CN111916374A - Chip array mass transfer device - Google Patents

Abstract

The present application discloses a chip array mass transfer device, including a film stretching and alignment mechanism, the film stretching and alignment mechanism includes a film stretching mechanism and a comb mechanism, and the comb mechanism includes a drive assembly, a transmission assembly, and an alignment mechanism. Positioning mold, the transfer assembly includes at least two transfer units, each transfer unit includes a timing belt, and each timing belt is wound around at least two timing wheels, wherein the positioning mold is detachably mounted on the inner surface of the timing belt The drive assembly is used to drive the synchronizing wheel at one end of the conveying unit to rotate, and the synchronizing wheel at the other end of the conveying unit is respectively connected with the fixed end of the film stretching mechanism and the movable end of the film stretching mechanism. The synchronous belts of the two transfer units move under the drive of the drive assembly, thereby driving the alignment molds on them to move in the length direction of the synchronous belts, so as to align a row of chips, which can realize the batch transfer of chip arrays, and ensure good transfer. At the same time, the efficiency of mass transfer is improved.

Description

Chip Array Mass Transfer Device

technical field

The invention belongs to the technical field related to chip manufacturing, and in particular relates to a chip array mass transfer device.

Background technique

With the escalation of difficulty brought about by the gradual development of LED pixelation, it is faced with many problems such as chips, packaging, and driver ICs. Mass transfer is another difficulty brought by pixelation. It takes a lot of time to transfer LED chips to circuit substrates in batches, and the transfer yield is not easy to control. That is, the efficiency and success rate of mass transfer determine its commercialization. success or failure. The difficulty of mass transfer technology is how to improve the transfer yield, and the transfer accuracy of each chip is controlled within plus or minus 0.5 microns, and it is required to improve production efficiency. At present, the mass transfer technology is mostly single-chip transfer. Although the yield rate is high, the efficiency is low, which is not in line with the current rapid development of the electronic technology industry. Therefore, the efficiency of mass transfer needs to be improved while ensuring the transfer yield.

SUMMARY OF THE INVENTION

In view of the above-mentioned defects or deficiencies in the prior art, it is desirable to provide a chip array mass transfer device.

In order to overcome the deficiencies in the prior art, the technical scheme provided by the present invention is:

The invention provides a chip array mass transfer device, which includes a frame, a pad lifting and aligning mechanism, a film stretching and aligning mechanism and a debonding manipulation assembly. The pad lifting and aligning mechanism is used for horizontal and vertical movement and vertical movement. moving and adjusting the position of the pad; the film stretching and alignment mechanism is used for clamping and stretching the film, and adjusting the position of the film in the horizontal direction to align the pad; the debonding manipulation component is used for peeling off the chip;

The film stretching and alignment mechanism includes a film stretching mechanism and a comb mechanism, the film stretching mechanism includes a fixed end of the film stretching mechanism and a movable end of the film stretching mechanism, and the fixed end of the film stretching mechanism and the The movable ends of the film stretching mechanism are respectively used for clamping the two ends of the film, and the movable ends of the film stretching mechanism are close to or away from the fixed ends of the film stretching mechanism and stretch the film;

The comb mechanism includes a drive assembly, a transmission assembly and an alignment mold, the transmission assembly includes at least two transmission units, each of the transmission units includes a synchronous belt, and each of the synchronous belts is wound around at least two synchronous belts wheel, wherein the alignment mold is detachably mounted on the inner surface of the synchronous belt, the driving assembly is used to drive the synchronous wheel at one end of the transmission unit to rotate, and the other end of the transmission unit rotates. The synchronizing wheels are respectively connected with the fixed end of the film stretching mechanism and the movable end of the film stretching mechanism.

In one embodiment, the drive assembly includes a spline shaft, a coupling and a drive motor, one end of the spline shaft is connected to the drive motor through a coupling, and the other end of the spline shaft is keyed to each of the The center of the corresponding synchronizing wheel of the transfer unit.

In one embodiment, the other ends of the spline shafts are respectively keyed to the centers of the respective synchronizing wheels of the two groups of transmission assemblies, and the two ends of the comb-tooth-shaped plate-like structures are detachably connected to the two groups of the inner surfaces of the respective timing belts of the transfer assemblies.

In one embodiment, the alignment mold includes a comb-tooth-shaped plate structure, and a comb-tooth slot is formed between two adjacent comb-tooths, and the formation position of the comb-tooth slot corresponds to the set position of the chip, so The width of the root of the comb slot matches the size and number of chips to be placed.

In one embodiment, the formation position of the comb-tooth slot corresponds to the set position of the chip on the substrate pad, and the width of the root of the comb-tooth slot is equal to the width of one chip and/or the width of multiple chips is different from that of multiple chips. The sum of the distances between the chips.

In one embodiment, the frame includes a frame base, a frame strut, a frame beam and a frame longitudinal beam, and the frame strut is fixed to the frame base and supports the frame beam and the frame longitudinal beam; the The pad lifting and aligning mechanism is installed on the frame base, the film stretching and aligning mechanism is installed on the bottoms of the two frame beams, and the debonding manipulation assembly is installed on the frame beams.

In one embodiment, the debonding manipulation assembly includes a lateral movement assembly and a debonding manipulation mechanism, the debonding manipulation mechanism includes a laser and a camera, the camera is connected to the output end of the laser, and the camera is used to The laser beam emitted by the laser is projected onto the wafer; the lateral movement assembly is fixed on the frame beam and can move on the frame beam, the lateral movement assembly includes a lateral movement right-angle block, wherein the laser Installed on the laterally moving right-angle block.

In one embodiment, the debonding manipulation assembly includes a lateral movement assembly and a debonding manipulation mechanism, and the debonding manipulation mechanism includes a vertical movement assembly of an ejector mechanism, an ejector mechanism and a precision camera device; the lateral movement assembly is fixed to the on the frame beam, and can move on the frame beam, the vertical movement component of the thimble mechanism is fixed on the lateral movement component, and can move up and down, and the thimble mechanism is installed on the vertical movement component of the thimble mechanism; The precise camera device is used to detect whether the distance between the chip on the film stretching mechanism and the corresponding position of the pad chip on the substrate in the stretching direction is deviated.

In one embodiment, the pad lifting and aligning mechanism includes a sloping block assembly, a substrate assembly and a pad; the substrate assembly is mounted on the sloping block assembly, and the pad is placed on the base plate assembly. on the base plate; the inclined block assembly can carry the base plate assembly to move horizontally and laterally along the length direction of the frame, and the base plate assembly can carry the pad to move vertically up and down.

