CN112804818A - Circuit board for embedded camera - Google Patents
Circuit board for embedded camera Download PDFInfo
- Publication number
- CN112804818A CN112804818A CN202011636496.3A CN202011636496A CN112804818A CN 112804818 A CN112804818 A CN 112804818A CN 202011636496 A CN202011636496 A CN 202011636496A CN 112804818 A CN112804818 A CN 112804818A
- Authority
- CN
- China
- Prior art keywords
- layer
- copper layer
- copper
- circuit board
- embedded camera
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010410 layer Substances 0.000 claims abstract description 209
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 116
- 229910052802 copper Inorganic materials 0.000 claims abstract description 116
- 239000010949 copper Substances 0.000 claims abstract description 116
- 239000012790 adhesive layer Substances 0.000 claims abstract description 37
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 31
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 23
- 239000010959 steel Substances 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 description 18
- 239000010931 gold Substances 0.000 description 18
- 238000007747 plating Methods 0.000 description 15
- 238000010276 construction Methods 0.000 description 4
- 239000011241 protective layer Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000010009 beating Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
本申请公开一种内嵌相机用的线路板，其具有打金线区和柔性区；打金线区、柔性区均具有：依次叠设的第一PI层、第一胶黏层、第一铜层、绝缘层、第四铜层、第二粘结层和第二PI层；其中，打金线区还包括依次叠设的第三铜层、第一粘结层和第二铜层，第二铜层背离第一粘结层的一侧与第一PI层连接；打金线区还包括依次叠设的第五铜层、第二粘结层和第六铜层，第五铜层背离第二粘结层的一侧与第二PI层连接；打金线区还包括一贯通第三铜层、第一粘结层、第二铜层、第一PI层、第一铜层、绝缘层、第四铜层、第二PI层、第五铜层、第二粘结层以及第六铜层的贯通槽，该贯通槽的一侧设置有钢片。借由上述结构，将相机内嵌在线路板内，使该线路板具有更薄的尺寸。
The present application discloses a circuit board for an embedded camera, which has a gold wire area and a flexible area; both the gold wire area and the flexible area have: a first PI layer, a first adhesive layer, a first layer and a first layer stacked in sequence. The copper layer, the insulating layer, the fourth copper layer, the second adhesive layer and the second PI layer; wherein, the gold wire area also includes the third copper layer, the first adhesive layer and the second copper layer stacked in sequence, The side of the second copper layer away from the first adhesive layer is connected to the first PI layer; the gold wire area also includes a fifth copper layer, a second adhesive layer and a sixth copper layer stacked in sequence, and the fifth copper layer The side away from the second adhesive layer is connected to the second PI layer; the gold wire area also includes a through-through third copper layer, the first adhesive layer, the second copper layer, the first PI layer, the first copper layer, The through grooves of the insulating layer, the fourth copper layer, the second PI layer, the fifth copper layer, the second adhesive layer and the sixth copper layer, one side of the through groove is provided with a steel sheet. With the above structure, the camera is embedded in the circuit board, so that the circuit board has a thinner size.
Description
Technical Field
The application relates to a circuit board field especially relates to a circuit board that embedded camera was used.
Background
As for a circuit board used for a camera chip, other electronic devices such as a mobile phone are becoming thinner and thinner, and a space for a camera is also becoming more limited. The thickness of the sheet structure therefore determines undoubtedly the popularity of the product.
Disclosure of Invention
The technical problem that this application will be solved lies in, provides the circuit board that embedded camera was used to the not enough of prior art, and it has less thickness.
The embodiment of the application discloses circuit board that embedded camera was used, this circuit board have gold line district and flexibility district, wherein, gold line district the flexibility district all has: the first PI layer, the first adhesive layer, the first copper layer, the insulating layer, the fourth copper layer, the second adhesive layer and the second PI layer are sequentially stacked;
the gold plating line area further comprises a third copper layer, a first bonding layer and a second copper layer which are sequentially overlapped, wherein one side, which is far away from the first bonding layer, of the second copper layer is connected with the first pi layer;
the gold plating line area further comprises a fifth copper layer, a second bonding layer and a sixth copper layer which are sequentially overlapped, wherein one side of the fifth copper layer, which is far away from the second bonding layer, is connected with the second pi layer;
the gold plating line area further comprises a through groove which penetrates through the third copper layer, the first bonding layer, the second copper layer, the first pi layer, the first copper layer, the insulating layer, the fourth copper layer, the second pi layer, the fifth copper layer, the second bonding layer and the sixth copper layer, and a steel sheet is arranged on one side of the through groove.
