CN111830399A - A remote control PCB function test equipment - Google Patents
A remote control PCB function test equipment Download PDFInfo
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Abstract
本发明公开了一种遥控器PCB功能测试设备,包括蓝牙中央控制模块、切换模块以及自动化测试单元,所述切换模块与蓝牙中央控制模块电性连接,每一个自动化测试单元均与切换模块连接,所述自动化测试单元包括测试模块、接口模块以及遥控器PCBA,遥控器PCBA插接在接口模块上,所述测试模块用于根据蓝牙中央控制模块的控制,实现对遥控器PCBA的自动化测试,所述测试模块还与切换模块电性连接,蓝牙中央控制模块用于对不同的切换模块进行通电或断电,依次实现多个遥控器PCBA的测试,本发明支持整版拼版PCB功能的测试,测试结果显示直观,可以大大降低出现漏测或者误测的可能性,有利于下一道工序正常进行。
The invention discloses a remote control PCB function test equipment, comprising a bluetooth central control module, a switching module and an automatic testing unit, the switching module is electrically connected with the bluetooth central control module, and each automatic testing unit is connected with the switching module, The automated test unit includes a test module, an interface module and a remote control PCBA, the remote control PCBA is plugged on the interface module, and the test module is used to realize the automated test of the remote control PCBA according to the control of the Bluetooth central control module, so the The test module is also electrically connected with the switching module, and the bluetooth central control module is used to power on or power off different switching modules, so as to realize the testing of multiple remote control PCBAs in turn. The results are displayed intuitively, which can greatly reduce the possibility of missed detection or false detection, which is conducive to the normal operation of the next process.
Description
技术领域technical field
本发明涉及遥控器测试技术领域,具体来说,涉及一种遥控器PCB功能测试设备。The invention relates to the technical field of remote control testing, in particular to a remote control PCB function testing device.
背景技术Background technique
现有技术中,遥控器PCB功能的正常与否,一般都是人工手动测试,而且每次只能测试一个遥控器PCB功能是否正常,不同的人测试效率不一致,耗费时间较长,而且人工测试可能存在漏测、误测等可能性,会导致每个遥控PCBA测试结果不一致,得到的数据还要进行长时间分析才能得到测试结果。In the prior art, whether the function of the remote control PCB is normal or not is generally tested manually, and only one remote control PCB can be tested for normal function at a time. The test efficiency of different people is inconsistent, it takes a long time, and manual testing There may be the possibility of missed test, false test, etc., which will lead to inconsistent test results of each remote control PCBA, and the obtained data needs to be analyzed for a long time before the test results can be obtained.
发明内容SUMMARY OF THE INVENTION
为了克服现有技术的不足,本发明提供了一种遥控器PCB功能测试设备,可以测试整版拼版PCB功能是否正常。In order to overcome the deficiencies of the prior art, the present invention provides a remote control PCB function test device, which can test whether the function of the full-page imposition PCB is normal.
本发明解决其技术问题所采用的技术方案是:一种遥控器PCB功能测试设备,其改进之处在于,包括蓝牙中央控制模块、切换模块以及多个自动化测试单元,所述切换模块与蓝牙中央控制模块电性连接,每一个自动化测试单元均与切换模块连接;The technical solution adopted by the present invention to solve the technical problem is: a remote control PCB function test equipment, the improvement of which is that it includes a bluetooth central control module, a switching module and a plurality of automatic test units, and the switching module is connected with the bluetooth central control module. The control module is electrically connected, and each automated test unit is connected to the switching module;
所述自动化测试单元包括测试模块、接口模块、提示模块以及遥控器PCBA,所述提示模块与测试模块连接,遥控器PCBA插接在接口模块上,测试模块用于根据蓝牙中央控制模块的控制,实现对遥控器PCBA的自动化测试,所述的测试模块还与切换模块电性连接,蓝牙中央控制模块用于对不同的切换模块进行通电或断电,依次实现多个遥控器PCBA的测试。The automated test unit includes a test module, an interface module, a prompt module and a remote control PCBA, the prompt module is connected to the test module, the remote control PCBA is plugged on the interface module, and the test module is used for control according to the bluetooth central control module, To realize the automatic test of the remote control PCBA, the test module is also electrically connected with the switching module, and the bluetooth central control module is used to power on or power off different switching modules, so as to realize the test of multiple remote control PCBAs in turn.
作为上述技术方案的改进,所述测试模块包括芯片UK1和芯片UZ1,所述芯片UZ1的PB0、PB1管脚分别与芯片UK1的IN1、IN2管脚连接,所述芯片UZ1的PB4、PB5、PB6、PB7管脚均与测试模块连接,所述芯片UK1的COM1、COM2、NO1、NO2的管脚均与接口模块连接。As an improvement of the above technical solution, the test module includes a chip UK1 and a chip UZ1, the PB0 and PB1 pins of the chip UZ1 are respectively connected to the IN1 and IN2 pins of the chip UK1, and the PB4, PB5 and PB6 of the chip UZ1 The pins of PB7 and PB7 are all connected with the test module, and the pins of COM1, COM2, NO1 and NO2 of the chip UK1 are all connected with the interface module.