In one embodiment, the film stretching alignment mechanism further includes a film stretching transverse alignment assembly and a film stretching longitudinal alignment assembly; the film stretching transverse alignment assembly is fixed on the bottom of the frame beam; the film The stretching longitudinal alignment assembly is fixed on the film stretching transverse alignment assembly, and can move horizontally along the length direction of the frame beam on the film stretching transverse alignment assembly; the film stretching mechanism is fixed on the on the film stretching longitudinal alignment assembly, and can move horizontally along the length direction of the frame longitudinal beam on the film stretching longitudinal alignment assembly; the fixed end of the film stretching mechanism is fixed on the film stretching longitudinal direction On the alignment assembly, the movable end of the film stretching mechanism can move horizontally along the length direction of the frame beam on the film stretching longitudinal alignment assembly.

Compared with the prior art, the beneficial effects of the present invention are:

The invention provides a chip array mass transfer device, a chip array mass transfer device, comprising a film stretching alignment mechanism, the film stretching alignment mechanism comprising a film stretching mechanism and a comb mechanism, the comb mechanism It includes a drive assembly, a transfer assembly and an alignment mold, the transfer assembly includes at least two transfer units, each transfer unit includes a synchronous belt, and each synchronous belt is wound around at least two synchronous wheels, wherein the alignment mold is detachably installed On the inner surface of the synchronous belt, the drive assembly is used to drive the synchronous wheel at one end of the transmission unit to rotate, and the synchronous wheel at the other end of the transmission unit is respectively connected with the fixed end of the film stretching mechanism and the movable end of the film stretching mechanism. The synchronous belts of the two transfer units move under the drive of the drive assembly, thereby driving the alignment molds on them to move in the length direction of the synchronous belt, so as to align a row of chips, which can realize the batch transfer of chip arrays, and ensure good transfer. At the same time, the efficiency of mass transfer is improved.

Description of drawings

The accompanying drawings are used as a part of the present application to provide a further understanding of the present invention, and the exemplary embodiments of the present invention and their descriptions are used to explain the present invention, but do not constitute an improper limitation of the present invention. Obviously, the drawings in the following description are only some embodiments, and for those of ordinary skill in the art, other drawings can also be obtained from these drawings without any creative effort. In the attached image:

FIG. 1 is an overall diagram of a chip array mass transfer device according to an embodiment of the present invention;

2 is a schematic diagram of a framework according to an embodiment of the present invention;

FIG. 3 is a schematic diagram of a pad lifting and aligning mechanism according to an embodiment of the present invention;

4 is a schematic diagram of the inclined block assembly according to the embodiment of the present invention;

5 is a schematic diagram of the inclined block drive assembly according to the embodiment of the present invention;

FIG. 6 is a schematic diagram of a substrate assembly according to an embodiment of the present invention;

7 is a schematic diagram of a film stretching alignment mechanism according to an embodiment of the present invention;

8 is a schematic diagram of a film stretching transverse alignment assembly according to an embodiment of the present invention;

9 is a schematic diagram of a longitudinal alignment assembly for film stretching according to an embodiment of the present invention;

10 is a schematic diagram of a film stretching mechanism according to an embodiment of the present invention;

11 is a schematic diagram of a fixed end of a film stretching mechanism according to an embodiment of the present invention;

12 is a schematic diagram of the movable end of the film stretching mechanism according to the embodiment of the present invention;

13 is another schematic diagram of the movable end of the film stretching mechanism according to the embodiment of the present invention;

14 is a schematic diagram of the comb mechanism according to the embodiment of the present invention;

15 is another schematic diagram of the comb mechanism according to the embodiment of the present invention;

Fig. 16 is a partial enlarged view of A part in Fig. 15;

17 is a schematic structural diagram of the alignment mold before alignment according to an embodiment of the present invention;

18 is a schematic structural diagram of the alignment mold after alignment according to an embodiment of the present invention;

19 is another schematic structural diagram of the alignment mold before alignment according to the embodiment of the present invention;

20 is another schematic structural diagram of the alignment mold after alignment according to the embodiment of the present invention;

21 is another structural schematic diagram of the alignment mold after alignment according to the embodiment of the invention;

22 is a schematic diagram of the ejector pin debonding manipulation assembly according to the embodiment of the present invention;

23 is another schematic diagram of the ejector pin debonding manipulation assembly according to the embodiment of the present invention;

Fig. 24 is another schematic diagram of the ejector pin debonding manipulation assembly according to the embodiment of the present invention;

25 is another schematic diagram of the ejector pin debonding manipulation assembly according to the embodiment of the present invention;

Fig. 26 is a partial enlarged view of part B in Fig. 25

27 is a schematic diagram of the ejector mechanism according to the embodiment of the present invention;

28 is a schematic diagram of a laser debonding manipulation mechanism according to an embodiment of the present invention;

29-32 are working principle diagrams of the chip array mass transfer device according to the embodiment of the present invention.

It should be noted that these drawings and written descriptions are not intended to limit the scope of the present invention in any way, but to illustrate the concept of the present invention to those skilled in the art by referring to specific embodiments.

Detailed ways

The present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the related invention, but not to limit the invention. In addition, it should be noted that, for the convenience of description, only the parts related to the invention are shown in the drawings.

It should be noted that the embodiments in the present application and the features of the embodiments may be combined with each other in the case of no conflict. The present application will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.

As mentioned in the background art, most of the current mass transfer technology is single chip transfer, although the yield is high, but the efficiency is low, which is not in line with the current rapid development of the electronic technology industry. The efficiency of transfer will be the direction of improvement in this application.

Referring to FIG. 1 to FIG. 32 , FIG. 1 to FIG. 32 show the specific structure and working principle of the chip array mass transfer apparatus of this embodiment.

The overall diagram of the device is shown in Figure 1. This embodiment is a chip array mass transfer device, which mainly includes a frame 1 , a pad lifting and aligning mechanism 2 , a film stretching and aligning mechanism 3 , and a debonding manipulation component 4 . The pad lift alignment mechanism 2 is used for horizontal and vertical movement to adjust the position of the pad; the film stretch alignment mechanism 3 is used to clamp and stretch the film, and adjust the horizontal direction of the film. position to align the pads; the debonding steering assembly 4 is used to peel off the chip.

