CN111987051A - Novel IGBT packaging structure with temperature measurement function and packaging method - Google Patents

Abstract

The invention discloses a novel IGBT packaging structure and packaging method with temperature measurement function, comprising a heat dissipation base, two sides of the heat dissipation base are respectively connected with a water inlet valve and a drain valve, and both sides of the bottom of the heat dissipation base are fixedly connected with a mounting frame, which is installed on both sides of the heat dissipation base. The front and rear sides of the bottom of the frame are provided with installation holes, and the top of the heat dissipation base is fixedly connected with thermally conductive silica gel. In the present invention, the heat dissipation base, the second heat dissipation plate, the heat insulation plate, the first heat dissipation plate, the installation frame, the water inlet valve, the first heat dissipation hole, the installation hole, the air inlet pipe, the drain valve, the positioning frame, the serpentine pipe, Thermal silica gel, shell, positioning rod, temperature sensor, cover, IGBT module, cooling fan, limit plate, spring, first positioning hole, second positioning hole, threaded pipe, second filter, frame, first filter The combined use of the solid desiccant and the second heat dissipation hole solves the problems that the existing IGBT package structure does not have the function of temperature measurement and the effect of heat dissipation is poor.

Description

New IGBT packaging structure and packaging method with temperature measurement function

technical field

The invention relates to the technical field of IGBT packaging, in particular to a novel IGBT packaging structure and packaging method with a temperature measurement function.

Background technique

IGBT, insulated gate bipolar transistor, is a composite fully controlled voltage-driven power semiconductor device composed of BJT and MOS, which has the advantages of high input impedance of MOSFET and low on-voltage drop of GTR. The GTR saturation voltage is reduced, the current carrying density is large, but the driving current is large; the MOSFET driving power is small, the switching speed is fast, but the on-state voltage drop is large, and the current carrying density is small. The IGBT combines the advantages of the above two devices, and the driving power is small and the saturation voltage is reduced. It is very suitable for converter systems with DC voltages of 600V and above, such as AC motors, frequency converters, switching power supplies, lighting circuits, traction drives, etc. IGBT modules are more and more widely used in circuits, but the existing IGBT modules do not. It has the function of accurate temperature measurement, and the heat transfer of other external equipment will also affect the operation of the IGBT module, thereby reducing the heat dissipation efficiency of the IGBT module.

SUMMARY OF THE INVENTION

The purpose of the present invention is to provide a new IGBT packaging structure with temperature measurement function, which has the advantages of temperature measurement function and good heat dissipation and dehumidification effect, and solves the problem that the existing IGBT packaging structure does not have temperature measurement function and has poor heat dissipation effect.

In order to achieve the above purpose, the present invention provides the following technical solutions: a novel IGBT package structure with temperature measurement function, comprising a heat dissipation base, two sides of the heat dissipation base are respectively connected with a water inlet valve and a drain valve, and two sides of the heat dissipation base are respectively connected. Mounting frames are fixedly connected to the sides, mounting holes are provided on the front and rear sides of the bottom of the mounting frame, thermally conductive silica gel is fixedly connected to the top of the heat dissipation base, and IGBT modules are fixedly connected to the top of the thermally conductive silica gel. The top of the base is fixedly connected with a positioning frame, both sides of the inner cavity of the positioning frame are fixedly connected with a casing, and the inner cavity of the casing is movably connected with a limit plate, and the limit plate is fixed on one side away from the positioning frame A spring is connected, a positioning rod is fixedly connected to the side of the limiting plate away from the spring, a first positioning hole is opened on both sides of the positioning frame, a cover is movably connected to the top of the heat dissipation base, and the inside of the cover is Both sides of the cavity are fixedly connected with temperature sensors, the outer surface of the outer cover is fixedly connected with a heat insulation board, and a second positioning hole is opened between the two sides of the outer cover and the two sides of the heat insulation board. One end of the rod away from the limiting plate passes through the first positioning hole and extends to the inner cavity of the second positioning hole, the outer surface of the cover is fixedly connected with a first heat dissipation plate, and the side of the first heat dissipation plate away from the cover penetrates through To the outside of the heat insulation board, the top of the inner cavity of the outer cover is fixedly connected with a cooling fan, and the top of the cooling fan is connected with an air inlet pipe, and the top of the air inlet pipe sequentially penetrates the outer cover and the insulation board and extends to the partition. The top of the hot plate, the bottom of the inner cavity of the air inlet pipe is fixedly connected with a first filter screen, the top of the first filter screen is placed with solid desiccant, the top of the air inlet pipe is movably connected with a frame, the frame The bottom of the frame is fixedly connected with a threaded pipe, the threaded pipe is located in the inner cavity of the air inlet pipe, and a second filter screen is fixedly connected between the threaded pipe and the inner cavity of the frame.

