CN112601166A

CN112601166A - Screen, electronic equipment and screen preparation method

Info

Publication number: CN112601166A
Application number: CN202011472384.9A
Authority: CN
Inventors: 谢华飞
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2020-12-14
Filing date: 2020-12-14
Publication date: 2021-04-02
Also published as: WO2022127666A1

Abstract

Embodiments of the present application provide a screen, an electronic device and a method for preparing the screen, which belong to the technical field of communications. The screen includes: a substrate, at least one display chip, a magnetic member, a support member, and a coil; the substrate is fixedly connected to the magnetic member through the support member, and a accommodating space is formed between the substrate and the magnetic member, and the substrate has oppositely arranged first sides and a second side surface, the first side surface is located in the accommodating space, and the second side surface is located outside the accommodating space; the coil is arranged on the first side surface, and at least one display chip is arranged on the second side surface. In the embodiment of the present application, the coil is integrated on the back of the substrate of the display panel, and the magnetic element and the coil drive the substrate to vibrate and emit sound, without additionally disposing a vibrating membrane, simplifying the screen structure and avoiding occupying too much internal space of the electronic device.

Description

Screen, electronic equipment and screen preparation method

Technical Field

The embodiment of the application relates to the technical field of communication, in particular to a screen, electronic equipment and a screen preparation method.

Background

The principle of the speaker is that a current passes through a coil in a magnetic circuit composed of magnets, and a driving force is generated in the up and down directions to vibrate a vibrating body, which in turn vibrates air and generates sound.

At present, some electronic devices employ internal speakers, that is, the speakers are disposed inside the electronic devices, and a screen sound generating technology is used to transmit sound.

Although the screen is used as a vibration layer in the current screen sounding technology, the main components still need to be below the screen, and the main components occupy more internal space of the electronic device.

Disclosure of Invention

The embodiment of the application aims to provide a screen, electronic equipment and a screen preparation method, and the problem that the existing screen sounding technology occupies more internal space of the electronic equipment can be solved.

In a first aspect, an embodiment of the present application provides a screen, including: the display device comprises a substrate, at least one display chip, a magnetic part, a support part and a coil;

the substrate is fixedly connected with the magnetic part through the supporting part, an accommodating space is formed between the substrate and the magnetic part, the substrate is provided with a first side surface and a second side surface which are oppositely arranged, the first side surface is positioned in the accommodating space, and the second side surface is positioned outside the accommodating space;

the coil is arranged on the first side face, and the at least one display chip is arranged on the second side face.

In a second aspect, an embodiment of the present application provides an electronic device, including the screen as described in the first aspect.

In a second aspect, embodiments of the present application provide a method for manufacturing a screen, where the screen includes a substrate, at least one display chip, a magnetic member, a support member, and a coil, where the substrate has a first side and a second side opposite to each other;

the method comprises the following steps:

preparing the coil on the first side of the substrate;

turning over the substrate, and preparing at least one display chip on the second side of the substrate;

the magnetic part is fixedly connected with the first side face of the substrate through the supporting part.

In the embodiment of this application, with the coil integration at display panel's the base plate back, compare current screen sound production technique by magnetic part and coil direct drive base plate vibration sound production, need not additionally to set up the vibrating diaphragm, simplify the screen structure, avoid taking up too much electronic equipment inner space.

Drawings

FIG. 1 is a schematic diagram of a conventional speaker configuration and two existing screen sounding configurations;

fig. 2 is a schematic structural diagram of a screen according to an embodiment of the present application;

fig. 3 is a second schematic structural diagram of a screen according to an embodiment of the present application;

fig. 4a is a schematic structural relationship diagram of a display chip and a spacer according to an embodiment of the present disclosure;

FIG. 4b is a schematic diagram of a coil arrangement provided by an embodiment of the present application;

fig. 4c is a schematic view of an application scenario provided in the embodiment of the present application;

FIG. 5a is a schematic flow chart of a screen manufacturing method according to an embodiment of the present disclosure;

fig. 5b is a second schematic flow chart of a screen manufacturing method according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be practiced in sequences other than those illustrated or described herein, and that the terms "first," "second," and the like are generally used herein in a generic sense and do not limit the number of terms, e.g., the first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

Referring to fig. 1, a conventional speaker configuration is shown along with two prior art screen sound generation techniques. The left side view in fig. 1 is a conventional speaker structure, comprising: the device comprises an elastic support 01, a vibrating diaphragm 02, a coil 03 and a magnetic block 04; the views in the middle and right of fig. 1 are of a prior art screen sound structure, and in one aspect the structure comprises: elastic support 01, vibrating diaphragm 02, coil 03, magnetic path 04, center 05, the structure includes in another scheme: middle frame 05, magnet 06, coil 07, oscillator spring and damping 08.

