CN111832380A - Sensor module, electronic device and assembly method - Google Patents

Abstract

The present application discloses a sensor module, an electronic device, and a method for assembling the sensor module. The sensor module includes a base material structure, a fixing frame, a photoelectric conversion component and an optical path structure component; wherein, the base material structure includes at least one wire arranged in the base material, one end of the wire is connected with the photoelectric conversion component, and the wire is connected to the photoelectric conversion component. The other end is used to connect with the printed circuit board, and the end connected with the photoelectric conversion components and the other end connected with the printed circuit board are arranged on the same side surface of the base material; the fixing frame is arranged on the two ends of the wires of the base material. One side; the photoelectric conversion components are arranged in the fixing frame; the optical path structure components are arranged on the photoelectric conversion components; the fixing frame is filled with protective glue, and the fixing frame and the protective glue connect the base material structure, the photoelectric conversion components and the optical path structure components packaged into one. By adopting the sensor module, the overall height of the component is reduced, and the photoelectric conversion components and metal wires and other components therein are better protected.

Description

Sensor module, electronic device and assembly method

This application claims the priority of the Chinese Patent Application No. 201910300583.2 filed with the State Intellectual Property Office of China on April 15, 2019, the entire contents of which are incorporated herein by reference.

technical field

The present application relates to the technical field of sensor modules, in particular to a sensor module, an electronic device, and an assembling method of the sensor module.

Background technique

Many current electronic devices, such as mobile phones and tablet computers, are equipped with sensor modules, such as fingerprint modules, for collecting and identifying biometric images such as fingerprints of users.

Please refer to FIG. 1 , which is a schematic structural diagram of a general fingerprint module and its associated components. Wherein, the fingerprint module 91 for collecting the fingerprint image of the user includes a base material 911 , a fingerprint sensor 912 , an infrared filter 913 and a molding compound 914 . The fingerprint sensor 912 is disposed on the substrate 911 , the infrared filter 913 is disposed on the fingerprint sensor 912 , and the mold material 914 encapsulates the three into a whole, that is, the fingerprint module 91 is obtained. The lower surface of the mold material 914 is connected to the printed circuit board 93 through the pads 92, so that the electrical signal of the fingerprint sensor 912 can be transmitted to the printed circuit through the wires running through the upper surface of the base material 911 to the lower surface of the base material 911. The circuit board 93, so that the printed circuit board 93 can process these electrical signals, and then identify the fingerprint image.

The above-mentioned installed sensor module and the printed circuit board as a whole can be called an assembly, and the assembly has a relatively large thickness. If it is used in electronic devices that require high thickness, such as ultra-thin mobile phones, the thickness of the assembly will hinder the realization of thin electronic devices. Therefore, the thickness of the existing assembly is relatively large, which results in a relatively large overall thickness or local thickness of the electronic device using the assembly.

In order to solve this problem, the inventor of the present application has previously developed a new sensor module, and the thickness of the assembly composed of the sensor module and the printed circuit board is smaller. However, there is still room for improvement in the packaging method of the sensor module.

SUMMARY OF THE INVENTION

The present application provides a sensor module. When the sensor module and the printed circuit board are installed together, the thickness of the assembly can be reduced, thereby laying a foundation for the realization of ultra-thin electronic equipment, and on this basis, the sensor module The packaging method of the module is improved, so as to better protect the photoelectric conversion components in the sensor module, as well as metal wires such as wires and connecting wires associated with them.

In a first aspect, the present application provides a sensor module, including a substrate structure, a fixing frame, a photoelectric conversion component, and an optical path structure component; wherein,

The base material structure includes at least one wire arranged in the base material, one end of the wire is connected with the photoelectric conversion element, the other end of the wire is used for connecting with the printed circuit board, and the other end of the wire is connected with the photoelectric conversion element. One end connected and the other end connected with the printed circuit board are arranged on the same side surface of the base material;

the fixing frame is arranged on the side where both ends of the wires of the base material are located;

the photoelectric conversion components are arranged in the fixed frame;

The optical path structure assembly is arranged on the photoelectric conversion component;

The fixing frame is filled with protective glue, and the fixing frame and the protective glue encapsulate the base material structure, the photoelectric conversion component and the optical path structure component into one body.

With reference to the first aspect, in a first possible implementation manner of the first aspect, the protective adhesive is silica gel.

In combination with the first aspect and the above possible implementation manners, in a second possible implementation manner of the first aspect, the protective glue is made of a transparent material; and/or the fixing frame is made of a plastic material.

In combination with the first aspect and the above possible implementation manners, in a third possible implementation manner of the first aspect, at least two wires are provided in the base material; wherein,

At least one wire is a first wire, and one end of the first wire is connected to the first side of the photoelectric conversion component;

The second side of the photoelectric conversion component is disposed opposite to the first side, at least one wire is a second wire, and one end of the second wire is connected to the second side.

With reference to the first aspect and the above possible implementation manners, in a fourth possible implementation manner of the first aspect, in the substrate, at least one of the second wires is disposed above the first wires.

In combination with the first aspect and the above possible implementation manners, in a fifth possible implementation manner of the first aspect, in the substrate, a connection between one end and the other end of at least one of the first wires is connected to the One end of the second wire is connected to the other end in parallel.

In combination with the first aspect and the above possible implementation manners, in a sixth possible implementation manner of the first aspect, in the substrate, the connecting lines between one end and the other end of each of the first wires are parallel to each other; and / or,

The connecting lines of one end and the other end of each of the second wires are parallel to each other.

In combination with the first aspect and the above possible implementation manners, in a seventh possible implementation manner of the first aspect, in the substrate, the connection between one end and the other end of each of the first wires, and each The connecting lines of one end and the other end of the second wire are parallel to each other.

In combination with the first aspect and the above possible implementation manners, in an eighth possible implementation manner of the first aspect, when the sensor module is mounted on a printed circuit board, the printed circuit board and the photoelectric conversion components are located in on the same side of the substrate and connected to the other end of the wire.

In combination with the first aspect and the above possible implementation manners, in a ninth possible implementation manner of the first aspect, the printed circuit board is a flexible printed circuit board.