Preferably, the number of the first heat dissipation plate is several, and a first heat dissipation hole is opened on one side of the first heat dissipation plate.

Preferably, the bottom of the heat dissipation base is fixedly connected with a second heat dissipation plate, one side of the second heat dissipation plate is provided with a second heat dissipation hole, and the number of the second heat dissipation plate is several.

Preferably, both front and rear sides of the IGBT module are provided with serpentine tubes, and both ends of the serpentine tubes are communicated with the heat dissipation base.

Preferably, the bottom of the casing is fixedly connected to the heat dissipation base, and the outer surface of the threaded pipe is threadedly connected to the connection of the air inlet pipe.

Preferably, the outer surface of the positioning frame is in contact with the inner wall of the outer cover, and the heat insulation board is made of glass fiber.

The packaging method of the new IGBT packaging structure with temperature measurement function, the specific operation steps are as follows:

A: First store the positioning rod into the inner cavity of the first positioning hole, and then connect the outer cover with its external structure and install it on the outer surface of the positioning frame, so that the positioning rod corresponds to the position of the second positioning hole, and the elastic force of the spring drives the limit plate Reset, the limit plate drives the positioning rod into the inner cavity of the second positioning hole, thereby positioning the position of the outer cover to achieve the purpose of packaging;

B: The structure is then fixed with other devices by the cooperation of the mounting holes and peripheral bolts. After power-on, the temperature sensor continuously monitors the temperature in the outer cover, and the cooling liquid is introduced into the cooling base through the water inlet valve. The cooling liquid usually flows into the inner cavity of the serpentine tube, the surface of the serpentine tube adsorbs the heat in the outer cover, the cooling liquid absorbs the heat on the surface of the serpentine tube, and the heat on the surface of the IGBT module is transferred to the heat dissipation base through the thermal conductive silica gel to dissipate heat. The coolant in the base usually absorbs heat, and is discharged through the drain valve, and the coolant is continuously supplied to dissipate heat;

C: During the heat dissipation process, start the cooling fan, the cooling fan draws the outside air through the air inlet pipe, and blows it into the inner cavity of the outer cover at an accelerated rate, so as to dissipate heat inside. In this process, the second filter screen and the first filter The net filters the dust and impurities in the air, and the solid desiccant absorbs the moisture in the air to avoid excessive moisture entering the inner cavity of the outer cover. The user needs to rotate the frame regularly to drive the threaded pipe from the inner cavity of the air inlet pipe. It is easy to clean and maintain the second filter screen and the first filter screen, and it is also convenient to replace the solid desiccant;

D: The heat absorbed on the surface of the cover can be transferred to the outside through the first heat dissipation plate, so that the heat dissipation efficiency of the cover can be improved through the cooperation of the first heat dissipation plate and the first heat dissipation hole, and the cooperation of the second heat dissipation plate and the second heat dissipation hole is the same It will speed up the heat dissipation efficiency of the heat dissipation base.

Compared with the prior art, the beneficial effects of the present invention are as follows:

1. The present invention is provided with a heat dissipation base, a second heat dissipation plate, a heat insulation plate, a first heat dissipation plate, a mounting frame, a water inlet valve, a first heat dissipation hole, a mounting hole, an air inlet pipe, a drain valve, a positioning frame, and a serpentine shape. Tube, thermal silica gel, shell, positioning rod, temperature sensor, cover, IGBT module, cooling fan, limit plate, spring, first positioning hole, second positioning hole, threaded pipe, second filter, frame, first The combined use of the filter screen, the solid desiccant and the second heat dissipation hole solves the problem that the existing IGBT package structure does not have the function of temperature measurement and the effect of heat dissipation is poor. The IGBT package structure has the function of temperature measurement and the effect of heat dissipation and dehumidification. Good advantages, worth promoting.

