CN111836500A - Electronic product sealing waterproof structure, electronic product and manufacturing method thereof - Google Patents

Abstract

The invention discloses a sealing waterproof structure of an electronic product, the electronic product and a manufacturing method of the electronic product, and belongs to the technical field of electronic products. The electronic product sealing waterproof structure comprises a first shell and a second shell, wherein the first shell comprises a first inner ring rib and a first outer ring rib, the second shell comprises a second inner ring rib and a second outer ring rib, the first inner ring rib and the second inner ring rib form an inner waterproof cavity through welding, and the first outer ring rib and the second outer ring rib form an outer waterproof cavity through welding. The electronic product sealing waterproof structure, the electronic product and the manufacturing method thereof provided by the invention can not only reach the waterproof level meeting the requirement, effectively reduce the waterproof failure risk, but also reduce the complexity of the assembly structure and the material cost, and reduce the processing process cost.

Description

Electronic product sealing waterproof structure, electronic product and manufacturing method thereof

technical field

The invention relates to the technical field of electronic products, in particular to a sealed waterproof structure for electronic products, electronic products and a manufacturing method thereof.

Background technique

The waterproof level of electronic products reflects the moisture-proof and dust-proof ability of the product itself. Especially for outdoor activities, it is inevitable to be in a harsh environment with high humidity or dusty sand. Longevity matters. To this end, international grade standards for different applications are formulated. The protection grade adopts the IP×× grade standard recommended by the International Electrotechnical Commission (IEC). Different installation places have different grades. For example, in the automotive field with high water resistance requirements, the highest waterproof level of electronic products is generally IPx7 level, and the main experimental condition of level 7--anti-immersion type is that even if it is immersed in water under specified conditions, it will not Go inside (1m water depth, 30 minutes).

Ultrasonic welding is a high-tech technology for welding thermoplastic products. Various thermoplastic parts can be processed by ultrasonic welding without adding solvents, adhesives or other auxiliary materials. The main principle of ultrasonic welding is to use high-frequency vibration waves to transmit to the surfaces of two objects to be welded. Under pressure, the surfaces of the two objects are rubbed against each other to form fusion between the molecular layers. The ultrasonic energy is transmitted to the welding area through the upper weldment. Due to the large acoustic resistance of the welding area, that is, the interface between the two welding, local high temperature will be generated, and due to the poor thermal conductivity of the plastic, it cannot be dissipated in time and will gather in the welding area. As a result, the contact surfaces of the two plastics melt rapidly, and after a certain pressure is applied, they are fused into one. When the ultrasonic wave stops working, let the pressure continue for a few seconds to make it solidify and form, thus forming a strong molecular chain to achieve the purpose of welding, and the welding strength can be close to the strength of the raw materials. Its advantages are as follows: 1. Fast welding speed, high welding strength and good sealing; 2. It replaces the traditional welding/bonding process, with low cost, clean and pollution-free and will not damage the workpiece; 3. The welding process is stable and all welding parameters It can be tracked and monitored through the software system, and it is easy to eliminate and maintain once the fault is found; 4. Increase the productivity by multiple times, reduce the cost, improve the product quality and safety production.

Fig. 1 is a sealed waterproof structure of an electronic product in the prior art, which mainly includes an upper casing 11 and a lower casing 12. When encapsulating, except at the outlet 1B of the internal functional module wire, the waterproof rubber ring 13 and the lower casing pass through The protrusions on the body 12 are tightly compressed, and the glue is dispensed with waterproof glue at the appropriate position. At the remaining connection positions, the 1A shell 11 and the lower shell 12 are welded along an ultrasonic welding line to achieve a certain waterproof sealing purpose. . The disadvantage of this structure is that in addition to the ultrasonic welding of the main structure of the sealed waterproof structure, an external waterproof rubber ring and waterproof glue dispensing are required to cooperate to achieve sealing and waterproofing. Not only the overall structure is complex, the material cost is high, but also It increases the cost of processing technology, and there is a certain risk of waterproof failure.

