CN112230803B - Touch substrate and preparation method thereof, display device - Google Patents
Touch substrate and preparation method thereof, display device Download PDFInfo
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- CN112230803B CN112230803B CN202011173636.8A CN202011173636A CN112230803B CN 112230803 B CN112230803 B CN 112230803B CN 202011173636 A CN202011173636 A CN 202011173636A CN 112230803 B CN112230803 B CN 112230803B
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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Abstract
本发明实施例提供一种触控基板及其制备方法、显示装置，该触控基板包括基底、设置在所述基底上的触控引线层、设置在所述触控引线层上的封装层以及设置在所述封装层上的触控电极层，所述封装层中开设有与所述触控引线层连通的第一开孔，所述触控电极层通过所述第一开孔与所述触控引线层连接，能够增大触控电极层与触控引线层之间的距离，减少触控电极层与触控引线层之间产生的寄生电容。
Embodiments of the present invention provide a touch substrate, a preparation method thereof, and a display device. The touch substrate includes a substrate, a touch lead layer provided on the substrate, an encapsulation layer provided on the touch lead layer, and A touch electrode layer is provided on the packaging layer. A first opening connected to the touch lead layer is opened in the packaging layer. The touch electrode layer communicates with the touch electrode layer through the first opening. The touch lead layer connection can increase the distance between the touch electrode layer and the touch lead layer, and reduce the parasitic capacitance generated between the touch electrode layer and the touch lead layer.
Description
Technical Field
The invention relates to the technical field of display, in particular to a touch substrate, a preparation method thereof and a display device.
Background
The organic light emitting diode display device (OrganicLightEmittingDiode, OLED) is a development trend of future display products, and has a series of advantages of wide viewing angle, high response speed, high brightness, high contrast, bright color, light weight, thin thickness, low power consumption and the like. Currently, organic light emitting diode display devices have begun to be applied to mobile phone screens.
With the appearance and continuous development of the OLED display technology, the flexible display is a trend of future display development, and the flexible screen which can be bent and curled is applied to mobile phones and flat plates in a large amount, so that the touch layer is required to have bending performance, and the existing AMOLED flexible screen is changed from a plug-in type mutual capacitance structure to an oncell mutual capacitance structure. In the oncell mutual capacitance structure, the touch electrode layer is very close to the cathode in the light-emitting unit, so that a large parasitic capacitance is increased, and a processing circuit is required to have a high capability to detect the touch position of the finger. In the oncell self-contained structure, since there are many touch lead layers led out, the touch lead layers need to be individually made into a film layer. At present, because the distance between the touch lead layer and the touch electrode layer is relatively close, parasitic capacitance is increased, and touch accuracy is affected.
Disclosure of Invention
The embodiment of the invention aims to solve the technical problem of providing a touch substrate, a preparation method thereof and a display device, which can increase the distance between a touch electrode layer and a touch lead layer and reduce parasitic capacitance generated between the touch electrode layer and the touch lead layer.
In order to solve the technical problems, the embodiment of the invention provides a touch substrate, which comprises a substrate, a touch lead layer arranged on the substrate, a packaging layer arranged on the touch lead layer and a touch electrode layer arranged on the packaging layer, wherein a first opening communicated with the touch lead layer is formed in the packaging layer, and the touch electrode layer is connected with the touch lead layer through the first opening.
In an exemplary embodiment, the display device further includes a light emitting unit disposed on the substrate, the encapsulation layer covers the light emitting unit, the light emitting unit includes a first pixel electrode formed on the same film layer as the touch lead layer.
In an exemplary embodiment, the light emitting unit further includes a pixel definition layer disposed on the first pixel electrode and the touch lead layer, the encapsulation layer is disposed on the pixel definition layer, a second opening communicating with the touch lead layer is formed in the pixel definition layer, and the touch lead layer is connected with the touch lead layer through the first opening and the second opening.
