CN111836453A - A PCB board jumper structure of an antenna system - Google Patents

Abstract

The invention discloses a PCB (printed circuit board) jumper structure of an antenna system, which comprises a first PCB and at least one second PCB, wherein the first PCB is provided with a first conductive circuit and a second conductive circuit, the second PCB is attached to the first PCB, the second PCB is provided with a third conductive circuit crossed with the first conductive circuit, two ends of the third conductive circuit are connected with the second conductive circuit of the first PCB, and the area of the second PCB is smaller than that of the first PCB. The invention designs one short cross circuit on the original PCB into a PCB with smaller area, thus reducing the material consumption of the product, lowering the cost, having high flexibility of local design and low profile design, and being suitable for SMT welding. Due to the fact that the wiring device can be used in a cross design mode, wiring layout can be optimized to the maximum degree, and differential loss is reduced. When one is damaged, the circuit board can be taken down and replaced without affecting the whole circuit board.

Description

A PCB board jumper structure of an antenna system

technical field

The invention relates to an antenna system, in particular to a PCB board jumper structure of the antenna system which can solve the problem of line crossing.

Background technique

With the continuous development of mobile communication technology, the requirements for PCB boards used in communication equipment (such as antenna systems) are getting higher and higher. PCB boards with compact structure, excellent electrical performance, low cost and high reliability have become The focus of domestic and foreign research at this stage.

In order to realize the miniaturization of the PCB board, the layout of the traces should be optimized as much as possible to make the circuit network of the PCB board compact, but this may lead to the problem of crossover of the lines. The traditional solutions to the problem of PCB board line crossing mainly include the following three:

Option 1: A metal bridge is used to directly connect to the top of the crossover line, and the two ends of the metal bridge are welded to the two ends of the line to be connected through the PCB pad to make the line connected.

Option 2: Use a coaxial cable to connect the disconnected line through the ground plane of the PCB to connect the line. The inner conductor of the coaxial line is welded to the two ends of the broken line of the PCB board, and the outer conductor is welded to the ground layer of the PCB board to realize the common ground with the circuit of the PCB board.

Option 3: Use more layers of plywood, and route the crossed lines on different signal layers. There is a ground layer between adjacent signal layers to shield the mutual interference between the signal layers.

Among them, the disadvantage of the above scheme 1 is that since the metal bridge directly walks above the crossover line, there is no shielding between the two lines, resulting in a large mutual interference between the two lines, thereby affecting the electrical performance of the two lines.

The disadvantage of the above solution 2 is that the error of the length of the coaxial line is relatively large, which leads to a relatively large phase error of the line. And the coaxial line will always have a small section of inner conductor exposed to the outside, resulting in radiation, affecting the electrical performance of itself and other lines, and it cannot achieve complete electromagnetic shielding.

The disadvantage of the above solution 3 is that the pressing of multiple double-sided panels not only increases the cost, but also makes the process more complicated and the accuracy is not high, resulting in errors in amplitude and phase, poor consistency, and inability to be used flexibly.

In addition, due to the large area of the circuit board and the local lines crossing, if a multi-layer board is used for lamination, the area of all layers needs to be the same, and the line crossing is only a small area, which leads to a large waste of materials. At the same time, there may be more than one place where the line crosses. After the integral pressing, if there is a problem in some crossover places, the whole circuit board will be scrapped, and the flexibility is very low.

SUMMARY OF THE INVENTION

The purpose of the present invention is to overcome the defects of the prior art, and to provide a PCB board jumper structure of the antenna system which reduces the processing cost and improves the flexibility of use.

In order to achieve the above purpose, the present invention proposes the following technical solution: a PCB board jumper structure of an antenna system, which includes a first PCB board and at least one second PCB board, and the first PCB board is provided with a first conductive circuit. and at least one second conductive line, the second PCB board is attached to the first PCB board, and the second PCB board is provided with a third conductive line intersecting with the first conductive line, The third conductive line is electrically connected to the second conductive line; the area of the second PCB board is smaller than that of the first PCB board.