As shown in Figure 2, the frame 1 mainly includes: a frame base 101, a frame pillar 102, a frame beam 103, and a frame longitudinal beam 104. The pad lifting alignment mechanism 2 is installed on the frame base 101; the film stretching alignment mechanism 3 is installed on the bottom of the two frame beams 103; the debonding manipulation assembly 4 is installed on a frame beam 103 .

As shown in FIG. 3 , the pad lifting and aligning mechanism 2 includes: an inclined block assembly 201 , a substrate assembly 202 , and a pad 203 , as shown in FIG. 4 . The inclined block assembly 201 is fixed on the frame base 101, the substrate assembly 202 is stacked on the inclined block assembly 201, and the pads 203 are placed on the substrate assembly 202, and the inclined block assembly 201 can carry the substrate The assembly 202 moves horizontally and laterally along the length direction of the frame 1 , and the substrate assembly 202 can support the pads to move up and down vertically.

As shown in FIG. 4 , the inclined block assembly 201 of the pad lifting and aligning mechanism 2 includes: a bottom linear guide module 201A, an inclined block 201B, an inclined block linear guide module 201C, and an inclined block driving module 201D, as shown in the figure 5 shown. The inclined block 201B is connected to the frame base 101 through the bottom linear guide module 201A, wherein the bottom of the inclined block 201B is connected with the slider of the bottom linear guide module 201A, and the guide rail of the bottom linear guide module 201A is connected. Fixed with the frame base 101; the inclined block drive module 201D is assembled on the two opposite inner sides of the two inclined blocks 201B; the guide rails of the inclined block linear guide module 201C are fixed on the two inclined surfaces of the inclined block 201B, a total of It includes six groups, and each of the two inclined blocks 201B is installed with three groups.

As shown in FIG. 5 , the inclined block drive module 201D of the inclined block assembly 201 mainly includes a fixed block 201D1, a nut 201D2, a forward and reverse lead screw 201D3, a coupling 201D4, a motor 201D5, a motor support block 201D6 and other components. The fixing block 201D1 is installed on the frame base 101, and there are three pieces in total; the nuts 201D2 are two in total, which are respectively installed on the inclined blocks 201B on both sides; the forward and reverse screw 201D3 and the fixing block 201D1 It is connected with the nut 201D2, and extends a distance from the fixing block 201D1 near the end of the motor 201D5, and the forward and reverse screw 201D3 and the motor 201D5 are connected together through the coupling 201D4; thus the motor 201D5 It can drive the forward and reverse screw 201D3 to move and the nut 201D2, and then drive the two inclined blocks 201B fixed with the two nuts 201D2. Since the used screws are forward and reverse screws, the two inclined blocks 201B can be driven by the motor 201D5 during operation. Opposite movement, so as to adjust the lifting and lowering of the components installed on its slope.

As shown in FIG. 6 , the substrate assembly 202 of the pad lifting and aligning mechanism 2 includes: an inclined plane platform 202A, a substrate driving module 202B, a substrate 202C, a substrate linear guide module 202D, a substrate displacement detection device 202E, and a substrate displacement detection device 202E. Device connection block 202F. The inclined plane platform 202A is connected with the slider of the inclined block linear guide module 201C, so that the base plate assembly 202 and the inclined block assembly 201 are connected together; block connection, the linear guide of the substrate linear guide module 202D is fixed on the inclined platform 202A, and the pad 203 is placed on the substrate 202C; the stator of the substrate driving module 202B is fixed on the inclined platform 202A, and its mover and the The bottom is fixed, that is, the substrate driving module 202B drives the substrate 202C to move in the length direction of the guide rail of the substrate linear guide module 202D, so as to make the pads 203 on it move; the substrate displacement detection device 202E includes a detection head and a scale element , the detection head is fixed with the substrate displacement detection device connection block 202F, the substrate displacement detection device connection block 202F is installed on the bottom of the substrate 202C, and the scale element of the substrate displacement detection device 202E is attached to the inclined surface platform 202A, so it can detect Displacement and velocity of substrate 202C in motion.

As shown in FIG. 7 , the film stretching alignment mechanism 3 includes the film stretching alignment mechanism and also includes a film stretching transverse alignment assembly 301 and a film stretching longitudinal alignment assembly 302; the film stretching transverse alignment The alignment assembly is fixed on the bottom of the frame beam 103; the film stretching longitudinal alignment assembly 302 is fixed on the film stretching transverse alignment assembly 301, and the fixed end of the film stretching mechanism 303 is fixed on the film stretching On the longitudinal alignment assembly 302, the movable end of the film stretching mechanism can move horizontally along the longitudinal direction of the frame beam on the film stretching longitudinal alignment assembly.

Film stretching transverse alignment assembly 301 , film stretching longitudinal alignment assembly 302 , film stretching mechanism 303 , film 304 , wafer 305 , and comb mechanism 306 . The film stretching transverse alignment assembly 301 is fixed with the frame beam 103; the film stretching transverse alignment assembly 301 is fixed at the bottom of the frame beam 103, and the film stretching longitudinal alignment assembly 302 is installed on the film stretching stretched on the transverse alignment assembly 301, and can move horizontally along the length direction of the frame beam 103 on the film stretching transverse alignment assembly; the film stretching mechanism 303 is used to compress the film placed thereon 304, and stretch the film 304 laterally to the outside, the film stretching mechanism 303 is fixed on the film stretching longitudinal alignment assembly, and can be along the length of the frame longitudinal beam on the film stretching longitudinal alignment assembly The direction moves horizontally; the wafer 305 is placed on the film 304 ; the comb mechanism 306 is installed on the film stretching mechanism 303 for changing the distance between chips on the wafer 305 .