In combination with the first aspect and the above possible implementation manners, in a tenth possible implementation manner of the first aspect, the printed circuit board is connected to the other end of the wire through a pad; the pad is connected to the printed circuit The sum of the heights of the boards is less than or equal to the sum of the heights of the photoelectric conversion components and the optical path structure components.

In combination with the first aspect and the above possible implementation manners, in an eleventh possible implementation manner of the first aspect, the sensor module is applied to an electronic device having a display screen, and the display screen is provided with a pinhole layer , the small hole layer is provided with at least one small hole for small hole imaging, and the sensor module is arranged below the at least one small hole.

In combination with the first aspect and the above possible implementation manners, in a twelfth possible implementation manner of the first aspect, an air layer is spaced between the small hole layer and the optical path structure component of the sensor module.

In combination with the first aspect and the above possible implementation manners, in the thirteenth possible implementation manner of the first aspect, a circle of glue is coated on the upper surface of the fixing frame, and the small hole layer is arranged on the glue, so that the An air layer is formed between the small hole layer and the optical path structure component.

In combination with the first aspect and the above possible implementation manners, in a thirteenth possible implementation manner of the first aspect, the optical path structure component includes an anti-infrared coating, and the anti-infrared coating covers the photoelectric conversion component. superior.

In a second aspect, the present application provides a sensor module, including a photoelectric conversion component and an optical path structure component; wherein,

The back of the photoelectric conversion element is provided with at least one electrical contact point, the at least one electrical contact point is used for connecting with the printed circuit board, and the at least one electrical contact point is connected with the circuit inside the photoelectric conversion element, transmitting the electrical signal output by the photoelectric conversion element to the printed circuit board through the at least one electrical contact point;

The optical path structure assembly is arranged on the photoelectric conversion element.

In combination with the second aspect, in a first possible implementation manner of the second aspect, at least one circuit outlet is provided on the back of the photoelectric conversion component, and the circuit outlet is connected to a circuit inside the photoelectric conversion component, and , the line outlet is connected with the electrical contact point through a conductive line located on the back of the photoelectric conversion element.

With reference to the second aspect and the above possible implementation manners, in a second possible implementation manner of the second aspect, in a second possible implementation manner of the second aspect, the at least one line outlet includes at least one first line outlet and at least one second line outlet, the at least one first line outlet and the at least one second line outlet are located on both sides of the electrical contact point; the electrical contact point includes a first contact point and a second contact point ; The conduction line includes a first conduction line and a second conduction line;

The first wire outlet is connected to the first contact point through the first conductive wire, and the second wire outlet is connected to the second contact point through the second conductive wire.

In combination with the second aspect and the above possible implementation manners, in a third possible implementation manner of the second aspect, the optical path structure component includes an anti-infrared coating, and the anti-infrared coating covers the photoelectric conversion component .

In a third aspect, the present application provides an electronic device, including any sensor module of the first aspect or the second aspect.

In a fourth aspect, the present application provides a method for assembling a sensor module, wherein the sensor module is any sensor module of the first aspect; the method includes the following steps:

The fixing frame and the photoelectric conversion component are respectively fixed on the base material structure, and the optical path structure component is fixed on the photoelectric conversion component; wherein, the photoelectric conversion component and the base material structure one end of the wire in the connection;

A protective glue is filled in the fixing frame, so that the fixing frame and the protective glue encapsulate the base material structure, the photoelectric conversion element and the optical path structure component into one body.

With reference to the fourth aspect, in a first possible implementation manner of the fourth aspect, the method further includes:

A printed circuit board is connected to the other end of the wire in the base material, and the printed circuit board and the other end of the wire are on the same side of the base material.

In a fifth aspect, the present application provides a method for assembling a sensor module, wherein the sensor module is any sensor module of the second aspect; the method includes the following steps:

At least one electrical contact point on the back of the photoelectric conversion element of the sensor module is connected to the printed circuit board.

With reference to the fifth aspect, in a first possible implementation manner of the fifth aspect, the method further includes:

The front surface of the photoelectric conversion element is covered with an anti-infrared coating.

In the above sensor module, the wires in the substrate structure no longer penetrate the upper and lower surfaces of the substrate, and the two ends of the wires are no longer on the upper and lower surfaces of the substrate, but on the same side surface of the substrate. In this way, the photoelectric conversion components respectively connected to both ends of the wires and the printed circuit board can be arranged on the same side of the base material, thereby reducing the overall height of the assembled assembly. Applying the sensor module in this embodiment to an electronic device makes it possible to realize an ultra-thin electronic device. At the same time, the present application improves the packaging method of the sensor module, and adopts a fixing frame and protective glue for packaging, which has various beneficial effects. First, the fixing frame and the protective adhesive can fix the relative positions of the photoelectric conversion components, the optical path structure components and the substrate, which is convenient for the overall application. Second, the fixing frame and the protective glue can isolate the photoelectric conversion components and other components from the outside world, thereby protecting the sensor module and preventing the photoelectric conversion components and other components from being polluted and damaged by substances in the environment, which will affect the sensor module. The normal work of the group. Third, the protective glue can also help the sensor module to dissipate heat during operation. Fourth, because the protective glue is a soft protective glue, it is jelly-like after curing, has a certain elasticity, can play a buffering role, and can better protect the photoelectric conversion components and metal wires in the sensor module. , to prevent these parts from being damaged by external force.

Description of drawings

In order to illustrate the technical solutions of the present application more clearly, the accompanying drawings in the embodiments will be briefly introduced below.

