CN111823128A

CN111823128A - Semiconductor wafer processing equipment

Info

Publication number: CN111823128A
Application number: CN202010665531.8A
Authority: CN
Inventors: 赵宏
Original assignee: Guangdong Ziyou Machinery Technology Co ltd
Current assignee: Guangdong Ziyou Machinery Technology Co ltd
Priority date: 2020-07-11
Filing date: 2020-07-11
Publication date: 2020-10-27

Abstract

The invention discloses a semiconductor wafer processing device, which structurally comprises a supporting host machine, a control panel, a slider, a supporting table, a motor, a grinding wheel and a wafer placing mechanism, wherein the control panel is embedded on the front surface of the supporting host machine, clamping pieces are used for tightly adhering the upper side surface and the lower side surface of the outer side of a wafer, the outer side of the wafer is rotated along a rotating wheel through the rotating force generated in the grinding process of the grinding wheel, the grinding wheel is ensured to comprehensively grind the surface of the wafer, the clamping rotating rod is rotated to be clamped with a positioning clamping groove, the wafer is turned, the grinding efficiency of the wafer is improved, a traction rope is used for traction and pulling, a connecting disc is driven to stably move downwards, at the moment, four piston plates synchronously perform piston motion in four air pipes, at the moment, the inner part of a sucking disc is in a vacuum state, at the moment, the, meanwhile, only the bottom surface of the wafer is adsorbed, so that the surface of the wafer is not influenced by grinding, and the wafer can be comprehensively ground.

Description

Semiconductor wafer processing equipment

Technical Field

The invention relates to the field of wafer photoetching developing equipment, in particular to semiconductor wafer processing equipment.

Background

When a semiconductor wafer is produced, a wafer grinding machine is needed to grind the surface layer of the wafer, saw marks and damages generated on the surface of the wafer during cutting are removed, and the surface of the wafer reaches required smoothness, but because the wafer is thin, the grinding machine needs to clamp the outer side of the wafer in the process of grinding the wafer, so that the situation that the grinding wheel causes the position deviation of the wafer in the grinding process is avoided, the grinding effect of the surface of the outer side joint of the wafer is reduced due to the fact that the outer side of the wafer is abutted against a clamp, the front side and the back side of the wafer need to be ground, the wafer needs to be detached from the clamp to be turned over, the clamping is repositioned, and the grinding efficiency of the grinding wheel is reduced.

Disclosure of Invention

The technical scheme adopted by the invention for realizing the technical purpose is as follows: the semiconductor wafer processing equipment structurally comprises a supporting host machine, a control panel, a slider, a supporting table, a motor, a grinding wheel and a wafer placing mechanism, wherein the control panel is embedded on the front surface of the supporting host machine, the slider is installed on the right side surface of the supporting host machine and is in sliding connection with the supporting table, the motor fixes the upper end of the supporting table, the output end of the motor and the grinding wheel synchronously rotate, the grinding wheel is positioned below the supporting table, the grinding wheel is positioned above the wafer placing mechanism, the wafer placing mechanism is fixedly installed at the right end of the supporting host machine, the wafer placing mechanism comprises a placing frame plate, an air cylinder, a clamping mechanism and a bearing table, the bottom surface of the placing frame plate is fixedly installed at the right end of the supporting host machine, the air cylinder is arranged on the outer side of the placing frame plate, the clamping mechanism is located inside the placing frame plate, the bearing table is fixedly installed on the bottom surface of the inner side of the placing frame plate and located below the clamping mechanism, and the two cylinders and the two clamping mechanisms are arranged and are symmetrically installed on the left side and the right side of the placing frame plate.

As a further improvement of the invention, the clamping mechanism comprises a connecting block, pulleys, a limiting mechanism, a push rod and a clamping head, the connecting block is fixed with the output end of the cylinder, the right end of the connecting block is provided with the pulleys, the pulleys are connected with the inner wall of the push rod in a sliding manner, the limiting mechanism is fixedly arranged at the connecting position between the connecting block and the inside of the push rod, the right end of the push rod is provided with a clamping head, the pulleys are provided with two pulleys and are arranged on the upper side and the lower side of the right end of the connecting block, and an annular groove matched with.

