CN112542557A - Display panel, preparation method thereof and display device - Google Patents
Display panel, preparation method thereof and display device Download PDFInfo
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- CN112542557A CN112542557A CN202011415488.6A CN202011415488A CN112542557A CN 112542557 A CN112542557 A CN 112542557A CN 202011415488 A CN202011415488 A CN 202011415488A CN 112542557 A CN112542557 A CN 112542557A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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Abstract
The embodiment of the invention discloses a display panel, a preparation method thereof and a display device, wherein the display panel comprises a substrate; the first water vapor barrier layer, OLED device layer and second water vapor barrier layer, second water vapor barrier layer are including the first inorganic layer and the buffering stress layer of range upon range of setting, and the buffering stress layer is located first inorganic layer and keeps away from base plate one side, and first inorganic layer and first water vapor barrier layer parcel OLED device layer, buffering stress layer and first water vapor barrier layer parcel OLED device layer, and the buffering stress layer includes the buffer, and the first inorganic layer of buffer embedding. According to the technical scheme provided by the embodiment of the invention, the light-emitting unit is wrapped by the first water vapor barrier layer and the second water vapor barrier layer to form a double-layer sealed packaging structure, so that the packaging effect of the OLED device layer can be improved, and the bending stress of the first inorganic layer can be reduced by embedding the buffer part into the first inorganic layer, thereby improving the bending capability of the display panel.
Description
Technical Field
The embodiment of the invention relates to the technical field of display, in particular to a display panel, a preparation method thereof and a display device.
Background
The light material and the electrode in the OLED device are very sensitive to water vapor and oxygen, the service life of the OLED device can be greatly shortened by the permeation of water and oxygen, and the requirement of the OLED device on the packaging effect is very high in order to ensure the reliability of the display panel.
In the prior art, a thin film packaging technology is generally adopted to package an OLED device, but the thin film packaging structure in the prior art has poor bending property, which is not beneficial to realizing bending of a display panel.
Disclosure of Invention
The embodiment of the invention provides a display panel, a preparation method thereof and a display device, which are used for improving the bending capability of the display panel.
In a first aspect, an embodiment of the present invention provides a display panel, including:
a substrate;
a first water vapor barrier layer positioned on the substrate;
the OLED device layer is positioned on one side, far away from the substrate, of the first water vapor barrier layer;
the second water vapor barrier layer is located the OLED device layer is far away from one side of the substrate, the second water vapor barrier layer comprises a first inorganic layer and a buffer stress layer which are arranged in a stacked mode, the buffer stress layer is located the first inorganic layer is far away from one side of the substrate, the first inorganic layer and the first water vapor barrier layer wrap the OLED device layer, the buffer stress layer and the first water vapor barrier layer wrap the OLED device layer, the position is parallel to the plane of the substrate, the projection of the buffer stress layer covers the projection of the first inorganic layer, the buffer stress layer comprises a buffer portion, and the buffer portion is embedded into the first inorganic layer.
Optionally, the second water vapor blocking layer further includes a second inorganic layer, the second inorganic layer is located on a side of the buffer stress layer away from the substrate, the OLED device layer is wrapped by the second inorganic layer and the first water vapor blocking layer, and a projection of the second inorganic layer covers a projection of the buffer stress layer on a plane parallel to the substrate.
Optionally, the display panel further includes an array substrate layer located between the first water vapor blocking layer and the OLED device layer, and the buffer portion extends from the buffer stress layer to the array substrate layer in a direction perpendicular to the substrate.
Optionally, the display panel includes a display area, and the buffer portion is disposed around an outer edge of the display area on a plane parallel to the substrate.
Optionally, the array substrate layer is located on an upper surface of the first water vapor blocking layer, and the second water vapor blocking layer is located on an upper surface of the OLED device layer.
Optionally, a projection of the second inorganic layer covers a projection of the first water vapor barrier layer on a plane parallel to the substrate.
Optionally, the thickness of the buffer part in the direction perpendicular to the substrate is in a range of 0.2-1.2 micrometers; in the direction parallel to the substrate, the width range of the buffer part is 1-3 microns.
Optionally, the material of the buffer stress layer comprises one or more of polyimide, polyamide, epoxy resin and rubber.
