CN112876203B - Aerogel composite material, display panel, manufacturing method and display device - Google Patents

Abstract

The disclosure provides an airgel composite material, a display panel, a manufacturing method and a display device, which relate to the field of display technology and are used to solve the problem that laser drilling has adverse effects on the display effect and packaging effect of a display device. The airgel composite material includes: aerogel and a reinforcement phase combined with the aerogel in a physical entanglement, physical crosslinking or chemical crosslinking manner; wherein the reinforcement phase is made of carbon nanotubes and fiber-forming polymers The formed composite fibers or composite particles; the airgel is SiO ₂ aerogel.

Description

Airgel composite material, display panel, manufacturing method and display device

technical field

The invention relates to the field of display technology, in particular to an airgel composite material, a display panel, a manufacturing method and a display device.

Background technique

With the current increasing demand for large screen-to-body ratios, full screens and narrow bezels have become the mainstream of current design. These designs often use special-shaped cut notch to accommodate necessary front functional components such as cameras and sensors. Holes are punched in the light-emitting area, and cameras, sensors, etc. are built into it, which undoubtedly has a stronger "full-screen" visual impact. Moreover, for electronic devices such as clocks and watches, components such as axes need to be built in the center. Therefore, punching holes in the display area has undoubtedly become the mainstream of the next-generation "full-screen" design.

With the development of high-precision, low-heat-affected laser equipment such as picoseconds and femtoseconds, laser drilling technology is widely used in semiconductor manufacturing. Laser drilling technology can be used to cut through the display panel in the pre-drilled area to form through holes. . However, laser drilling is to use laser to burn in the pre-drilled area to form through holes. The high temperature of laser cutting will cause the surrounding organic material layer to turn yellow, which will have a negative impact on the display effect; at the same time, the laser drilling There may be poor encapsulation at the cutting edge, water vapor and oxygen enter from the perforated area and diffuse in the display panel, eventually leading to failure of the display device.

Contents of the invention

The embodiments of the present application provide an airgel composite material, a display panel, a manufacturing method and a display device, which are used to avoid the problems of poor display effect and failure of the display device caused by laser drilling.

In one aspect, an airgel composite is provided. The airgel composite material comprises: airgel and a reinforcement phase combined with the aerogel in a physical entanglement, physical cross-linking or chemical cross-linking manner; wherein, the reinforcement phase is made of carbon nanotubes and synthetic Composite fibers or composite particles formed by fiber polymers; the airgel is SiO ₂ aerogel.

In some embodiments, the reinforcing phase of the airgel composite material is a composite fiber containing carbon nanotubes and polyamide.

In another aspect, a method for preparing an airgel composite material is provided, which is used for preparing the airgel composite material described in any one of the above embodiments. The preparation method of the airgel composite material comprises: mixing organic silicon source, water and C1-C4 low-carbon alcohol, adding acid to adjust the pH and hydrolyzing for a certain period of time to obtain a sol; mixing the reinforcing phase with the sol, adding alkali to adjust the pH and stirring for a certain period of time until it forms a wet gel composite material; placing the wet gel composite material in an aging solution for aging; drying the aged wet gel composite material to obtain an airgel composite material .

In some embodiments, in the preparation method of the airgel composite material, the drying treatment method is CO ₂ supercritical drying.

In yet another aspect, a display panel is provided. The display panel has at least one through hole, at least a part of the hole wall of the through hole is formed by the airgel composite material described in any one of the above embodiments.

In some embodiments, the display panel includes: a driving backplane; a light emitting layer disposed on the driving backplane and an encapsulation layer located on a side of the light emitting layer away from the driving backplane; wherein the light emitting The layer includes: a plurality of light emitting devices, the light emitting layer has a side wall close to the through hole; the through hole penetrates through the driving backplane, the light emitting layer and the encapsulation layer, and the airgel composite material It is arranged between the side wall of the light-emitting layer and the hole wall of the through hole, and is filled in the gap between the packaging layer and the driving backplane.

In some embodiments, the display panel further includes: a pixel defining layer disposed on the driving backplane; a material of the pixel defining layer is the airgel composite material.

In some embodiments, the display panel includes: a first substrate; a second substrate disposed opposite to the first substrate; a liquid crystal layer disposed between the first substrate and the second substrate, the The through hole penetrates through the first substrate, the second substrate and the liquid crystal layer, and the position where the liquid crystal layer is penetrated by the through hole is sealed by the airgel composite material.

In some embodiments, the display panel further includes: at least one spacer disposed between the first substrate and the second substrate; a material of the spacer is the airgel composite material.

In yet another aspect, a method for manufacturing a display panel is provided, which is used to form the display panel described in any one of the above embodiments. The manufacturing method of the display panel includes: forming a display panel to be punched; the display panel to be punched includes a first pattern layer, and the material of the first pattern layer is the air condensation as described in any of the above-mentioned embodiments. Glue composite material; using a laser to cut the display panel to be punched along a laser cutting path to form a display panel with at least one through hole, the laser cutting path is within the range defined by the first pattern layer; wherein , at least a part of the wall of the through hole is formed by the airgel composite material.

In some embodiments, the forming the display panel to be punched includes: forming a first pattern layer on the driving backplane; forming a light emitting layer on the driving backplane on which the first pattern layer is formed, the The light-emitting layer includes: a plurality of light-emitting devices; an encapsulation layer is formed on the side of the light-emitting layer away from the driving backplane; the laser is used to cut the display panel to be punched along a laser cutting path to form a A through-hole display panel includes: forming at least one through-hole through the driving backplane, the light-emitting layer, and the encapsulation layer along the laser cutting path; the light-emitting layer has a side wall close to the through-hole , the airgel composite material is arranged between the side wall of the light-emitting layer and the hole wall of the through hole, and is filled in the gap between the encapsulation layer and the driving backplane.

In some embodiments, the forming the display panel to be punched includes: forming a first pattern layer on the first substrate; packaging the first substrate and the second substrate into a box, and the first substrate after the box is packaged A liquid crystal layer is formed between a substrate and the second substrate; cutting the display panel to be punched with a laser along a laser cutting path to form a display panel having at least one through hole includes: The cutting path forms at least one through hole penetrating the first substrate, the second substrate and the liquid crystal layer, and the position where the liquid crystal layer is penetrated by the through hole is sealed by the airgel composite material.

In some embodiments, the forming the display panel to be punched further includes: forming at least one spacer on the first substrate or the second substrate; wherein, the material of the spacer is the air condensation Glue composites. Finally, a display device is provided. The display device includes the display panel described in any one of the above embodiments.