2. In the present invention, the heat insulation board is arranged to avoid excessive heat transfer from the outside to the inner cavity of the outer cover, thereby playing the role of heat insulation;

By setting the positioning frame, the stability when the cover is installed is increased.

Description of drawings

Fig. 1 is the structural representation of the present invention;

Fig. 2 is the front sectional view one of the partial structure of the present invention;

3 is a front cross-sectional view of the housing of the present invention;

Fig. 4 is the front sectional view two of the partial structure of the present invention;

Fig. 5 is the front sectional view of the air inlet pipe and frame of the present invention;

Fig. 6 is the left side view of the second cooling plate of the present invention;

Fig. 7 is the top view of the mounting frame of the present invention;

FIG. 8 is a top view of the positioning frame of the present invention.

In the figure: 1 cooling base, 2 second cooling plate, 3 heat insulation plate, 4 first cooling plate, 5 mounting bracket, 6 water inlet valve, 7 first cooling hole, 8 mounting hole, 9 air inlet pipe, 10 drainage Valve, 11 positioning frame, 12 serpentine tube, 13 thermal silica gel, 14 housing, 15 positioning rod, 16 temperature sensor, 17 outer cover, 18 IGBT module, 19 cooling fan, 20 limit plate, 21 spring, 22 first positioning Hole, 23 second positioning hole, 24 threaded pipe, 25 second filter screen, 26 frame, 27 first filter screen, 28 solid desiccant, 29 second heat dissipation hole.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

In the description of the invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end", etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific orientation or a specific orientation. construction and operation, and therefore should not be construed as limiting the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed to indicate or imply relative importance.

In the description of the invention, it should be noted that, unless otherwise expressly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense, for example, "connected" may be a fixed connection, It can also be a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or the internal communication between the two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood in specific situations.

In the present invention, the heat dissipation base 1, the second heat dissipation plate 2, the heat insulation plate 3, the first heat dissipation plate 4, the installation frame 5, the water inlet valve 6, the first heat dissipation hole 7, the installation hole 8, the air inlet pipe 9, the drainage Valve 10, positioning frame 11, serpentine tube 12, thermally conductive silica gel 13, housing 14, positioning rod 15, temperature sensor 16, cover 17, IGBT module 18, cooling fan 19, limit plate 20, spring 21, first positioning The parts such as the hole 22, the second positioning hole 23, the threaded pipe 24, the second filter screen 25, the frame 26, the first filter screen 27, the solid desiccant 28 and the second heat dissipation hole 29 are all general standard parts or those skilled in the art. The known components, their structures and principles are all known by those skilled in the art through technical manuals or through routine experimental methods.

Please refer to Figure 1-8, the new IGBT package structure with temperature measurement function includes a heat dissipation base 1, the two sides of the heat dissipation base 1 are connected with a water inlet valve 6 and a drain valve 10 respectively, and both sides of the bottom of the heat dissipation base 1 are fixedly connected There is a mounting frame 5, and mounting holes 8 are provided on the front and rear sides of the bottom of the mounting frame 5. The top of the heat dissipation base 1 is fixedly connected with thermally conductive silica gel 13, the top of the thermally conductive silica gel 13 is fixedly connected with an IGBT module 18, and the top of the heat dissipation base 1 is fixed A positioning frame 11 is connected, and both sides of the inner cavity of the positioning frame 11 are fixedly connected with a casing 14, the inner cavity of the casing 14 is movably connected to a limit plate 20, and a side of the limit plate 20 away from the positioning frame 11 is fixedly connected with a spring 21. The positioning rod 15 is fixedly connected to the side of the limiting plate 20 away from the spring 21, the first positioning holes 22 are opened on both sides of the positioning frame 11, the top of the heat dissipation base 1 is movably connected with the outer cover 17, and the inner cavity of the outer cover 17 is movably connected. The temperature sensor 16 is fixedly connected on both sides, the outer surface of the outer cover 17 is fixedly connected with the heat insulation plate 3, the two sides of the outer cover 17 and the two sides of the heat insulation plate 3 are provided with a second positioning hole 23, and the positioning rod 15 The end away from the limiting plate 20 passes through the first positioning hole 22 and extends to the inner cavity of the second positioning hole 23 . The outer surface of the cover 17 is fixedly connected with the first heat dissipation plate 4 . The side penetrates to the outside of the heat insulation board 3, the top of the inner cavity of the outer cover 17 is fixedly connected with a cooling fan 19, the top of the cooling fan 19 is connected with an air inlet pipe 9, and the top of the air inlet pipe 9 sequentially penetrates the outer cover 17 and the heat insulation plate 3. And extends to the top of the heat insulation board 3, the bottom of the air inlet pipe 9 is fixedly connected with a first filter screen 27, the top of the first filter screen 27 is placed with a solid desiccant 28, and the top of the air inlet pipe 9 is movably connected with a The frame 26, the bottom of the frame 26 is fixedly connected with a threaded pipe 24, the threaded pipe 24 is located in the inner cavity of the air inlet pipe 9, and a second filter screen 25 is fixedly connected between the threaded pipe 24 and the inner cavity of the frame 26;

