CN111966187A - A device and method for heat dissipation management of an external card applied to a high-density server - Google Patents

Abstract

The invention provides an external card heat dissipation management device and method applied to a high-density server, wherein a local temperature control circuit is added in a server node, the temperature of an area with larger heat productivity is detected through an NTC thermistor or a temperature sensor, when the temperature exceeds an allowable range, the temperature control circuit starts to work, the current passing through a TEC refrigeration sheet is regulated and controlled through a PWM wave, and then the refrigeration is carried out through the TEC refrigeration sheet, so that the temperature of a heating board card is reduced, and the area temperature of the heating board card is controlled within a safe range. Because the TEC refrigeration plate is arranged above the heating plate card or is closely arranged, the inner space of the node is not occupied; the temperature control circuit of the refrigerating sheet is integrated into the board card shell, so that the heat dissipation can be enhanced and the confidentiality can be ensured; the refrigerating sheet uses a DSP chip, a control circuit is simple, and CPLD or BMC resources in the server are prevented from being occupied; and the control precision is high through the closed-loop control of temperature feedback.

Description

A device and method for heat dissipation management of an external card applied to a high-density server

technical field

The invention relates to the technical field of server heat dissipation, in particular to a heat dissipation management device and method for an add-in card applied to a high-density server.

Background technique

In recent years, driven by technologies such as cloud computing, big data, and the Internet of Things, the data center industry has ushered in a period of rapid growth. As the exclusive form of large Internet companies such as BAT, the entire rack server has been deployed on a large scale. It is also widely used by traditional enterprises with self-built data centers. Compared with traditional rack and blade servers, it has changed the deployment and use methods of traditional servers, and the hardware platform can be flexibly configured according to the needs of users, which brings more advantages and improves the utilization of cabinet space. The overall unit pools the power supply unit, the cooling unit and the cloud computing unit, which reduces the space occupied by the auxiliary modules. The centralized power supply and cooling design improves the power efficiency, realizes the reduction of energy consumption and efficient delivery.

The traditional server adopts an exclusive design in the design of the cooling subsystem, and the single machine is equipped with an independent fan for cooling. SmartRack, on the other hand, removes the cooling fan of each server node and integrates it into a cooling fan wall through centralized cooling, which is arranged at the rear of the entire cabinet. Only 18 fans are required for 48 nodes, reducing the number by more than 93%, effectively improving the The heat dissipation efficiency, space utilization and power conversion rate greatly reduce the heat dissipation power consumption.

With the development of Internet companies, more and more peripheral devices and functions are added, which makes the components and external boards inside the server cabinet denser and denser. For the chips and external cards, leave enough cooling air ducts or carry out a separate cooling design. A server that uses a fan wall to manage heat dissipation in a unified manner cannot control a certain area inside, resulting in local overheating inside the server. Local overheating will reduce the performance of the board, cause speed reduction and frequency reduction, high temperature alarms, and even bring downtime and other serious consequences, which may eventually lead to local component failure.

SUMMARY OF THE INVENTION

The purpose of the present invention is to provide a heat dissipation management device and method for an add-in card applied to a high-density server, which aims to solve the problem that local overheating is easy to occur inside the server in the prior art, realize closed-loop control through temperature feedback, and improve control accuracy .

In order to achieve the above technical purpose, the present invention provides a heat dissipation management device for an add-in card applied to a high-density server, the device comprising:

TEC cooling chips, temperature monitoring components, power control chips, DSP chips and heat sinks;

The temperature monitoring component monitors the temperature information of the heating board and feeds it back to the DSP chip;

The DSP chip is connected to the power control chip, and adjusts the power output of the power control chip through the PWM wave according to the temperature information;

The power control chip is connected to the TEC cooling chip, and controls the current size and direction of the TEC cooling chip according to the power output;

The DSP chip is also connected with a radiator fan.

Preferably, the cooling surface of the TEC refrigerating sheet is attached and pressed against the shell of the heating board card, and thermally conductive silicone grease is applied in the middle, the heating surface of the TEC refrigerating sheet is attached and pressed against the shell of the radiator board card, and thermally conductive silicon is smeared in the middle. fat.

