CN112871813A - Cleaning method and cleaning device for slicing machine - Google Patents
Cleaning method and cleaning device for slicing machine Download PDFInfo
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- CN112871813A CN112871813A CN201911205964.9A CN201911205964A CN112871813A CN 112871813 A CN112871813 A CN 112871813A CN 201911205964 A CN201911205964 A CN 201911205964A CN 112871813 A CN112871813 A CN 112871813A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/08—Cleaning containers, e.g. tanks
- B08B9/20—Cleaning containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans are brought
- B08B9/28—Cleaning containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans are brought the apparatus cleaning by splash, spray, or jet application, with or without soaking
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/08—Cleaning containers, e.g. tanks
- B08B9/20—Cleaning containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans are brought
- B08B9/28—Cleaning containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans are brought the apparatus cleaning by splash, spray, or jet application, with or without soaking
- B08B9/34—Arrangements of conduits or nozzles
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- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention provides a cleaning method and a cleaning device for a slicing machine, and relates to the technical field of solar photovoltaics. The slicing machine cleaning method is used for cleaning each part inside a machine cabin of a slicing machine and comprises the following steps: after slicing is completed, the feeding mechanism, the crystal support mechanism and the silicon wafer on the crystal support mechanism are cleaned by the first cleaning unit to obtain the cleaned feeding mechanism, crystal support mechanism and silicon wafer, and after the cleaned silicon wafer is removed and the silicon rod is installed on the crystal support mechanism, the main roller mechanism is cleaned by the second cleaning unit to obtain the cleaned main roller mechanism. The cleaning units are used for cleaning different positions inside the machine cabin in different cleaning stages, so that the repeated cleaning of the same positions in the machine cabin is avoided, the problems of low cleaning efficiency and poor effect in the cleaning process of the slicing machine are solved, and the utilization rate of water resources is improved.
Description
Technical Field
The invention relates to the technical field of solar photovoltaics, in particular to a cleaning method and a cleaning device for a slicing machine.
Background
In the manufacturing process of the photovoltaic module, slicing is used as an important process for cutting the silicon rod into silicon wafers, processing the silicon wafers to obtain battery pieces, and packaging the battery pieces to obtain the photovoltaic module.
In the slicing process, the silicon rod is mainly cut into silicon wafers by a slicer. In the silicon wafer cutting process, the diamond wires in the main roller mechanism in the slicer bin rotate at a high speed, so that mortar is driven to grind the silicon rod, and the silicon rod is cut into a plurality of silicon wafers. The chips, silicon powder and mortar generated in the silicon wafer cutting process are mixed, and the chips and the silicon powder are sputtered to all corners inside the bin of the slicing machine under the high-speed operation of the main roller mechanism of the slicing machine. Scraps and silicon powder in the slicer bin can cause the diamond wire to jump, and the cutting efficiency of the diamond wire is reduced.
At present, in the cleaning process of a slicing machine, a cleaning device is used for cleaning each part in the slicing machine and a cut silicon slice after slicing is finished, then the cleaned silicon slice is taken out, and a silicon rod to be cut is installed again. After the silicon rod is installed again, the machine cabin needs to be cleaned again, and impurities generated in the silicon rod installation process are cleaned. Therefore, in the last unloading of slicer, need repeat many times to the inside washing in machine storehouse, not only waste water resource, the cleaning efficiency is low moreover, cleaning performance is poor.
Disclosure of Invention
The invention provides a cleaning method and a cleaning device for a slicing machine, aiming at improving the cleaning effect and the cleaning efficiency of the slicing machine and improving the utilization rate of water resources.
In a first aspect, an embodiment of the present invention provides a method for cleaning a microtome, where the microtome includes a machine chamber, and a feeding mechanism, a crystal support mechanism, a main roller mechanism, a first cleaning unit, and a second cleaning unit are disposed inside the machine chamber, and the method includes:
after slicing is completed, cleaning the feeding mechanism, the crystal support mechanism and the silicon wafer on the crystal support mechanism by adopting a first cleaning unit to obtain the cleaned feeding mechanism, the cleaned crystal support mechanism and the cleaned silicon wafer;
and after the cleaned silicon wafer is removed and a silicon rod is installed on the crystal support mechanism, cleaning the main roller mechanism by adopting the second cleaning unit to obtain the cleaned main roller mechanism.
