CN113054803A - Circuit board structure, power supply and lamp - Google Patents
Circuit board structure, power supply and lamp Download PDFInfo
- Publication number
- CN113054803A CN113054803A CN202110320266.4A CN202110320266A CN113054803A CN 113054803 A CN113054803 A CN 113054803A CN 202110320266 A CN202110320266 A CN 202110320266A CN 113054803 A CN113054803 A CN 113054803A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- flexible circuit
- rigid
- board structure
- chip capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
- H02K11/0094—Structural association with other electrical or electronic devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structure Of Printed Boards (AREA)
Abstract
本发明公开了一种线路板结构、电源与灯具，其中，线路板结构包括刚性电路板、柔性电路板和贴片电容，柔性电路板具有电连接端，电连接端用于固定连接于所述刚性电路板，并与刚性电路板电连接；贴片电容固定连接于柔性电路板，并与柔性电路板电连接。通过柔性电路板的设计，贴片电容使用时，贴片电容发声振动，贴片电容的振动自柔性电路板传输至刚性电路板时，由于柔性电路板的弹性特性，所以贴片电容的振动在柔性电路板上传输时，贴片电容的振动力被消耗掉，从而减小贴片电容的振动摆幅及振动频率，从而减小贴片电容产生的噪音。
The invention discloses a circuit board structure, a power supply and a lamp, wherein the circuit board structure includes a rigid circuit board, a flexible circuit board and a chip capacitor, and the flexible circuit board has an electrical connection end, and the electrical connection end is used to be fixedly connected to the The rigid circuit board is electrically connected to the rigid circuit board; the chip capacitor is fixedly connected to the flexible circuit board and is electrically connected to the flexible circuit board. Through the design of the flexible circuit board, when the chip capacitor is used, the chip capacitor vibrates, and when the vibration of the chip capacitor is transmitted from the flexible circuit board to the rigid circuit board, due to the elastic characteristics of the flexible circuit board, the vibration of the chip capacitor is in the During transmission on the flexible circuit board, the vibration force of the chip capacitor is consumed, thereby reducing the vibration swing and vibration frequency of the chip capacitor, thereby reducing the noise generated by the chip capacitor.
Description
Technical Field
The invention relates to the technical field of lamps, in particular to a circuit board structure, a power supply and a lamp.
Background
In the related art, in the design of the lamp circuit board, the chip capacitor and other electronic components are fixedly designed on the rigid circuit board, so that a circuit board structure required by a user is formed. However, when the chip capacitor is used, the chip capacitor generates a large noise, which affects the quality of life of a user.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a circuit board structure which can reduce noise generated by a chip capacitor.
The invention also provides a power supply with the circuit board structure.
The invention also provides a lamp with the power supply.
The circuit board structure according to the embodiment of the invention is applied to a rigid circuit board and comprises the following components:
a rigid circuit board;
the flexible circuit board is provided with an electric connection end, and the electric connection end is fixedly connected to the rigid circuit board and is electrically connected with the rigid circuit board;
and the patch capacitor is fixedly connected to the flexible circuit board and is electrically connected with the flexible circuit board.
The circuit board structure provided by the embodiment of the invention at least has the following beneficial effects: through the design of flexible circuit board, when paster electric capacity used, paster electric capacity sound production vibration, when paster electric capacity's vibration transmitted to rigid circuit board from flexible circuit board, because flexible circuit board's elastic characteristic, so when paster electric capacity's vibration was transmitted on flexible circuit board, paster electric capacity's vibrational force was consumed to reduce paster electric capacity's vibration amplitude of oscillation and vibration frequency, thereby reduced the noise that paster electric capacity produced.
According to some embodiments of the invention, the flexible circuit board has a thickness of between 0.15mm and 0.35 mm.
According to some embodiments of the invention, the patch capacitors have multiple groups, the multiple groups of patch capacitors are arranged on the flexible circuit board at intervals in a first preset direction and are gradually far away from the electric connection end, and the distance between two adjacent groups of patch capacitors is at least 1.5 mm; each group of the patch capacitors comprises one or more patch capacitors, the patch capacitors in the same group are arranged on the flexible circuit board at intervals in a second preset direction, and the first preset direction is perpendicular to the second preset direction.
