CN112000201A - Cooling system and its coolant distribution module - Google Patents

Abstract

The invention provides a heat dissipation system and a cooling liquid distribution module thereof, which are applied to a plurality of electronic components of electronic computer equipment. The heat dissipation system includes a plurality of water cooling heads, a radiator and a cooling liquid distribution module. The plurality of water-cooling heads are respectively corresponding to the plurality of electronic components. The radiator exchanges heat with the passing fluid medium. The cooling liquid distribution module is connected between the plurality of water cooling heads and the radiator. The coolant distribution module includes a module body and a power module. The module body includes a cold water chamber. The cold water chamber has a plurality of first liquid outlets, and the plurality of first liquid outlets correspond to the plurality of water cooling heads respectively. The power module is arranged in the module body, and the power module drives the fluid medium to flow out from the plurality of first liquid outlets, so that the fluid medium circulates in the plurality of water cooling heads, radiators and cooling liquid distribution modules. Therefore, the present invention can be applied to electronic computer equipment with relatively small space.

Description

Cooling system and its coolant distribution module

technical field

The present invention relates to a heat dissipation system, in particular to a heat dissipation system with a cooling liquid distribution module and the cooling liquid distribution module thereof.

Background technique

With the advancement and popularization of science and technology, various electronic devices or computer equipment have long been indispensable in people's daily life, such as notebook computers, desktop computers, and network servers. Generally speaking, the electronic components inside these products will increase the temperature during operation, and the high temperature can easily cause damage to the components. Therefore, the heat dissipation mechanism is a very important and necessary design for these electronic products. The general heat dissipation design includes the use of fans to provide airflow for convection cooling, or the use of special materials to attach heat dissipation units to generate conduction cooling. In addition, the water cooling mechanism is also an effective and common heat dissipation design.

The principle of water-cooled heat dissipation is simple, generally using liquid (such as water or coolant) as the heat dissipation medium, and using a continuously operating pump to form a continuous circulation in the applied system. Liquids flow in closed conduits, and these conduits are distributed over the surfaces of the various electronic components in the system, such as the central processing unit. As the relatively cold liquid flows through these relatively hot electronic components, it absorbs its heat to slow its temperature rise. Then, with the heat exchange of the pipeline to the outside world or other heat dissipation mechanisms, heat is released to reduce the temperature of the liquid, and the liquid is returned to the system for circulation and heat dissipation.

For example, a Rack Coolant Distribution Unit (RackCDU for short) is a water-cooled device currently used in server equipment. This kind of distribution device can directly bring the cooling liquid to multiple cold plates in a server rack through multiple pipelines at the same time, and adjust the flow to evenly distribute the cooling liquid to each cold plate, so as to be on the cold plates at the same time. The various electronic components (such as the central processing unit) are cooled. The distribution device then continuously inputs the cooling liquid into the server rack and takes away the heat inside the server rack through the relevant pump, the closed circuit and the heat exchange mechanism at the back end, etc.

As mentioned above, the distribution device uses a set of external circulating cold water inlets and hot water outlets to connect with the rear cooling pipeline (extends outside the server rack), and all the cold plates can be arranged in vertical layers. Each cold plate also has a set of cold water inlet and hot water outlet, and is connected in parallel to the cold water inlet and hot water outlet of the other cold plates through a manifold device (located in the server rack).

However, in the above-mentioned water-cooled heat dissipation system used in server equipment, the cooling liquid distribution device must use a set of external circulation to achieve the purpose of heat exchange and the manifold device to achieve the purpose of evenly distributing the cooling liquid to each cold plate. In this way, the volume of the entire cooling system will be too large, and it cannot be used in electronic equipment with relatively small internal space (such as the host of a personal computer). Therefore, how to improve this problem is indeed a concern of relevant personnel in the field. Focus.

SUMMARY OF THE INVENTION

The technical problem to be solved by the present invention is to provide a heat dissipation system in view of the above-mentioned deficiencies in the prior art, the structural design of the cooling liquid distribution module can be applied to electronic computer equipment with relatively narrow space.

