CN111903185B - Display device and manufacturing method thereof - Google Patents

Abstract

A display device (1) is provided with: a TFT substrate (10) provided with a planarization layer (13) on the surface; a sealing film (50) including a resin film (52) as an inkjet resin film; a frame-shaped second A bank (41), which surrounds the planarization layer (13), and the inner side is covered with a resin film (52), and the planarization layer (13) has concavo-convex portions (133) around its edge, and the planarization layer (13) The concave-convex part (133) is provided with concave-convex with different sizes on the first side (131) and the second side (132).

Description

Display device and manufacturing method thereof

technical field

The present invention relates to a display device and a manufacturing method thereof.

Background technique

When the light-emitting element reacts with a small amount of water or oxygen, its characteristics deteriorate, causing problems of reduced reliability, shortened lifetime, and the like of a finally obtained display device. Therefore, the light emitting element is sealed by the sealing film including the resin film. However, since the resin used for the above-mentioned resin film is ejected from the inkjet coating device in the form of liquid ink droplets, it is easily wetted and spread.

Then, for example, in Patent Document 1, it is proposed to form a plurality of frame-shaped banks surrounding a planarization layer provided with light emitting elements to limit the wetting and spreading of resin sealing the light emitting elements.

prior art literature

patent documents

Japanese Laid-Open Patent Publication "JP-A-2011-146323 (Published on July 28, 2011)"

Contents of the invention

The problem to be solved by the invention

When the ink droplets ejected on the planarization layer flow down from the planarization layer, they tend to wet and spread, but on the other hand, due to surface tension, the flow tends to stop at the end of the upper surface of the planarization layer. As a result, ink droplets may not spread at the end of the upper surface of the planarizing layer, and defective portions may occur. When such a defect occurs, there is a region where the foreign matter is covered with the above-mentioned resin film and cannot be flattened. Therefore, moisture or the like may permeate into the above-mentioned resin film from the above-mentioned region, the light-emitting element may be deteriorated, and the reliability of the obtained display device may be lowered.

The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a display device capable of preventing a decrease in reliability due to a defect in a resin film, and a method of manufacturing the same.

solutions to problems

In order to solve the above problems, a display device according to one aspect of the present invention includes: a circuit substrate provided with a planarization layer on the surface; a plurality of light emitting elements provided on the planarization layer; and a sealing film including a first An inorganic film, a resin film on the upper layer of the first inorganic film, a second inorganic film on the upper layer of the resin film, and seal the light-emitting element; a frame-shaped first bank surrounding the flattened layer, and the inner side is covered with the resin film, the planarization layer has a first side and a second side perpendicular to the first side, and has concavo-convex portions on the entire periphery of the edge portion of the planarization layer , the concavo-convex portion is provided with concavities and convexities of different sizes on the first side and the second side in plan view.

In order to solve the above problems, in the method of manufacturing a display device according to one aspect of the present invention, the display device includes: a circuit substrate provided with a planarization layer on the surface; a plurality of light emitting elements provided on the planarization layer; layer; a sealing film comprising a first inorganic film, a resin film on an upper layer of the first inorganic film, a second inorganic film on an upper layer of the resin film, and seals the light emitting element; a first bank, It surrounds the planarization layer, and the inner side is covered by the resin film, the planarization layer has a first side and a second side orthogonal to the first side, and the manufacturing method includes: forming the a step of forming a planarization layer; a step of forming the first bank surrounding the planarization layer; a step of forming the resin film covering the inner side of the first bank, in the step of forming the planarization layer, Concave-convex portions are formed on the entire periphery of the edge portion of the flattening layer, and the sizes of the concavo-convex portions are different between the first side and the second side in a planar view. In the process of forming the resin film, ink Droplets are dropped from the inkjet coating device on a region corresponding to the concavo-convex portion in the region surrounded by the first bank.

Invention effect

According to an aspect of the present invention, there is provided a display device capable of preventing a decrease in reliability due to a defect of a resin film and a method of manufacturing the same.

Description of drawings

FIG. 1 is an enlarged plan view illustrating a schematic configuration of a main part of a display device according to a first embodiment together with an arrangement of ink droplets when a resin film is formed.

2 is a plan view schematically showing a schematic configuration of a main part of the display device according to the first embodiment.

3 is a cross-sectional view illustrating a schematic configuration of a main part of the display device according to the first embodiment.

FIG. 4 is a flowchart illustrating an example of a method of manufacturing the display device according to the first embodiment.

(a) to (e) of FIG. 5 are main part cross-sectional views illustrating a part of the manufacturing process of the display device according to the first embodiment in order of process.

6 is a flowchart showing an example of a TFT layer/second bank lower layer bank forming process according to the first embodiment.

7 is a flow chart showing an example of the light emitting element layer/upper bank/third bank formation process related to the first embodiment.

FIG. 8 is a flowchart illustrating an example of a sealing layer forming step according to the first embodiment.

(a) of FIG. 9 is a perspective view showing the appearance of the inkjet coating device according to the first embodiment, and (b) shows the configuration of the main part of the bottom surface of the inkjet head of the inkjet coating device. Bottom view.

FIG. 10 is a plan view showing ink droplet spreading in a case where no concavo-convex portion is provided on the edge portion of the planarizing layer.

11 is an enlarged plan view illustrating a schematic configuration of a main part of a display device according to a modified example of the first embodiment together with an arrangement of ink droplets when forming a resin film.

12 is an enlarged plan view illustrating a schematic configuration of a main part of a display device according to a second embodiment together with an arrangement of ink droplets when forming a resin film.

13 is an enlarged plan view illustrating a schematic configuration of a main part of a display device according to a modified example of the second embodiment together with an arrangement of ink droplets when forming a resin film.

14 is an enlarged plan view illustrating a schematic configuration of a main part of a display device according to a third embodiment together with an arrangement of ink droplets when forming a resin film.

Detailed ways

[First Embodiment]

An embodiment of the present invention will be described below based on FIGS. 1 to 11 .

＜Structure of display device＞

FIG. 2 is a plan view schematically showing a schematic configuration of a main part of the display device 1 according to the present embodiment. 3 is a cross-sectional view illustrating a schematic configuration of a main part of a display device according to the present embodiment. And, FIG. 3 corresponds to a sectional view taken along line A-A of the display device 1 shown in FIG. 2 .