1 is a schematic structural diagram of a fingerprint module in the prior art and its associated components;

2 is a side view of one of the specific implementations of the sensor module and the printed circuit board of the application;

3a is a schematic three-dimensional structural diagram of one of the specific implementations of the sensor module of the present application;

Fig. 3b is a schematic three-dimensional structure diagram of the sensor module shown in Fig. 3a after removing the fixing frame and the protective glue;

4 is a perspective perspective view of one of the specific implementations of the substrate structure of the application;

5a is a schematic three-dimensional structural diagram of the second specific implementation manner of the sensor module of the present application;

Fig. 5b is a schematic three-dimensional structure diagram of the sensor module shown in Fig. 5a after removing the fixing frame and the protective glue;

6 is a perspective perspective view of the second specific implementation manner of the substrate structure of the application;

7 is a perspective perspective view of the third specific implementation manner of the substrate structure of the application;

8 is a side view of one of the specific implementations of the electronic device of the application;

9 is a side view of the third specific implementation manner of the sensor module of the application after being assembled with a printed circuit board;

10a is a schematic three-dimensional structural diagram of the third specific implementation manner of the sensor module of the present application;

FIG. 10b is a schematic three-dimensional structure diagram of the sensor module shown in FIG. 10a after removing the fixing frame and the protective glue;

11 is a side view of the fourth specific implementation of the sensor module of the application after being assembled with a printed circuit board;

12 is a schematic three-dimensional structural diagram of the fourth specific implementation of the sensor module of the present application after being assembled with a printed circuit board;

13 is a perspective perspective view of one of the specific implementations of the photoelectric conversion components of the sensor module in the application;

FIG. 14 is a side view of the second specific implementation manner of the electronic device of the present application.

Description of reference numbers:

FIG. 1 : fingerprint module 91 ; base material 911 ; fingerprint sensor 912 ; infrared filter 913 ; mold material 914 ; pad 92 ;

2 to 14: substrate 1; wire 2; first wire 21; one end 211 of the first wire; the other end 212 of the first wire; the second wire 22; one end 221 of the second wire; One end 222; photoelectric conversion element 3; first side 31; second side 32; back side 33; front side 34; electrical contact point 35; first contact point 351; second contact point 352; first port 361; second port 362; conduction line 37; first conduction line 371; second conduction line 372; internal line 38; optical path structure component 4; anti-infrared coating 41; fixing frame 51; protective glue 52; pad 6; printing Circuit board 7; connecting wire 81; adhesive layers 82, 83; display screen 100; pinhole layer 101; pinhole 1011;

Detailed ways

The embodiments of the present application will be described in detail below.

Referring to FIG. 2 to FIG. 7 , a sensor module is provided in the first embodiment of the present application. The sensor module includes a base material structure, a fixing frame 51 , a photoelectric conversion component 3 and an optical path structure component 4 . The base material structure includes at least one wire 2 arranged in the base material 1 , one end of the wire 2 is connected with the photoelectric conversion component 3 , and the other end of the wire 2 is used for connecting with the printed circuit board 7 and connected with the photoelectric conversion component 3 One end and the other end connected to the printed circuit board 7 are arranged on the same side surface of the base material 1 . The fixing frame 51 is disposed on one side of the base material 1 , which is also the side where the two ends of the wire 2 are located. The photoelectric conversion element 3 is arranged in the fixed frame 51 . The optical path structure assembly 4 is arranged on the photoelectric conversion element 3 . The fixing frame 51 is filled with protective glue 52 , and the fixing frame 51 and the protective glue 52 encapsulate the base material structure, the photoelectric conversion component 3 and the optical path structure component 4 into one body.

In the above-mentioned base material structure, the above-mentioned wires 2 may be arranged inside the base material 1 , and only the wires whose ends are exposed on the surface of the base material 1 may be entirely arranged on the upper surface or the lower surface of the base material 1 . The wires 2 arranged in the base material 1 in the present application may include any of the above-mentioned implementation forms. It should be noted that, the wires 2 arranged in the base material 1 may be arranged in a straight line, and may also be arranged in a curved manner, which is not limited here.

In the above substrate structure, the wires 2 no longer penetrate the upper and lower surfaces of the substrate 1 , and both ends of the wires 2 are no longer on the upper and lower surfaces of the substrate 1 , but on the same side surface of the substrate 1 . When the base material structure is applied, the photoelectric conversion component 3 and the printed circuit board 7 can be arranged on the same side of the base material 1, and one end of the wire 2 is connected with the photoelectric conversion component 3, and the other end of the wire 2 is used. for connection with the printed circuit board 7. Optionally, one end of the wire 2 can be connected to the photoelectric conversion element 3 through the connecting wire 81 . In this way, the electrical signals output by the photoelectric conversion element 3 can be transmitted to the printed circuit board 7 through the wires 2, so that the printed circuit board 7 can process these electrical signals.

The above-mentioned photoelectric conversion device 3 is a device that converts an optical signal into an electrical signal. In this application, image sensors such as CMOS (Complementary Metal-Oxide-Semiconductor), CIS (CMOS Image Sensor), or CCD (Charge-coupled Device) can be used.

The above-mentioned optical path structure component 4 is a component through which light can pass, for example, an infrared filter, an infrared glass, and the like. The optical path structure component can be used to provide the image distance of the pinhole imaging, and/or to control the angle of view through the change of the refractive index, etc.

The above-mentioned fixed frame 51 may be a fixed frame of rigid material, for example, a plastic material or the like.

The above-mentioned protective glue 52 is a soft protective glue, and the protective glue has the ability to encapsulate, and also has a certain elasticity, and has a certain buffering ability of external force. The protective glue is in a jelly-like state after curing. The protective glue used in this application can be the existing protective glue, such as silica gel. Optionally, the protective glue can be made of transparent material.

Both the photoelectric conversion element 3 and the optical path structure assembly 4 are located in the fixed frame 51 . By filling the fixing frame 51 with the soft protective glue 52 , the base material structure, the photoelectric conversion component 3 and the optical path structure component 4 can be packaged into one body. At this time, the top surface of the road structure assembly 4 can be flush with the top surface of the fixing frame 51 , or lower than the top surface of the fixing frame 51 , so that the height of the entire sensor module is not additionally increased.

In the sensor module of the present application, the fixing frame and the protective glue are used for encapsulation, which has various beneficial effects. First, the fixing frame and the protective adhesive can fix the relative positions of the photoelectric conversion component 3, the optical path structure component 4 and the substrate 1, which is convenient for overall application. Second, the fixing frame and the protective glue can isolate the photoelectric conversion components and other components from the outside world, thereby protecting the sensor module and preventing the photoelectric conversion components and other components from being polluted and damaged by substances in the environment, which will affect the sensor module. The normal work of the group. Third, the protective glue can also help the sensor module to dissipate heat during operation. Fourth, because the protective glue is a soft protective glue, it is jelly-like after curing, has a certain elasticity, and can play a buffering role, so it can better protect the photoelectric conversion components and metal wires in the sensor module. parts to avoid damage to these parts due to external force.

