Disclosure of Invention
In order to overcome the technical defects in the prior art, the invention provides a method and a system for positioning the defects of the double-track ultrasonic wave, which can realize accurate positioning of the defects.
The technical scheme used for solving the technical problems of the invention is as follows:
a double-track ultrasonic defect positioning system comprises a double-track ultrasonic signal transmitting circuit and a double-track echo signal receiving circuit, wherein the double-track ultrasonic signal transmitting circuit is used for transmitting two paths of same ultrasonic signals to a detection plane of a detected substance in a time-sharing manner, intersection points exist between detection routes formed inside the detected substance by the two paths of same ultrasonic signals, the double-track echo signal receiving circuit receives the two paths of echo signals, amplifies the echo signals, eliminates abnormal signals and noise, converts the processed echo signals into digital signals for storage, transmits the stored digital signals to an upper computer, analyzes the echo signals processed by the double-track echo signal receiving circuit by the upper computer, extracts defect characteristics from the echo signals, and detects defects of the detection routes, and judging the defect position of the detected substance according to the intersection point position of the two detection routes to obtain a detection result.
Preferably, the binaural ultrasonic signal transmitting circuit includes: the system comprises a main control chip, a first driving module, a second driving module, a first pulse generating module, a second pulse generating module, a first transducer and a second transducer, wherein:
the main control chip is used for respectively outputting corresponding control signals and frequency signals to the first driving module and the second driving module, wherein the frequency signals are frequencies for generating ultrasonic signals, and the control signals are used for enabling the corresponding driving modules and controlling the subsequent two paths of ultrasonic signals to be transmitted in a time-sharing manner;
the first driving module and the second driving module generate two paths of driving signals after receiving the frequency signals and the control signals corresponding to the driving circuit, and respectively output the two paths of driving signals to the first pulse generating module and the second pulse generating module;
the first pulse generating module and the second pulse generating module generate 2 paths of pulse signals with corresponding frequencies under the driving of corresponding driving signals and respectively output the pulse signals to the first energy converter and the second energy converter;
and the first transducer and the second transducer respectively convert the received pulse signals into ultrasonic signals with corresponding frequencies and transmit the ultrasonic signals.
Preferably, the two-way echo signal receiving circuit includes:
the first echo signal receiving end and the second echo signal receiving end are used for receiving two time-sharing echo signals;
the first amplifying circuit and the second amplifying circuit amplify the received echo signals, the amplification times of the two amplifying circuits are adjustable, and the amplification times of the two amplifying circuits are different, so that the two echo signals with different sizes are met;
the analog switch is used for enabling the first echo signal receiving end and the second echo signal receiving end to only receive the corresponding echo signals;
the filter circuit is used for filtering noise of the echo signal;
an AD converter for converting the echo signal into a digital signal;
the FPGA chip reads and stores the digital signal and transmits the digital signal to an upper computer;
and the upper computer is used for processing and analyzing the received signals and judging whether defects exist or not.
Preferably, before amplifying the echo signal at the echo signal receiving end, the amplifying circuit further needs to perform impedance matching, and input impedances of the first amplifying circuit and the second amplifying circuit need to be far greater than output impedances of the first echo signal receiving end and the second echo signal receiving end.
Preferably, the analog switch is a double-input single-output single-pole double-throw switch, and the single-pole double-throw switch selects a receiving device corresponding to the echo signal.
The invention also provides a method for positioning the defects of the double-track ultrasonic wave, which comprises the following steps:
s1, selecting a first position to be detected of a substance to be detected, sending a first ultrasonic signal at the first position to be detected, and obtaining a first echo signal of the first ultrasonic signal through a first ultrasonic detection method;
s2, selecting a second to-be-detected position of a to-be-detected substance, sending a second ultrasonic signal at the second to-be-detected position, and obtaining a second echo signal of the second ultrasonic signal through a second ultrasonic detection method;
s3, translating the first position to be detected and the second position to be detected simultaneously, keeping the two echo signals in the same plane, obtaining a first echo signal of the second path through a first ultrasonic detection method, and obtaining a second echo signal of the second path through a second ultrasonic detection method;
s4, repeating the step S3 until the two echo signal routes of the plane of the substance to be detected pass through all positions, and finding the intersection point of the two detection routes by drawing the sectional view of the substance to be detected to obtain the positioning coordinates of the intersection point position in the sectional plane;
s5, repeating the steps S1-S4 until the positioning coordinates of all the positions of the substance to be detected are marked, analyzing echo signals obtained by all detection routes of the substance to be detected, extracting defect characteristics for analysis, and finding out two detection routes corresponding to the defect signals;
wherein the first ultrasonic detection method and the second ultrasonic detection method may be any combination of a butt measurement method and an oblique measurement method.