Preferably, the temperature monitoring component is an NTC thermistor or a temperature sensor.

Preferably, the TEC cooling chip is powered by a connector on the main board for power supply of peripheral boards.

Preferably, the device further includes a two-color LED connected to the DSP chip. When the temperature of the heating board is too high or the temperature cannot be adjusted normally, so that the temperature of the TEC cooling chip is too high, it will warn in red, otherwise it will be displayed in green normally.

The present invention also provides a heat dissipation management method for an add-in card applied to a high-density server implemented by the device, and the method includes the following operations:

The real-time temperature of the heating board is monitored by the temperature sensor, and the DSP chip calculates the real-time temperature difference between the real-time temperature and the reference temperature;

When the real-time temperature difference is not greater than the reference temperature difference threshold, read the output value of the incremental PID controller, and linearly map the output value to the PWM duty cycle, or control the temperature control circuit to not work;

When the real-time temperature difference is greater than the reference temperature difference threshold, the output PWM duty cycle is 1, the power control chip works in full power mode, and the PWM duty cycle of the next cycle is obtained;

The TEC cooling chip sets the magnitude and direction of the input current according to the power to dissipate heat from the heating board.

Preferably, the DSP chip is initialized at the initial stage of power-on, including the PWM period, the reference temperature, the reference temperature difference threshold and the PID controller coefficient.

Preferably, the formula of the incremental PID controller is:

ΔP _d =K _p [e(k)-e(k-1)]+K _I e(k)+K _D [e(k)-2e(k-1)+e(k-2)]

In the formula, K _p , K _I and K _D are the proportional term, integral term and differential term of the PID controller respectively; e is the power error.

The effects provided in the summary of the invention are only the effects of the embodiments, rather than all the effects of the invention. One of the above technical solutions has the following advantages or beneficial effects:

Compared with the prior art, the present invention detects the temperature of the area with a large amount of heat through NTC thermistor or temperature sensor by adding a local temperature control circuit inside the server node. When the temperature exceeds the allowable range, the temperature control circuit Start to work, use PWM wave to adjust and control the current passing through the TEC cooling sheet, and then use the TEC cooling sheet to cool down, reduce the temperature of the heating board, so that the temperature of the heating board area is controlled within a safe range. Because the TEC cooling chip is placed on the top of the heating board or close to it, it does not occupy the internal space of the node; the temperature control circuit of the cooling chip is integrated into the board shell, which can enhance heat dissipation and ensure confidentiality; the cooling chip uses a DSP chip to control The circuit is simple and avoids occupying the CPLD or BMC resources inside the server; through the closed-loop control of temperature feedback, the control precision is high.

Description of drawings

1 is a schematic diagram of a heat dissipation structure provided in an embodiment of the present invention;

FIG. 2 is a schematic working diagram of an external card heat dissipation management device applied to a high-density server provided in an embodiment of the present invention;

FIG. 3 is a flowchart of a heat dissipation management method for an add-in card applied to a high-density server according to an embodiment of the present invention.

Detailed ways

In order to clearly illustrate the technical features of the solution, the present invention will be described in detail below through specific embodiments and in conjunction with the accompanying drawings. The following disclosure provides many different embodiments or examples for implementing different structures of the invention. In order to simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Furthermore, the present invention may repeat reference numerals and/or letters in different instances. This repetition is for the purpose of simplicity and clarity and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed. It should be noted that the components illustrated in the figures are not necessarily drawn to scale. Descriptions of well-known components and processing techniques and processes are omitted from the present invention to avoid unnecessarily limiting the present invention.

A device and method for heat dissipation management of an add-in card applied to a high-density server provided by embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

As shown in Figures 1-2, the present invention discloses a heat dissipation management device for an add-in card applied to a high-density server. The device includes:

TEC cooling chips, temperature monitoring components, power control chips, DSP chips and heat sinks;

The temperature monitoring component monitors the temperature information of the heating board and feeds it back to the DSP chip;

The DSP chip is connected to the power control chip, and adjusts the power output of the power control chip through the PWM wave according to the temperature information;

The power control chip is connected to the TEC cooling chip, and controls the current size and direction of the TEC cooling chip according to the power output;

The DSP chip is also connected with a radiator fan.