The height of the optical path structure component 4 is h1, the height of the photoelectric conversion component 3 is h2, the height of the substrate 1 is h3, and the height of the printed circuit board 7 is h4. According to the original assembly method, the height of the assembly after the four are assembled together is (h1+h2+h3+h4), but using the substrate structure of the present application for assembly, the height of the assembly after the four are assembled together is { h3+max[(h1+h2),h4]}, thereby reducing the overall height of the assembly. The application of this assembly to electronic devices enables the realization of ultra-thin electronic devices.

It should be noted that, during actual assembly, an adhesive layer 82 may also exist between the photoelectric conversion component 3 and the substrate 1 . Similarly, an adhesive layer 83 may also exist between the photoelectric conversion component 3 and the optical path structure component 4 . The adhesive layer 82 can be formed by using an existing adhesive or the like, for example, a water glue, a die attach film (DAF) or the like can be used. Regardless of whether the substrate structure in the prior art or the substrate structure in this embodiment is adopted, the heights of the adhesive layer 82 and the adhesive layer 83 remain unchanged after the assembly is completed. The existence of it does not affect the realization of the beneficial effects of the solution of the present application. Based on this, the overall height of the adhesive layer 82 and the photoelectric conversion component 3 may be regarded as h2, and the overall height of the adhesive layer 83 and the optical path structure component 4 may be regarded as h1, as shown in FIG. 2 .

It should also be noted that, during actual assembly, the printed circuit board 7 and the other end of the wire 2 may be connected through a pad 6 (PAD). The pad 6 can be implemented by using the prior art, for example, a grid array package pad (LGAPAD) and the like can be used. Optionally, as shown in the schematic diagram in FIG. 2, the height of the pad 6 is represented by h5, then the sum of the heights of the pad 6 and the printed circuit board 7 (h4+h5) is less than or equal to the photoelectric conversion component 3 and the optical path. The sum of the heights of structural components 4 (h1+h2). In this case, the height of the assembly in this embodiment is reduced by (h4+h5) compared to the existing assembly. When (h4+h5)>(h1+h2), the overall height of the assembly is (h3+h4+h5), which is reduced by (h1+h2) compared with the existing assembly.

In one example, the height h3 of the substrate 1 is 150 μm, the height h2 of the photoelectric conversion component 3 is 170 μm, the height h1 of the optical path structure component 4 is 130 μm, the height h4 of the printed circuit board 7 is 250 μm, and the height of the pad 6 is 250 μm. h5 is 30-50 μm. If the substrate and the corresponding assembly method in the prior art are used, the height of the whole assembly after the sensor module and the printed circuit board are assembled is 730-750 μm. However, if the substrate structure and the corresponding assembly method in the present application are adopted, the overall height of the assembly is 450 μm, which is reduced by 280-300 μm. The height h2 of the above-mentioned photoelectric conversion component 3 includes the adhesive layer 82 between the substrate 1 and the photoelectric conversion component 3, and the height of the above-mentioned optical path structure component 4 includes the distance between the optical path structure component 4 and the photoelectric conversion component 3. Adhesive layer 83 in between.

In another example, the height h3 of the substrate 1 is 50 μm, the height h2 of the photoelectric conversion component 3 is 80 μm, the height h1 of the optical path structure component 4 is 30 μm, the height h4 of the printed circuit board 7 is 28 μm, and the height of the pad 6 is 28 μm. The height h5 is 10 μm. If the substrate and the corresponding assembly method in the prior art are used, the overall height of the assembly after the sensor module and the printed circuit board are assembled is 198 μm. However, if the substrate structure and the corresponding assembly method in the present application are adopted, the overall height of the assembly is 160 μm, which is reduced by 38 μm.

Please refer to FIG. 3 a , FIG. 3 b and FIG. 4 , optionally, at least two wires 2 may be provided in the base material 1 . Wherein, at least one wire 2 is a first wire 21 , and one end 211 of the first wire is connected to the first side 31 of the photoelectric conversion element 3 . The second side 32 of the photoelectric conversion element 3 is disposed opposite to the first side 31 . At least one wire 2 is a second wire 22 , and one end 221 of the second wire is connected to the second side 32 .

When a plurality of wires 2 are arranged in the base material 1, one end (ie, 211 and 221) of the plurality of wires 2 is arranged on both sides of the photoelectric conversion component 3, so that the arrangement of the plurality of wires 2 is more reasonable. Facilitates production and subsequent assembly of substrate structures.

Optionally, referring to FIG. 3b and FIG. 4 , when the wires 2 are arranged inside the base material 1, in the base material 1, at least one second wire 22 is arranged above the first wires 21, so that a plurality of The arrangement of wires 2 is more reasonable.

It should be noted that when the wire 2 is arranged inside the base material 1, in order to make the two ends of the first wire 21 and the two ends of the second wire 22 be on the same surface of the base material 1, the first wire 21 and the There may be local curved line segments near the surface of the second wire 22 close to the substrate 1 . In this embodiment, the second conducting wire 22 is disposed above the first conducting wire 21 , which mainly means that the horizontal section of the second conducting wire 22 is disposed above the horizontal section of the first conducting wire 21 .

It should also be noted that in the present application, the first feature is "above", "above" and "above" the second feature, including the first feature being directly above and obliquely above the second feature, or merely indicating the level of the first feature The height is higher than the second feature. The first feature is "below", "below" and "below" the second feature, including the first feature being directly below and diagonally below the second feature, or simply indicating that the first feature is level below the second feature.

Optionally, referring to FIG. 4 , when the wire 2 is arranged inside the substrate 1 and only two ends are exposed on the surface of the substrate 1 , the connection between one end 211 of the at least one first wire and the other end 212 of the first wire is The line L1 is parallel to or overlapping with the connecting line L2 between one end 221 of the at least one second wire and the other end 222 of the second wire. When at least one L1 and at least one L2 overlap, it indicates that at least one second wire 22 is directly above the first wire 21 .