Optionally, the slicer further includes a mortar tank and a third cleaning unit, and before the main roller mechanism is cleaned by the second cleaning unit, the slicer further includes: and cleaning the mortar tank by adopting the third cleaning unit to obtain the cleaned mortar tank.
In a second aspect, an embodiment of the present invention further provides a slicer cleaning device, configured to clean a slicer, where the slicer includes a machine cabin, a feeding mechanism, a crystal support mechanism, and a main roller mechanism are sequentially disposed in the machine cabin from top to bottom, and the cleaning device includes: first cleaning unit, second cleaning unit and water supply unit, the water supply mouth of water supply unit is connected respectively first cleaning unit's water inlet with the water inlet of second cleaning unit is used for right respectively first cleaning unit with the second cleaning unit supplies water, first cleaning unit with the second cleaning unit is installed respectively the inside in machine storehouse, first cleaning unit is used for adopting the water that water supply unit provided is right feed mechanism with brilliant support mechanism washs, the second cleaning unit is used for adopting the water that water supply unit provided is right main roller mechanism washs.
Optionally, the first cleaning unit includes at least one first spray pipe surrounding the feeding mechanism and disposed on the inner wall of the machine cabin, a plurality of first spray heads are disposed on the first spray pipe at intervals, and the plurality of first spray heads are used for spraying water flow to the interior of the machine cabin to clean the feeding mechanism and the crystal support mechanism.
Optionally, the second cleaning unit includes at least one second spray pipe, a plurality of second spray heads are arranged on the second spray pipe at intervals along the length direction of the main roller in the main roller mechanism, and the plurality of second spray heads are used for spraying water to the main roller mechanism to clean the main roller mechanism.
Optionally, the second cleaning unit further includes at least one first rotary nozzle, and the first rotary nozzles are arranged on the second spray pipe at intervals.
Optionally, the first rotary nozzle is arranged at a top corner of the machine cabin.
Optionally, the method further includes: the third cleaning unit, the water supply port of water supply unit connects the water inlet of third cleaning unit, the slicer still includes the mortar jar, the third cleaning unit sets up in the mortar jar, be used for adopting the water that the water supply unit provided is right the mortar jar washs.
Optionally, the third cleaning unit includes a second rotary nozzle, and the second rotary nozzle is disposed at the top of the mortar tank.
Optionally, the water outlets of the first nozzle and the second nozzle are fan-shaped structures.
Optionally, the method further includes: the control unit comprises a first electromagnetic valve, a second electromagnetic valve and a third electromagnetic valve, and a water supply opening of the water supply unit is connected with the first cleaning unit through the first electromagnetic valve, connected with the second cleaning unit through the second electromagnetic valve, and connected with the third cleaning unit through the third electromagnetic valve.
In a third aspect, an embodiment of the present invention further provides a microtome including the cleaning device according to the second aspect.
In the embodiment of the invention, the method for cleaning the slicing machine is used for cleaning the machine cabin and the silicon wafer of the slicing machine, and comprises the following steps: after slicing is completed, the feeding mechanism, the crystal support mechanism and the silicon wafer on the crystal support mechanism are cleaned by the first cleaning unit to obtain the cleaned feeding mechanism, the cleaned crystal support mechanism and the cleaned silicon wafer, and after the cleaned silicon wafer is removed and the silicon rod is installed on the crystal support mechanism, the main roller mechanism is cleaned by the second cleaning unit to obtain the cleaned main roller mechanism. Through the inside first cleaning unit and the second cleaning unit that set up mutually independent in the machine storehouse of slicer, after the section was accomplished, use different cleaning unit to wash the inside different positions in machine storehouse in the washing stage independence of difference, avoid carrying out repeated washing to the inside the same position in machine storehouse, can solve among the slicer cleaning process cleaning efficiency low, the problem that the cleaning performance is poor to improve the utilization efficiency of water resource.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor.
FIG. 1 is a schematic diagram of a microtome cleaning apparatus according to a first embodiment of the present disclosure;
FIG. 2 shows a cross-sectional view of FIG. 1 along the A-A direction;
FIG. 3 shows a cross-sectional view of a microtome cleaning device in accordance with a second embodiment of the present disclosure;
fig. 4 is a flowchart illustrating steps of a method for cleaning a microtome according to a fourth embodiment of the present invention.