Preferably, the second PCB board is attached to the first PCB board by surface mounting.

Preferably, the second PCB board is electrically connected to the first PCB board through metallized vias.

Preferably, the metallized vias are arranged around the third conductive circuit on the second PCB board to form a closed circle, and the metallized vias are connected to the ground layer of the second PCB board and the third conductive circuit. The ground plane of a PCB board.

Preferably, the metallized vias are arranged on the second PCB board, so that the third conductive line and the second conductive line are electrically connected.

Preferably, the second PCB board is formed by pressing two double-sided metal clad plates, which includes a top ground layer, a signal layer and a bottom ground layer distributed in sequence from top to bottom, and the signal layer forms the first ground layer. Three conductive lines.

Preferably, the second PCB board further includes a top dielectric layer, a bottom dielectric layer and an adhesive dielectric layer, the top ground layer is attached to the upper surface of the top dielectric layer, and the signal layer and the bottom ground layer are respectively attached to the the upper and lower surfaces of the bottom dielectric layer, and the top dielectric layer and the signal layer are laminated through the adhesive medium layer.

Preferably, the first PCB board includes two second conductive lines, two ends of the third conductive line are electrically connected to the two second conductive lines through metallized vias, respectively, and the two second conductive lines are electrically connected to each other. The two connection ends of the second conductive line and the third conductive line are respectively located on both sides of the first conductive line.

Preferably, the second PCB board is a double-sided metal clad board, which includes a signal layer and a ground layer, and the signal layer forms the third conductive circuit.

Preferably, the second PCB board further includes a dielectric layer, and the signal layer and the ground layer are respectively pressed on the upper and lower surfaces of the dielectric layer.

Preferably, the first PCB board is a PCB board formed by pressing at least one metal-clad board.

Preferably, the first PCB board is a large-scale multiple-input multiple-output antenna calibration board.

The beneficial effects of the present invention are:

1. In the present invention, one of the short crossover lines on the original PCB board is additionally designed into a PCB board with a smaller area, and then the PCB board is connected to the corresponding connection end of the original PCB board, so as to solve the problem of the lines appearing on the original PCB board. crossover problem. And because the area of the PCB board is small, the design area only needs to enable the above-mentioned one cross line to realize signal transmission. Compared with the existing design with the same area of the multi-layer double-sided board, the design of this solution reduces the material used for the product and the cost. Lower, and high local design flexibility, low profile design, suitable for SMT welding at the same time. Since it can be used in cross design, the trace layout can be optimized to the greatest extent and the difference loss can be reduced. A damaged one can be removed and replaced without affecting the overall circuit board.

2. The newly designed PCB board of the present invention is mounted under the ground layer of the original PCB board by using surface mount technology. The structure is simple, flexible and convenient, and can be mounted on the surface of any plane board to realize line jumping. Moreover, the vertical space is fully utilized, so that the structure of the PCB board is more compact, and the size of the PCB board is reduced.

3. The newly designed PCB board of the present invention adopts the design structure of the three-layer board, and the signal layer is placed in the middle layer to achieve a good electromagnetic shielding effect, which is also suitable for the design structure of the two-layer board and reduces the cost.

Description of drawings

1 and 2 are schematic structural diagrams of Embodiment 1 of the present invention (the conductive circuit is not shown in FIG. 1, and the conductive circuit is shown in FIG. 2);

Fig. 3 is the three-dimensional perspective structure schematic diagram of Embodiment 1 of the present invention;

Fig. 4 is the three-dimensional structure schematic diagram of Embodiment 2 of the present invention;

5 is a schematic perspective view of the structure of the second PCB in Embodiment 1 of the present invention after assembly;

6 is a schematic diagram of a split structure of a second PCB board in Embodiment 1 of the present invention;

7 is a schematic structural diagram of the assembled second PCB board in Embodiment 2 of the present invention;

8 is a schematic diagram of a split structure of a second PCB board in Embodiment 2 of the present invention;

Fig. 9 is the side view structure schematic diagram of the second PCB board in Embodiment 1 of the present invention;

10 is a schematic side view of the structure of the second PCB in Embodiment 2 of the present invention;

FIG. 11 is a partial enlarged schematic view of the structure in FIG. 2 .