It should be understood that in FIGS. 3 a to 7 , in order to avoid the situation where the structure is too messy due to the fact that the multiple first conducting wires 21 and the multiple second conducting wires 22 are all drawn in the drawings, only one first conducting wire 21 is schematically drawn. and a second wire 22. In fact, there is a first wire between one end 211 of each pair of first wires and the other end 212 of the first wire; there is a first wire between one end 221 of each pair of second wires and the other end 222 of the second wire Two wires.

Optionally, referring to FIG. 7 , when the entire wire 2 is disposed on the surface of the substrate 1 , the connection line L1 between one end 211 of the at least one first wire and the other end 212 of the first wire, and the connection line L1 of the at least one second wire The connection line L2 between one end 221 and the other end 222 of the second wire is parallel.

Please refer to FIG. 3b , FIG. 4 and FIG. 7 , optionally, when a plurality of first wires 21 are provided in the substrate 1 , the connection line L1 between one end 211 of each first wire and the other end 212 of the first wire are parallel to each other. At this time, the heights of the plurality of first wires 21 in the base material 1 may be the same or different, which is not limited in the present application.

Optionally, when a plurality of second wires 22 are provided in the base material 1, the connection line L2 between one end 221 of each second wire and the other end 222 of the second wire is parallel to each other. At this time, the heights of the plurality of second wires 22 in the base material 1 may be the same or different, which is not limited in this application.

The above-mentioned wire arrangements can also be combined with each other. In different application scenarios, different wire arrangements can be set for the base material structure to facilitate the production and subsequent assembly of the base material structure.

Optionally, referring to FIGS. 5a to 7 , when a plurality of first wires 21 and a plurality of second wires 22 are provided in the base material 1, each L1 and each L2 may also be parallel to each other, that is, all L1 and all L2 are parallel to each other. At this time, since the first wires 21 and the second wires 22 are already staggered in the horizontal position in the base material 1, the heights of the first wires 21 and the second wires 22 in the base material 1 may be the same, or It can be different, and the arrangement of the wires can be specifically set according to the different actual application scenarios or the convenience of the processing of the substrate structure.

Optionally, when a plurality of first wires 21 and a plurality of second wires 22 are provided in the base material 1, the first wires 21 and the second wires 22 may be staggered in the horizontal position, as shown in FIG. 5a to FIG. 7 . Show.

In addition, the first wires 21 and the second wires 22 can also be arranged in sub-areas, that is, all the first wires 21 are arranged in one horizontal area, and all the second wires 22 are arranged in another horizontal area.

Optionally, the above-mentioned printed circuit board 7 is a rigid printed circuit board or a flexible printed circuit board (Flexible Printed Circuit, FPC). The flexible printed circuit board is soft and thin, so that the sum of the heights of the printed circuit board and the pads can be kept below and below the heights of the photoelectric conversion components and the optical path structure components.

Optionally, referring to FIG. 8 , the above sensor module can be applied to an electronic device having a display screen 100 , the display screen 100 is provided with a pinhole layer 101 , and at least one hole for pinholes is provided in the pinhole layer 101 In the small hole 1011 for imaging, the sensor module is arranged below at least one small hole 1011 . In this way, the light above the display screen 100 passes through the small hole 1011 and passes through the optical path structure component 4 , and forms an image spot on the photoelectric conversion component 3 according to the principle of small hole imaging. The photoelectric conversion component 3 outputs the image spots in the form of electrical signals, so as to facilitate subsequent processing of these electrical signals to form images, thereby completing the process of image acquisition. The above sensor module is applied in electronic equipment, and can be used to collect biometric images such as fingerprints, palm prints, and faces.

Optionally, a light-transmitting portion 1021 is correspondingly provided above the small hole 1011 in the above-mentioned small hole layer 101, so that light can pass through other structures above the small hole layer 101, such as a liquid crystal layer, an optical film, etc., and then pass through the small hole layer 101. Hole 1011 to reach the sensor module. It should be noted that the sizes of the light-transmitting portion 1021 and the small holes 1011 may be the same or different, which are not limited in this application.

The aperture layer 101 and the optical path structure component 4 may be closely attached, or may be separated by a thin air layer, which is not limited in this application. When installing the sensor module and the display screen of the above structure, a circle of glue (not shown in the figure) may be coated on the upper surface of the fixing frame 51, and air is left in the glue circle. The pinhole layer is disposed on the glue, so that an air layer is formed between the pinhole layer 101 and the optical path structure component 4 , and further, the pinhole layer 101 and the optical path structure component 4 are spaced apart. When an air layer is spaced between the small hole layer 101 and the optical path structure component 4, some stray light in the light passing through the small hole 1011 can be eliminated due to the change of the refractive index, so as to prevent the stray light from affecting the image acquisition.

Optionally, in the above sensor module, other commonly used components may also be provided on the substrate 1 . For example, referring to FIG. 8 , a capacitor 11 is also provided on the substrate 1 . For another example, the substrate 1 is further provided with a stress balance member 12 , and the material of the stress balance member 12 may be the same as or similar to that of the photoelectric conversion element 3 . During processing and installation, the sensor module may be cut, or in a state of cooling or cooling. At this time, the interconnected photoelectric conversion components 3 and the substrate 1 are easily deformed to generate stress, and the stress The balance member 12 can balance the stress between the photoelectric conversion element 3 and the substrate 1 . These two components are packaged together with the base material structure, the photoelectric conversion component 3 and the optical path structure component 4 by the fixing frame 51 and the protective glue 52 as a whole.

As mentioned above, the above-mentioned optical path structure component 4 is a component through which light can pass. Referring to FIGS. 9 to 10b, optionally, the optical path structure component 4 may include an anti-infrared coating (IR cut coating) 41, and the anti-infrared coating 41 may be covered on the photoelectric conversion component 3 by means of evaporation or the like, that is, It covers the surface of the front surface 34 of the photoelectric conversion element 3 .

The above-mentioned anti-infrared coating 41 can be formed by using existing anti-infrared materials, and is formed by processes such as evaporation, spraying, etc. The present application does not limit the material and forming process of the anti-infrared coating.