As shown in FIGS. 2 and 3 , the display device 1 according to this embodiment includes: a TFT (Thin Film Transistor: thin film transistor) substrate 10 (circuit substrate), and a light emitting element layer 30 including a light emitting element 34 provided on the TFT substrate 10 . , a frame-shaped first bank 41, a frame-shaped second bank 42, a plurality of third banks 43, a sealing film 50, a cover (not shown) such as a functional film, and an electronic circuit board (not shown). The second bank 42 includes a lower bank 42a and an upper bank 42b.

The TFT substrate 10 includes an insulating support 11 and a TFT layer 14 (circuit layer) provided on the support 11 . As shown in FIG. 3 , for example, the support body 11 is a flexible laminate film in which a lower surface film 11 a , a resin layer 11 b , and a barrier layer 11 c are sequentially provided. In addition, in the support body 11, in addition to the above description, a glass substrate may be used instead of the resin layer.

As a material of the lower surface film 11a, polyethylene terephthalate etc. are mentioned. Polyimide etc. are mentioned as a material of the resin layer 11b. The barrier layer 11c is a layer for preventing water, oxygen, etc. from permeating the TFT layer 14 and the light-emitting element layer 30, for example, a silicon oxide film, a silicon nitride film, a silicon nitride oxide film formed by CVD (Chemical Vapor Deposition) method, etc. or a laminated film of these.

The TFT layer 14 includes a TFT 25 (driver element) for driving the light emitting element 34 , a circuit portion 12 in which a plurality of wirings are formed, and a planarization layer 13 covering the circuit portion 12 . The TFT layer 14 has, for example, a structure in which a semiconductor layer 21, an inorganic insulating layer 22, a first wiring layer, an inorganic insulating layer 23, a second wiring layer, an inorganic insulating layer 24, a third wiring layer, and a planarization layer 13 are sequentially stacked. constitute.

The first wiring layer includes, for example, a plurality of gate electrodes G, a plurality of gate wirings connected to the plurality of gate electrodes G, and the like. The second wiring layer includes, for example, a plurality of capacitive electrodes C and a plurality of capacitive wirings connected to the plurality of capacitive electrodes C. The third wiring layer includes, for example, a plurality of source electrodes S, a plurality of source wirings connected to the plurality of source electrodes S, a plurality of drain electrodes D, and a plurality of wires connected to the second electrode 33 of the light emitting element 34 . The second electrode is connected to wiring and the like. The inorganic insulating layers 22 / 23 / 24 are formed to cover the entire surface of the support body 11 , for example. A region surrounded by gate wiring and source wiring in a grid pattern is a pixel 2 . A TFT 25 is provided in each pixel 2 . The TFT 25 includes a semiconductor layer 21 , a gate electrode G, an inorganic insulating layer 22 , a source electrode S, and a drain electrode D. As shown in FIG.

The planarizing layer 13 planarizes steps on the TFT 25 and the third wiring layer. As shown in FIGS. 2 and 3 , the planarization layer 13 is provided in an island shape on the surface of the TFT layer 14 from the active area DA to the non-active area NA. The active area DA is an area in which the light emitting elements 34 are provided, and is a pixel area (display area) in which a plurality of pixels 2 are provided. The non-active area NA is a peripheral area (frame area) surrounding the active area DA.

As shown in FIG. 3 , a contact hole 13 b for electrically connecting the first electrode 31 and the TFT 25 is formed in the planarization layer 13 of the active area DA. In the planarization layer 13 of the non-active area NA, a slit 13 a is formed in a frame shape in plan view so as to surround the active area, and the slit is used to cut off the permeation path of water to the active area DA.

As shown in FIG. 2, the planarization layer 13 has a square shape, which has two first sides 131 parallel to each other in the vertical direction of FIG. Two second sides 132 parallel to each other in the left and right direction. In the edge portion of the planarizing layer 13, the concave-convex portion 133 faces the first bank 41 and is provided on the entire circumference of the edge portion. The size (spacing and depth) varies. The concave-convex portion 133 includes a concave-convex portion 131A provided on the first side 131 and composed of a concave portion 131 a and a convex portion 131 b, and a concave-convex portion 132A provided on the second side 132 and composed of a concave portion 132 a and a convex portion 132 b.

The concave portions 131 a and 132 a are recessed in the in-plane direction toward the inner side of the planarizing layer 13 (the side opposite to the first bank 41 ) in a planar view. The protrusions 131b and 132b protrude in the in-plane direction toward the outside of the planarizing layer 13 (on the side of the first bank 41 ) in a planar view. The concavo-convex portions 131A and 132A respectively have, for example, a zigzag shape.

At the end of the TFT layer 14 is provided a terminal portion TM connected to an electronic circuit substrate (not shown) such as an IC chip, and having a plurality of terminals for external connection.

The semiconductor layer 21 is made of, for example, low-temperature polysilicon or an oxide semiconductor. The inorganic insulating layer 22 can be formed of, for example, a silicon oxide film or a silicon nitride film formed by a CVD method, or a laminated film of these. The first wiring layer, the second wiring layer, the third wiring layer, and the terminal portion TM are composed of, for example, a known metal single-layer film or laminated film. The planarization layer 13 can be made of, for example, a photosensitive resin such as polyimide resin or acrylic resin.

As shown in FIG. 3 , the light emitting element layer 30 includes a plurality of light emitting elements 34 and edge covers 35 provided corresponding to the pixels 2 . One pixel, which is the smallest unit of display, is composed of, for example, R (red), G (green), and B (blue) pixels 2 .

The light-emitting element 34 includes a first electrode 31 disposed on the planarization layer 13, a second electrode 33 disposed on the upper layer of the first electrode 31, and a light-emitting layer disposed between the first electrode 31 and the second electrode 33. The functional layer 32.

The first electrodes 31 are electrically connected to the TFTs 25, respectively. Accordingly, each TFT 25 drives each light emitting element 34 . The first electrode 31 is an island-shaped anode (patterned anode) for each pixel 2 , and the second electrode 33 is a full-surface cathode (common cathode) common to all the pixels 2 . However, it can also be said that the first electrode 31 is a cathode and the second electrode 33 is an anode. Known electrode materials are used for the first electrode 31 and the second electrode 33 .