According to some embodiments of the present invention, the flexible circuit board is provided with hole portions penetrating both sides of the flexible circuit board, and the hole portions are disposed between two adjacent sets of the patch capacitors.
According to some embodiments of the present invention, the hole portion is a bar-shaped through groove, and a length direction of the bar-shaped through groove is parallel to the second preset direction; or, the hole part comprises a plurality of through holes, and the through holes are arranged on the flexible circuit board at intervals in the second preset direction.
According to some embodiments of the invention, the patch capacitor is spaced from the electrical connection terminal by at least 1.8mm, such that the patch capacitor is spaced from the rigid circuit board by at least 1.8 mm.
The circuit board structure provided by the embodiment of the invention at least has the following beneficial effects: the chip capacitor is connected to the rigid circuit board through the flexible circuit board to replace the chip capacitor to be directly and fixedly connected to the rigid circuit board. In the use process of the chip capacitor, the flexible circuit board can reduce the vibration amplitude and the vibration frequency of the chip capacitor, so that the noise generated by the circuit board structure is reduced.
According to some embodiments of the invention, the circuit board structure further comprises: and the inductor is fixedly connected to the rigid circuit board and is electrically connected with the rigid circuit board.
According to some embodiments of the invention, a spacing between the flexible circuit board and the inductor is at least 1.8 mm.
According to some embodiments of the invention, the circuit board structure further comprises an unvoiced component, and a distance between the flexible circuit board and the unvoiced component is at least 1.5 mm.
The power supply according to the embodiment of the invention comprises the circuit board structure.
The power supply provided by the embodiment of the invention has at least the following beneficial effects: the power supply adopts the circuit board structure, and in the circuit board structure, the chip capacitor is connected to the rigid circuit board through the flexible circuit board so as to replace the chip capacitor to be directly connected to the rigid circuit board. When the chip capacitor is used, the flexible circuit board can reduce the vibration amplitude and the vibration frequency of the chip capacitor, so that the noise generated by the circuit board is reduced.
The lamp provided by the embodiment of the invention comprises the power supply.
The lamp provided by the embodiment of the invention at least has the following beneficial effects: the power adopts above-mentioned circuit board structure, and in the circuit board structure, the paster electric capacity passes through flexible circuit board fixed connection on the rigid circuit board to reduce the noise that lamps and lanterns produced. In the prior art, the chip capacitor is directly and fixedly connected to the rigid circuit board, if a plurality of lamps are used simultaneously, noise generated by the lamps is superposed, and noise of more than sixty decibels is often generated, and if a user sleeps by turning on the lamp at night, the noise of the decibels seriously affects the sleep of the user. However, in this application scheme, the paster electric capacity passes through flexible circuit board fixed connection in rigid circuit board, and flexible circuit board makes the paster electric capacity produce less noise, so, if a plurality of lamps and lanterns use simultaneously, the noise stack that a plurality of lamps and lanterns produced often produces the noise about eight decibels, and the noise of this decibel can not influence user's sleep.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The invention is further described with reference to the following figures and examples, in which:
fig. 1 is a schematic view of the overall structure of a circuit board according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a circuit board structure according to an embodiment of the present invention;
fig. 3 is another schematic structural diagram of a circuit board structure according to an embodiment of the invention.
Reference numerals:
the circuit board structure 100, the flexible circuit board 110, the electrical connection end 111, the patch capacitor 120, the hole portion 130, the strip-shaped through groove 131 and the through hole 132;
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, the meaning of a plurality is one or more, the meaning of a plurality is two or more, and the above, below, exceeding, etc. are understood as excluding the present numbers, and the above, below, within, etc. are understood as including the present numbers. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
In the description of the present invention, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
According to the present invention, a circuit board structure is disclosed, referring to fig. 1 and fig. 2, wherein the circuit board structure 100 includes a rigid circuit board 200, a flexible circuit board 110 and a chip capacitor 120, the flexible circuit board 110 has an electrical connection end 111, the electrical connection end 111 is used for being fixedly connected to the rigid circuit board 200 and electrically connected to the rigid circuit board 200; the patch capacitor 120 is fixedly connected to the flexible circuit board 110 and electrically connected to the flexible circuit board 110.
