CN111988056B - Memory card and electronic device - Google Patents
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Abstract
本公开是关于一种存储卡和电子设备。所述存储卡适配于电子设备的Nano‑SIM卡卡槽,且能够与所述Nano‑SIM卡卡槽内的触点导通,所述存储卡包括存储单元、控制单元和的多个接触触点,所述多个接触触点区别于Nano‑SIM卡上的多个接触触点,且所述存储卡上排布在同一行的接触触点长度相同。
The present disclosure relates to a memory card and electronic equipment. The memory card is adapted to the Nano-SIM card slot of the electronic device, and can be conducted with the contacts in the Nano-SIM card slot, and the memory card includes a storage unit, a control unit and a plurality of contacts Contacts, the plurality of contact points are different from the plurality of contact points on the Nano-SIM card, and the contact points arranged in the same row on the memory card have the same length.
Description
技术领域technical field
本公开涉及终端技术领域,尤其涉及一种存储卡和电子设备。The present disclosure relates to the technical field of terminals, and in particular to a memory card and electronic equipment.
背景技术Background technique
随着智能终端的高速发展,用户通过智能终端实现的功能也随之越来越多,例如,用户可以通过智能终端可以存储图片、文字或者音频等信息。通常而言,智能终端自带的存储空间有限,逐渐无法满足用户对存储空间的需求,因而使得用户对外置的终端存储器的需求逐渐增加。With the rapid development of smart terminals, users can implement more and more functions through smart terminals. For example, users can store information such as pictures, text, or audio through smart terminals. Generally speaking, the built-in storage space of the smart terminal is limited, which gradually fails to meet the user's demand for storage space, thus making the user's demand for external terminal memory gradually increase.
发明内容Contents of the invention
本公开提供一种存储卡和电子设备,以解决相关技术中的不足。The present disclosure provides a memory card and electronic equipment to solve the deficiencies in related technologies.
根据本公开实施例的第一方面,提供一存储卡,所述存储卡适配于电子设备的Nano-SIM卡卡槽,且能够与所述Nano-SIM卡卡槽内的触点导通,所述存储卡包括:According to the first aspect of an embodiment of the present disclosure, a memory card is provided, the memory card is adapted to a Nano-SIM card slot of an electronic device, and can be conducted with contacts in the Nano-SIM card slot, The memory card includes:
存储单元;storage unit;
控制单元;以及control unit; and
十二接触触点,所述十二接触触点区别于Nano-SIM卡上的多个接触触点,所述十二个接触触点排布成两行六列,同一行的接触触点的长度相同,且所述十二个接触触点中排布在同一行的接触触点长度相同,每两列接触触点的宽度与所述Nano-SIM卡的一列接触触点的宽度相等,每相邻两个接触触点共用Nano-SIM卡卡槽内的一个接触触点。Twelve contacts, the twelve contacts are different from the multiple contacts on the Nano-SIM card, the twelve contacts are arranged in two rows and six columns, and the contacts of the same row The lengths are the same, and the lengths of the contact contacts arranged in the same row among the twelve contact contacts are the same, and the width of every two columns of contact contacts is equal to the width of a column of contact contacts of the Nano-SIM card. Two adjacent contact points share one contact point in the Nano-SIM card slot.
可选的,所述十二个接触触点中,每一行接触触点的长度与所述Nano-SIM卡的对应行接触触点的长度相等。Optionally, among the twelve contacts, the length of each row of contacts is equal to the length of the corresponding row of contacts of the Nano-SIM card.
可选的,所述十二个接触触点包括四个数据信号触点、四个地信号触点和四个其他功能触点,所述其他功能触点包括时钟信号触点、检测触点和电源触点;Optionally, the twelve contact contacts include four data signal contacts, four ground signal contacts and four other functional contacts, and the other functional contacts include clock signal contacts, detection contacts and power contacts;
其中,每一行接触触点包括两个地信号触点、两个数据信号触点和两个其他功能触点。Wherein, each row of contact contacts includes two ground signal contacts, two data signal contacts and two other functional contacts.