作为上述技术方案的改进,所述测试模块还包括芯片UK2,所述芯片UK2的IN1、IN2管脚分别与芯片UZ1的PB2、PB3管脚连接,所述芯片UK2的NO1、NO2管脚均与接口模块连接。As an improvement of the above technical solution, the test module further includes a chip UK2, the IN1 and IN2 pins of the chip UK2 are respectively connected to the PB2 and PB3 pins of the chip UZ1, and the NO1 and NO2 pins of the chip UK2 are both connected to the PB2 and PB3 pins of the chip UZ1. Interface module connection.
作为上述技术方案的改进,所述蓝牙中央控制模块包括芯片U1,所述芯片U1的VCCBAT管脚连接有电源模块,所述芯片U1的P11、P10、P32、P31、P07、P06、P04、P02、P01、P00管脚均与切换模块连接,所述芯片U1的XO管脚和X1管脚均连接有晶振模块。As an improvement of the above technical solution, the bluetooth central control module includes a chip U1, the VCCBAT pin of the chip U1 is connected with a power module, and the P11, P10, P32, P31, P07, P06, P04, P02 of the chip U1 The pins , P01 and P00 are all connected with the switching module, and the XO pin and the X1 pin of the chip U1 are both connected with a crystal oscillator module.
作为上述技术方案的改进,所述芯片U1的ANT管脚连接有无线射频模块,所述无线射频模块支持与无线接收设备连接,所述无线接收设备包括手机、电脑终端或者其他支持无线信号接收端;As an improvement of the above technical solution, the ANT pin of the chip U1 is connected with a wireless radio frequency module, and the wireless radio frequency module supports connection with a wireless receiving device, and the wireless receiving device includes a mobile phone, a computer terminal or other supporting wireless signal receiving terminals ;
所述芯片U1的P03管脚连接开关按钮S2,所述开关按钮S2接地;The P03 pin of the chip U1 is connected to the switch button S2, and the switch button S2 is grounded;
作为上述技术方案的改进,所述芯片U1的P02、P04、P05、P06、P07管脚均连接有烧录模块,所述烧录模块包括烧录芯片PX1,所述烧录芯片PX1的1、2、3、4、10管脚分别与芯片U1的P05、P04、P06、P02、P07管脚连接;As an improvement of the above technical solution, the pins P02, P04, P05, P06, and P07 of the chip U1 are all connected with a programming module, and the programming module includes a programming chip PX1. 2, 3, 4, and 10 pins are respectively connected to P05, P04, P06, P02, and P07 pins of chip U1;
所述芯片U1的P05管脚还连接有测试指示灯D2的正极,测试指示灯D2的负极连接有电阻R3,所述电阻R3接地。The P05 pin of the chip U1 is also connected to the positive pole of the test indicator light D2, the negative pole of the test indicator light D2 is connected to a resistor R3, and the resistor R3 is grounded.
作为上述技术方案的改进,所述芯片U1的型号为BK3435。As an improvement of the above technical solution, the model of the chip U1 is BK3435.
作为上述技术方案的改进,所述电源模块包括芯片U2,所述芯片U2的VIN管脚通过PTC元件串联有电源指示灯D1正极,电源指示灯D1负极连接有电阻R1,所述电阻R1接地;As an improvement of the above technical solution, the power module includes a chip U2, the VIN pin of the chip U2 is connected in series with the positive pole of the power indicator light D1 through the PTC element, the negative pole of the power indicator light D1 is connected with a resistor R1, and the resistor R1 is grounded;
所述芯片U2的FB管脚和SW管脚连接有滤波单元。A filter unit is connected to the FB pin and the SW pin of the chip U2.
作为上述技术方案的改进,所述芯片U2的型号为RT8059。As an improvement of the above technical solution, the model of the chip U2 is RT8059.
本发明的有益效果是:支持整版拼版PCB功能的测试,测试结果显示直观,可以大大降低可能出现漏测或者误测的可能性,本发明的操作简易,还可以降低工人学习培训成本。The beneficial effects of the present invention are: support the test of the full-page imposition PCB function, the test results are displayed intuitively, the possibility of possible missed test or false test can be greatly reduced, the operation of the present invention is simple, and the cost of learning and training for workers can also be reduced.