Description of reference numerals:
101-machine bin, 102-feeding mechanism, 103-crystal support mechanism, 104-main roller mechanism, 1041-main roller, 1042-diamond wire, 105-silicon chip, 106-first cleaning unit, 1061-first spray pipe, 1062-first spray head, 107-second cleaning unit, 1071-second spray pipe, 1072-second spray head, 1073-first rotary spray head, 108-water supply unit, 1081-water tank, 1082-water pump, 1083-liquid level meter, 109-third cleaning unit, 1010-mortar tank, 1011-first electromagnetic valve, 1012-second electromagnetic valve, 1013-third electromagnetic valve, 1014-fourth electromagnetic valve.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
Referring to fig. 1, fig. 1 is a schematic diagram of a microtome cleaning apparatus that may be used to clean various portions of a microtome section of a microtome according to a first embodiment of the invention.
Referring to fig. 2, fig. 2 shows a cross-sectional view of fig. 1 along a-a direction, and as shown in fig. 1 and 2, the microtome may include a machine room 101, and a feeding mechanism 102, a crystal support mechanism 103, and a main roller mechanism 104 may be sequentially disposed inside the machine room 101 from top to bottom. The cleaning device may include: the cleaning device comprises a first cleaning unit 106, a second cleaning unit 107 and a water supply unit 108, wherein a water supply port of the water supply unit 108 is respectively connected with water inlets of the first cleaning unit 106 and the second cleaning unit 107 and used for supplying water to the first cleaning unit 106 and the second cleaning unit 107, the first cleaning unit 106 and the second cleaning unit 107 are respectively installed inside the machine cabin 101, the first cleaning unit 106 is used for cleaning the feeding mechanism 102 and the crystal support mechanism 103 by using the water provided by the water supply unit 108, and the second cleaning unit 107 is used for cleaning the main roller mechanism 104 by using the water provided by the water supply unit 108.
In this embodiment, as shown in fig. 1, the feeding mechanism 102 may be fixedly installed on a top wall inside the machine cabin 101, the crystal support mechanism 103 may be disposed at a lower end of the feeding mechanism 102 and fixedly connected to the feeding mechanism 102, one end of the crystal support mechanism 103 away from the feeding mechanism 102 is used for fixing a silicon rod (105 in fig. 1 is a silicon wafer obtained after cutting the silicon rod), and the feeding mechanism 102 is used for driving the crystal support mechanism 103 to reciprocate up and down to drive the silicon rod supported by the crystal support mechanism 103 to move. The main roller mechanism 104 may include a main roller 1041 and diamond wires 1042, the main roller 1041 is used for driving the diamond wires 1042 to rotate at a high speed. In the cutting process, the feeding mechanism 102 drives the crystal support mechanism 103 to move towards the main roller mechanism 104, so as to drive the silicon rod to move towards the diamond wire 1042 rotating at a high speed in the main roller mechanism 104, and the silicon rod carried by the crystal support mechanism 103 is cut by the diamond wire 1042 rotating at a high speed, so as to obtain a plurality of silicon wafers 105. In practical use, the specific structure of the slicer and the specific cutting process can refer to the prior art, and the embodiment is not limited thereto.
In this embodiment, the first cleaning unit 106 may include at least one first spray pipe 1061 surrounding the feeding mechanism 102 and disposed on an inner wall of the machine cabin 101, a plurality of first spray heads 1062 are disposed on the first spray pipe 1061 at intervals, and the plurality of first spray heads 1062 are configured to spray water to the interior of the machine cabin 101, so as to clean the feeding mechanism 102, the crystal support mechanism 103, and the main roller mechanism 104.
As shown in fig. 1 and 2, the first cleaning unit 106 may include at least one first spray pipe 1061, the first spray pipe 1061 may surround the feeding mechanism 102 and be fixedly installed on a side wall and/or a top wall (the top wall is taken as an example in the figure) inside the cabin 101, and the first spray pipe 1061 may be a water supply pipe such as a galvanized pipe, a copper pipe, or a plastic pipe. The installation manner of the first spraying pipe 1061 can refer to the installation manner of a water supply pipe in the prior art, and the installation position of the first spraying pipe 1061 in the cabin can be set according to requirements, which is not limited in this embodiment.