可选的,一个地信号触点位于对应行的最边缘,另一个地信号触点位于该行接触触点的中部,且在该行接触触点中,所述数据信号触点与所述其他功能触点通过所述地信号触点隔离。Optionally, one ground signal contact is located at the extreme edge of the corresponding row, the other ground signal contact is located in the middle of the row of contact contacts, and in the row of contact contacts, the data signal contact and the other The functional contacts are isolated by the ground signal contact.
可选的,所述数据信号触点包括数据输出触点和数据输入触点,单个所述数据输出触点与单个所述数据输入触点设置于同一列。Optionally, the data signal contacts include data output contacts and data input contacts, and a single data output contact and a single data input contact are arranged in the same row.
可选的,位于同一列的所述接触触点的宽度相同。Optionally, the contact points located in the same column have the same width.
可选的,还包括缺口,所述缺口位于呈方形的所述存储卡的任一拐角处。Optionally, a notch is further included, and the notch is located at any corner of the square memory card.
根据本公开实施例的第二方面,提供一种电子设备,包括第一卡槽和第二卡槽,所述第一卡槽和所述第二卡槽的规格均适配于Nano-SIM卡的规格;According to a second aspect of an embodiment of the present disclosure, an electronic device is provided, including a first card slot and a second card slot, the specifications of the first card slot and the second card slot are both adapted to Nano-SIM cards Specifications;
其中,所述第一卡槽用于与上述任一项实施例所述的存储卡进行插接,所述第二卡槽用于与Nano-SIM卡进行插接。Wherein, the first card slot is used for inserting the memory card described in any one of the above embodiments, and the second card slot is used for inserting the Nano-SIM card.
可选的,所述电子设备包括下述至少一种:Optionally, the electronic device includes at least one of the following:
手持设备、车载设备、可穿戴设备、家庭智能设备、计算设备、连接到无线调制解调器的其他处理设备。Handheld devices, automotive devices, wearable devices, home smart devices, computing devices, other processing devices connected to wireless modems.
本公开的实施例提供的技术方案可以包括以下有益效果:The technical solutions provided by the embodiments of the present disclosure may include the following beneficial effects:
由上述实施例可知,本公开提供一种能够与Nano-SIM卡卡座进行适配的存储卡,针对电子设备内的同一Nano-SIM卡卡座,其既可以用于容置Nano-SIM卡,也可以用于容置本公开中提供的存储卡,有利于提高电子设备内Nano-SIM卡卡座的利用率,尤其在电子设备具有多个Nano-SIM卡卡座时,有利于降低Nano-SIM卡卡座被空置的概率。It can be seen from the above embodiments that the present disclosure provides a memory card that can be adapted to a Nano-SIM card holder, which can be used to accommodate a Nano-SIM card for the same Nano-SIM card holder in an electronic device , can also be used to accommodate the memory card provided in the present disclosure, which is conducive to improving the utilization rate of the Nano-SIM card holder in the electronic device, especially when the electronic device has multiple Nano-SIM card holders, it is beneficial to reduce the Nano-SIM card holder. - The probability that the SIM card holder is empty.
应当理解的是,以上的一般描述和后文的细节描述仅是示例性和解释性的,并不能限制本公开。It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure.
附图说明Description of drawings
此处的附图被并入说明书中并构成本说明书的一部分,示出了符合本公开的实施例,并与说明书一起用于解释本公开的原理。The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description serve to explain the principles of the disclosure.
图1是相关技术中Nano-SIM卡的结构示意图。FIG. 1 is a schematic structural diagram of a Nano-SIM card in the related art.
图2是根据一示例性实施例示出的一种存储卡的结构示意图。Fig. 2 is a schematic structural diagram of a memory card according to an exemplary embodiment.
图3是根据一示例性实施例示出的另一种存储卡的结构示意图。Fig. 3 is a schematic structural diagram of another memory card according to an exemplary embodiment.
图4是根据一示例性实施例示出的又一种存储卡的结构示意图。Fig. 4 is a schematic structural diagram of another memory card according to an exemplary embodiment.
图5是根据一示例性实施例示出的再一种存储卡的结构示意图。Fig. 5 is a schematic structural diagram of another memory card according to an exemplary embodiment.
图6是根据一示例性实施例示出的还一种存储卡的结构示意图。Fig. 6 is a schematic structural diagram of another memory card according to an exemplary embodiment.