In a second aspect, an embodiment of the present invention further provides a method for manufacturing a display panel, where the method for manufacturing a display panel includes:
providing a substrate;
forming a first water vapor barrier layer on the substrate;
forming an OLED device layer on one side, far away from the substrate, of the first water vapor barrier layer;
forming a second water vapor barrier layer on one side, far away from the substrate, of the OLED device layer;
the second water vapor barrier layer comprises a first inorganic layer and a buffer stress layer which are arranged in a stacked mode, the buffer stress layer is located on the first inorganic layer and is far away from one side of the substrate, the first inorganic layer and the first water vapor barrier layer wrap the OLED device layer, the buffer stress layer and the first water vapor barrier layer wrap the OLED device layer, the projection of the buffer stress layer covers the projection of the first inorganic layer on a plane parallel to the substrate, the buffer stress layer comprises a buffer portion, and the buffer portion is embedded into the first inorganic layer.
In a third aspect, an embodiment of the present invention further provides a display device, where the display device includes the display panel provided in any embodiment of the present invention.
According to the technical scheme provided by the embodiment of the invention, the first water vapor barrier layer and the second water vapor barrier layer are enabled to wrap the OLED device layer by adding the first water vapor barrier layer on the substrate, and the second water vapor barrier layer comprises the first inorganic layer and the buffer stress layer, namely the first inorganic layer and the first water vapor barrier layer wrap the OLED device layer, the buffer stress layer and the first water vapor barrier layer wrap the OLED device layer, so that a double-layer sealed packaging structure is formed, the packaging performance of the OLED device layer can be improved, and the phenomenon that external water vapor and oxygen enter the OLED device layer to cause the performance reduction of the OLED device layer is avoided. The buffer stress layer comprises a buffer part, and the buffer part is embedded into the first inorganic layer, so that the bending stress of the first inorganic layer can be relieved, and the bending capability of the display panel is improved.
Drawings
Fig. 1 is a top view of a display panel according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of the display panel shown in FIG. 1 along a cutting line AA';
fig. 3 is a schematic cross-sectional view of another display panel according to an embodiment of the invention;
fig. 4 is a schematic cross-sectional view illustrating another display panel according to an embodiment of the invention;
fig. 5 is a schematic cross-sectional view illustrating another display panel according to an embodiment of the invention;
fig. 6 is a schematic cross-sectional view illustrating another display panel according to an embodiment of the present invention;
fig. 7 is a schematic cross-sectional view illustrating another display panel according to an embodiment of the invention;
fig. 8 is a flowchart of a method for manufacturing a display panel according to an embodiment of the invention;
fig. 9 is a schematic structural diagram of a display device according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
As described in the background art, the conventional package structure generally uses a continuous covering manner of an organic layer and an inorganic layer to package the OLED device, and during the bending process of the display panel, there is a large stress between the film layers, and the inorganic layer has brittleness and is easily broken when receiving a large stress, so that the package structure is greatly limited during the bending process, and is not beneficial to the bending of the package structure, thereby reducing the bending capability of the display panel.
In view of the above situation, embodiments of the present invention provide a display panel, a manufacturing method thereof, and a display device, so as to improve the bending capability of the display panel. Fig. 1 is a top view of a display panel according to an embodiment of the present invention, and fig. 2 is a schematic cross-sectional structure of the display panel shown in fig. 1 along a cutting line AA', and referring to fig. 1 and fig. 2, the display panel according to an embodiment of the present invention includes a substrate 20; a first water vapor barrier layer 30 on the substrate 20; the OLED device layer 501 is positioned on one side, away from the substrate 20, of the first water vapor barrier layer 30; the second water vapor barrier layer 40 is located on one side, far away from the substrate 20, of the OLED device layer 501, the second water vapor barrier layer 40 comprises a first inorganic layer 410 and a buffer stress layer 420 which are arranged in a stacked mode, the buffer stress layer 420 is located on one side, far away from the substrate 20, of the first inorganic layer 410, the first inorganic layer 410 and the first water vapor barrier layer 30 wrap the OLED device layer 501, the buffer stress layer 420 and the first water vapor barrier layer 30 wrap the OLED device layer 501, on a plane parallel to the substrate 20, projection of the buffer stress layer 420 covers projection of the first inorganic layer 410, the buffer stress layer 410 comprises a buffer portion 421, and the buffer portion 421 is embedded into the first inorganic layer 410.