附图说明Description of drawings
图1是本发明的整体流程图;Fig. 1 is the overall flow chart of the present invention;
图2是本发明的蓝牙中央控制模块电路图;Fig. 2 is the bluetooth central control module circuit diagram of the present invention;
图3是本发明的电源模块电路图;3 is a circuit diagram of a power module of the present invention;
图4是本发明的一号测试模块电路图;Fig. 4 is the circuit diagram of No. 1 test module of the present invention;
图5是本发明的二号测试模块电路图;Fig. 5 is the circuit diagram of No. 2 test module of the present invention;
图6是本发明的三号测试模块电路图;Fig. 6 is the circuit diagram of No. 3 test module of the present invention;
图7是本发明的四号测试模块电路图;Fig. 7 is the circuit diagram of No. 4 test module of the present invention;
图8为本发明的提示模块电路图;8 is a circuit diagram of a prompt module of the present invention;
图9为本发明的一号切换模块电路图;Fig. 9 is the circuit diagram of No. 1 switching module of the present invention;
图10为本发明的二号切换模块电路图;10 is a circuit diagram of the No. 2 switching module of the present invention;
图11为本发明的三号切换模块电路图;Fig. 11 is the circuit diagram of No. 3 switching module of the present invention;
图12为本发明的四号切换模块电路图;Fig. 12 is the circuit diagram of No. 4 switching module of the present invention;
图13为本发明的一号接口模块电路图;13 is a circuit diagram of the No. 1 interface module of the present invention;
图14为本发明的二号接口模块电路图;14 is a circuit diagram of the No. 2 interface module of the present invention;
图15为本发明的三号接口模块电路图;Fig. 15 is the circuit diagram of No. 3 interface module of the present invention;
图16为本发明的四号接口模块电路图。FIG. 16 is a circuit diagram of the No. 4 interface module of the present invention.
具体实施方式Detailed ways
下面结合附图和实施例对本发明进一步说明。The present invention will be further described below with reference to the accompanying drawings and embodiments.
以下将结合实施例和附图对本发明的构思、具体结构及产生的技术效果进行清楚、完整地描述,以充分地理解本发明的目的、特征和效果。显然,所描述的实施例只是本发明的一部分实施例,而不是全部实施例,基于本发明的实施例,本领域的技术人员在不付出创造性劳动的前提下所获得的其他实施例,均属于本发明保护的范围。另外,专利中涉及到的所有联接/连接关系,并非单指构件直接相接,而是指可根据具体实施情况,通过添加或减少联接辅件,来组成更优的联接结构。本发明创造中的各个技术特征,在不互相矛盾冲突的前提下可以交互组合。The concept, specific structure and technical effects of the present invention will be clearly and completely described below with reference to the embodiments and accompanying drawings, so as to fully understand the purpose, characteristics and effects of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, other embodiments obtained by those skilled in the art without creative efforts are all within the scope of The scope of protection of the present invention. In addition, all the coupling/connection relationships involved in the patent do not mean that the components are directly connected, but refer to a better coupling structure by adding or reducing coupling accessories according to the specific implementation. Various technical features in the present invention can be combined interactively on the premise of not contradicting each other.
本发明揭示了一种遥控器PCB功能测试设备,包括蓝牙中央控制模块100、切换模块200以及多个自动化测试单元,所述切换模块200与蓝牙中央控制模块100电性连接,每一个自动化测试单元均与切换模块连接。The present invention discloses a remote control PCB function test equipment, including a bluetooth
本发明的切换模块200包括一号切换模块、二号切换模块、三号切换模块以及四号切换模块。The
参照图1,本发明多个所述自动化测试单元包括四组自动化测试单元,第一组自动化测试单元包括一号测试模块301、一号接口模块303、一号提示模块302以及一号遥控器PCBA,所述一号提示模块302与一号测试模块301连接,一号遥控器PCBA插接在一号接口模块303上,一号测试模块301用于根据蓝牙中央控制模块100的控制,实现对一号遥控器PCBA的自动化测试。Referring to FIG. 1, a plurality of the automated test units of the present invention include four groups of automated test units, and the first group of automated test units includes a No. 1