Specifically, the patch capacitor 120 is electrically connected to the rigid circuit board 200 through the flexible circuit board 110, so that the patch capacitor 120 is electrically connected to other components of the rigid circuit board 200, and the patch capacitor 120 can be normally used. Meanwhile, when the patch capacitor 120 vibrates by sound, and the vibration of the patch capacitor 120 is transmitted from the flexible circuit board 110 to the rigid circuit board 200, the flexible circuit board 110 consumes the vibration of the patch capacitor 120 due to the elastic characteristic of the flexible circuit board 110, so that the vibration swing and the vibration frequency of the patch capacitor 120 are reduced, and the noise generated when the patch capacitor 120 works is reduced.
In some embodiments, the thickness of the flexible circuit board 110 is between 0.15mm and 0.35mm, and particularly, the thickness of the flexible circuit board 110 is greater than 0.15mm, so that the flexible circuit board 110 has sufficient elasticity to stably support the patch capacitor 120; meanwhile, the thickness of the flexible circuit board 110 is less than 0.35mm, so that the flexible circuit board 110 has good flexibility, and thus the vibration frequency and the vibration amplitude of the chip capacitor 120 are reduced, and the noise generated by the chip capacitor 120 is reduced.
In some embodiments, the patch capacitor 120 is a patch capacitor, and the attached capacitor can be better attached and fixedly connected to the flexible circuit board 110, so that the flexible circuit board 110 can preferably reduce the vibration frequency and the vibration amplitude of the patch capacitor 120.
In some embodiments, the distance between the patch capacitor 120 and the electrical connection terminal 111 is at least 1.8mm, so that the distance between the patch capacitor 120 and the rigid circuit board 200 is above 1.8 mm; specifically, when the patch capacitor 120 vibrates, since the distance between the patch capacitor 120 and the rigid circuit board 200 is long enough, when the vibration of the patch capacitor 120 is transmitted to the rigid circuit board 200, the flexible circuit board 110 consumes enough driving force of the patch capacitor 120, so as to ensure that the vibration amplitude and the vibration frequency of the patch capacitor 120 are reduced to small enough values, and further ensure that the patch capacitor 120 generates small noise.
In some embodiments, the patch capacitors 120 have multiple sets, and the multiple sets of patch capacitors 120 are sequentially disposed on the flexible circuit board 110 at intervals in a first preset direction (the first preset direction is the length direction of the flexible circuit board 110), so that the multiple sets of patch capacitors 120 are gradually disposed away from the electrical connection end 111, wherein the distance between the first set of patch capacitors 120 and the rigid circuit board 200 is at least 1.8mm, thereby ensuring that the vibration amplitude and the vibration frequency of the multiple sets of patch capacitors 120 are effectively reduced, and further reducing the noise generated by the patch capacitors 120. Further, the distance between two adjacent sets of patch capacitors 120 is at least 1.5mm, so as to prevent the gravity generated by the patch capacitors 120 from concentrating on a certain area of the flexible circuit board 110 due to the close distance between the two adjacent sets of patch capacitors 120, and thus the flexible circuit board 110 cannot preferably reduce the vibration amplitude and the vibration frequency of the patch capacitors 120.
Further, each group of patch capacitors 120 has one patch capacitor 120, for example, as shown in fig. 1, two groups of patch capacitors 120 are disposed on the flexible circuit board 110, each group of patch capacitors 120 has one patch capacitor, and the two groups of patch capacitors 120 are disposed on the side surface of the flexible circuit board 110 at intervals along the length direction of the flexible circuit board 110; instead, each group of patch capacitors 120 has a plurality of patch capacitors 120 (not shown in the figure), the plurality of patch capacitors 120 are sequentially arranged on the flexible circuit board 110 at intervals in a second predetermined direction (the second predetermined direction is the width direction of the flexible circuit board 110), and the patch capacitors 120 in the same group are arranged at equal intervals with the rigid circuit board 200.
Further, the two sets of patch capacitors 120 are controlled to be closer to each other, so that the noise reduction effect of the flexible circuit board 110 on the patch capacitors 120 is affected. In some embodiments, in order to further reduce the vibration amplitude and the vibration frequency of the patch capacitors 120 of the flexible circuit board 110, the flexible circuit board 110 is provided with a hole portion 130, and the hole portion 130 is located between two adjacent sets of patch capacitors 120. When the patch capacitor 120 vibrates, and the vibration of the patch capacitor 120 is transmitted to the hole 130, the hole 130 can quickly consume the vibration force of the patch capacitor 120, so that the vibration frequency and the vibration amplitude of the patch capacitor 120 are further reduced, and the noise generated by the patch capacitor 120 is reduced.