The technical problem to be solved by the present invention is to provide a cooling liquid distribution module in view of the above-mentioned deficiencies in the prior art, the structural design of which can be applied to electronic computer equipment with relatively narrow space.

The technical solution adopted by the present invention to solve the technical problem is to provide a heat dissipation system, which is applied to electronic computer equipment. The electronic computer equipment includes a plurality of electronic components, and the heat dissipation system includes a plurality of water cooling heads, a radiator and a cooling liquid distribution module. The plurality of water-cooling heads are respectively corresponding to the plurality of electronic components. The radiator exchanges heat with the fluid medium passing therethrough. The cooling liquid distribution module is connected between the plurality of water cooling heads and the radiator. The coolant distribution module includes a module body and a power module. The module body includes a cold water chamber. The cold water chamber has a plurality of first liquid outlets, and the plurality of first liquid outlets are respectively connected to the plurality of water cooling heads. The power module is disposed in the module body, and the power module drives the fluid medium to flow out from the plurality of first liquid outlets, so that the fluid medium circulates in the plurality of water cooling heads, radiators and cooling liquid distribution modules.

Preferably, the module body further includes a water storage chamber, the power module is arranged between the water storage chamber and the cold water chamber, the water storage chamber has a first liquid inlet, and the The water storage chamber and the cold water chamber communicate with each other, and the power module drives the fluid medium flowing into the water storage chamber from the first liquid inlet to flow out of the cold water chamber from the plurality of first liquid outlets.

Preferably, the module body further includes a hot water chamber, the hot water chamber is not communicated with the cold water chamber and the water storage chamber, the hot water chamber includes a plurality of second liquid inlets and a The second liquid outlet, and the plurality of second liquid inlets respectively correspond to the plurality of water cooling heads.

Preferably, the plurality of first liquid outlets of the cold water chamber are arranged along a first reference line, the plurality of second liquid inlets of the hot water chamber are arranged along a second reference line, the The cold water chamber extends along the first reference line, the hot water chamber extends along the second reference line, and the cold water chamber and the hot water chamber are arranged along a third reference line, wherein the first reference line The reference line and the second reference line are parallel to each other, and the first reference line and the second reference line are respectively perpendicular to the third reference line.

Preferably, each water-cooled head includes a water-cooled head liquid inlet and a water-cooled head liquid outlet, the water-cooled head liquid inlet corresponds to and is in fluid communication with one of the plurality of first liquid outlets, and the water-cooled head is in fluid communication. The head liquid outlet corresponds to and is in fluid communication with one of the plurality of second liquid inlets; wherein, the fluid medium flows out of the corresponding water-cooled head through the water-cooled head liquid outlet, and passes through the corresponding second liquid inlet The inlet flows into the hot water chamber, and the fluid medium flows out of the cold water chamber through the plurality of first liquid outlets, and flows into the corresponding water cooling head through the corresponding liquid inlet of the water cooling head.

Preferably, the radiator includes a radiator liquid inlet and a radiator liquid outlet, the radiator liquid inlet and the radiator liquid outlet are respectively the second liquid outlet and the first liquid inlet Fluid communication; wherein the fluid medium flows out of the hot water chamber through the second liquid outlet, and flows into the radiator through the radiator inlet, and the fluid medium flows out of the radiator through the radiator outlet , and flows into the water storage chamber through the first liquid inlet.

Preferably, the power module includes a power module liquid outlet, and the cooling liquid distribution module further includes a flow control device, and the flow control device is configured between the power module liquid outlet and the plurality of first outlets. Between the liquid ports, the flow control device is used to control the flow rate of the fluid medium flowing out from the plurality of first liquid outlets.

Preferably, the flow control device includes a sensor and a microcontroller, the sensor is used for sensing a flow value between the liquid outlet of the power module and the plurality of first liquid outlets, the The microcontroller controls the flow rate of the fluid medium flowing out from the plurality of first liquid outlets according to the flow rate value.