第二组自动化测试单元包括二号测试模块401、二号接口模块403、二号提示模块402以及二号遥控器PCBA,所述二号提示模块402与二号测试模块401连接,二号遥控器PCBA插接在二号接口模块403上,二号测试模块401用于根据蓝牙中央控制模块100的控制,实现对二号遥控器PCBA的自动化测试。The second group of automated test units includes the No. 2
第三组自动化测试单元包括三号测试模块501、三号接口模块503、三号提示模块502以及三号遥控器PCBA,所述三号提示模块502与三号测试模块501连接,三号遥控器PCBA插接在三号接口模块503上,三号测试模块501用于根据蓝牙中央控制模块100的控制,实现对三号遥控器PCBA的自动化测试。The third group of automated test units includes the No. 3
所述的一号测试模块301、二号测试模块401、三号测试模块501以及四号测试模块601均与切换模块电性连接,蓝牙中央控制模块100用于对不同的切换模块进行通电或断电,依次实现多个遥控器PCBA的测试。The No. 1
本发明的一号提示模块302、二号提示模块402、三号提示模块502以及四号提示模块602在具体实施时,参照图8,使用的是指示灯提示模块电路,但本发明不局限于指示灯提示模块电路,其他提示模块例如蜂鸣器或者显示器显示度数的模块电路均包含在内。When the No. 1
参照图2,所述蓝牙中央控制模块100包括芯片U1,所述芯片U1的型号为BK3435,所述芯片U1的VCCBAT管脚连接有电源模块104,所述芯片U1的P11、P10、P32、P31、P07、P06、P04、P02、P01、P00管脚均与切换模块200连接,所述芯片U1的XO管脚和X1管脚均连接有晶振模块103,所述芯片U1的ANT管脚连接有无线射频模块101,所述无线射频模块101支持与无线接收设备连接,所述无线接收设备包括手机、电脑终端或者其他支持无线信号接收端,所述晶振模块103用于输出16MHZ频率提供给芯片U1的无线射频模块101起振。2, the bluetooth
其中,本发明芯片U1的P00、P01、P11、P10管脚均与一号切换模块连接,芯片U1的P00、P01、P32、P31管脚均与二号切换模块连接,芯片U1的P00、P01、P07、P06管脚均与三号切换模块连接,芯片U1的P00、P01、P02、P04管脚均与四号切换模块连接。Among them, the pins P00, P01, P11, and P10 of the chip U1 of the present invention are all connected to the No. 1 switching module, the P00, P01, P32, and P31 pins of the chip U1 are all connected to the No. 2 switching module, and the P00, P01 of the chip U1 , P07 and P06 pins are all connected to the No. 3 switching module, and the P00, P01, P02, and P04 pins of the chip U1 are all connected to the No. 4 switching module.
所述芯片U1的P03管脚连接开关按钮S2,所述开关按钮S2接地。所述该开关按钮S2控制的是蓝牙中央控制模块100与接口模块的导通与关闭,所述芯片U1的P02、P04、P05、P06、P07管脚均连接有烧录模块102,所述烧录模块102包括烧录芯片PX1,所述烧录芯片PX1的1、2、3、4、10管脚分别与芯片U1的P05、P04、P06、P02、P07管脚连接,所述烧录模块102用于烧录程序到芯片U1,可根据自身需求改变相关程序。The P03 pin of the chip U1 is connected to the switch button S2, and the switch button S2 is grounded. The switch button S2 controls the turn-on and turn-off of the Bluetooth
所述芯片U1的P05管脚还连接有测试指示灯D2的正极,测试指示灯D2的负极连接有电阻R3,所述电阻R3接地。所述芯片U2的FB管脚和SW管脚连接有滤波单元1040。参照图3,所述电源模块104包括芯片U2,所述芯片U2的型号为RT8059,所述芯片U2的VIN管脚通过PTC元件串联有电源指示灯D1正极,电源指示灯D1负极连接有电阻R1,所述电阻R1接地。通过220V转5V输出的USB充电器,使用USB公口(A型插头)转Micro usb公口提供5V电压CP2做为输入电源滤波电容,芯片U2通过滤波单元1040的电阻R2与电阻R4使SW管脚输出3.3V电压。The P05 pin of the chip U1 is also connected to the positive pole of the test indicator light D2, the negative pole of the test indicator light D2 is connected to a resistor R3, and the resistor R3 is grounded. The
参照图4,所述一号测试模块301包括芯片UK1和芯片UZ1,所述芯片UZ1的PB0、PB1管脚分别与芯片UK1的IN1、IN2管脚连接,所述芯片UZ1的PB4、PB5、PB6、PB7管脚均与一号提示模块302连接,所述芯片UZ1的PA0、PA4管脚均与一号切换模块相连,所述芯片UZ1的PA7管脚与一号接口模块303连接,控制芯片UZ1与一号接口模块303的接通与断开,所述芯片UK1的COM1、COM2、NO1、NO2的管脚均与一号接口模块303连接。所述一号测试模块301还包括芯片UK2,所述芯片UK2的IN1、IN2管脚分别与芯片UZ1的PB2、PB3管脚连接,所述芯片UK2的NO1、NO2管脚均与一号接口模块303连接,所述芯片UK2的COM1、COM2管脚均与一号接口模块303连接。4, the No. 1
上述实施例中,当芯片UK1的IN1引脚为0V时,芯片UK1的COM1与NO1之间为断开状态。当芯片UK1的IN1引脚为3.3V时,COM1与NO1之间为导通状态;当芯片UK2的IN2引脚为0V时,COM2与NO2之间为断开状态;当芯片UK2的IN2引脚为3.3V时,COM2与NO2之间为导通状态。In the above embodiment, when the IN1 pin of the chip UK1 is 0V, the connection between COM1 and NO1 of the chip UK1 is in a disconnected state. When the IN1 pin of the chip UK1 is 3.3V, the connection between COM1 and NO1 is in an on state; when the IN2 pin of the chip UK2 is 0V, the connection between COM2 and NO2 is in a disconnected state; when the IN2 pin of the chip UK2 is in a disconnected state When it is 3.3V, it is in the conduction state between COM2 and NO2.