In an exemplary embodiment, a third opening communicating with the first pixel electrode is formed in the pixel defining layer, and the light emitting unit further includes a light emitting layer disposed in the third opening and a second pixel electrode disposed on the light emitting layer.
In an exemplary embodiment, the pixel structure further includes a protection layer disposed between the pixel defining layer and the encapsulation layer, a fourth opening communicating with the second opening is formed in the protection layer, and an edge of the protection layer near one side of the second opening is connected with the encapsulation layer.
In an exemplary embodiment, the encapsulation layer includes a first inorganic encapsulation layer disposed on the protection layer, an organic encapsulation layer formed on the first inorganic encapsulation layer, and a second inorganic encapsulation layer formed on the organic encapsulation layer, wherein an edge of the second inorganic encapsulation layer near the second opening is connected to an edge of the protection layer near the second opening.
In an exemplary embodiment, the display device further includes a source drain layer and a display lead disposed on the substrate, and a flat layer disposed on the source drain layer and the display lead, wherein a fourth opening communicated with the source drain layer is formed in the flat layer, the first pixel electrode is disposed on the flat layer and connected with the source drain layer through the fourth opening, and the source drain layer and the display lead are formed on the same film layer.
In an exemplary embodiment, the touch lead layer further comprises a processing circuit arranged on the substrate, and the touch lead layer is connected with the processing circuit.
The embodiment of the invention also provides a display device which comprises any one of the touch substrates.
The embodiment of the invention also provides a preparation method of the touch substrate, which comprises the following steps:
forming a touch lead layer on a substrate;
forming a packaging layer on the touch lead layer, and forming a first opening communicated with the touch lead layer in the packaging layer;
and forming a touch lead layer on the packaging layer, and connecting the touch lead layer with the touch lead layer through the first opening.
The invention provides a touch substrate, a preparation method thereof and a display device, wherein a touch electrode layer is separated from a touch lead layer through a packaging layer, so that the touch electrode layer is connected with the touch lead layer through a first opening on the packaging layer, the distance between the touch electrode layer and the touch lead layer is increased, the parasitic capacitance between the touch electrode layer and the touch lead layer is reduced, the product yield is improved, the performance of a capacitive active pen is improved, the signal attenuation of an active pen signal in the transmission process is reduced, and the signal receiving intensity is enhanced. At the same time, by making holes in the encapsulation layer, the practical usability is increased.
Of course, it is not necessary for any one product or method of practicing the invention to achieve all of the advantages set forth above at the same time. Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of embodiments of the invention may be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate and do not limit the invention. The shapes and sizes of the various components in the drawings are not to scale, and are intended to illustrate the present invention only.
FIG. 1 is a schematic diagram of a touch substrate according to an embodiment of the present invention;
fig. 2 is a cross-sectional view of a touch substrate according to an embodiment of the invention.
Detailed Description
The following describes in further detail the embodiments of the present invention with reference to the drawings and examples. The following examples are illustrative of the invention and are not intended to limit the scope of the invention. It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be arbitrarily combined with each other.
At present, 2 metal layers are arranged on the packaging layer, and the 2 metal layers are respectively manufactured to form a touch electrode layer and a touch lead layer. For example, taking an about 8-inch screen as an example, the touch unit is 4.2mm, and the touch unit at least needs more than 1000 touch lead layers. The touch lead layer and the touch electrode layer are layered to form two layers of film layers, so that the lead can be conveniently led. However, in the structure, the distance between the touch lead layer and the touch electrode layer is very short, so that parasitic capacitance is generated between the touch lead layer and the touch electrode layer.
The embodiment of the invention provides a touch substrate, which comprises a substrate, a touch lead layer arranged on the substrate, a packaging layer arranged on the touch lead layer and a touch electrode layer arranged on the packaging layer, wherein a first opening communicated with the touch lead layer is formed in the packaging layer, and the touch lead layer is connected with the touch lead layer through the first opening.