As shown in FIG. 8 , the film stretching transverse alignment component 301 of the film stretching alignment mechanism 3 includes a transverse linear guide module 301A, a film stretching transverse alignment frame 301B, and a film stretching transverse alignment frame driving die Group 301C, film stretching transverse alignment frame displacement detection device 301D, film stretching transverse alignment frame displacement detection device connecting block 301E. Wherein, the film stretching transverse alignment frame 301B is connected with the slider of the transverse linear guide module 301A, and the linear guide in the transverse linear guide module 301A is fixed at the bottom of the frame beam 103 in the frame 1; the described The stator of the film stretching transverse alignment frame driving module 301C is installed at the bottom of the frame beam 103 in the frame 1, and its mover is fixed with the connection block 301E of the film stretching transverse alignment frame displacement detection device, while the film stretching The connecting block 301E of the lateral alignment frame displacement detection device is connected with the film stretching lateral alignment frame 301B, so driven by the film stretching lateral alignment frame driving module 301C, the film stretching lateral alignment frame 301B can be moved in a straight horizontal direction. The guide rail of the guide rail module 301A moves in the length direction; the film stretching transverse alignment frame displacement detection device 301D includes a detection head and a scale element, and the detection head is fixed on the film stretching transverse alignment frame displacement detection device connecting block 301E If the scale element is attached to the bottom of the frame beam 103 in the frame 1, the displacement and speed of the film stretching transverse alignment frame 301B are detected by the film stretching transverse alignment frame displacement detection device 301D. The film stretching transverse alignment assembly 301 is used for transverse alignment of the chip after the film 304 is stretched.

As shown in FIG. 9 , the film stretching longitudinal alignment component 302 of the film stretching alignment mechanism 3 includes: a longitudinal linear guide module 302A, a film stretching longitudinal alignment frame 302B, a film stretching longitudinal alignment frame drive The module 302C, the film stretching longitudinal alignment frame displacement detection device 302D, and the film stretching longitudinal alignment frame displacement detection device connecting block 302E. The film stretching longitudinal alignment frame 302B is fixed to the linear guide of the longitudinal linear guide module 302A, and the slider in the longitudinal linear guide module 302A is fixed to the film stretching lateral alignment frame 301B; the stator of the film stretching longitudinal alignment frame drive module 302C is installed on the film stretching transverse alignment frame 301B, and its mover connects the film through the film stretching longitudinal alignment frame displacement detection device connecting block 302E stretched on the longitudinal alignment frame 302B, so the film stretching longitudinal alignment frame 302B can move along the length of the guide rail of the longitudinal linear guide module 302A under the driving of the film stretching longitudinal alignment frame driving module 302C; the The film stretching longitudinal alignment frame displacement detection device 302D includes a detection head and a scale element, the detection head is fixed on the connection block 302E of the film stretching longitudinal alignment frame displacement detection device, and the scale element is attached to the film stretching transverse alignment On the frame 301B, the displacement and speed of the film stretching longitudinal alignment frame 302B can be detected. The film stretching longitudinal alignment assembly 302 is used for longitudinal alignment of the chip after the film 304 is stretched.

As shown in FIG. 10 , the film stretching mechanism 303 of the film stretching and positioning mechanism 3 includes: a fixed end 303A of the film stretching mechanism, and a movable end 303B of the film stretching mechanism, and the movable end 303A of the film stretching mechanism can be The film stretching longitudinal alignment assembly 302 moves horizontally along the length direction of the frame beam 103 .

As shown in FIG. 11 and FIG. 12 , the film stretching mechanism fixed end 303A in the film stretching mechanism 303 includes: the film stretching mechanism fixed end pressing film fixed block 303A1, the film stretching mechanism fixed end pressing film moving block 303A2 , Film stretching mechanism fixed end pressing film moving block linear guide module 303A3, film stretching mechanism fixed end pressing film moving block driving device 303A4, film stretching mechanism fixed end pressing film fixed block fixed bearing boss 303A5. The film stretching mechanism fixed end pressing film block 303A1 is fixed on the film stretching longitudinal alignment frame 302B in the film stretching longitudinal alignment assembly 302; the film stretching mechanism fixed end pressing film moving block The guide rail of the linear guide module 303A3 is fixed on the fixed end pressure film block 303A1 of the film stretching mechanism, and its slider is fixed with the film stretching mechanism fixed end pressure film moving block 303A2; the film stretching mechanism fixed end pressure film The moving block driving device 303A4 can drive the film stretching mechanism fixed end pressing film moving block 303A2 to move along the length direction of the guide rail in the linear guide module 303A3; the film stretching mechanism fixed end pressing film moving block 303A2 is then fixed with the film stretching mechanism The end pressing film fixing block 303A1 cooperates to realize the pressing and loosening of the film 304; the fixed end pressing film fixing block of the film stretching mechanism and the fixed end pressing film fixing block 303A1 of the film stretching mechanism are integrated into one. Type processing, located on the outside of the "L"-shaped fixed end lamination block.

As shown in FIG. 12 and FIG. 13 , the movable end 303B of the film stretching mechanism in the film stretching mechanism 303 includes: a linear guide module 303B1 at the movable end of the film stretching mechanism, and a film pressing block 303B2 at the movable end of the film stretching mechanism , Film stretching mechanism movable end pressing film moving block 303B3, film stretching mechanism movable end pressing film moving block linear guide module 303B4, film stretching mechanism movable end pressing film moving block driving device 303B5, film stretching mechanism movable end displacement Detection device connecting block 303B6, film stretching mechanism movable end drive module 303B7, film stretching mechanism movable end pressing film fixed block fixed bearing boss 303B8, film stretching mechanism movable end displacement detection device 303B9. The film-stretching mechanism movable end pressing film fixing block 303B2 is connected with the slider in the movable-end linear guide module 303B1 of the film stretching mechanism, and the linear guide in the movable-end linear guide module 303B1 of the film stretching mechanism is fixed On the film stretching longitudinal alignment frame 302B in the film stretching longitudinal alignment assembly 302; the stator of the movable end driving module 303B7 of the film stretching mechanism is fixed on the film stretching of the film stretching longitudinal alignment assembly 302 On the vertical alignment frame 302B, its mover is connected to the movable end pressing block 303B2 of the film stretching mechanism through the connecting block 303B6 of the movable end displacement detection device of the film stretching mechanism, which can drive the entire movable end 303B of the film stretching mechanism. It moves along the length direction of the guide rail of the movable end linear guide module 303B1 of the film stretching mechanism; the movable end displacement detection device 303B9 of the film stretching mechanism includes a detection head and a scale element, and the detection head is installed at the movable end of the film stretching mechanism. On the device connecting block 303B6, the scale element is attached to the film stretching longitudinal alignment frame 302B of the film stretching longitudinal alignment assembly 302, so it can be used to detect the movable end of the film stretching mechanism. The displacement and speed of the linear guide rail module 303B1 at the movable end of the mechanism in the longitudinal direction of the guide rail; the movable end lamination moving block 303B3 of the film stretching mechanism is installed on the linear guide mold On the slider of the group 303B4, the guide rail of the linear guide module 303B4 of the movable end of the film stretching mechanism is fixed on the movable end of the film stretching mechanism and the film fixed block 303B2; the movable end of the film stretching mechanism The film pressing moving block driving device 303B5 can drive the film stretching mechanism movable end film pressing block 303B3 to move in the length direction of the guide rail of the film stretching mechanism movable end pressing film moving block linear guide module 303B4; the film stretching mechanism movable end film pressing The moving block 303B3 cooperates with the movable end pressing and fixing block 303B2 of the film stretching mechanism to realize the pressing and loosening of the film 304; the movable end pressing and fixing block of the film stretching mechanism fixes the bearing boss 303B8 and the film stretching mechanism The movable end lamination block 303B2 is integrally processed and is located on the outside of the "L" type movable end lamination block. Therefore, the film stretching mechanism 303 can press the film 304 through the fixed end 303A of the film stretching mechanism and the movable end 303B of the film stretching mechanism. The movable end driving module 303B7 moves in the longitudinal direction of the guide rail in the movable end linear guide module 303B1 of the film stretching mechanism under the driving of the movable end driving module 303B7, so as to realize the transverse stretching of the film 304.