参照图5,所述二号测试模块401包括芯片UK3和芯片UZ2,所述芯片UZ2的PB0、PB1管脚分别与芯片UK3的IN1、IN2管脚连接,所述芯片UZ2的PB4、PB5、PB6、PB7管脚均与二号提示模块402连接,所述芯片UZ2的PA0、PA4管脚均与二号切换模块相连,所述芯片UZ2的PA7管脚与二号接口模块403连接,控制芯片UZ2与二号接口模块403的接通与断开,所述芯片UK3的COM1、COM2、NO1、NO2的管脚均与二号接口模块403连接。所述二号测试模块401还包括芯片UK4,所述芯片UK4的IN1、IN2管脚分别与芯片UZ2的PB2、PB3管脚连接,所述芯片UK4的NO1、NO2管脚均与二号接口模块403连接,所述芯片UK4的COM1、COM2管脚均与二号接口模块403连接。5, the No. 2
上述实施例中,当芯片UK3的IN1引脚为0V时,芯片UK3的COM1与NO1之间为断开状态。当芯片UK3的IN1引脚为3.3V时,COM1与NO1之间为导通状态;当芯片UK4的IN2引脚为0V时,COM2与NO2之间为断开状态;当芯片UK4的IN2引脚为3.3V时,COM2与NO2之间为导通状态。In the above embodiment, when the IN1 pin of the chip UK3 is 0V, the connection between COM1 and NO1 of the chip UK3 is in a disconnected state. When the IN1 pin of the chip UK3 is 3.3V, the connection between COM1 and NO1 is in an on state; when the IN2 pin of the chip UK4 is 0V, the connection between COM2 and NO2 is in a disconnected state; when the IN2 pin of the chip UK4 is in a disconnected state When it is 3.3V, it is in the conduction state between COM2 and NO2.
参照图6,所述三号测试模块501包括芯片UK5和芯片UZ3,所述芯片UZ3的PB0、PB1管脚分别与芯片UK5的IN1、IN2管脚连接,所述芯片UZ3的PB4、PB5、PB6、PB7管脚均与三号提示模块502连接,所述芯片UZ3的PA0、PA4管脚均与三号切换模块相连,所述芯片UZ3的PA7管脚与三号接口模块503连接,控制芯片UZ3与三号接口模块503的接通与断开,所述芯片UK5的COM1、COM2、NO1、NO2的管脚均与三号接口模块503连接。所述三号测试模块501还包括芯片UK6,所述芯片UK6的IN1、IN2管脚分别与芯片UZ3的PB2、PB3管脚连接,所述芯片UK6的NO1、NO2管脚均与三号接口模块503连接,所述芯片UK6的COM1、COM2管脚均与三号接口模块503连接。6, the No. 3
上述实施例中,当芯片UK5的IN1引脚为0V时,芯片UK5的COM1与NO1之间为断开状态。当芯片UK5的IN1引脚为3.3V时,COM1与NO1之间为导通状态;当芯片UK6的IN2引脚为0V时,COM2与NO2之间为断开状态;当芯片UK6的IN2引脚为3.3V时,COM2与NO2之间为导通状态。In the above embodiment, when the IN1 pin of the chip UK5 is 0V, the connection between COM1 and NO1 of the chip UK5 is in a disconnected state. When the IN1 pin of the chip UK5 is 3.3V, the connection between COM1 and NO1 is in an on state; when the IN2 pin of the chip UK6 is 0V, the connection between COM2 and NO2 is in a disconnected state; when the IN2 pin of the chip UK6 is in a disconnected state When it is 3.3V, it is in the conduction state between COM2 and NO2.