FIG. 1 is a schematic diagram of a touch substrate according to an embodiment of the present invention; fig. 2 is a cross-sectional view of a touch substrate according to an embodiment of the invention. As shown in fig. 1 and 2, the touch substrate of the embodiment of the invention includes a substrate 10, a touch lead layer 20 disposed on the substrate 10, a packaging layer 30 disposed on the touch lead layer 20, and a touch electrode layer 40 disposed on the packaging layer 30. The encapsulation layer 30 is provided with a first opening communicated with the touch lead layer 20, and the touch electrode layer 40 is connected with the touch lead layer 20 through the first opening. The touch electrode layer 40 may be a self-capacitance touch electrode layer. The substrate 10 may have a single-layer and multi-layer structure, and the multi-layer structure may be composed of a composite of an organic film layer and an inorganic film layer. The touch lead layer 20 is connected to the touch electrode layer 40, and is capable of transmitting a touch signal.
According to the touch substrate, the touch electrode layer 40 and the touch lead layer 20 are separated through the packaging layer 30, so that the touch electrode layer 40 is connected with the touch lead layer 20 through the first opening on the packaging layer 30, the distance between the touch electrode layer 40 and the touch lead layer 20 is increased, parasitic capacitance between the touch electrode layer 40 and the touch lead layer 20 is reduced, the product yield is improved, the performance of a capacitive active pen can be improved, the signal attenuation of an active pen signal in the transmission process is reduced, and the signal receiving intensity is enhanced. At the same time, by making holes in the encapsulation layer, the practical usability is increased.
As shown in fig. 2, the touch substrate of the embodiment of the invention further includes a light emitting unit 50 disposed on the base 10, the light emitting unit 50 includes a driving structure layer disposed on the base 10 and a light emitting structure layer disposed on the driving structure layer, and the encapsulation layer 30 covers the light emitting structure layer to isolate water and oxygen from entering and protect the light emitting material in the light emitting structure layer. The driving structure layer mainly includes a plurality of thin film transistors (ThinFilm Transistor, TFT) for controlling light emission of the light emitting structure layer. The light emitting structure layer includes a first pixel electrode 60 disposed on the driving structure layer, a pixel defining layer 70 disposed on the first pixel electrode 60, a light emitting layer 80 disposed on the pixel defining layer 70, and a second pixel electrode 90 disposed on the light emitting layer 80. The pixel defining layer 70 has a third opening communicating with the first pixel electrode 60, and the light emitting layer 80 is disposed in the third opening and connected to the first pixel electrode 60. The encapsulation layer 30 is disposed on the pixel defining layer 70 and covers the light emitting layer 80 and the second pixel electrode 90, thereby protecting the light emitting layer 80.
In the exemplary embodiment, the first pixel electrode 60 and the touch lead layer 20 are formed on the same film layer, i.e., the first pixel electrode 60 and the touch lead layer 20 are prepared through the same preparation process, thereby simplifying the process and saving the production cost.
In an exemplary embodiment, the thin film transistor includes a source and drain layer 90 and a display lead 100 disposed on a substrate 10, and a planarization layer 110 disposed on the source and drain layer 90 and the display lead 100, the planarization layer 110 having the first pixel electrode 60 and the touch lead layer 20 disposed thereon. The planarization layer 110 has a fourth opening in communication with the source/drain layer 90, and the first pixel electrode 60 is connected to the source/drain layer 90 through the fourth opening. The source and drain electrode layer 90 and the display lead 100 are formed on the same film layer, namely, the source and drain electrode layer 90 and the display lead 100 are prepared through the same preparation process, so that the process is simplified, and the production cost is saved.
