CN112640115B

CN112640115B - Display device and method of manufacturing the same

Info

Publication number: CN112640115B
Application number: CN201980057882.6A
Authority: CN
Inventors: 韩昇龙; 金贤善; 朴相武
Original assignee: Samsung Electronics Co Ltd
Current assignee: Samsung Electronics Co Ltd
Priority date: 2018-09-05
Filing date: 2019-09-05
Publication date: 2025-06-06
Anticipated expiration: 2039-09-05
Also published as: EP3830874A1; KR102766406B1; EP3830874A4; KR20200027891A; CN112640115A

Abstract

A display device is provided, comprising: a plurality of display modules, each comprising a plurality of inorganic light-emitting elements mounted on a mounting surface of a substrate; a light absorption pattern formed between the plurality of display modules; and an encapsulation layer formed on the mounting surfaces of the plurality of display modules to cover the mounting surfaces of the plurality of display modules.

Description

Display device and method of manufacturing the same

Technical Field

The present disclosure relates to a display device that displays an image using a combination of modules having self-luminous inorganic light emitting elements mounted on a substrate.

Background

A display device is an output device for visually presenting data information such as characters, graphics, and the like, as well as still images or video images.

For conventional display devices, a liquid crystal panel or an Organic Light Emitting Diode (OLED) panel formed by depositing an OLED on a substrate is generally used. However, the liquid crystal panel has a slow response time and high power consumption, and is difficult to compact because it cannot emit light by itself and requires a backlight. OLED panels also have problems of short life and poor productivity. Accordingly, as a new type of panel replacing them, micro LED panels having inorganic light emitting elements mounted on a substrate and using the inorganic light emitting elements themselves as pixels are being studied.

The micro LED panel can be designed to be compact and slim because it does not require a backlight and can have a minimized bezel portion and have good properties in terms of brightness, resolution, power consumption, and durability.

Further, since a complicated process is not required except for a process of picking up an inorganic light emitting element from a wafer and transferring it onto a substrate, the micro LED panel can be manufactured to have various resolutions and sizes, and the micro LED panel can realize a large screen by putting unit panels together. However, when the unit panels are put together, a gap is generated at the joint between the panels, which may deteriorate the image quality.

Disclosure of Invention

Technical problem

The present disclosure provides a display device and a method of manufacturing the same, by which image degradation that may otherwise occur due to seams between a plurality of display modules when display panels are put together to realize a large screen can be minimized.

Technical proposal

According to an aspect of the present disclosure, there is provided a display apparatus including a plurality of display modules each including a substrate and a plurality of inorganic light emitting elements mounted on a mounting surface of the substrate, a light absorbing pattern formed to cover gaps between the plurality of display modules, and an encapsulation layer formed on the mounting surfaces of the plurality of display modules to cover the mounting surfaces of the plurality of display modules.

The light absorbing pattern may include a form of intersecting stripes.

The substrate may include an anisotropic conductive layer for electrically connecting the contact electrodes of the plurality of inorganic light emitting elements to the pad electrodes of the substrate.

The light absorbing pattern may be formed on the anisotropic conductive layer.

The encapsulation layer may be formed to cover the light absorption pattern.

The substrate may include a glass substrate, and a Thin Film Transistor (TFT) layer formed on the glass substrate.

The encapsulation layer may include a transparent molding resin made of at least one of an acrylic resin, a polyimide resin, an epoxy resin, a polyurethane resin, or a silicone resin.

The encapsulation layer may include an optical adhesive made of one of an Optically Clear Adhesive (OCA) and an Optically Clear Resin (OCR).

The display device may further include a cover glass attached to the optical adhesive.

The display device may further include an auxiliary light absorption pattern formed between the plurality of inorganic light emitting elements.

The display apparatus may further include a rear cover for supporting the plurality of display modules.

The substrate may include a light absorbing layer integrally formed on the mounting surface to enhance contrast by absorbing external light.

According to another aspect of the present disclosure, there is provided a method for manufacturing a display device, the method including preparing a plurality of display modules each formed with a plurality of inorganic light emitting elements mounted on a mounting surface of a substrate, arranging the plurality of display modules adjacent to each other, forming a light absorption pattern to cover a gap formed between the plurality of display modules, and forming an encapsulation layer on the mounting surfaces of the plurality of display modules to cover the mounting surfaces of the plurality of display modules.