Referring to fig. 2, the hole portion 130 is a strip through groove 131, the strip through groove 131 is disposed along the width direction of the flexible circuit board 110, and the length of the strip through groove 131 is the same as the distance in the width direction of the flexible circuit board 110 occupied by each group of the chip capacitors 120, so that when the vibration generated by the chip capacitors 120 is transmitted to the rigid circuit board 200 along the flexible circuit board 110, the strip through groove 131 can effectively consume the vibration generated by the chip capacitors 120, and further reduce the vibration swing and the vibration frequency of the chip capacitors 120.
Instead of the strip-shaped through slot 131, referring to fig. 1 and fig. 3, in some embodiments, the hole portion 130 includes a plurality of through holes 132, the through holes 132 are circular, the through holes 132 are arranged at intervals along the width direction of the flexible circuit board 110, and the distance of the arrangement of the through holes 132 is the same as the distance occupied by each group of the patch capacitors 120 along the width direction of the flexible circuit board 110, so that when the vibration generated by the patch capacitors 120 is transmitted to the rigid circuit board 200 along the flexible circuit board 110, the through holes 132 can effectively consume the vibration generated by the patch capacitors 120, thereby reducing the vibration swing and the vibration frequency generated by the patch capacitors 120. In addition, the hole 130 is arranged by the above method, and the strength of the flexible circuit board 110 is ensured on the premise of ensuring the vibration amplitude and the vibration frequency of the chip capacitor 120 to be reduced.
In some embodiments, the circuit board structure further includes other sound components, the other sound components are mainly inductors 210, the inductors 210 are further divided into cross inductors 212 and transformers 211, and the inductors 210 are directly and fixedly connected to the rigid circuit board 200 and electrically connected to the rigid circuit board 200. The patch capacitor 120 is connected to the rigid circuit board 200 through the flexible circuit board 110, the patch capacitor 120 is not attached to the rigid circuit board 200, and the flexibility of the flexible circuit board 110 is utilized to reduce the resonance generated between the patch capacitor 120 and the inductor 210, thereby reducing the generation of larger noise of the circuit board structure.
Further, the distance between the flexible circuit board 110 and the inductor 210 is at least 1.8mm, so as to further reduce the resonance effect between the flexible circuit board 110 and the inductor 210, thereby ensuring that the circuit board structure emits a small noise.
In some embodiments, the flexible circuit board 110 further includes an unvoiced component 220, the unvoiced component 220 has multiple types and is fixedly connected to the rigid circuit board 200, and at this time, the unvoiced component 220 and the unvoiced component work together to form a complete circuit board structure. Further, the distance between the flexible circuit board 110 and the unvoiced components is at least 1.5mm, so that the noise generated by the chip capacitor 120 is further reduced.
According to the invention, the power supply comprises the circuit board structure, the power supply adopts the circuit board structure, and in the circuit board structure, the chip capacitor 120 is connected to the rigid circuit board 200 through the flexible circuit board 110 to replace the chip capacitor 120 to be fixedly connected to the rigid circuit board 200, so that in the use process of the chip capacitor 120, the flexible circuit board 110 can reduce the vibration amplitude and the vibration frequency of the chip capacitor 120, and further reduce the noise generated by the circuit board.
According to the invention, the lamp comprises the power supply which adopts the circuit board structure, and in the circuit board structure, the chip capacitor 120 is fixedly connected to the rigid circuit board 200 through the flexible circuit board 110, so that the noise generated by the lamp is reduced. In the prior art, the chip capacitor 120 is directly and fixedly connected to the rigid circuit board 200, if a plurality of lamps are used simultaneously, noise generated by the lamps is superimposed, and noise of more than sixty decibels is often generated, and if a user sleeps by turning on the light at night, the noise of the decibels seriously affects the sleep of the user. However, in the present application scheme, the patch capacitor 120 is fixedly connected to the rigid circuit board 200 through the flexible circuit board 110, and the flexible circuit board 110 makes the patch capacitor 120 generate a small noise, so that if a plurality of lamps are used simultaneously, the noise generated by the plurality of lamps is superimposed, which often generates about eight decibels of noise, and the noise of the decibels does not affect the sleep of the user.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention. Furthermore, the embodiments of the present invention and the features of the embodiments may be combined with each other without conflict.