Specifically, the substrate 20 includes a non-display area 102 where a display area 101 is disposed around the display area 101, and the OLED device layer 501 is located in the display area 101 of the substrate 20 to realize display of a picture. The substrate 20 is a flexible substrate formed of any suitable insulating material having flexibility, for example, the material of the substrate 20 may be polyimide. The first water vapor blocking layer 30 is disposed on the substrate 20, the OLED device layer 501 is formed on one side of the first water vapor blocking layer 30 away from the substrate 20, and the first water vapor blocking layer 30 is used for preventing water vapor and oxygen from penetrating through the substrate 20 and entering the OLED device layer 501.
The OLED device layer 501 includes an array of OLED devices, which generally includes a cathode, an electron injection layer, an electron transport layer, a light emitting layer, a hole transport layer, a hole injection layer, and an anode, where electrons of the cathode and holes of the anode are respectively injected into the electron injection layer and the hole injection layer under the driving action of an electric field, and then migrate to the light emitting layer through the electron transport layer and the hole transport layer, where the electrons and the holes combine in the light emitting layer to generate excitons, and the excitons generate photons to emit light through migration and radiation attenuation. Since the organic light emitting material in the light emitting layer is sensitive to moisture and oxygen, if the light emitting layer is exposed to moisture and oxygen for a long time, the light emitting performance of the OLED device may be reduced, and therefore the OLED device layer 501 needs to be encapsulated to isolate water and oxygen.
One side of keeping away from base plate 20 at OLED device layer 501 is provided with second steam barrier layer 40, because OLED device layer 501 sets up on first steam barrier layer 30, consequently first steam barrier layer 30 and second steam barrier layer 40 realize the complete parcel to light-emitting unit 50, that is to say, first steam barrier layer 30 and second steam barrier layer 40 form the enclosure space, can block during the aqueous oxygen entering OLED device layer 501 in the external environment, be favorable to improving display panel to the ability of blockking of aqueous oxygen.
Further, the second water vapor barrier layer 40 includes a first inorganic layer 410 and a buffer stress layer 420, and the first inorganic layer 410 and the buffer stress layer 420 are stacked on the OLED device layer 501. The materials of the first water vapor blocking layer 30 and the first inorganic layer 410 may be both inorganic materials, and the first water vapor blocking layer 30 and the first inorganic layer 410 form a closed space to prevent water and oxygen from entering the OLED device layer 501; the buffer stress layer 420 may be an organic layer, and a projection of the buffer stress layer 420 on a plane parallel to the substrate 20 covers a projection of the first inorganic layer 410, that is, an enclosed space formed by the first water vapor barrier layer 30 and the first inorganic layer 410 is nested in an enclosed space formed by the buffer stress layer 420 and the first water vapor barrier layer 30, so as to form a double-layer sealing structure, which can further prevent water and oxygen from entering the OLED device layer 501.
It can be understood that the inorganic material has good water and oxygen resistance, but is brittle, and the organic material has a certain flexibility, so that the flexibility of the packaging structure can be improved, and the display panel can be prevented from being damaged by external impact force or bending stress. The buffer stress layer 420 may be formed by an inkjet printing technique, and by embedding the buffer portion 421 of the buffer stress layer 420 into the first inorganic layer 410, the bending stress in the first inorganic layer 410 may be relieved, thereby improving the bending stress of the first inorganic layer 410, and preventing the first inorganic layer 410 from being fractured due to the concentration of the bending stress in the first inorganic layer 410, wherein the elastic modulus of the buffer stress layer 420 is smaller than the elastic modulus of the first inorganic layer 410, and when the first inorganic layer 410 is stressed and bent, the deformation of the buffer stress layer 420 is greater than the deformation of the first inorganic layer 410, so that the buffer stress layer 420 may effectively release the stress of the first inorganic layer 410. Meanwhile, embedding the buffer portion 421 into the first inorganic layer 410 can also increase the adhesion area between the first inorganic layer 410 and the buffer stress layer 420, thereby increasing the adhesion of the first inorganic layer 410 and preventing the first inorganic layer 410 and the buffer stress layer 420 from being separated to reduce the packaging effect.