The thickness of the anti-infrared coating 41 itself is very small, generally from a few tenths of a micron to two microns, and the anti-infrared coating 41 can be attached to the photoelectric conversion component 3 without being fixed by an adhesive layer. Therefore, by adopting the above solution of the anti-infrared coating, the thickness of the optical path structure component can be reduced. Suitably, the heights of the fixing frame 51 and the protective glue 52 can be correspondingly reduced, so that they remain flush with the anti-infrared coating 41 , or slightly lower than the anti-infrared coating 41 . In this way, the thickness of the sensor module and the entire assembly can be further reduced.

In one example, the height h3 of the substrate 1 is 50 μm, the height h2 of the photoelectric conversion element 3 is 80 μm, the height h6 of the anti-infrared coating 41 is 1 μm, the height of the printed circuit board 7 is 28 μm, and the height of the pad 6 is 28 μm. h5 is 10 μm. In this way, the overall height of the assembled component is 131 μm, which is further reduced by about 30 μm compared with the aforementioned example of 160 μm.

It should be noted that, the optical path structure component may only include an anti-infrared coating, or may include other possible components. When the optical path structure component only includes the anti-infrared coating, since the thickness of the anti-infrared coating itself is very small, it is not enough to provide the image distance for the imaging of the pinhole. To this end, in an implementation manner, a sensor module or other possible components or components in an electronic device may be used to provide an image distance for pinhole imaging.

Referring to FIG. 8 , in a second embodiment of the present application, an electronic device is provided, and the electronic device includes any one of the sensor modules in the foregoing first embodiment. Optionally, the electronic device may further include a display screen 100, the display screen 100 is provided with a pinhole layer 101, the pinhole layer 101 is provided with one or more pinholes 1011 for pinhole imaging, and the sensor module is provided with below the one or more small holes 1011 . In this way, the light can pass through the small hole 1011, reach the sensor module, and be converted into an electrical signal by the sensor module.

The electronic device may further include a printed circuit board 7 connected to the other ends of the wires in the substrate 1 (eg, the other end 212 of the first wire and the other end 222 of the second wire), and the printed circuit board 7 It is on the same side of the substrate 1 as the other ends of the wires (eg, the other end 212 of the first wire and the other end 222 of the second wire). That is to say, the printed circuit board 7 is located on the same side of the base material 1 as the photoelectric conversion component 3 and the optical path structure component 4 .

Since the electronic device includes any of the aforementioned sensor modules, it accordingly has the beneficial effects of the sensor module, which will not be repeated here.

In a third embodiment of the present application, a method for assembling a sensor module is provided. The sensor module here is any one of the sensor modules in the foregoing first embodiment. The installation method includes the following steps:

S100: Fix the fixing frame and the photoelectric conversion component on the base material structure respectively, and fix the optical path structure component on the photoelectric conversion component; wherein, the photoelectric conversion component and the base One end of the wire in the material structure is connected;

S200: Filling protective glue in the fixing frame, so that the fixing frame and the protective glue encapsulate the base material structure, the photoelectric conversion component and the optical path structure component into one body.

For the above-mentioned sensor module and printed circuit board, reference may be made to the relevant descriptions in the first embodiment, which will not be repeated here.

Using the above sensor module assembly method, the base material 1 , the fixing frame 51 , the photoelectric conversion component 3 and the optical path structure component 4 of the sensor module can be installed and fixed first, and then the fixing frame 51 is filled with the protective glue 52 , thereby These parts are assembled into a whole for easy industrial installation and use.

In addition, the method may further include the following steps:

S300: Connect the printed circuit board to the other end of the wire in the base material, and the printed circuit board and the other end of the wire are on the same side of the base material.

Through the above method, the sensor module and the printed circuit board can be conveniently installed together, which facilitates the realization of industrialized installation. After installation, the sensor module and the printed circuit board can be regarded as a whole, that is, an assembly. When it is applied to an electronic device, the assembly is integrally installed in the electronic device, and the installation process is also very convenient. Since the overall height of the assembled component after installation is greatly reduced compared with the prior art, this also lays a foundation for realizing ultra-thin electronic devices.

In order to further reduce the overall thickness of the assembly, referring to FIGS. 11 to 13 , another sensor module is provided in the fourth embodiment of the present application. The sensor module includes a photoelectric conversion component 3 and an optical path structure component; wherein, the back surface 33 of the photoelectric conversion component 3 is provided with at least one electrical contact point 35 . These electrical contacts 35 are connected to lines 38 inside the photoelectric conversion element 3 . When the sensor module and the printed circuit board 7 are assembled together, the printed circuit board 7 is connected to the photoelectric conversion element 3 through the electrical contact points 35, so that the electrical signal output by the photoelectric conversion element 3 can be transmitted to the printed circuit board through the electrical contact point 35. circuit board 7, so that the printed circuit board 7 can process these electrical signals. The optical path structure component is arranged on the photoelectric conversion element 3 .

For the above-mentioned optical path structure components, reference may be made to the relevant description in the first embodiment, and details are not repeated here. Optionally, the optical path structure component may include an anti-infrared coating 41, and the anti-infrared coating 41 is covered on the photoelectric conversion component 3, that is, on the surface of the front surface 34 of the photoelectric conversion component 3, thereby reducing the sensor module and the whole. The thickness of the assembly.

As described in the first embodiment, the above-mentioned photoelectric conversion component 3 is a component that converts optical signals into electrical signals, and image sensors such as CMOS, CIS, or CCD can be used in this application.

For the general photoelectric conversion components 3, for the convenience of wiring, the connecting lines are generally drawn from the front 34 or the side of the photoelectric conversion components 3 to connect with other components in the sensor module, as shown in Figures 3b and 10b. Show. However, in this embodiment, in order to reduce the overall thickness of the assembly, the base material structure is omitted, and the fixing frame and protective glue that encapsulate the photoelectric conversion component 3 and the optical path structure component into one are omitted. At the same time, by improving the structure of the photoelectric conversion element 3, that is, setting the electrical contact point 35 on the back surface 33 of the photoelectric conversion element 3, and connecting it with the circuit 38 inside the photoelectric conversion element 3, so that the photoelectric conversion element 3 A direct connection to the printed circuit board 7 is possible instead of an indirect connection via wires inside the substrate structure. Since the base material structure and the adhesive layer are omitted, the overall thickness of the sensor module in this embodiment is smaller than that in the prior art.