The functional layer 32 between the first electrode 31 and the second electrode 33 is, for example, an EL layer. When the display device 1 is an organic EL display device, an organic layer is used as the functional layer 32 . The functional layer 32 is constituted, for example, by laminating a hole transport layer, a light emitting layer, and an electron transport layer in this order from the lower layer side. In addition, it is sufficient that the functional layer 32 includes at least a light emitting layer. In addition, the functional layer 32 may include layers other than the above-mentioned layers. The functional layer 32 may be formed in an island shape for each pixel 2 , or may be formed as a common layer shared by a plurality of pixels 2 in a full-surface manner.

The edge cover 35 is a grid-shaped bank (protrusion) in plan view, covers the edge of the first electrode 31 , and has an opening 35 a exposing a part of the first electrode 31 . The edge cover 35 is disposed between adjacent pixels 2 on the planarization layer 13 in the active area DA, and the opening 35 a becomes a light emitting area of each pixel 2 . The edge cover 35 prevents electric field concentration, short circuit between the first electrode 31 and the second electrode 33, and also functions as a pixel separation layer. For the edge cover 35 , for example, the photosensitive resins exemplified above can be used.

The sealing film 50 seals the light emitting element layer 30 and prevents penetration of water, oxygen, and the like into the inside of the light emitting element layer 30 . The sealing film 50 includes a first inorganic film 51 on top of the second electrode 33 , a resin film 52 on top of the first inorganic film 51 , and a second inorganic film 53 on top of the resin film 52 .

The first inorganic film 51 and the second inorganic film 53 function as barrier layers to prevent deterioration of the light emitting element 34 caused by moisture and oxygen. The first inorganic film 51 and the second inorganic film 53 can be formed of, for example, a silicon oxide film, a silicon nitride film, a silicon oxynitride film, or a laminated film formed by CVD.

The resin film 52 performs stress relaxation of the first inorganic film 51 and the second inorganic film 53 , planarization by filling of steps and foreign matter on the surface of the light emitting element layer 30 , filling of pin holes, and the like. The resin film 52 is an ink film (inkjet resin film) formed by forming a film of the ink 152 (refer to FIG. 5 (d)) containing resin, and is thicker than the first inorganic film 51 and the second inorganic film 53, And has a light-transmitting organic insulating film. The resin film 52 is formed by applying the ink 152 on the first inorganic film 51 in a region surrounded by the first banks 41 by an inkjet method, and curing by UV curing or the like. As said resin, the photosensitive resin in the above-mentioned example is mentioned.

An unillustrated cover such as a functional film may be provided on the sealing layer 50 via an unillustrated adhesive layer. The cover body is a functional layer having at least one of a protection function, an optical compensation function, and a touch sensor function.

The first bank 41 and the second bank 42 are frame-shaped bank banks (convex portions) serving as bank portions (ink plugs) that block the ink 152 used in the resin film 52 to prevent the flow of the ink 152 . As shown in FIG. 2 and FIG. 3 , on the inorganic insulating layer 24 provided with the planarization layer 13 in the non-active area NA, the first bank 41 and the second bank 41 are disposed in a double-layer frame-like manner surrounding the planarization layer 13 . dike42. The planarization layer 13, the first bank 41, and the second bank 42 are formed on the same layer (same plane).

The first bank 41 and the second bank 42 are each formed in a frame shape composed of continuous lines. The first bank 41 is provided facing the planarization layer 13 so as to surround the planarization layer 13 . The second bank 42 is provided to surround the first bank 41 .

The inside of the first bank 41 is covered with a resin film 52 . The edge portion of the resin film 52 is in contact with the first bank 41 . The edges of the resin film 52 are defined by the first banks 41 .

The second bank 42 is formed such that the height of the second bank 42 is higher than the height of the first bank 41 . In addition, the height of the first bank 41 and the height of the second bank 42 refer to the base layer (the inorganic insulating layer 24 in the example shown in FIG. 3 ) on which the first bank 41 and the second bank 42 are provided. ) to the height of the upper surfaces of the first bank 41 and the second bank 42 respectively.

The third bank 43 is a restricting bank (convex portion), which plays a barrier function when the ink 152 passes through the third bank 43, so that when the resin film 52 is formed, the flow velocity of the ink 152 gradually decreases, and the flow rate of the ink 152 is restricted. Diffuse moisture. Furthermore, the third bank 43 also functions as a mask spacer on which an evaporation mask is placed when forming each layer (evaporation layer) included in the functional layer 32 .

The third banks 43 are respectively formed in a frame shape in the non-active area NA on the planarization layer 13 , and are arranged in a multiple frame shape so as to surround the active area DA. Also, the number of third banks 43 is omitted in FIG. 2 . The third bank 43 may be formed in a continuous frame shape, or may be formed in a discontinuous frame shape.

As a material of the first bank 41 to the third bank 43, the photosensitive resin in the above-mentioned examples can be mentioned. In the example shown in FIG. 2 , as the first bank 41 and the third bank 43 , banks made of the same material as the edge cover 35 are formed. In addition, an upper bank 42b made of the same material as the edge cover 35, the first bank 41, and the third bank 43 is laminated on the lower bank 42a made of the same material as the planarizing layer 13 to form two banks as the second bank. Second Dike 42. Also, each end surface of these edge caps 35 , first to third banks 41 to 43 , and planarization layer 13 has, for example, a forward tapered shape in order to improve the coverage of the formation surface where each layer is formed. Therefore, as these materials, for example, positive photosensitive resins such as acrylic resins and polyimide resins are preferably used.

In addition, in FIG. 2 and FIG. 3 , the case where the first bank 41 and the second bank 42 double surround the planarization layer 13 is shown as an example. However, the present embodiment is not limited thereto, and the bank portion may further include banks other than the first bank 41 and the second bank 42 .

<Manufacturing method of display device 1>

FIG. 4 is a flowchart illustrating an example of a method of manufacturing the display device 1 according to this embodiment. (a) to (e) of FIG. 5 are main part cross-sectional views showing a part of the manufacturing process of the display device according to the present embodiment in order of process. When the display device 1 is, for example, a flexible display device, as shown in FIG. The lower bank forming process (S3), the upper bank/third bank forming process (S4) of the light emitting element layer/first bank/second bank, the sealing layer forming process (S5), the upper surface film sticking process (S6), Support substrate glass peeling process (S7), lower surface film sticking process (S8), laminate separation process (S9), functional film sticking process (S10), electronic circuit board mounting process (S11).