图7是根据一示例性实施例示出的一种电子设备的结构示意图。Fig. 7 is a schematic structural diagram of an electronic device according to an exemplary embodiment.
图8是根据一示例性实施例示出的另一种电子设备的结构示意图。Fig. 8 is a schematic structural diagram of another electronic device according to an exemplary embodiment.
具体实施方式detailed description
这里将详细地对示例性实施例进行说明,其示例表示在附图中。下面的描述涉及附图时,除非另有表示,不同附图中的相同数字表示相同或相似的要素。以下示例性实施例中所描述的实施方式并不代表与本申请相一致的所有实施方式。相反,它们仅是与如所附权利要求书中所详述的、本申请的一些方面相一致的装置和方法的例子。Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with aspects of the present application as recited in the appended claims.
在本申请使用的术语是仅仅出于描述特定实施例的目的,而非旨在限制本申请。在本申请和所附权利要求书中所使用的单数形式的“一种”、“所述”和“该”也旨在包括多数形式,除非上下文清楚地表示其他含义。还应当理解,本文中使用的术语“和/或”是指并包含一个或多个相关联的列出项目的任何或所有可能组合。The terminology used in this application is for the purpose of describing particular embodiments only, and is not intended to limit the application. As used in this application and the appended claims, the singular forms "a", "the", and "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise. It should also be understood that the term "and/or" as used herein refers to and includes any and all possible combinations of one or more of the associated listed items.
应当理解,尽管在本申请可能采用术语第一、第二、第三等来描述各种信息,但这些信息不应限于这些术语。这些术语仅用来将同一类型的信息彼此区分开。例如,在不脱离本申请范围的情况下,第一信息也可以被称为第二信息,类似地,第二信息也可以被称为第一信息。取决于语境,如在此所使用的词语“如果”可以被解释成为“在……时”或“当……时”或“响应于确定”。It should be understood that although the terms first, second, third, etc. may be used in this application to describe various information, the information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, without departing from the scope of the present application, first information may also be called second information, and similarly, second information may also be called first information. Depending on the context, the word "if" as used herein may be interpreted as "at" or "when" or "in response to a determination."
图1是相关技术中Nano-SIM卡100的结构示意图。如图1所示,Nano-SIM卡100可以包括接地触点、电源触点、编程电压触点、数据触点、复位触点和时钟触点,该接地触点、电源触点、编程电压触点、数据触点、复位触点和时钟触点可以排布成两行三列,并在Nano-SIM卡100装配至电子设备内时,与Nano-SIM卡卡槽上的触点导通,实现电子设备的通话功能。其中,该Nano-SIM卡100的尺寸可以为12.3mm×8.8mm×0.7mm。FIG. 1 is a schematic structural diagram of a Nano-
图2是根据本申请一示例性实施例示出的一种存储卡200的结构示意图。如图2所示,该存储卡200能够适配于电子设备的Nano-SIM卡卡槽,并且能够与Nano-SIM卡卡槽内的触点导通,该存储卡200可以包括存储单元、控制单元和多个接触触点,该多个接触触点可以与Nano-SIM卡卡槽上的触点进行导通,从而电子设备能够将图片信息、视频信息、音频信息和文字信息等存储在该存储卡200内,也可以从该存储卡200内获取到图片信息、视频信息、音频信息和文字信息等。Fig. 2 is a schematic structural diagram of a
其中,存储卡200能够适配于Nano-SIM卡卡槽内,亦即存储卡200的外形结构、尺寸均与Nano-SIM卡的外形结构、尺寸一致,但是,存储卡200上多个接触触点区别于Nano-SIM卡的接触触点,并且该存储卡200上排布在同一行的接触触点的长度相同。基于此,针对电子设备内的同一Nano-SIM卡卡槽,其既可以用于容置Nano-SIM卡,也可以用于容置本公开中提供的存储卡,有利于提高电子设备内Nano-SIM卡卡槽的利用率,尤其在电子设备具有多个Nano-SIM卡卡槽时,有利于降低Nano-SIM卡卡槽被空置的概率。Wherein, the
其中,存储卡200的接触引脚区别于Nano-SIM卡的接触引脚可以理解为:存储卡200的接触引脚数量与Nano-SIM卡的接触引脚数量不同;存储卡200的接触引脚的排布方式与Nano-SIM卡的接触引脚的排布方式不同;或者也可以是存储卡200的接触引脚中任意一个或者多个接触引脚的功能区别于Nano-SIM卡的接触引脚的功能,本公开并不对此进行限制。举例而言,该存储卡200可以基于通用串行总线((Universal Serial Bus,USB)、高速外设部件互连(PeripheralComponent Interconnect,PCI)、通用闪存存储(Universal FlashStorage,UFS)、多媒体存储卡(Multimedia Card,MMC)、嵌入式多媒体存储卡(EmbeddedMulti-media Card,EMMC)中的任意一种接口协议进行通信。Wherein, the difference between the contact pins of the