It should be noted that, during the actual assembly, the electrical contact point 35 and the printed circuit board 7 may be electrically connected through pads, or the photoelectric conversion component 3 and the printed circuit board 7 may also be connected through an adhesive layer. In order to make the electrical contact point 35 of the photoelectric conversion element 3 electrically connect with the printed circuit board 7 .

Referring to FIG. 11 , the thickness of the anti-infrared coating 41 is h6. When the optical path structure component only includes the anti-infrared coating 41, the thickness of the optical path structure component is h6. The height of the photoelectric conversion component 3 is h2, the height of the printed circuit board 7 is h4, and the height of the pad 6 is h5. Then, the height of the assembled parts is (h6+h2+h4+h5), and the thickness is smaller than that of the assembled parts in the prior art. The application of this assembly to electronic devices enables the realization of ultra-thin electronic devices. In addition, since the thickness of the base material structure is generally greater than the thicknesses of the printed circuit board 7 and the pads 6 , the overall thickness of the sensor module in this embodiment is also smaller than that of the first embodiment.

In one example, the height h6 of the anti-infrared coating 41 is 1 μm, the height h2 of the photoelectric conversion element 3 is 80 μm, the height h4 of the printed circuit board 7 is 28 μm, and the height h5 of the pad 6 is 10 μm. Then, the overall height of the assembled component is 119 μm, which is reduced by about 80 μm compared with 198 μm in the prior art, and further reduced by 12 μm compared with the aforementioned example of 131 μm.

Please refer to FIG. 13 , optionally, at least one line outlet is provided on the back surface 33 of the photoelectric conversion element 3 , the line outlet is connected to the line 38 inside the photoelectric conversion element 3 , and the line outlet is connected to the electrical contact point 35 is connected through a conductive line 37 located on the back surface 33 of the photoelectric conversion element 3 . The conduction line 37 of the back surface 33 of the photoelectric conversion component 3 may be a circuit or the like provided on the surface of the back surface 33 , and its thickness is generally negligible.

The above-mentioned line outlet has the function of connecting the line 38 inside the photoelectric conversion element 3 and the external conduction line 37 . In actual implementation, different forms of holes such as via holes, through holes, through holes or blind holes can be opened on the back surface 33 of the photoelectric conversion component 3 . These holes can be used as channels so that the lines 38 inside the photoelectric conversion element 3 can pass through the holes to connect with the external conductive lines 37 , or the internal lines 38 and the external conductive lines 37 can be connected in the holes.

All the lines 38 inside the photoelectric conversion element 3 are directly connected to the electrical contact points 35 , and the design requirements for the lines 38 inside the photoelectric conversion element 3 are relatively high. Through the above-mentioned conductive lines 37 on the back surface 33 of the photoelectric conversion element 3, part of the circuits that originally need to be designed inside the photoelectric conversion element 3 can be moved to the outside of the photoelectric conversion element 3, which is more convenient for circuit design.

Optionally, referring to FIG. 13 , in an implementation manner, the above-mentioned line outlet may include at least one first line outlet 361 and at least one second line outlet 362 . The first wire outlet 361 and the second wire outlet 362 are located on both sides of the electrical contact point 35 . The electrical contacts 35 include a first contact 351 and a second contact 352 . The conduction line 37 includes a first conduction line 371 and a second conduction line 372 . The first wire outlet 361 is connected to the first contact point 351 through the first conductive wire 371 , and the second wire outlet 362 is connected to the second contact point 352 through the second conductive wire 372 .

By arranging the circuit outlet, the conducting circuit and the electrical contact point, the arrangement of the internal circuit of the photoelectric conversion element 3 is facilitated, and at the same time, the design, industrial production and subsequent assembly of the photoelectric conversion element 3 are also facilitated.

Referring to FIG. 14 , in a fifth embodiment of the present application, an electronic device is provided, and the electronic device includes any one of the sensor modules in the foregoing fourth embodiment. Optionally, the electronic device may further include a display screen 100, the display screen 100 is provided with a pinhole layer 101, the pinhole layer 101 is provided with one or more pinholes 1011 for pinhole imaging, and the sensor module is provided with below the one or more small holes 1011 . In this way, the light can pass through the small hole 1011, reach the sensor module, and be converted into an electrical signal by the sensor module. Optionally, the electronic device may further include a printed circuit board 7 , and the printed circuit board 7 is connected to the electrical contact points 35 of the photoelectric conversion element 3 .

Since the electronic device includes any one of the sensor modules in the fourth embodiment, it accordingly has the beneficial effects of the aforementioned sensor modules, which will not be repeated here.

In a sixth embodiment of the present application, a method for assembling a sensor module is provided. The sensor module here is any one of the sensor modules in the foregoing fourth embodiment. The installation method includes the following steps:

S400: Connect at least one electrical contact point on the back of the photoelectric conversion element of the sensor module to a printed circuit board.

In addition, the method may further include the following steps:

S500: Cover the front surface of the photoelectric conversion element with an anti-infrared coating.

For the above-mentioned sensor module, printed circuit board, etc., reference may be made to the relevant description in the fourth embodiment, which will not be repeated here.

Through the above method, the sensor module and the printed circuit board can be conveniently installed together, which facilitates the realization of industrialized installation. After installation, the sensor module and the printed circuit board can be regarded as a whole, that is, an assembly. When it is applied to an electronic device, the assembly is integrally installed in the electronic device, and the installation process is also very convenient. Since the overall height of the assembled component after installation is greatly reduced compared with the prior art, this also lays a foundation for realizing ultra-thin electronic devices.

Unless otherwise specified, "plurality" in this specification refers to two or more. In the embodiments of the present application, words such as "first" and "second" are used to distinguish the same items or similar items with substantially the same functions and functions. Those skilled in the art can understand that the words "first", "second" and the like do not limit the quantity and execution order, and the words "first", "second" and the like are not necessarily different.

It should be understood that in the description of this application, the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer" The orientation or positional relationship indicated by etc. is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation. , so it cannot be construed as a limitation on this application.

It should be understood that, in various embodiments of the present application, the execution order of each step should be determined by its function and internal logic, and the size of the sequence number of each step does not mean the sequence of execution, and does not limit the implementation process of the embodiment. For example, the step of S400 in the foregoing sixth embodiment may be performed before or after the step of S500, which is not limited in this application.