The film stretching mechanism 303 is mainly used to fix and stretch the film 304 attached to the wafer 305, so that the chips are arranged in a horizontal array, and the chip particle spacing is in a multiple relationship with the corresponding position of the pad 203 on the substrate 202C, so that It is used to realize mass transfer in batches and improve efficiency.

14 to 16 , the comb mechanism 306 in the film stretching mechanism 303 is shown including the comb mechanism including a driving assembly 306D, a conveying assembly and an alignment mold 306E, the conveying assembly including two conveying units , each of the transmission units includes a timing belt, and each of the timing belts is wound around at least two timing wheels 306B, wherein the alignment mold 306E is detachably installed on the inner surface of the timing belt 306A, so The driving assembly 306D is used to drive the synchronizing wheel 306B at one end of the conveying unit to rotate, and the synchronizing wheel 306B at the other end of the conveying unit is respectively connected to the fixed end of the film stretching mechanism and the film stretching mechanism. Organization activities are connected. The synchronous belts 306B of the two transfer units move under the driving of the driving component 306D, thereby driving the alignment mold 306E thereon to move in the length direction of the synchronous belt 306A, so as to align a row of chips, which can realize the batch transfer of chip arrays. While ensuring the transfer yield, the efficiency of mass transfer is improved.

Specifically, the transfer unit includes a timing belt 306A, a timing pulley 306B, and a bearing 306C. The comb-tooth mechanism drive assembly 306D includes a spline shaft 306D1, a coupling 306D2, and a comb-tooth mechanism drive motor 306D3, as shown in FIG. 14 . The synchronizing wheel 306B includes a total of four, two of which are connected to the spline shaft 306D1 of the comb-tooth mechanism drive assembly 306D, and the other two are respectively connected to the fixed end of the film stretching mechanism through the bearing 306C. 303A5 is connected to the fixed bearing boss 303B8 of the movable end of the film stretching mechanism; the alignment die 306E is installed on the inner surface of the two synchronous belts 306A, and it can be disassembled and has two kinds of sparse ruler and dense ruler; The synchronous belt 306A includes two synchronous belts, one of which is close to the drive motor 306D3 of the comb gear mechanism, the two synchronous belts 306A are installed on the four synchronous wheels 306B, and the one synchronous belt 306A is equipped with two synchronous wheels 306B; it is connected to the spline shaft 306D1. The two synchronizing wheels 306B are connected with the film stretching mechanism fixed end pressing block 303A1 and the film stretching mechanism movable end pressing block 303B2 through the bearing 306C, respectively, so they are connected with the spline shaft 306D1. The distance between the two synchronization wheels 306B can be adjusted with the movement of the movable end 303B of the film stretching mechanism; after the distance is adjusted, the alignment mold 306E is assembled; the spline shaft 306D1 is connected to The shaft 306D2 is connected with the driving motor 306D3 of the comb mechanism, thereby realizing the movement of the two synchronous belt structures under the driving of the motor, thereby driving the alignment mold 306E thereon to move in the length direction of the synchronous belt 306A, thereby making the wafer 305 move on the one row of chip alignment.

In particular, the alignment mold 306E includes a comb-tooth-shaped plate structure 306E1, a comb-tooth slit 306E12 is formed between two adjacent comb-tooth 306E11, and the formation position of the comb-tooth slit 306E12 is the same as that of the chip 306E2. Corresponding to the set position, the width of the root of the comb-tooth slot 306E12 matches the size and quantity of the chips 306E2 to be placed. The formation position of the comb-tooth slit 306E12 corresponds to the set position of the chip 306E2 on the substrate pad, and the root width of the comb-tooth slit 306E12 is equal to the width of one chip 306E2 and/or the width of multiple chips and the width of multiple chips. The sum of the distances between. Specifically, the tooth profile of the alignment die 306E can be designed in the following two ways.

1) Intensive teeth, as shown in Figure 17 and Figure 18: that is, each chip 306E2 occupies a comb tooth position, which can realize one-time alignment of a whole row of chips 306E2, and then selectively stab the crystals. The chip pitches on wafer 305 are matched.

2) The sparse teeth, as shown in Figure 19 and Figure 20: the position of the chip 306E2 sandwiched between the two comb teeth 306E12 is fixed, and the chip clamped by the comb teeth 306E11 is the chip to be transferred. The serrations 306E12 match the chip position pitch on the pads 203 on the substrate. The design of sparse teeth reduces the difficulty of alignment of the comb teeth, and also reduces the difficulty of manufacturing the comb teeth.

In particular, the alignment mold 306E can be fabricated by etching, or a comb-tooth structure as shown in FIG. 21 , which is relatively large in size and can be fabricated by machining.

In particular, the film stretching mechanism 303 can have two working modes:

1) Film stretching scheme: the distance between the stretched film 304 and the chip and the corresponding distance between the chip positions of the pads 203 on the substrate 202C have a multiple relationship in the stretching direction. However, due to the uneven deformation of the film during stretching, the batch alignment cannot be guaranteed, so the chips to be transferred are fixed by the sparse teeth.

2) The film is not stretched scheme: the wafer 305 on the film 304 is directly fixed on the film stretching mechanism 303 after being diced, without being stretched by the stretching mechanism or only properly stretched to increase the number of chips Since there is no need to stretch the distance between the two, it can be applied to the transfer of multi-size wafers, and the above-mentioned dense teeth can be used to fix the chip, so that the ejector pin 402-1D3 can pierce the crystal.