在本实施例中,以图1相关技术中的Nano-SIM卡所示,该Nano-SIM卡上的接触触点可以排布成两行三列,而仍以图2所示,本公开中提供的存储卡200可以包括十二个接触触点,该十二个接触触点可以排布成两行六列,并且每一行接触触点的长度与Nano-SIM卡上对应行接触触点的长度相同。需要指出的是,参照图1和图2,在图1和图2的视角下,从左至右为Nano-SIM或存储卡的宽度方向,“行”的方向与Nano-SIM或存储卡的宽度方向一致;从上至下为Nano-SIM或存储卡的长度方向,“列”的方向与Nano-SIM或存储卡的长度方向一致。例如,图1中位于上方的一行接触触点的长度与图2中位于上方的一行接触触点的长度相等;或者,也可以是图1中位于下方的一行接触触点的长度与图2中位于下方的一行接触触点的长度相等。基于此,本领域技术人员可以沿用针对Nano-SIM卡的设计尺寸进行新的触点设计,可以简化加工,降低生产成本。In this embodiment, as shown in the Nano-SIM card in the related art in FIG. 1, the contacts on the Nano-SIM card can be arranged in two rows and three columns, and as shown in FIG. The provided
相类似的,仍以图2所示,该十二个接触触点排布成两行六列,并且每两列接触触点的宽度与Nano-SIM卡上一列接触触点的宽度相等。例如,图1中自左至右的第一列接触触点的宽度为D1,图2中自左至右第一列、第二列的宽度之和为D2,该D1=D2;可以类比的是,图1中自左至右的第二列接触触点的宽度与图2中自左至右第三列、第四列的宽度之和相等,图1中自左至右的第三列接触触点的宽度与图2中自左至右第五列、第六列的宽度之和相等。Similarly, as shown in FIG. 2 , the twelve contacts are arranged in two rows and six columns, and the width of every two columns of contacts is equal to the width of one column of contacts on the Nano-SIM card. For example, the width of the first row of contact contacts from left to right in Figure 1 is D1, and the sum of the widths of the first row and second row from left to right in Figure 2 is D2, and this D1=D2; it can be compared Yes, the width of the second column of contacts from left to right in Figure 1 is equal to the sum of the widths of the third and fourth columns from left to right in Figure 2, and the third column from left to right in Figure 1 The width of the contact point is equal to the sum of the widths of the fifth column and the sixth column from left to right in FIG. 2 .
在上述各个实施例中,仍以图2所示,该十二个接触触点可以包括四个数据信号触点、四个地信号触点和四个其他功能触点,该其他功能触点可以包括时钟信号触点、检测触点和电源触点。并且,每一行接触触点中均可以包括两个地信号触点、两个数据信号触点和两个其他功能触点。例如图2中所示,位于上方的一行接触触点可以包括两个地信号触点GND,一个时钟信号触点CLK,一个检测触点C/D,一个数据输入触点DIN_T,一个数据输出触点DOU_C,位于下方的一行接触触点可以包括两个地信号触点GND,一个电源触点VCC,一个电源触点VCCQ2,一个数据输入触点DIN_C,一个数据输出触点DOU_T。In each of the above embodiments, still shown in FIG. 2, the twelve contact points may include four data signal contacts, four ground signal contacts and four other functional contacts, and the other functional contacts may Includes clock signal contacts, sense contacts and power contacts. Moreover, each row of contact contacts may include two ground signal contacts, two data signal contacts and two other functional contacts. For example, as shown in Figure 2, the upper row of contacts may include two ground signal contacts GND, one clock signal contact CLK, one detection contact C/D, one data input contact DIN_T, one data output contact Point DOU_C, a row of contact contacts located below may include two ground signal contacts GND, one power contact VCC, one power contact VCCQ2, one data input contact DIN_C, and one data output contact DOU_T.