As a further improvement of the invention, the limiting mechanism comprises a rotating block, a clamping rotating rod, two fixing rings and two positioning clamping grooves, wherein the rotating block is fixed with the inner part of the push rod, the clamping rotating rod is fixedly arranged on the outer side of the rotating block, the fixing rings are arranged on the outer side of the rotating block and positioned on the same circle center, the fixing rings are fixed with the right end of the connecting block, the positioning clamping grooves are formed in the inner wall of the fixing rings, the clamping rotating rods are connected with the positioning clamping grooves in a clamping mode, and the two positioning clamping grooves are respectively arranged on the upper side and the lower side of the inner wall of the fixing ring and are.

As a further improvement of the invention, the clamping head comprises a clamping edge plate, springs, clamping pieces and guide rods, wherein the springs are fixedly arranged on the inner wall of the clamping edge plate, the springs and the clamping pieces are fixed, the clamping pieces are positioned in the clamping edge plate, the guide rods are fixedly arranged in the clamping edge plate, the guide rods penetrate through the clamping pieces in a clearance fit manner, the clamping edge plate is of a groove-shaped arc plate structure, twelve springs are arranged, and the two springs are in a group and are uniformly distributed at the connecting positions of the clamping pieces and the clamping edge plate.

As a further improvement of the invention, the clamping piece comprises a clamping plate, hinged plates and rotating wheels, the hinged plates are fixedly arranged in the clamping plate, the guide rods penetrate through the clamping plate in a clearance fit manner, the hinged plates are connected with rotating wheel shafts, and the two rotating wheels are respectively arranged at the head end and the tail end of the hinged plates.

As a further improvement of the invention, the plummer comprises an expansion piece, a touch panel and an adsorption mechanism, wherein the bottom surface of the expansion piece is fixedly arranged on the bottom surface of the inner side of the placing frame plate, the bottom of the touch panel is arranged inside the upper end of the expansion piece in a clearance fit manner, the adsorption mechanism is arranged inside the upper end of the touch panel, the expansion piece and the touch panel are both in a cylindrical structure, the inner diameter of the expansion piece is matched with the outer diameter of the touch panel, and the expansion piece is in control connection through a control panel.

As a further improvement of the invention, the adsorption mechanism comprises suckers, air pipes, a piston plate, a connecting disc, traction ropes, a pull rod and clamping rods, wherein the suckers are embedded in the upper surface of the interior of the touch panel, the air pipes are arranged at the lower ends of the suckers, the piston plate is installed at the lower end of the interior of the air pipes in a clearance fit manner, the lower end of the piston plate is fixed to the upper surface of the connecting disc, the lower end of the connecting disc is wound around the head ends of the traction ropes, the tail ends of the traction ropes are wound around the pull rod, the pull rod penetrates through the interior of the touch panel in a clearance fit manner, the clamping rods are fixedly installed on the outer side surface of the touch panel, the clamping rods are connected with the interior of the pull rod in a clamping manner, the suckers are arranged in four numbers and are uniformly distributed on four directions in.

The invention has the beneficial effects that:

1. the clamping head pastes tightly to wafer both sides surface, make the clamping piece paste tightly to the upper and lower both sides surface in the wafer outside, the turning force through grinding wheel grinding in-process production, make the outside of wafer rotate along rotating the wheel, the conversion takes place for the conflict area on the outside surface of clamping piece and wafer simultaneously, ensure that grinding wheel carries out comprehensive grinding to wafer surface, through rotating the clamping head, make the turning block rotate round solid fixed ring, at this moment, rotate through the screens bull stick and carry out the block with positioning channel section, ensure that the clamping head rotates one hundred eighty degrees, turn over the wafer, the grinding efficiency to the wafer has been improved.

