CN111933565A - Wafer adsorption force adjusting system and method for conveying manipulator and arm - Google Patents

Abstract

An embodiment of the present invention provides a wafer adsorption force adjustment system, method, and arm for a conveying robot. The system includes: N pressure sensors, N wafer contactors, a controller, a static electricity generation controller, and a static electricity generation controller. device; the N pressure sensors are respectively connected with N wafer contactors for obtaining the pressure value of the wafer after determining that the wafer is placed on the wafer contactor, and the pressure value is N The sum of the output values of the pressure sensors; the controller is connected to the output ends of the N pressure sensors, and is used for determining the corresponding current target voltage value according to the pressure value and the preset electrostatic control voltage model, and Using the current target voltage value to drive the static electricity generation controller to output the current actual voltage value, so that the static electricity generating device can generate corresponding static charges to generate adsorption force with the wafer electrostatic induction, so as to achieve different thicknesses under various processes. Slip-free transport of wafers.

Description

Wafer suction force adjustment system and method for transfer robot, arm

technical field

The invention relates to the technical field of semiconductor production, in particular to a wafer adsorption force adjustment system and method and an arm for a conveying robot.

Background technique

In the prior art, in the production of semiconductors, due to the variety of semiconductor products and the complex process, the thickness of the wafers varies greatly in different fabs, and the contact area of the wafer contactors in contact with the wafers is required to be as small as possible. Reduced to avoid defects and exposure problems. There is no transfer method in the industry that can be fully adapted, so different series of wafer transfer robots have to be produced to adapt to it, resulting in a lot of investment.

Therefore, how to provide a transfer robot that can conveniently transfer wafers of different specifications is a technical problem to be solved urgently by those skilled in the art.

SUMMARY OF THE INVENTION

Embodiments of the present invention provide a wafer adsorption force adjustment system, method, and arm for a transfer robot, which can conveniently transfer wafers of different specifications.

An embodiment of the present invention provides a wafer adsorption force adjustment system for a transfer robot, including: N pressure sensors, N wafer contactors, a controller, a static electricity generating controller, and a static electricity generating device, where N is no a positive integer less than 3;

The static electricity generating device is connected to the voltage output end of the static electricity generating controller, and is used for generating static charge to induce induced charge on the wafer;

The N pressure sensors are respectively connected to the N wafer contactors, and are used to obtain the pressure value of the wafer after it is determined that the wafer is placed on the wafer contactor, and the pressure value is the N number of the pressure sensors. The sum of the output values of the pressure sensor;

The controller is connected to the output ends of the N pressure sensors, and is used for determining a corresponding current target voltage value according to the pressure value and a preset electrostatic control voltage model, and using the current target voltage value to drive the static electricity generation control The device outputs the current actual voltage value so that the static electricity generating device generates a corresponding static charge; wherein, the preset static electricity control parameter model is provided with a corresponding relationship between the pressure value and the target voltage value.

Further, the preset electrostatic control parameter model is a preset electrostatic control voltmeter; the preset electrostatic control voltmeter is provided with a pressure value range and a corresponding target voltage value.

Further, the preset electrostatic control voltage model is a functional relationship between the pressure value and the target voltage value.

Further, it also includes a power supply;

The static electricity generating device includes a positive charge terminal and an electronic terminal;

The positive charge terminal and the electronic terminal are both arranged on the transmission manipulator;

The power supply is used to supply power to the positive charge terminal and the electronic terminal, so that the positive charge terminal generates a positive charge, and the electronic terminal generates electrons.

Further, it also includes: an alarm module connected to the controller;

The controller is further configured to obtain the current target voltage value and the current actual voltage value, and determine whether the difference between the current target voltage value and the current actual voltage value exceeds a preset threshold; if it exceeds the current threshold, the alarm module is triggered.

Further, the controller is further configured to obtain the current target voltage value and the current actual voltage value, and determine whether the difference between the current target voltage value and the current actual voltage value exceeds a preset threshold; if it does not exceed the preset threshold, Then, the preset electrostatic control voltage model is modified by using the current target voltage value and the current actual voltage value to obtain a modified voltage model.

Further, the controller is specifically configured to, if the current target voltage value is less than the current actual voltage value, adjust the target voltage value in the preset electrostatic control voltage model to be smaller; if the current target voltage value is greater than the current actual voltage value voltage value, the target voltage value in the preset electrostatic control voltage model is increased.

Further, the controller is further configured to issue a wafer placement error alarm when the deviation of any one of the N pressure values corresponding to the N pressure sensors and the other pressure values exceeds a threshold.