Preferably, in step S4, when two non-parallel detection signals are obtained, the two signals need to be amplified, abnormal data is eliminated, and noise is eliminated.
Preferably, when the substance to be detected has at least four detectable planes, the first position to be detected and the second position to be detected are selected on two adjacent planes, the first ultrasonic detection method and the second ultrasonic detection method are both a counter detection method, the first position to be detected and the second position to be detected are selected on two parallel planes, and at least one of the first ultrasonic detection method and the second ultrasonic detection method is an oblique detection method.
Preferably, the substance to be detected has only two detectable planes, the first position to be detected and the second position to be detected may be selected from the same plane where the two detectable planes are adjacent or parallel to each other, or may be selected from different planes where the two detectable planes are adjacent or parallel to each other, and at least one of the first ultrasonic detection method and the second ultrasonic detection method is an oblique detection method.
Compared with the prior art, the invention provides a method and a system for positioning the defects of the double-track ultrasonic wave, which have the following beneficial effects: the invention realizes the accurate positioning of the defects of the building concrete in the nondestructive testing field, and reduces the cost loss brought by defect repair; the invention can be applied to a plurality of working scenes and has wide application range; the hardware circuit designed by the invention is simple and reasonable, the cost is low, and the operation is simple and convenient.
Detailed Description
The present invention will be described in detail with reference to the specific embodiments shown in the drawings, which are not intended to limit the present invention, and structural, methodological, or functional changes made by those skilled in the art according to the specific embodiments are included in the scope of the present invention.
As shown in fig. 1, the binaural ultrasonic defect localization system 100 of the present invention includes a binaural ultrasonic signal transmitting circuit 10 and a two-way echo signal receiving circuit 20. The dual-channel ultrasonic signal transmitting circuit 10 is configured to transmit two identical ultrasonic signals to a detection plane of a detected object in a time-sharing manner. The two-way echo signal receiving circuit 20 receives the two-way echo signals, amplifies the signals, eliminates abnormal signals and noise, converts the processed echo signals into digital signals, and sends the digital signals to the upper computer 29. The upper computer 29 analyzes the echo signals processed by the two-way echo signal receiving circuit, extracts characteristic values from the echo signals, judges the defects of the detected substances, finds two corresponding detection routes and obtains a detection result through the intersection point coordinates of the two detection routes.
The technical solution of the present invention will be described in detail below.
Referring to fig. 2, fig. 2 shows an internal module structure of the binaural ultrasonic signal transmitting circuit 10. The dual-channel ultrasonic signal transmitting circuit 10 comprises a main control chip 11, a first driving module 12, a second driving module 13, a first pulse generating module 14, a second pulse generating module 15, a first transducer 16 and a second transducer 17. The main control chip 11 outputs corresponding control signals and frequency signals to the first driving module 12 and the second driving module 13, the frequency signals are frequencies for generating ultrasonic signals, and the control signals are used for enabling the corresponding driving modules and controlling the subsequent two paths of ultrasonic signals to be transmitted in a time-sharing manner. The first driving module 12 and the second driving module 13, after receiving the frequency signal and the control signal corresponding to the driving circuit, generate two driving signals, and output the two driving signals to the first pulse generating module 14 and the second pulse generating module 15, respectively. The first pulse generating module 14 and the second pulse generating module 15 generate 2 paths of pulse signals with corresponding frequencies under the driving of corresponding driving signals, and output the pulse signals to the first transducer 16 and the second transducer 17 respectively. The function of the first transducer 16 and the second transducer 17 is to convert electrical energy into acoustic energy, thereby ultimately generating two ultrasonic signals.