2. The pulling pull rod is used for pulling the pulling rope, the connecting disc is driven to move stably downwards, the four piston plates synchronously move in the four air pipes, the sucking disc is in a vacuum state, the sucking disc and the bottom surface of the wafer are firmly adsorbed, the bottom surface of the wafer is adsorbed, the surface of the wafer is not affected by grinding, and comprehensive grinding can be performed.

Drawings

FIG. 1 is a schematic structural diagram of a semiconductor wafer processing apparatus according to the present invention.

Fig. 2 is a schematic top view of a wafer placing mechanism according to the present invention.

Fig. 3 is a schematic view of an internal structure of the clamping mechanism of the present invention.

Fig. 4 is a schematic structural diagram of a limiting mechanism according to the present invention.

Fig. 5 is a schematic perspective view of a chuck according to the present invention.

Fig. 6 is a schematic top view of a clip according to the present invention.

Fig. 7 is a schematic perspective view of a carrier table according to the present invention.

Fig. 8 is a schematic diagram of an internal structure of an adsorption mechanism according to the present invention.

In the figure: a supporting host machine-1, a control panel-2, a slider-3, a supporting table-4, a motor-5, a grinding wheel-6, a wafer placing mechanism-7, a placing frame plate-71, a cylinder-72, a clamping mechanism-73, a bearing table-74, a connecting block-731, a pulley-732, a limiting mechanism-733, a push rod-734, a clamping head-735, a rotating block-33 a, a clamping rotating rod-33 b, a fixing ring-33 c, a positioning clamping groove-33 d, a clamping edge plate-35 a, a spring-35 b, a clamping piece-35 c, a guide rod-35 d, a clamping plate-c 1, a hinge plate-c 2, a rotating wheel-c 3, a telescopic device-741, a butting panel-742, an adsorption mechanism-743, a suction cup-43 a, a, Air pipe-43 b, piston plate-43 c, connecting disc-43 d, traction rope-43 e, pull rod-43 f and clamping rod-43 g.

Detailed Description

The invention is further described below with reference to the accompanying drawings:

example 1:

as shown in figures 1 to 6:

the invention relates to a semiconductor wafer processing device, which structurally comprises a supporting host machine 1, a control panel 2, a slider 3, a supporting table 4, a motor 5, a grinding wheel 6 and a wafer placing mechanism 7, wherein the control panel 2 is embedded on the front surface of the supporting host machine 1, the slider 3 is arranged on the right side surface of the supporting host machine 1, the slider 3 is connected with the supporting table 4 in a sliding manner, the motor 5 fixes the upper end of the supporting table 4, the output end of the motor 5 and the grinding wheel 6 rotate synchronously, the grinding wheel 6 is positioned below the supporting table 4, the grinding wheel 6 is positioned above the wafer placing mechanism 7, the wafer placing mechanism 7 is fixedly arranged at the right end of the supporting host machine 1, the wafer placing mechanism 7 comprises a placing frame plate 71, an air cylinder 72, a clamping mechanism 73 and a bearing table 74, the bottom surface of the placing frame plate 71 is fixedly arranged, place the frame 71 outside and be equipped with cylinder 72 to cylinder 72 output is fixed mutually with clamping mechanism 73, clamping mechanism 73 is located places inside the frame 71, plummer 74 fixed mounting is in placing the inboard bottom surface of frame 71 to plummer 74 is located clamping mechanism 73 below, cylinder 72 and clamping mechanism 73 all are equipped with two to be bilateral symmetry and install in the left and right sides of placing frame 71, do benefit to and carry out the clamping to wafer outside both sides, ensure to carry out the location grinding to the wafer.

The clamping mechanism 73 comprises a connecting block 731, a pulley 732, a limiting mechanism 733, a push rod 734 and a clamping head 735, the connecting block 731 is fixed to the output end of the air cylinder 72, the pulley 732 is arranged at the right end of the connecting block 731, the pulley 732 is slidably connected to the inner wall of the push rod 734, the limiting mechanism 733 is fixedly mounted at the connection position between the connecting block 731 and the push rod 734, the clamping head 735 is arranged at the right end of the push rod 734, the two pulleys 732 are arranged on the upper side and the lower side of the right end of the connecting block 731, an annular groove matched with the width of the pulley 732 is formed in the push rod 734, the pulley 732 is ensured to slide in the push rod 734, and the push rod 734 can rotate.