In particular, the alignment die 306E is detachable on the timing belt 306A. When the distance between the fixed end 303A of the film stretching mechanism and the movable end of the film stretching mechanism is fixed, an alignment mold 306E is installed to accommodate wafers of different sizes.

The debonding manipulation assembly 4 includes a lateral movement assembly and a debonding manipulation mechanism 402. The lateral movement assembly is fixed on the frame beam 103 and can move on the frame beam 103. The lateral movement assembly includes lateral movement. Right-angle block 401 , debonding manipulation mechanism 402 , laterally moving right-angle block drive module 403 , laterally moving linear guide rail module 404 , laterally moving right-angle block displacement detection device 405 , laterally moving right-angle block drive module connecting block 406 .

Referring to FIG. 22 , the laterally moving right-angle block drive module 403 and the laterally moving linear guide module 404 are installed on one side of the frame beam 103 , wherein the two modules of the laterally moving linear guide module 404 are respectively fixed on the frame beam 103 The upper and inner sides of one side form a right angle. The laterally moving right-angle block 401 is installed on the laterally moving linear guide rail module 404, and is connected with the mover of the laterally moving right-angle block driving module 403 through the laterally moving right-angle block driving module connecting block 406, thereby moving laterally. The right-angle block 401 can move along the length direction of the linear guide rail module under the driving of the driving module, that is, realize the lateral movement on the frame beam 103 . The debonding manipulation mechanism 402 is installed on the laterally moving right-angle block 401 ; the laterally-moving right-angle block displacement detection device 405 is used to detect the displacement and speed of the laterally moving right-angle block 401 , ie, the components on it.

Wherein, the debonding manipulation mechanism 402 may have two forms, namely, a thimble debonding manipulation mechanism 402-1 and a laser debonding manipulation mechanism 402-2. It should be noted that the overall diagram of the device shown in FIG. 1 is in the form of an ejector pin debonding operating mechanism.

Next, the structure and working form of the two debonding operating mechanisms will be described.

22-27, the form of the ejector pin debonding operation mechanism 402-1 will be described first. The ejector pin debonding manipulation mechanism 402-1 includes: a rigid-flexible coupling motion table mechanism 402-1A, an ejector pin debonding vertical movement drive assembly 402-1B, an ejector pin mechanism 402-1C and a precision camera device 402-1D. The vertical movement component 402-1B of the ejector mechanism is fixed on the lateral movement component and can move up and down, the ejector mechanism is installed on the vertical movement component of the ejector mechanism, and the precision camera is used to detect the film Whether the distance between the chip on the stretching mechanism 303 and the corresponding position of the pad chip on the substrate in the stretching direction is deviated.

The rigid-flexible coupling motion table mechanism 402-1A includes: a rigid-flexible coupling motion table rigid frame 402-1A1, a rigid-flexible coupling motion table core motion platform 402-1A2, and a rigid-flexible coupling motion table flexible hinge 402-1A3; and The rigid-flexible coupling motion table core motion platform 402-1A2 further includes a rigid-flexible coupling motion table core motion platform driving device 402-1A21, a rigid-flexible coupling motion table core motion platform driving device connecting block 402-1A22, a rigid-flexible coupling motion The table core motion platform displacement detection device 402-1A23 and the rigid-flexible coupling motion table core motion platform displacement detection device fixing block 402-1A24; the ejector pin debonding vertical movement drive assembly 402-1B includes the ejector pin debonding vertical movement drive assembly connection Block 402-1B1, ejector pin debonding and vertically moving linear guide module 402-1B2; the ejector pin mechanism 402-1C includes ejector pin mounting block 402-1D1, ejector pin mounting block pushing device 402-1D2 and ejector pin 402-1D3.

Wherein, the ejector pin debonding operating mechanism 402-1 is connected to the laterally moving right-angle block 401 through ejector pin debonding vertical movement drive assembly connecting block 402-1B1; in addition, the ejector pin debonding vertical movement linear guide module 402- The slider of 1B2 is fixed on the side of the laterally moving right-angle block 401, and its linear guide is fixed on the rigid-flexible coupling motion table mechanism 402-1A, which is driven by the ejector pin debonding vertical movement drive assembly 402-1B; wherein the ejector pin debonding vertically moves The stator of the drive assembly 402-1B is fixed on the rigid-flexible coupling motion table mechanism 402-1A, and the mover is connected with the thimble unbonded vertically moving drive assembly connecting block 402-1B1. Then, the rigid-flexible coupling motion table mechanism 402-1A can move along the length direction of the linear guide rail module 402-1B2 for debonding and vertical movement of the thimble, that is, to realize vertical movement in the Z direction.

The rigid-flexible coupling motion table core motion platform 402-1A2 of the rigid-flexible coupling motion table mechanism 402-1A is driven by the rigid-flexible coupling motion table core motion platform driving device 402-1A21, and drives the rigid-flexible coupling under the action of a driving force The flexible hinge 402-1A3 of the motion table is elastically deformed, and a small displacement is generated by the elastic deformation of the flexible hinge 402-1A3 of the rigid-flexible coupling motion table, so as to realize precise micro-motion in the vertical direction. This enables the device to be used in sub-micron or even nano-scale mass transfer technologies such as Mini/Micro LED.

The ejector mechanism 402-1C of the debonding manipulation assembly 4 is installed at the lower end of the core motion platform 402-1A2 of the rigid-flexible coupling motion table through the ejector mounting block pushing device 402-1D2, and is not in contact with the rigid frame 402-1A1 of the rigid-flexible coupling motion table ; The thimble installation block 402-1D1 is fixed at the end of the thimble installation block pushing device 402-1D2, and the thimble 402-1D3 is arrayed at the bottom of the thimble installation block 402-1D1. Then for the displacement of the ejector pin 402-1D3: the ejector pin debonding vertical movement drive assembly 402-1B drives the rigid-flexible coupling motion table mechanism 402-1A to achieve a large stroke, so that the ejector pin 402-1D3 initially reaches the predetermined position, while the rigid-flexible coupling motion table core The motion platform driving device 402-1A21 is used to drive the rigid-flexible coupling motion table core motion platform 402-1A2, and then the ejector pin 402-1D3 realizes precise micro-displacement under the pushing of the ejector pin mounting block pushing device 402-1D2, and completes the vertical direction. Precise positioning.