According to the technical scheme provided by the embodiment of the invention, the first water vapor barrier layer and the second water vapor barrier layer are enabled to wrap the OLED device layer by adding the first water vapor barrier layer on the substrate, and the second water vapor barrier layer comprises the first inorganic layer and the buffer stress layer, namely the first inorganic layer and the first water vapor barrier layer wrap the OLED device layer, the buffer stress layer and the first water vapor barrier layer wrap the OLED device layer, so that a double-layer sealed packaging structure is formed, the packaging performance of the OLED device layer can be improved, and the phenomenon that external water vapor and oxygen enter the OLED device layer to cause the performance reduction of the OLED device layer is avoided. The buffer stress layer comprises a buffer part, and the buffer part is embedded into the first inorganic layer, so that the bending stress of the first inorganic layer can be relieved, and the bending capability of the display panel is improved.
Fig. 3 is a schematic cross-sectional structure view of another display panel according to an embodiment of the present invention, referring to fig. 3, based on the foregoing technical solution, the second water vapor blocking layer 40 further includes a second inorganic layer 430, the second inorganic layer 430 is located on a side of the buffer stress layer 420 away from the substrate 20, the second inorganic layer 430 and the first water vapor blocking layer 30 wrap the OLED device layer 501, and a projection of the second inorganic layer 430 covers a projection of the buffer stress layer 420 on a plane parallel to the substrate 20.
Specifically, a second inorganic layer 430 is further disposed on a side of the buffer stress layer 420 away from the substrate 20, and the first inorganic layer 410, the buffer stress layer 420 and the second inorganic layer 430 are sequentially stacked on the OLED device layer 501 and cover the OLED device layer 501. The closed space formed by the first inorganic layer 410 and the first water vapor barrier layer 30 is nested in the closed space formed by the first water vapor barrier layer 30 and the buffer stress layer 420, and the closed space formed by the first water vapor barrier layer 30 and the buffer stress layer 420 is nested in the closed space formed by the second inorganic layer 430 and the first water vapor barrier layer 30. The materials of the first inorganic layer 410 and the second inorganic layer 430 are inorganic materials with strong water and oxygen resistance, the material of the buffer stress layer 420 can be an organic material with small elastic modulus and strong hydrophobic property, the first inorganic layer 410, the buffer stress layer 420 and the second inorganic layer 430 are stacked, water vapor and oxygen in the external environment can be prevented from entering the OLED device layer 501, and the outermost layer of the second water vapor barrier layer 40 is the second inorganic layer 430 with water and oxygen resistance, so that the water vapor and oxygen can be well isolated. In addition, the second water vapor barrier layer 40 and the first water vapor barrier layer 30 form an enclosed space to wrap the OLED device layer 501, so that external water vapor and oxygen can be prevented from entering the OLED device layer 501 through the substrate 20, and the sealing performance of the OLED device layer 501 is further enhanced. On a plane parallel to the substrate 20, the projection of the second inorganic layer coincides with the projection of the first water vapor barrier layer, forming a narrow bezel at the edge of the display panel. Or, on the plane parallel to the substrate 20, the projection of the second inorganic layer covers the projection of the first water vapor blocking layer, that is, the second inorganic layer surrounds the first water vapor blocking layer and contacts with the substrate 20 to form a wrapping structure, so that the packaging effect is further improved.
Optionally, fig. 4 is a schematic cross-sectional structure view of another display panel provided in an embodiment of the present invention, and referring to fig. 4, on the basis of the above technical solutions, the display panel provided in an embodiment of the present invention further includes an array substrate layer 502 located between the first water vapor barrier layer 30 and the OLED device layer 501, and in a direction perpendicular to the substrate 20, the buffer portion 421 extends from the buffer stress layer 420 to the array substrate layer 502.
Specifically, the array substrate layer 502 includes a thin film transistor array for driving the OLED device, the thin film transistor array includes a plurality of thin film transistors arranged in an array, and the thin film transistors generate driving signals according to signals output by the driving chip, for example, generate driving signals according to signals on the scanning signal lines and the data signal lines, so as to drive the OLED device to emit light.