The plurality of inorganic light emitting elements mounted on the mounting surface of the substrate may be obtained by picking up the plurality of inorganic light emitting elements from the wafer and transferring the plurality of inorganic light emitting elements onto the substrate.

Arranging the plurality of display modules adjacent to each other may include arranging the plurality of display modules in an mxn matrix.

The method may further include forming an auxiliary light absorption pattern between the plurality of inorganic light emitting elements.

Forming the light absorption pattern between the plurality of display modules and forming the auxiliary light absorption pattern between the plurality of light emitting elements may be performed simultaneously.

Forming the encapsulation layer may include applying a transparent molding resin made of at least one of an acrylic resin, a polyimide resin, an epoxy resin, a polyurethane resin, or a silicone resin to the mounting surfaces of the plurality of display modules.

Forming the encapsulation layer may include adhering an optical adhesive made of one of Optically Clear Adhesive (OCA) and Optically Clear Resin (OCR) to the mounting surfaces of the plurality of display modules.

The method may further include attaching a cover glass to the optical adhesive.

Advantageous effects of the invention

The display device may have a seamless effect of making the seam between adjacent display modules invisible because light entering the gap is absorbed by the light absorbing pattern.

According to the embodiments of the present disclosure, the display device may have an encapsulation layer formed together after assembling a plurality of display modules, thereby more easily and effectively obtaining a seamless effect.

Drawings

FIG. 1 illustrates a display device omitting a light absorbing layer, a light absorbing pattern, and an encapsulation layer according to an embodiment of the present disclosure;

Fig. 2 is an exploded view of the main structure of the display device shown in fig. 1;

FIG. 3 is a cross-sectional view of a plurality of display modules of the display device of FIG. 1;

fig. 4 illustrates an inorganic light emitting element mounting structure according to an embodiment of the present disclosure;

Fig. 5 illustrates an inorganic light emitting element mounting structure according to another embodiment of the present disclosure;

fig. 6 is a cross-sectional view of a structure in which light absorbing patterns are formed between a plurality of display modules of the display apparatus of fig. 1;

Fig. 7 is a perspective view of a structure in which light absorbing patterns are formed between a plurality of display modules of the display apparatus of fig. 1;

Fig. 8 is a cross-sectional view of a structure in which an encapsulation layer (mold resin) is formed on a plurality of display modules of the display device of fig. 1;

Fig. 9 is a flowchart illustrating a method for manufacturing a display device according to an embodiment of the present disclosure;

fig. 10 is a cross-sectional view of a structure in which light absorption patterns and auxiliary light absorption patterns are formed between a plurality of display modules and between a plurality of inorganic light emitting elements of a display device according to another embodiment of the present disclosure;

fig. 11 is a perspective view of a structure in which light absorption patterns and auxiliary light absorption patterns are formed between a plurality of display modules and between a plurality of inorganic light emitting elements of the display device of fig. 10;

fig. 12 is a cross-sectional view of a structure in which an encapsulation layer (mold resin) is formed on a plurality of display modules of the display device of fig. 10;

fig. 13 is a flowchart illustrating a method for manufacturing a display device according to another embodiment of the present disclosure;

fig. 14 is an exploded view of a main structure of a display device according to another embodiment of the present disclosure;

Fig. 15 is a sectional view of a structure in which an encapsulation layer (optical adhesive) is formed on the mounting surfaces of a plurality of display modules of the display device of fig. 14, and

Fig. 16 is a cross-sectional view of a structure in which an encapsulation layer (optical adhesive) and cover glass are attached to mounting surfaces of a plurality of display modules of a display device according to an embodiment of the present disclosure.

Detailed Description

Embodiments of the present disclosure are provided to assist in a comprehensive understanding of the present disclosure as defined in the claims and their equivalents. Accordingly, one of ordinary skill in the art will recognize that various changes and modifications of the embodiments described herein can be made without departing from the scope and spirit of the present disclosure.

As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Elements of the figures are drawn in exaggerated form and size for clarity.

It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

Reference will now be made in detail to embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout.