Wherein, stop mechanism 733 includes turning block 33a, screens bull stick 33b, solid fixed ring 33c, positioning groove 33d, turning block 33a is fixed mutually with push rod 734 is inside, turning block 33a outside fixed mounting has screens bull stick 33b, the turning block 33a outside is equipped with solid fixed ring 33c and is located same centre of circle, gu fixed ring 33c is fixed mutually with connecting block 731 right-hand member, gu fixed ring 33c inner wall is equipped with positioning groove 33d to screens bull stick 33b is connected with positioning groove 33d block, positioning groove 33d is equipped with two altogether, installs respectively that the upper and lower both sides at solid fixed ring 33c inner wall are upper and lower symmetrical structure, does benefit to and rotates through screens bull stick 33b and carries out the screens with positioning groove 33d, ensures that turning block 33a rotates one hundred eighty degrees round solid fixed ring 33c is inside, overturns the dress chuck.

Wherein, dress chuck 735 includes card limit board 35a, spring 35b, clamping piece 35c, guide bar 35d, card limit board 35a inner wall fixed mounting has spring 35b, spring 35b is fixed mutually with clamping piece 35c to clamping piece 35c is located inside the card limit board 35a, guide bar 35d fixed mounting is inside card limit board 35a to guide bar 35d adopts clearance fit to run through inside clamping piece 35c, card limit board 35a is recess type arc plate structure, does benefit to the clamping to the wafer edge, spring 35b is equipped with twelve altogether, and two are a set of, and evenly distributed is in clamping piece 35c and the inside junction of card limit board 35a, does benefit to the buffer adjustment to clamping piece 35c, ensures clamping piece 35c to the effectual clamping of wafer edge, prevents that the skew from taking place for the wafer position.

The clamping piece 35c comprises a clamping plate c1, a hinge plate c2 and a rotating wheel c3, a hinge plate c2 is fixedly mounted in the clamping plate c1, the guide rod 35d penetrates through the clamping plate c1 in a clearance fit mode, the hinge plate c2 is connected with the rotating wheel c3 through a shaft, two rotating wheels c3 are arranged at the head end and the tail end of the hinge plate c2 respectively, sliding of the outer side of a wafer is facilitated, fixed-point rotation of the wafer is guaranteed, the edge of the wafer and the contact surface of the clamping plate c1 are converted, and the surface layer of the wafer is ground by the grinding wheel.

The specific use mode and function of the embodiment are as follows:

in the invention, a wafer is placed on the upper surface of a bearing table 74, two air cylinders 72 are controlled by a control panel 2 to synchronously move, a push rod 734 drives a clamping head 735 to move, the clamping head 735 tightly adheres to the two side surfaces of the wafer, clamping pieces 35c tightly adhere to the upper and lower side surfaces of the outer side of the wafer through the elastic force of a spring 35b, then a motor 5 is started to rotate a grinding wheel 6 to grind the surface of the wafer, the circle center of the wafer is ensured not to deviate in the grinding process of the wafer, the outer side of the wafer is rotated along a rotating wheel c3 through the rotating force generated in the grinding process of the grinding wheel 6, the circle center of the wafer is prevented from deviating, meanwhile, the contact area between the clamping pieces 35c and the outer side surface of the wafer is converted, the grinding wheel 6 is ensured to comprehensively grind the surface of the wafer, after one surface layer is ground, through rotating clamping head 735 for turning block 33a rotates around solid fixed ring 33c, at this moment rotates through screens bull stick 33b and carries out the block with positioning groove 33d, ensures clamping head 735 and rotates one hundred eighty degrees, carries out the turn-over with the wafer, need not after the turn-over to fix a position the wafer centre of a circle, has improved the efficiency of grinding to the wafer.

