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CN111876629B - A kind of high-performance copper-based alloy material for lead frame and preparation method thereof - Google Patents

A kind of high-performance copper-based alloy material for lead frame and preparation method thereof Download PDF

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CN111876629B
CN111876629B CN202010773056.6A CN202010773056A CN111876629B CN 111876629 B CN111876629 B CN 111876629B CN 202010773056 A CN202010773056 A CN 202010773056A CN 111876629 B CN111876629 B CN 111876629B
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copper
lead frame
alloy material
based alloy
platinum
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CN111876629A (en
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Tianshui Huayang Electronic Technology Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/01—Alloys based on copper with aluminium as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B37/00—Control devices or methods specially adapted for metal-rolling mills or the work produced thereby
    • B21B37/74—Temperature control, e.g. by cooling or heating the rolls or the product
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/02—Making non-ferrous alloys by melting
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H10W70/456—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B2201/00—Special rolling modes
    • B21B2201/06—Thermomechanical rolling

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Conductive Materials (AREA)

Abstract

本发明提供了一种引线框架用高性能铜基合金材料及其制备方法，属于引线框架用铜合金加工技术领域。该铜基合金材料包括以下按重量比计的材料：铝0.14～0.22wt％、锆0.02～0.05wt％、铂0.01‑0.03wt％、钛0.01～0.03wt％及余量铜。本发明通过加入锆、铂、钛使铜铝合金硬度、抗拉强度、导热性、抗高温软化性、延伸率及导电率得以改善，还满足了引线框架材料薄型化趋势要求；考虑到铜引线框架材料薄型化、轻型化会影响引线框架本身的硬度、抗拉强度，加入微量的锆、铂，而锆、铂加入量又对延伸率和导电率会产生一定影响，通过加入微量的钛、铝改善其导电率及延展性。The invention provides a high-performance copper-based alloy material for lead frames and a preparation method thereof, belonging to the technical field of copper alloy processing for lead frames. The copper-based alloy material includes the following materials in weight ratio: aluminum 0.14-0.22 wt %, zirconium 0.02-0.05 wt %, platinum 0.01-0.03 wt %, titanium 0.01-0.03 wt % and the balance copper. The invention improves the hardness, tensile strength, thermal conductivity, high temperature softening resistance, elongation and electrical conductivity of copper-aluminum alloy by adding zirconium, platinum and titanium, and also satisfies the thinning trend of lead frame materials; considering copper leads The thinning and lightening of the frame material will affect the hardness and tensile strength of the lead frame itself, adding a small amount of zirconium and platinum, and the addition of zirconium and platinum will have a certain impact on the elongation and conductivity. Aluminum improves its electrical conductivity and ductility.