Preferably, the cooling liquid distribution module further includes a thermal sensor, the thermal sensor is disposed between the liquid outlet of the power module and the plurality of first liquid outlets, and the thermal sensor is used to sense the A temperature value between the liquid outlet of the power module and the plurality of first liquid outlets.

Preferably, the electronic computer device is a personal computer host, and the plurality of electronic components are display cards disposed in the personal computer host.

The present invention also provides a cooling liquid distribution module, which is applied to a heat dissipation system. The heat dissipation system is used to dissipate heat from a plurality of electronic components on an electronic computer device. The heat dissipation system includes a plurality of water cooling units respectively corresponding to the plurality of electronic components. The head and the radiator, the cooling liquid distribution module includes the module body and the power module. The module body is connected between the plurality of water cooling heads and the radiator. The module body includes a cold water chamber, and the cold water chamber has a plurality of first liquid outlets, and the plurality of first liquid outlets correspond to the plurality of first liquid outlets respectively. A water cooler. The power module is arranged in the module body, and the power module is used to drive the fluid medium to flow out from the plurality of first liquid outlets, so that the fluid medium circulates in the plurality of water cooling heads, radiators and cooling liquid distribution modules flow.

The cooling liquid distribution module of the present invention can be applied to electronic computer equipment with relatively small space due to its structural design. The cold water chamber of the cooling liquid distribution module has a plurality of first liquid outlets, and the fluid medium is driven by the power module to flow out of the cold water chamber from the first liquid outlets to the corresponding water cooling heads, so as to achieve the cooling liquid distribution. In addition, the cold water chamber, the water storage chamber and the hot water chamber of the cooling liquid distribution module are integrated into a module body, which can effectively reduce the volume of the cooling system. Therefore, the heat dissipation system of the present invention can be used in a casing of an electronic computer equipment with relatively small space, and dissipates heat for a plurality of electronic components arranged in the casing of the electronic computer equipment.

In order to make the above-mentioned and other objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are exemplified below, and are described in detail as follows in conjunction with the accompanying drawings.

Description of drawings

FIG. 1 is a functional block diagram of a heat dissipation system according to an embodiment of the present invention.

FIG. 2 is a schematic three-dimensional structural diagram of the cooling liquid distribution module shown in FIG. 1 .

FIG. 3 is a schematic cross-sectional view along the line A-A shown in FIG. 2 .

Detailed ways

For the convenience of description, each structure, composition or component of the cooling system in the drawings of the present invention is not drawn according to the scale of its application, and needs to be enlarged in different proportions according to the description, which is not intended to limit the implementation of the cooling system of the present invention. .

Please refer to FIGS. 1 to 3 . FIG. 1 is a functional block diagram of a heat dissipation system 1 according to an embodiment of the present invention, FIG. 2 is a three-dimensional schematic diagram of the cooling liquid distribution module 13 shown in FIG. 1 , and FIG. A schematic cross-sectional view of line A-A is shown. It should be noted that, in order to present the structure of the cooling liquid distribution module 13 more clearly, FIG. 2 adopts a perspective view of some components to present the appearance structure. As shown in FIG. 1 , the heat dissipation system 1 of this embodiment is applied to a plurality of electronic components 101 of an electronic computer device 100. In this embodiment, the electronic computer device 100 is, for example, a personal computer host, and these electronic components 101 are, for example, arranged in The display card in the casing 102 of the personal computer mainframe, that is to say, the cooling system 1 of this embodiment is configured in the casing 102 of the personal computer mainframe, and the heat energy generated by the operation of the display cards is brought to a low temperature place , in order to achieve the cooling effect.