SUMMARY OF THE INVENTION

In order to solve the problems in the prior art, the embodiments of the present invention provide a sealed waterproof structure for electronic products, electronic products and a manufacturing method thereof, which can not only achieve the required waterproof level, but also effectively reduce the risk of waterproof failure and reduce the assembly structure. Complexity and material costs, reducing processing costs. The technical solution is as follows:

In one aspect, a sealing and waterproof structure for electronic products is provided, including a first casing and a second casing, the first casing includes a first inner ring rib and a first outer ring rib, and the second casing includes The second inner ring rib and the second outer ring rib, the first inner ring rib and the second inner ring rib are welded to form an inner waterproof cavity, and the first outer ring rib and the second outer ring rib pass through Welding to form an outer waterproof cavity.

Preferably, the first inner ring rib has a first inner groove, the second inner ring rib has a second inner groove, and the first inner groove and the second inner groove are formed by welding to form an inner groove. Outlet holes, the first outer ring rib has a first outer groove, the second outer ring rib has a second outer groove, and the first outer groove and the second outer groove are formed by welding to form an outlet wire hole.

Preferably, the inner wire outlet holes and the outer wire outlet holes are arranged concentrically.

Preferably, both the inner wire outlet hole and the outer wire outlet hole have accommodating spaces that can be interference fit with the wires.

Preferably, both the inner wire outlet hole and the outer wire outlet hole are circular holes.

Preferably, the welding is ultrasonic welding.

On the other hand, an electronic product is provided, comprising any of the above-mentioned sealed waterproof structure, and a functional module is arranged in the inner waterproof cavity of the sealed waterproof structure.

Preferably, the first inner ring rib and the second inner ring rib are ultrasonically welded to form an inner waterproof cavity, and the first outer ring rib and the second outer ring rib are ultrasonically welded to form an outer waterproof cavity, so The wire of the functional module is in an interference fit with the inner wire outlet hole and the outer wire outlet hole.

In yet another aspect, a method for manufacturing an electronic product is provided, comprising:

injection molding the first shell and the second shell respectively;

Positioning and assembling the functional module, the first casing and the second casing;

between the first inner rib of the first casing and the second inner rib of the second casing, and between the first outer rib of the first casing and the second inner rib of the second casing Between the second outer ring ribs of the second shell, the first shell and the second shell are press-fitted and packaged by welding;

The waterproof performance test of the electronic product is carried out.

Preferably, the manufacturing method of an electronic product includes:

injection molding the first shell and the second shell respectively;

Positioning and assembling the functional module and the wire of the functional module, the first casing and the second casing, wherein the wire of the functional module and the inner wire outlet, the All outgoing holes are assembled with interference fit;

between the first inner rib of the first casing and the second inner rib of the second casing, and between the first outer rib of the first casing and the second inner rib of the second casing Between the second outer ring ribs of the second shell, the first shell and the second shell are press-fitted and packaged by welding;

The waterproof performance test of the electronic product is carried out.

The beneficial effects brought by the technical solutions provided in the embodiments of the present invention are:

1. Through the two layers of inner and outer ring ribs used for ultrasonic welding on the two shells, two inner and outer waterproof cavities are formed in the sealed waterproof structure of electronic products. Prevent water from further infiltrating the inner waterproof cavity, thus providing a good guarantee for the sealing and waterproofing of the entire structure and reducing the risk of waterproof failure;

2. In addition, compared with the traditional structure, the assembly structure of the waterproof rubber ring and waterproof glue at the outlet is omitted, and the two shells that can be integrally formed only need to be welded and packaged along two ultrasonic welding lines, and no additional work is required. The compression assembly work and dispensing process of the waterproof rubber ring and the shell only need to be welded in two ultrasonic welding lines and the wire interference assembly can be performed, which not only reduces the overall structural complexity, reduces material costs, but also saves money The processing procedures and man-hours reduce the processing cost.

Description of drawings

In order to illustrate the technical solutions in the embodiments of the present invention more clearly, the following briefly introduces the accompanying drawings used in the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained from these drawings without creative effort.