An airgel composite material provided by an embodiment of the present disclosure has a better heat absorption effect, can form a dense protective layer at the same time, and can achieve a good packaging effect. The airgel composite material is applied to the manufacturing process of a display panel In this way, the damage to the surrounding display area by laser drilling can be effectively avoided, the packaging effect of the perforated area can be ensured, and the failure of the display device can be avoided.

Description of drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only some of the present invention. Embodiments, for those of ordinary skill in the art, other drawings can also be obtained based on these drawings without any creative effort.

FIG. 1 is a flow chart for the preparation of carbon nanotube polyamide composite materials according to some embodiments of the present disclosure;

2 is a flowchart of a method for preparing an airgel composite material according to some embodiments of the present disclosure;

FIG. 3 is a structural diagram of a display panel according to some embodiments of the present disclosure;

4 is a flowchart of a method for manufacturing a display panel according to some embodiments of the present disclosure;

5 is a flowchart of a method for manufacturing an OLED display panel according to some embodiments of the present disclosure;

FIG. 6 is a flow chart of a fabrication process of an OLED display panel according to some embodiments of the present disclosure;

7 is a top view of (e) in FIG. 6 when the first pattern layer is used as a pixel defining layer according to some embodiments of the present disclosure;

8 is a top view of (f) in FIG. 6 when the first pattern layer is used as a pixel defining layer according to some embodiments of the present disclosure;

FIG. 9 is a top view of (e) in FIG. 6 when the first pattern layer is used as the pixel defining layer of the area to be punched according to some embodiments of the present disclosure;

FIG. 10 is a structural diagram of an OLED display panel according to some embodiments of the present disclosure;

11 is a structural diagram of an OLED display panel with through holes formed according to some embodiments of the present disclosure;

12 is a flow chart of a method for manufacturing an LCD display panel according to some embodiments of the present disclosure;

FIG. 13 is a flowchart of a manufacturing process of an LCD display panel according to some embodiments of the present disclosure.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

In describing the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", The orientations or positional relationships indicated by "top", "bottom", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying References to devices or elements must have a particular orientation, be constructed, and operate in a particular orientation and therefore should not be construed as limiting the invention.

Throughout the specification and claims, unless the context requires otherwise, the term "comprise" and other forms such as the third person singular "comprises" and the present participle "comprising" are used Interpreted as the meaning of openness and inclusion, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific examples" example)" or "some examples (some examples)" etc. are intended to indicate that specific features, structures, materials or characteristics related to the embodiment or examples are included in at least one embodiment or example of the present disclosure. Schematic representations of the above terms are not necessarily referring to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be included in any suitable manner in any one or more embodiments or examples.

Hereinafter, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

In describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other. As another example, the term "coupled" may be used when describing some embodiments to indicate that two or more elements are in direct physical or electrical contact. However, the terms "coupled" or "communicatively coupled" may also mean that two or more elements are not in direct contact with each other, but yet still co-operate or interact with each other. The embodiments disclosed herein are not necessarily limited by the context herein.

"At least one of A, B and C" has the same meaning as "at least one of A, B or C" and both include the following combinations of A, B and C: A only, B only, C only, A and B A combination of A and C, a combination of B and C, and a combination of A, B and C.

"A and/or B" includes the following three combinations: A only, B only, and a combination of A and B.

"Multiple" means at least two.

The use of "suitable for" or "configured to" herein means open and inclusive language that does not exclude devices that are suitable for or configured to perform additional tasks or steps.

Additionally, the use of "based on" is meant to be open and inclusive, as a process, step, calculation, or other action that is "based on" one or more stated conditions or values may in practice be based on additional conditions or beyond stated values.

As used herein, descriptions such as "about" or "approximately" include the stated value as well as mean values that are within acceptable deviations from the specified value as considered by one of ordinary skill in the art. The measurements discussed are determined by the errors associated with the measurement of a particular quantity (ie, limitations of the measurement system).

Exemplary embodiments are described herein with reference to cross-sectional and/or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and regions are exaggerated for clarity. Accordingly, variations in shape from the drawings as a result, for example, of manufacturing techniques and/or tolerances are contemplated. Thus, example embodiments should not be construed as limited to the shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, an etched region illustrated as a rectangle will, typically, have curved features. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of example embodiments.

Some embodiments of the present disclosure provide an airgel composite material, the airgel composite material comprising: an airgel and a reinforcement bonded to the aerogel by physical entanglement, physical cross-linking or chemical cross-linking phase; wherein, the reinforcing phase is composite fibers or composite particles formed by carbon nanotubes and fiber-forming polymers; the airgel is SiO ₂ aerogel. Exemplarily, the fiber-forming polymer refers to a synthetic high molecular polymer that can be made into fibers. Synthetic fibers include polyester, nylon, acrylic, polyvinyl chloride, vinylon, spandex, polyolefin elastic yarn, etc., which can be formed into synthetic fibers. Fiber polymers include polyester, polyamide, acrylonitrile copolymer, polyvinyl chloride and its copolymer, polyvinyl acetal, polyurethane, polyolefin, etc.

For example, fiber-forming polymers may include polyamide (nylon), polycaprolactam (nylon 6), polyethylene sebacamide (nylon 610), polydodecanediamide (nylon 612), polyethylene adipamide Hexamethylene diamine (nylon 66), polyoctylamide (nylon 8), poly 9-aminononanoic acid (nylon 9), polydecanediamine sebacate (nylon 1010), polyundecamide (nylon 11), poly Any of lauramide (nylon 12) and the like. For example, the reinforcing phase may be composite fibers or composite particles formed of carbon nanotubes and polyamide (English full name: Polyamide, PA for short, commonly known as nylon).

Exemplarily, the above-mentioned reinforcing phase may be composite fibers or composite particles containing carbon nanotubes and polyamide. Specifically, referring to FIG. 1 , the above-mentioned composite fibers or composite particles containing carbon nanotubes and polyamides can be prepared by the following preparation method.

S101. Prepare a composite material solution.

Exemplarily, carbon nanotubes and polyamides are added to an organic solvent to obtain a mixed solution of carbon nanotubes, polyamides and an organic solvent, and the mixed solution is ultrasonically treated to obtain a composite material composed of carbon nanotubes and polyamides solution. Specifically, there is no limitation on the selection of the organic solvent and the preparation method of the composite material solution, and those skilled in the art can choose the corresponding organic solvent and subsequent treatment conditions according to the needs. For example, the organic solvent can be 4,4'-diaminodiphenyl ether or other ether organic solvents. In the composite material solution, the mass fraction of carbon nanotubes is 0.01% to 0.8%, and the mass fraction of polyamide is 50% to 60%. Mix well.