参照图7,所述四号测试模块601包括芯片UK7和芯片UZ4,所述芯片UZ4的PB0、PB1管脚分别与芯片UK7的IN1、IN2管脚连接,所述芯片UZ4的PB4、PB5、PB6、PB7管脚均与四号提示模块602连接,所述芯片UZ4的PA0、PA4管脚均与四号切换模块相连,所述芯片UZ4的PA7管脚与四号接口模块603连接,控制芯片UZ4与四号接口模块603的接通与断开,所述芯片UK7的COM1、COM2、NO1、NO2的管脚均与四号接口模块603连接。所述四号测试模块601还包括芯片UK8,所述芯片UK8的IN1、IN2管脚分别与芯片UZ4的PB2、PB3管脚连接,所述芯片UK8的NO1、NO2管脚均与四号接口模块603连接,所述芯片UK8的COM1、COM2管脚均与四号接口模块603连接。7, the No. 4
上述实施例中,当芯片UK7的IN1引脚为0V时,芯片UK7的COM1与NO1之间为断开状态。当芯片UK7的IN1引脚为3.3V时,COM1与NO1之间为导通状态;当芯片UK8的IN2引脚为0V时,COM2与NO2之间为断开状态;当芯片UK8的IN2引脚为3.3V时,COM2与NO2之间为导通状态。In the above embodiment, when the IN1 pin of the chip UK7 is 0V, the connection between COM1 and NO1 of the chip UK7 is in a disconnected state. When the IN1 pin of the chip UK7 is 3.3V, the connection between COM1 and NO1 is in an on state; when the IN2 pin of the chip UK8 is 0V, the connection between COM2 and NO2 is in a disconnected state; when the IN2 pin of the chip UK8 is in a disconnected state When it is 3.3V, it is in the conduction state between COM2 and NO2.
本发明在具体实施时:When the present invention is specifically implemented:
步骤一:对一号遥控器PCBA进行供电,按下S2按钮使芯片U1的P03管脚与GND管脚之间导通,并使得P03管脚识别到电压为0V,芯片U1的P05管脚输出3.3V高电平使测试指示灯D2的正极和负极之间产生大于1V压降,电阻R3限制电流大小,从而点亮测试指示灯D2,并开始进行一号遥控器PCBA功能测试。Step 1: Supply power to the No. 1 remote control PCBA, press the S2 button to make the connection between the P03 pin of the chip U1 and the GND pin, and make the P03 pin recognize that the voltage is 0V, and the P05 pin of the chip U1 output The 3.3V high level causes a voltage drop of more than 1V between the positive and negative poles of the test indicator D2, and the resistor R3 limits the current, thereby lighting up the test indicator D2, and starting the No. 1 remote control PCBA function test.
步骤二:芯片U1的P11、P10两个管脚输出3.3V,使一号接口模快303内部导通,且导通的电压为3.3V,从而使芯片U1与芯片UZ1相互之间可以通过串口协议通讯。Step 2: The two pins P11 and P10 of the chip U1 output 3.3V, so that the No. 1
步骤三:U1发送“开始信号”给芯片UZ1,芯片UZ1的PA7管脚输出3.3V,一号接口模块303电压为3.3V使芯片UZ1的NO1、COM1管脚导通,给一号遥控器PCBA提供3.3V电源,使一号遥控器PCBA上的蓝牙MCU可以正常工作。Step 3: U1 sends a "start signal" to the chip UZ1, the PA7 pin of the chip UZ1 outputs 3.3V, and the voltage of the No. 1
步骤四:一号遥控器PCBA上电后,蓝牙自动会与芯片U1连接。连接成功后,芯片U1发送“第一个按键按下信号”给芯片UZ1。Step 4: After the No. 1 remote control PCBA is powered on, the Bluetooth will automatically connect with the chip U1. After the connection is successful, the chip U1 sends the "first button press signal" to the chip UZ1.
步骤五:芯片UZ1收到后使芯片UZ1的PB3管脚输出200MS的3.3V电压,芯片UK2的IN1管脚为高电平使芯片UK2的NO1、COM1管脚导通200MS,相当于手动按下按键,一号遥控器PCBA识别到有按键按下后会通过蓝牙发送数据给芯片U1。Step 5: After the chip UZ1 is received, the PB3 pin of the chip UZ1 outputs a 3.3V voltage of 200MS, and the IN1 pin of the chip UK2 is at a high level, so that the NO1 and COM1 pins of the chip UK2 are turned on for 200MS, which is equivalent to pressing manually. Press the button, the No. 1 remote control PCBA will send data to the chip U1 through Bluetooth after it recognizes that there is a button pressed.
步骤六:芯片U1收到蓝牙数据会通过U1的P00管脚发送“第一个按键信号正常,按下第二个按键信号”给芯片UZ1。Step 6: When the chip U1 receives the Bluetooth data, it will send "the first button signal is normal, press the second button signal" to the chip UZ1 through the P00 pin of U1.
步骤七:芯片UZ1收到后会使芯片UZ1的PB4管脚一直输出3.3V电压使一号提示模块302的发光二极管DZ1的正、负极两端电压差值大于1V,从而点亮“测试指示1-1”LED灯,芯片UZ1的PB2管脚输出200MS的3.3V电压,芯片UK2的IN2管脚为3.3V电压,使芯片UK2的NO2、COM2管脚导通200MS,相当于手动按下按键,一号遥控器PCBA识别到有按键按下后会通过蓝牙发送数据给芯片U1。Step 7: After the chip UZ1 is received, the PB4 pin of the chip UZ1 will always output 3.3V voltage, so that the voltage difference between the positive and negative terminals of the LED DZ1 of the No. 1
步骤八:芯片U1收到蓝牙数据会通过芯片U1的P00管脚发送“第二个按键信号正常,按下第三个按键信号”给芯片UZ1。Step 8: When the chip U1 receives the Bluetooth data, it will send "the second button signal is normal, press the third button signal" to the chip UZ1 through the P00 pin of the chip U1.