1 is a schematic diagram of a sealing and waterproof structure of an electronic product in the prior art;

2 is a schematic diagram of a sealing and waterproof structure of an electronic product provided by an embodiment of the present invention;

3 is a schematic diagram of a sealing and waterproof structure of an electronic product and a structure of an electronic product provided by an embodiment of the present invention;

FIG. 4 is a partial structural schematic diagram of the sealing and waterproof structure of the electronic product in FIG. 3 .

Detailed ways

In order to make the objectives, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only Some, but not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

It should be noted that the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as "first" or "second" may expressly or implicitly include one or more of that feature.

The embodiments of the present invention provide a sealed waterproof structure for electronic products, an electronic product and a manufacturing method thereof. Two layers of inner and outer ring ribs for ultrasonic welding on two shells are used to form two inner and outer waterproof cavities in the electronic product sealed waterproof structure. , even if there is water slowly infiltrating into the outer waterproof cavity, it can effectively reduce the pressure and prevent the water from further infiltrating into the inner waterproof cavity, thus providing a good guarantee for the sealing and waterproofing of the whole structure and reducing the risk of waterproof failure; The structure omits the assembly structure of the waterproof rubber ring and waterproof glue at the outlet, and the two shells that can be integrally formed only need to be welded and packaged along two ultrasonic welding lines, and there is no need to additionally press the waterproof rubber ring and the shell. Tight assembly work and glue dispensing process only need to carry out welding and wire interference assembly on two ultrasonic welding lines, which not only reduces the overall structural complexity, reduces material costs, but also saves processing procedures and man-hours, reducing processing process cost. Therefore, the electronic product sealing waterproof structure, the electronic product and the manufacturing method thereof can be widely applied to various electronic product application fields involving waterproof sealing, such as the electronic product waterproof sealing scene in the automotive field.

The following describes in detail the electronic product sealing and waterproof structure, the electronic product and the manufacturing method thereof provided by the embodiments of the present invention with reference to the specific embodiments and the accompanying drawings.

As shown in FIG. 2 and FIG. 3 , the sealing and waterproof structure for electronic products provided by the embodiment of the present invention includes a first casing 21 and a second casing 22 , and the first casing 21 includes a first inner ring rib 21 a and a first outer ring Rib 21b, the second shell 22 includes a second inner ring rib 22a and a second outer ring rib 22b, the first inner ring rib 21a and the second inner ring rib 22a are welded to form an inner waterproof cavity 31, and the first outer ring rib 21b The outer waterproof cavity 32 is formed by welding with the second outer ring rib 22b. Two double sealing walls are formed by welding along the two circles of ribs, so that the sealed waterproof structure includes two inner and outer waterproof cavities, which provides an effective guarantee for good sealing and waterproof performance. Here, the first housing 21, the first inner ring rib 21a and the first outer ring rib 21b can be integrally formed by injection molding; the second housing 22, the second inner ring rib 22a and the second outer ring rib 22b It can be made into one piece by injection molding process. The first housing 21 and its first inner ring rib 21a and first outer ring rib 21b, the second housing 22 and its second inner ring rib 22a and second outer ring rib 22b can all be made of PC, ABS or PC Made of +ABS material, preferably the same or similar material, so that the welding performance (especially when ultrasonic welding is used) is better.

Preferably, the first inner ring rib 21a has a first inner groove 21c, the second inner ring rib 22a has a second inner groove 22c, and the first inner groove 21c and the second inner groove 22c are welded to form an inner wire outlet hole The first outer ring rib 21b has a first outer groove 21d, the second outer ring rib 22b has a second outer groove 22d, and the first outer groove 21d and the second outer groove 22d are welded to form an outer wire hole. The wire 5 of the functional module in the sealed waterproof structure can be passed through the inner wire outlet hole and the outer wire outlet hole.

Further preferably, the inner wire outlet hole and the outer wire outlet hole are arranged concentrically, which is more convenient for the wire rod 5 to pass out.