Wherein the array substrate layer 502 is located on the upper surface of the first water vapor blocking layer 30, and the second water vapor blocking layer 40 is located on the upper surface of the OLED device layer 501. That is, the first water vapor blocking layer 30 and the second water vapor blocking layer 40 are in direct contact, and together form an encapsulation structure of the display panel to block external water and oxygen from entering the OLED device layer 501.
Since the water and oxygen usually intrude from the side frame of the display panel, the buffer portion 421 extends from the buffer stress layer 420 to the array substrate layer 502 along the direction perpendicular to the substrate 20, which is equivalent to a closed space formed between the array substrate layer 502 and the buffer stress layer 420, so that the package structure at the side frame of the display panel is changed from a three-layer structure to a five-layer structure (the second inorganic layer 430, the buffer stress 420, the first inorganic layer 410, the buffer portion 421 and the first inorganic layer 410) in the direction parallel to the substrate 20, and on the premise of not increasing the package film layer, the package effect can be improved, and the capability of blocking water and oxygen is improved. Since the material of the buffer stress layer 420 is an organic material having a small elastic modulus, by embedding the buffer portion 421 in the first inorganic layer 410, stress concentration of the first inorganic layer 10 can be avoided, so that bending stress in the first inorganic layer 410 can be effectively released, the first inorganic layer 410 and the second inorganic layer 430 are prevented from being broken when being bent, and bending resistance of the display panel is improved.
Of course, in other embodiments, more buffer portions 421 may be added, fig. 5 is a schematic cross-sectional structure diagram of another display panel provided in the embodiments of the present invention, and referring to fig. 5, by increasing the number of the buffer portions 421, it is equivalent to increasing an enclosed space formed by the array substrate layer 502 and the buffer stress layer 420, and further improving the encapsulation effect, for specific effect, please refer to the related description of fig. 4, which is not repeated herein.
Alternatively, with continued reference to fig. 4, the display panel includes a display area 101, and a buffer portion 421 is disposed around an outer edge of the display area 101 on a plane parallel to the substrate 20. The purpose of setting up like this is in order to improve the encapsulation effect to OLED device layer 501, makes the confined space that forms between array substrate layer 502 and the stress buffering layer 420 can wrap up OLED device layer 501 completely through the setting of buffer 421, and in the direction that is on a parallel with base plate 20, the packaging structure of display panel side frame department becomes five layer structure from three layer construction, under the prerequisite that does not increase the encapsulation rete, can improve the encapsulation effect, has improved the ability of separation water oxygen. In the embodiment of the invention, in the direction parallel to the substrate 20, the projection of the second inorganic layer 430 covers the projection of the first water vapor barrier layer 30, that is, the second inorganic layer 430 wraps up the first water vapor barrier layer 30 to form a wrapping structure, so that the packaging effect of the packaging structure can be further improved.
Optionally, with reference to fig. 4, on the basis of the above technical solutions, in a direction perpendicular to the substrate 20, the thickness d1 of the buffer portion 421 is in a range of 0.2 to 1.2 micrometers, and in a direction parallel to the substrate 20, the width k1 of the buffer portion 421 is in a range of 1 to 3 micrometers.
Specifically, in a direction parallel to the substrate 20, the thickness d2 of the outer frame 422 of the stress buffer layer 420 in a direction perpendicular to the substrate 20 is in a range of 0.2 to 1.2 μm, and the width k2 in a direction parallel to the substrate 20 is in a range of 1 to 5 μm. The outer frame 422 of the buffer stress layer 420 is located between the first water vapor barrier layer 30 and the second inorganic layer 430 and is in contact with the first water vapor barrier layer 30 and the second inorganic layer 430, so that the width k2 of the outer frame 422 of the buffer stress layer 420 can be relatively wider to better release the internal stress of the first inorganic layer 410 and the second inorganic layer 430, and in the thickness direction of the display panel, the outer frame 422 of the buffer stress layer 420 extends to the first water vapor barrier layer 30 and is in contact with the first water vapor barrier layer 30, so that the internal stress of the second water vapor barrier layer 40 can be reduced to the greatest extent.