The existing Display panel technology adopts a Liquid Crystal Display (LCD) or an Organic Light-Emitting Diode (OLED) technology, the LCD adopts an upper cover plate glass and a lower Thin Film Transistor (TFT) to drive a glass-packaged Liquid Crystal (LC) and a backlight to Display, and the upper and lower glasses need to be sealed and attached, so that the upper and lower glasses are difficult to be used as a vibration surface to sound; the OLED is made of organic matters which are sensitive to water and oxygen and need extremely high packaging conditions for blocking water and oxygen, and the long-term vibration can destroy the isolation performance of the film layer, so that the OLED is not suitable for serving as a vibration layer.

The following describes the screen provided in the embodiments of the present application in detail through specific embodiments and application scenarios thereof with reference to the accompanying drawings.

Referring to fig. 2 and 3, an embodiment of the present application provides a screen including: a substrate 11, at least one display chip 12, a magnetic member 2, a support member 3, and a coil 4; the substrate 11 is made of glass, quartz, plastic and the like, the display chip 12 is used for displaying each pixel point of the screen, and the substrate 11 and the at least one display chip 12 jointly form the display panel 1.

The substrate 11 is fixedly connected with the magnetic member 2 through the support member 3, and an accommodating space 5 is formed between the substrate 11 and the magnetic member 2, the substrate 11 has a first side surface 111 and a second side surface 112 which are oppositely arranged, the first side surface 111 is located in the accommodating space 5, and the second side surface 112 is located outside the accommodating space 5;

the coil 4 is arranged at the first side 111 and the at least one display chip 12 is arranged at the second side 112.

It can be understood that, after the screen is installed on the electronic device, the coil 4 can be connected to the internal control circuit of the electronic device, so that, when the device is in operation, the driving substrate 11 can vibrate and sound by controlling the current inside the coil 4 and matching with the magnetic member 2.

In fig. 2, the double-headed arrows indicate that the display panel 1 receives the acting force and the reaction force of the magnetic member 2 and the coil 4, and the direction is perpendicular to the front-back direction of the magnetic member 2; the dotted line and the one-way arrow indicate the sound emitting direction, specifically the direction of sound diffusion outward, and the magnetic member 2, the accommodating space 5, the supporting member 3, the coil 4 and the display panel 1 together constitute a speaker structure.

Like this, with the coil integration at display panel's the base plate back, compare current screen sound production technique by magnetic part and coil direct drive base plate vibration sound production, need not additionally to set up the vibrating diaphragm, simplify the screen structure, avoid taking up too much electronic equipment inner space.

In some embodiments, the display chip 12 is a Micro Light Emitting Diode (Micro LED) chip, that is, in the embodiment of the present application, a Micro LED display panel is used as the display panel in the screen.

In the Micro LED display, the bonding of the LED chip is directly performed on the driving substrate (i.e., the substrate 11), and the LED chip emits light by using an inorganic material, so that the Micro LED display has the advantages of water and oxygen resistance, high stability, high efficiency, and the like.

In particular, with continued reference to fig. 3, in some embodiments, the screen further comprises: the number of the display chips 12, the number of the TFTs 13 and the number of the metal wirings 14 are the same;

each display chip 12 is fixed to the second side by one TFT 13 and one metal trace 14.

In the embodiment of the present application, in a specific manufacturing process of the display panel 1, the TFT 13 and the metal trace 14 are manufactured on the substrate 11, and then the display chip 12 is bonded to the TFT 13 and the metal trace 14, so as to drive and conduct the display chip 12.

Referring to fig. 4a, in some embodiments, spacers 120 are disposed between adjacent display chips 12. Specifically, fig. 4a illustrates a scene in which the display chips 12 correspond to red, green and blue pixels, where R represents red, G represents green and B represents blue, and the spacers 120 are disposed in the spacing regions between the display chips 12, so as to prevent R, G, B color cross-talk; alternatively, the spacers 120 may be referred to as spacer pillars or Black Matrix (BM).

Referring to fig. 4b, further, the coils 4 are distributed in the orthographic projection area of the spacer 120 on the second side 112. It should be noted that, for clarity, the coil 4, the display chip 12 and the spacer 120 are shown in fig. 4b at the same time, and in an actual application scenario, the coil 4, the display chip 12 and the spacer 120 are located on two opposite sides of the substrate 11.

In the embodiment of the present application, the coil 4 is prepared on the back side of the spacing region of the display chip 12 (i.e., where the spacer 120 blocks) so that neither bottom emission nor top emission of the display chip 12 affects the R/G/B pixel display.

In some embodiments, the pattern of the coil 4 may be a zigzag pattern (as shown in fig. 4 b), a zigzag pattern, and the like, and the pattern of the coil 4 is not particularly limited in the examples of the present application.

Referring to fig. 4c, in some embodiments, the coils 4 may be disposed only in a local area of the second side surface 112, that is, the entire screen, for example, the left diagram in fig. 4c, the coils 4 are disposed in the lower left corner of the screen, or the coils 4 are disposed in other positions according to layout of other components inside the device; for another example, the middle diagram of fig. 4c, the coils 4 are arranged along the diagonal of the screen, and sound is produced at multiple points, so that the stereo effect of sound is realized;

in some embodiments, the coils 4 are disposed in the whole range of the second side surface 112, that is, for the whole screen, the coils 4 may be disposed only in the whole range of the whole screen, for example, the right diagram in fig. 4c, and the coils 4 are uniformly disposed in the whole area of the whole screen, so as to realize an oversized listening area, and further, the sounding position can be controlled to move with the change of the display screen area.