In the manufacturing process of the display device 1, first, as shown in FIG. 2 and FIG. Resin layer 11b (S1). Next, the barrier layer 11c is formed on the resin layer 11b (S2). Next, the TFT layer 14 and the lower bank 42a of the second bank 42 are formed (S3).

FIG. 6 is a flow chart showing an example of the TFT layer/second bank forming step ( S3 ) of the lower layer bank. This step ( S3 ) includes, for example, a circuit portion forming step ( S21 ) and a planarization layer/second bank forming step ( S22 ).

The circuit unit 12 includes the aforementioned plurality of TFTs 25 and a plurality of wirings covered with the planarizing layer 13 . In the step ( S3 ), first, as shown in FIG. 5( a ), the circuit portion 12 including a plurality of TFTs 25 and a plurality of wirings is formed by a known method ( S21 ). Then, the planarization layer 13 and the lower bank 42a of the second bank 42 are formed (S22).

In the step ( S22 ), first, as shown in FIG. 5( a ), photosensitive resin 130 is applied on inorganic insulating layer 24 by a known method so as to cover circuit portion 12 . Next, for example, by photolithography using a multi-tone mask as the exposure mask M, the planarization layer 13 made of the photosensitive resin 130 and the lower bank 42 a of the second bank 42 are patterned.

In (a) of FIG. 5 , as the multi-tone mask, a half-tone mask having a light-transmitting portion MA, a light-shielding portion M1, and a half-tone portion M2 (multi-tone portion) is used, and a positive-type photosensitive resin is used as the multi-tone mask. The case of the photosensitive resin 130 is shown as an example.

Opposite to the region of the photosensitive resin 130 other than the formation region of the planarization layer 13 and the lower bank 42a and the formation region of the slit 13a and the contact hole 13b (see FIG. Department MA. The light-shielding portion M1 covers the formation region of the planarization layer 13 and the formation region of the lower bank 42a in the photosensitive resin 130 excluding the slit 13a, the contact hole 13b, and the concave-convex structure formation region at the end of the planarization layer 13 . The halftone portion M2 covers the formation region of the uneven portion 133 of the planarizing layer 13 in the photosensitive resin 130 . The halftone portion M2 has different transmittances in the formation area of the first side 131 and the formation area of the second side 132 of the planarization layer 13 . The transmittance of the halftone portion M2 covering the formation area of the first side 131 is higher than the transmittance of the halftone portion M2 covering the formation area of the second side 132 .

When the photosensitive resin 130 is irradiated with light such as ultraviolet light through the exposure mask M, the light transmitted through the light transmissive portion MA and the halftone portion M2 is irradiated onto the photosensitive resin 130 . As a result, the region of the photosensitive resin 130 facing the translucent portion MA is exposed, and the region facing the halftone portion M2 is half-exposed. Then, by developing, as shown in FIG. 5( b ), the planarization layer 13 made of the photosensitive resin 130 and the lower bank 42 a are patterned simultaneously. At this time, the flattening layer 13 having the uneven portion 133 whose end surface has a gentle inclination angle can be formed at the edge by light interference caused by the half-exposure and the resolution of the exposure machine. Also, as a multi-tone mask, a gray tone mask can be used. Of course, the planarization layer 13 and the lower bank 42a may be formed by etching, double exposure, etc., or the planarization layer 13 and the lower bank 42a may be formed in different steps using different masks.

Next, the light emitting element layer 30, the first bank 41, the upper layer bank 42b of the second bank 42, and the third bank 43 are formed (S4). Fig. 7 is a flowchart showing an example of the light emitting element layer/upper bank/third bank forming process (S4). This step (S4) includes, for example, a first electrode forming step (S31), an edge cap/upper bank/third bank forming step (S32), a functional layer forming step (S33), and a second electrode forming step (S34).

In the step (S4), as shown in FIG. 5(c), first, the first electrode 31 is formed on the planarization layer 13 formed in the step (S3) (S31). Next, an organic film (not shown) made of, for example, a positive photosensitive resin or the like is formed on the TFT layer 14 so as to cover the first electrode 31 . Next, the edge cap 35 made of an organic film, the first bank 41 , the upper layer bank 42 b of the second bank 42 , and the third bank 43 are patterned by photolithography or the like. Then, the functional layer 32 is formed (S33). Next, the second electrode 33 is formed (S34). Thus, the light emitting element layer 30 including the light emitting element 34 and the third bank 43 are formed on the planarization layer 13, and the first bank 41 and the second bank including the lower bank 42a and the upper bank 42b are formed on the inorganic insulating layer 24. 42.

As described above, the bank portion forming process includes, for example: a first bank forming process of forming the first bank 41; a second bank forming process including a lower bank forming process and an upper bank forming process, wherein the lower bank forming process forms the second The lower bank 42a of the second bank 42 forms the upper bank 42b of the second bank 42 in the upper bank forming step. In this case, as described above, the planarization layer forming step in the TFT layer forming step and the lower bank forming step of the second bank in the bank portion forming step can be performed simultaneously. In addition, the step of forming the light emitting element layer, the step of forming the first bank of the step of forming the bank portion, and the step of forming the upper layer of the second bank may be performed simultaneously. Of course, the edge cover 35, the first bank 41, the second bank 42 or the upper bank 42b of the second bank 42, and the third bank 43 can be formed simultaneously using the same material, or can be formed using different materials or different masks in different layers. formed in the process.

Next, the light emitting element layer 30 formed in the step (S4) is sealed with the sealing film 50 (S5). FIG. 8 is a flowchart showing an example of the sealing layer forming step ( S5 ). This step (S5) includes, for example, a first inorganic film forming step (S41), a resin layer forming step (S42), and a first inorganic film forming step (S43).

