CN111907846B - Film stripping device and method - Google Patents
Film stripping device and method Download PDFInfo
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- CN111907846B CN111907846B CN202010818394.7A CN202010818394A CN111907846B CN 111907846 B CN111907846 B CN 111907846B CN 202010818394 A CN202010818394 A CN 202010818394A CN 111907846 B CN111907846 B CN 111907846B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B69/00—Unpacking of articles or materials, not otherwise provided for
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Abstract
The invention provides a film stripping device and a film stripping method, which solve the problem that a pixel unit array substrate is easy to wrinkle due to film stripping equipment in the prior art. The film layer stripping device comprises a pointer, the pointer comprises a main body part and a free end, and the friction coefficient of the main body part is smaller than that of the free end.
Description
Technical Field
The invention relates to the technical field of film layer stripping, in particular to a film layer stripping device and method.
Background
In the field of display screen preparation, a protective film is generally required to cover the surface of a semi-finished product or a finished product of a display screen so as to prevent the manufactured part from being worn, attached with dust, even oxidized and the like. However, the protective film needs to be removed first during subsequent preparation or use. When the protective film is peeled by using the film peeling equipment in the prior art, the film below the protective film is easily taken up, so that the pixel unit array substrate is wrinkled, and the display effect is influenced.
Disclosure of Invention
In view of the above, embodiments of the present invention provide a film peeling apparatus and method to solve the problem that a film peeling device in the prior art is prone to cause wrinkles on a pixel cell array substrate.
The invention provides a film layer stripping device which comprises a pointer, wherein the pointer comprises a main body part and a free end, and the friction coefficient of the main body part is smaller than that of the free end. According to the embodiment, the friction coefficient between the pointer and the film layer to be peeled is increased equivalently by increasing the friction coefficient of the free end of the pointer, so that the vertical pressure required by the separation of the film layer is reduced, and the film layer below the film layer to be peeled is prevented from being wrinkled.
In one embodiment, the free end includes a concave-convex surface. According to the embodiment, the friction coefficient is increased by utilizing the concave-convex surface, the structure is simple, and the realization is easy.
In one embodiment, the free end is serrated. An implementable embodiment is provided.
The second aspect of the present invention provides a film layer peeling method, including: fixing a substrate on a carrier, the substrate comprising a first film layer and a second film layer superposed on the first film layer; the pointer is controlled to abut against the surface, far away from the first film layer, of the second film layer and move along the direction parallel to the second film layer until the local area of the second film layer is separated relative to the first film layer; the pointer comprises a main body part and a free end, and the friction coefficient of the main body part is smaller than that of the free end; and clamping the local area by using the clamping jaw, and tearing the second film layer away from the first film layer. According to the embodiment, the friction coefficient between the pointer and the film layer to be peeled is increased equivalently by increasing the friction coefficient of the free end of the pointer, so that the vertical pressure required by the separation of the film layer is reduced, and the film layer below the film layer to be peeled is prevented from being wrinkled.
In one embodiment, the step of controlling the pointer to press against the surface of the second film layer far from the first film layer and move along the direction parallel to the second film layer until the local area of the second film layer is separated from the first film layer comprises: firstly, controlling a pointer to abut against the surface of the second film layer far away from the first film layer at a first preset pressure and move for a certain distance along the direction parallel to the second film layer; then the pointer is controlled to be pressed on the surface of the second film layer far away from the first film layer at a second preset pressure and continuously moves along the direction parallel to the second film layer until the local area of the second film layer is separated relative to the first film layer; wherein the first predetermined pressure is greater than the second predetermined pressure. According to the present embodiment, the movement process of the pointer is divided into a front stage and a rear stage. The slip phenomenon is mostly generated in the starting stage, and after the front section opens a path on the second film layer, the rear section uses smaller vertical pressure to press the pointer, so that the friction force and the adhesion force between the second film layer and the first film layer can be overcome, the separation of the second film layer and the first film layer is realized, the required kinetic energy is reduced, and the cost is reduced.