Preferably, the steel sheet has a step portion on one side facing the gold plating line area, the gold plating line area further comprises a connecting portion, and one surface of the step portion facing the gold plating line area is fixedly connected with the gold plating line area through the connecting portion.
Preferably, the step part side surface of the steel sheet extends into the through groove and is matched with the inner wall of the through groove.
Preferably, the first pi layer and the second copper layer are of unitary construction.
Preferably, the second pi layer and the fifth copper layer are of unitary construction.
Preferably, the gold plating line area further comprises an ink layer, and the ink layer is arranged between the steel sheet and the sixth copper layer.
Preferably, the end face of the steel sheet extending into the through groove is flush with the outer side face of the connecting part.
Preferably, the connecting portion is made of ADH material.
Preferably, the through slot is laser slotted.
By means of the structure, the camera is embedded in the circuit board, so that the circuit board has a thinner size. Meanwhile, the flatness of the chip is improved by the steel sheets and the step parts of the steel sheets.
For a better understanding of the nature and technical content of the present application, reference should be made to the following detailed description and accompanying drawings, which are provided for purposes of illustration and description only and are not intended to limit the present application.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a circuit board for an embedded camera in the embodiment of the present application.
Reference numerals of the above figures: 1. an insulating layer; 2. a first copper layer; 3. a first adhesive layer; 4. a first pi layer; 5. a second copper layer; 6. a first copper sheet layer; 7. a first adhesive layer; 8. a third copper layer; 9. a second copper sheet layer; 10. a first ink layer; 11. a fourth copper layer; 12. a second adhesive layer; 13. a second pi layer; 14. a fifth copper layer; 15. a third copper sheet layer; 16. A second adhesive layer; 17. a sixth copper layer; 18. a second ink layer; 19. a connecting portion; 20. a steel sheet; 21. a through groove; 100. A gold wire making area; 101. a flexible region; 102. a connecting region.
Detailed Description
The following is a description of the embodiments of the "circuit board for embedded camera" disclosed in the present application with reference to specific embodiments, and those skilled in the art can understand the advantages and effects of the present application from the disclosure of the present application. The present application is capable of other and different embodiments and its several details are capable of modifications and variations in various respects, all without departing from the present application. The drawings in the present application are for illustrative purposes only and are not intended to be drawn to scale. The following embodiments will further explain the related art of the present application in detail, but the disclosure is not intended to limit the scope of the present application.
It will be understood that, although the terms "first," "second," "third," etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are used primarily to distinguish one element from another element or from one signal to another signal. In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be.
The embodiment of the application discloses circuit board that embedded camera was used, this circuit board have gold line district 100 and flexible region 101 of beating, wherein, gold line district 100 the flexible region 101 all has: the first pi layer 4, the first adhesive layer 3, the first copper layer 2, the insulating layer 1, the fourth copper layer 11, the second bonding layer 16 and the second pi layer 13 are sequentially stacked;
the gold plating line area 100 further comprises a third copper layer 8, a first bonding layer 7 and a second copper layer 5 which are sequentially stacked, wherein one side, which is far away from the first bonding layer 7, of the second copper layer 5 is connected with the first pi layer 4;
the gold plating line area 100 further comprises a fifth copper layer 14, a second bonding layer 16 and a sixth copper layer 17 which are sequentially stacked, wherein one side of the fifth copper layer 14, which is far away from the second bonding layer 16, is connected with the second pi layer 13;
the gold plating line area 100 further comprises a through groove 21 which is communicated with the third copper layer 8, the first bonding layer 7, the second copper layer 5, the first pi layer 4, the first copper layer 2, the insulating layer 1, the fourth copper layer 11, the second pi layer 13, the fifth copper layer 14, the second bonding layer 16 and the sixth copper layer 17, and a steel sheet 20 is arranged on one side of the through groove 21.
By means of the structure, the camera is embedded in the circuit board, so that the circuit board has a thinner size. Meanwhile, the flatness of the chip is improved by the steel sheets and the step parts of the steel sheets.
In a preferred embodiment, the gold wire area 100 further comprises a connecting portion 19 disposed on a side of the ink layer facing away from the fourth copper plate. The through groove 21 also penetrates the connection portion 19. The connection portion 19 may be made of ADH material.
The steel sheet 20 has a step portion on a side facing the gold plating line area 100, and the step portion is fixedly connected with the gold plating line area 100 through a connecting portion 19 on a surface facing the gold plating line area 100. The side wall surface of the stepped portion is bonded to the through groove 21 of the connecting portion 19. Preferably, the end face of the steel sheet 20 extending into the through slot 21 is flush with the outer side face of the ink layer.