In this embodiment, a plurality of first spray nozzles 1062 may be disposed on the first spray pipe 1061 at intervals, and water outlets of the first spray nozzles 1062 may face the feeding mechanism 102, the wafer support mechanism 103 and the silicon wafer 105 inside the machine bin 101, and are used for spraying water to the feeding mechanism 102, the wafer support mechanism 103 and the silicon wafer 105. The first spray nozzle 1062 may be a spray nozzle integrally formed with the first spray pipe 1061, or may be a spray nozzle installed on the first spray pipe 1061. The structure of the first nozzle 1062 may be set as required, which is not limited in this embodiment.
As shown in fig. 1 and 2, the second cleaning unit 107 may include at least one second spray pipe 1071, a plurality of second spray heads 1072 may be disposed on the second spray pipe 1071 at intervals along a length direction of the main roller 1041, and water outlets of the plurality of second spray heads 1072 may be directed toward the position of the main roller mechanism 104 to spray water to the main roller mechanism 104 to clean the main roller mechanism 104. The second spraying pipes 1071 may be water supply pipes such as galvanized pipes, copper pipes, or plastic pipes, the second spraying pipes 1071 may be fixedly installed on a sidewall and/or a top wall (the sidewall is taken as an example in fig. 1) of the machine cabin 101, and the second spraying heads 1072 may be disposed on the second spraying pipes 1071 at intervals. As shown in fig. 2, the main roller mechanism 104 may include a main roller 1041, and the second spray pipes 1071 are disposed along a length direction of the main roller 1041 such that a plurality of second spray heads 1072 are disposed at intervals along the length direction of the main roller 104. At least one second spray pipe 1071 may be provided along the length direction of each main roll 1041. During the actual use, the mounting means of second shower 1071 can refer to the mounting means of the delivery pipe among the prior art, and the mounted position of second shower 1071 in the machine storehouse can set up as required, and this embodiment does not do the restriction to this.
As shown in fig. 2, a water inlet of the first spray pipe 1061 and a water inlet of the second spray pipe 1071 are respectively connected to a water outlet of the water supply unit 108, and the water supply unit 108 is configured to supply water under a certain pressure to the first spray pipe 1061 and the second spray pipe 1071. In practical use, the specific structure and form of the water supply unit 108 may be set according to requirements, and the water supply pressure provided by the water supply unit 108 may be set according to requirements, which is not limited by the embodiment.
In this embodiment, when the water supply unit 108 supplies water under a certain pressure, and the water outlets of the first nozzles 1062 spray water to the feeding mechanism 102, the sprayed water can clean the feeding mechanism 102, and after the water sprayed to the feeding mechanism 102 flows down along the feeding mechanism 102, the wafer support mechanism 103 located below the feeding mechanism 102 and the silicon wafers 105 carried on the wafer support mechanism 103 can be cleaned. Similarly, when the water outlets of the plurality of second nozzles 1072 spray water to the main roller mechanism 104 under a certain pressure of water supplied from the water supply unit 108, the sprayed water may clean the main roller mechanism 104.
During the actual use, the quantity of first shower can set up according to the demand, and when including a plurality of first shower in first cleaning unit, a plurality of first shower can the interval set up on the inside inner wall and/or the roof of machine storehouse. The quantity of the second spray pipes can be set according to requirements, and when the second cleaning unit comprises a plurality of second spray pipes, the second spray pipes can be arranged on the inner wall and/or the top wall of the machine cabin at intervals along the length direction of the main roller. The number of the first spray heads arranged on each first spray pipe and the number of the second spray heads arranged on each second spray pipe can be set according to requirements, and the number of the first spray heads and the number of the second spray heads are not limited in the embodiment.
It should be noted that, in the prior art, only one set of cleaning device is usually arranged in the machine cabin to clean, and the fixed position in the machine cabin is cleaned through one set of cleaning device, so that the cleaning range is limited, the cleaning efficiency is low, the effect is poor, and the requirement is difficult to meet. In the embodiment, the first cleaning unit and the second cleaning unit are arranged and are independent from each other, and different positions in the machine cabin are cleaned respectively, so that the cleaning efficiency and the cleaning effect can be improved.