步骤九:芯片UZ1收到后会使芯片UZ1的PB5管脚一直输出3.3V电压,使一号提示模块302的发光二极管DZ2的正、负极两端电压差值大于1V,从而点亮“测试指示1-2”LED灯,芯片UZ1的PB1管脚输出200MS的3.3V电压,芯片UK1的IN1管脚为3.3V电压使芯片UK1的NO1、COM1导通200MS,相当于手动按下按键,一号遥控器PCBA识别到有按键按下后会通过蓝牙发送数据给芯片U1。Step 9: After the chip UZ1 is received, the PB5 pin of the chip UZ1 will always output a voltage of 3.3V, so that the voltage difference between the positive and negative terminals of the LED DZ2 of the No. 1
步骤十:芯片U1收到蓝牙数据会通过芯片U1的P00管脚发送“第三个按键信号正常,按下第四个按键信号”给芯片UZ1。Step 10: When the chip U1 receives the Bluetooth data, it will send "the third button signal is normal, press the fourth button signal" to the chip UZ1 through the P00 pin of the chip U1.
步骤十一:芯片UZ1收到后会使芯片UZ1的PB6一直输出3.3V电压,使一号提示模块302的发光二极管DZ3的正、负极两端压差值大于1V,从而点亮“测试指示1-3”LED灯,芯片UZ1的PB0管脚输出200MS的3.3V电压,芯片UK1的IN2管脚为3.3V电压使芯片UK1的NO2、COM2管脚导通200MS,相当于手动按下按键,由于一号遥控器PCBA的相关引脚断开设计,没有发送蓝牙数据给芯片U1。Step 11: After the chip UZ1 is received, the PB6 of the chip UZ1 will always output a voltage of 3.3V, so that the voltage difference between the positive and negative terminals of the LED DZ3 of the No. 1
步骤十二:芯片U1超过3秒没有收到蓝牙数据后,会发送“第四个按键信号接收失败,并断开1号遥控器电源给芯片UZ1。Step 12: After the chip U1 does not receive the Bluetooth data for more than 3 seconds, it will send "Failed to receive the fourth button signal, and disconnect the power supply of the No. 1 remote control to the chip UZ1.
步骤十三:芯片UZ1收到后会使芯片UZ1的PB7管脚一直0V电压,使一号提示模块302的发光二极管DZ4的正、负极两端压差值小于1V从而点不亮“测试指示1-4”LED灯,并且使芯片UZ1的PA7管脚输出0V使一号接口模块303断开,导致一号遥控器PCBA断电。芯片UZ1会发送“一号遥控器PCBA测试完毕。Step 13: After the chip UZ1 is received, the voltage of the PB7 pin of the chip UZ1 will always be 0V, so that the voltage difference between the positive and negative terminals of the LED DZ4 of the No. 1
步骤十四:由于四组自动化测试单元电路结构相同,所使用的芯片也相同,故重复步骤一至步骤十三的内容,即可完成二号遥控器PCBA、三号遥控器PCBA以及四号遥控器PCBA的测试。Step 14: Since the circuit structure of the four groups of automated test units is the same and the chips used are also the same, so repeat
在步骤十四当中,由于芯片U1与切换模块连接的管脚不相同,固在测试二号遥控器PCBA时,芯片U1的P32、P31两个管脚输出3.3V至二号切换模块,二号切换模块与二号接口模块403连接,使二号接口模块403内部导通,且导通的电压为3.3V,从而使芯片U1与芯片UZ2相互之间可以通过串口协议通讯;在测试三号遥控器PCBA时,芯片U1的P07、P06两个管脚输出3.3V至三号切换模块,三号切换模块与三号接口模块503连接,使三号接口模块503内部导通,且导通的电压为3.3V,从而使芯片U1与芯片UZ3相互之间可以通过串口协议通讯;在测试四号遥控器PCBA时,芯片U1的P04、P02两个管脚输出3.3V至四号切换模块,四号切换模块与四号接口模块603连接,使四号接口模块603内部导通,且导通的电压为3.3V,从而使芯片U1与芯片UZ4相互之间可以通过串口协议通讯。In step 14, since the pins connected to the chip U1 and the switching module are not the same, when testing the No. 2 remote control PCBA, the two pins P32 and P31 of the chip U1 output 3.3V to the No. 2 switching module, No. 2 The switching module is connected to the No. 2 interface module 403, so that the No. 2 interface module 403 is internally turned on, and the conduction voltage is 3.3V, so that the chip U1 and the chip UZ2 can communicate with each other through the serial port protocol; in the test No. 3 remote control When the PCBA is installed, the two pins P07 and P06 of the chip U1 output 3.3V to the No. 3 switching module, and the No. 3 switching module is connected to the No. 3 interface module 503, so that the No. 3 interface module 503 is internally turned on, and the voltage that is turned on is It is 3.3V, so that the chip U1 and the chip UZ3 can communicate with each other through the serial port protocol; when testing the No. 4 remote control PCBA, the two pins P04 and P02 of the chip U1 output 3.3V to the No. 4 switching module, No. 4 The switching module is connected with the No. 4 interface module 603, so that the No. 4 interface module 603 is internally turned on, and the conduction voltage is 3.3V, so that the chip U1 and the chip UZ4 can communicate with each other through the serial port protocol.