Description

High-performance copper-based alloy material for lead frame and preparation method thereof
Technical Field
The invention belongs to the technical field of copper alloy processing for lead frames, and particularly relates to a high-performance copper-based alloy material for a lead frame and a preparation method thereof.
Background
The lead frame is an important basic material in the electronic information industry, is used as a chip carrier of an integrated circuit, is a key structural member for realizing the electrical connection between a leading-out end of an internal circuit of the chip and an external lead by means of a bonding material to form an electrical circuit, and plays a role of a bridge connected with an external lead.
Since the lead frame has a great influence on the reliability and durability of the integrated circuit, the lead frame material has strict performance requirements in the aspects of tensile strength, thermal conductivity, ductility, electrical conductivity and the like, and copper alloy has been widely applied to the lead frame due to the excellent electrical and thermal conductivity of the copper alloy in the past 80 years. The existing copper alloy is roughly divided into a copper-iron system, a copper-nickel-silicon system, a copper-chromium system, a copper-nickel-tin system and the like, ternary, quaternary and other multi-element copper alloys can obtain better performance and lower cost than the traditional binary alloys, and the copper-iron system alloy has the most brands, has better mechanical strength, stress relaxation resistance and low creep property, and is a good lead frame material. With the rapid development of the related information industry such as electronic communication, the performance requirements on the lead frame are higher and higher, and how to effectively improve the heat conduction, the electric conduction, the strength, the hardness, the high softening temperature, the heat resistance, the oxidation resistance, the corrosion resistance, the weldability, the plastic encapsulation, the repeated bending property, the processing and forming performance and the like of the lead frame material becomes a very prominent problem in the development process of integrated circuits. The lead frame copper alloy material with the strength of 450-500 MPa and the electric conductivity of 80% IACS can not meet the requirement of a super large scale integrated circuit, and the super large scale integrated circuit needs the copper alloy material with the strength of more than 500MPa and the electric conductivity of more than 80% IACS.
Disclosure of Invention
The invention aims to provide a high-performance copper-based alloy material for a lead frame and a preparation method thereof, aiming at the problem that the strength and the conductivity of the existing lead frame copper alloy material need to be improved.
The invention adopts the technical scheme that the high-performance copper-based alloy material for the lead frame comprises the following materials in parts by weight: 0.14 to 0.22 wt% of aluminum, 0.02 to 0.05 wt% of zirconium, 0.01 to 0.03 wt% of platinum, 0.01 to 0.03 wt% of titanium, and the balance copper.
Further, in some embodiments of the present invention, the high performance copper-based alloy material for the lead frame comprises the following materials by weight: 0.17 to 0.20 wt% of aluminum, 0.02 to 0.04 wt% of zirconium, 0.01 to 0.02 wt% of platinum, 0.01 to 0.02 wt% of titanium, and the balance of copper.
Preferably, in an embodiment of the present invention, the high-performance copper-based alloy material for lead frames comprises the following materials by weight: 0.18 wt% of aluminum, 0.03 wt% of zirconium, 0.02 wt% of platinum, 0.02 wt% of titanium and the balance of copper.
The technical scheme of the invention also provides a preparation method of the high-performance copper-based alloy material for the lead frame, which comprises the steps of smelting and casting, hot rough rolling, primary aging annealing, hot finish rolling, secondary aging annealing, finished product rolling, annealing and cooling.
The smelting temperature is 1240-1400 ℃.
The hot rough rolling temperature is 840-880 ℃.
The primary aging annealing temperature is 500-650 ℃, and the temperature is kept for 3-5 h.
The deformation amount of the hot finish rolling is 30-50%.
The secondary aging annealing temperature is 500-650 ℃, and the temperature is kept for 3-5 h.
The processing rate of finished product rolling is 30-50%.
When rolling the finished product, processing the finished product to the thickness of 0.05-0.15 mm.
And the annealing temperature during annealing and cooling is 360-400 ℃, and the annealing is cooled to room temperature after the annealing is finished.
Compared with the prior art, the invention has the beneficial technical effects that:
by adding zirconium, platinum and titanium, the hardness, tensile strength, thermal conductivity, high-temperature softening resistance, elongation and electric conductivity of the copper-aluminum alloy are improved, and the requirement of the thinning trend of the lead frame material is met; considering that the hardness and tensile strength of the lead frame are affected by thinning and lightening of the copper lead frame material, the addition of trace amounts of zirconium and platinum can affect the elongation and conductivity, and the conductivity and ductility of the copper lead frame are improved by adding trace amounts of titanium and aluminum.
Detailed Description
The present invention will be described in further detail with reference to the following preferred embodiments in conjunction with the technical solutions of the present invention.
Example 1
The high-performance copper-based alloy material for the lead frame provided by the embodiment comprises the following materials in parts by weight: 0.14 wt% of aluminum, 0.02 wt% of zirconium, 0.01 wt% of platinum, 0.01 wt% of titanium and the balance of copper; weighing the component materials according to the proportion, mixing, smelting at 1240 ℃, injecting into a casting mold to form an ingot after melting, heating to 840 ℃, and carrying out 8-pass hot rough rolling; carrying out primary aging annealing at 500 ℃, preserving heat for 3 hours, and carrying out hot finish rolling with the deformation of 30%; and (3) carrying out secondary aging annealing at 500 ℃, keeping the temperature for 3h, rolling a finished product with the processing rate of 30 percent, processing to the thickness of 0.15mm, then annealing at 360 ℃, keeping the temperature for 3h, and naturally cooling to room temperature to obtain the product. The product performance index is as follows: the tensile strength can reach 574MPa, and the electric conductivity can reach 82.5 percent IACS.
Example 2
The high-performance copper-based alloy material for the lead frame provided by the embodiment comprises the following materials in parts by weight: 0.22 wt% of aluminum, 0.05 wt% of zirconium, 0.03 wt% of platinum, 0.03 wt% of titanium and the balance of copper; weighing the component materials according to the proportion, mixing, smelting at 1400 ℃, injecting into a casting mold to form an ingot after melting, heating to 880 ℃, and carrying out 8-pass hot rough rolling; carrying out primary aging annealing at 650 ℃, preserving heat for 5 hours, and carrying out hot finish rolling with the deformation of 50%; and (3) carrying out secondary aging annealing at 650 ℃, keeping the temperature for 5h, rolling the finished product with the processing rate of 50% until the thickness is 0.12mm, then annealing at 400 ℃, keeping the temperature for 5h, and naturally cooling to room temperature to obtain the product. The product performance index is as follows: the tensile strength can reach 586MPa, and the electric conductivity can reach 81.6 percent IACS.
Example 3
The high-performance copper-based alloy material for the lead frame provided by the embodiment comprises the following materials in parts by weight: 0.18 wt% of aluminum, 0.03 wt% of zirconium, 0.02 wt% of platinum, 0.02 wt% of titanium and the balance of copper; weighing the component materials according to the proportion, mixing, smelting at 1310 ℃, injecting into a casting mold to form an ingot after melting, heating to 855 ℃, and carrying out 8-pass hot rough rolling; carrying out primary aging annealing at 600 ℃, preserving heat for 4 hours, and carrying out hot finish rolling with the deformation of 40%; and (3) carrying out secondary aging annealing at the temperature of 600 ℃, keeping the temperature for 4h, rolling the finished product with the processing rate of 40% until the thickness is 0.08mm, then carrying out annealing treatment at the temperature of 380 ℃ for 4h, and naturally cooling to room temperature to obtain the product. The product performance index is as follows: the tensile strength can reach 566MPa, and the electric conductivity can reach 83.7 percent IACS.
Example 4
The high-performance copper-based alloy material for the lead frame provided by the embodiment comprises the following materials in parts by weight: 0.16 wt% of aluminum, 0.03 wt% of zirconium, 0.02 wt% of platinum, 0.01 wt% of titanium and the balance of copper; weighing the component materials according to the proportion, mixing, smelting at the temperature of 1305 ℃, injecting into a casting mold to form an ingot after melting, heating to 865 ℃, and carrying out hot rough rolling for 8 times; carrying out primary aging annealing at 545 ℃ for 3.5h, and carrying out hot finish rolling with the deformation of 40%; and (3) carrying out secondary aging annealing at 545 ℃, preserving heat for 3.5h, rolling a finished product with the processing rate of 40% until the thickness is 0.05mm, then annealing at 360 ℃, preserving heat for 3h, and naturally cooling to room temperature to obtain the product. The product performance index is as follows: the tensile strength can reach 552MPa, and the electric conductivity can reach 84.1 percent IACS.