In one embodiment, the step of controlling the pointer to press against the surface of the second film layer away from the first film layer with a first predetermined pressure and to move a distance along a direction parallel to the second film layer comprises: the pointer is controlled to press against the surface of the second film layer far away from the first film layer at a first preset pressure and move at a first speed along a direction parallel to the second film layer. Then controlling the pointer to press against the surface of the second film layer far away from the first film layer with a second preset pressure, and continuously moving along the direction parallel to the second film layer comprises: then the pointer is controlled to be pressed on the surface of the second film layer far away from the first film layer by second preset pressure and continuously moves at a second speed along the direction parallel to the second film layer; wherein the second speed is greater than the first speed. Generally, the front stage time can be controlled to be much shorter than the rear stage time, and in this case, the film separation rate greatly depends on the time required for the rear stage. Therefore, by setting the moving speed (i.e., the second speed) of the pointer at the rear section to be greater than the moving speed (i.e., the first speed) of the pointer at the front section, the film peeling rate can be increased.
In one embodiment, the second film layer includes a first region and a second region, the first region having a coefficient of friction that is greater than the coefficient of friction of the second region. Controlling the pointer to abut against the surface of the second film layer far away from the first film layer comprises: the control pointer is pressed against the surface of the first area of the second film layer. According to the embodiment, the friction coefficient between the pointer and the film to be peeled can be further increased by increasing the friction coefficient of the first area of the second film, so that the vertical pressure required by film separation is further reduced, and wrinkles of the film below the film to be peeled are avoided.
In one embodiment, the second film layer includes adjacent first and second regions. After the substrate is fixed on the carrier, the method further comprises the following steps: the second film layer is scribed along a line of demarcation between the first region and the second region. Controlling the pointer to abut against the surface of the second film layer far away from the first film layer and move along the direction parallel to the second film layer comprises: the pointer is controlled to be pressed on the surface of the second film layer far away from the first film layer and moves along the direction perpendicular to the boundary line and the direction parallel to the second film layer; and changing the motion direction of the pointer, and controlling the pointer to move along the direction parallel to the boundary line and the direction parallel to the second film layer. According to the embodiment, the film layer area to be stripped and the reserved film layer area are separated by the pointer, so that the reserved film layer area is prevented from being pulled when the film layer is stripped, and the reliability is improved.
In one embodiment, the substrate is a display screen, the first film layer is a pixel unit array substrate, and the second film layer is a protective film.
In one embodiment, the free end includes a concave-convex surface.
According to the film stripping device and method provided by the invention, the sliding friction coefficient between the pointer and the film to be stripped is improved, so that the film to be stripped can be stripped by using smaller vertical pressure. When the vertical pressure is reduced, the pointer can be prevented from being inserted into the membrane layer below the membrane layer to be peeled, so that the membrane layer below the membrane layer to be peeled is prevented from being wrinkled. Meanwhile, when the vertical pressure is reduced, the horizontal thrust is correspondingly reduced, and the film layer to be peeled can be prevented from being scratched.
Drawings
Fig. 1 is a schematic diagram of a process of peeling a protective film of a display screen by a film peeling apparatus in the prior art.
FIG. 2 is a schematic diagram illustrating a force applied to the indicator during the peeling process of the film shown in FIG. 1.
FIG. 3 is a schematic diagram illustrating the stress of the protective film during the peeling process of the film shown in FIG. 1.
Fig. 4 is a schematic partial structure diagram of a pointer in a film peeling apparatus according to a first embodiment of the present invention.
Fig. 5 is a schematic partial structure diagram of a pointer in a film peeling apparatus according to a second embodiment of the present invention.
Fig. 6 is a schematic structural diagram of a display screen according to an embodiment of the present invention.
Fig. 7 is a flowchart of a film peeling method according to an embodiment of the invention.
Fig. 8 is a flowchart illustrating a film peeling method according to an embodiment of the present invention.
Fig. 9 is a flowchart of a film peeling method according to another embodiment of the invention.
Fig. 10 is a flowchart of a film peeling method according to another embodiment of the invention.