In an exemplary embodiment, the pixel defining layer 70 is located between the first pixel electrode 60 and the touch lead layer 20 and the encapsulation layer 30. The second opening communicated with the touch lead layer 20 is formed in the pixel definition layer 70, the second opening is communicated with the first opening in the packaging layer 30, and the touch electrode layer 40 is connected with the touch lead layer 20 through the first opening and the second opening, so that the touch electrode layer 40 and the touch lead layer 20 are separated through the pixel definition layer 70 and the packaging layer 30, the distance between the touch electrode layer 40 and the touch lead layer 20 is further increased, and parasitic capacitance between the touch electrode layer 40 and the touch lead layer 20 is reduced.
In an exemplary embodiment, the touch substrate of the embodiment of the present invention further includes a protective layer 120 disposed between the pixel defining layer 70 and the encapsulation layer 30, and a fourth opening communicating with the second opening in the pixel defining layer 70 is formed in the protective layer 120. Wherein the first opening, the fourth opening and the second opening are communicated with each other and expose the touch lead layer 20. The edge of the protection layer 120 near the side of the second opening is connected with the encapsulation layer 30, and the protection layer 120 and the encapsulation layer 30 are combined to form a protection layer to prevent water and oxygen from invading the luminescent material.
In an exemplary embodiment, the encapsulation layer 30 includes a first inorganic encapsulation layer 301 disposed on the protective layer 120, an organic encapsulation layer 302 formed on the first inorganic encapsulation layer 301, and a second inorganic encapsulation layer 303 formed on the organic encapsulation layer 302, edges of the first inorganic encapsulation layer 301 and the second inorganic encapsulation layer 303 near one side of the second opening cover sidewalls of the first opening, the fourth opening, and the second opening, and are connected with edges of the protective layer 120 near one side of the second opening, thereby forming a protective layer protecting the light emitting material. The protective layer 120 may be an inorganic material. The first inorganic encapsulation layer 301, the second inorganic encapsulation layer 303, and the protective layer 120 may employ silicon nitride (SiNx) or silicon oxide (SiOx), or the like.
In an exemplary embodiment, the touch substrate further includes a processing circuit disposed on the substrate, and the touch lead layer is connected to the processing circuit and transmits a touch signal formed by the touch electrode layer to the processing circuit.
In the touch substrate of the embodiment of the invention, the touch structure is manufactured by 2 layers, and one layer is mainly manufactured to form a touch electrode layer which is positioned on the packaging layer. The other layer is mainly used for carrying out a touch control wiring layer and is positioned on the substrate. The touch control mode of the touch control substrate can be a self-capacitance mode or a mutual capacitance mode, so long as the touch control electrode layer and the touch control wiring are divided into two film layers.
The technical scheme of the present embodiment is further described below through the process of manufacturing the touch substrate of the present embodiment. As shown in fig. 2, the preparation process of the touch substrate includes:
1) The substrate 10 is prepared. In an exemplary embodiment, the substrate 10 may include a first flexible material layer, a first inorganic material layer, a semiconductor layer, a second flexible material layer, and a second inorganic material layer stacked on a glass carrier plate. The first and second flexible material layers may be Polyimide (PI), polyethylene terephthalate (PET), or surface-treated polymer soft films, the first and second inorganic material layers may be silicon nitride (SiNx) or silicon oxide (SiOx) for improving the water-oxygen resistance of the substrate, the first and second inorganic material layers may be called Barrier (Barrier) layers, and the semiconductor layer may be amorphous silicon (a-si). In an exemplary embodiment, the substrate 10 may be a stack of PI 1/barrer 1/a-si/PI 2/barrer 2.
2) On the substrate 10 on which the foregoing pattern is formed, a first metal film is deposited on the substrate 10, and the first metal film is patterned by a patterning process, so that the first metal film forms the source and drain layer 90 and the display lead 100 on the substrate 10, respectively.
3) On the substrate 10 on which the foregoing pattern is formed, a flat thin film of an organic material is coated on the source and drain layer 90 and the display lead 100, and a flat layer (PLN) 110 covering the entire substrate 10 is formed through a patterning process. A fourth opening is formed in the Planar Layer (PLN) 110, and the planar layer 110 in the fourth opening is etched away to expose the source/drain layer 90.