In the step ( S5 ), first, as shown in FIG. 5( d ), the first inorganic film 51 is formed by CVD or the like ( S41 ). Next, the resin film 52 is formed on the first inorganic film 51 (S42). In the process ( S42 ), ink droplets 152 a drop from the inkjet coating device 200 to the area surrounded by the first banks 41 , thereby coating the entire area with the ink 152 that is the material of the resin film 52 . Next, the ink 152 is irradiated with ultraviolet rays to cure the ink 152 . Thus, the resin film 52 made of the ink 152 is formed. Then, as shown in FIG. 5( e ), the second inorganic film 53 is formed by CVD or the like so as to cover the resin film 52 ( S43 ). The first inorganic film 51 and the second inorganic film 53 are formed on the entire surface of the active area DA and the non-active area NA except the terminal portion TM, so that the resin film 52 is sandwiched between the first inorganic film 51 and the second inorganic film. Between 53.

Next, an upper surface film (not shown) is pasted on the sealing film 50 formed in the step (S5) (S6). Next, the lower surface of the resin layer 11b is irradiated with laser light through the support substrate 11a' to peel the support substrate 11a' from the resin layer 11b (S7). Next, the lower surface film 11a shown in FIG. 3 is attached to the lower surface of the resin layer 11b (S8). Next, the laminate obtained in the step (S8) is divided to obtain a plurality of individual sheets (S9). Next, a functional film (not shown) is pasted on the obtained sheet ( S10 ). Next, an electronic circuit board (not shown) is mounted on the terminals for external connection in the terminal portion TM to obtain the display device 1 shown in FIGS. 2 and 3 ( S11 ). And, these respective steps are performed by the display device manufacturing apparatus.

<Shape of uneven portion 131A/132A and method of forming resin film 52 >

FIG. 1 is an enlarged plan view illustrating a schematic configuration of main parts of a display device 1 according to the present embodiment, together with an arrangement of ink droplets 152 a when forming a resin film 52 . 9( a ) is a perspective view showing the appearance of the inkjet coating device 200 according to this embodiment, and FIG. 9( b ) is a bottom view showing the main part of the bottom surface of the inkjet head 203 . FIG. 10 is a plan view showing the spread of ink droplets 152 a in the case where the uneven portion 133 is not provided on the edge portion of the planarizing layer 13 .

The inkjet coating device 200 is a film forming device that ejects ink droplets 152 a of the ink 152 in step S42 to form the resin film 52 in the sealing film 50 .

As shown in FIG. 9( a), the inkjet coating apparatus 200 includes: a mounting table 201 on which a substrate on which the first inorganic film 51 is formed is placed as a film-forming substrate; above the mounting table 201. For example, a plurality of inkjet heads 203 are provided on the side of the gantry 202 . As shown in FIG. 9( b ), a plurality of nozzles 203 a for ejecting (dropping) ink droplets 152 a is provided on the bottom surface of the inkjet head 203 (the surface facing the film-forming substrate 100 ). In addition, the number of inkjet heads 203 and the number of nozzles 203a are not particularly limited.

The gantry 202 is reciprocated by the gantry sliding mechanism 204 coupled to the stage 201 in a direction (first direction) parallel to the first side 131 of the planarizing layer 13 , which is the coating direction of the ink 152 . As shown in FIGS. 1 and 10 , the ink droplet 152 a drops in the area surrounded by the first bank 41 . The inkjet coating device 200 drips the ink droplets 152 a in a zigzag pattern in which the arrangement of the ink droplets 152 a is shifted by half of the coating pitch of the ink droplets 152 a in the forward path and the return path, for example. This is because, when the ink droplets 152a are arranged in a grid pattern, defects are likely to occur between the ink droplets 152a, or film thickness unevenness is likely to occur on the formed resin film 52 .

The distance between the ink droplets 152 in the direction parallel to the first side of the planarization layer 13 (that is, the direction parallel to the coating direction of the ink droplets 152a, the first direction) is equal to that in the inkjet coating device 200. The coating cycle of the ink droplet 152a is the coating pitch p1 (μm). In addition, the distance between the ink droplets 152 in the direction parallel to the second side of the planarization layer 13 (that is, the direction perpendicular to the coating direction of the ink droplets 152a, the second direction) is equal to that of the inkjet coating device 200 The nozzle pitch p2 (μm) of the nozzle 203a in . And, the pitch between ink droplets 152a means the distance between the centers of adjacent ink droplets 152a. In addition, the nozzle pitch p2 represents the distance between the centers of adjacent nozzles 203a.

The ink droplets 152 a dropped on the film formation substrate 100 radially spread from the state shown by the solid line in FIG. 10 to the state shown by the broken line in FIG. 10 . However, since the end face of the planarization layer 13 is tapered, the ink droplet 152a dropped on the lower side of the planarization layer 13 (between the planarization layer 13 and the first banks 41) cannot diffuse onto the planarization layer 13. side. Therefore, when the uneven portion 133 is not provided at the edge of the planarizing layer 13, as shown by the oblique lines in FIG. .

Therefore, in the present embodiment, the concavo-convex portion 133 is provided on the edge portion of the planarization layer 13 to remove such a region R where the ink droplet 152 a does not diffuse. In other words, according to the present embodiment, the concavo-convex portion 133 is provided in the edge portion of the planarizing layer 13 so as to have an edge in the range where the ink droplet 152 a spreads.

The pitch of the concavo-convex portions (recessed portion 132 a , convex portion 132 b ) in the concavo-convex portion 132A is defined by the nozzle pitch p2. The depth of the concave-convex portion in the concave-convex portion 132A and the pitch of the concave-convex portion (the concave portion 131 a , the convex portion 131 b ) in the concave-convex portion 131A are defined by the coating pitch p1. The depth of the concavities and convexities in the concavo-convex portion 131A is defined by the nozzle pitch p2 and the coating pitch p1. Further, the coating pitch p1 is defined by the film thickness t of the resin film 52 (final coating film thickness), the size of the nozzle 203a (specifically, the amount V of one drop of the ink droplet 152a from the nozzle 203a), and the nozzle pitch p2. For example, as shown in FIG. 1 , when the pitch of the bumps in the bump 132A is P2 (μm), it is preferable that the pitch of the bumps P2 is equal to the nozzle pitch p2 (μm) (ie, P2 = p2 ). Also, the pitch P2 of the concavities and convexities in the concavo-convex portion 132A represents the period of the concavities and convexities, that is, the distance between the centers of the adjacent concave portions 132a or the distance between the centers of the adjacent convex portions 132b in the concavo-convex portions in plan view. . Also, the distance between the centers of adjacent concave portions 132a is the same as the distance between the centers of adjacent convex portions 132b.