Fig. 11 is a schematic diagram of a film peeling process according to an embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Fig. 1 is a schematic diagram of a process of peeling a protective film of a display screen by a film peeling apparatus in the prior art. As shown in fig. 1, in the prior art, a process of peeling off a protective film 11 on a display screen 1 by using a film peeling apparatus includes: firstly, fixing a display screen 1 on a carrying platform; secondly, vertical pressure F is applied to the pointer 2 of the film stripping device1To press the pointer 2 against the protective film 11; then, a horizontal pushing force F is applied to the pointer 22Driving the protection film 11 to move to form an arch-shaped bulge separated from the pixel unit array substrate 12 in a local area of the protection film 11; finally, the separation area is clamped by a clamping jaw of the film stripping device to tear the protective film 11 away from the pixel unit array substrate 12. Thus, the protective film peeling process is completed.
The inventors analyzed the related stress during the above peeling process, ignoring the influence of gravity. FIG. 2 is a schematic diagram illustrating a force applied to the indicator during the peeling process of the film shown in FIG. 1. FIG. 3 is a schematic diagram illustrating the stress of the protective film during the peeling process of the film shown in FIG. 1.
Referring to fig. 2, for the pointer 2, the stress is as follows: f2＝fNeedle and protector＝F1μNeedle and protector；F1＝FN1(ii) a Wherein f isNeedle and protectorIs the static friction between the pointer 2 and the protective film 11; mu.sNeedle and protectorIs the sliding friction coefficient between the pointer 2 and the protective film 11.
Referring to fig. 3, the protection film 11 is stressed as follows: f. ofNeedle and protector＝F1μBao + lower＝fBao + lower+fGlue stick；FN2＝FN3(ii) a Wherein f isBao + lowerIs the sliding friction between the protective film 11 and the pixel cell array substrate 12; f. ofGlue stickIs the adhesion between the protective film 11 and the pixel unit array substrate 12; f. ofBao + lowerIs the sliding friction coefficient between the protective film 11 and the pixel cell array substrate 12.
According to the force relationship between the pointer 2 and the protective film 11, it can be deduced that:
(1)
(2)F2＝F1μbao + lower+fGlue stick。
It can be seen that, in order to achieve peeling between the protective film 11 and the pixel cell array substrate 12, the vertical pressure F1Equation (1) should be satisfied. While in the prior art, when the vertical pressure F is applied1When the formula (1) is satisfied, the pointer 2 often penetrates into the pixel unit array substrate 12, so that when the pointer 2 drives the protective film 11 to move, the pixel unit array substrate 12 is taken up, the pixel unit array substrate 12 is wrinkled, and the display effect is affected.
In order to solve the above-mentioned problems, the inventors found that the sliding friction coefficient μ between the pointer 2 and the protective film 11 can be appropriately increasedNeedle and protectorSo that a smaller vertical pressure force F can be utilized1Peeling between the protective film 11 and the pixel unit array substrate 12 is achieved. When vertical pressure F1When the size becomes small, the insertion of the pointer 2 into the pixel cell array substrate 12 can be prevented, thereby preventing the pixel cell array substrate 12 from being wrinkled. Meanwhile, according to the formula (2), when the vertical pressure F is obtained1Reduced, horizontal thrust F2It is also reduced accordingly, and the protective film 11 can be prevented from being scratched.
In order to increase the sliding friction coefficient mu between the hands 2 and the protective film 11Needle and protectorEmbodiments of the present invention provide a film peeling apparatus and method, and a display screen, which increase the sliding friction coefficient μ between the pointer 2 and the protective film 11 in two aspects of increasing the friction coefficient of the pointer 2 and increasing the friction coefficient of the protective film 11, respectivelyNeedle and protector。
Fig. 4 is a schematic partial structure diagram of a pointer in a film peeling apparatus according to a first embodiment of the present invention. The film layer stripping device is suitable for a stripping process between two adjacent flexible film layers, such as a stripping process of a protective film in a display screen, but is not limited to the above. As shown in fig. 4, the film peeling device includes a pointer 20 (not shown), the pointer 20 includes a main body 21 and a free end 22, and the friction coefficient of the main body 21 is smaller than that of the free end 22.
It is understood that the material of the pointer 20 may include steel, and in other embodiments, may be other materials, and is not limited thereto.
It will be understood that the free end 22 of the finger 20 refers to the end of the finger 20 that is in contact with the film to be peeled. The free end 22 has a coefficient of sliding friction greater than 0.15 (note: this value is the data measured when the pointer 20 is slid on a steel material).