Affix and press the cooling surface of the TEC cooling sheet to the shell of the heating board card, apply thermal conductive silicone grease in the middle, attach and press the heating surface of the TEC cooling sheet to the shell of the radiator card, and apply thermal conductive silicone grease in the middle.

Install the NTC thermistor or temperature sensor on the board with the TEC cooling chip. For the best overall stability, place the thermistor or temperature sensor close to the TEC cooling chip, or use the temperature sensor integrated inside the TEC. To feed back the temperature information of the TEC cooling chip, the temperature control circuit can also be integrated into the shell of the heating board and close to the top of the security board chip. In addition, there must be at least two temperature information feedback circuits to ensure that one of the feedback circuits fails and information can be obtained from the other feedback circuit.

The TEC cooling chip is powered by the connector originally used for the power supply of the peripheral card on the main board, and the DSP chip is initialized at the initial stage of power-on, including the PWM cycle, reference temperature, reference temperature difference threshold and PID controller coefficient.

After the DSP chip is powered on, the temperature difference is calculated by the temperature information detected by the DSP chip and the set reference temperature value. According to the size of the temperature difference, the PWM is calculated by the incremental PID controller, and the PWM wave is used to adjust the power control. The chip, the power control chip outputs a certain current to the TEC cooling chip. When the TEC cooling chip flows a current in a fixed direction, its cooling surface starts to cool, and the heating surface starts to heat up, and its cooling capacity is proportional to the current. The cooling side will lower the temperature of the heating board, and the heating side will transfer the heat to the board case or heat sink, which is used to discharge the generated heat out of the chassis.

In addition, there is a two-color LED on the board, which is driven by DSP. When the temperature of the heating board is too high or the temperature adjustment cannot be performed normally, so that the temperature of the TEC cooling chip is too high, it will warn in red, otherwise it will be displayed in green normally.

In the embodiment of the present invention, by adding a local temperature control circuit inside the server node, the NTC thermistor or temperature sensor is used to detect the temperature of the area with a large amount of heat. When the temperature exceeds the allowable range, the temperature control circuit starts to work, and the PWM The wave regulation controls the current passing through the TEC cooling sheet, and then cools it through the TEC cooling sheet, reducing the temperature of the heating board, so that the temperature of the heating board area is controlled within a safe range. Because the TEC cooling chip is placed on the top of the heating board or close to it, it does not occupy the internal space of the node; the temperature control circuit of the cooling chip is integrated into the board shell, which can enhance heat dissipation and ensure confidentiality; the cooling chip uses a DSP chip to control The circuit is simple and avoids occupying the CPLD or BMC resources inside the server; through the closed-loop control of temperature feedback, the control precision is high.

As shown in FIG. 3 , an embodiment of the present invention further discloses a heat dissipation management method for an add-in card applied to a high-density server implemented by using the device, and the method includes the following operations:

Monitor the real-time temperature of the heating board through the temperature sensor, and calculate the real-time temperature difference between the real-time temperature and the reference temperature;

When the real-time temperature difference is not greater than the reference temperature difference threshold, read the output value of the incremental PID controller, and linearly map the output value to the PWM duty cycle, or control the temperature control circuit to not work;

When the real-time temperature difference is greater than the reference temperature difference threshold, the output PWM duty cycle is 1, the power control chip works in full power mode, and the PWM duty cycle of the next cycle is obtained;

The TEC cooling chip sets the input current size and direction according to the power to dissipate heat from the heating board.

When the temperature difference between the temperature of the heating board and the reference temperature is not greater than the reference temperature difference threshold, the entire temperature control circuit does not work or works according to the output value of the PID controller. When the temperature difference between the temperature of the heating board and the reference temperature Above the threshold, the temperature control circuit operates at full power. The TEC cooling sheet works to cool down the board to reduce the temperature of the board until the area temperature of the heating board is within a safe range.

Initialization settings are performed at the initial stage of power-on of the DSP chip, including PWM cycle, reference temperature, reference temperature difference threshold and PID controller coefficients.