Reference numerals: 1. First PCB board, 11, Bottom ground layer of the first PCB board, 12, First conductive trace, 13, Second conductive trace, 2. Second PCB board, 21, Top ground layer, 22 , Top dielectric layer, 23, Adhesive dielectric layer, 24, First signal layer/third conductive trace, 25, Bottom dielectric layer, 26, Bottom ground layer, 27, Second signal layer/third conductive trace, 28, Ground layer, 29, dielectric layer, 3, metallized via.

Detailed ways

The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings of the present invention.

1 to 4 and FIG. 11, a PCB board jumper structure of an antenna system disclosed in the present invention includes a first PCB board 1 and at least one second PCB board 2, and the first PCB board 1 has a At least one first conductive trace 12 and at least one second conductive trace 13 . The second PCB board 2 is mounted on the first PCB board. The second PCB board 2 is provided with a third conductive line intersecting with the first conductive line 12 on the first PCB board 1 and is mounted on the first PCB After the board 1 is installed, the third conductive line is electrically connected to the second conductive line 13 on the first PCB board 1. Because the third conductive line and the first conductive line 12 are respectively on different PCB boards 1, they will not intersect. . In the present invention, the third conductive circuit intersecting with the first conductive circuit 12 is additionally designed as a second PCB board 2 , which solves the problem of the intersection with the first conductive circuit 12 .

In this embodiment, at least two second conductive lines 13 are disposed on the first PCB board 1 , each of the second conductive lines 13 has a connection terminal for electrical connection with the third conductive line, and two ends of the third conductive line are respectively connected to The connection ends of the two second conductive lines 13 are electrically connected, and the two connection ends of the two second conductive lines 13 electrically connected to the third conductive line are located on two sides of the first conductive line, respectively.

Preferably, the area of the second PCB board 2 is designed to be much smaller than the area of the first PCB board 1 , so that multiple second PCB boards 2 can be arranged on the first PCB board 1 as required. In this embodiment, preferably, one second PCB board 2 is connected to two second conductive lines 13 on the first PCB board. Of course, it can also be connected to more second conductive lines 13 on the first PCB board 1. Specifically, the second A plurality of third conductive lines are arranged on the PCB board 2 , and each third conductive line is connected to two second conductive lines 13 .

During implementation, the first PCB board 1 may be a PCB board formed by pressing at least one single-sided metal clad plate (such as a copper clad laminate), that is, the second PCB board 2 may be used to solve the problem of The problem of cross-circuits on PCBs laminated with metal clad plates can also be used to solve the problems of cross-circuits on PCBs laminated with any number of single-sided and/or double-sided metal-clad plates.

Example 1

In this embodiment 1, the first PCB board 1 is a Massive MIMO (Massive Multiple Input Multiple Output) antenna calibration board, and the calibration board is formed by pressing two double-sided copper clad laminates. A plurality of second PCB boards 2 are laminated on the bottom ground layer 11 of the first PCB board, and each second PCB board 2 is connected to two second conductive lines 13 on the first PCB board 1 . In this way, since the area of the second PCB board 2 is small, the processing cost can be greatly reduced. In addition, since a plurality of second PCB boards 2 are arranged on one first PCB board 1, when one second PCB board 2 is damaged, Can be removed and replaced without affecting the overall circuit board, increasing design flexibility.

The working principle of the calibration board in Embodiment 1 is as follows: the main signal is fed through the radio frequency connector (not shown in the figure), and reaches the radiation unit (not shown in the figure) through the feeding network (not shown in the figure) for radiation. The main signal of the network coupling through the feeding network is transmitted to the Wilkinson power divider (not shown) connected to the second PCB board through the second PCB board on the calibration board, and finally reaches the calibration port (not shown in the figure). ) to calibrate the main signal.