The buffer portion 421 is embedded in the first inorganic layer 410, in order to make a sufficient distance between the buffer portion 421 and the outer frame 422 of the buffer stress layer 420 to equally divide the stress in the second vapor barrier layer 40, the width k1 of the buffer portion 421 may be relatively narrow, for example, 0.2 to 1.2 μm, and the thickness d1 of the buffer portion 421 may be the same as or different from the thickness d2 of the outer frame 422 of the buffer stress layer 420, and may be set according to the actual manufacturing process of the display panel. For example, referring to fig. 6, a cross-sectional structure of another display panel provided in the embodiment of the invention is schematically shown in fig. 6, a thickness d1 of the buffer portion 421 is the same as a thickness d2 of the outer frame 422 of the buffer stress layer 420, and in a direction parallel to the substrate 20, the number of films between the second inorganic layer 430 and the array substrate 502 is increased, so that the encapsulation effect on the OLED device layer 501 is improved, and the encapsulation effect on the array substrate 502 is also improved.
Optionally, fig. 7 is a schematic cross-sectional structure diagram of another display panel according to an embodiment of the present invention, and referring to fig. 7, on the basis of the foregoing technical solutions, fig. 7 specifically illustrates that the buffer portion 421 extends to the array substrate layer 502. The array substrate layer 502 comprises a protection layer 511 arranged on the first water vapor blocking layer 30 to prevent impurities on the first water vapor blocking layer 30 from affecting the thin film transistor array, a gate insulating layer 512, a capacitor insulating layer 513, an interlayer insulating layer 514, a passivation layer 515 and thin film transistors 517 are arranged on the protection layer 511, and the thin film transistors 517 are arranged in an array mode to form a driving circuit of the OLED light emitting device and drive the OLED light emitting device to emit light. The passivation layer 515 is provided with a planarization layer 516, the anode layer 522, the organic layer 521 and the cathode layer 523 are sequentially disposed on the planarization layer 516, and the anode layer 522, the organic layer 521 and the cathode layer 523 constitute an OLED light emitting device, wherein the organic layer 521 includes a light emitting layer. The buffer portion 421 may extend onto the planarization layer 516 and be disposed along the edge of the display region, so that the enclosed space formed by the buffer stress layer 420 and the array substrate layer 502 can cover the whole OLED device layer 501, and the buffer stress layer 420 is made of an organic material with stronger hydrophobic property, such as one or more of polyimide, polyamide, epoxy resin, or rubber. Therefore, the buffer portion 421 can reduce the stress inside the first inorganic layer 410, and can further isolate external water and oxygen from entering the OLED device layer 501.
An embodiment of the present invention further provides a method for manufacturing a display panel, fig. 8 is a flowchart of the method for manufacturing the display panel according to the embodiment of the present invention, and with reference to fig. 1 to 8, on the basis of the foregoing technical solutions, the method for manufacturing the display panel according to the embodiment of the present invention includes:
s101, providing a substrate.
And S102, forming a first water vapor barrier layer on the substrate.
S103, forming an OLED device layer on one side, far away from the substrate, of the first water vapor barrier layer.
S104, forming a second water vapor barrier layer on one side, far away from the substrate, of the OLED device layer;
the second water vapor barrier layer comprises a first inorganic layer and a buffer stress layer which are stacked, the buffer stress layer is located on one side, away from the substrate, of the first inorganic layer, the first inorganic layer and the first water vapor barrier layer wrap the OLED device layer, the buffer stress layer and the first water vapor barrier layer wrap the OLED device layer, the projection of the first inorganic layer is covered by the projection of the buffer stress layer on a plane parallel to the substrate, the buffer stress layer comprises a buffer portion, and the buffer portion is embedded into the first inorganic layer.
Specifically, the substrate 20 includes a non-display area 102 where a display area 101 is disposed around the display area 101, and the OLED device layer 501 is located in the display area 101 of the substrate 20 to realize display of a picture. The substrate 20 is a flexible substrate formed of any suitable insulating material having flexibility, for example, the material of the substrate 20 may be polyimide. The first water vapor blocking layer 30 is disposed on the substrate 20, the OLED device layer 501 is formed on one side of the first water vapor blocking layer 30 away from the substrate 20, and the first water vapor blocking layer 30 is used for preventing water vapor and oxygen from penetrating through the substrate 20 and entering the OLED device layer 501.