After the DSP chip is powered on, wait for a PWM cycle, read the reference temperature difference threshold preset by the DSP chip, read the real-time temperature through the DSP chip, calculate the real-time temperature difference between the real-time temperature and the reference temperature, and compare the real-time temperature difference with the reference temperature. Temperature difference threshold for comparison.

When the real-time temperature difference is not greater than the reference temperature difference threshold, the output value of the incremental PID controller is read, and the output value is linearly mapped to the PWM duty cycle, or the control temperature control circuit does not work.

The formula of the incremental PID controller is:

ΔP _d =K _p [e(k)-e(k-1)]+K _I e(k)+K _D [e(k)-2e(k-1)+e(k-2)]

In the formula, K _p , K _I and K _D are the proportional term, integral term and differential term of the PID controller respectively; e is the power error. The proportional term can make the power error respond quickly, the integral term can make the power of the power control chip reach the set power and eliminate the static difference of power, and the differential term can predict the output of the next cycle according to the error rate, which can improve the dynamic response of the system speed.

When the real-time temperature difference is greater than the reference temperature difference threshold, the output PWM duty cycle is 1, the power control chip works in full power mode, and the PWM duty cycle of the next cycle is obtained.

The above descriptions are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention shall be included in the protection of the present invention. within the range.

Claims (8)

1. An external card heat dissipation management device applied to a high-density server, wherein the device comprises: TEC cooling chips, temperature monitoring components, power control chips, DSP chips and heat sinks; The temperature monitoring component monitors the temperature information of the heating board and feeds it back to the DSP chip; The DSP chip is connected to the power control chip, and adjusts the power output of the power control chip through the PWM wave according to the temperature information; The power control chip is connected to the TEC cooling chip, and controls the current size and direction of the TEC cooling chip according to the power output; The DSP chip is also connected with a radiator fan. 2 . The heat dissipation management device for an add-in card applied to a high-density server according to claim 1 , wherein the cooling surface of the TEC cooling sheet is attached to and pressed against the heating plate card shell, and thermally conductive silicon is applied in the middle. 3 . Grease, the heating surface of the TEC cooling sheet is attached and pressed against the shell of the radiator board, and thermal conductive silicone grease is applied in the middle. 3 . The heat dissipation management device for an add-in card applied to a high-density server according to claim 1 , wherein the temperature monitoring component is an NTC thermistor or a temperature sensor. 4 . 4 . The heat dissipation management device for an external card applied to a high-density server according to claim 1 , wherein the TEC cooling sheet is powered by a connector on the main board that is used for power supply of the peripheral card. 5 . 5. The heat dissipation management device for an add-in card applied to a high-density server according to claim 1, wherein the device further comprises a bi-color LED, connected to the DSP chip, when the temperature of the heating board is too high or When the temperature adjustment cannot be carried out normally and the temperature of the TEC cooling plate is too high, it will warn in red, otherwise it will be displayed in green normally. 6. A method for heat dissipation management of an add-in card applied to a high-density server implemented by the device according to any one of claims 1-5, wherein the method comprises the following operations: The real-time temperature of the heating board is monitored by the temperature sensor, and the DSP chip calculates the real-time temperature difference between the real-time temperature and the reference temperature; When the real-time temperature difference is not greater than the reference temperature difference threshold, read the output value of the incremental PID controller, and linearly map the output value to the PWM duty cycle, or control the temperature control circuit to not work; When the real-time temperature difference is greater than the reference temperature difference threshold, the output PWM duty cycle is 1, the power control chip works in full power mode, and the PWM duty cycle of the next cycle is obtained; The TEC cooling chip sets the magnitude and direction of the input current according to the power to dissipate heat from the heating board. 7. The method for heat dissipation management of an add-in card applied to a high-density server according to claim 6, wherein the DSP chip is initialized and set at the initial stage of power-on, including a PWM cycle, a reference temperature, a reference temperature difference threshold and a PID controller coefficients. 8. The heat dissipation management method for an external plug-in card applied to a high-density server according to claim 6, wherein the formula of the incremental PID controller is: ΔP _d =K _p [e(k)-e(k-1)]+K _I e(k)+K _D [e(k)-2e(k-1)+e(k-2)] In the formula, K _p , K _I and K _D are the proportional term, integral term and differential term of the PID controller respectively; e is the power error.

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