An embodiment of the present invention also provides a method for adjusting the wafer adsorption force for a conveying robot, which is applied to any one of the wafer adsorption force adjustment systems described above, including:

After it is determined that the wafer is placed on the wafer contactor, the pressure value of the wafer is obtained, and the pressure value is the sum of the output values of the N pressure sensors;

determining a corresponding current target voltage value according to the pressure value and a preset electrostatic control voltage model;

Using the current target voltage value to drive the static electricity generating controller to output the current actual voltage value so that the static electricity generating device generates corresponding static charge;

Wherein, the preset electrostatic control parameter model has a corresponding relationship between the pressure value and the target voltage value.

Further, it also includes:

Obtain the current target voltage value and the current actual voltage value;

Determine whether the difference between the current target voltage value and the current actual voltage value exceeds a preset threshold;

If the preset threshold value is not exceeded, the preset electrostatic control voltage model is modified by using the current target voltage value and the current actual voltage value to obtain a modified voltage model.

An embodiment of the present invention provides a wafer adsorption force adjustment system, method, and arm for a conveying manipulator. By utilizing the different weights of wafers of different specifications, the electrostatic charge generated by the electrostatic generating device is controlled to be different, so as to generate different electrostatic charges. The positive pressure ensures the static friction during the wafer transfer process. The positive pressure can be converted into the pressure value of the electrical signal by the pressure sensor under the wafer contactor, so as to realize the non-slip of the wafers with different thicknesses under various processes. transmission.

Description of drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description These are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic structural diagram of a wafer adsorption force adjustment system for a transfer robot according to an embodiment of the present invention;

FIG. 2 is a voltage relationship diagram of a wafer adsorption force adjustment system for a transfer robot according to an embodiment of the present invention;

FIG. 3 is a force-electricity relationship diagram of a wafer adsorption force adjustment system for a transfer robot according to an embodiment of the present invention;

4 is a top view of a wafer adsorption force adjustment system for a transfer robot according to an embodiment of the present invention;

5 is a front view of a wafer adsorption force adjustment system for a transfer robot according to an embodiment of the present invention;

FIG. 6 is a flow chart of a method for adjusting the adsorption force of a wafer for a conveying robot according to an embodiment of the present application;

FIG. 7 is a modified flow chart of the method for adjusting the wafer suction force for a transfer robot provided by an embodiment of the present application.

Reference number:

1: Base body; 11: Support part; 12: Connection part; 13: Wiring slot;

2: Static electricity generating device; 21: Positive charge terminal; 22: Electronic terminal;

3: wafer contactor; 4: pressure sensor; 5: first wire; 6: second wire; 7: wiring distributor; 8: controller; 9: static electricity generation controller.

Detailed ways

In order to make the purposes, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments These are some embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

The following describes a wafer adsorption force adjustment system for a transfer robot according to an embodiment of the present invention with reference to FIGS. 1 to 5 . 1 is a schematic diagram of the composition and structure of a wafer adsorption force adjustment system for a transfer robot according to an embodiment of the present invention; FIG. 2 is a voltage relationship of a wafer adsorption force adjustment system for a transfer robot according to an embodiment of the present invention. Fig. 3 is a force-electrical relationship diagram of a wafer adsorption force adjustment system for a conveying robot provided by an embodiment of the present invention; Fig. 4 is a wafer adsorption force adjustment for a conveying robot provided by an embodiment of the present invention The top view of the system; FIG. 5 is a front view of a wafer adsorption force adjustment system for a transfer robot provided by an embodiment of the present invention.

In a specific implementation manner of the present invention, an embodiment of the present invention provides a wafer adsorption force adjustment system for a transfer robot, comprising: N pressure sensors 4, N wafer contactors 3, a controller 8, The static electricity generation controller 9, the static electricity generation device 2, the N is a positive integer not less than 3; the static electricity generation device 2 is connected with the voltage output terminal of the static electricity generation controller 9, and is used for The circle generates an induced charge; the N described pressure sensors 4 are respectively connected with N wafer contactors 3 for obtaining the pressure value of the wafer when the wafer is determined to be placed on the wafer contactor 3; The controller 8 is connected to the output ends of the N pressure sensors, and is used to determine the corresponding current target voltage value according to the pressure value and the preset electrostatic control voltage model, and use the current target voltage value to drive the static electricity generation. The controller 9 outputs the current actual voltage value so that the static electricity generating device 2 generates a corresponding static charge; wherein, the preset static electricity control parameter model has a corresponding relationship between the pressure value and the target voltage value.