In one embodiment, the free end 22 includes a concave-convex surface. The sliding friction coefficient of the pointer 20 is increased by the concave-convex structure, and the structure is simple and easy to realize. For example, as shown in FIG. 4, the free end 22 is serrated. For another example, as shown in fig. 5, which is a schematic partial structure diagram of a pointer in a film peeling apparatus provided by a second embodiment of the present invention, in a pointer 30 (not shown in the figure), a free end includes an arc surface 311 and a huge particle protrusion 312 located on the arc surface 311. The shape of the protrusion 312 includes any shape such as a cone, a hemisphere, a rectangle, and the like.
According to the film stripping device provided by any embodiment, the friction coefficient of the free end of the pointer is increased, so that the sliding friction coefficient between the pointer and the film to be stripped is improved, and the lower vertical pressure F can be utilized1And stripping the film layer to be stripped. When vertical pressure F1When the thickness of the film layer becomes smaller, the pointer can be prevented from being inserted into the film layer below the film layer to be peeled, and therefore the film layer below the pointer is prevented from being wrinkled.
The invention also provides a display screen. Fig. 6 is a schematic structural diagram of a display screen according to an embodiment of the present invention. As shown in fig. 6, the display screen 60 includes a pixel cell array substrate and a protective film 63 stacked on the pixel cell array substrate. The pixel unit array substrate includes a pad region S. The protective film 63 includes a first region Q having a friction coefficient greater than that of a second region, and an orthogonal projection of the first region Q on the pixel unit array substrate covering the pad region S.
The pixel unit array substrate includes a carrier substrate 61 and a plurality of functional film layers 62 stacked on the carrier substrate 61. In the present embodiment, the carrier substrate 61 may be any one of a glass substrate, an organic substrate, a quartz substrate, and a metal substrate. The functional films 62 form pixel driving circuits arranged in an array and a plurality of light emitting units corresponding to the pixel driving circuits one by one and located above the pixel driving circuits. The protective film 63 may be stacked on the upper surface or the lower surface of the pixel cell array substrate, for example, as shown in fig. 6, the protective film 63 is stacked on the upper surface of the pixel cell array substrate, i.e., the side away from the carrier substrate 61.
It is understood that the material of the protection film 63 may include a PET (polyethylene terephthalate) film, and in other embodiments, the protection film 63 may be made of other materials, which are not specifically limited herein.
In one embodiment, the first region Q has a concave-convex surface. The sliding friction coefficient of the film layer to be peeled is increased by utilizing the concave-convex structure, the structure is simple, and the realization is easy. For example, the protective film 63 is provided with a large number of particle projections on the surface of the first region Q. The shape of the protrusion includes any shape such as a cone, a hemisphere, a rectangle, and the like. For another example, as shown in fig. 6, the surface of the protective film 63 in the first region Q is etched into a structured pattern surface 631.
According to the display screen provided by any embodiment, in the process of peeling off the protective film, the action area of the pointer is the first area Q, and the friction coefficient between the pointer and the film layer to be peeled off is improved by increasing the friction coefficient of the first area Q of the protective film, so that smaller vertical pressure F can be utilized1And peeling off the protective film. When vertical pressure F1When the size of the pixel unit array substrate is reduced, the pointer can be prevented from being inserted into the pixel unit array substrate, and therefore the pixel unit array substrate is prevented from being wrinkled.
The invention also provides a film layer stripping method. Fig. 7 is a flowchart of a film peeling method according to an embodiment of the invention. Fig. 8 is a flowchart illustrating a film peeling method according to an embodiment of the present invention. The film layer peeling method is suitable for separating adjacent film layers such as a protective film in a display screen, but is not limited thereto. As shown in fig. 7 and 8, the film peeling method 700 includes:
step S710 fixes a substrate on the stage 71, wherein the substrate includes a first film layer and a second film layer stacked on the first film layer.
Taking the peeling of the protective film on the display screen 70 as an example, the display screen 70 includes a pixel cell array substrate 72 and a protective film 73 stacked on the pixel cell array substrate 72.