S102, drying the composite material solution to prepare composite material particles/spinning the composite material solution to prepare composite material fibers.

Exemplarily, the composite material solution can be dried to obtain composite material particles. Commonly used drying methods include atmospheric drying, vacuum drying, spray drying, boiling drying, freeze drying, and the like. Specifically, the composite material solution can be dried by vacuum drying, the pressure is reduced to a vacuum condition, and the composite material solution composed of carbon nanotubes and polyamide is dried to obtain a composite material composed of carbon nanotubes and polyamide. For example, the treatment temperature for drying under reduced pressure is 200°, the degree of vacuum is 10 ^-4 Torr (ie 133.322*10 ^-4 Pa), and the drying time is 15 minutes, which is not limited.

Commonly used fiber spinning methods can be divided into two types: melt spinning and solution spinning. Usually, the fiber-forming polymer that does not decompose significantly in the molten state is melt-spun, and the fiber-forming polymer that decomposes when melted is solution-spun, that is, the fiber-forming polymer is dissolved in a solvent to obtain a viscous spinning solution, and then spinning.

Exemplarily, solution spinning may be used to solution-spin the above composite material into fibers of the composite material composed of carbon nanotubes and polyamide. Specifically, under the conditions that the spinning temperature is 285°C-291°C, the spinning speed is 150m/min-300m/min, the heat-setting time is 10s-30s and the storage time is not less than 4 days, the said A solution of a composite material composed of carbon nanotubes and polyamide is spun into a composite fiber containing carbon nanotubes and polyamide.

Exemplarily, the reinforcing phase of the airgel composite material is a composite fiber containing carbon nanotubes and polyamide, which can be combined with SiO ₂ airgel to obtain carbon nanotube polyamide composite fiber-reinforced SiO ₂ airgel. Since the composite fiber contains carbon nanotubes, the density of the composite fiber is relatively high, and the density of the carbon nanotube-polyamide composite fiber-reinforced SiO ₂ airgel formed accordingly is also relatively high. After being heated at high temperature, the SiO ₂ airgel is destroyed. The composite fiber containing carbon nanotubes and polyamide can form a dense protective layer and can achieve good encapsulation effect. At the same time, because it contains carbon elements, it has a better heat absorption effect. The above-mentioned airgel can absorb more heat when it is heated and melted at a high temperature, thereby effectively reducing the degree of heat damage to surrounding substances.

In other embodiments of the present disclosure, a method for preparing an airgel composite material is provided, which is used to prepare the airgel composite material in any of the above embodiments, see FIG. 2, the preparation method includes:

S201. Mix the organic silicon source, water and C1-C4 low-carbon alcohol, add acid to adjust the pH, and hydrolyze for a certain period of time to obtain a sol.

Exemplarily, there is no limit to the selection of the organosilicon source, and the organosilicon source commonly used in the preparation of silica airgel in this field can be used. A typical but non-limiting organosilicon source is, for example, methyl orthosilicate (English Name: Tetramethoxysilane), ethyl orthosilicate (English name: Tetraethyl orthosilicate, alias TEOS) or tetrachlorosilane (English name: Tetrachlorosilane), etc. C1-C4 low carbon alcohols include but not limited to methanol, ethanol, propanol, butanol and the like. Depending on the selected organosilicon source and low-carbon alcohol, the mixing ratio of the raw materials used to prepare the solution may be different, and the preparation conditions may also be different.

For example, the selected organosilicon source is tetraethyl orthosilicate, the organosilicon source, water and ethanol are mixed at a molar ratio of 1:4:10, and acid is added to adjust the pH after mixing evenly. The acid plays the role of catalyzing hydrolysis, and the acidic environment makes the sol-gel reaction easy to carry out, and the pH of the reaction environment can be controlled to create an acidic environment. Among them, there is no limitation on the selection of the acid, and hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, hydrofluoric acid, oxalic acid or acetic acid can be used. Concretely, the acid used for adjusting pH can be hydrochloric acid, the concentration of hydrochloric acid is 0.5～1mol/L, the addition amount of hydrochloric acid is to make the pH value of solution be 3～4, the temperature of hydrolysis after adjusting pH is 40～90 ℃, hydrolysis The time is 12-24 hours. For example, hydrochloric acid can be added to make the pH of the solution 3, and the hydrolysis is carried out after adjusting the pH. The hydrolysis temperature is 50° C., and the hydrolysis time is 12 hours. Wherein, the selected acid can be hydrochloric acid and ethanol mixed with a volume ratio of 1:20 to form a hydrochloric acid alcohol solution, which can also be used to adjust the pH, and the effect of using the hydrochloric acid alcohol solution to adjust the pH and the condition control of subsequent hydrolysis It is consistent with hydrochloric acid and will not be repeated here.

S202. Mix the reinforcing phase with the sol, add alkali to adjust the pH and stir for a certain period of time, and wait until it forms a wet gel composite material.

Exemplarily, mixing the reinforcement phase with the sol includes: placing the reinforcement phase in a container, pouring the sol into the container and submerging the reinforcement phase, and then ultrasonically treating the mixture of the reinforcement phase and the sol for 30 minutes. Specifically, the reinforcing phase is a chopped carbon nanotube polyamide composite fiber. Shortening the composite fiber is beneficial to the uniform mixing of the fiber and the sol. At the same time, the use of ultrasonic treatment can make the dispersion of the reinforcing phase in the sol more uniform, which is beneficial to the development of the subsequent preparation process.

Exemplarily, after the reinforcement phase and the sol are fully mixed, the preparation method of the airgel composite material further includes: adding alkali to adjust the pH and stirring for a certain period of time, and waiting for the wet gel composite material to be formed. Wherein, there is no restriction on the selection of the base, and the base selected may be ammonia water, monoethanolamine, diethanolamine or triethanolamine, etc. Specifically, the alkali used for adjusting the pH may be ammonia water, the concentration of which is 1-2 mol/L; the amount of alkali added is to adjust the pH of the solution to 7-8. The stirring time is 10-20 minutes; the time required to form the wet gel composite material after the stirring is not less than 3 minutes. For example, ammonia water can be added to adjust the pH of the solution to 7, after the pH adjustment is completed, the mixture is stirred for 15 minutes and left to stand for 3 minutes to form a wet gel composite. Wherein, the selected alkali can be ammonia water and ethanol mixed with a volume ratio of 1:20 to form an ammonia water-alcohol solution, which can also be used for pH adjustment, and the effect of using the ammonia water-alcohol solution for pH adjustment and subsequent condition control and Ammonia is the same, and will not be repeated here.