Fig. 1 illustrates a display device omitting a light absorbing layer, a light absorbing pattern, and an encapsulation layer according to an embodiment of the present disclosure. Fig. 2 is an exploded view of the main structure of the display device shown in fig. 1. Fig. 3 is a cross-sectional view of a plurality of display modules of the display device of fig. 1. Fig. 4 illustrates an inorganic light emitting element mounting structure according to an embodiment of the present disclosure. Fig. 5 illustrates an inorganic light emitting element mounting structure according to another embodiment of the present disclosure. Fig. 6 is a cross-sectional view of a structure in which a light absorbing pattern is formed between a plurality of display modules of the display apparatus of fig. 1. Fig. 7 is a perspective view of a structure in which a light absorbing pattern is formed between a plurality of display modules of the display apparatus of fig. 1. Fig. 8 is a cross-sectional view of a structure in which an encapsulation layer (mold resin) is formed on a plurality of display modules of the display device of fig. 1.

The display device 1 may be a device for displaying information, materials, data, etc. in characters, figures, diagrams, images, etc., and may be implemented as a television, a personal computer, a mobile device, a digital signage, etc.

In an embodiment of the present disclosure, the display apparatus 1 may include a display panel 20 for displaying an image, a frame 21 for supporting the display panel 20, and a rear cover 10 for covering a back of the frame 21, as shown in fig. 2.

The display panel 20 may include a plurality of display modules 30A to 30L, a light absorbing pattern 80 formed between the plurality of display modules 30A to 30L, and an encapsulation layer 90 formed on the plurality of display modules 30A to 30L to cover the plurality of light emitting elements 50, and the mounting surfaces of the display modules 30A to 30L.

The rear cover 10 may support the display panel 20. The rear cover 10 may be mounted on the floor by a bracket (not shown) or on a wall by a hanger (not shown). The display apparatus 1 may include a power source (not shown) for supplying power to the plurality of display modules 30A to 30L and a control board 25 for controlling the operation of the plurality of display modules 30A to 30L.

The plurality of display modules 30A to 30L may be vertically and horizontally arranged adjacent to each other. The plurality of display modules 30A to 30L may be arranged in the form of an mxn matrix. In the embodiment of the present disclosure, there are 12 display modules 30A to 30L arranged in a4×3 matrix, but the number and arrangement scheme of the display modules 30A to 30L are not limited thereto.

A plurality of display modules 30A to 30L may be mounted in the frame 21. The plurality of display modules 30A-30L may be mounted in the frame 21 in various known methods, such as magnetic force using magnets, mechanical assembly structure, etc. The rear cover 10 may be coupled to the back of the frame 21, and thus may form the back profile of the display apparatus 1.

The display apparatus 1 can realize a large screen by stitching the plurality of display modules 30A to 30L.

The plurality of display modules 30A to 30L may all have the same structure. Thus, the description of one display module may apply equally to any other display module.

For example, the display module 30A may include a substrate 40 and a plurality of light emitting elements 50 mounted on the substrate 40. The substrate 40 may include a base substrate 42 and a Thin Film Transistor (TFT) layer 43 formed on the base substrate 42 to drive the inorganic light emitting element 50. The base substrate 42 may include a glass substrate. For example, the substrate 40 may include a Chip On Glass (COG) type substrate. A first pad electrode 44a and a second pad electrode 44b for electrically connecting the inorganic light emitting element 50 may be formed on the substrate 40.

The plurality of inorganic light emitting elements 50 may be formed of an inorganic material, and may include inorganic light emitting elements having a size of several micrometers (μm) to hundreds of micrometers in each of width, length, and height. The shortest one of the width, length and height of the micro-inorganic light emitting element may have a size of 100 μm or less. A plurality of inorganic light emitting elements 50 may be picked up from a silicon wafer and transferred directly onto the substrate 40. The plurality of inorganic light emitting elements 50 may be picked up and transferred by an electrostatic method using an electrostatic head, or an adhesion method using an elastic polymer substance such as PDMS, silicon, or the like as a head.

The plurality of inorganic light emitting elements 50 may be a light emitting structure including an n-type semiconductor, an active layer, a p-type semiconductor, a first contact electrode 57a, and a second contact electrode 57b, and may have a flip chip form in which the first contact electrode 57a and the second contact electrode 57b are arranged in the same direction (a direction opposite to the light emitting direction).