在本实施例中,仍以图2所示,在一行接触触点中,其中一个地信号触点位于对应行的最边缘,另一个地信号触点位于该行接触触点的中部,并且在该行接触触点中,数据信号触点和其他功能触点可以通过地信号触点进行隔离。例如图2中所示,自左至右的方向上,地信号触点位于第三列和第六列,第一列和第二列设置为其他功能触点、第四列和第五列设置为数据信号触点。In this embodiment, as shown in FIG. 2, in a row of contact contacts, one of the ground signal contacts is located at the extreme edge of the corresponding row, and the other ground signal contact is located in the middle of the row of contact contacts. In this row of contacts, data signal contacts and other functional contacts can be isolated by ground signal contacts. For example, as shown in Figure 2, from left to right, the ground signal contacts are located in the third and sixth columns, the first and second columns are set as other functional contacts, and the fourth and fifth columns are set It is a data signal contact.
仍以图2所示,该数据信号触点可以包括数据输出触点和数据输入出点,单个数据输出触点与单个数据输入触点设置与同一列。如图2中,自左至右的第四列中可以包括一数据输入触点DIN_T和一数据输出触点DOU_T、第五列中可以包括一数据输入触点DIN_C和一数据输出触点DOU_C。Still shown in FIG. 2 , the data signal contacts may include data output contacts and data input and output contacts, and a single data output contact and a single data input contact are arranged in the same column. As shown in FIG. 2 , the fourth column from left to right may include a data input contact DIN_T and a data output contact DOU_T, and the fifth column may include a data input contact DIN_C and a data output contact DOU_C.
需要说明的是,在满足数据信号触点和其他功能触点被地信号触点隔离、且一个数据输出触点和一个数据输入触点位于同一列的情况下,各个触点的位置可以互换。It should be noted that the position of each contact can be interchanged under the condition that the data signal contact and other functional contacts are isolated by the ground signal contact, and a data output contact and a data input contact are located in the same column .
例如,如图3所示,自左至右的方向上,也可以是第一列和第二列设置数据信号触点、第三列和第六列设置地信号触点、第四列和第五列设置其他功能触点。基于图2和图3所实施里,第一列和第二列中的数据信号触点在满足数据输入触点和数据输出触点位于同一列的情况下也可以更换位置。例如,在图3所示实施例中,数据输入触点DIN_T和数据输出触点DOU_T位于同一列、数据输入触点DIN_C和数据输出触点DOU_C位于同一列,而如图4所示,数据输入触点DIN_C和数据输出触点DOU_T位于同一列、数据输入触点DIN_T和数据输出触点DOU_C位于同一列,在此仅作示例性说明,通过数据信号触点的位置更换可以存在8种实施方式,此处不再一一举例。For example, as shown in Figure 3, in the direction from left to right, data signal contacts can also be set in the first column and the second column, ground signal contacts can be set in the third column and the sixth column, and ground signal contacts can be set in the fourth column and the sixth column. Five columns are provided with other functional contacts. Based on the implementation shown in FIG. 2 and FIG. 3 , the data signal contacts in the first column and the second column can also be replaced under the condition that the data input contacts and the data output contacts are located in the same column. For example, in the embodiment shown in Figure 3, the data input contact DIN_T and the data output contact DOU_T are located in the same column, the data input contact DIN_C and the data output contact DOU_C are located in the same column, and as shown in Figure 4, the data input The contact DIN_C and the data output contact DOU_T are located in the same column, and the data input contact DIN_T and the data output contact DOU_C are located in the same column. This is only an example, and there are 8 implementations through the position replacement of the data signal contact. , no more examples here.