The number of the first heat dissipation plate 4 is several, and the first heat dissipation hole 7 is opened on one side of the first heat dissipation plate 4;

The bottom of the heat dissipation base 1 is fixedly connected with a second heat dissipation plate 2, one side of the second heat dissipation plate 2 is provided with a second heat dissipation hole 29, and the number of the second heat dissipation plate 2 is several;

The front and rear sides of the IGBT module 18 are provided with a serpentine tube 12, and both ends of the serpentine tube 12 are communicated with the heat dissipation base 1;

The bottom of the casing 14 is fixedly connected with the heat dissipation base 1, and the outer surface of the threaded pipe 24 is threadedly connected with the connection of the air inlet pipe 9;

The outer surface of the positioning frame 11 is in contact with the inner wall of the outer cover 17, and the heat insulation board 3 is made of glass fiber;

By disposing the heat insulating plate 3, the excessive heat from the outside is prevented from being transferred to the inner cavity of the outer cover 17, and the effect of heat insulation is achieved;

By arranging the positioning frame 11 , the stability of the cover 17 during installation is increased.

The packaging method of the new IGBT packaging structure with temperature measurement function, the specific operation steps are as follows:

A: First store the positioning rod 15 into the inner cavity of the first positioning hole 22, and then connect the outer cover 17 with its external structure and install it on the outer surface of the positioning frame 11, so that the positioning rod 15 corresponds to the position of the second positioning hole 23, and the spring The elastic force of 21 drives the limit plate 20 to reset, and the limit plate 20 drives the positioning rod 15 to enter the inner cavity of the second positioning hole 23, thereby positioning the position of the outer cover 17 to achieve the purpose of packaging;

B: Then, the structure is fixed with other devices by the cooperation of the mounting holes 8 and the peripheral bolts. After the power is turned on, the temperature sensor 16 continuously monitors the temperature in the outer cover 17, and sends the water to the heat dissipation base 1 through the water inlet valve 6. When the cooling liquid is introduced, the cooling liquid usually flows into the inner cavity of the serpentine tube 12, the surface of the serpentine tube 12 adsorbs the heat in the outer cover 17, the cooling liquid adsorbs the heat on the surface of the serpentine tube 12, and the heat on the surface of the IGBT module 18 is absorbed. The heat is transferred to the heat dissipation base 1 through the thermal conductive silica gel 13, and the cooling liquid in the heat dissipation base 1 usually absorbs the heat, and is discharged through the drain valve 10, and the cooling liquid is continuously supplied to dissipate heat;

C: During the heat dissipation process, the heat dissipation fan 19 is started, and the heat dissipation fan 19 draws the outside air through the air inlet pipe 9, and accelerates the blowing into the inner cavity of the outer cover 17, so as to dissipate heat inside. In this process, the second filter net 25 and the first filter screen 27 filter the dust and impurities in the air, and the solid desiccant 28 adsorbs the moisture in the air, so as to avoid too much moisture entering the inner cavity of the outer cover 17. The user needs to rotate the frame 26 regularly to drive the The threaded pipe 24 is separated from the inner cavity of the air inlet pipe 9, so as to facilitate the cleaning and maintenance of the first filter screen 27 and the second filter screen 25, and also facilitate the replacement of the solid desiccant 28;