Furthermore, when the depth of the unevenness in the uneven portion 132A is D2 (μm), the depth D2 of the unevenness is preferably half of the coating pitch p1 (μm). And, in the inkjet coating device 200, when the coating frequency of the ink droplet 152a is f (l/s) and the scanning speed of the film-forming substrate 100 is v (μm/s), the coating pitch p1 is represented by p1 =v/f to represent. Therefore, the depth D2 of the unevenness is preferably D2=p1/2=v/(2×f). In addition, the depth D2 of the concavities and convexities in the concavo-convex portion 132A represents the distance between the line connecting the adjacent concavities 132a and the line connecting the adjacent protruding portions 132b in plan view, that is, the depth D2 of the concavities 132a in plan view. The separation distance between the center and the center of the convex portion 132b in the concave-convex direction (left-right direction in FIG. 1 ).

On the other hand, when the pitch of the concavities and convexities in the concavo-convex portion 131A is P1 (μm), it is preferably equal to the coating pitch p1. That is, it is preferable that P1=p1=v/f. Also, the pitch P1 of the concavities and convexities in the concavo-convex portion 131A represents the period of the concavities and convexities, that is, the distance between the centers of adjacent concave portions 131 a or the distance between the centers of adjacent convex portions 131 b in the concavo-convex portions in plan view. . Also, the distance between the centers of adjacent concave portions 131a is the same as the distance between the centers of adjacent convex portions 131b.

In addition, when the depth of the concavities and convexities in the concavo-convex portion 131A is D1 (μm), the depth D1 of the concavo-convex portions is preferably set such that the center of each concave portion 132a and the center of the convex portion 132b in the concavo-convex portion 131A are adjacent to The shortest distance x between the respective ink droplets 152a in the concave portion 132a and the convex portion 132a is the same. At this time, since the relationship of x ² =(p2/2-x) ² +{v/(2×f)} ² holds, x=p/4+v ² /(4×p×f ² ). Therefore, when the depth of the concavo-convex portion 131A is D1 (μm), it is preferable that the depth D1 of the concavo-convex is D1=2×xp/2=v ² /(2×p2×f ² ). Also, v ² /f ² can be replaced by p1 ² (the square of p1). In addition, the depth D1 of the concavities and convexities in the concavo-convex portion 131A represents the distance between the line connecting the adjacent concavities 131a and the line connecting the adjacent protruding portions 131b in plan view, that is, the depth D1 of the concavities 131a in plan view. The separation distance between the center and the center of the convex portion 131b in the concave-convex direction (vertical direction in FIG. 1 ).

In addition, when the thickness of the resin film 52 is t (μm), the number of drops of the inkjet coating device 200 on the same area of the film-forming substrate 100 is n (times), and the amount of one drop of the ink drop 152a from the nozzle 203a For V(pl), as mentioned above, when the spray pitch is p2 (μm), the coating pitch is p1 (μm), the coating frequency is f (l/s), and the scanning speed is v (μm/s), Dividing the amount of one drop of the ink drop 152a by the area occupied by the amount of one drop becomes the coating film thickness of the ink drop 152a formed by one scan. Therefore, the film thickness t of the resin film 52 finally formed is t= V×10 ³ ×n/(p2×p1)=V×10 ³ ×n/(p2×v/f). Therefore, the pitch P1 of the concavities and convexities in the concavo-convex portion 131A is preferably set as P1=v/f=V×10 ³ ×n/(p2×t)=V×10 ³ ×n/(P2×t). In addition, the pitch P2 of the concavities and convexities in the concavo-convex part 132A is preferably set as P2=p2=V×10 ³ ×n/(t×v/f)=V×10 ³ ×n/(t×P1). The depth D2 of the concavities and convexities in the concavo-convex portion 132A is preferably set to half the pitch P1 of the concavities and convexities in the concavo-convex portion 131A, that is, D2=V×10 ³ ×n/(p2×2×t)=V×10 ³ ×n /(P2×2×t).

For example, it is assumed that the nozzle pitch p2=70.5 μm, the film thickness t=10 μm of the resin film 52, the number of times of dropping in the same area n=2, the amount of one drop of the ink drop 152a from the nozzle 203a V=10 pl, and the coating frequency f= When the scanning speed is 21.15 kHz and v=600×10 ³ μm/s, it is preferable that the concave-convex pitch P2=70.5 μm and the depth D2=14.2 μm in the concave-convex part 132A. In addition, it is preferable that the concave-convex pitch P1=28.4 μm and the concave-convex depth D1=5.7 μm in the concave-convex portion 131A.

<effect>

As described above, in the present embodiment, the edge portion of the planarization layer 13 is provided with the concavo-convex portion 133, and the concavo-convex portion 133 has different sizes (pitch and depth) of the concavo-convex portions on the first side 131 and the second side 132, Ink droplets 152 a are applied (dropped) in conformity with the concavo-convex portion 133 . As shown in FIG. 1 , the ink droplet 152a is coated such that, among the ink droplet 152a adjacent to each side sandwiching each side of the planarization layer 13, the ink droplet 152a on the planarization layer 13 and each convex portion 131b The center of / 132b is opposite, and the ink drop 152a located between the planarization layer 13 and the first bank 41 is opposite to the center of each concave portion 131a / 132a. According to the present embodiment, when the edge portion of the planarizing layer 13 is straight, the concave portions 131a/132a are provided in the region where the ink droplet 152a does not spread. Therefore, defects of the resin film 52 at the edge portion of the planarizing layer 13 can be suppressed.