The OLED device layer 501 includes an array of OLED devices, which generally includes a cathode, an electron injection layer, an electron transport layer, a light emitting layer, a hole transport layer, a hole injection layer, and an anode, where electrons of the cathode and holes of the anode are respectively injected into the electron injection layer and the hole injection layer under the driving action of an electric field, and then migrate to the light emitting layer through the electron transport layer and the hole transport layer, where the electrons and the holes combine in the light emitting layer to generate excitons, and the excitons generate photons to emit light through migration and radiation attenuation. Since the organic light emitting material in the light emitting layer is sensitive to moisture and oxygen, if the light emitting layer is exposed to moisture and oxygen for a long time, the light emitting performance of the OLED device may be reduced, and therefore the OLED device layer 501 needs to be encapsulated to isolate water and oxygen.
One side of keeping away from base plate 20 at OLED device layer 501 is provided with second steam barrier layer 40, because OLED device layer 501 sets up on first steam barrier layer 30, consequently first steam barrier layer 30 and second steam barrier layer 40 realize the complete parcel to light-emitting unit 50, that is to say, first steam barrier layer 30 and second steam barrier layer 40 form the enclosure space, can block during the aqueous oxygen entering OLED device layer 501 in the external environment, be favorable to improving display panel to the ability of blockking of aqueous oxygen.
Further, the second water vapor barrier layer 40 includes a first inorganic layer 410 and a buffer stress layer 420, and the first inorganic layer 410 and the buffer stress layer 420 are stacked on the OLED device layer 501. The materials of the first water vapor blocking layer 30 and the first inorganic layer 410 may be both inorganic materials, and the first water vapor blocking layer 30 and the first inorganic layer 410 form a closed space to prevent water and oxygen from entering the OLED device layer 501; the buffer stress layer 420 may be an organic layer, and a projection of the buffer stress layer 420 on a plane parallel to the substrate 20 covers a projection of the first inorganic layer 410, that is, an enclosed space formed by the first water vapor barrier layer 30 and the first inorganic layer 410 is nested in an enclosed space formed by the buffer stress layer 420 and the first water vapor barrier layer 30, so as to form a double-layer sealing structure, which can further prevent water and oxygen from entering the OLED device layer 501.
Specifically, the step S104 of forming a second water vapor blocking layer on the side of the OLED device layer away from the substrate includes:
s1041, forming a first inorganic layer 410 on the OLED device layer 501, so that the first inorganic layer 410 and the first water vapor blocking layer 30 form a sealing structure including the OLED device layer, forming a hole on the surface of the first inorganic layer 410 away from the substrate 20, the hole extending from the surface of the first inorganic layer to the direction of the substrate 20.
Preferably, the apertures extend to the array substrate layer 502 or the first vapor barrier layer 30, the projections of the apertures onto a plane parallel to the substrate 20 are located in the non-display area of the display panel.
S1042, forming a buffer stress layer 420 on the first inorganic layer 410, wherein the buffer stress layer 420 wraps the outer surface of the first inorganic layer 410, forms a sealing structure with the first water vapor barrier layer 30 to wrap the first inorganic layer, and further fills the holes in the first inorganic layer to form the buffer 421.
S1043, forming a second inorganic layer 430 on the buffer stress layer, wherein the second inorganic layer 430 wraps the outer surface of the buffer stress layer 420, and forms a sealing structure with the first water vapor barrier layer 30 to wrap the buffer stress layer.
It can be understood that the inorganic material has good water and oxygen resistance, but is brittle, and the organic material has a certain flexibility, so that the flexibility of the packaging structure can be improved, and the display panel can be prevented from being damaged by external impact force or bending stress. The buffer stress layer 420 may be formed by an inkjet printing technique, and by embedding the buffer portion 421 of the buffer stress layer 420 into the first inorganic layer 410, the bending stress in the first inorganic layer 410 may be relieved, thereby improving the bending stress of the first inorganic layer 410, and preventing the first inorganic layer 410 from being fractured due to the concentration of the bending stress in the first inorganic layer 410, wherein the elastic modulus of the buffer stress layer 420 is smaller than the elastic modulus of the first inorganic layer 410, and when the first inorganic layer 410 is stressed and bent, the deformation of the buffer stress layer 420 is greater than the deformation of the first inorganic layer 410, so that the buffer stress layer 420 may effectively release the stress of the first inorganic layer 410. Meanwhile, embedding the buffer portion 421 into the first inorganic layer 410 can also increase the adhesion area between the first inorganic layer 410 and the buffer stress layer 420, thereby increasing the adhesion of the first inorganic layer 410 and preventing the first inorganic layer 410 and the buffer stress layer 420 from being separated to reduce the packaging effect.