Step S720, the pointer 74 is controlled to press against the surface of the second film layer far from the first film layer, and move along the direction parallel to the second film layer until the local area of the second film layer is separated from the first film layer. The pointer 74 includes a main body 741 and a free end 742, and a friction coefficient of the main body 741 is smaller than a friction coefficient of the free end 742.
Also taking the display screen as an example, as shown in fig. 8, a vertical pressure F is used1The pointer 74 is pressed against the protective film 73 and the horizontal pressure F is used2The pointer 74 is pushed to control the pointer 74 to move the protective film 73. Until a partial area of the protective film 73 is separated with respect to the pixel unit array substrate 72.
Step S730, clamping the local area with the clamping jaw, and tearing the second film layer away from the first film layer. Thus, the membrane layer separation process is completed.
According to the film peeling method provided in the present embodiment, by increasing the friction coefficient of the free end 742 of the pointer 74, the friction coefficient between the pointer 74 and the second film is increased, and thus the vertical pressure F required for the peeling process is reduced1Thereby avoiding the vertical pressure F1Too large results in the pointer 74 being inserted into the first film layer and the resulting peeling process picks up the first film layer, causing problems with wrinkling of the first film layer. Further, when the vertical pressure F is applied1When reduced, horizontal pressure F2And the number of the second film layers is correspondingly reduced, so that the second film layers are prevented from being scratched, and the reliability is improved.
Fig. 9 is a flowchart of a film peeling method according to another embodiment of the invention. As shown in fig. 9, the film peeling method 800 includes the following steps:
step S810 is to fix a substrate on the stage 71, wherein the substrate includes a first film layer and a second film layer stacked on the first film layer. Wherein the second film layer comprises a first region and a second region, the first region having a coefficient of friction greater than the coefficient of friction of the second region.
Still referring to fig. 8, taking the peeling of the protective film on the display screen 70 as an example, the display screen 70 includes a pixel cell array substrate 72 and a protective film 73 stacked on the pixel cell array substrate 72. The pixel unit array substrate 72 includes a pad region S. The protective film 73 includes a first region Q, which is orthographically projected on the pixel unit array substrate 72 to cover the pad region S, and a second region.
In step S820, the pointer is controlled to press against the surface of the second film layer far from the first film layer and move along a direction parallel to the second film layer until the local area of the second film layer is separated from the first film layer.
Also taking the display screen as an example, as shown in fig. 8, a vertical pressure F is used1The pointer 74 is pressed against the protective film 73 and the horizontal pressure F is used2The pointer 74 is pushed to control the pointer 74 to move the protective film 73. Until a partial area of the protective film 73 is separated with respect to the pixel unit array substrate 72.
Step S830, clamping the local area with the clamping jaw, and tearing the second film layer away from the first film layer. Thus, the membrane layer separation process is completed.
According to the film stripping method provided by the embodiment, by increasing the friction coefficient of the first area Q of the second film, when the pointer 74 is contacted with the first area Q, the friction coefficient between the pointer 74 and the second film is increased, and the vertical pressure F required by the stripping process is reduced1Thereby avoiding the vertical pressure F1Too large results in the pointer 74 being inserted into the first film layer and the resulting peeling process picks up the first film layer, causing problems with wrinkling of the first film layer. Further, when the vertical pressure F is applied1When reduced, horizontal pressure F2And the number of the second film layers is correspondingly reduced, so that the second film layers are prevented from being scratched, and the reliability is improved.
Fig. 10 is a flowchart of a film peeling method according to another embodiment of the invention. As shown in fig. 10, the film peeling method 900 includes the following steps:
step S910, fixing a substrate on a stage, where the substrate includes a first film layer and a second film layer stacked on the first film layer.
Continuing to refer to fig. 8, taking the peeling of the protective film on the display screen 70 as an example, the display screen 70 includes a pixel cell array substrate 72 and a protective film 73 stacked on the pixel cell array substrate 72.
In step S920, the pointer is first controlled to press against the surface of the second film layer away from the first film layer with a first predetermined pressure, and to move a distance along a direction parallel to the second film layer.
First, a first vertical pressure F is utilized11The pointer 74 is pressed against the protective film 73 and the first horizontal pressure F is applied12The pointer 74 is pushed to control the pointer 74 to drive the protective film 73 to move for a certain distance.