Further preferably, both the inner wire outlet hole and the outer wire outlet hole have accommodating spaces that can be interference fit with the wire rod 5 , and the hole structure or specification of the inner wire outlet hole and the outer wire outlet hole can be set to meet the requirements of the interference fit with the wire rod 5 . Reasonable interference design makes it possible to effectively extrude the outer sheath of the wire to complete the sealing, so as to achieve effective tensile strength without causing damage to the outer sheath.

Further preferably, the inner wire outlet hole and the outer wire outlet hole are all circular holes, that is, the first inner groove 21c, the second inner groove 22c, the first outer groove 21d, and the second outer groove 22d are semicircular ribs. This kind of structure is less likely to cause damage to the outer skin.

Preferably, the welding in the above solution adopts a sealed connection method of ultrasonic welding.

As shown in FIG. 2 and FIG. 3 , the electronic product provided by the embodiment of the present invention includes the sealed waterproof structure according to any one of the above solutions, and a functional module 4 is arranged in the inner waterproof cavity of the sealed waterproof structure.

Preferably, the first inner ring rib 21a and the second inner ring rib 22a are formed by ultrasonic welding to form an inner waterproof cavity, and the first outer ring rib 21b and the second outer ring rib 22b are formed by ultrasonic welding to form an outer waterproof cavity. The wire rod 5 has an interference fit with the inner wire outlet hole and the outer wire outlet hole.

In addition, the manufacturing method of the electronic product provided by the embodiment of the present invention includes the following steps:

Step 1: Injection molding the first shell and the second shell respectively;

Step 2: Position and assemble the functional module, the first casing and the second casing;

Step 3: Between the first inner rib of the first shell and the second inner rib of the second shell, between the first outer rib of the first shell and the second outer rib of the second shell between, the first shell and the second shell are press-fitted and packaged by welding;

Step 4: Check the waterproof performance of electronic products.

Waterproof test: IPx7 level test, simulating product application immersion test.

Test equipment: waterproof test barrel;

Test conditions: The product is placed under water at a depth of 1 meter (1000Mg/Hg water pressure), taken out after 30 minutes, and placed at room temperature for 2 hours. For the detection function, please refer to the IEC 60529IPx7 specification for details.

Test Result: Passed.

Preferably, the manufacturing method of the above-mentioned electronic product adopts the following steps to implement:

injection molding the first shell and the second shell respectively;

Positioning and assembling the functional module and the wire rod of the functional module, the first casing and the second casing, wherein the wire rod of the functional module, the inner wire outlet hole and the outer wire outlet hole are all assembled with interference fit;

between the first inner rib of the first casing and the second inner rib of the second casing, and between the first outer rib of the first casing and the second outer rib of the second casing Between the two, the first shell and the second shell are press-fitted and packaged by welding;

Test the waterproof performance of electronic products.

Waterproof test: IPx7 level test, simulating product application immersion test.

Test equipment: waterproof test barrel;

Test conditions: The product is placed under water at a depth of 1 meter (1000Mg/Hg water pressure), taken out after 30 minutes, and placed at room temperature for 2 hours. For the detection function, please refer to the IEC 60529IPx7 specification for details.

Test Result: Passed.

Table 1 Performance comparison table of electronic products before and after waterproof test

It can be seen from the above Table 1 that the electronic product provided by the embodiment of the present invention has passed the IPx7 level test, and the waterproof performance reaches the IPx7 level, and the product performance is not affected.

All the above-mentioned optional technical solutions can be combined arbitrarily to form optional embodiments of the present invention, which will not be repeated here.

To sum up, the sealing and waterproof structure for electronic products, electronic products and manufacturing methods thereof provided by the embodiments of the present invention have the following beneficial effects compared with the prior art:

1. Through the two layers of inner and outer ring ribs used for ultrasonic welding on the two shells, two inner and outer waterproof cavities are formed in the sealed waterproof structure of electronic products. Prevent water from further infiltrating the inner waterproof cavity, thus providing a good guarantee for the sealing and waterproofing of the entire structure and reducing the risk of waterproof failure;

2. In addition, compared with the traditional structure, the assembly structure of the waterproof rubber ring and waterproof glue at the outlet is omitted, and the two shells that can be integrally formed only need to be welded and packaged along two ultrasonic welding lines, and no additional work is required. The compression assembly work and dispensing process of the waterproof rubber ring and the shell only need to be welded in two ultrasonic welding lines and the wire interference assembly can be performed, which not only reduces the overall structural complexity, reduces material costs, and saves processing. Processes and man-hours, reducing processing costs.