本发明针对的一号遥控器PCBA、二号遥控器PCBA、三号遥控器PCBA以及四号遥控器PCBA的测试结果,通过相对应的一号提示模块302、二号提示模块402、三号提示模块502以及四号提示模块602进行灯光的亮灭来得知测试结果,二号遥控器PCBA、三号遥控器PCBA以及四号遥控器PCBA的测试步骤具体参照一号遥控器PCBA的测试步骤进行。The test results of the No. 1 remote control PCBA, the No. 2 remote control PCBA, the No. 3 remote control PCBA, and the No. 4 remote control PCBA aimed at by the present invention are prompted by the corresponding No. 1
本发明值得注意的是,当进行二号遥控器PCBA功能测试时,断开一号遥控器PCBA供电,二号遥控器PCBA供电;当进行三号遥控器PCBA功能测试时,断开二号遥控器PCBA供电,三号遥控器PCBA供电;当进行四号遥控器PCBA功能测试时,断开三号遥控器PCBA供电,四号遥控器PCBA供电,并且,本发明只是完成了四组遥控器PCBA的功能测试,本发明不局限于针对遥控器PCBA数量和顺序上的功能测试,即针对数量上进行发明创造或者对本发明的测试遥控器PCBA组数顺序进行调整的,均属于本发明的遥控器PCBA功能测试范畴。What is worth noting in the present invention is that when the function test of the No. 2 remote control PCBA is performed, the power supply of the No. 1 remote control PCBA and the power supply of the No. 2 remote control PCBA are disconnected; when the function test of the No. 3 remote control PCBA is performed, the power supply of the No. The PCBA of the remote controller is powered, and the PCBA of the remote controller is powered; when the function test of the PCBA of the remote controller is performed, the power supply of the PCBA of the remote controller of the No. The present invention is not limited to the function test on the quantity and sequence of the remote controller PCBA, that is, the invention and creation on the quantity or the adjustment of the sequence of the test remote controller PCBA groups of the present invention belong to the remote controller of the present invention. PCBA functional test category.
本发明的四个遥控器PCBA都测试完成后,观察“一号、二号、三号以及四号提示模块”即可知道相应的遥控器PCBA是什么地方出现焊接不良。按下S2按钮输出0V电压,芯片U1识别到后会发送“复位信号”给芯片UZ1、UZ2、UZ3、UZ4开始新一轮遥控器PCBA自动化测试。After the four remote control PCBAs of the present invention have been tested, the "No. 1, No. 2, No. 3 and No. 4 prompt modules" can be observed to know where the corresponding remote control PCBAs have poor welding. Press the S2 button to output 0V voltage. After the chip U1 recognizes it, it will send a "reset signal" to the chips UZ1, UZ2, UZ3, and UZ4 to start a new round of remote control PCBA automation testing.
本发明的有益效果是:支持整版拼版PCB功能的测试,测试结果显示直观,可以大大降低可能出现漏测或者误测的可能性,本发明的操作简易,还可以降低工人学习培训成本。The beneficial effects of the present invention are: support the test of the full-page imposition PCB function, the test results are displayed intuitively, the possibility of possible missed test or false test can be greatly reduced, the operation of the present invention is simple, and the cost of learning and training for workers can also be reduced.
以上是对本发明的较佳实施进行了具体说明,但本发明创造并不限于所述实施例,熟悉本领域的技术人员在不违背本发明精神的前提下还可做出种种的等同变形或替换,这些等同的变形或替换均包含在本申请权利要求所限定的范围。The above is a specific description of the preferred implementation of the present invention, but the present invention is not limited to the described embodiments, and those skilled in the art can also make various equivalent deformations or replacements on the premise that does not violate the spirit of the present invention , these equivalent modifications or substitutions are all included in the scope defined by the claims of the present application.
Claims (9)
Priority Applications (1)
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| CN202010725770.8A CN111830399A (en) | 2020-07-24 | 2020-07-24 | A remote control PCB function test equipment |
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