In addition, the ink 152 is easy to stop at the end of the flat surface, and when the end of the planarizing layer 13 is linear as shown in FIG. , the ink 152 continues to stay at the end of the upper surface of the planarization layer 13 . However, in this embodiment, since the uneven portion 133 is provided on the edge of the planarizing layer 13, each edge (Each edge) of the planarizing layer 13 is not continuous from one end to the other end when viewed from above. Straight lines are formed, and the parts connected by the straight lines are shorter than before. The ink droplets 152 a dropped on the upper surface of the planarization layer 13 flow on the planarization layer 13 , overlap while being wetted and diffused, and are planarized in the active area DA. In addition, when the ink droplet 152 a wetted and diffused on the planarization layer 13 reaches the recess 131 a / 132 a , it flows from the recess 131 a / 132 a to the bottom of the planarization layer 13 . When the ink 152 (ink droplet 152 a ) flows from any position to the bottom of the planarization layer 13 , the surrounding ink 152 also flows from the planarization layer 13 to the bottom. The recesses 131 a / 132 a cause the ink 152 to flow downward from the upper surface of the planarizing layer 13 . The ink droplet 152a dropped on the area between the planarization layer 13 and the first bank 41 and the ink 152 flowing from the upper surface of the planarization layer 13 to the area between the planarization layer 13 and the first bank 41 are in this area. Diffusion in, and reach the first bank 41, and be blocked by the first bank 41. As a result, even if foreign matter enters the region surrounded by the first bank 41 , the foreign matter can be covered and planarized by the resin film 52 formed by curing the ink 152 .

Therefore, according to the present embodiment, there is provided a display device 1 capable of preventing a decrease in reliability due to a defect in the inkjet resin film, that is, the resin film 52 , and a method of manufacturing the same. Furthermore, in this embodiment, the case where the arrangement of the ink droplets 152a is shifted by half of the coating pitch p1 of the ink droplets 152a has been described as an example, but the same idea (idea) can be applied to other coating methods.

＜Modification 1＞

FIG. 11 is an enlarged plan view illustrating a schematic configuration of a main part of a display device 1 according to this modified example, together with an arrangement of ink droplets 152 a when forming a resin film 52 . The ink droplets 152a spread radially. Therefore, as shown in FIG. 11 , the concavo-convex portion 131A/ 132A may have a curved shape (wavy shape) that smoothes the zigzag shape shown in FIG. 1 .

<Modification 2>

In addition, in this embodiment, as shown in FIG. 1 and FIG. 11 , as an example, the pitch of the concavo-convex portion 132A provided on the second side 132 of the planarizing layer 13 is wider than that provided on the second side 132 of the planarizing layer 13 . The pitch of the concavo-convex part 131A on the first side 131. However, the present embodiment is not limited thereto, and the concavo-convex pitch of the concavo-convex portion 131A may be wider than the concavo-convex pitch of the concavo-convex portion 132A.

[Second Embodiment]

Another embodiment of the present invention will be described below based on FIGS. 12 and 13 . In addition, members having the same functions as those described in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

FIG. 12 is an enlarged plan view illustrating the schematic configuration of main parts of the display device 1 according to the present embodiment, together with the arrangement of ink droplets 152 a when the resin film 52 is formed. The display device 1 according to the present embodiment has the same configuration as the display device 1 according to the first embodiment except for the following configurations. As described above, the ink droplet 152a is dropped to the inner side of the first bank 41 . Therefore, it is preferable to provide concavo-convex portions matching the drop shape of the ink droplet 152 a in the first bank 41 . Therefore, in this embodiment, as shown in FIG. The first side 411 and the second side 412 of the first bank 41 parallel to the second side 132 of the planarization layer 13 are different in size (pitch and depth) of the unevenness.

The concave-convex portion 413 includes a concave-convex portion 411A provided on the first side 411 and composed of a concave portion 411 a and a convex portion 411 b, and a concave-convex portion 412A provided on the second side 412 and composed of a concave portion 412 a and a convex portion 412 b. The concave-convex portion 411A has a shape in which the concave-convex portion 131A is reversed in the vertical direction (second direction) so that the concave portion 411 a faces the convex portion 131 b of the planarizing layer 13 , and the convex portion 411 b faces the concave portion 131 a of the planarizing layer 13 . In addition, the concavo-convex portion 412A has a shape in which the concavo-convex portion 132A is translated in the left-right direction (first direction) so that the concave portion 412a is opposed to the concave portion 132a of the planarizing layer 13 and the convex portion 412b is opposed to the convex portion 131b of the planarizing layer 13 . Therefore, if the pitch of the concavities and convexities (recesses 411 a and convexes 411 b ) in the concavo-convex portion 411A is P11 (μm), and the depth of the concavities and convexities in the concavo-convex portion 411A is D11 (μm), then P11=P1, D11=D1. In addition, if the pitch of the concavo-convex portion (recess 412a and protruding portion 412b ) in the concavo-convex portion 412A is P12 (μm), and the depth of the concavo-convex portion 412A is D12 (μm), then P12=P2, D12=D2.

＜Modifications＞

FIG. 13 is an enlarged plan view illustrating a schematic configuration of a main part of a display device 1 according to this modified example, together with an arrangement of ink droplets 152 a when forming a resin film 52 . In the example shown in FIG. 12 , the distance between the uneven portion 133 of the planarizing layer 13 and the uneven portion 413 of the first bank 41 is not constant in the up-down direction and in the left-right direction. However, the concave-convex portion 413 may be formed such that the distance between the concave-convex portion 133 of the planarizing layer 13 and the concave-convex portion 413 of the first bank 41 is constant. Therefore, as shown in FIG. 13, the concavo-convex portion 411A/412A may also have a shape in which the concavo-convex portion 131A is moved in parallel in the vertical direction, and the concavo-convex portion 132A is moved in parallel in the left-right direction, so that the concave portion 411a is opposed to the concave portion 131a, and the convex portion 411b faces the convex part 131b, the concave part 4123a faces the concave part 132a, and the convex part 412b faces the convex part 132b. As shown in FIG. 13, also in this case, P11=P1, D11=D1.

[Third Embodiment]

Another embodiment of the present invention will be described below based on FIG. 14 . In addition, members having the same functions as those described in the first and second embodiments are denoted by the same reference numerals, and description thereof will be omitted.

FIG. 14 is an enlarged plan view illustrating the schematic configuration of main parts of the display device 1 according to the present embodiment, together with the arrangement of ink droplets 152 a when the resin film 52 is formed. The display device 1 according to this embodiment has the same configuration as the display devices 1 according to the first and second embodiments except for the following configurations.

