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CN112166502A - 一种倒装芯片的封装结构及电子设备 - Google Patents

一种倒装芯片的封装结构及电子设备 Download PDF

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Publication number
CN112166502A
CN112166502A CN201880093928.5A CN201880093928A CN112166502A CN 112166502 A CN112166502 A CN 112166502A CN 201880093928 A CN201880093928 A CN 201880093928A CN 112166502 A CN112166502 A CN 112166502A
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chip
metal
electromagnetic
functional circuit
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CN112166502B (zh
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吴韦
李定
尹红成
匡雄才
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Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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    • H10W42/20—
    • H10W42/263—
    • H10W42/273—
    • H10W42/284—
    • H10W70/60—
    • H10W72/227—
    • H10W72/232—
    • H10W72/248—
    • H10W72/252—
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    • H10W72/267—
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Waveguides (AREA)

Abstract

一种倒装芯片的封装结构及电子设备。封装结构包括：基板、芯片、导电凸块和第一金属结构，芯片的上表面通过多个导电凸块与基板朝向芯片的表面形成电气连接；第一金属结构包含多个第一金属柱，每个第一金属柱置于基板和芯片之间，与基板以及芯片形成电气连接，多个第一金属柱围绕第一有源功能电路排列，第一有源功能电路为芯片中具有电磁辐射能力和/或电磁接收能力的电路。采用上述封装结构，多个第一金属柱可以改变基板、芯片以及导电凸块之间形成的谐振腔的谐振特性，从而减小干扰源对受扰体的干扰，提高干扰源和受扰体之间的电磁隔离度。

Description

PCT国内申请，说明书已公开。

Claims (10)

  1. PCT国内申请，权利要求书已公开。
CN201880093928.5A 2018-05-31 2018-05-31 一种倒装芯片的封装结构及电子设备 Active CN112166502B (zh)

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CN112166502B CN112166502B (zh) 2023-01-13

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
CN112803942A (zh) * 2021-01-30 2021-05-14 珠海巨晟科技股份有限公司 减弱无线干扰的触摸按键芯片封装结构及信号处理方法

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US11309243B2 (en) * 2019-08-28 2022-04-19 Taiwan Semiconductor Manufacturing Company, Ltd. Package having different metal densities in different regions and manufacturing method thereof
US11177223B1 (en) * 2020-09-02 2021-11-16 Qualcomm Incorporated Electromagnetic interference shielding for packages and modules

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US20050104222A1 (en) * 2003-10-22 2005-05-19 Jeong Se-Young Flip chip device having supportable bar and mounting structure thereof
US20070132094A1 (en) * 2005-12-12 2007-06-14 Fujitsu Limited & Eudyna Devices Inc. Circuit module
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US20120313240A1 (en) * 2011-06-09 2012-12-13 Shih-Lian Cheng Semiconductor package and fabrication method thereof
CN104051431A (zh) * 2013-03-14 2014-09-17 Nxp股份有限公司 具有射频屏蔽的系统、半导体器件及其制造方法
CN104425460A (zh) * 2013-09-11 2015-03-18 恩智浦有限公司 集成电路
CN107408551A (zh) * 2015-02-27 2017-11-28 高通股份有限公司 倒装芯片（fc）模块中的分隔屏蔽
CN107818956A (zh) * 2016-09-12 2018-03-20 联发科技股份有限公司 半导体封装、封装上封装及其制造方法

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US6509640B1 (en) * 2000-09-29 2003-01-21 Intel Corporation Integral capacitor using embedded enclosure for effective electromagnetic radiation reduction
WO2007076443A2 (en) 2005-12-21 2007-07-05 Colt Rapid Mat, Llc Rapidly installable energy barrier system
US8492762B2 (en) * 2006-06-27 2013-07-23 General Electric Company Electrical interface for a sensor array
US8017436B1 (en) * 2007-12-10 2011-09-13 Amkor Technology, Inc. Thin substrate fabrication method and structure
US9312927B2 (en) 2013-11-11 2016-04-12 Qualcomm Incorporated Tunable guard ring for improved circuit isolation
US9496231B1 (en) 2015-12-03 2016-11-15 Intel IP Corporation Bypass ring to improve noise isolation of coils and inductors
CN105428325B (zh) * 2015-12-22 2017-03-22 苏州日月新半导体有限公司 一种带金属屏蔽层的单层超薄基板封装结构的制备工艺及其制品
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Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11233695A (ja) * 1998-02-12 1999-08-27 Matsushita Electric Ind Co Ltd 半導体装置
US20050104222A1 (en) * 2003-10-22 2005-05-19 Jeong Se-Young Flip chip device having supportable bar and mounting structure thereof
US20070132094A1 (en) * 2005-12-12 2007-06-14 Fujitsu Limited & Eudyna Devices Inc. Circuit module
CN102593104A (zh) * 2011-01-05 2012-07-18 矽品精密工业股份有限公司 半导体封装件及其制造方法
US20120313240A1 (en) * 2011-06-09 2012-12-13 Shih-Lian Cheng Semiconductor package and fabrication method thereof
CN104051431A (zh) * 2013-03-14 2014-09-17 Nxp股份有限公司 具有射频屏蔽的系统、半导体器件及其制造方法
CN104425460A (zh) * 2013-09-11 2015-03-18 恩智浦有限公司 集成电路
CN107408551A (zh) * 2015-02-27 2017-11-28 高通股份有限公司 倒装芯片（fc）模块中的分隔屏蔽
CN107818956A (zh) * 2016-09-12 2018-03-20 联发科技股份有限公司 半导体封装、封装上封装及其制造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112803942A (zh) * 2021-01-30 2021-05-14 珠海巨晟科技股份有限公司 减弱无线干扰的触摸按键芯片封装结构及信号处理方法

Also Published As

Publication number Publication date
CN112166502B (zh) 2023-01-13
US20210013154A1 (en) 2021-01-14
WO2019227436A1 (zh) 2019-12-05
US11251136B2 (en) 2022-02-15

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