As shown in FIG. 1 , the heat dissipation system 1 of this embodiment includes a plurality of water cooling heads 11 , a radiator 12 and a cooling liquid distribution module 13 . The water-cooling heads 11 are respectively used for matching with a plurality of electronic components 101 (display cards) disposed in the casing 102 , and each water-cooling head 11 is in thermal contact with the corresponding electronic component 101 . The connection mode between the head 11 and its corresponding electronic components 101 is limited, and the connection mode between each water-cooled head 11 and its corresponding electronic components 101 may vary depending on the actual situation. The head 11 and the electronic component 101 are arranged in the same casing. The radiator 12 exchanges heat with the passing fluid medium (not shown). The cooling liquid distribution module 13 is connected between the water cooling heads 11 and the radiator 12 .

As shown in FIGS. 1 to 3 , the cooling liquid distribution module 13 of this embodiment includes a module body 131 and a power module 132 . The module body 131 includes a cold water chamber C1 , and the cold water chamber C1 has a plurality of first liquid outlets C11 , and the first liquid outlets C11 are respectively connected to the plurality of water cooling heads 11 . The power module 132 is disposed in the module body 131 , and the power module 132 is used to drive the fluid medium to flow out from the plurality of first liquid outlets C11 , so that the fluid medium is distributed among the plurality of water cooling heads 11 , the radiator 12 and the cooling liquid Cycle in module 13. In this embodiment, the power module is, for example, a pump, but the present invention is not limited to this.

As shown in FIG. 1 to FIG. 3 , the module body 131 of this embodiment further includes a water storage chamber C2, the power module 132 is located between the water storage chamber C2 and the cold water chamber C1, and the water storage chamber C2 has a first The liquid inlet C12, and the water storage chamber C2 and the cold water chamber C1 communicate with each other, the power module 132 drives the fluid medium flowing into the water storage chamber C2 from the first liquid inlet C12 to make it flow from the plurality of first liquid outlets Port C11 flows out of cold water chamber C1.

As shown in FIGS. 1 to 3 , in this embodiment, the module body 131 further includes a hot water chamber C3, which is not connected to the cold water chamber C1 and the water storage chamber C2, that is to say, The cold water chamber C1 and the hot water chamber C3 are directly separated from the module body 131 into two independent spaces. The hot water chamber C3 includes a second liquid outlet C21 and a plurality of second liquid inlet ports C22 , and the second liquid inlet ports C22 are respectively connected to the plurality of water cooling heads 11 .

As shown in FIGS. 2 and 3 , the plurality of first liquid outlets C11 of the cold water chamber C1 in this embodiment are arranged along the first reference line L1, and the plurality of second liquid inlets C22 of the hot water chamber C3 are arranged along the first reference line L1. Aligned along the second reference line L2, the cold water chamber C1 extends along the first reference line L1, the hot water chamber C3 extends along the second reference line L2, and the cold water chamber C1 and the hot water chamber C3 extend along the third reference line L2. The reference lines L3 are arranged, wherein the first reference line L1 and the second reference line L2 are parallel to each other, and the first reference line L1 and the second reference line L2 are respectively perpendicular to the third reference line L3.

As shown in FIG. 1 , the radiator 12 of the present embodiment uses, for example, a condenser. The condenser can provide refrigeration and is a type of heat exchanger, which can convert gas or steam into liquid, and heat pipes of the condenser. The heat in the (not shown) is quickly transferred to the air near the radiator 12 for heat dissipation, but the invention is not limited to this. In other embodiments, the radiator 12 is, for example, a water-cooled radiator. In this embodiment, the radiator 12 includes a radiator liquid inlet 121 and a radiator liquid outlet 122, the radiator liquid inlet 121 is in fluid communication with the second liquid outlet C21 of the hot water chamber C3, and the radiator liquid outlet The port 122 is in fluid communication with the first liquid inlet C12 of the water storage chamber C2. Specifically, the fluid medium flows out through the second liquid outlet C21 of the hot water chamber C3, and flows into the radiator through the radiator liquid inlet 121. 12, and the fluid medium flows out of the radiator 12 through the radiator liquid outlet 122, and flows into the water storage chamber C2 through the first liquid inlet C12.