As shown in fig. 3, which is a first schematic diagram of a two-channel echo receiving circuit 20, the two-channel echo receiving circuit 20 is configured to receive two echo signals, and includes a first echo receiving end 21, a second echo receiving end 22, a first amplifying circuit 23, a second amplifying circuit 24, an analog switch 25, and a filtering circuit 26. The first echo signal receiving end 21 and the second echo signal receiving end 22 are used for receiving two time-shared echo signals. Because the echo signals received by the receiving end are weak, the echo signals are firstly amplified, and the first amplifying circuit 23 and the second amplifying circuit 24 need to be respectively subjected to impedance matching in consideration of the fact that the complete echo signals are to be amplified, because the input impedance of the first amplifying circuit 23 and the input impedance of the second amplifying circuit 24 need to be far greater than the output impedance of the first echo signal receiving end 21 and the output impedance of the second echo signal receiving end 22, two different echo signals need to be amplified differently, and the amplification times of the first amplifying circuit 23 and the second amplifying circuit 24 are adjustable so as to meet the requirement of the two echo signals with different weak degrees;
the analog switch 25 is a double-input single-output single-pole double-throw switch, positions of the dual-channel ultrasonic signal transmitting circuit 10 and the two-way echo signal receiving circuit 20 are well arranged in the defect detection process, in the detection process, echo signals generated after one path of ultrasonic signals of the dual-channel ultrasonic signal transmitting circuit 10 passes through a medium are simultaneously received by the first echo signal receiving terminal 21 and the second echo signal receiving terminal 22, and data received by the first echo signal receiving terminal 21 belongs to abnormal data relative to the second echo signal receiving terminal 22, in the data analysis, the misjudgment of defects can be caused, and in the design, the first echo signal receiving terminal 21 and the second echo signal receiving terminal 22 are enabled to only receive the respective corresponding echo signals through the gating of the analog switch 25, so that abnormal data received by the two echo signal receiving terminals can be eliminated;
the filter circuit 26 is used to filter noise of the echo signal, the echo signal received by the two-way echo signal receiving circuit 20 is an analog signal, and the analog signal may dope noise in the circuit during transmission of the circuit, so the filter circuit 26 is a final step of processing the analog signal, the noise of the echo signal mainly comes from high frequency, and the filter circuit 26 selects butterworth low-pass filtering for filtering high-frequency noise in the signal. In order to better keep the original characteristics of echo signals, the filter circuit 26 is designed into a Butterworth eight-order filter circuit to attenuate and eliminate high-frequency signals for many times, and as the frequency of ultrasonic signals in the design is 50KHZ, the filter circuit 26 also obtains a proper cut-off frequency of 75K through a matching resistor and a capacitor.
As shown in fig. 4, which is a second schematic diagram of the binaural echo receiving signal circuit 20, the filtered echo signal passes through the AD converter 27 to obtain a digital signal, the converted digital signal is stored in the memory of the FPGA chip 28, the FPGA chip 28 transmits the stored digital signal to the upper computer 29 through serial port communication, and is configured to process the acquired echo data to extract a feature value, the feature value is read and analyzed by the upper computer 29, the feature value is analyzed to find an abnormal value, and the defect feature is obtained according to a defect feature that may exist in the digital signal, such as a data difference between a normal condition and a defect condition, so as to determine whether a defect exists.
The method for defect detection by using the above-mentioned binaural ultrasonic defect localization system according to the present invention is described below.