In the embodiment of the invention, the method for cleaning the slicing machine is used for cleaning the machine cabin and the silicon wafer of the slicing machine, and comprises the following steps: after slicing is completed, the feeding mechanism, the crystal support mechanism and the silicon wafer on the crystal support mechanism are cleaned by the first cleaning unit to obtain the cleaned feeding mechanism, the cleaned crystal support mechanism and the cleaned silicon wafer, and after the cleaned silicon wafer is removed and the silicon rod is installed on the crystal support mechanism, the main roller mechanism is cleaned by the second cleaning unit to obtain the cleaned main roller mechanism. Through the inside first cleaning unit and the second cleaning unit that set up mutually independent in the machine storehouse of slicer, after the section was accomplished, use different cleaning unit to wash the inside different positions in machine storehouse in the washing stage independence of difference, avoid carrying out repeated washing to the inside the same position in machine storehouse, can solve among the slicer cleaning process cleaning efficiency low, the problem that the cleaning performance is poor to improve the utilization efficiency of water resource.
Example two
Referring to fig. 3, fig. 3 shows a cross-sectional view of a microtome cleaning apparatus that may be used to clean various portions of a microtome housing in a second embodiment of the present invention.
In this embodiment, the cleaning apparatus may include a first cleaning unit 106, a second cleaning unit 107, a water supply unit 108, and a third cleaning unit 109. The specific structures of the microtome, the first cleaning unit 106 and the second cleaning unit 107 can refer to the first embodiment, which is not described in detail in this embodiment.
In this embodiment, the plurality of first spray nozzles 1062 may be disposed on the first spray pipe 1061 at equal intervals, and when the plurality of first spray nozzles 1062 are disposed on the first spray pipe 1061 at equal intervals, the water flow may be uniformly sprayed into the machine chamber 101, so as to better clean the feeding mechanism 102 and the crystal supporting mechanism 103. Meanwhile, the water outlets of the first nozzles 1062 may face the positions of the feeding mechanism 102, the crystal supporting mechanism 103, and the silicon wafer 105, respectively, so as to spray water streams to the positions of the feeding mechanism 102, the crystal supporting mechanism 103, and the silicon wafer 105, respectively, to clean the feeding mechanism 102, the crystal supporting mechanism 103, and the silicon wafer 105, respectively. In this embodiment, can adjust the direction that first shower nozzle 1062 sprays rivers, diversified washs each part in the machine storehouse 101, improves cleaning performance and cleaning efficiency.
Similarly, the plurality of second spraying nozzles 1072 may be disposed on the second spraying pipe 1071 at equal intervals, and after the plurality of second spraying nozzles 1072 are disposed on the second spraying pipe 1071 at equal intervals, the sprayed water flow may be uniformly sprayed to the side where the main roller mechanism 104 is located, so as to better clean the main roller 1041 and the diamond wire 1042 in the main roller mechanism 104. In actual use, the water outlet of each second spray head 1072 may be adjusted to direct the water outlet of the second spray head 1072 toward the position of the main roller mechanism 104 to clean the main roller mechanism 104.
Optionally, the second cleaning unit 107 may further include at least one first rotary spray head 1073, the first rotary spray heads 1073 may be disposed on the second spray pipe 1071 at intervals, and the spray area of the second rotary spray heads 1073 is large, so that the cleaning effect of the second cleaning unit 107 may be improved. As shown in fig. 3, the first rotary sprayer 1073 may be disposed at a top corner of the housing 101, and the first rotary sprayer 1073 may be disposed at a top corner of the housing 101, so that the junction between the main roller 104 and the diamond wire 1042 may be better cleaned.
In this embodiment, the slicing machine may further include a mortar tank 1010, the mortar tank 1010 is used for storing mortar, during the cutting process, the mortar enters the machine cabin 101, and under the driving of the diamond wire 1042, the mortar grinds the silicon rod, and the silicon rod is cut into silicon wafers. The concrete structure and the using method of the mortar tank 1010 can refer to the prior art, and the embodiment does not limit the structure. The third cleaning unit 109 may include a second rotary sprayer disposed at the top of the mortar tank 1010. During actual use, after cutting, the interior of the mortar tank 1010 can be cleaned, so that impurities in the mortar tank 1010 are prevented from entering the machine cabin 101 along with mortar in the next cutting process, and the cutting efficiency of the diamond wire 1042 is prevented from being affected.