4) On the substrate 10 having the above pattern formed thereon, a second metal film is deposited on the planarization layer 110, and the second metal film is patterned by a patterning process, so that the second metal film forms the first pixel electrode 60 and the touch lead layer 20 on the planarization layer 110, respectively.
5) On the substrate 10 on which the foregoing pattern is formed, a pixel defining film and an inorganic film are coated on the first pixel electrode 60 and the touch lead layer 20, and the pixel defining film and the inorganic film are patterned by a patterning process to form a Pixel Defining Layer (PDL) 70 and a protective layer 120 on the Pixel Defining Layer (PDL) 70. Etching the protective layer 120 and the pixel definition layer 70 through an etching process, so that the orthographic projection of the protective layer 120 on the substrate 10 is not overlapped with the orthographic projection of the first pixel electrode 60 and the touch lead layer 20 on the substrate 10, and a fourth opening is formed on the protective layer 120; a second opening and a third opening are formed on the pixel defining layer 70, the third opening exposes the surface of the first pixel electrode 60, the pixel defining layer 70 in the second opening is etched away, the protective layer 120 in the fourth opening is etched away, and the second opening is communicated with the fourth opening to expose the surface of the touch lead layer 20.
6) Depositing a light emitting material on the first pixel electrode 60 exposed in the third opening on the substrate 10 forming the aforementioned pattern to form a light emitting layer 80; subsequently, a third metal film is deposited on the light emitting layer 80, and the third metal film is patterned through a patterning process to form the second pixel electrode 130.
7) On the substrate 10 with the above pattern, a layer of packaging film covering the second pixel electrode 130 is coated and deposited on the protective layer 120, the packaging film is patterned by a patterning process to form a packaging layer 30, a first opening is formed in the packaging layer 30, the packaging layer 30 in the first opening is etched away, so that the first opening, the fourth opening and the second opening are communicated, and the surface of the touch lead layer 20 is exposed. The edges of the encapsulation layer 30 encapsulate the sidewalls of the first opening, the fourth opening and the second opening, and are connected to the edges of the exposed surface of the touch lead layer 20. In an exemplary embodiment, the encapsulation layer 30 may include a first inorganic encapsulation layer 301 formed on the protective layer 120, an organic encapsulation layer 302 formed on the first inorganic encapsulation layer 301, and a second inorganic encapsulation layer 303 formed on the organic encapsulation layer 302. The edges of the first inorganic packaging layer 301 and the second inorganic packaging layer 303, which are close to one side of the second opening, are coated on the side walls of the first opening, the fourth opening and the second opening, and are respectively connected with the edges of the protective layer 120, which are close to one side of the second opening, and the exposed edges of the surface of the touch lead layer 20, so that a protective layer is formed, water and oxygen are isolated, and the service life of the luminescent material is ensured.
8) On the substrate 10 with the above pattern, a fourth metal film is deposited on the encapsulation layer 30, and the fourth metal film is patterned by a patterning process, so that a touch electrode layer is formed on the encapsulation layer 30 by the fourth metal film, and the touch electrode layer is connected with the touch lead layer 20 through the first opening, the fourth opening and the second opening.
The embodiment of the invention also provides a display device, which comprises the touch substrate of the embodiment. The display device may be: any product or component with display function such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.
The embodiment of the invention also provides a preparation method of the touch substrate, which comprises the following steps:
forming a touch lead layer on a substrate;
forming a packaging layer on the touch lead layer, and forming a first opening communicated with the touch lead layer in the packaging layer;
and forming a touch lead layer on the packaging layer, and connecting the touch lead layer with the touch lead layer through the first opening.
