CN113169147A - 显示面板以及显示模组 - Google Patents
显示面板以及显示模组 Download PDFInfo
- Publication number
- CN113169147A CN113169147A CN201880097608.7A CN201880097608A CN113169147A CN 113169147 A CN113169147 A CN 113169147A CN 201880097608 A CN201880097608 A CN 201880097608A CN 113169147 A CN113169147 A CN 113169147A
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- CN
- China
- Prior art keywords
- bonding
- display panel
- conductive
- bonding pads
- binding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- H10W70/60—
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- H10W70/611—
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- H10W72/20—
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
一种显示面板和显示模组,显示面板上设有用于与绑定对象绑定的绑定区,绑定区上设有多个第一接合垫,绑定区上设有导线,第一接合垫的高度大于导线的高度。通过显示面板的第一接合垫以及绑定对象的第二接合垫的特有结构,能够有效地避免导电介质中的导电粒子直接压在导线上,避免造成显示面板线路短路或漏电。
Description
PCT国内申请,说明书已公开。
Claims (15)
- PCT国内申请,权利要求书已公开。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2018/118986 WO2020113385A1 (zh) | 2018-12-03 | 2018-12-03 | 显示面板以及显示模组 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113169147A true CN113169147A (zh) | 2021-07-23 |
Family
ID=70973994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880097608.7A Pending CN113169147A (zh) | 2018-12-03 | 2018-12-03 | 显示面板以及显示模组 |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN113169147A (zh) |
| WO (1) | WO2020113385A1 (zh) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1510979A (zh) * | 2002-12-23 | 2004-07-07 | 矽统科技股份有限公司 | 无焊垫设计的高密度电路板及其制造方法 |
| JP2005223123A (ja) * | 2004-02-05 | 2005-08-18 | Matsushita Electric Ind Co Ltd | 半導体装置およびその製造方法 |
| CN101459151A (zh) * | 2007-12-12 | 2009-06-17 | 群康科技(深圳)有限公司 | 焊接基板、采用该焊接基板的电子封装构造及其封装方法 |
| CN107145016A (zh) * | 2017-07-13 | 2017-09-08 | 深圳市华星光电技术有限公司 | 阵列基板、液晶面板及显示设备及阵列基板的制作方法 |
| CN108336077A (zh) * | 2017-12-13 | 2018-07-27 | 友达光电股份有限公司 | 像素阵列基板及其制造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100416343C (zh) * | 2004-01-21 | 2008-09-03 | 友达光电股份有限公司 | 增加金属连线可靠度的结构 |
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2018
- 2018-12-03 CN CN201880097608.7A patent/CN113169147A/zh active Pending
- 2018-12-03 WO PCT/CN2018/118986 patent/WO2020113385A1/zh not_active Ceased
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1510979A (zh) * | 2002-12-23 | 2004-07-07 | 矽统科技股份有限公司 | 无焊垫设计的高密度电路板及其制造方法 |
| JP2005223123A (ja) * | 2004-02-05 | 2005-08-18 | Matsushita Electric Ind Co Ltd | 半導体装置およびその製造方法 |
| CN101459151A (zh) * | 2007-12-12 | 2009-06-17 | 群康科技(深圳)有限公司 | 焊接基板、采用该焊接基板的电子封装构造及其封装方法 |
| CN107145016A (zh) * | 2017-07-13 | 2017-09-08 | 深圳市华星光电技术有限公司 | 阵列基板、液晶面板及显示设备及阵列基板的制作方法 |
| CN108336077A (zh) * | 2017-12-13 | 2018-07-27 | 友达光电股份有限公司 | 像素阵列基板及其制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020113385A1 (zh) | 2020-06-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20210723 |
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| WD01 | Invention patent application deemed withdrawn after publication |