Referring to fig. 5, fig. 5 is a schematic flow chart of a binaural ultrasonic defect localization method of the present invention, as shown in the figure, the method includes the steps of:
s1, selecting a first position to be detected of a substance to be detected, sending a first ultrasonic signal at the first position to be detected, and obtaining a first echo signal of the first ultrasonic signal through a first ultrasonic detection method;
s2, selecting a second to-be-detected position of a to-be-detected substance, sending a second ultrasonic signal at the second to-be-detected position, and obtaining a second echo signal of the second ultrasonic signal through a second ultrasonic detection method;
s3, translating the first position to be detected and the second position to be detected simultaneously, keeping the two echo signals in the same plane, obtaining a first echo signal of the second path through a first ultrasonic detection method, and obtaining a second echo signal of the second path through a second ultrasonic detection method;
s4, repeating the step S3 until the two echo signal routes of the plane of the substance to be measured pass through all positions, and finding the intersection point of the two routes by drawing the sectional view of the substance to be measured to obtain the positioning coordinates of the intersection point position in the sectional plane;
s5, repeating the steps S1-S4 until the positioning coordinates of all the positions of the substance to be detected are marked, analyzing echo signals obtained by all detection routes of the substance to be detected, extracting defect characteristics for analysis, and finding out two detection routes corresponding to the defect signals;
wherein the first ultrasonic detection method and the second ultrasonic detection method may be any combination of a butt measurement method and an oblique measurement method.
In step S4, after acquiring the two non-parallel detection signals, the two signals need to be further amplified, processed to remove abnormal data, noise, and the like.
The above-described defect detection method of the present invention will be described in detail by specific examples.
Referring to fig. 6, fig. 6 is a schematic diagram of defect detection in a first embodiment, in which a substance to be detected has at least four detectable planes, for example, the substance to be detected is a pillar, and defect positioning is realized by a combination of alignment measurement and alignment measurement. During measurement, as shown in fig. 6a, a first to-be-measured position and a second to-be-measured position are selected on two adjacent planes of a to-be-measured substance, two ultrasonic signals of a two-channel ultrasonic signal transmitting circuit are put on, two receiving ends of a two-way echo signal receiving circuit are placed on opposite surfaces corresponding to the two receiving ends, as shown in fig. 6b, the first to-be-measured position and the second to-be-measured position are selected on two parallel planes of the to-be-measured substance, two ultrasonic signals of the two-channel ultrasonic signal transmitting circuit are put on, and the two receiving ends of the two-way echo signal receiving circuit are placed on opposite surfaces corresponding to the two receiving ends, wherein signals 1 and 2 represent two-way transmitted ultrasonic signals, and signals 1 'and 2' represent two-way; the method comprises the steps of firstly acquiring a detection route formed by a signal 1 and a signal 1 ', acquiring a detection route formed by a signal 2 and a signal 2', simultaneously translating two ultrasonic signal detection routes in the same plane range to finish the acquisition of echo data of different detection routes of a plane at a position to be detected until all position marks of a substance to be detected are finished, carrying out feature extraction on the acquired data, analyzing feature signals, finding out two detection routes corresponding to signals with defects, and positioning the positions of the defects according to intersection points of the detection routes.
Referring to fig. 7, fig. 7 is a schematic diagram illustrating defect detection according to a second embodiment. In this second embodiment, which can be used in situations where two opposing planes are detectable, such as the detection of a beam, a combination of lateral and oblique methods is used, such as the top view of a beam shown in fig. 7 a. During measurement, two ultrasonic signals of the dual-channel ultrasonic signal transmitting circuit are placed on the same plane of a substance to be measured, or can be placed on two opposite planes, two receiving ends of the dual-channel echo signal receiving circuit are placed on opposite surfaces corresponding to the two receiving ends, as shown in the figure, wherein signals 1 and 2 represent the two transmitted ultrasonic signals, and signals 1 'and 2' represent the two echo signals; the method comprises the steps of firstly acquiring a detection route formed by a signal 1 and a signal 1 ', acquiring a detection route formed by a signal 2 and a signal 2', simultaneously translating two ultrasonic signal detection routes in the same plane range to finish the acquisition of echo data of different detection routes of a plane at a position to be detected until all position marks of a substance to be detected are finished, carrying out feature extraction on the acquired data, analyzing feature signals, finding out two detection routes corresponding to signals with defects, and positioning the positions of the defects according to intersection points of the detection routes.