In this embodiment, the water supply unit 108 may include a water tank 1081, a water pump 1082, and a level gauge 1083. Wherein, water tank 1081 is used for storing the water of wasing the time, and level gauge 1083 is used for monitoring the water level in the water tank 1081 to conveniently carry out the moisturizing to water tank 1081. The water outlet of the water pump 1082 is connected to the water inlet of the first spray pipe 1061, the water inlet of the second spray pipe 1071, and the water inlet of the second rotary sprayer, respectively, to provide water under a certain pressure to the first spray pipe 1061, the second spray pipe 1071, and the second rotary sprayer.
The water outlets of the optional first nozzle 1062 and the second nozzle 1072 may be fan-shaped structures to increase the spray area of the first nozzle 1062 and the second nozzle 1072, thereby improving the cleaning effect.
In the embodiment of the invention, the cleaning device of the slicing machine can be used for cleaning each part inside the machine cabin of the slicing machine, the cleaning device can comprise a first cleaning unit, a second cleaning unit and a third cleaning unit, the first cleaning unit can clean the feeding mechanism and the crystal support mechanism inside the machine cabin of the slicing machine, the second cleaning unit can clean the main roller mechanism inside the machine cabin, and the third cleaning unit can clean the mortar tank. Through setting up mutually independent first cleaning unit, second cleaning unit and third cleaning unit, wash the different positions of slicer in the washing stage of difference, can improve cleaning performance and effect, avoid the problem that cleaning efficiency is low, cleaning performance is poor, can improve the utilization efficiency of water resource simultaneously.
Alternatively, the washing apparatus may further include a control unit, which may include a first solenoid valve 1011, a second solenoid valve 1012, and a third solenoid valve 1013, and the water supply port of the water supply unit 108 is connected to the first washing unit 106 through the first solenoid valve 1011, the second washing unit 107 through the second solenoid valve 1012, and the third washing unit 109 through the third solenoid valve 1013. As shown in fig. 3, a water outlet of a water pump 1082 in the water supply unit 108 is connected to water inlets of the first spray pipe 1061, the second spray pipe 1071 and the second rotary sprayer, respectively, and when the water pump 1082 is operated, water in the water tank 1081 is sent to the first spray pipe 1061, the second spray pipe 1071 and the second rotary sprayer, respectively.
In this embodiment, the control unit can also include fourth solenoid valve 1014, and fourth solenoid valve 1014 and external water source switch-on can control fourth solenoid valve 1014 to open when level gauge 1083 detects the decline of water level in the water tank 1081, carry out the moisturizing to water tank 1081, when avoiding the interior water yield of water tank 1081 not enough, influence the cleaning.
In the embodiment, the first cleaning unit, the second cleaning unit and the third cleaning unit are controlled by the control unit to clean different parts in the wafer cutting machine at different stages respectively, so that the manual repeated starting or stopping of cleaning operation is omitted, and the automatic cleaning of the silicon wafer cutting feeding and discharging process is realized. The cleaning effect and efficiency can be improved. In addition, when the main roller mechanism 104 is cleaned by the second cleaning unit 107 before cutting, the cleaned water can enter the mortar tank 1010 and be used in the cutting process, so that the waste of water resources is saved. In the slicing process of the slicing machine, the mortar flows back to the mortar cylinder for recycling, and the mortar can carry cutting chips, steel wire ends and other impurities to flow back to the mortar tank. By cleaning the mortar tank 101, the problems of wire mesh jumping, wire breakage, silicon wafer surface scratches and the like which are possibly caused by the participation of impurities in the cutting of the next silicon wafer can be avoided.
EXAMPLE III
A microtome according to this embodiment may include the cleaning device according to the first and second embodiments, as shown in fig. 1, 2, and 3.
Example four
Referring to fig. 4, fig. 4 is a flowchart illustrating steps of a cleaning method for a slicing machine according to a fourth embodiment of the present invention, which can be used for cleaning various parts in a bin of the slicing machine and a silicon wafer to improve the cleaning effect and the cleaning efficiency of the slicing machine.
In this embodiment, the microtome may include a machine chamber 101, and the feeding mechanism 102, the crystal support mechanism 103, and the main roller mechanism 104, and the first cleaning unit 106 and the second cleaning unit 107 are sequentially disposed inside the machine chamber 101 from top to bottom. The specific structure of the slicer can refer to the first embodiment and the second embodiment, which are not described herein.