The inorganic light emitting element 50 may have a light emitting surface 54, a side surface 55, and a bottom surface 56, and the first contact electrode 57a and the second contact electrode 57b may be formed on the bottom surface 56.

The first and second contact electrodes 57a and 57b may be electrically coupled to the first and second pad electrodes 44a and 44b, respectively, and formed on the mounting surface 41 of the substrate 40.

The substrate 40 may include an anisotropic conductive layer 70, and the anisotropic conductive layer 70 is formed as a medium of electrical connection between the contact electrodes 57a and 57b and the pad electrodes 44a and 44 b. The anisotropic conductive layer 70 may have an anisotropic conductive adhesive adhered on the protective film, and may have a structure in which conductive balls 71 are distributed in an adhesive resin. The conductive balls 71 each have a conductive spherical body covered with a thin insulating film, and when the insulating film is broken by pressure, the conductive balls 71 may be able to electrically join two conductors together.

The anisotropic conductive layer 70 may include an Anisotropic Conductive Film (ACF) in a film form and an Anisotropic Conductive Paste (ACP) in a paste form.

Accordingly, when the anisotropic conductive layer 70 is pressurized while the plurality of inorganic light emitting elements 50 are mounted on the substrate 40, the insulating film of the conductive balls is broken, thereby allowing the contact electrodes 57a and 57b of the inorganic light emitting elements 50 to be electrically bonded with the pad electrodes 44a and 44b of the inorganic light emitting elements 50.

Alternatively, the plurality of inorganic light emitting elements 50 may be mounted on the substrate 40 by solder instead of the anisotropic conductive layer 70 (see fig. 5). After the inorganic light emitting element 50 is arranged on the substrate 40, the inorganic light emitting element 50 may be bonded to the substrate 40 by a reflow process.

The plurality of inorganic light emitting elements 50 may include a red light emitting element 51, a green light emitting element 52, and a blue light emitting element 53, and may be mounted on the mounting surface 41 of the substrate 40 in groups of the red light emitting element 51, the green light emitting element 52, and the blue light emitting element 53. A set of a red light emitting element 51, a green light emitting element 52, and a blue light emitting element 53 may form a pixel. The red light emitting element 51, the green light emitting element 52, and the blue light emitting element 53 may each form a sub-pixel.

The red light emitting elements 51, the green light emitting elements 52, and the blue light emitting elements 53 may be arranged in a row at intervals or in any other form such as a triangle form.

The substrate 40 may include a light absorbing layer 60 to enhance contrast by absorbing external light. The light absorbing layer 60 may be formed on the entire mounting surface of the substrate 40 using the same material as the light absorbing pattern 80 to be described later. The light absorbing layer 60 may be formed between the TFT layer 43 and the anisotropic conductive layer 70.

Referring to fig. 1 and 3, in the display apparatus 1, when the plurality of display modules 30A to 30L are spliced, a gap G may be formed between the plurality of display modules 30A to 30L. Scattered reflection of light occurs in the gap G, thereby creating a feeling of strangeness and degrading image quality.

Therefore, according to an embodiment of the present disclosure, the display panel 20 may include the light absorbing pattern 80 formed between the plurality of display modules 30A to 30L to prevent generation of an abnormal sense and degradation of image quality due to the seam exposed by the gap G between the plurality of display modules 30A to 30L.

As described above, since the display modules 30A to 30L are vertically and horizontally arranged in the form of an mxn matrix, the light absorbing pattern 80 may be formed as a cross stripe or grid pattern including the horizontal pattern 81 and the vertical pattern 82 (see fig. 7). The light absorbing pattern 80 may physically fill the gap G between the plurality of display modules 30A to 30L.

For example, the light absorbing pattern 80 may be formed to cover the gap G between the adjacent plurality of display modules 30A to 30L. The light absorbing pattern 80 may be formed on the substrate 40 of the display module 30A and on the substrate 40 of the display module 30D. Specifically, the light absorbing pattern 80 may be formed on the anisotropic conductive layer 70 of the display module 30A and on the anisotropic conductive layer 70 of the display module 30D.

The light absorbing pattern 80 may be formed on the anisotropic conductive layer 70 of the plurality of display modules 30 and thus between the anisotropic conductive layer 70 and the encapsulation layer 90.