Specifically, as shown in FIG. 1 , there are a first wafer contactor 301 , a second wafer contactor 302 , and an Nth wafer contactor 30N in the figure. A solid piece that touches and supports the wafer, therefore, at least 3 pieces are required to fix the sheet-shaped wafer. Therefore, N is an integer greater than 2, that is, a natural number such as 3, 4, etc. Correspondingly, N pressure sensors 4 in a one-to-one correspondence may be provided at the bottom of the wafer contactor 3, that is, the first pressure sensor 401, the second pressure sensor 402...the Nth pressure sensor 40N, so as to be the wafer contactor When a wafer is placed on the 3, the wafer can generate pressure on the pressure sensor 4, and the pressure sensor 4 acquires the pressure value caused by the wafer.

Further, as shown in FIG. 2 and FIG. 3 , it can be known that different types of wafers require different sizes of stiction force, and there is a corresponding relationship between the stiction force and the output voltage of the pressure sensor 4 , and the output voltage of the pressure sensor 4 is related to the electrostatic force. The input voltage of the generator 2 has a corresponding relationship, so that the corresponding relationship between the static friction force and the input voltage of the static generator 2 can be found. The input voltage of the static generator 2 is the target voltage value to be generated by the static generator 2 . Therefore, different target voltage values can be input for different types of wafers, thereby generating corresponding static friction forces.

Specifically, the preset electrostatic control parameter model can be set in the form of a preset electrostatic control voltmeter, so that when the pressure sensor 4 transmits a voltage signal, that is, a signal of a pressure value, the preset electrostatic control can be performed according to the pressure value. The corresponding target voltage value is searched in the voltmeter; the preset electrostatic control voltmeter is provided with a pressure value range and a corresponding target voltage value.

Of course, a function can also be used to express the relationship between the pressure value and the target voltage value, so as to obtain a more accurate target voltage value. That is to say, the preset electrostatic control voltage model is a functional relationship between the pressure value and the target voltage value. Mode. After obtaining the pressure value, use the functional relationship to calculate the target voltage value.

It is worth noting that, in order to make the static electricity generating device 2 generate positive and negative charges, a power supply can also be provided; the static electricity generating device 2 includes a positive charge terminal 21 and an electronic terminal; the positive charge terminal 21 and the electronic terminal The heads are all set on the transfer manipulator; the power supply is used to supply power to the positive charge terminal 21 and the electronic terminal, so that the positive charge terminal 21 generates a positive charge, and the electronic terminal generates electrons .

As shown in FIG. 4 and FIG. 5 , the conveying robot includes: a base body 1 , a power source and a static electricity generating device 2 . The base body 1 includes a support part 11 for supporting the wafer; the static electricity generating device 2 includes a positive charge terminal 21 and an electronic terminal 22. The positive charge terminal 21 and the electron terminal 22 are powered so that the positive charge terminal 21 generates a positive charge and the electron terminal 22 generates electrons.

The wafer can be fixedly supported by the support portion 11 and move synchronously with the support portion 11 , so that the transfer of the wafer is realized. The wafer and the supporting part 11 are provided with a fixed force by the electrostatic generating device 2. After the electrostatic generating device 2 is energized, the positive charge terminal 21 generates a positive charge, and the positive charge terminal 21 attracts electrons in the wafer, and the electronic terminal 22 Electrons are generated, and the electronic terminal 22 attracts the positive charges in the wafer to realize electrostatic adsorption and fixation between the wafer and the transfer robot.

In one embodiment, the support portion 11 is provided with a wafer contactor 3 , the wafer contactor 3 protrudes from the surface of the support portion 11 , and the surface of the wafer contactor 3 is used for contacting the wafer, reducing the contact between the wafer and the wafer. The contact area of the base body 1 and the static friction force between the wafer and the surface of the wafer contactor 3 are used to prevent the wafer from moving relative to the base body 1 to ensure the transfer stability of the wafer.

In one embodiment, the material of the base body 1 is an insulating material, and the insulating material may be ceramic, plastic, rubber, or the like. The base body 1 further includes a connecting portion 12, and the connecting portion 12 is used for connecting with driving components such as a motor and an air cylinder. The support portion 11 is a hollow annular structure, the wafer is supported by the annular support portion 11, the wafer is uniformly stressed, and other operations can also be performed on the wafer through the hollow portion.

In one embodiment, the bottom of the wafer contactor 3 is provided with a pressure sensor 4, and the pressure sensor 4 is used to measure the pressure exerted by the wafer on the wafer contactor 3, and the friction coefficient between the pressure and the surface of the wafer contactor 3 is measured. The static friction force between the wafer and the surface of the wafer contactor 3 can be calculated. The pressure exerted by the wafer on the wafer contactor 3 is the sum of the gravity of the wafer and the attractive force of the electrostatic generating device 2 to the wafer. The gravity of the wafer remains unchanged. According to the set static friction force, the user can adjust the attractive force of the electrostatic generating device 2 to the wafer according to the pressure measured by the pressure sensor 4, that is, adjust the voltage to the electrostatic generating device 2. .