S203. Aging the wet gel composite material in an aging solution.

Exemplarily, the aging liquid may be ethanol, n-hexane, cyclohexane, n-heptane, or acetone, etc., the aging temperature is 50-90° C., and the aging time is 10-24 h, which is not limited. Specifically, the aging solution is obtained by mixing ethyl orthosilicate and ethanol at a volume ratio of 1:10, the aging temperature is 50° C., and the aging time is 24 hours.

S204, drying the aged wet gel composite material to obtain an airgel composite material.

The drying treatment may be performed by using a carbon dioxide supercritical drying process or an atmospheric pressure drying process. Specifically, the atmospheric pressure drying process can be performed by a conventional method, such as natural drying under normal pressure (1±0.3 atm). Carbon dioxide (CO ₂ ) is gaseous at room temperature and atmospheric pressure. When carbon dioxide supercritical drying process is used for drying treatment, when the limit of constant temperature and high pressure is exceeded, that is, the so-called supercritical point, the evaporation process does not occur. Therefore, carbon dioxide is in the The supercritical state of gas and liquid cannot be distinguished, and the carbon dioxide in the supercritical state is called "supercritical carbon dioxide". For supercritical carbon dioxide, since the molecular density is close to that of a liquid, but the viscosity is lower, supercritical carbon dioxide has a behavior close to that of a gas. In addition, due to faster diffusion and higher thermal conductivity, the drying efficiency is higher and the drying process time is reduced.

Exemplarily, the drying treatment method for the aged wet gel composite material is CO ₂ supercritical drying.

The airgel composite material prepared by the method for preparing the airgel composite material has relatively high density, strong heat absorption capacity, and good physical and chemical properties.

Other embodiments of the present disclosure provide a display device, including a display panel 1 for displaying images. The display panel 1 can be an OLED (Organic Light Emitting Diode, organic light emitting diode) display panel, a QLED (Quantum Dot Light Emitting Diodes, quantum dot light emitting diode) display panel, an LCD (Liquid Crystal Display, liquid crystal display) display panel, a micro LED ( Including: miniLED or microLED) display panel, etc.

In other embodiments of the present disclosure, a display panel 1 is provided. Referring to FIG. 3 , the display panel 1 may include a plurality of sub-pixels P, and the plurality of sub-pixels P are located in the AA region. Exemplarily, a plurality of sub-pixels P may be arranged in an array. For example, the sub-pixels P arranged in a row along the X direction are called the same pixel, and the sub-pixels P arranged in a row along the Y direction are called the same column of pixels.

Exemplarily, the plurality of sub-pixels P includes a first color sub-pixel P, a second color sub-pixel P and a third color sub-pixel P; for example, the first color, the second color and the third color are three primary colors; for example, the first color The first color, the second color and the third color are red, green and blue respectively; that is, the plurality of sub-pixels P includes a red sub-pixel P _R , a green sub-pixel _PG and a blue sub-pixel P _B .

For example, referring to FIG. 3 , the display panel 1 has at least one (for example, one) through hole 10 , and at least a part of the hole wall of the through hole 10 is formed of an airgel composite material. Exemplarily, the shape and size of the two openings of the through hole 10 on the upper surface and the lower surface of the display panel 1 are basically the same, and the shape of the opening can be any of polygonal, circular, elliptical, etc.; the polygonal shape includes: hexagonal shape, quadrilateral or triangle, etc., wherein the quadrilateral can be rectangle, square, parallelogram, etc., without limitation. For example, referring to FIG. 3 , the opening shape of the through hole 10 is a rectangle.

In some embodiments of the present disclosure, the display panel 1 may be an OLED display panel. Referring to (e) in FIG. The light emitting layer 30 is away from the encapsulation layer 40 on the side of the driving backplane 20 , and at least one (for example, one) through hole 10 runs through the driving backplane 20 , the light emitting layer 30 and the encapsulation layer 40 .

Next, each part of the display panel 1 is described in detail.

Exemplarily, referring to FIG. 3 , the driving backplane 20 includes a base substrate and a pixel circuit layer disposed on the base substrate. Specifically, the base substrate is configured to carry multiple film layers of the driving backplane 20 , such as a buffer layer, a gate insulating layer, an interlayer insulating layer, and the like. For example, the base substrate may be a rigid base substrate; the rigid base substrate may be, for example, a glass substrate or a PMMA (Polymethyl methacrylate, polymethyl methacrylate) substrate or the like. For another example, the base substrate can be a flexible base substrate; the flexible base substrate can be, for example, a PET (Polyethylene terephthalate, polyethylene terephthalate) base substrate, a PEN (Polyethylene naphthalate two formic acid glycolester, poly Ethylene naphthalate) base substrate or PI (Polyimide, polyimide) base substrate, etc.

Exemplarily, referring to FIG. 3 , the pixel circuit layer includes a plurality of pixel circuits 210 . Embodiments of the present disclosure do not limit the specific structure of the pixel circuit 210, which can be designed according to actual conditions. Exemplarily, the pixel circuit 210 is composed of thin film transistors (Thin Film Transistor, TFT for short), capacitors (Capacitance, C for short), and other electronic devices, and each transistor includes an active layer. For example, the pixel circuit 210 may include two thin film transistors (a switching transistor and a driving transistor) and a capacitor to form a 2T1C structure; of course, the pixel circuit may also include more than two thin film transistors (a plurality of switching transistors and a driving transistor ) and at least one capacitor, for example, the pixel circuit 210 may include two storage capacitors Cst and eight transistors (seven switching transistors and one driving transistor), forming an 8T2C structure.

Exemplarily, referring to FIG. 3 , the display panel 1 includes a plurality of light emitting devices L. As shown in FIG. The light emitting device L may be a light emitting device such as LED (Light Emitting Diode, Light Emitting Diode), OLED (Organic Light Emitting Diode, Organic Light Emitting Diode) or QLED. The light emitting device L includes a cathode and an anode, and a light emitting functional layer between the cathode and the anode. Wherein, the luminescent functional layer may include, for example, an luminescent layer (Emission layer, EL), a hole transport layer (Hole Transporting Layer, HTL) between the luminescent layer and the anode, an electron transport layer (Election layer) between the luminescent layer and the cathode. Transporting Layer, ETL). Of course, in some embodiments as required, a hole injection layer (Hole Injection Layer, HIL) can also be set between the hole transport layer HTL and the anode, and an electron injection layer (HIL) can be set between the electron transport layer ETL and the cathode. Election Injection Layer, EIL).