As shown in FIG. 1 , each water cooling head 11 in this embodiment includes a water cooling head liquid inlet 111 and a water cooling head liquid outlet 112 . The water cooling head liquid inlet 111 of each water cooling head 11 is in fluid communication with the first liquid outlet C11 of the corresponding cold water chamber C1, and the water cooling head liquid outlet 112 of each water cooling head 11 is in fluid communication with the corresponding hot water chamber The second liquid inlet C22 of C3 is in fluid communication. Specifically, the fluid medium flows out of the water block 11 through the water block outlet ports 112 of these water blocks 11, and flows into the hot water chamber C3 through the corresponding second liquid inlet C22. , and the fluid medium flows out of the cold water chamber C1 through the first liquid outlet ports C11 , and flows into the water cooling head 11 through the corresponding liquid inlet ports 111 of the water cooling head.

It is worth mentioning that, in this embodiment, the diameters of the plurality of first liquid outlets C11 of the cold water chamber C1 are, for example, the same as each other, and the water-cooled head liquid inlets 111 of the plurality of water-cooled heads 11 are, for example, the same as each other. , but the present invention is not limited to this. In other embodiments, the diameters of the plurality of first liquid outlets C11 and the plurality of water-cooled head liquid inlets 111 may correspond to the thermal resistance value of the corresponding water-cooled head 11 . For example, when the thermal resistance of the water-cooled head 11 is high, the diameter of the first liquid outlet C11 and the water-cooled head liquid inlet 111 correspondingly connected to it are relatively large. On the contrary, in the water-cooled head 11 In the case of low thermal resistance, the diameter of the first liquid outlet C11 and the water-cooled head liquid inlet 111 connected to it is relatively small. Under such a structural design, it can be ensured that each water-cooled head 11 can achieve good performance. cooling efficiency. In other words, in the same heat dissipation system 1 , the first liquid outlet C11 and the cold water head liquid inlet 111 with different diameters may be respectively provided.

It should be noted that any of the above-mentioned fluid communication relationships can be implemented by connecting a pipe body (not shown in the figure), but not limited to this, and the fluid medium filled in the above-mentioned fluid circulation circuit can be a liquid medium, The gaseous medium or the gaseous and liquid coexisting medium, and the cooling liquid distribution module 13 can provide pipe connection in the cooling system 1, and undertake the functions of equalization and conduction. In addition, the cooling liquid distribution module 13 can configure the fluid medium passing through it, for example, evenly or intelligently according to the actual application situation, the fluid medium in it can be brought through the plurality of first liquid outlets C11 of the cold water chamber C1 For each water-cooling head 11; preferably, but not limited to this, the cooling liquid distribution module 13 also has the function of real-time monitoring and automatic adjustment of the best heat dissipation performance.

Next, the operation flow of the heat dissipation system 1 of this embodiment will be described. The fluid medium flowing through the water-cooled head 11 is heated by the heat source of the electronic components 101 matched with the water-cooled head 11, and the heated fluid medium will flow out of the water-cooled head 11 through the water-cooled head liquid outlet 112, and through the corresponding second liquid inlet The port C22 flows into the hot water chamber C3 of the module body 131, and then the fluid medium flows out of the hot water chamber C3 through the second liquid outlet C21 of the hot water chamber C3, and flows into the heat dissipation chamber through the radiator liquid inlet 121 In the radiator 12, as mentioned above, the fluid medium flowing into the radiator 12 will conduct heat exchange in the radiator 12 to cool down. Then, the fluid medium after cooling down the radiator 12 will flow out of the radiator 12 through the radiator liquid outlet 122, and flow into the water storage chamber C2 of the module body 131 through the first liquid inlet C12. The group 132 drives the fluid medium flowing into the water storage chamber C2 from the first liquid inlet C12 to flow out of the cold water chamber C1 from the plurality of first liquid outlets C11 of the cold water chamber C1, and again through the corresponding liquid inlet port 111 of the water cooling head. into the water block 11 . When the above-mentioned circulation process is continuously repeated in the fluid circulation loop, the heat energy of the plurality of electronic components 101 of the electronic computer device 100 can be brought to a low temperature, so as to achieve the effect of cooling.