The second bank 42 is preferably formed such that the distance between the first bank 41 and the second bank 42 is fixed so that the ink droplet 152 a that has crossed the first bank 41 does not overflow from the second bank 42 . Therefore, in the present embodiment, the concave-convex portion 423 is provided on the entire circumference of the second bank 42, and the concave-convex portion 423 is formed between the first side 421 of the second bank 42 parallel to the first side 131 of the planarizing layer 13 and the The size (pitch and depth) of the concavities and convexities in the second side 422 parallel to the second side 132 of the planarization layer 13 is different.

The concave-convex portion 423 includes a concave-convex portion 421A formed on the first side 421 and composed of a concave portion 421a and a convex portion 421b, and a concave-convex portion 422A formed on the second side 422 and composed of a concave portion 422a and a convex portion 422b. The concavo-convex portion 421A has a shape in which the concavo-convex portion 131A is shifted in parallel in the vertical direction (second direction). In addition, the concavo-convex portion 412A has a shape in which the concavo-convex portion 132A is shifted in parallel in the left-right direction (first direction). Therefore, if the pitch of the concavities and convexities (concave portion 421a and convex portion 421b) in the concavo-convex portion 421A is P21 (μm), and the depth of the concavo-convex portion 421A is D21 (μm), then P21=P1=P11, D21=D1= D12. In addition, if the pitch of the concavities and convexities (concave portion 422a and convex portion 422b) in the concavo-convex portion 422A is P22 (μm), and the depth of the concavo-convex portion 422A is D22 (μm), then P22=P2=P12, D22=D2= D12.

The present invention is not limited to the above-mentioned embodiments, and various changes can be made within the range shown in the claims. Embodiments obtained by appropriately combining technical means disclosed in different embodiments are also included in the technical scope of the present invention. . Furthermore, new technical features can be formed by combining the technical means disclosed in the respective embodiments.

reference sign

1 display device

10 TFT substrate (circuit substrate)

13 planarization layer

34 light emitting elements

41 The first embankment (the first frame embankment)

42 Second embankment (second frame embankment)

50 sealing film

52 resin film

131, 411, 421 first side

131A, 132A, 133, 411A, 412A, 413, 421A, 422A, 423 Concave and convex parts

131a, 132a, 411a, 412a, 421a, 422a Recesses

131b, 132b, 411b, 421b, 422b Convex part

132, 412, 422 second side

152 ink

152a ink drop

200 inkjet coating device

203a nozzle

Claims (10)

1. A display device, characterized in that, possesses: A circuit substrate, which is provided with a planarization layer on the surface; a plurality of light emitting elements disposed on the planarization layer; a sealing film comprising a first inorganic film, a resin film on an upper layer of the first inorganic film, a second inorganic film on an upper layer of the resin film, and seals the light emitting element; a frame-shaped first bank that surrounds the planarization layer and whose inner side is covered by the resin film, The planarization layer has a first side and a second side perpendicular to the first side, and has concavo-convex portions around the entire periphery of the edge portion of the planarize layer. The first side and the second side are provided with unevennesses of different sizes. 2. The display device of claim 1, wherein In the first side and the second side of the concave-convex part, the pitch of the concave-convex and the depth of the concave-convex are different. The distance between the centers of adjacent concave parts or the distance between the centers of adjacent convex parts. the departure distance. 3. The display device according to claim 1 or 2, characterized in that, When viewed from above, the concave-convex portion has a zigzag shape. 4. The display device according to claim 1 or 2, wherein The concavo-convex portion has a curved shape when viewed from above. 5. The display device as claimed in claim 1 or 2, characterized in that, In the frame-shaped first bank, a concave-convex portion is provided on a side parallel to the first side, and the concave-convex portion has a direction perpendicular to the first side. The shape is reversed or moved in parallel, and a concavo-convex part is provided on the side parallel to the second side, and the concavo-convex part has a shape of moving the concavo-convex part of the second side in parallel. 6. The display device according to claim 1 or 2, wherein having a second dike surrounding said first dike, In the second bank, the side parallel to the first side and the side parallel to the second side are respectively provided with concavo-convex parts, so that the gap between the first bank and the second bank The distance is fixed. 7. A method of manufacturing a display device, The display device has: A circuit substrate, which is provided with a planarization layer on the surface; a plurality of light emitting elements disposed on the planarization layer; a sealing film comprising a first inorganic film, a resin film on an upper layer of the first inorganic film, a second inorganic film on an upper layer of the resin film, and seals the light emitting element; a first bank that surrounds the planarizing layer having a first side and a second side orthogonal to the first side, and whose inner side is covered with the resin film, The manufacturing method is characterized in that it includes: the process of forming the planarization layer; forming the first bank surrounding the planarization layer; a step of forming the resin film covering the inner side of the first bank, In the step of forming the planarization layer, irregularities are formed on the entire periphery of the edge of the planarization layer, and the sizes of the irregularities are different on the first side and the second side in plan view, In the step of forming the resin film, ink droplets are dropped from an inkjet coating device onto a region corresponding to the concavo-convex portion in a region surrounded by the first bank. 8. The method for manufacturing a display device according to claim 7, wherein: In the step of forming the resin film, The second side is a side perpendicular to the coating direction of the ink drop, when the nozzle pitch of the ink drop in the inkjet coating device is p2 (μm), the ink drop The coating frequency is f (l/s), the scanning speed is v (μm/s), and the pitch of the concavities and convexities in the concavo-convex portion of the second side is P2 (μm/s) when viewed from above. When the depth of the concavities and convexities in the concavo-convex portion of the second side is D2 (μm), P2=p2, D2=v/(2×f). 9. The method for manufacturing a display device according to claim 8, wherein: In the step of forming the resin film, When the number of drops of the inkjet coating device on the same area is n (times), the amount of one drop of ink from the nozzle is V (pl), and the thickness of the resin film is t (μm), then P2=V×10 ³ ×n/(t×v/f), D2=V×10 ³ ×n/(p2×2×t). 10. The manufacturing method of the display device as claimed in claim 8 or 9, characterized in that, In the step of forming the resin film, The first side is a side parallel to the coating direction of the ink droplet, and the pitch of the concavities and convexities in the concavo-convex portion of the first side when viewed from a plan is P1 (μm/s), and when viewed from a plan, The depth of the concavo-convex in the concavo-convex portion of the first side is D1 (μm), then P1=v/f, D1=v ² /(2×p2×f ² ).

Images