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CN111868901B - 工具高度调整装置以及具有该装置的芯片部件转印装置 - Google Patents

工具高度调整装置以及具有该装置的芯片部件转印装置 Download PDF

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Publication number
CN111868901B
CN111868901B CN201980019450.6A CN201980019450A CN111868901B CN 111868901 B CN111868901 B CN 111868901B CN 201980019450 A CN201980019450 A CN 201980019450A CN 111868901 B CN111868901 B CN 111868901B
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CN
China
Prior art keywords
tool
transparent plate
chip
holding portion
chip holding
Prior art date
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Active
Application number
CN201980019450.6A
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English (en)
Chinese (zh)
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CN111868901A (zh
Inventor
松本武士
寺田胜美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Engineering Co Ltd
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Toray Engineering Co Ltd
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Publication of CN111868901A publication Critical patent/CN111868901A/zh
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Publication of CN111868901B publication Critical patent/CN111868901B/zh
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Classifications

    • H10P72/0446—
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
    • H10P72/3212—
    • H10P72/53—
    • H10P72/78—
    • H10W72/071—
    • H10W72/0711—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Wire Bonding (AREA)
CN201980019450.6A 2018-03-28 2019-03-18 工具高度调整装置以及具有该装置的芯片部件转印装置 Active CN111868901B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018061143A JP6752250B2 (ja) 2018-03-28 2018-03-28 ツール高さ調整装置およびこれを備えたチップ部品転写装置
JP2018-061143 2018-03-28
PCT/JP2019/011063 WO2019188470A1 (fr) 2018-03-28 2019-03-18 Dispositif de réglage de hauteur d'outil et dispositif de transfert de composant de puce équipé de celui-ci

Publications (2)

Publication Number Publication Date
CN111868901A CN111868901A (zh) 2020-10-30
CN111868901B true CN111868901B (zh) 2024-06-21

Family

ID=68061534

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980019450.6A Active CN111868901B (zh) 2018-03-28 2019-03-18 工具高度调整装置以及具有该装置的芯片部件转印装置

Country Status (4)

Country Link
JP (1) JP6752250B2 (fr)
KR (1) KR102633517B1 (fr)
CN (1) CN111868901B (fr)
WO (1) WO2019188470A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112992736A (zh) * 2021-02-08 2021-06-18 苏州广林达电子科技有限公司 扇出型芯片封装装置以及方法
CN115376960A (zh) * 2021-12-03 2022-11-22 微见智能封装技术(深圳)有限公司 一种识取组件、定位组件、固晶机及固晶方法
JP2024058023A (ja) * 2022-10-14 2024-04-25 東レエンジニアリング株式会社 検査装置およびこれを用いたスタンプ検査装置
WO2024228306A1 (fr) * 2023-05-01 2024-11-07 パナソニックＩｐマネジメント株式会社 Substrat de transfert, procédé de transfert d'élément et dispositif de transfert d'élément

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH707308A1 (de) * 2012-12-05 2014-06-13 Esec Ag Verfahren zum Bestimmen der Höhe einer Dispensdüse über einer Referenzfläche.
WO2015083221A1 (fr) * 2013-12-02 2015-06-11 富士機械製造株式会社 Système de réglage de dispositif de fourniture de puce et gabarit de réglage

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Publication number Priority date Publication date Assignee Title
JPH0645786A (ja) * 1992-07-21 1994-02-18 Tdk Corp 高さ調整手段を備えた部品実装装置
JPH1163932A (ja) * 1997-08-25 1999-03-05 Matsushita Electric Ind Co Ltd ワイヤボンディングにおけるワイヤの高さ検査方法
JP2000283751A (ja) * 1999-03-30 2000-10-13 Matsushita Electric Ind Co Ltd 位置測定装置
JP4383255B2 (ja) * 2004-05-31 2009-12-16 富士機械製造株式会社 電子部品実装方法および装置
JP2008201883A (ja) 2007-02-20 2008-09-04 Nitto Denko Corp 稜状の微細構造を有する粘着部材
JP2009212254A (ja) * 2008-03-04 2009-09-17 Toray Eng Co Ltd チップ搭載方法およびチップ搭載装置
KR101575279B1 (ko) * 2009-03-19 2015-12-10 한화테크윈 주식회사 부품실장기의 레이저 변위센서가 구비된 헤드 어셈블리 및 그 좌표 교정방법
JP2012004143A (ja) * 2010-06-14 2012-01-05 Panasonic Corp 電子部品の実装装置および実装方法
JP2014045011A (ja) * 2012-08-24 2014-03-13 Bondtech Inc 基板支持システム
US9162880B2 (en) 2012-09-07 2015-10-20 LuxVue Technology Corporation Mass transfer tool
JP6272676B2 (ja) * 2013-11-07 2018-01-31 東レエンジニアリング株式会社 ボンディング装置
JP6131473B2 (ja) 2013-12-27 2017-05-24 パナソニックＩｐマネジメント株式会社 電子部品実装方法及び電子部品実装装置
JP2015192029A (ja) 2014-03-28 2015-11-02 日本電気株式会社 電子部品実装装置及び電子部品のピックアップ方法
JP6553489B2 (ja) 2015-11-18 2019-07-31 株式会社Ｆｕｊｉ 部品実装機、および部品実装機のウエハ部品吸着高さ調整方法
JP6712206B2 (ja) * 2016-09-09 2020-06-17 ヤマハ発動機株式会社 基板作業装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH707308A1 (de) * 2012-12-05 2014-06-13 Esec Ag Verfahren zum Bestimmen der Höhe einer Dispensdüse über einer Referenzfläche.
WO2015083221A1 (fr) * 2013-12-02 2015-06-11 富士機械製造株式会社 Système de réglage de dispositif de fourniture de puce et gabarit de réglage

Also Published As

Publication number Publication date
WO2019188470A1 (fr) 2019-10-03
CN111868901A (zh) 2020-10-30
KR102633517B1 (ko) 2024-02-06
JP6752250B2 (ja) 2020-09-09
KR20200136906A (ko) 2020-12-08
JP2019175961A (ja) 2019-10-10

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