Step S930, the pointer is controlled to press against the surface of the second film layer far from the first film layer with a second predetermined pressure, and continuously moves along a direction parallel to the second film layer until the local area of the second film layer is separated from the first film layer; wherein the first predetermined pressure is greater than the second predetermined pressure.
After the pointer 74 moves a distance, the pointer 74 is lifted a distance, which is equivalent to using a pressure F higher than the first vertical pressure11Small second vertical pressure F21The pointer 74 is continuously pressed against the protective film 73. While using the second horizontal pressure F22The pointer 74 is pushed to control the pointer 74 to drive the protective film 73 to continue to move for a certain distance until the local area of the protective film 73 is separated from the pixel unit array substrate 72.
In this process, the movement process of the pointer 74 is divided into a front stage and a rear stage, and the front stage movement distance is smaller than the rear stage movement distance. With greater vertical pressure, i.e. first vertical pressure F, on the front section11The pointer 74 is pressed, so that the contact area between the pointer 74 and the protective film 73 is larger, and the friction force and the adhesive force between the pointer 74 and the protective film 73 are ensured to be larger, so that the sliding between the pointer 74 and the protective film 73 is avoided. Since the slip phenomenon often occurs at the starting stage, the lower vertical pressure, i.e., the second vertical pressure F, can be applied to the rear stage after the front stage opens a path on the protective film 7321The pointer 74 is pressed against the protective film 73, so that the friction and adhesion between the protective film 73 and the pixel unit array substrate 72 can be overcome, and the separation of the two is realized.
It should be understood that the first verticalStraight pressure F11And a second vertical pressure force F21All conform to the formula (1), and the first vertical pressure F11Greater than the second vertical pressure F21. At the same time, according to the formula (2), when the second vertical pressure F is applied21Less than the first vertical pressure F11Accordingly, the second horizontal pressure F22May be less than the first level pressure F12Thereby reducing the required kinetic energy and reducing the cost.
And S940, clamping the local area by using the clamping jaw, and tearing the second film layer away from the first film layer.
Thus, the membrane layer separation process is completed.
In one embodiment, step S920 is specifically executed as: the pointer is controlled to press against the surface of the second film layer far away from the first film layer at a first preset pressure and move for a certain distance at a first speed along a direction parallel to the second film layer. At this time, step S930 is specifically executed as: and then controlling the pointer to press against the surface of the second film layer far away from the first film layer at a second preset pressure, and continuously moving at a second speed along the direction parallel to the second film layer until the local area of the second film layer is separated relative to the first film layer, wherein the second speed is greater than the first speed.
Generally, the front stage time can be controlled to be much shorter than the rear stage time, and in this case, the film separation rate greatly depends on the time required for the rear stage. Therefore, by setting the moving speed (i.e., the second speed) of the pointer at the rear section to be greater than the moving speed (i.e., the first speed) of the pointer at the front section, the film peeling rate can be increased.
The person skilled in the art can combine the three film layer peeling methods according to the description of the specification to obtain a new technical scheme. The new technical scheme obtained by the combination mode belongs to the protection scope of the invention. And will not be described in detail herein.
Fig. 11 is a schematic diagram of a film peeling process according to an embodiment of the invention. The film layer peeling method provided by any of the above embodiments can be adopted in the peeling process, and the difference is that the film layer to be peeled includes the adjacent first area and second area, so that the film layer to be peeled in the first area only needs to be torn off. For example, the display screen includes adjacent display area AA and pad area BB, and the protective film above the pad area BB is only required to be torn off. In this case, after the substrate is fixed on the stage, a step of dividing the first area and the second area of the film layer to be peeled is further included.
