of the invention will be thorough.

It should be noted that when an element is said to be "fixed on" another element, it may be directly on the other element or there may be an intervening element; when an element is said to be "connected" to another element, it may is directly connected to another element or there may be an intervening element; the terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field of the present invention; the terms used herein in the description of the present invention are only to describe specific embodiments is not intended to limit the present invention; as used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Example 1

Referring to accompanying drawings 1 to 11, a wafer thickness sorting method in this embodiment is to sort and store the wafers after thickness detection, and the storage device is on the conveyor belt 4126 that stores and transports the wafer 4150 Both ends are provided with a top sensor 4132 and a bottom sensor 4113 respectively, and a drive motor 4120 is provided for driving the conveyor belt 4126. When the storage device is stored and the wafers in it are transported, the drive motor 4120 drives the conveyor belt 4126 to drive the wafer. The circle 4150 rises, and when the top sensor 4132 detects that there is a wafer 150 on the top of the conveyor belt 4126, the top sensor 4132 sends an interrupt signal to the drive motor 4120, and the drive motor 4120 stops rotating so that the wafer 4150 remains at the set height. At this time, the manipulator 450 The top wafer 150 is taken away, and the transfer is completed in a continuous cycle.

It also includes a storage device for storing wafers. The manipulator 450 places the wafer 150 on the top of the conveyor belt 4126. The top sensor 4132 detects the presence of the wafer 150 and sends a control signal to the drive motor 4120. The drive motor 4120 rotates so that the conveyor belt 4126 drives the wafer 4150 down. One slot pitch.

The bottom sensor 4113 detects the number of fixed teeth 4127 of the passing conveyor belt 4126 , and calculates the distance between adjacent fixed teeth 4127 by calculating the number of fixed teeth 4127 and the corresponding encoding value of the encoder of the drive motor 4120 .

The specific method is first to drive the conveyor belt 4126 through the driving motor 4120 so that all the fixed teeth 4127 are located above the bottom sensor 4113, and then drive the motor 4120 to drive the conveyor belt 4126 down. When the bottom sensor 4113 detects the first fixed tooth 4127, the motor code value is cleared, this position is the zero position, and then the conveyor belt 4126 continues to descend so that the last fixed tooth 4127 stops moving when it is detected by the bottom sensor 4113, and the number of fixed teeth 4127 is compared with the code value of the encoder of the corresponding drive motor 4120 The distance between adjacent fixed teeth 4127 is calculated as the slot distance.

The conveyor belt 4126 drives the wafer 4150 to rise each time at the slot pitch. During the movement, the top sensor 4132 continues to detect. When the top sensor 4132 detects that there is a wafer 4150 on the top of the conveyor belt 4126, the top sensor 4132 sends an interrupt signal to the drive motor. 4120 ; when the top sensor 4132 does not detect that there is a wafer 4150 on the top of the conveyor belt 4126 , the conveyor belt 4126 continues to move at the slot pitch.

The method of this embodiment is carried out using the following equipment: the equipment includes a thickness detection component 500 and a sorting component 300, and the sorting component 300 includes a wafer input mechanism 410 and a wafer storage mechanism 440, and the thickness detection component 500 controls the wafer The wafers are transported to the sorting component 300 through the wafer input mechanism 410 after the thickness detection, and the sorting component 300 places the wafers of different thicknesses into different storage mechanisms 440 according to the set classification rules. The final wafer is transported to the wafer input mechanism 410. The wafer storage mechanism 440 includes at least one set of conveyor belts 4126 arranged symmetrically. The opposite sides of at least one set of the conveyor belts 4126 are provided with corresponding support. The fixed teeth 4127 of the wafer 4150, at least one set of the two ends of the conveyor belt 4126 are respectively provided with a top sensor 4132 and a bottom sensor 4113, and the top sensor 4132 is used to detect whether there is a wafer 4150 on the top of the conveyor belt 4126, so The bottom sensor 4113 is used to detect whether a fixed tooth 4127 passes by. The conveyor belt 4126 drives the wafer to rise at the slot pitch each time. During the movement, the top sensor 4132 continues to detect. When the top sensor 4132 detects that there is a wafer on the top of the conveyor belt 4126, the top sensor 4132 sends an interrupt signal to the drive motor; When the top sensor 4132 does not detect that there is a wafer on the top of the conveyor belt 4126, the conveyor belt 4126 continues to move at the slot pitch. Each time the above wafer is triggered, the top sensor 4132 sends an interrupt signal to make the conveyor belt stop immediately, so as to ensure the consistency of the wafer lifting height.