Optionally, an embodiment of the present invention further provides a display device, and fig. 9 is a schematic structural diagram of a display device according to an embodiment of the present invention, where the display device may be an electronic product such as a mobile phone, a tablet, a computer, and a smart watch, and the display device includes the display panel according to any embodiment of the present invention, so that the display device according to an embodiment of the present invention also has the beneficial effects described in any embodiment of the present invention.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (10)
1. A display panel, comprising:
a substrate;
a first water vapor barrier layer positioned on the substrate;
the OLED device layer is positioned on one side, far away from the substrate, of the first water vapor barrier layer;
the second water vapor barrier layer is located the OLED device layer is far away from one side of the substrate, the second water vapor barrier layer comprises a first inorganic layer and a buffer stress layer which are arranged in a stacked mode, the buffer stress layer is located the first inorganic layer is far away from one side of the substrate, the first inorganic layer and the first water vapor barrier layer wrap the OLED device layer, the buffer stress layer and the first water vapor barrier layer wrap the OLED device layer, the position is parallel to the plane of the substrate, the projection of the buffer stress layer covers the projection of the first inorganic layer, the buffer stress layer comprises a buffer portion, and the buffer portion is embedded into the first inorganic layer.
2. The display panel of claim 1, wherein the second moisture barrier layer further comprises a second inorganic layer, the second inorganic layer is located on a side of the buffer stress layer away from the substrate, the second inorganic layer and the first moisture barrier layer wrap the OLED device layer, and a projection of the second inorganic layer covers a projection of the buffer stress layer on a plane parallel to the substrate.
3. The display panel of claim 1, further comprising an array substrate layer between the first water vapor barrier layer and the OLED device layer, the buffer extending from the buffer stress layer to the array substrate layer in a direction perpendicular to the substrate.
4. The display panel according to claim 3, wherein the display panel comprises a display area, and the buffer portion is provided around an outer edge of the display area in a plane parallel to the substrate.
5. The display panel of claim 4 wherein the array substrate layer is on a top surface of the first water vapor barrier layer and the second water vapor barrier layer is on a top surface of the OLED device layer.
6. The display panel of claim 2 wherein the projection of the second inorganic layer overlays the projection of the first water vapor barrier layer in a plane parallel to the substrate.
7. The display panel according to claim 6, wherein the buffer portion has a thickness in a range of 0.2 to 1.2 μm in a direction perpendicular to the substrate;
in the direction parallel to the substrate, the width range of the buffer part is 1-3 microns.
8. The display panel of claim 1, wherein the material of the buffer stress layer comprises one or more of polyimide, polyamide, epoxy, and rubber.
9. A method for manufacturing a display panel, comprising:
providing a substrate;
forming a first water vapor barrier layer on the substrate;
forming an OLED device layer on one side, far away from the substrate, of the first water vapor barrier layer;
forming a second water vapor barrier layer on one side, far away from the substrate, of the OLED device layer;
the second water vapor barrier layer comprises a first inorganic layer and a buffer stress layer which are arranged in a stacked mode, the buffer stress layer is located on the first inorganic layer and is far away from one side of the substrate, the first inorganic layer and the first water vapor barrier layer wrap the OLED device layer, the buffer stress layer and the first water vapor barrier layer wrap the OLED device layer, the projection of the buffer stress layer covers the projection of the first inorganic layer on a plane parallel to the substrate, the buffer stress layer comprises a buffer portion, and the buffer portion is embedded into the first inorganic layer.
10. A display device characterized by comprising the display panel according to any one of claims 1 to 8.
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Application publication date: 20210323 |