Alternatively, the light absorbing pattern 80 may be formed to be filled in the gap G between the adjacent display modules 30A and 30D. Some light absorbing patterns 80 may be formed on the substrate 40 to cover the gap G, and some light absorbing patterns 80 may be formed in the gap G to fill the gap G.

The light absorbing pattern 80 may include a black inorganic material, a black organic material, a black metal, etc., which absorb light well to maximize the light absorbing effect.

For example, the light absorbing pattern 80 may be formed of a material such as carbon black, a polyene pigment, an azo pigment, an azomethine pigment, a diammonium pigment, a phthalocyanine pigment, a quinone pigment, an indigo pigment, a thioindigo pigment, a dioxazine pigment, a quinacridone pigment, an isoindolinone pigment, a metal oxide, a metal complex, an aromatic hydrocarbon, or the like.

The light absorbing pattern 80 may be formed by applying light absorbing ink between the plurality of display modules 30A to 30L and hardening the ink. Alternatively, the light absorbing pattern 80 may be formed by coating a light absorbing film between the plurality of display modules 30A to 30L.

In the embodiment of the present disclosure, after the light absorbing pattern 80 is formed between the plurality of display modules 30A to 30L, the encapsulation layer 90 may be formed on the plurality of display modules 30A to 30L to cover the plurality of inorganic light emitting elements 50, and the mounting surface 41 of the substrate.

According to a conventional technique for realizing a large screen by stitching, a display panel is manufactured by forming an encapsulation layer for each display module to protect a plurality of inorganic light emitting elements thereon, and then stitching the plurality of display panels to realize a large screen. In this case, a gap is formed even between adjacent encapsulation layers, and in order to recognize a seam caused by the gap between the encapsulation layers and solve the generation of an abnormal feeling and the degradation of image quality due to the gap, a side light absorbing layer is sometimes formed on the side of the encapsulation layer. However, this process is very challenging and complex.

To solve this problem, according to an embodiment of the present disclosure, a plurality of display modules 30A to 30L are first adjacently arranged, and then the encapsulation layer 90 is commonly formed on the entire area of the mounting surface 41 of the display modules 30A to 30L. The encapsulation layer 90 may be formed to cover the light absorbing pattern 80.

Therefore, since the encapsulation layer 90 is formed at one time on all of the display modules 30A to 30L, no gap is formed in the region of the encapsulation layer 90. Therefore, when a large screen is realized by stitching, a seamless effect can be more easily and effectively obtained.

In addition, the complete packaging of the plurality of display modules 30A to 30L may also have the effect of putting the plurality of display modules 30A to 30L together.

The encapsulation layer 90 may be formed by applying a transparent mold resin on the plurality of display modules 30A to 30L and hardening the mold resin. The molding resin may include a translucent material or a fluorescent material, such as an acrylic resin, a polyimide resin, an epoxy resin, a polyurethane resin, which is liquid at room temperature. The mold resin may be cured by hardening, thereby physically protecting the phosphor element 50.

Fig. 9 is a flowchart illustrating a method for manufacturing a display device according to an embodiment of the present disclosure.

Referring to fig. 1 to 9, a method for manufacturing a display device according to an embodiment of the present disclosure will be briefly described.

First, in 210, a plurality of display modules 30A to 30L are prepared. Each of the plurality of display modules 30A to 30L may be formed by mounting a plurality of inorganic light emitting elements 50 on the mounting surface 41 of the substrate 40. To have enhanced contrast, the substrate 40 may include a light absorbing layer 60. The substrate 40 may include an anisotropic conductive layer 70 to easily bond the plurality of inorganic light emitting elements 50 to the substrate 40.

Next, in 220, the plurality of display modules 30A to 30L may be arranged adjacent to each other. The plurality of display modules 30A to 30L may be fixed by a jig (sig). The plurality of display modules 30A to 30L may be arranged in the form of an mxn matrix.

Next, in 230, a light absorbing pattern 80 may be formed between the plurality of display modules 30A to 30L. By filling the gap G between the plurality of display modules 30A to 30L, the light absorbing pattern 80 can prevent scattered reflection and leakage of light and obtain a seamless effect.

Subsequently, in 240, an encapsulation layer 90 may be formed on the plurality of display modules 30A to 30L to cover and protect the plurality of inorganic light emitting elements 50. In forming the encapsulation layer 90, the plurality of display modules 30A to 30L are not separately encapsulated but are integrally encapsulated, thereby preventing formation of gaps in the region of the encapsulation layer 90. The display panel 20 thus formed is mounted in the frame 21.