Or a combination of the oblique measurement method and the oblique measurement method is used as the roof beam top view shown in fig. 7b, during measurement, two ultrasonic signals of the two-channel ultrasonic signal transmitting circuit are placed on the same plane of the substance to be measured, or can be placed on the opposite plane, and two receiving ends of the two-way echo signal receiving circuit are placed on the opposite surface corresponding to the two receiving ends, as shown in the figure, wherein the signals 1 and 2 represent the two-way transmitted ultrasonic signals, and the signals 1 'and 2' represent the two-way echo signals; the method comprises the steps of firstly acquiring a detection route formed by a signal 1 and a signal 1 ', acquiring a detection route formed by a signal 2 and a signal 2', simultaneously translating two ultrasonic signal detection routes in the same plane range to finish the acquisition of echo data of different detection routes of a plane at a position to be detected until all position marks of a substance to be detected are finished, carrying out feature extraction on the acquired data, analyzing feature signals, finding out two detection routes corresponding to signals with defects, and positioning the positions of the defects according to intersection points of the detection routes.
Referring to fig. 8, fig. 8 is a schematic diagram illustrating defect detection according to a third embodiment. In the third embodiment, it can be used for the situation that there are two adjacent detectable planes, or the detection of the wall corner, when the combined method of the measurement method and the oblique measurement method is used for measurement as shown in fig. 8, as shown in the top view of the wall corner shown in fig. 8a, two ultrasonic signals of the two-channel ultrasonic signal transmitting circuit are placed on the same plane of the substance to be measured, or can be placed on the adjacent planes, and two receiving ends of the two-channel echo signal receiving circuit are placed on the adjacent planes, as shown in fig. 8b, where signals 1 and 2 represent two-channel transmitted ultrasonic signals, and signals 1 'and 2' represent two-channel echo signals; the method comprises the steps of firstly acquiring a detection route formed by a signal 1 and a signal 1 ', acquiring a detection route formed by a signal 2 and a signal 2', simultaneously translating two ultrasonic signal detection routes in the same plane range to finish the acquisition of echo data of different detection routes of a plane at a position to be detected until all position marks of a substance to be detected are finished, carrying out feature extraction on the acquired data, analyzing feature signals, finding out two detection routes corresponding to signals with defects, and positioning the positions of the defects according to intersection points of the detection routes. Referring to fig. 9, fig. 9 is a schematic diagram illustrating defect detection according to a fourth embodiment. In the fourth embodiment, the method can be used in the case where there are two adjacent detectable planes, such as the detection of a corner, and when the measurement is performed in the combined manner of the oblique measurement method and the oblique measurement method as shown in fig. 9, as shown in the top view of the corner in fig. 9a, two ultrasonic signals of the binaural ultrasonic signal transmitting circuit are placed on the same plane of the substance to be measured, or can be placed on the adjacent planes, and two receiving ends of the two-way echo signal receiving circuit are placed on the planes adjacent to the receiving ends, as shown in fig. 9b, where signals 1 and 2 represent the two-way transmitted ultrasonic signals, and signals 1 'and 2' represent the two-way echo signals; the method comprises the steps of firstly acquiring a detection route formed by a signal 1 and a signal 1 ', acquiring a detection route formed by a signal 2 and a signal 2', simultaneously translating two ultrasonic signal detection routes in the same plane range to finish the acquisition of echo data of different detection routes of a plane at a position to be detected until all position marks of a substance to be detected are finished, carrying out feature extraction on the acquired data, analyzing feature signals, finding out two detection routes corresponding to signals with defects, and positioning the positions of the defects according to intersection points of the detection routes.
In summary, the present invention provides a binaural ultrasonic defect localization method and a system thereof, including a binaural ultrasonic signal emitting circuit 10 and a dual echo signal receiving circuit 20, and simultaneously detecting the detection substance by using different combination methods of a pair detection method and an oblique detection method, wherein the detection routes formed by the two ultrasonic detection methods are non-parallel in the same plane, extracting the defect characteristics from the signals received by the two echo signal receiving terminals, finding out the two detection routes corresponding to the defect signals by analyzing the defect characteristics, and localizing the defect position according to the intersection point of the detection routes.