In one embodiment, the base body 1 is configured with a wiring slot 13 , and the first wire 5 connecting the power source and the positive charge terminal 21 and the second wire 6 connecting the power source and the positive charge terminal 21 are both arranged in the wire groove 13 . The arrangement of the wiring slot 13 is convenient to define the wiring path, and the assembly is simpler, and the wires are arranged in the wiring slot 13, which can make the wiring more tidy.

In one embodiment, as shown in FIG. 2 , the wiring slot 13 is a hollow cavity in the base body 1 , the upper and lower surfaces of the wiring slot 13 are closed, and the end of the wiring slot 13 is open so that the wires can be introduced into the wiring in slot 13. The upper and lower surfaces of the wiring slot 13 are closed to provide a relatively closed environment for the positive charge terminal 21 and the electronic terminal 22, so as to reduce the influence of the external environment on the positive charge terminal 21 and the electronic terminal 22, and improve the stability of the Coulomb force .

In one embodiment, a wiring distributor 7 is connected to the base body 1 , and the wiring distributor 7 is arranged at one end of the wiring slot 13 close to the power supply. The wiring distributor 7 is used to connect the wires, the pressure sensor 4 is connected to the power supply through the wiring distributor 7, and the wires between the positive charge terminal 21 and the electronic terminal are also connected to the power supply through the wiring distributor 7, which can be used as a pressure sensor at the same time through a power supply. 4 and the static electricity generating device 2 are powered to simplify the structure.

On the basis of any of the above embodiments, an alarm module connected to the controller 8 is also provided in the embodiment of the present invention; the controller 8 is also used to obtain the current target voltage value and the current actual voltage value, and determine the current Whether the difference between the target voltage value and the current actual voltage value exceeds a preset threshold; if it exceeds the current threshold, the alarm module is triggered.

Further, the controller 8 is also used to obtain the current target voltage value and the current actual voltage value, and determine whether the difference between the current target voltage value and the current actual voltage value exceeds a preset threshold; if it does not exceed the preset threshold , the preset electrostatic control voltage model is modified by using the current target voltage value and the current actual voltage value to obtain a modified voltage model.

Specifically, when revising the preset electrostatic control voltage model, the controller 8 is specifically configured to adjust the target voltage value in the preset electrostatic control voltage model smaller if the current target voltage value is smaller than the current actual voltage value; If the current target voltage value is greater than the current actual voltage value, the target voltage value in the preset electrostatic control voltage model is increased.

On the basis of the above-mentioned embodiment, in this embodiment, in order to know whether there is a deviation in the position where the wafer is placed, the controller 8 is also used for when any one of the N pressure values corresponding to the N pressure sensors 4 A wafer placement error alarm is issued when the deviation from other pressure values exceeds a threshold. That is to say, if the wafer is placed in the correct position, the pressure values of the N pressure sensors 4 should be the same, but if one of them is abnormal, it means that the abnormal pressure sensor 4 has been subjected to too much or too little pressure. pressure, the wafer is placed in the wrong position.

An embodiment of the present invention provides a wafer adsorption force adjustment system, method, and arm for a conveying robot. By utilizing the different weights of wafers with different specifications, the electrostatic charge generated by the electrostatic generating device 2 is controlled to be different, so as to be different from that of all wafers. The electrostatic induction of the wafer generates adsorption force to generate different positive pressures to ensure the static friction force during the wafer transfer process. Produces slip-free transport of wafers of different thicknesses under various processes.

The following describes the wafer adsorption force adjustment system for the transfer robot provided by the embodiments of the present invention, the wafer adsorption force adjustment system for the transfer robot described below and the wafer adsorption force adjustment for the transfer robot described above. The methods can refer to each other correspondingly.

Please refer to FIG. 6 and FIG. 7 , FIG. 6 is a flowchart of a method for adjusting the adsorption force of a wafer for a conveying robot provided by an embodiment of the present application; FIG. 7 is a wafer for conveying a robot provided by an embodiment of the present application. Modified flow chart of the adsorption force adjustment method.