A number of uniformly distributed wafer storage mechanisms 440 are provided in the sorting assembly 300 , and a symmetrical parallel wafer input mechanism 410 and a wafer output mechanism 310 are arranged on the periphery of the plurality of wafer storage mechanisms 440 .

The sorting assembly 300 is also provided with a storage box 320, the storage box 320 is arranged at one end of the wafer input mechanism 410 away from the thickness detection assembly 500, and the storage box 320 is used to receive the end of the wafer input mechanism 410 Falling wafers.

The transport track of the wafer input mechanism 410 is provided with a detection mechanism 520 for detecting the integrity of the wafer. The detection mechanism 520 is an image recognition device that detects a complete wafer and sends a signal to control the manipulator 450. The mobile arm 420 of the manipulator 450 Move and place the complete wafer clamped by the gripper 430 into the corresponding storage mechanism 440. When the wafer is detected to be incomplete, no signal is sent to the manipulator 450 for grasping, and the incomplete wafer that has not been grasped The wafer moves with the wafer input mechanism 410 and falls into the storage box 320 . The wafer input mechanism 410 and the wafer output mechanism 310 are conveyor belts and other conveying equipment.

The outlet of the wafer output mechanism 310 is connected with a guide assembly-200, and the guide assembly-200 includes a wafer transfer mechanism-210, a guide mechanism-220, and a guide lifting mechanism-230, and the wafer transfer mechanism-1 210 is docked with the wafer output mechanism 310, the first guide vane mechanism 230 drives the first guide vane mechanism 220 to move, and the first guide vane mechanism 220 connects the first guide vane lift mechanism 230 with the wafer Circular transfer mechanism one 210 .

The wafer transfer mechanism one 210 is connected with a transmission component one 100, and the transmission component one 100 includes a material loading transmission mechanism one 110 for placing the wafer cassette one 130 to be stored and an unloading transmission mechanism one for placing the stored wafer cassette one 140 120, the feeding transport mechanism 110 transports the wafer cassette 130 to be stored to the wafer transfer mechanism 1 210, and the wafer transfer mechanism 1 210 transports the wafer cassette 130 to be stored to the guide mechanism 1 220 for fixing , the guide plate lifting mechanism one 230 places the wafer output by the wafer output mechanism 310 in the wafer cassette one 130 to be stored, and then the stored wafer cassette one 140 is transported to the transmission component one by the wafer transfer mechanism one 210 The first 120 of the blanking transmission mechanism of 100 outputs.

The thickness detection assembly 500 includes a fixed bracket 510 and several detection mechanisms 520 arranged side by side. The fixed bracket 510 is provided with several height adjustment mechanisms 530 , and the detection mechanisms 520 are respectively arranged on individual height adjustment mechanisms 530 .

One side of the thickness detection assembly 500 and the symmetrical sorting assembly 300 is provided with a second guide assembly 600, and the second guide assembly 600 is provided with a second wafer transfer mechanism 610, a second guide mechanism 620, and a second guide lift mechanism 630. The wafer transfer mechanism 2 610 extends outwards to connect with the thickness detection component 500, the guide vane lifting mechanism 2 630 drives the guide vane mechanism 2 620 to move, and the guide vane mechanism 2 620 is connected to the guide vane lifting mechanism Two 630 and the second wafer transfer mechanism 610.

The second guide mechanism 620 is connected with the second transmission component 700, and the second transmission component 700 includes the second loading transmission mechanism 720 for placing the wafer cassette 740 to be taken and the second unloading transmission mechanism 710 for placing the wafer cassette 730 that has been taken , the second loading and unloading transmission mechanism 720 and the second unloading transmission mechanism 710 are transferred through the vertical movement mechanism 760 .

The wafer storage mechanism 440 also includes a base 4100 and a drive motor 4120 fixed on the base 4100, the base 4100 is vertically provided with a fixed bracket, and the upper and lower sides of the fixed bracket are provided with driven shafts 4125, so The driven shaft 4125 is provided with a rotating wheel 4124 for driving the conveyor belt 4126 , and the rotating wheel 4124 is connected with the driving wheel 4121 of the driving motor 4120 through a driving belt 4122 .