By means of the structure, the penetrating groove 21 is arranged in the gold-plating line area 100, so that the camera is embedded in the ultrathin circuit board, and the flatness of the chip can meet the requirement through the steel sheet 20. In this embodiment, the flatness of the chip can be improved from the previous 25 μm to within 15 μm.
In particular, in order to embed the camera into the circuit board for the embedded camera, a through-groove 21 for accommodating the camera may be opened in the connection region 102. In the present embodiment, the through-groove 21 may be provided by a laser method. In particular, a picosecond machine laser cutting carbonization-free process is used. A steel sheet 20 is provided at one end of the through groove 21. The steel sheet 20 may be 316L.
Through setting up second copper layer 5 and first PI layer 4 and setting up first gluing layer 3 of integral type structure to having changed prior art, need set up gluing layer and the PI layer of integral type structure, set up the one deck protective layer again between second copper layer 5 and PI layer, thereby having reduced the thickness of product under the condition of guaranteeing product quality.
Correspondingly, on the other side of the insulating layer 1, a fourth copper layer 11 is provided. The second laminated structure comprises a fifth copper layer 14 and a second pi layer 13 in a monolithic configuration; the fifth copper layer 14 and the second pi-layer 13 are connected by a second adhesive layer 16. Through setting up fifth copper layer 14 and the second PI layer 13 of integral type structure and setting up second tie coat 16 to having changed prior art, need set up the sticky layer and the PI layer of integral type structure, set up the one deck protective layer again between fourth copper layer 11 and PI layer, thereby reduced the thickness of product under the condition of guaranteeing product quality.
In this embodiment, not only the protective layer is subtracted, but also the thicknesses of the second copper layer 5 and the fifth copper layer 14 can be changed from 12.5 μm to 7 μm.
Specifically, in the present embodiment, the insulating layer 1 may be made of a PI material. The thicknesses of the insulating layer 1, the first copper layer 2 and the second copper layer 5 can be set as required, and generally, the total thickness of the three layers is about 35 μm. The first adhesive layer 3 and the second adhesive layer 16 are both made of ADH material.
In the present embodiment, the second copper layer 5 is provided with a first adhesive layer 7 on the side facing away from the first pi-layer 4. The thickness of the first adhesive layer 7 can be adjusted from 45 μm to 35 μm. The first adhesive layer 7 may be made of ADH or PP material.
Correspondingly, the fifth copper layer 14 is provided with a second adhesive layer 16 on the side facing away from the second pi-layer 13. The thickness of the second adhesive layer 16 can be adjusted from 45 μm to 35 μm. The second adhesive layer 16 may be made of ADH or PP material. The first adhesive layer 7 is provided with a third copper layer 8 on the side facing away from the second copper layer 5. The thickness of the third copper layer 8 can be adjusted from 18 μm to 10 μm.
Preferably, a first copper plate layer 6 is provided between the second copper layer 5 and the first adhesive layer 7, the thickness of the first copper plate layer 6 being adjusted from 25 μm to 12 μm. A second copper layer 9 is arranged on the side of the third copper layer 8 facing away from the first adhesive layer 7, the thickness of the second copper layer 9 being from 10 μm.
Correspondingly, a third copper layer 15 is arranged between the fifth copper layer 14 and the second adhesive layer 16, and the thickness of the third copper layer 15 is adjusted from 25 μm to 12 μm. A fourth copper layer is provided on the side of the sixth copper layer 17 facing away from the first adhesive layer 7, the thickness of which can be adjusted from 25 μm to 10 μm.
Thus, the thickness of the wiring board for the embedded camera can be only 0.27 mm. In addition, the inner layer adopts a selective filling mode, and the whole stack structure adopts a full-blind hole design, so that more space is provided for wiring.
The embodiment of the application also discloses a preparation method of the circuit board for the embedded camera, which comprises the following steps:
sequentially laminating the first copper layer 2, the insulating layer 1 and the fourth copper layer 11 together to form a first base material layer;
forming the second copper layer 5 and the first pi layer 4 into a unitary construction to form a first sheet;
forming the fifth copper layer 14 and the second pi layer 13 into a unitary construction to form a second sheet;
laminating the first sheet, the first substrate layer and the second sheet together; wherein the first pi layer 4 of the first sheet is connected to the first copper layer 2 of the first substrate; the second pi-layer 13 of the second sheet is connected to the fourth copper layer 11 of the first substrate;
sequentially pressing a third copper layer 8 and a first bonding layer 7 on the fourth copper layer 11;
sequentially pressing a second bonding layer 16 and a sixth copper layer 17 on the fifth copper layer 14;
a penetrating through groove 21 is formed in the third copper layer 8, the first bonding layer 7, the second copper layer 5, the first pi layer 4, the first copper layer 2, the insulating layer 1, the fourth copper layer 11, the second pi layer 13, the fifth copper layer 14, the second bonding layer 16 and the sixth copper layer 17;
the steel piece 20 is inserted into the through groove 21.