The precise camera device 402-1D is installed on the outside of the rigid-flexible coupling motion table rigid frame 402-1A1 of the rigid-flexible coupling motion table mechanism 402-1A, and is used to observe the motion positioning of the entire debonding manipulation assembly 4.

Preferably, the rigid-flexible coupling motion table flexible hinges 402-1A3 between the rigid-flexible coupling motion table core motion platform 402-1A2 and the rigid-flexible coupling motion table rigid frame 402-1A1 are symmetrically arranged and manufactured in one piece .

In particular, in addition to the crystal thorn device in the form of a mechanical thimble, the form of laser chip peeling can also be used without contact transfer. Referring to FIG. 28 , the form of the laser debonding manipulation mechanism 402 - 2 will be described next.

The laser debonding manipulation mechanism 402-2 includes a laser 402-2A and a camera 402-2B. The laser 402-2A is installed on the laterally moving right-angle block 401, and the camera 402-2B is connected to the output end of the laser 402-2A. The laser 402-2A emits laser light, and the camera 402-2B projects the laser beam onto the wafer, so as to realize chip debonding.

In addition, because the laser is focused by a special optical system to become a very small spot, the energy density is high, and it works non-contact, so the laser debonding method has no mechanical punching force on the workpiece itself, the workpiece is not easily deformed, and It has the advantages of minimal thermal influence and high precision.

The working process of the chip array mass transfer device according to the embodiment of the present invention:

1) Film stretching: The principle is shown in Figure 29. The wafer 305 attached to the film 304 is fixed on the film stretching mechanism 303 after being diced, and the fixed end of the film stretching mechanism is activated to press the film. The block driving device 303A4, the movable end pressing film moving block driving device 303B5 of the film stretching mechanism, the film stretching mechanism fixed end pressing film moving block 303A2, the film stretching mechanism of the film stretching mechanism 303 The movable end film pressing block 303B3 cooperates with the corresponding film stretching mechanism fixed end film pressing block 303A1 and the film stretching mechanism movable end film pressing block 303B2 to press the film 304; the film stretching mechanism movable end driving module 303B7 Continue to apply force to stretch and deform the film 304, and use the precision camera 402-1D to detect the distance between the chips of the wafer 305 until the distance between the chips and the corresponding distance between the chip positions of the pads 203 on the substrate 202C becomes a multiple in the stretching direction relation. However, due to the uneven deformation of the film during stretching, the batch alignment cannot be guaranteed, so the chips to be transferred are fixed by the sparse teeth.

2) Non-stretching scheme of the film: the wafer 305 on the film 304 is fixed on the film stretching mechanism 303 after being diced. The above-mentioned dense teeth are used to fix the chip to be transferred, so that the ejector pin 402-1D3 can pierce the crystal.

Chip alignment: use the precision camera 402-1D to detect the position of the chip after the film 304 is stretched, and move the film stretch lateral alignment component 301 of the film stretch alignment mechanism 3 laterally, so that it is installed along the frame. The transverse linear guide module 301A at the bottom of the frame beam 103 in 1 moves as a whole in the length direction, which is the transverse alignment process of the chip, as shown in Figure 30; The longitudinal alignment assembly 302 is stretched, and the film stretching longitudinal alignment assembly 302 and the film stretching mechanism 303 are moved along the longitudinal direction of the longitudinal linear guide module 302A installed on the film stretching transverse alignment frame 301B, that is, The vertical alignment process of the chip is shown in FIG. 31 ; the pads 203 on the substrate 202C can be driven by the inclined block driving module 201D in the inclined block assembly 201 to change with the height of the inclined plane platform 202A; and , the pads 203 on the substrate 202C can move along the longitudinal direction of the substrate linear guide module 202D when the substrate driving module 202B drives the substrate 202C, which is the longitudinal feeding process of the pads 203 , as shown in FIG. 32 .

The comb teeth fix the chip. After the alignment process, the alignment mold 306E of the comb mechanism 306 is used to fix the transfer chip, so as to avoid further deformation of the film when the ejector pin 402-1D3 pierces the crystal. After part of the chips are transferred, the film is deformed and redistributed, resulting in increased chip dislocation. , affecting the chip transfer yield.

Test again to ensure accurate alignment and mass transfer. The precise camera device 402-1D is used to detect again whether the position of the aligned chip deviates from the position of the chip corresponding to the pad 203 on the substrate 202C. If there is a deviation, adjust the position to the correct position and then perform batch transfer. To make a display panel, transfer the red, green and blue chips in stages.

Referring to FIG. 6, FIG. 6 shows the alignment mechanism used for the mass transfer of the chip array in this embodiment.

The alignment mechanism includes a drive assembly, a transmission assembly and the above-mentioned alignment mold, the transmission assembly includes a synchronous belt and at least two synchronous wheels, the synchronous belt is wound around the at least two synchronous wheels, wherein the comb The toothed plate-like structure is detachably mounted on the inner surface of the synchronous belt, and the driving assembly is used for driving the synchronous wheel to rotate.

The structure of the transmission assembly includes but is not limited to the above-mentioned methods, and other structures capable of converting rotational motion into translational motion can also be used, such as gears and racks that mesh with each other, and worm gears and worms that cooperate with each other.

Wherein, the drive assembly includes a drive motor, a coupling and a spline shaft, one end of the spline shaft is connected to the drive motor through the coupling, and the other end of the spline shaft is keyed to one of the synchronizing wheels center. The drive motor drives the spline shaft to rotate through the coupling, and the spline shaft drives the synchronous wheel to rotate.

Preferably, the transmission assembly includes two groups of transmission assemblies, the other ends of the spline shafts are respectively keyed to the centers of the respective synchronizing wheels of the two groups of the transmission assemblies, and the two ends of the comb-shaped plate-shaped structure can be respectively It is detachably connected to the inner surfaces of the respective synchronous belts of the two sets of transmission assemblies.

According to the above-mentioned embodiments of the present application, the existing batch transfer method of chip arrays is improved. The drive assembly drives the synchronous wheel to rotate, and the rotation of the synchronous wheel drives the movement of the synchronous belt. The comb-shaped plate installed on the inner surface of the synchronous belt The comb-shaped structure moves forward, and the top of the comb teeth of the comb-tooth plate-shaped structure is inserted into the gap between two adjacent chips, and continues to move until the chip is completely inserted into the comb teeth slot, so as to realize the fixation of the chip and complete the alignment of a row of chips. , which can realize batch transfer of chip arrays, and improve the efficiency of mass transfer while ensuring the transfer yield.