Exemplarily, the anode can be formed of a transparent conductive material with a high work function, and its electrode material can include indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium oxide (IGO), gallium zinc oxide (GZO) oxide Zinc (ZnO), indium oxide (In2O3), aluminum zinc oxide (AZO) and carbon nanotubes, etc.; the cathode, for example, can be formed of materials with high conductivity and low work function, and its electrode materials can include magnesium aluminum alloy (MgAl) and lithium Alloys such as aluminum alloy (LiAl) or metal elements such as magnesium (Mg), aluminum (Al), lithium (Li), and silver (Ag). The material of the light-emitting layer can be selected according to the color of the emitted light. For example, the material of the light emitting layer includes a fluorescent light emitting material or a phosphorescent light emitting material. For example, in at least one embodiment of the present disclosure, the light-emitting layer may adopt a doping system, that is, a dopant material is mixed into a host light-emitting material to obtain a usable light-emitting material. For example, metal compound materials, anthracene derivatives, aromatic diamine compounds, triphenylamine compounds, aromatic triamine compounds, biphenyldiamine derivatives, and triarylamine polymers can be used as the host luminescent material.

Exemplarily, referring to (e) in FIG. 6 , in an OLED display device, in order to protect the light emitting layer 30 from intrusion by water vapor and oxygen and have a longer working life, after the light emitting layer 30 is formed, the light emitting layer 30 An encapsulation layer 40 is formed on a side away from the driving backplane 20 . Specifically, the encapsulation layer 40 may include a single-layer sealing layer, or may include multiple layers (for example, three layers) of sealing layers, and the material of the encapsulation layer can be selected by those skilled in the art according to needs, and the comparison is not limited. For example, the encapsulation layer 40 is sealed with three layers, which are respectively a first inorganic material film layer, an organic material film layer and a second inorganic material film layer.

Exemplarily, referring to (f) in FIG. 6 , the luminescent layer 30 has a side wall 31 close to the through hole 10, and the airgel composite material is disposed between the side wall 31 of the luminescent layer 30 and the wall of the through hole 10. and fill the gap between the encapsulation layer 40 and the driving backplane 20 . If there is a gap between the encapsulation layer 40 and the driving backplane 20 after the punching is completed, the encapsulation layer 40 is poorly encapsulated. The airgel composite material is filled, and the airgel composite material forms a dense protective layer, thereby avoiding the intrusion of water vapor and oxygen, and achieving a better packaging effect.

Exemplarily, referring to FIG. 6 to FIG. 8 , the display panel 1 further includes a pixel defining layer disposed on the driving backplane 20 , and the material of the pixel defining layer is the airgel composite material in any of the above-mentioned embodiments. The pixel defining layer is used to define the light-emitting area of each sub-pixel P. Each closed laser cutting path 11 is within the range defined by the pixel defining layer, and there is a certain distance between the laser cutting path and the edge of the pixel defining layer. In this way, after the hole is punched, the distance d1 between the edge of each through hole 10 and the sub-pixel P closest to the through hole 10 is smaller than the width d2 of the pixel defining layer between two adjacent sub-pixels P.

In some embodiments of the present disclosure, referring to FIG. 13 , the display panel 1 may be an LCD display panel, and the display panel includes: a first substrate 60 , a second substrate 70 disposed opposite to the first substrate 60 , and a second substrate 70 disposed at the second A liquid crystal layer 80 between the first substrate 60 and the second substrate 70, and at least one (for example, one) through hole 10 passing through the first substrate 60, the second substrate 70 and the liquid crystal layer 80, the liquid crystal layer 80 is formed by the through hole 10 through the position is sealed by airgel composite material. Exemplarily, the first substrate 60 may be an array substrate, and the second substrate 70 may be a color filter substrate, which is not limited thereto.

Exemplarily, referring to FIG. 13 , the display panel 1 further includes: at least one (for example, three) spacers 90 disposed between the first substrate 60 and the second substrate 70, and the material of the spacers 90 is The airgel composite material in any of the above embodiments.

Still other embodiments of the present disclosure provide a method for manufacturing a display panel, which is used to form the display panel 1 in any of the above embodiments, referring to FIG. 4 , including:

S301, forming a display panel to be punched.

Exemplarily, the display panel to be punched includes a first pattern layer 50, and the material of the first pattern layer 50 is the airgel composite material in the above-mentioned embodiments.

The pattern layer refers to the film layer formed by one patterning process. A patterning process refers to a process capable of forming at least one pattern with a certain shape. For example, a thin film is formed on the driving backplane 20 by any one of various film-forming processes such as deposition, coating, and sputtering, and then the thin film is patterned to form a film layer containing at least one pattern, which is called a pattern. layer. The patterning steps include: coating photoresist, exposing, developing, etching and stripping photoresist, etc. In this embodiment, the positional relationship of multiple patterns belonging to the same pattern layer is referred to as setting in the same layer.

S302 , using a laser to cut the display panel to be punched along the laser cutting path 11 to form a display panel 1 having at least one through hole 10 .

Exemplarily, the method for manufacturing the above display panel further includes using a laser to cut the display panel to be punched along the laser cutting path 11 to form a display panel 1 having at least one (for example, one) through hole 10, the laser cutting path 11 is within the range defined by the first pattern layer 50; wherein, at least a part of the hole wall of the through hole 10 is formed of an airgel composite material.

Next, referring to FIG. 5 , taking an OLED display panel as an example, the manufacturing method of the display panel 1 will be described in detail. The manufacturing method of the display panel 1 includes the following steps:

S401 , forming a first pattern layer 50 .

Exemplarily, referring to (a) in FIG. 6 , forming a display panel to be punched includes forming a first pattern layer 50 on the driving backplane 20, and the first pattern layer 50 includes at least one (for example, may be three) The material of the first pattern 51 and the first pattern layer 50 is an airgel composite material, which is the carbon nanotube polyamide composite fiber-reinforced SiO ₂ airgel in the above embodiment.