Two sets of conveyor belts 4126 are included and arranged parallel to each other. Each set of conveyor belts 4126 includes two conveyor belts 4126 arranged symmetrically. The number of fixed teeth 4127 on the two sets of conveyor belts 4126 is the same.

The fixed bracket includes a lower fixed bracket 4110 and an upper fixed bracket 4130, the lower fixed bracket 4110 and the upper fixed bracket 4130 are provided with a rotating shaft fixing hole 4111 for fixing the driven shaft 4125, the top sensor 4132 is connected with the upper fixed bracket 4130 is fixed, and the bottom sensor 4113 is fixed with the lower fixing bracket 4110.

The base 4100 or the lower fixed bracket 4110 is provided with a fixing device 4116, the fixing device 4116 is used to fix the rotating shaft 4115 and the driving shaft 4114 of the driving motor 4120, the rotating shaft 4115 and the driving shaft 4114 are arranged in parallel and pass through the gear Group 4128 transmission, the rotating shaft 4115 and the drive shaft 4114 are all provided with transmission wheels 4121.

The gear set 4128 is a pair of gears with the same specifications and meshing with each other.

The driving motor 4120 is an integrated servo driving motor, and the driving motor 4120 includes an encoder, a control board and a brake mechanism, and the control board is connected to the top sensor 4132 and the bottom sensor 4113 in communication.

The first transmission component 100 is provided with upper and lower cavities or left and right cavities that are connected to each other, and the upper and lower cavities or the left and right cavities are respectively provided with a feeding transmission mechanism 110 and an unloading transmission mechanism 120 .

The second transmission component 700 is provided with upper and lower cavities or left and right cavities that are connected to each other, and the upper and lower cavities or the left and right cavities are respectively provided with a feeding transmission mechanism 2 720 and an unloading transmission mechanism 2 710 .

A top sensor 4132 and a bottom sensor 4113 are respectively provided at both ends of the conveyor belt 4126 for storing and transporting the wafer 4150, and a drive motor 4120 is provided for driving the conveyor belt 4126, and the drive motor 4120 drives the conveyor belt 4126 to drive the wafer 4150 to rise, When the top sensor 4132 detects that there is a wafer 4150 on the top of the conveyor belt 4126, the top sensor 4132 sends an interrupt signal to the driving motor 4120, and the driving motor 4120 stops rotating so that the wafer 4150 remains at the set height. It can ensure that the wafer 4150 is accurately and stably placed at the position to be picked and placed.

The method of this embodiment also includes detecting the number of fixed teeth 4127 of the conveyor belt 4126 passing through the bottom sensor 4113, and calculating the number of fixed teeth 4127 and the corresponding encoding value of the encoder of the drive motor 4120. spacing.

The specific method is first to drive the conveyor belt 4126 through the driving motor 4120 so that all the fixed teeth 4127 are located above the bottom sensor 4113, and then drive the motor 4120 to drive the conveyor belt 4126 down. When the bottom sensor 4113 detects the first fixed tooth 4127, the motor code value is cleared, this position is the zero position, and then the conveyor belt 4126 continues to descend so that the last fixed tooth 4127 stops moving when it is detected by the bottom sensor 4113, and the number of fixed teeth 4127 is compared with the code value of the encoder of the corresponding drive motor 4120 The distance between adjacent fixed teeth 4127 is calculated as the slot distance. By determining the value of the motor code value in the process of all the fixed teeth 4127 passing through the bottom sensor 4113, the distance between adjacent fixed teeth 4127 is calculated as the slot distance, and the conveyor belt 4126 is controlled to rise or fall by one slot distance each time through the code value. It can ensure that the conveyor belt 4126 moves stably and evenly to realize the stable taking or storage of the wafer 4150 .

The conveyor belt 4126 drives the wafer 4150 to rise each time at the slot pitch. During the movement, the top sensor 4132 continues to detect. When the top sensor 4132 detects that there is a wafer 4150 on the top of the conveyor belt 4126, the top sensor 4132 sends an interrupt signal to the drive motor. 4120 ; when the top sensor 4132 does not detect that there is a wafer 4150 on the top of the conveyor belt 4126 , the conveyor belt 4126 continues to move at the slot pitch.

The above-described embodiment only expresses a certain implementation mode of the present invention, and its description is relatively specific and detailed, but it should not be interpreted as limiting the patent scope of the present invention; it should be pointed out that for those of ordinary skill in the art That is to say, without departing from the concept of the present invention, several modifications and improvements can be made, which all belong to the protection scope of the present invention; therefore, the protection scope of the patent for the present invention should be based on the appended claims.