D: The heat absorbed on the surface of the outer cover 17 can be transferred to the outside through the first heat dissipation plate 4, so that the heat dissipation efficiency of the outer cover 17 is improved through the cooperation of the first heat dissipation plate 4 and the first heat dissipation hole 7. The second heat dissipation plate 2 and the first heat dissipation hole 7 The cooperation of the two heat dissipation holes 29 will also speed up the heat dissipation efficiency of the heat dissipation base 1 .

To sum up: the new IGBT package structure with temperature measurement function is provided with a heat dissipation base 1, a second heat dissipation plate 2, a heat insulation plate 3, a first heat dissipation plate 4, a mounting frame 5, a water inlet valve 6, a first Heat dissipation hole 7, installation hole 8, air inlet pipe 9, drain valve 10, positioning frame 11, serpentine tube 12, thermally conductive silica gel 13, shell 14, positioning rod 15, temperature sensor 16, cover 17, IGBT module 18, heat dissipation Fan 19, limit plate 20, spring 21, first positioning hole 22, second positioning hole 23, threaded pipe 24, second filter screen 25, frame 26, first filter screen 27, solid desiccant 28 and second heat dissipation The combined use of the holes 29 solves the problems that the existing IGBT package structure does not have a temperature measurement function and has a poor heat dissipation effect.

Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, and substitutions can be made in these embodiments without departing from the principle and spirit of the invention and modifications, the scope of the present invention is defined by the appended claims and their equivalents.

Claims (7)