It should be noted that the orientation or positional relationship indicated by the terms "up", "down", "front", "rear", "left", "right", "vertical", "inside", "outside", etc. Based on the orientation or positional relationship shown in the drawings, it is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood to limit the present invention.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention in any form. Although the present invention has been disclosed above with preferred embodiments, it is not intended to limit the present invention. Within the scope of the technical solution of the present invention, personnel can make some changes or modifications to equivalent examples of equivalent changes by using the above-mentioned technical content, but any content that does not depart from the technical solution of the present invention is based on the technical solution of the present invention. Substantially any simple modifications, equivalent changes and modifications made to the above embodiments still fall within the scope of the solutions of the present invention.

Claims (10)

1. A chip array mass transfer device, characterized in that it comprises a frame, a pad lifting alignment mechanism, a film stretching alignment mechanism and a debonding manipulation assembly, and the pad lifting alignment mechanism is used for horizontal lateral movement and vertical movement to adjust the position of the pad; the film stretching and alignment mechanism is used for clamping and stretching the film, and adjusting the position of the film in the horizontal direction to align the pad; the debonding manipulation assembly is used for peeling off chip; The film stretching and alignment mechanism includes a film stretching mechanism and a comb mechanism, the film stretching mechanism includes a fixed end of the film stretching mechanism and a movable end of the film stretching mechanism, and the fixed end of the film stretching mechanism and the The movable ends of the film stretching mechanism are respectively used for clamping the two ends of the film, and the movable ends of the film stretching mechanism are close to or away from the fixed ends of the film stretching mechanism and stretch the film; The comb mechanism includes a drive assembly, a transmission assembly and an alignment mold, the transmission assembly includes at least two transmission units, each of the transmission units includes a synchronous belt, and each of the synchronous belts is wound around at least two synchronous belts wheel, wherein the alignment mold is detachably mounted on the inner surface of the synchronous belt, the driving assembly is used to drive the synchronous wheel at one end of the transmission unit to rotate, and the other end of the transmission unit rotates. The synchronizing wheels are respectively connected with the fixed end of the film stretching mechanism and the movable end of the film stretching mechanism. 2 . The chip array mass transfer device according to claim 1 , wherein the drive assembly comprises a spline shaft, a coupling and a drive motor, and one end of the spline shaft is connected to the drive motor through a coupling. 3 . , the other end of the spline shaft is keyed to the center of the corresponding synchronizing wheel of each of the transmission units. 3. The chip array mass transfer device according to claim 2, wherein the other ends of the spline shafts are respectively keyed to the centers of the respective synchronizing wheels of the two groups of the transmission assemblies, and the comb-tooth-shaped Two ends of the plate-like structure are respectively detachably connected to the inner surfaces of the respective synchronous belts of the two groups of the conveying assemblies. 4 . The chip array mass transfer device according to claim 1 , wherein the alignment mold comprises a comb-tooth-shaped plate structure, and a comb-tooth slot is formed between two adjacent comb-tooths, and the comb-toothed The formation position of the slot corresponds to the set position of the chip, and the width of the root of the comb-tooth slot matches the size and quantity of the chips to be placed. 5 . The chip array mass transfer device according to claim 4 , wherein the formation position of the comb-tooth slit corresponds to the set position of the chip on the substrate pad, and the root width of the comb-tooth slit is equal to 5 . The width of one chip and/or the sum of the width of multiple chips and the distance between multiple chips. 6 . The chip array mass transfer device according to claim 1 , wherein the frame comprises a frame base, a frame column, a frame beam and a frame longitudinal beam, and the frame column is fixed to the frame base and supports the frame base. 7 . The frame beams and the frame longitudinal beams; the pad lifting alignment mechanism is installed on the frame base, the film stretching alignment mechanism is installed at the bottom of the two frame beams, and the debonding manipulation assembly is installed on the frame beam. 7. The chip array mass transfer device according to claim 6, wherein the debonding manipulation assembly comprises a lateral movement assembly and a debonding manipulation mechanism, the debonding manipulation mechanism comprises a laser and a camera, the camera is connected to the The output end of the laser is connected, and the camera is used to project the laser beam emitted by the laser onto the wafer; the lateral movement component is fixed on the frame beam and can move on the frame beam, so The laterally moving assembly includes a laterally moving right-angle block, wherein the laser is mounted on the laterally moving right-angle block. 8 . The chip array mass transfer device according to claim 6 , wherein the debonding manipulation assembly comprises a lateral movement assembly and a debonding manipulation mechanism, and the debonding manipulation mechanism comprises an ejector mechanism vertical movement assembly, an ejector mechanism and a precision camera device; the lateral movement component is fixed on the frame beam and can move on the frame beam, and the thimble mechanism vertical movement component is fixed on the lateral movement component and can move up and down, The thimble mechanism is installed on the vertical movement component of the thimble mechanism; the precision camera device is used to detect whether the distance between the chip on the film stretching mechanism and the corresponding position of the pad chip on the substrate in the stretching direction is deviated. 9 . The chip array mass transfer device according to claim 6 , wherein the pad lifting and aligning mechanism comprises an inclined block assembly, a substrate assembly and a welding pad; the substrate assembly is mounted on the inclined block. 10 . On the assembly, the pads are placed on the substrate of the substrate assembly; the inclined block assembly can carry the substrate assembly to move horizontally and laterally along the length direction of the frame, and the substrate assembly can carry the pads up and down Move vertically. 10 . The chip array mass transfer device according to claim 6 , wherein the film stretching alignment mechanism further comprises a film stretching transverse alignment assembly and a film stretching longitudinal alignment assembly; the film stretching The stretching transverse alignment assembly is fixed on the bottom of the frame beam; the film stretching longitudinal alignment assembly is fixed on the film stretching transverse alignment assembly, and can follow the frame beam on the film stretching transverse alignment assembly The film stretching mechanism is fixed on the film stretching longitudinal alignment assembly, and can move horizontally along the longitudinal direction of the frame longitudinal beam on the film stretching longitudinal alignment assembly; the The fixed end of the film stretching mechanism is fixed on the film stretching longitudinal alignment assembly, and the movable end of the film stretching mechanism can move horizontally along the length direction of the frame beam on the film stretching longitudinal alignment assembly.

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