Claims (4)

1.一种引线框架用高性能铜基合金材料，包括以下按重量比计的材料：铝0.14～0.22wt％、锆0.02～0.05wt％、铂0.01-0.03wt％、钛0.01～0.03wt％及余量铜；该引线框架用高性能铜基合金材料的制备步骤有熔炼铸造、热粗轧、一次时效退火、热精轧、二次时效退火、成品轧制、退火冷却,其特征在于:所述熔炼温度为1240～1400℃，所述热粗轧温度为840～880℃，所述一次时效退火温度为500～650℃、保温3～5h，所述热精轧的变形量在30～50％，所述二次时效退火温度为500～650℃、保温3～5h，所述成品轧制的加工率为30～50％，所述退火冷却时退火温度为360～400℃，退火完成后冷却至室温，得到成品。1. A high-performance copper-based alloy material for a lead frame, comprising the following materials by weight: aluminum 0.14-0.22wt%, zirconium 0.02-0.05wt%, platinum 0.01-0.03wt%, titanium 0.01-0.03wt% and surplus copper; the preparation steps of the high-performance copper-based alloy material for the lead frame include smelting and casting, hot rough rolling, primary aging annealing, hot finishing rolling, secondary aging annealing, finished product rolling, and annealing cooling, and are characterized in that: The smelting temperature is 1240-1400°C, the hot rough rolling temperature is 840-880°C, the primary aging annealing temperature is 500-650°C, the temperature is kept for 3-5 hours, and the deformation amount of the hot finishing rolling is 30～880°C. 50%, the secondary aging annealing temperature is 500-650 ℃, the temperature is kept for 3-5 hours, the processing rate of the finished product rolling is 30-50%, the annealing temperature during the annealing cooling is 360-400 ℃, and the annealing is completed. After cooling to room temperature, the finished product was obtained. 2.根据权利要求1所述的引线框架用高性能铜基合金材料，其特征在于，包括以下按重量比计的材料：铝0.17～0.20wt％、锆0.02～0.04wt％、铂0.01-0.02wt％、钛0.01～0.02wt％及余量铜。2 . The high-performance copper-based alloy material for a lead frame according to claim 1 , comprising the following materials by weight: aluminum 0.17-0.20 wt %, zirconium 0.02-0.04 wt %, platinum 0.01-0.02 wt % wt%, titanium 0.01-0.02wt% and balance copper. 3.根据权利要求1所述的引线框架用高性能铜基合金材料，其特征在于，由以下按重量比计的材料组成：铝0.18wt％、锆0.03wt％、铂0.02wt％、钛0.02wt％及余量铜。3. The high-performance copper-based alloy material for a lead frame according to claim 1, characterized in that it is composed of the following materials by weight: aluminum 0.18wt%, zirconium 0.03wt%, platinum 0.02wt%, titanium 0.02% wt% and balance copper. 4.根据权利要求1所述的引线框架用高性能铜基合金材料，其特征在于:成品轧制时，加工至厚度0.05～0.15mm。4. The high-performance copper-based alloy material for a lead frame according to claim 1, characterized in that: when the finished product is rolled, it is processed to a thickness of 0.05-0.15 mm.
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1161294A (en) * 1997-08-06 1999-03-05 Sumitomo Light Metal Ind Ltd Alumina dispersion strengthened copper alloy and method for producing the same
CN1681960A (en) * 2002-07-16 2005-10-12 霍尼韦尔国际公司 Copper sputtering targets and methods of forming copper sputtering targets
WO2006104152A1 (en) * 2005-03-28 2006-10-05 Sumitomo Metal Industries, Ltd. Copper alloy and process for producing the same
CN1930314A (en) * 2004-03-12 2007-03-14 住友金属工业株式会社 Copper alloy and its manufacturing method
CN102804352A (en) * 2009-06-12 2012-11-28 三菱综合材料株式会社 Wiring layer structure and process for manufacture thereof
CN108602128A (en) * 2016-01-13 2018-09-28 株式会社丰山控股 The method and its Preparation equipment of the copper metal nanometer powder with uniform oxygen passivation layer are prepared by using hot plasma

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1161294A (en) * 1997-08-06 1999-03-05 Sumitomo Light Metal Ind Ltd Alumina dispersion strengthened copper alloy and method for producing the same
CN1681960A (en) * 2002-07-16 2005-10-12 霍尼韦尔国际公司 Copper sputtering targets and methods of forming copper sputtering targets
CN1930314A (en) * 2004-03-12 2007-03-14 住友金属工业株式会社 Copper alloy and its manufacturing method
WO2006104152A1 (en) * 2005-03-28 2006-10-05 Sumitomo Metal Industries, Ltd. Copper alloy and process for producing the same
CN102804352A (en) * 2009-06-12 2012-11-28 三菱综合材料株式会社 Wiring layer structure and process for manufacture thereof
CN108602128A (en) * 2016-01-13 2018-09-28 株式会社丰山控股 The method and its Preparation equipment of the copper metal nanometer powder with uniform oxygen passivation layer are prepared by using hot plasma

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