In yet another specific embodiment of the present invention, an embodiment of the present invention also provides a method for adjusting the wafer adsorption force for a conveying robot, which is applied to the wafer adsorption force adjustment system described in any of the above, and is specifically controlled by The controller executes, the method specifically includes:

Step S61: after determining that the wafer is placed on the wafer contactor, obtain the pressure value of the wafer;

Step S62: determining a corresponding current target voltage value according to the pressure value and a preset electrostatic control voltage model;

Step S63 : using the current target voltage value to drive the static electricity generating controller to output the current actual voltage value so that the static electricity generating device generates corresponding static charge;

Wherein, the preset electrostatic control parameter model has a corresponding relationship between the pressure value and the target voltage value.

Further, specifically executed by the controller, the method specifically further includes:

Step S71: obtaining the current target voltage value and the current actual voltage value;

Step S72: judging whether the difference between the current target voltage value and the current actual voltage value exceeds a preset threshold;

Step S73: If the preset threshold value is not exceeded, correct the preset electrostatic control voltage model by using the current target voltage value and the current actual voltage value to obtain a corrected voltage model.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, but not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that it can still be The technical solutions described in the foregoing embodiments are modified, or some technical features thereof are equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims (10)

1. A wafer chucking force adjustment system for a transfer robot, comprising: the device comprises N pressure sensors, N wafer contactors, a controller, a static electricity generation controller and a static electricity generation device, wherein N is a positive integer not less than 3;

the static electricity generating device is connected with a voltage output end of the static electricity generating controller and is used for generating static electricity to enable the wafer to generate induced charges;

the N pressure sensors are respectively connected with the N wafer contactors and used for acquiring pressure values of the wafers after the wafers are placed on the wafer contactors;

the controller is connected with the output ends of the N pressure sensors and is used for determining a corresponding current target voltage value according to the pressure value and a preset static control voltage model, and driving the static electricity generation controller to output a current actual voltage value by using the current target voltage value so as to enable the static electricity generation device to generate corresponding static electricity and generate adsorption force by virtue of static electricity induction with the wafer; and the preset static control parameter model is provided with a corresponding relation between a pressure value and a target voltage value.

2. The wafer chucking force adjustment system of claim 1, wherein the predetermined electrostatic control parameter model is a predetermined electrostatic control voltmeter; the preset static control voltmeter is provided with a pressure value range and a corresponding target voltage value.

3. The wafer chucking force adjustment system of claim 1, wherein the predetermined electrostatic control voltage model is a function of a pressure value and the target voltage value.

4. The wafer chucking force adjustment system for a transfer robot as claimed in claim 1, further comprising a power supply;

the static electricity generating device comprises a positive charge end and an electronic end;

the positive charge end and the electronic end are both arranged on the conveying manipulator;

the power supply is used for supplying power to the positive charge terminal and the electronic terminal, so that the positive charge terminal generates positive charge, and the electronic terminal generates electrons.

5. The wafer chucking force adjustment system for a transfer robot as claimed in claim 1, further comprising: the alarm module is connected with the controller;

the controller is also used for acquiring a current target voltage value and a current actual voltage value, and judging whether the difference value of the current target voltage value and the current actual voltage value exceeds a preset threshold value or not; and if the current threshold value is exceeded, triggering the alarm module.

6. The wafer chucking force adjustment system for a transfer robot as claimed in claim 1,

the controller is also used for acquiring a current target voltage value and a current actual voltage value, and judging whether the difference value of the current target voltage value and the current actual voltage value exceeds a preset threshold value or not; and if the current target voltage value does not exceed the preset threshold value, correcting the preset static control voltage model by using the current target voltage value and the current actual voltage value to obtain a corrected voltage model.

7. The wafer chucking force adjustment system of claim 6, wherein the controller is specifically configured to reduce the target voltage value in the preset electrostatic control voltage model if the current target voltage value is less than the current actual voltage value; and if the current target voltage value is larger than the current actual voltage value, increasing the target voltage value in the preset static control voltage model.

8. The wafer chucking force adjustment system for a transfer robot as claimed in any one of claims 1 to 7, wherein the controller is further configured to issue a wafer placement error alarm when a deviation of any one of the N pressure values corresponding to the N pressure sensors from the other pressure values exceeds a threshold value.

9. A transfer robot characterized by being provided with the wafer suction force adjusting system according to any one of claims 1 to 8.

10. A wafer suction force adjusting method for a transfer robot, applied to the wafer suction force adjusting system according to any one of claims 1 to 8, comprising:

when the wafer is placed on the wafer contactor, acquiring a pressure value of the wafer;

determining a corresponding current target voltage value according to the pressure value and a preset static control voltage model;

driving the static electricity generation controller to output a current actual voltage value by using a current target voltage value so as to enable the static electricity generation device to generate corresponding static electricity to generate an adsorption force with the static electricity induction of the wafer;

and the preset static control parameter model is provided with a corresponding relation between a pressure value and a target voltage value.

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