The embodiment of the application also provides an electronic device which comprises the screen.

Referring to fig. 5a, an embodiment of the present application further provides a method for manufacturing a screen, where the screen includes a substrate, at least one display chip, a magnetic member, a support member, and a coil, where the substrate has a first side and a second side opposite to each other;

the method comprises the following steps:

step 501: preparing a coil on a first side of a substrate;

in the embodiment of the application, a coil for driving the substrate to vibrate and generate sound is prepared on the substrate, so that the coil is integrated on the substrate of the display panel.

In particular, preparing a coil on a first side of a substrate comprises: performing Physical Vapor Deposition (PVD) on a first side of a substrate; performing photolithography on the first side of the substrate; a coil is prepared on the first side of the substrate using an etching process. I.e. the coil is prepared on the first side of the substrate by PVD, photolithography and etching processes. Optionally, after the coil is manufactured, an upper inorganic film layer is manufactured by a Chemical Vapor Deposition (CVD) process for metal layer protection;

step 502: turning over the substrate, and preparing at least one display chip on the second side of the substrate;

in the embodiment of the application, after the preparation of the coil is finished, the substrate is turned over, and the display chip is prepared on the other surface of the substrate;

specifically, preparing at least one display chip on the second side of the substrate includes:

(1) preparing a plurality of TFTs and a plurality of metal wires on the second side surface of the substrate, specifically preparing the TFTs and the metal wires according to the semiconductor process procedures of PVD, CVD, photoetching, etching and the like;

(2) preparing a spacer for separating each display chip on the second side surface of the substrate, specifically preparing a light blocking film layer by coating organic matters or depositing metals and the like, and realizing pixel isolation by photoetching and etching process patterning to prepare the spacer;

(3) transferring the display chip onto the second side of the substrate by a transfer process, wherein the transfer process comprises at least one of: a wafer transfer process, a film transfer process and a chip transfer process;

(4) bonding display chips with TFTs and metal wires, wherein one display chip corresponds to one TFT and one metal wire;

thus, the manufacturing of the display panel in the screen is completed through step 501 and step 502, and the specific flow can refer to the flow diagram shown in fig. 5 b.

Step 503: the magnetic member is fixedly connected with the first side surface of the substrate through the supporting member.

In the embodiment of the application, after the display panel is manufactured, the substrate is fixedly connected with the magnetic part through the supporting part, so that the screen is manufactured.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element. Further, it should be noted that the scope of the methods and apparatus of the embodiments of the present application is not limited to performing the functions in the order illustrated or discussed, but may include performing the functions in a substantially simultaneous manner or in a reverse order based on the functions involved, e.g., the methods described may be performed in an order different than that described, and various steps may be added, omitted, or combined. In addition, features described with reference to certain examples may be combined in other examples.

While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. A screen, comprising: the display device comprises a substrate, at least one display chip, a magnetic part, a support part and a coil;

2. The screen of claim 1, further comprising: the display device comprises a plurality of Thin Film Transistors (TFTs) and a plurality of metal wires, wherein the display chips, the TFTs and the metal wires are the same in number;

each display chip is fixed on the second side surface through one TFT and one metal wire.

3. A screen as recited in claim 1, wherein a spacer is disposed between adjacent ones of the display chips.

4. A screen according to claim 3, wherein said coils are distributed within an orthographic projection area of said spacer on said second side.

5. A screen according to claim 4, wherein said coil is provided in a partial or full extent of said second side.

6. A screen as recited in claim 1, wherein the display chip is a Micro LED chip of a Micro light emitting diode.

7. An electronic device characterized by comprising a screen according to any one of claims 1 to 6.

8. A screen preparation method is characterized in that the screen comprises a substrate, at least one display chip, a magnetic part, a support part and a coil, wherein the substrate is provided with a first side face and a second side face which are opposite;

the method comprises the following steps:

preparing the coil on the first side of the substrate;

9. The method of claim 8, wherein said preparing the coil on the first side of the substrate comprises:

performing physical vapor deposition on the first side of the substrate;

performing photolithography on a first side of the substrate;

the coil is fabricated on the first side of the substrate using an etching process.

10. The method of claim 8, wherein preparing at least one display chip on the second side of the substrate comprises:

preparing a plurality of TFTs and a plurality of metal wirings on the second side of the substrate;

preparing a spacer for spacing each of the display chips on the second side of the substrate;

transferring the display chip to the second side of the substrate by a transfer process;

bonding the display chip with the TFT and the metal wire;

wherein, one display chip corresponds to one TFT and one metal wire, and the transfer process comprises at least one of the following: wafer transfer process, film transfer process, and chip transfer process.