1. A novel IGBT package structure with temperature measurement function, comprising a heat dissipation base (1), characterized in that: both sides of the heat dissipation base (1) are respectively connected with a water inlet valve (6) and a drain valve (10), so Mounting brackets (5) are fixedly connected to both sides of the bottom of the heat dissipation base (1), and mounting holes (8) are provided on both front and rear sides of the bottom of the mounting bracket (5). The top of the heat dissipation base (1) is provided with mounting holes (8). A thermally conductive silica gel (13) is fixedly connected, an IGBT module (18) is fixedly connected to the top of the thermally conductive silica gel (13), and a positioning frame (11) is fixedly connected to the top of the heat dissipation base (1). 11) Both sides of the inner cavity are fixedly connected with a casing (14), the inner cavity of the casing (14) is movably connected to a limit plate (20), and the limit plate (20) is far away from the positioning frame (11) A spring (21) is fixedly connected to one side of the limiter plate (20), a positioning rod (15) is fixedly connected to the side of the limiting plate (20) away from the spring (21), and a second A positioning hole (22), a cover (17) is movably connected to the top of the heat dissipation base (1), temperature sensors (16) are fixedly connected to both sides of the inner cavity of the cover (17), and the cover (17) ) is fixedly connected with a heat insulating plate (3), the two sides of the outer cover (17) and the two sides of the heat insulating plate (3) are provided with a second positioning hole (23), the positioning rod (15) One end away from the limiting plate (20) passes through the first positioning hole (22) and extends to the inner cavity of the second positioning hole (23), the outer surface of the outer cover (17) is fixedly connected with a first heat dissipation plate (4), the side of the first heat dissipation plate (4) away from the outer cover (17) penetrates to the outside of the heat insulation plate (3), the top of the inner cavity of the outer cover (17) is fixedly connected with a cooling fan (19) ), the top of the cooling fan (19) is communicated with an air inlet pipe (9), and the top of the air inlet pipe (9) sequentially penetrates the outer cover (17) and the heat insulation plate (3) and extends to the heat insulation plate ( 3) The top of the air inlet pipe (9) is fixedly connected with a first filter screen (27) at the bottom of the inner cavity, and a solid desiccant (28) is placed on the top of the first filter screen (27). A frame (26) is movably connected to the top of the air inlet pipe (9), and a threaded pipe (24) is fixedly connected to the bottom of the frame (26), and the threaded pipe (24) is located in the inner cavity of the air inlet pipe (9). A second filter screen (25) is fixedly connected between the threaded pipe (24) and the inner cavity of the frame (26). 2. The novel IGBT package structure with temperature measurement function according to claim 1, characterized in that: the number of the first heat dissipation plate (4) is several, and one side of the first heat dissipation plate (4) A first heat dissipation hole (7) is opened. 3. The novel IGBT package structure with temperature measurement function according to claim 1, characterized in that: the bottom of the heat dissipation base (1) is fixedly connected with a second heat dissipation plate (2), and the second heat dissipation plate ( 2) One side is provided with second heat dissipation holes (29), and the number of the second heat dissipation plates (2) is several. 4. The novel IGBT package structure with temperature measurement function according to claim 1, characterized in that: the front and rear sides of the IGBT module (18) are provided with serpentine tubes (12), and the serpentine tubes ( Both ends of 12) are communicated with the heat dissipation base (1). 5 . The novel IGBT package structure with temperature measurement function according to claim 1 , wherein the bottom of the casing ( 14 ) is fixedly connected to the heat dissipation base ( 1 ), and the outer surface of the threaded pipe ( 24 ) is fixedly connected. 6 . The connection between the surface and the air inlet pipe (9) is screwed. 6. The novel IGBT package structure with temperature measurement function according to claim 1, characterized in that: the outer surface of the positioning frame (11) is in contact with the inner wall of the outer cover (17), and the heat insulation plate (3) Made of fiberglass. 7. according to the encapsulation method of the novel IGBT encapsulation structure with temperature measurement function described in any one of claim 1-6, its concrete operation steps are as follows: A: First store the positioning rod (15) into the inner cavity of the first positioning hole (22), and then connect the outer cover (17) with its external structure and install it on the outer surface of the positioning frame (11), so that the positioning rod (15) is connected to the outer surface of the positioning frame (11). The position of the second positioning hole (23) corresponds to the position of the second positioning hole (23), the elastic force of the spring (21) drives the limit plate (20) to reset, and the limit plate (20) drives the positioning rod (15) into the inner cavity of the second positioning hole (23), In this way, the position of the outer cover (17) is positioned to achieve the purpose of encapsulation; B: The structure is then fixed with other devices by the cooperation of the mounting holes (8) and the peripheral bolts. After the power is turned on, the temperature sensor (16) continuously monitors the temperature in the outer cover (17), and passes the water inlet valve. (6) Pass the cooling liquid into the heat dissipation base (1), the cooling liquid usually flows into the inner cavity of the serpentine tube (12), the surface of the serpentine tube (12) adsorbs the heat in the outer cover (17), and the cooling liquid The heat on the surface of the serpentine tube (12) is adsorbed, and the heat on the surface of the IGBT module (18) is transferred to the heat dissipation base (1) through the thermally conductive silica gel (13). It is discharged through the drain valve (10), and the cooling liquid is continuously introduced to dissipate heat; C: During the heat dissipation process, start the heat dissipation fan (19), the heat dissipation fan (19) extracts the outside air through the air inlet pipe (9), and accelerates the blowing into the inner cavity of the outer cover (17), so as to dissipate the heat inside. During this process, the second filter screen (25) and the first filter screen (27) filter the dust and impurities in the air, and the solid desiccant (28) adsorbs the moisture in the air, so as to prevent too much moist air from entering the housing (17), the user needs to periodically rotate the frame (26) to drive the threaded pipe (24) to disengage from the inner cavity of the air inlet pipe (9), so as to facilitate the filtering of the second filter screen (25) and the first filter. The net (27) is cleaned and maintained, and it is also convenient to replace the solid desiccant (28); D: The heat absorbed on the surface of the outer cover (17) can be transferred to the outside through the first heat dissipation plate (4), so that through the cooperation of the first heat dissipation plate (4) and the first heat dissipation hole (7), the heat dissipation of the outer cover (17) is improved. Heat dissipation efficiency, the cooperation of the second heat dissipation plate (2) and the second heat dissipation hole (29) will also speed up the heat dissipation efficiency of the heat dissipation base (1).

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