The invention adopts the structure in which the PCB board is connected with the PCB board, and the structure is simple, flexible and convenient, and can be mounted on the surface of any plane board to realize the circuit bridge connection. In addition, the present invention adopts the PCB board to be mounted on the PCB board, making full use of the vertical space, making the structure of the PCB board more compact, and reducing the size of the PCB board.

When the second PCB board 2 is implemented, there can be various alternatives, such as a double-sided copper clad laminate, or two double-sided copper clad laminates pressed together, etc. The second PCB board 2 is made of two double-sided clad laminates. When the copper plates are pressed together, the structure mounted on the antenna calibration board is shown in Figure 3.

Specifically, as shown in FIG. 5 , FIG. 6 and FIG. 9 , the second PCB board 2 is specifically formed by pressing two double-sided copper clad laminates, including three layers of copper layers, and the three layers of copper layers are in order from top to bottom. The top ground layer 21, the first signal layer 24 and the bottom ground layer 26 are distributed, wherein the top ground layer 21 and the bottom ground layer 26 form the ground layer of the second PCB board 2, and the middle layer forms the above-mentioned first signal layer 24. A signal layer 24 is the third conductive circuit 27 on the second PCB board 2 .

There are also multiple dielectric layers between the three copper layers, specifically a top dielectric layer 22 , a bottom dielectric layer 25 and an adhesive dielectric layer 23 . The top ground layer 21 is attached to the upper surface of the top dielectric layer 22, the first signal layer 24 and the bottom ground layer 26 are attached to the upper and lower surfaces of the bottom dielectric layer 25, respectively, and the top dielectric layer 22 and the first signal layer 24. They are pressed together by the adhesive medium layer 23 .

During implementation, the second PCB board 2 is pressed onto the bottom ground layer 11 of the first PCB board through surface mount technology (ie, SMT technology). And the second PCB board 2 is connected to the first PCB board 1 through the metallized vias 3 . Specifically, the metallized vias 3 are arranged around the third conductive circuit 27 on the second PCB board 2 and are formed in a closed circle, and the metallized vias 3 are connected to the first and second PCB boards 1 and 2 . The two upper and lower ground layers 11 and 21 achieve a common ground and at the same time strengthen the electromagnetic shielding effect of the entire PCB board. Alternatively, the metallized vias 3 are not limited to be formed in a closed circle on the second PCB board 2 , and only need to realize the upper and lower ground layers 11 , 21 of the first and second PCB boards 1 , 2 . And the first signal layer 24 of the second PCB board 2 is connected to the first PCB board 1 through the metallized vias 3 , so as to realize the third conductive line of the second PCB board 2 and the second conductive line on the first PCB board 1 . Line 13 is electrically connected.

The second PCB board 2 of the present embodiment 1 adopts a three-layer board design scheme, and the signal layer is placed in the middle layer, which not only ensures that the signal layer will not be subject to external electromagnetic interference, but also shields the signal layer from the influence of the outside world.

Example 2

Different from the above-mentioned Embodiment 1, the second PCB board 2 is a double-sided copper clad laminate, and its structure mounted on the antenna calibration board (ie, the first PCB board 1 ) is shown in FIG. 4 .

Specifically, as shown in FIG. 7 , FIG. 8 and FIG. 10 , in the case of applications requiring less shielding, the second PCB board 2 can also be a double-sided board, thereby reducing the cost. Specifically, the second PCB board 2 includes two layers of copper layers, and the two layers of copper layers are the second signal layer 27 and the ground layer 28 distributed up and down, that is, the bottom layer is the ground layer 28, the top layer is the second signal layer 27, and the first layer is the ground layer 28. The second signal layer 27 is the third conductive line 27 on the second PCB board 2 . A dielectric layer 29 is further included between the second signal layer 27 and the ground layer 28 , and the second signal layer 27 and the ground layer 28 are respectively attached to the upper and lower surfaces of the dielectric layer 29 .