Those of ordinary skill in the art can understand that all or part of the steps of implementing the above embodiments can be completed by hardware, or can be completed by instructing relevant hardware through a program, and the program can be stored in a computer-readable storage medium. The storage medium mentioned may be a read-only memory, a magnetic disk or an optical disk, etc.

The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection of the present invention. within the range.

Contents not described in detail in this specification belong to the prior art known to those skilled in the art.

Claims (10)

1. A sealed waterproof structure for electronic products, characterized in that it comprises a first casing and a second casing, the first casing includes a first inner ring rib and a first outer ring rib, and the second casing It includes a second inner ring rib and a second outer ring rib, the first inner ring rib and the second inner ring rib are welded to form an inner waterproof cavity, and the first outer ring rib and the second outer ring rib are welded to form an inner waterproof cavity. The outer waterproof cavity is formed by welding. 2 . The sealing and waterproof structure according to claim 1 , wherein the first inner ring rib has a first inner groove, the second inner ring rib has a second inner groove, and the first inner ring rib has a second inner groove. 3 . The groove and the second inner groove are welded to form an inner wire outlet hole, the first outer ring rib has a first outer groove, the second outer ring rib has a second outer groove, and the first outer ring rib has a second outer groove. The groove and the second outer groove are welded to form an outgoing wire hole. 3 . The sealing and waterproof structure according to claim 2 , wherein the inner wire outlet holes and the outer wire outlet holes are arranged concentrically. 4 . 4 . The sealing and waterproof structure according to claim 2 , wherein the inner wire outlet hole and the outer wire outlet hole both have accommodating spaces that can be interference-fitted with the wires. 5 . 5 . The sealing and waterproof structure according to claim 2 , wherein the inner wire outlet hole and the outer wire outlet hole are both circular holes. 6 . 6 . The sealing and waterproof structure according to claim 1 , wherein the welding is ultrasonic welding. 7 . 7 . An electronic product, characterized in that it comprises the sealed waterproof structure according to any one of claims 1 to 6 , and a functional module is arranged in an inner waterproof cavity of the sealed waterproof structure. 8 . The electronic product according to claim 7 , wherein the first inner ring rib and the second inner ring rib are ultrasonically welded to form an inner waterproof cavity, and the first outer ring rib and the second inner ring rib are welded to form an inner waterproof cavity. Two outer ring ribs are formed by ultrasonic welding to form an outer waterproof cavity, and the wire of the functional module is in an interference fit with the inner wire outlet hole and the outer wire outlet hole. 9. A method of making an electronic product according to claim 7, characterized in that, comprising: injection molding the first shell and the second shell respectively; Positioning and assembling the functional module, the first casing and the second casing; between the first inner rib of the first casing and the second inner rib of the second casing, and between the first outer rib of the first casing and the second inner rib of the second casing Between the second outer ring ribs of the second shell, the first shell and the second shell are press-fitted and packaged by welding; The waterproof performance test of the electronic product is carried out. 10. A method of making an electronic product according to claim 8, characterized in that, comprising: respectively injection molding the first shell and the second shell; Positioning and assembling the functional module and the wire of the functional module, the first casing and the second casing, wherein the wire of the functional module and the inner wire outlet, the All outgoing holes are assembled with interference fit; between the first inner rib of the first casing and the second inner rib of the second casing, and between the first outer rib of the first casing and the second inner rib of the second casing Between the second outer ring ribs of the second shell, the first shell and the second shell are press-fitted and packaged by welding; The waterproof performance test of the electronic product is carried out.

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