Specifically, taking the film layer stripping method 700 as an example, after step S710, the method further includes: the second film layer is scribed along the boundary L between the first and second regions as shown in fig. 11. Here, the first region and the second region may be scribed out using, for example, a laser cutting process. In this case, step S720 is specifically executed as: firstly, controlling the pointer 74 to press against the surface of the second film layer far away from the first film layer and move a distance along the direction parallel to the second film layer along the direction perpendicular to the boundary line L; and secondly, changing the motion direction of the pointer, and controlling the pointer to move along the direction parallel to the boundary line L along the direction parallel to the second film layer until the local area of the second film layer is separated relative to the first film layer. The second step is actually a specific implementation procedure of the film peeling method provided in any of the above embodiments, taking the film peeling method shown in fig. 10 as an example, the implementation procedure of the second step includes: and changing the moving direction of the pointer, firstly controlling the pointer to be pressed against the surface of the second film layer far away from the first film layer by first preset pressure, moving the pointer for a distance at first speed along the direction parallel to the second film layer along the direction parallel to the boundary line L, then controlling the pointer to be pressed against the surface of the second film layer far away from the first film layer by second preset pressure, and continuously moving the pointer at second speed along the direction parallel to the second film layer along the direction parallel to the boundary line L until the local area of the second film layer is separated relative to the first film layer. The details of the film peeling method shown in fig. 10 can be referred to and will not be described herein. In one embodiment, the execution sequence of the first step and the second step of step S720 can be interchanged, that is, the pointer is controlled to press against the surface of the second film layer far from the first film layer and move in a direction parallel to the second film layer along a direction parallel to the boundary line L, and then the moving direction of the pointer is changed, and the pointer is controlled to move in a direction parallel to the second film layer along a direction perpendicular to the boundary line L.
According to the film stripping method provided by the embodiment, after the film area to be stripped and the reserved film area are separated by the pointer, the second film is torn away from the first film by the clamping jaw, the phenomenon that the reserved film area is pulled in the tearing process can be avoided, and the reliability is improved.
The foregoing description has been presented for purposes of illustration and description. Furthermore, the description is not intended to limit embodiments of the application to the form disclosed herein. While a number of example aspects and embodiments have been discussed above, those of skill in the art will recognize certain variations, modifications, alterations, additions and sub-combinations thereof.
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| CN113579460B (en) * | 2021-07-22 | 2022-12-02 | 广东省科学院中乌焊接研究所 | Method for removing metal binder of stirring head |
| KR20230055444A (en) * | 2021-10-18 | 2023-04-26 | 삼성디스플레이 주식회사 | Film peeling apparatus and film peeling method using the same |
| CN114822254B (en) * | 2022-04-26 | 2023-11-21 | 昆山国显光电有限公司 | Module and manufacturing method thereof |
| CN120840965B (en) * | 2025-09-24 | 2025-11-28 | 江苏帝浦拓普智能装备有限公司 | Paper tearing plate adhesive tape feeding and paper separating mechanism |
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| CN104429196B (en) * | 2014-12-02 | 2016-10-26 | 甘肃农业大学 | A kind of can the film removing drum of demoulding |
| JP2016160072A (en) * | 2015-03-04 | 2016-09-05 | 株式会社ジャパンディスプレイ | Peeling device and peeling head |
| CN206050305U (en) * | 2016-07-04 | 2017-03-29 | 北京中科同志科技股份有限公司 | Coating-removing machine |
| CN107458070B (en) * | 2017-07-28 | 2020-01-03 | 京东方科技集团股份有限公司 | Film peeling equipment, film peeling control method and device |
| CN207440452U (en) * | 2017-09-20 | 2018-06-01 | 宁波视睿迪光电有限公司 | Optics film exfoliating device |
| CN208270882U (en) * | 2018-07-03 | 2018-12-21 | 京东方科技集团股份有限公司 | A kind of film layer removing auxiliary device and film layer peel-off device |
| CN109866497B (en) * | 2019-03-29 | 2024-04-19 | 迈为技术(珠海)有限公司 | Film stripping and removing device and method |
| CN210026598U (en) * | 2019-03-29 | 2020-02-07 | 苏州迈为科技股份有限公司 | Film peeling mechanism and peeling device |
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2020
- 2020-08-14 CN CN202010818394.7A patent/CN111907846B/en active Active
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Effective date of registration: 20251217 Address after: 215334 Jiangsu Province Suzhou City Kunshan City Kunshan Development Zone Zhangji Road 135 Building 013 Room 507 Patentee after: Suzhou Guoxian Innovation Technology Co.,Ltd. Country or region after: China Address before: 065500 Guan County, Hebei Province emerging industries demonstration zone Patentee before: YUNGU (GU'AN) TECHNOLOGY Co.,Ltd. Country or region before: China |