相类似的,针对位于地信号触点同一侧的其他功能触点,例如图4中位于地信号触点右侧的时钟信号触点CLK、电源触点VCC、电源触点VCCQ2和检测触点C/D,该四个其他功能触点的位置可以进行互换,例如图4、图5所示,时钟信号触点CLK和检测触点C/D可以位置互换,如图5、图6所示,时钟信号触点CLK与电源触点VCCQ2可以位置互换。当然,在其他实施例中,也可以是其他功能触点进行位置互换,共可以存在24种排布方式,此处不再一一举例。综上可知,本公开中提供的存储卡200上十二个触点共计可以有2×8××24=384种可能的实施方式。此外,针对存储卡200所包括的四个地信号触点,其位置也可以进行互换,当各个地信号触点之间存在差异时,本公开中的实施方式共计384×24=9216种实施方式。Similarly, for other functional contacts located on the same side of the ground signal contact, such as the clock signal contact CLK, power contact VCC, power contact VCCQ2 and detection contact C located on the right side of the ground signal contact in Figure 4 /D, the positions of the four other functional contacts can be interchanged, as shown in Figure 4 and Figure 5, the positions of the clock signal contact CLK and the detection contact C/D can be interchanged, as shown in Figure 5 and Figure 6 As shown, the positions of the clock signal contact CLK and the power contact VCCQ2 can be interchanged. Of course, in other embodiments, the positions of other functional contacts may also be exchanged, and there may be 24 arrangements in total, which will not be listed here. To sum up, it can be seen that there are 2×8×24=384 possible implementation manners in total for the twelve contacts on the
在上述各个实施例中,仍以图6所示,该存储卡200还可以包括一缺口201该缺口201可以位于成方形的存储卡200的任一拐角处,通过该缺口201可以用于标识存储卡200的装配方位,方便用户安装存储卡200。如图6中所示,缺口201位于存储卡200的右上角位置,当然在其他实施例中该缺口201也可以位于左上角或者右下角或者左下角等位置,该缺口201的数量可以为一个或者多个,本公开并不限制。In each of the above embodiments, as shown in FIG. 6, the
进一步地,在上述各个实施例中,位于同一列的接触触点的宽度相同,一方面可以提高存储卡的美观性,另一方面可以简化生产工艺。针对存储卡200,本公开对各个接触触点在存储卡的卡体上的位置不做限定,各个接触触点的长度值、长度值不做限定。本公开中对存储卡200的接触触点的形状并不进行限制,其可以是规则的矩形,也可以是不规则的形状,各个接触触点的边与存储卡的各侧边的距离值不做限定;存储卡的具体长度、长度不做限定。Furthermore, in each of the above embodiments, the contact contacts in the same row have the same width, which can improve the aesthetics of the memory card on the one hand, and simplify the production process on the other hand. For the
本公开还提供一种如图7所示的电子设备300,该电子设备300可以包括第一卡槽301和第二卡槽302,且该第一卡槽301和第二卡槽302的规格均适配于Nano-SIM卡的规格。其中,第一卡槽301可以与上述任一实施例中所述的存储卡200进行插接导通,实现电子设备300的外置存储功能,第二卡槽302可以与Nano-SIM卡进行插接导通,实现电子设备的通讯功能。其中,该第一卡槽301和第二卡槽302可以如图7所示隶属于不同的卡座,即第一卡槽301和第二卡槽302之间可以相互分离,相互独立的伸出电子设备300;或者,如图8所示,在其他实施例中,该第一卡槽301和第二卡槽302也可以隶属于同一卡槽,共同伸出或者缩回电子设备300。该电子设备300可以包括各种具有通信功能的手持设备、车载设备、可穿戴设备、家庭智能设备、计算设备或连接到无线调制解调器的其他处理设备。The present disclosure also provides an
本领域技术人员在考虑说明书及实践这里公开的公开后,将容易想到本公开的其它实施方案。本申请旨在涵盖本公开的任何变型、用途或者适应性变化,这些变型、用途或者适应性变化遵循本公开的一般性原理并包括本公开未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的,本公开的真正范围和精神由下面的权利要求指出。Other embodiments of the disclosure will be readily apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any modification, use or adaptation of the present disclosure, and these modifications, uses or adaptations follow the general principles of the present disclosure and include common knowledge or conventional technical means in the technical field not disclosed in the present disclosure . The specification and examples are to be considered exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
应当理解的是,本公开并不局限于上面已经描述并在附图中示出的精确结构,并且可以在不脱离其范围进行各种修改和改变。本公开的范围仅由所附的权利要求来限制。It should be understood that the present disclosure is not limited to the precise constructions which have been described above and shown in the drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
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