As shown in FIG. 1 , the cooling liquid distribution module 13 of this embodiment further includes a flow control device 133 . The flow control device 133 is disposed between the power module liquid outlet 1320 of the power module 132 and the plurality of first liquid outlets C11 of the cold water chamber C1, and the flow control device 133 is used to control the fluid medium from these first liquid outlets Flow out of port C11. Specifically, in this embodiment, the flow control device 133 includes a sensor and a microcontroller (not shown in this figure), and the sensor is used to sense the power module liquid outlet 1320 and these first outlets. The flow value between the liquid ports C11, the microcontroller controls the flow rate of the fluid medium flowing out of the first liquid outlet C11 according to the flow value. In this embodiment, the sensor is, for example, a flow meter, but the present invention does not This is the limit. It is worth mentioning that, in other embodiments, a thermal sensor (not shown in this figure) can also be arranged between the liquid outlet 1320 of the power module and the plurality of first liquid outlets C11. The device is used to sense the temperature value between the liquid outlet 1320 of the power module and the first liquid outlets C11.

In the heat dissipation system of the embodiment of the present invention, the cold water chamber, the water storage chamber and the hot water chamber of the cooling liquid distribution module are integrated into a module body, which effectively reduces the volume of the heat dissipation system, and the cold water chamber has a plurality of first A liquid outlet, through which the power module drives the fluid medium to flow out of the cold water chamber from the first liquid outlet to the corresponding water cooling head, so as to achieve the purpose of cooling liquid distribution. Therefore, under such a structural design, the present invention is implemented The heat dissipation system of this example can be used in a case of an electronic computer equipment (personal computer host) with relatively small space, and dissipates heat for a plurality of electronic components (eg, display cards) disposed in the case of the electronic computer equipment.

Only the above are only preferred embodiments of the present invention, and should not limit the scope of implementation of the present invention, that is, any simple equivalent changes and modifications made according to the claims of the present invention and the contents of the description are still valid. It belongs to the scope covered by the patent of the present invention. Additionally, no embodiment or claim of the present invention is required to achieve all of the objects or advantages or features disclosed herein. In addition, the abstract section and headings are only used to aid the search of patent documents and are not intended to limit the scope of the present invention. In addition, the terms such as "first" and "second" mentioned in this specification or the claims are only used to name the elements or to distinguish different embodiments or ranges, and are not used to limit the number of elements. upper or lower limit.

Claims (11)