Claims (16)

1. A wafer thickness sorting method is characterized by comprising the following steps: sorting and storing the wafer after the thickness detection, wherein the method is carried out by adopting the following equipment: the wafer sorting device comprises a thickness detection assembly (500) and a sorting assembly (300), wherein the sorting assembly (300) comprises a wafer input mechanism (410) and a wafer storage mechanism (440), wafers with different thicknesses are conveyed to the sorting assembly (300) through the wafer input mechanism (410) after being detected by the thickness detection assembly (500), the sorting assembly (300) places the wafers with different thicknesses into different wafer storage mechanisms (440) according to set sorting rules, the wafer storage mechanism (440) is respectively provided with a top sensor (4132) and a bottom sensor (4113) at two ends of a conveyer belt (4126) for storing and conveying the wafers (4150), a driving motor (4120) is used for driving the conveyer belt (4126), when the wafers in the storage devices are conveyed after storage is completed, the driving motor (4120) drives the conveyer belt (4126) to drive the wafers (4150) to ascend, and when the top sensor (4132) detects that the wafers (150) are arranged at the top of the conveyer belt (4126), the top sensor (4132) continuously sends an interruption signal to the driving motor (4120), the driving motor (4120) keeps rotating the wafer conveying robot (4150) to stop, and the wafer conveying the wafers (4150) is continuously, and the robot (41150) is taken out, and the top sensor (4132) is kept at the set height of the wafer is taken out;

the method further comprises detecting the number of fixed teeth (4127) of the passing conveyor belt (4126) by a bottom sensor (4113), calculating the distance between adjacent fixed teeth (4127) by the number of fixed teeth (4127) and the code value of the encoder of the corresponding driving motor (4120); the method specifically comprises the steps that a driving motor (4120) drives a conveying belt (4126) to enable all fixed teeth (4127) to be located above a bottom sensor (4113), a rear driving motor (4120) drives the conveying belt (4126) to descend, when the bottom sensor (4113) detects first fixed teeth (4127), the coded value of the motor is cleared to zero, the position is a zero position, then the conveying belt (4126) continues to descend to enable the last fixed teeth (4127) to be detected by the bottom sensor (4113) to stop moving, and the number of the fixed teeth (4127) and the coded value of an encoder of the corresponding driving motor (4120) are used for calculating the distance between every two adjacent fixed teeth (4127) to be the groove position distance; the conveyor (4126) drives the wafer (4150) to rise at a slot pitch each time, the top sensor (4132) continues to detect during the movement, and when the top sensor (4132) detects that there is a wafer (4150) on top of the conveyor (4126), the top sensor (4132) sends an interrupt signal to the drive motor (4120); when the top sensor (4132) does not detect a wafer (4150) on top of the conveyor belt (4126), the conveyor belt (4126) continues to move at the slot pitch.

2. The wafer thickness sorting method as claimed in claim 1, wherein: a plurality of wafer storage mechanisms (440) which are uniformly distributed are arranged in the sorting assembly (300), and a wafer input mechanism (410) and a wafer output mechanism (310) which are symmetrically parallel are arranged on the periphery of the plurality of wafer storage mechanisms (440).

3. The wafer thickness sorting method as claimed in claim 2, wherein: sorting component (300) still is equipped with receiver (320), receiver (320) set up in the one end of keeping away from thickness detection subassembly (500) of wafer input mechanism (410), receiver (320) are used for receiving the terminal wafer that drops of wafer input mechanism (410).

4. The wafer thickness sorting method as claimed in claim 2, wherein: be equipped with detection mechanism (520) that are used for detecting the wafer completeness on the transportation orbit of wafer input mechanism (410), the exit linkage of wafer output mechanism (310) has guide piece subassembly (200), guide piece subassembly (200) includes wafer transfer mechanism (210), guide piece mechanism (220), guide piece elevating system (230), wafer transfer mechanism (210) with wafer output mechanism (310) butt joint, guide piece elevating system (230) drive guide piece mechanism (220) remove, guide piece mechanism (220) switching guide piece elevating system (230) with wafer transfer mechanism (210).

5. The wafer thickness sorting method as claimed in claim 4, wherein: the first wafer transfer mechanism (210) is connected with a first transmission assembly (100), and the first transmission assembly (100) comprises a first feeding transmission mechanism (110) for placing a first wafer box (130) to be stored and a first discharging transmission mechanism (120) for placing a first stored wafer box (140).