Exemplarily, referring to (e) and FIG. 7 in FIG. 6, at least one (for example, may be one) through hole 10 may be formed on the display panel 1 by laser drilling in subsequent process steps, and each through hole The laser cutting path 11 of 10 is within the range defined by the first pattern layer 50, that is, the orthographic projection of the laser cutting path 11 of each through hole 10 on the driving backplane 20 is contained in a first pattern 51 on the outer wall of the driving backplane 20. In the orthographic projection on . The area where the orthographic projection of each first pattern 51 on the drive backplane 20 overlaps with the orthographic projection of the enclosed figure formed by the laser cutting path 11 contained in it on the drive backplane 20 is the overlapping area 511, and each first pattern The area where the orthographic projection of 51 on the driving backplane 20 and the orthographic projection of the closed figure formed by the laser cutting path 11 included on the driving backplane 20 does not overlap is the non-overlapping area 512 . Due to the existence of the non-overlapping region 512 and the part of the first pattern 51 on it, in the process of forming the through hole 10 by laser cutting, the sub-pixel P penetrated by the through hole 10 and the sub-pixel P located far away from the first pattern 51 penetrated by the through hole 10 There is an airgel composite material with a certain thickness between the sub-pixels P' on one side of the pixel P, which has a good heat absorption effect and can form a dense sealing structure. During the laser cutting process, it can avoid the large amount of heat released from affecting the material performance of the sub-pixel P'. After laser cutting, the sealing effect on the sub-pixel P' is ensured, so as to achieve a better display effect and avoid device failure caused by water vapor intrusion.

Exemplarily, the value range of the minimum distance between the orthographic projection of the outer wall of the first pattern 51 on the driving backplane 20 and the orthographic projection of the laser cutting path 11 of the through hole 10 contained on the driving backplane 20 is ( 0.1 mm, 0.5 mm]. In this way, there is a sufficient amount of airgel composite material between the sub-pixel P and the sub-pixel P', further improving the heat absorption and sealing effect.

For example, referring to FIG. 7 and FIG. 8 , the first pattern layer 50 may be a pixel defining layer of the display panel 1 for dividing the sub-pixels P. Referring to FIG. In subsequent process steps, at least one (for example, one) through hole 10 may be formed on the display panel 1 by laser drilling, the through hole 10 runs through at least one (for example, two) sub-pixels P, and is simultaneously Each of the plurality of sub-pixels P penetrated by one through hole 10 is adjacent to at least one (for example, may be one) of the other plurality of sub-pixels P penetrated by the same through hole 10 . At this time, the pattern of the pixel defining layer surrounding the plurality of sub-pixels P is a first pattern 51 . For example, the through hole 10 runs through two adjacent sub-pixels P, at this time, the pixel defining layer pattern surrounding the two sub-pixels P is a first pattern 51 . The minimum distance between the orthographic projection of the outer wall of each first pattern 51 on the driving backplane 20 and the orthographic projection of the laser cutting path 11 of the through hole 10 contained on the driving backplane 20 is d, 0.1mm<d≤ 0.5 mm, that is, the range of the minimum value of the area width d of the non-overlapping area 512 is 0.1 mm<d≤0.5 mm.

For example, referring to FIG. 3 and FIG. 9 , the area of the display panel 1 provided with through holes 10 is a perforated area 521 , and other areas of the display panel 1 not provided with through holes 10 are non-perforated areas 522 . The first pattern layer 50 can only be used as the pixel defining layer of the sub-pixel P in the punched area 521, and in the non-punched area 522, the pixel defining layer of the sub-pixel P' is still made of conventional materials. Specifically, the first pattern layer 50 is provided on the same layer as the pixel defining layer of the display panel 1 , and is formed through a single patterning process using inkjet printing technology.

For example, referring to FIG. 10 and FIG. 11 , the first pattern layer 50 is not used as a pixel defining layer, the first patterns 51 are solid cylinders, and the orthographic projection of each first pattern 51 on the driving backplane 20 completely covers one laser beam. Orthographic projection of the closed figure formed by the cutting path 11 on the driving backplane 20 . The orthographic projection of each through hole 10 formed by subsequent laser drilling on the driving backplane 20 is included in the orthographic projection of the outer wall of the first pattern 51 on the driving backplane 20 . Similar to the above-mentioned embodiments, the minimum distance between the orthographic projection of the outer wall of each first pattern 51 on the driving backplane 20 and the orthographic projection of the laser cutting path 11 of the through hole 10 it contains on the driving backplane 20 is w, 0.1mm<w≤0.5mm, that is, the range of the minimum value of the region width w of the non-overlapping region 512 is 0.1mm<w≤0.5mm.

S402 , forming the light emitting layer 30 .

Exemplarily, referring to (b) in FIG. 6 , the formation of the display panel to be punched further includes: forming a light emitting layer 30 on the driving backplane 20 formed with the first pattern layer 50, the light emitting layer 30 includes multiple A light emitting device L. The light emitting device L is the smallest unit capable of emitting light. Specifically, the luminescent layer 30 includes a hole injection layer (Hole Injection Layer, HIL), a hole transport layer (Hole Transport Layer, HTL), and a luminescent material sequentially formed on the driving backplane 20 on which the first pattern layer 50 is formed. Layer (Emission layer, EL), electron transport layer (Electronic Transport Layer, ETL) and electron injection layer (Electronic Injection Layer, EIL). The light emitting layer 30 also includes two electrode layers, one of which is an anode and the other is a cathode. Exemplarily, the anode can be formed before forming the first pattern layer 50, and the cathode can be formed after forming the electron injection layer (Electronic Injection Layer, EIL).

Referring to (b) in FIG. 6, (c) in FIG. 6 and (d) in FIG. , while the multiple film layers included in the light emitting layer 30 are sequentially formed, corresponding film layers will also be deposited on the first pattern 51 . Before forming the cathode of the light-emitting layer 30, the film layer deposited on the first pattern 51 can be removed by at least one (for example, multiple times) etching process, so that the cathode can be deposited on the electron injection layer and the first pattern layer 50 simultaneously. superior. After the cathode is formed, the manufacturing method of the above display panel further includes: manufacturing the annular perforated protection area 53 . Specifically, a plurality of first annular hollow areas 531 can be etched on the cathode by exposure and development, the orthographic projection of the first annular hollow areas 531 on the driving backplane 20 coincides with the non-overlapping area 512, and the first annular hollow areas 531 The width k is 200˜500 μm, for example, the width of the first annular hollow region 531 may be 300 μm. After the first annular hollow area 531 is formed, use the same mask as that used to form the first annular hollow area 531 to etch each first pattern 51 through exposure and development to form at least one (for example, there may be multiple) The second ring-shaped hollow areas 532 disposed on the same layer as the first pattern layer 50 , each second ring-shaped hollow area 532 surrounds a light emitting device L. Each annular perforated protection area 53 includes a first annular hollow area 531 and a second annular hollow area 532 whose orthographic projections on the drive backplane 20 completely overlap.