Fig. 10 is a cross-sectional view of a structure in which light absorption patterns and auxiliary light absorption patterns are formed between a plurality of display modules and between a plurality of inorganic light emitting elements of a display device according to another embodiment of the present disclosure. Fig. 11 is a perspective view of a structure in which light absorption patterns and auxiliary light absorption patterns are formed between a plurality of display modules and between a plurality of inorganic light emitting elements of the display device of fig. 10. Fig. 12 is a cross-sectional view of a structure in which an encapsulation layer (mold resin) is formed on a plurality of display modules of the display device of fig. 10.

Referring to fig. 10 to 12, a display device 201 according to another embodiment of the present disclosure will be described. Features identical to those of the foregoing embodiments are denoted by identical reference numerals, and overlapping descriptions will not be repeated.

Unlike the previous embodiment, the display panel 20 may further include an auxiliary light absorption pattern 100 formed between the plurality of inorganic light emitting elements 50 in addition to the light absorption pattern 80 formed between the plurality of display modules 30A to 30L.

The auxiliary light absorbing pattern 100 may be used to supplement the light absorbing layer 60 integrally formed on the mounting surface 41 of the substrate 40. For example, the auxiliary light absorbing pattern 100 may absorb external light such that the substrate 40 looks black, thereby enhancing the contrast of the screen.

Similar to the light absorbing layer 60 and the light absorbing pattern 80, the auxiliary light absorbing pattern 100 may have black.

In this embodiment, the auxiliary light absorbing pattern 100 may be formed to be arranged between pixels, each of which includes a set of red light emitting elements 51, green light emitting elements 52, and blue light emitting elements 53. Alternatively, the auxiliary light absorbing pattern 100 may be more finely formed to separate each sub-pixel, i.e., each of the light emitting elements 51, 52, and 53.

The auxiliary light absorbing pattern 100 may be formed in a cross stripe pattern including a horizontal pattern 101 and a vertical pattern 102 disposed between pixels. The auxiliary light absorbing pattern 100 may be formed in a similar manner to the light absorbing pattern 80. For example, the auxiliary light absorbing pattern 100 may be formed by applying light absorbing ink and then hardening the light absorbing ink, or by coating a light absorbing film.

In this way, since the auxiliary light absorbing pattern 100 may be formed using the same material and the same method as the light absorbing pattern 80, the auxiliary light absorbing pattern 100 and the light absorbing pattern 80 may be simultaneously formed in a single process. Accordingly, the manufacturing process of the display device can be simplified and easier.

Fig. 13 is a flowchart illustrating a method for manufacturing a display device according to another embodiment of the present disclosure.

Referring to fig. 10 to 13, a method for manufacturing a display device according to another embodiment of the present disclosure will be briefly described.

First, in 210, a plurality of display modules 30A to 30L are prepared. Each of the plurality of display modules 30A to 30L may be formed by mounting a plurality of inorganic light emitting elements on the substrate 40. To have enhanced contrast, the substrate 40 may include a light absorbing layer 60. The substrate 40 may include an anisotropic conductive layer 70 to easily bond the plurality of inorganic light emitting elements 50 to the substrate 40.

Next, in 220, the plurality of display modules 30A to 30L may be arranged adjacent to each other. The plurality of display modules 30A to 30L may be fixed by a jig. The plurality of display modules 30A to 30L may be arranged in the form of an mxn matrix.

Next, in 330, a light absorbing pattern 80 may be formed between the plurality of display modules 30A to 30L. By filling the gap G between the plurality of display modules 30A to 30L, the light absorbing pattern 80 can prevent scattered reflection and leakage of light and obtain a seamless effect.

In this regard, the auxiliary light absorption pattern 100 may be formed between the plurality of inorganic light emitting elements 50. The auxiliary light absorbing pattern 100 may absorb external light, thereby enabling the display device 201 to generate a clearer image. The auxiliary light absorbing pattern 100 may be formed using the same material and the same method as the light absorbing pattern 80. Accordingly, the light absorbing pattern 80 and the auxiliary light absorbing pattern 100 may be simultaneously formed in a single process.