6. The wafer thickness sorting method as claimed in claim 1, wherein: thickness detection subassembly (500) include fixed bolster (510) and a plurality of detection mechanism (520) that set up side by side, be equipped with a plurality of height control mechanism (530) on fixed bolster (510), detection mechanism (520) set up respectively in solitary height control mechanism (530).

7. The wafer thickness sorting method as claimed in claim 1, wherein: one side that subassembly (300) was selected separately to thickness detection subassembly (500) symmetry is equipped with guide piece subassembly two (600), guide piece subassembly two (600) are equipped with wafer transfer mechanism two (610), guide piece mechanism two (620) and guide piece elevating system two (630), wafer transfer mechanism two (610) outwards extend is connected with thickness detection subassembly (500), guide piece elevating system two (630) drive guide piece mechanism two (620) remove, guide piece mechanism two (620) switching guide piece elevating system two (630) with wafer transfer mechanism two (610).

8. The wafer thickness sorting method as claimed in claim 7, wherein: the second guide vane mechanism (620) is connected with a second transmission assembly (700), the second transmission assembly (700) comprises a second feeding transmission mechanism (720) for placing a wafer box (740) to be taken and a second discharging transmission mechanism (710) for placing a wafer box (730) to be taken, and the second feeding transmission mechanism (720) and the second discharging transmission mechanism (710) are connected through a vertical moving mechanism (760) in a switching mode.

9. The wafer thickness sorting method as claimed in claim 1, wherein: the wafer storage mechanism (440) further comprises a base (4100) and a driving motor (4120) fixed on the base (4100), a fixed support is vertically arranged on the base (4100), driven shafts (4125) are arranged on the upper side and the lower side of the fixed support, a rotating wheel (4124) used for driving a conveying belt (4126) is arranged on each driven shaft (4125), and the rotating wheel (4124) is connected with a driving wheel (4121) of the driving motor (4120) through a driving belt (4122).

10. The wafer thickness sorting method as claimed in claim 9, wherein: the conveying belt mechanism comprises two groups of conveying belts (4126) which are arranged in parallel, each group of conveying belts (4126) comprises two symmetrically arranged conveying belts (4126), and the number of the fixed teeth (4127) on the two groups of conveying belts (4126) is the same.

11. The wafer thickness sorting method as claimed in claim 10, wherein: the fixing support comprises a lower fixing support (4110) and an upper fixing support (4130), wherein both the lower fixing support (4110) and the upper fixing support (4130) are provided with rotating shaft fixing holes (4111) for fixing the driven shaft (4125), the top sensor (4132) is fixed with the upper fixing support (4130), and the bottom sensor (4113) is fixed with the lower fixing support (4110).

12. The wafer thickness sorting method as claimed in claim 11, wherein: the fixing device (4116) is arranged on the base (4100) or the lower fixing support (4110), the fixing device (4116) is used for fixing the rotating shaft (4115) and the driving shaft (4114) of the driving motor (4120), the rotating shaft (4115) and the driving shaft (4114) are arranged in parallel and are transmitted through the gear set (4128), and the rotating shaft (4115) and the driving shaft (4114) are both provided with driving wheels (4121).

13. The wafer thickness sorting method as claimed in claim 12, wherein: the gear set (4128) is a pair of gears with the same specification and meshed with each other.

14. The wafer thickness sorting method as claimed in claim 13, wherein: the driving motor (4120) is an integrated servo driving motor, the driving motor (4120) comprises an encoder, a control board and a brake mechanism, and the control board is in communication connection with the top sensor (4132) and the bottom sensor (4113).

15. The wafer thickness sorting method as claimed in claim 5, wherein: the first transmission assembly (100) is provided with an upper cavity, a lower cavity or a left cavity and a right cavity which are communicated with each other, and the upper cavity, the lower cavity or the left cavity and the right cavity are respectively provided with a first feeding transmission mechanism (110) and a first discharging transmission mechanism (120).

16. The wafer thickness sorting method as claimed in claim 8, wherein: the second transmission assembly (700) is provided with an upper cavity and a lower cavity or a left cavity and a right cavity which are communicated with each other, and the upper cavity and the lower cavity or the left cavity and the right cavity are respectively provided with a second feeding transmission mechanism (720) and a second discharging transmission mechanism (710).

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