Exemplarily, when the first pattern layer 50 is not used as a pixel defining layer, and each first pattern 51 is in the shape of a solid column, after the electron injection layer of the light emitting layer 30 is formed, there will also be on the first pattern 51 Corresponding to the deposition of the film layer, the film layer deposited on the first pattern 51 can be removed by at least one (eg, multiple times) etching process.

S403 , forming an encapsulation layer 40 .

Exemplarily, referring to (e) in FIG. 6 , after forming the light emitting layer 30 , forming the display panel to be punched further includes: forming an encapsulation layer 40 on a side of the light emitting layer 30 away from the driving backplane 20 . Specifically, the material of the encapsulation layer 40 may be tetrafluoroethylene (English name: tetrafluoroethylene, alias: TFE), epoxy resin, and the like. Specifically, due to the existence of the annular perforated protection area 53 , when the encapsulation layer 40 is formed, the encapsulation layer 40 will fill at least part of the annular perforated protection area 53 .

S404 , forming a through hole 10 .

Exemplarily, referring to (f) in FIG. 6 and FIG. 8 and FIG. 11, after the encapsulation layer 40 is formed, a laser is used to cut the display panel to be punched along the laser cutting path 11 to form a display panel having at least one through hole 10. The display panel 1 includes: forming at least one (for example, one) through hole 10 through the driving backplane 20, the light emitting layer 30 and the encapsulation layer 40 along the laser cutting path 11, the laser cutting path 11 is defined in the first pattern layer 50 Within the range; the light emitting layer 30 has a side wall 31 close to the through hole 10, the airgel composite material is arranged between the side wall 31 of the light emitting layer 30 and the hole wall of the through hole 10, and is filled in the encapsulation layer 40 and the driving backplane 20 in the gap between.

Specifically, the through hole 10 is formed by laser burning, and the laser cuts along the laser cutting path 11 , that is, the main part of the laser cutting is the first pattern 51 in the first pattern layer 50 . Due to the high temperature of laser cutting, the airgel composite material forming the first pattern 51 at the cutting path absorbs heat and melts, and the melted airgel composite material will diffuse to both sides under the action of the pulsed laser, and in the protective gas (inert gas) gas) or protective liquid atmosphere, the completely melted airgel composite material can be filled in the gap between the encapsulation layer 40 and the driving backplane 20, between the side wall 31 of the light emitting layer 30 and the hole wall of the through hole 10 A dense protective layer is formed between them, so as to avoid the problem that the encapsulation layer 40 is not properly packaged and the encapsulation layer 40 makes water vapor invade the device after laser drilling, resulting in failure of the device. At the same time, since the airgel composite material contains carbon elements, it has a better heat absorption effect, and can absorb more heat when it is heated and melted at high temperature, thereby reducing the damage degree of heat to the light-emitting device L of the surrounding light-emitting layer 30 .

Exemplarily, when the display panel 1 has the ring-shaped perforated protection area 53, when laser drilling is performed, due to the existence of the ring-shaped perforated protection area 53, there is a gap between the first pattern 51 and the light emitting device L. On the basis of melting and absorbing heat of the sol composite material, the damage to the light-emitting device L caused by the heat released by laser burning can be further reduced.

Exemplarily, when the base substrate of the driving backplane 20 is a flexible base substrate, the flexible base substrate is carried on the rigid substrate in the manufacturing process, and after the laser drilling is completed, the flexible base substrate and the rigid substrate can be Separate to form a display panel 1; when the base substrate is a rigid base substrate, the display panel 1 can be obtained after laser drilling is completed.

Exemplarily, referring to FIGS. 12 to 13 , taking the display panel 1 as an LCD display panel as an example, the manufacturing method of the display panel 1 will be described in detail. The manufacturing method of the display panel 1 includes the following steps:

S501 , forming a first pattern layer 50 on a first substrate 60 .

Exemplarily, referring to FIG. 12 and (a) in FIG. 13 , the first pattern layer 50 is formed on the first substrate 60 . Specifically, the first pattern layer 50 includes at least one (for example, three) first patterns 51, and the material of the first pattern layer 50 is an airgel composite material, and the airgel composite material is the above-mentioned embodiment. Carbon nanotube-polyamide composite fiber-reinforced SiO ₂ aerogels.

Specifically, the first pattern 51 can be a solid cylinder, and the laser cutting path 11 is within the range defined by the first pattern layer 50, that is, the orthographic projection of the closed figure formed by the laser cutting path 11 on the first substrate 60 is defined by a first pattern layer 50. The orthographic projection of a pattern 51 on the first substrate 60 is completely covered, the orthographic projection of the outer wall of the first pattern 51 on the first substrate 60 and the orthographic projection of the laser cutting path 11 of the through hole 10 it contains on the first substrate 60 The value range of the minimum distance between is (0.1mm, 0.5mm]. In this way, there is a sufficient amount of airgel composite material between the cutting position and the liquid crystal layer 80, thereby ensuring that the airgel composite material can absorb Heat, the secret protective layer formed by sufficient airgel composite material after cutting, realizes the sealing of the liquid crystal layer 80 .

Exemplarily, the first patterns 51 may also be tubular, and the orthographic projection of each first pattern 51 on the first substrate 60 is the same as the orthographic projection of the closed figure formed by the laser cutting path 11 contained therein on the first substrate 60. The overlapping area is the overlapping area 511, and the area where the orthographic projection of each spacer on the first substrate 60 does not overlap with the orthographic projection of the closed figure formed by the laser cutting path 11 it contains on the first substrate 60 is the non-overlapping area. Coincident area 512 . The value range of the minimum area width of the non-overlapping area 512 is also (0.1mm, 0.5mm], so as to ensure heat absorption and sealing effect.

S502, packaging the first substrate 60 and the second substrate 70 into a box.

Exemplarily, referring to (b) in FIG. 13 , packaging the first substrate 60 and the second substrate 70 in a box includes: using the first substrate 60 and the second substrate 70 as a lower substrate and an upper substrate respectively and packaging the box, The opposing areas of the first substrate 60 and the second substrate 70 form a closed space, and the liquid crystal layer 80 is disposed in the closed space.

Exemplarily, forming the display panel to be punched further includes forming at least one (for example, three) spacers 90 on the first substrate 60 or the second substrate 70, wherein the material of the spacers 90 is the above-mentioned Airgel composites in Examples. The first pattern layer 50 and the spacer 90 may belong to the same pattern layer, at this time, they are the same layer and the same material, of course, the two may also belong to different pattern layers. For example, the area of the display panel 1 provided with the through holes 10 is a perforated area, and the other areas of the display panel 1 not provided with the through holes 10 are non-perforated areas. The first pattern 51 may only be used as a spacer 90 in the perforated area, and the spacer 90 in the non-perforated area is still made of conventional materials. Specifically, the first pattern 51 is disposed on the same layer as the pixel defining layer of the display panel 1 , and can be formed through a single patterning process using inkjet printing technology.