1. A heat dissipation system, applied to an electronic computer equipment, the electronic computer equipment comprises a plurality of electronic components, it is characterized in that, this heat dissipation system comprises: a plurality of water cooling heads, respectively corresponding to the plurality of electronic components; a heat sink that exchanges heat with a fluid medium passing through the heat sink; and A cooling liquid distribution module is connected between the plurality of water cooling heads and the radiator, and the cooling liquid distribution module includes: a module body including a cold water chamber, the cold water chamber has a plurality of first liquid outlets, and the plurality of first liquid outlets are respectively connected to the plurality of water cooling heads; and A power module is disposed in the module body, and the power module is used to drive the fluid medium to flow out from the plurality of first liquid outlets, so that the fluid medium flows between the plurality of water cooling heads, the radiator and the Circulating flow in the coolant distribution module. 2. The heat dissipation system of claim 1, wherein the module body further comprises a water storage chamber, the power module is disposed between the water storage chamber and the cold water chamber, and the water storage chamber The chamber has a first liquid inlet, and the water storage chamber and the cold water chamber communicate with each other, and the power module drives the fluid medium flowing into the water storage chamber from the first liquid inlet from the plurality of The first liquid outlet flows out of the cold water chamber. 3 . The heat dissipation system of claim 2 , wherein the module body further comprises a hot water chamber, the hot water chamber is not communicated with the cold water chamber and the water storage chamber, and the hot water chamber The chamber includes a plurality of second liquid inlets and a second liquid outlet, and the plurality of second liquid inlets correspond to the plurality of water cooling heads respectively. 4 . The heat dissipation system of claim 3 , wherein the plurality of first liquid outlets of the cold water chamber are arranged along a first reference line, and the plurality of second inlet ports of the hot water chamber are arranged along a first reference line. 5 . The liquid ports are arranged along a second reference line, the cold water chamber extends along the first reference line, the hot water chamber extends along the second reference line, and the cold water chamber and the hot water chamber extend along the A third reference line is arranged, wherein the first reference line and the second reference line are parallel to each other, and the first reference line and the second reference line are respectively perpendicular to the third reference line. 5. The heat dissipation system of claim 3, wherein each water block comprises a water block liquid inlet and a water block liquid outlet, the water block liquid inlet and the plurality of first liquid ports One of them corresponds to and is in fluid communication, and the water-cooled head liquid outlet corresponds to and is in fluid communication with one of the plurality of second liquid inlets; wherein, the fluid medium flows out of the corresponding water-cooled head liquid outlet through the water-cooled head The water block flows into the hot water chamber through the corresponding second liquid inlet, and the fluid medium flows out of the cold water chamber through the plurality of first liquid outlets, and flows in through the corresponding liquid inlet of the water block corresponding water block. 6 . The heat dissipation system of claim 3 , wherein the radiator comprises a radiator liquid inlet and a radiator liquid outlet, the radiator liquid inlet and the radiator liquid outlet are respectively connected to the radiator liquid inlet and the radiator liquid outlet. The second liquid outlet is in fluid communication with the first liquid inlet; wherein, the fluid medium flows out of the hot water chamber through the second liquid outlet, and flows into the radiator through the radiator liquid inlet, and the fluid The medium flows out of the radiator through the radiator liquid outlet, and flows into the water storage chamber through the first liquid inlet. 7 . The heat dissipation system of claim 1 , wherein the power module comprises a power module liquid outlet, the cooling liquid distribution module further comprises a flow control device, and the flow control device is configured on the power module. 8 . Between the module liquid outlet and the plurality of first liquid outlets, the flow control device is used to control the flow rate of the fluid medium flowing out from the plurality of first liquid outlets. 8 . The cooling system of claim 7 , wherein the flow control device comprises a sensor and a microcontroller, the sensor is used for sensing the power module liquid outlet and the plurality of first A flow value between a liquid outlet, the microcontroller controls the flow rate of the fluid medium flowing out from the plurality of first liquid outlets according to the flow value. 9 . The heat dissipation system of claim 7 , wherein the cooling liquid distribution module further comprises a thermal sensor, and the thermal sensor is disposed at the liquid outlet of the power module and the plurality of first liquid outlets. 10 . between the ports, the thermal sensor is used for sensing a temperature value between the liquid outlet of the power module and the plurality of first liquid outlets. 10 . The cooling system of claim 1 , wherein the electronic computer device is a personal computer host, and the plurality of electronic components are display cards disposed in the personal computer host. 11 . 11. A cooling liquid distribution module, applied to a heat dissipation system, the heat dissipation system is used for heat dissipation of a plurality of electronic components on an electronic computer device, the heat dissipation system comprises a plurality of electronic components respectively disposed corresponding to the plurality of electronic components. A water cooling head and a radiator, wherein the cooling liquid distribution module includes: A module body is connected between the plurality of water cooling heads and the radiator, the module body includes a cold water chamber, the cold water chamber has a plurality of first liquid outlets, and the plurality of first liquid outlets The ports correspond to the plurality of water blocks, respectively; and A power module is disposed in the module body, and the power module is used to drive a fluid medium to flow out from the plurality of first liquid outlets, so that the fluid medium flows through the plurality of water cooling heads, the radiator and the Circulating flow in the coolant distribution module.

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