The disclosure is only a preferred embodiment of the present application and is not intended to limit the scope of the claims, so that all equivalent technical changes made by using the contents of the specification and the drawings are included in the scope of the claims.
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011636496.3A CN112804818A (en) | 2020-12-31 | 2020-12-31 | Circuit board for embedded camera |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011636496.3A CN112804818A (en) | 2020-12-31 | 2020-12-31 | Circuit board for embedded camera |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112804818A true CN112804818A (en) | 2021-05-14 |
Family
ID=75808711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011636496.3A Pending CN112804818A (en) | 2020-12-31 | 2020-12-31 | Circuit board for embedded camera |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112804818A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102299124A (en) * | 2010-06-28 | 2011-12-28 | 三菱电机株式会社 | Resin sealing type electronic controlling means and producing method thereof |
| US20140374068A1 (en) * | 2013-06-21 | 2014-12-25 | Qing Gan Zeng | Method and apparatus for dissipating heat from a liquid-immersed transformer |
| CN205667019U (en) * | 2016-06-15 | 2016-10-26 | 宁波华远电子科技有限公司 | Sunken rigid -flexible printed circuit board |
| CN207053646U (en) * | 2017-08-24 | 2018-02-27 | 信利光电股份有限公司 | A kind of multi-cam module and its substrate |
| US20190356822A1 (en) * | 2016-12-27 | 2019-11-21 | Huawei Technologies Co., Ltd. | Camera Substrate Assembly, Camera Module, and Terminal Device |
-
2020
- 2020-12-31 CN CN202011636496.3A patent/CN112804818A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102299124A (en) * | 2010-06-28 | 2011-12-28 | 三菱电机株式会社 | Resin sealing type electronic controlling means and producing method thereof |
| US20140374068A1 (en) * | 2013-06-21 | 2014-12-25 | Qing Gan Zeng | Method and apparatus for dissipating heat from a liquid-immersed transformer |
| CN205667019U (en) * | 2016-06-15 | 2016-10-26 | 宁波华远电子科技有限公司 | Sunken rigid -flexible printed circuit board |
| US20190356822A1 (en) * | 2016-12-27 | 2019-11-21 | Huawei Technologies Co., Ltd. | Camera Substrate Assembly, Camera Module, and Terminal Device |
| CN207053646U (en) * | 2017-08-24 | 2018-02-27 | 信利光电股份有限公司 | A kind of multi-cam module and its substrate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5700241B2 (en) | Multilayer wiring board and manufacturing method thereof | |
| US9226382B2 (en) | Printed wiring board | |
| US20080128911A1 (en) | Semiconductor package and method for manufacturing the same | |
| TW200843068A (en) | Stacked flip-assembled semiconductor chips embedded in thin hybrid substrate | |
| US10129982B2 (en) | Embedded board and method of manufacturing the same | |
| TW201117692A (en) | Multilayer flexible printed circuit board, and method for fabricating the same | |
| WO2004105454A1 (en) | Wiring board manufacturing method | |
| TW202231924A (en) | Process for depositing a bronze alloy on a printed circuit board and printed circuit board obtained using this process | |
| US20120088334A1 (en) | Method for manufacturing semiconductor package | |
| CN214381593U (en) | Ultra-thin circuit structure | |
| TW571434B (en) | Semiconductor device and the manufacturing method of the same | |
| CN112804818A (en) | Circuit board for embedded camera | |
| CN108962843A (en) | Semiconducter IC built-in substrate and its manufacturing method | |
| CN112867242A (en) | Preparation method of circuit board for embedded camera | |
| CN112689384A (en) | Ultra-thin circuit structure | |
| US20060285301A1 (en) | Method for making a pre-laminated inlet | |
| TW201101851A (en) | Micro-electro-mechanical acoustic sensor package structure | |
| JP3329756B2 (en) | Multilayer wiring board and method of manufacturing the same | |
| JP2013145847A (en) | Printed wiring board and manufacturing method of the same | |
| CN106158672B (en) | It is embedded to the substrate and its processing method of fingerprint recognition chip | |
| CN216122982U (en) | Sandwich glue film and multilayer circuit board | |
| JP2013165149A (en) | Multilayer ceramic substrate and manufacturing method of the same | |
| JP2015219878A (en) | Composite IC card and module for composite IC card used therefor | |
| JP3943055B2 (en) | Manufacturing method of multilayer wiring board | |
| CN113488454B (en) | Packaging structure and packaging method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210514 |
|
| RJ01 | Rejection of invention patent application after publication |