In the description of the embodiments of the present invention, it should be understood that the terms "middle," "upper," "lower," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, merely to facilitate description of the present invention and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
In describing embodiments of the present invention, it should be noted that, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "connected" should be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Although the embodiments of the present invention are described above, the embodiments are only used for facilitating understanding of the present invention, and are not intended to limit the present invention. Any person skilled in the art can make any modification and variation in form and detail without departing from the spirit and scope of the present disclosure, but the scope of the present disclosure is to be determined by the appended claims.
Claims (7)
1. The touch substrate is characterized by comprising a substrate, a touch lead layer arranged on the substrate, a packaging layer arranged on the touch lead layer and a touch electrode layer arranged on the packaging layer, wherein a first opening communicated with the touch lead layer is formed in the packaging layer, and the touch electrode layer is connected with the touch lead layer through the first opening; the packaging layer covers the light-emitting unit, the light-emitting unit comprises a first pixel electrode, and the first pixel electrode and the touch lead layer are formed on the same film layer; the light-emitting unit further comprises a pixel definition layer arranged on the first pixel electrode and the touch lead layer, the packaging layer is arranged on the pixel definition layer, and a second opening communicated with the touch lead layer is formed in the pixel definition layer; the touch electrode layer is connected with the touch lead layer through the first opening, the fourth opening and the second opening.
2. The touch substrate according to claim 1, wherein a third opening communicating with the first pixel electrode is formed in the pixel defining layer, and the light emitting unit further comprises a light emitting layer disposed in the third opening and a second pixel electrode disposed on the light emitting layer.
3. The touch substrate according to claim 1, wherein the encapsulation layer comprises a first inorganic encapsulation layer disposed on the protection layer, an organic encapsulation layer formed on the first inorganic encapsulation layer, and a second inorganic encapsulation layer formed on the organic encapsulation layer, and an edge of the second inorganic encapsulation layer near the second opening is connected to an edge of the protection layer near the second opening.
4. The touch substrate according to claim 1, further comprising a source/drain layer and a display lead disposed on the substrate, and a flat layer disposed on the source/drain layer and the display lead, wherein a fourth opening is formed in the flat layer and is communicated with the source/drain layer, the first pixel electrode is disposed on the flat layer and is connected to the source/drain layer through the fourth opening, and the source/drain layer and the display lead are formed on the same film layer.
5. The touch substrate of claim 1, further comprising a processing circuit disposed on the base, the touch lead layer being connected to the processing circuit.
6. A display device comprising a touch substrate according to any one of claims 1-5.
7. The preparation method of the touch substrate is characterized by comprising the following steps of:
forming a touch lead layer and a first pixel electrode on a substrate, wherein the first pixel electrode and the touch lead layer are formed on the same film layer;
forming a pixel definition layer on the touch lead layer and the first pixel electrode, wherein a second opening communicated with the touch lead layer is formed in the pixel definition layer;
forming a protective layer on the pixel definition layer, wherein a fourth opening communicated with the second opening is formed in the protective layer;
forming a packaging layer on the protective layer, forming a first opening communicated with the fourth opening in the packaging layer, and connecting the edge of the protective layer, which is close to one side of the second opening, with the packaging layer;
and forming a touch electrode layer on the packaging layer, and connecting the touch electrode layer with the touch lead layer through the first opening, the fourth opening and the second opening.
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| CN108336116A (en) * | 2018-02-08 | 2018-07-27 | 京东方科技集团股份有限公司 | A kind of OLED array and preparation method thereof, display device |
| CN108538852A (en) * | 2018-03-26 | 2018-09-14 | 上海天马微电子有限公司 | Flexible display panel and flexible display device |
| CN109671747A (en) * | 2018-12-12 | 2019-04-23 | 武汉华星光电技术有限公司 | A kind of OLED display |
| CN111106156A (en) * | 2020-01-07 | 2020-05-05 | 京东方科技集团股份有限公司 | Display panel, preparation method thereof and display device |
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