The ground layer 28 of the second PCB board 2 is also connected to the bottom ground layer 11 of the first PCB board by the surface mount technology. The second PCB board 2 is also provided with metallized vias 3, and the second signal layer 27 passes through The metallized via 3 is connected to the first PCB board 1, so that the second conductive line on the first PCB board 1 is electrically connected with the third conductive line on the second PCB board 2; and the second PCB board 2 also passes through The metallized via hole 3 shares the ground with the first PCB board 1 .

In addition, the present invention uses the second PCB board to connect the conductive lines on the first PCB board, which can ensure the consistency of the electrical performance of the lines, and has high stability, and can fully consider the electrical parameters of the cascaded parts of the two PCB boards in the design. matching performance for optimal interconnect design.

The technical content and technical features of the present invention have been disclosed as above. However, those skilled in the art may still make various replacements and modifications based on the teaching and disclosure of the present invention without departing from the spirit of the present invention. Therefore, the protection scope of the present invention should not be limited to The contents disclosed in the embodiments should include various substitutions and modifications without departing from the present invention, and are covered by the claims of this patent application.

Claims (10)

1. A PCB board jumper structure of an antenna system, characterized in that it comprises a first PCB board and at least one second PCB board, and the first PCB board is provided with a first conductive line and at least one second conductive line circuit, the second PCB board is attached to the first PCB board, and the second PCB board is provided with a third conductive circuit intersecting with the first conductive circuit, the third conductive circuit It is electrically connected with the second conductive circuit; the area of the second PCB board is smaller than that of the first PCB board. 2 . The PCB board jumper structure of the antenna system according to claim 1 , wherein the second PCB board is attached to the first PCB board by a surface mount method. 3 . 3 . The PCB board jumper structure of the antenna system according to claim 1 , wherein the second PCB board is electrically connected to the first PCB board through metallized via holes. 4 . 4 . The PCB board jumper structure of the antenna system according to claim 3 , wherein the metallized via holes are arranged around the third conductive circuit on the second PCB board and form a closed circle. 5 . , the metallized via is connected to the ground layer of the second PCB board and the ground layer of the first PCB board. 5 . The PCB board jumper structure of the antenna system according to claim 3 , wherein the metallized via holes are arranged on the second PCB board, so that the third conductive line and the second conductive line are electrically connected. 6 . 6 . The PCB board jumper structure of the antenna system according to claim 1 , wherein the second PCB board is formed by pressing two double-sided metal clad plates, and it comprises a A top ground layer, a signal layer and a bottom ground layer, the signal layer forming the third conductive trace. 7. The PCB board jumper structure of the antenna system according to claim 5, wherein the second PCB board further comprises a top dielectric layer, a bottom dielectric layer and an adhesive dielectric layer, and the top ground layer is attached to the the upper surface of the top dielectric layer, the signal layer and the bottom ground layer are respectively attached to the upper and lower surfaces of the bottom dielectric layer, and the top dielectric layer and the signal layer are laminated through the adhesive dielectric layer . 8 . The PCB board jumper structure of the antenna system according to claim 6 , wherein the first PCB board comprises two second conductive lines, and two ends of the third conductive lines pass through metallized via holes. 9 . They are respectively electrically connected with the two second conductive lines, and the two connection ends of the two second conductive lines and the third conductive lines are respectively located on both sides of the first conductive lines. 9 . The PCB board jumper structure of the antenna system according to claim 8 , wherein the second PCB board is a double-sided metal-clad board, which comprises a signal layer and a ground layer, and the signal layer forms the The third conductive circuit, the second PCB board further includes a dielectric layer, and the signal layer and the ground layer are respectively pressed on the upper and lower surfaces of the dielectric layer. 10 . The PCB board jumper structure of the antenna system according to claim 1 , wherein the first PCB board is a massive multiple-input multiple-output antenna calibration board. 11 .

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