Fig. 14 is an exploded view of the main structure of a display device according to another embodiment of the present disclosure. Fig. 15 is a cross-sectional view of a structure in which an encapsulation layer (optical adhesive) is formed on the mounting surfaces of a plurality of display modules of the display device of fig. 14. Fig. 16 is a cross-sectional view of a structure in which an encapsulation layer (optical adhesive) and cover glass are attached to mounting surfaces of a plurality of display modules of a display device according to an embodiment of the present disclosure.

Referring to fig. 14 to 16, display devices 301, 401 according to another embodiment of the present disclosure will be described.

Unlike the previous embodiments of the present disclosure, the optical adhesive 190 may be used for the encapsulation layer instead of molding resin.

For the optical adhesive 190, an Optically Clear Adhesive (OCA) or an Optically Clear Resin (OCR) may be used. When the transmittance of OCA and OCR is greater than about 90%, they may be in a very transparent state.

Both OCA and OCR can improve their transmittance through low reflectivity characteristics, thereby improving visibility and image quality. Although the structure having the air gap causes light loss due to the refractive index difference between the film layer and the air layer, the structure using OCA or OCR can reduce light loss because the refractive index difference between the film layer and the optical adhesive layer is reduced, thereby improving visibility and image quality.

In other words, OCA and OCR can simply join adjacent component layers and also have benefits in improving image quality.

Except that in this process OCA and OCR are applied in film form and liquid form, respectively.

When the optical adhesive 190 is used for the encapsulation layer, a cover glass 191 may be attached to the optical adhesive 190 to physically protect the plurality of inorganic light emitting elements 50.

Even when the optical adhesive 190 is used for the encapsulation layer, the light absorbing pattern 80 may be formed between the plurality of display modules 30A to 30L as shown in fig. 14 and 15. Further, a light absorption pattern 80 may be formed between the plurality of display modules 30A to 30L, and an auxiliary light absorption pattern 100 may be formed between the plurality of inorganic light emitting elements 50, as shown in fig. 16.

According to embodiments of the present disclosure, the display device may have a seamless effect of making a seam between adjacent display modules invisible because light entering the gap is absorbed by the light absorbing pattern.

While several embodiments have been described above, those of ordinary skill in the art will understand and appreciate that various modifications can be made without departing from the scope of the disclosure. It is therefore obvious to a person skilled in the art that the true scope of the technical protection is only limited by the appended claims.

Claims

1. A display device, comprising:

a plurality of display modules, each comprising a substrate and a plurality of inorganic light emitting elements mounted on a mounting surface of the substrate;

a light absorption pattern formed to cover gaps between the plurality of display modules; and

an encapsulation layer, which is formed together on the entire area of the mounting surface of the plurality of display modules to cover the mounting surface of the substrate of each of the plurality of display modules and the plurality of inorganic light-emitting elements of each of the plurality of display modules,

The substrate of each of the plurality of display modules comprises an anisotropic conductive layer on the mounting surface, the anisotropic conductive layer being used to electrically connect the contact electrodes of the plurality of inorganic light-emitting elements to the pad electrodes of the substrate, and

The light absorption pattern is formed between the anisotropic conductive layer and the encapsulation layer, and is covered by the encapsulation layer.

2 . The display device according to claim 1 , wherein the light absorption pattern has a form of crossed stripes.

3 . The display device according to claim 1 , wherein the substrate comprises a glass substrate, and a thin film transistor (TFT) layer formed on the glass substrate.

4 . The display device of claim 1 , wherein the encapsulation layer comprises a transparent mold resin made of at least one of acrylic resin, polyimide resin, epoxy resin, polyurethane resin, or silicone resin.

5 . The display device of claim 1 , wherein the encapsulation layer comprises an optical adhesive made of one of an optically transparent adhesive (OCA) and an optically transparent resin (OCR).

The display device according to claim 5 , further comprising: a cover glass attached to the optical adhesive.

7 . The display device according to claim 1 , further comprising: an auxiliary light absorption pattern formed between the plurality of inorganic light emitting elements.

8 . The display device according to claim 1 , further comprising a back cover for supporting the plurality of display modules.

9 . The display device according to claim 1 , wherein the substrate comprises a light absorbing layer integrally formed on the mounting surface to enhance contrast by absorbing external light.