Exemplarily, referring to FIG. 13 , the first pattern 51 may be a spacer 90 of the display panel 1 for maintaining a certain distance between the first substrate 60 and the second substrate 70 so that The thickness of the liquid crystal layer 80 between the second substrates 70 is uniform everywhere.

S503 , laser drilling to form the display panel 1 .

Exemplarily, referring to (c) in FIG. 13 , forming a display panel 1 by laser drilling includes: forming at least one (for example, one) through the first substrate 60, the second substrate 70 and the liquid crystal layer along the laser cutting path 11. 80 , and the position where the liquid crystal layer 80 is penetrated by the through hole 10 is sealed by an airgel composite material. Similar to the OLED display panel, the orthographic projection of the laser cutting path 11 of the LCD display panel on the first substrate 60 is included in the orthographic projection of the spacers 90 on the first substrate 60. The airgel composite material absorbs more heat and melts, so as to avoid high temperature damage to the film layer around the spacer. At the same time, the melted airgel composite material will diffuse to both sides under the action of the pulsed laser, and eventually Solidification forms a dense protective layer, which can seal the liquid crystal layer at the cutting path. The solidified dense protective layer can still be used as a spacer to maintain the thickness of the liquid crystal layer at the laser drilling, avoiding display effects caused by changes in the thickness of the liquid crystal layer Variation problem.

The material and shape of each layer prepared by the above-mentioned preparation method, as well as the positional relationship among them, can refer to the above-mentioned embodiment of the display panel 1 , and can produce the same technical effect, and will not be repeated here.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: it can still be Modifications are made to the technical solutions described in the foregoing embodiments, or equivalent replacements are made to some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims (13)

1. A display panel, characterized in that the display panel has at least one through hole, the through hole is formed by cutting the display panel to be punched by a laser along the laser cutting path, and the position where the through hole penetrates sealed by an airgel composite; The display panel to be punched includes a first pattern layer, and the material of the first pattern layer is the airgel composite material; the laser cutting path is within the range defined by the first pattern layer; the The airgel composite comprises: an airgel, a reinforcing phase bound to said aerogel in a physically entangled, physically crosslinked or chemically crosslinked manner; Wherein, the reinforcing phase is composite fibers or composite particles formed by carbon nanotubes and fiber-forming polymers; The airgel is SiO ₂ airgel. 2. The display panel according to claim 1, characterized in that, The reinforcing phase of the airgel composite material is a composite fiber containing carbon nanotubes and polyamide. 3. The display panel according to claim 1, characterized in that, The preparation method of the airgel composite material comprises: Mix the organic silicon source, water and C1~C4 low-carbon alcohol, add acid to adjust the pH and hydrolyze for a certain period of time to obtain a sol; Mix the reinforcing phase with the sol, add alkali to adjust the pH and stir for a certain period of time, and wait for it to form a wet gel composite material; Aging the wet gel composite material in an aging solution; The aged wet gel composite material is dried to obtain an airgel composite material. 4. The display panel according to claim 3, characterized in that, The drying treatment method is _CO2 supercritical drying. 5. The display panel according to any one of claims 1 to 4, wherein the display panel comprises: drive backplane; A light-emitting layer disposed on the driving backplane, the light-emitting layer comprising: a plurality of light-emitting devices, the light-emitting layer having a side wall close to the through hole; An encapsulation layer located on the side of the light-emitting layer away from the driving backplane; The through hole runs through the driving backplane, the light emitting layer and the encapsulation layer, the airgel composite material is arranged between the side wall of the light emitting layer and the hole wall of the through hole, and filled In the gap between the encapsulation layer and the driving backplane. 6. The display panel according to claim 5, further comprising: a pixel definition layer disposed on the driving backplane; The material of the pixel defining layer is the airgel composite material. 7. The display panel according to claim 1, wherein the display panel comprises: first substrate; a second substrate disposed opposite to the first substrate; a liquid crystal layer disposed between the first substrate and the second substrate, The through hole penetrates through the first substrate, the second substrate and the liquid crystal layer, and the position where the liquid crystal layer is penetrated by the through hole is sealed by the airgel composite material. 8. The display panel according to claim 7, further comprising: at least one spacer disposed between the first substrate and the second substrate; The spacer is made of the airgel composite material. 9. A method for manufacturing a display panel according to any one of claims 1 to 8, characterized in that it comprises: forming a display panel to be punched; the display panel to be punched includes a first pattern layer, and the material of the first pattern layer is an airgel composite material; cutting the display panel to be punched with a laser along a laser cutting path to form a display panel having at least one through hole, the laser cutting path being within the range defined by the first pattern layer; Wherein, the position through which the through hole penetrates is sealed by the airgel composite material. 10. The method for manufacturing a display panel according to claim 9, wherein said forming the display panel to be punched comprises: forming a first pattern layer on the driving backplane; A light-emitting layer is formed on the driving backplane on which the first pattern layer is formed, and the light-emitting layer includes: a plurality of light-emitting devices; forming an encapsulation layer on a side of the light-emitting layer away from the driving backplane; The cutting of the display panel to be punched along a laser cutting path by using a laser to form a display panel having at least one through hole includes: forming at least one through hole through the driving backplane, the light emitting layer and the encapsulation layer along the laser cutting path; The luminescent layer has a side wall close to the through hole, the airgel composite material is arranged between the side wall of the luminescent layer and the hole wall of the through hole, and is filled in the encapsulation layer and the through hole. in the gap between the drive backplanes. 11. The method for manufacturing a display panel according to claim 9, wherein said forming the display panel to be punched comprises: forming a first pattern layer on the first substrate; Encapsulating the first substrate and the second substrate in a cell, and forming a liquid crystal layer between the first substrate and the second substrate after the encapsulation of the cell; The cutting of the display panel to be punched along a laser cutting path by using a laser to form a display panel having at least one through hole includes: At least one through hole penetrating through the first substrate, the second substrate and the liquid crystal layer is formed along the laser cutting path, and the position where the liquid crystal layer is penetrated by the through hole is sealed by the airgel composite material. 12. The method for manufacturing a display panel according to claim 11, wherein the forming the display panel to be punched further comprises: forming at least one spacer on the first substrate or the second substrate ; Wherein, the material of the spacer is the airgel composite material. 13. A display device, comprising the display panel according to any one of claims 1-8.

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