As shown in fig. 1 and 3, a control unit may be included in the slicing machine, and after the silicon rod is cut into silicon wafers, the slicing machine may control a first electromagnetic valve 1011 in the control unit to open, start a first cleaning unit 106 to clean the feeding mechanism 102 and the crystal supporting mechanism 103 in the slicing machine and the cut silicon wafers 105, clean the chips, impurities and the like attached to the feeding mechanism 102 and the crystal supporting mechanism 103 during the cutting process, and clean the cut silicon wafers 105. The process of cleaning the feeding mechanism 102, the wafer supporting mechanism 103, and the silicon wafer 105 by the first cleaning unit 106 can refer to the foregoing embodiments, which are not repeated herein.
And 402, after the cleaned silicon wafer is removed and the silicon rod is installed on the crystal support mechanism, cleaning the main roller mechanism by adopting a second cleaning unit to obtain the cleaned main roller mechanism.
In the prior art, after the cleaned silicon wafer 105 is removed, the feeding mechanism 102 and the wafer support mechanism 103 need to be lifted, and the silicon rod needs to be mounted on the wafer support mechanism 103 again for the next cutting. In the silicon rod installation process, impurity can fall on main roller mechanism 104 below the silicon rod, in order to prevent impurity influence cutting next time on main roller mechanism 104, need use belt cleaning device to wash once more the machine storehouse, and the scavenging period is longer, needs a large amount of water resources.
As shown in fig. 1 and 3, after the cleaned silicon wafer is removed and the silicon rod is mounted, the microtome may control the second electromagnetic valve 1012 in the control unit to open, start the second cleaning unit 107 to clean the main roller mechanism 104, and clean the scraps and impurities generated in the previous cutting process of the main roller mechanism 104, the impurities generated in the silicon rod mounting process, and the like, so as to prevent the cutting process from being affected. The process of cleaning the main roller mechanism 104 by the second cleaning unit 107 can refer to the foregoing embodiments, which are not described herein.
Optionally, the slicer may further include a mortar tank 1010 and a third cleaning unit 109, and before the second cleaning unit 107 is used to clean the main roller mechanism 104, the third cleaning unit 109 may also be used to clean the mortar tank 1010, so as to obtain the cleaned mortar tank 1010.
In this embodiment, after the feeding mechanism 102, the wafer support mechanism 103, and the silicon wafer 105 are cleaned, sewage generated during the cleaning process may be discharged into the mortar tank 1010, and the sewage may be discharged through the mortar tank 1010. After the sewage in the mortar tank 1010 is removed, the slicing machine can open the third electromagnetic valve 1013 after the sewage in the mortar tank 1010 is removed, start the third cleaning unit 109, clean the mortar tank 1010 by using the third cleaning unit 109, clean impurities, chips and the like in the mortar tank 1010, and prevent the impurities and the chips in the mortar tank 1010 from entering the machine cabin and affecting the cutting of the slicing machine.
Meanwhile, in the process of cleaning the main roller mechanism 104, the cleaned water can be stored in the mortar tank 1010, and the cleaned water with less impurities in the main roller mechanism 104 can be applied to the cutting process, so that the utilization rate of water resources is improved.
In the embodiment of the invention, the method for cleaning the slicing machine is used for cleaning the machine cabin and the silicon wafer of the slicing machine, and comprises the following steps: after slicing is completed, the feeding mechanism, the crystal support mechanism and the silicon wafer on the crystal support mechanism are cleaned by the first cleaning unit to obtain the cleaned feeding mechanism, the cleaned crystal support mechanism and the cleaned silicon wafer, and after the cleaned silicon wafer is removed and the silicon rod is installed on the crystal support mechanism, the main roller mechanism is cleaned by the second cleaning unit to obtain the cleaned main roller mechanism. Through the inside first cleaning unit and the second cleaning unit that set up mutually independent in the machine storehouse of slicer, after the section was accomplished, use different cleaning unit to wash the inside different positions in machine storehouse in the washing stage independence of difference, avoid carrying out repeated washing to the inside the same position in machine storehouse, can solve among the slicer cleaning process cleaning efficiency low, the problem that the cleaning performance is poor to improve the utilization efficiency of water resource.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (12)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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