It should be understood that the same and similar parts among the various embodiments in this specification may refer to each other. In particular, for the embodiments of the electronic device and the assembling method, since they are basically similar to the embodiments of the sensor module, the description is relatively simple, and for relevant details, please refer to the descriptions in the method embodiments. The embodiments of the present invention described above do not limit the protection scope of the present invention.

Claims (21)

1. A sensor module, characterized in that, comprising a base material structure, a fixed frame, a photoelectric conversion element and an optical path structure assembly; wherein, The base material structure includes at least one wire arranged in the base material, one end of the wire is connected with the photoelectric conversion element, the other end of the wire is used for connecting with the printed circuit board, and the other end of the wire is connected with the photoelectric conversion element. One end connected and the other end connected with the printed circuit board are arranged on the same side surface of the base material; the fixing frame is arranged on the side where both ends of the wires of the base material are located; the photoelectric conversion components are arranged in the fixed frame; The optical path structure assembly is arranged on the photoelectric conversion component; The fixing frame is filled with protective glue, and the fixing frame and the protective glue encapsulate the base material structure, the photoelectric conversion component and the optical path structure component into one body. 2 . The sensor module according to claim 1 , wherein the protective glue is silica gel. 3 . 3 . The sensor module according to claim 1 , wherein the protective glue is made of transparent material; and/or the fixing frame is made of plastic material. 4 . 4 . The sensor module according to claim 1 , wherein at least two wires are provided in the base material; wherein, at least one wire is a first wire, and one end of the first wire is connected to the The first side of the photoelectric conversion component is connected; the second side of the photoelectric conversion component is arranged opposite to the first side, at least one wire is a second wire, and one end of the second wire is connected to the second wire. side connection. 5 . The sensor module according to claim 4 , wherein, in the base material, at least one of the second wires is disposed above the first wires; or, 5 . In the base material, the connection line between one end and the other end of at least one first wire is parallel to the connection line between one end and the other end of the second wire; or, In the base material, the connecting lines between one end and the other end of each of the first wires are parallel to each other; or, The connecting lines of one end and the other end of each of the second wires are parallel to each other; or, In the base material, the connecting line between one end and the other end of each of the first wires and the connecting line between one end and the other end of each of the second wires are parallel to each other. 6 . The sensor module according to claim 1 , wherein when the sensor module is mounted on a printed circuit board, the printed circuit board and the photoelectric conversion component are located on the same side of the substrate. 7 . , and connected to the other end of the wire. 7. The sensor module according to claim 6, wherein the printed circuit board is a flexible printed circuit board. 8 . The sensor module according to claim 6 , wherein the printed circuit board is connected to the other end of the wire through a pad; the sum of the heights of the pad and the printed circuit board is less than 8 . or equal to the sum of the heights of the photoelectric conversion components and the optical path structure components. 9 . The sensor module according to claim 1 , wherein the sensor module is applied to an electronic device with a display screen, and the display screen is provided with a pinhole layer, and the The pinhole layer is provided with at least one pinhole for pinhole imaging, and the sensor module is arranged under the at least one pinhole. 10 . The sensor module according to claim 9 , wherein an air layer is spaced between the small hole layer and the optical path structure component of the sensor module. 11 . 11 . The sensor module according to claim 10 , wherein a circle of glue is coated on the upper surface of the fixing frame, and the small hole layer is arranged on the glue, so that the small hole layer and the optical path structure are formed. 12 . An air layer is formed between the components. 12 . The sensor module according to claim 1 , wherein the optical path structure component comprises an anti-infrared coating, and the anti-infrared coating covers the photoelectric conversion component. 13 . 13. A sensor module, characterized in that it comprises a photoelectric conversion component and an optical path structure component; wherein, The back of the photoelectric conversion element is provided with at least one electrical contact point, the at least one electrical contact point is used for connecting with the printed circuit board, and the at least one electrical contact point is connected with the circuit inside the photoelectric conversion element, transmitting the electrical signal output by the photoelectric conversion element to the printed circuit board through the at least one electrical contact point; The optical path structure assembly is arranged on the photoelectric conversion element. 14 . The sensor module according to claim 13 , wherein at least one circuit outlet is provided on the back of the photoelectric conversion component, and the circuit outlet is connected to a circuit inside the photoelectric conversion component, and, 14 . The line outlet is connected to the electrical contact point through a conductive line located on the back of the photoelectric conversion element. 15. The sensor module of claim 14, wherein the at least one line outlet comprises at least one first line outlet and at least one second line outlet, the at least one first line outlet being connected to the at least one line outlet A second line outlet is located on both sides of the electrical contact point; the electrical contact point includes a first contact point and a second contact point; the conduction line includes a first conduction line and a second conduction line; The first wire outlet is connected to the first contact point through the first conductive wire, and the second wire outlet is connected to the second contact point through the second conductive wire. 16 . The sensor module according to claim 13 , wherein the optical path structure component comprises an anti-infrared coating, and the anti-infrared coating covers the photoelectric conversion component. 17 . 17. An electronic device, comprising the sensor module according to any one of claims 1-16. 18. A method for assembling a sensor module, wherein the sensor module is the sensor module according to any one of claims 1-12; the method comprises the following steps: The fixing frame and the photoelectric conversion component are respectively fixed on the base material structure, and the optical path structure component is fixed on the photoelectric conversion component; wherein, the photoelectric conversion component and the base material structure one end of the wire in the connection; A protective glue is filled in the fixing frame, so that the fixing frame and the protective glue encapsulate the base material structure, the photoelectric conversion element and the optical path structure component into one body. 19. The method of claim 18, further comprising: A printed circuit board is connected to the other end of the wire in the base material, and the printed circuit board and the other end of the wire are on the same side of the base material. 20. A method for assembling a sensor module, wherein the sensor module is the sensor module according to any one of claims 13-16; the method comprises the following steps: At least one electrical contact point on the back of the photoelectric conversion element of the sensor module is connected to the printed circuit board. 21. The method of claim 20, wherein the method further comprises: The front surface of the photoelectric conversion element is covered with an anti-infrared coating.

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