Claims (11)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110320266.4A CN113054803A (en) | 2021-03-25 | 2021-03-25 | Circuit board structure, power supply and lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110320266.4A CN113054803A (en) | 2021-03-25 | 2021-03-25 | Circuit board structure, power supply and lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113054803A true CN113054803A (en) | 2021-06-29 |
Family
ID=76515482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110320266.4A Pending CN113054803A (en) | 2021-03-25 | 2021-03-25 | Circuit board structure, power supply and lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113054803A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1917741A (en) * | 2005-08-18 | 2007-02-21 | Tdk株式会社 | Flexible substrate, mounting structure, display unit and portable electronic apparatus |
| WO2015021640A1 (en) * | 2013-08-15 | 2015-02-19 | 深圳市众明半导体照明有限公司 | Circuit board structure and power supply module having same |
| CN111315114A (en) * | 2020-01-20 | 2020-06-19 | 长沙镭铟智能科技有限公司 | Damping device based on flexible circuit board and circuit board |
| CN214959150U (en) * | 2021-03-25 | 2021-11-30 | 深圳市宝泰光电科技有限公司 | Circuit board structure, power supply and lamp |
-
2021
- 2021-03-25 CN CN202110320266.4A patent/CN113054803A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1917741A (en) * | 2005-08-18 | 2007-02-21 | Tdk株式会社 | Flexible substrate, mounting structure, display unit and portable electronic apparatus |
| WO2015021640A1 (en) * | 2013-08-15 | 2015-02-19 | 深圳市众明半导体照明有限公司 | Circuit board structure and power supply module having same |
| CN111315114A (en) * | 2020-01-20 | 2020-06-19 | 长沙镭铟智能科技有限公司 | Damping device based on flexible circuit board and circuit board |
| CN214959150U (en) * | 2021-03-25 | 2021-11-30 | 深圳市宝泰光电科技有限公司 | Circuit board structure, power supply and lamp |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8152335B2 (en) | Substrate for disposition of light-emitting diodes | |
| CN214959150U (en) | Circuit board structure, power supply and lamp | |
| CN1177401C (en) | Surface mount type switching power supply device and installation method thereof | |
| KR20040013981A (en) | apparatus for fixing bobbin to printing circuit board for use in transformer | |
| CN113054803A (en) | Circuit board structure, power supply and lamp | |
| KR20010013602A (en) | Packaging structure of piezoelectric transformer element and the method thereof | |
| WO2020103577A1 (en) | Loudspeaker | |
| CN107819410A (en) | Piezoelectric energy collector | |
| JP2003032024A (en) | Chip antenna | |
| JP2000277883A (en) | Mounting method of surface mount type capacitor | |
| ATE453208T1 (en) | LIGHTING DEVICE FOR FLUORESCENCE LAMP | |
| CN207541936U (en) | A kind of magnetostriction sound absorption structure | |
| CN202352324U (en) | Piezoelectric sounder | |
| CN217540679U (en) | Energy-saving high-frequency electronic ballast for lighting series | |
| CN207504160U (en) | A kind of onboard antenna of Intelligent set top box | |
| CN206993477U (en) | A kind of LED circuit board of multilayer | |
| CN211656524U (en) | Anti-electromagnetic interference PCB | |
| JP2007123447A (en) | Electronic equipment | |
| CN207094570U (en) | Flexible circuit board and the LED with the flexible circuit board | |
| CN207968899U (en) | Microphone device | |
| CN211294881U (en) | an electrolytic capacitor | |
| CN209201032U (en) | A kind of SMD table crystalline substance resonator | |
| CN114222416B (en) | Circuit boards and display devices | |
| CN222234825U (en) | A chip structure and resonator with small electrode and small TS value | |
| CN219832171U (en) | Piezoelectric sounder |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210629 |
|
| RJ01 | Rejection of invention patent application after publication |