Example 2:

as shown in fig. 7 to 8:

the carrying platform 74 includes a retractor 741, a contact panel 742 and an adsorption mechanism 743, the bottom of the retractor 741 is fixedly mounted on the bottom of the inner side of the frame 71, the bottom of the contact panel 742 is mounted inside the upper end of the retractor 741 through clearance fit, the adsorption mechanism 743 is disposed inside the upper end of the contact panel 742, the retractor 741 and the contact panel 742 are both in cylindrical structures, the inner diameter of the retractor 741 is matched with the outer diameter of the contact panel 742, the retractor 741 is in control connection with the control panel 2, the contact panel 742 is driven by the retractor 741 to retract the contact panel 742 into the retractor 741, and the contact panel 742 can be retracted into the retractor 741.

Wherein, the suction mechanism 743 includes a suction cup 43a, an air tube 43b, a piston plate 43c, a connection disc 43d, a pulling rope 43e, a pulling rod 43f, and a clamping rod 43g, the suction cup 43a is embedded in the upper surface of the inner part of the interference panel 742, the air tube 43b is disposed at the lower end of the suction cup 43a, the piston plate 43c is mounted at the lower end of the inner part of the air tube 43b by clearance fit, the lower end of the piston plate 43c is fixed to the upper surface of the connection disc 43d, the lower end of the connection disc 43d is wound around the head end of the pulling rope 43e, the tail end of the pulling rope 43e is wound around the pulling rod 43f, the pulling rod 43f penetrates through the inner part of the interference panel 742 by clearance fit, the clamping rod 43g is fixedly mounted on the outer side surface of the interference panel 742, the clamping rod 43g is connected with the inner part of the pulling rod 43f by snap, do benefit to and carry out firm absorption to the bottom surface of wafer, ensure that the wafer can not take place the skew in the position of the in-process central point that grinds, connection pad 43d is disc type structure to haulage rope 43e twines with connection pad 43 d's centre of a circle department, does benefit to and ensures to drive connection pad 43d and carries out steady downstream, has spurred four piston plates 43c simultaneously and has carried out the atmospheric pressure change in trachea 43b is inside, makes sucking disc 43a carry out firm absorption to the bottom surface of wafer.

The specific use mode and function of the embodiment are as follows:

in the invention, a wafer is placed on the touch panel 742, the telescopic device 741 is controlled to work through the control panel 2, the height of the touch panel 742 is adjusted, the touch panel 742 is prevented from colliding with the clamping mechanism 73, then the pull rod 43f is pulled, the pulling rope 43e is pulled to drive the connecting disc 43d to move downwards stably, at the moment, the four piston plates 43c synchronously perform piston motion in the four air pipes 43b to change the air pressure in the air pipes 43b, at the moment, the inside of the suction disc 43a is in a vacuum state, at the moment, the suction disc 43a is firmly adsorbed with the bottom surface of the wafer, the center of the circle of the wafer is positioned, the wafer is ensured not to deviate in the grinding process, at the same time, only the bottom surface of the wafer is adsorbed, the surface of the wafer is ensured not influenced by grinding, and comprehensive grinding can be performed.

The technical solutions of the present invention or similar technical solutions designed by those skilled in the art based on the teachings of the technical solutions of the present invention are all within the scope of the present invention to achieve the above technical effects.

Claims

1. A semiconductor wafer processing device structurally comprises a supporting host (1), a control panel (2), a slider (3), a supporting platform (4), a motor (5), a grinding wheel (6) and a wafer placing mechanism (7), a control panel (2) is embedded on the front surface of the supporting host (1), the slider (3) is arranged on the right side surface of the supporting host (1), the slider (3) is connected with the supporting platform (4) in a sliding way, the motor (5) fixes the upper end of the supporting platform (4), the output end of the motor (5) rotates synchronously with the grinding wheel (6), and the grinding wheel (6) is positioned below the support table (4), the grinding wheel (6) is positioned above the wafer placing mechanism (7), wafer placement machine constructs (7) fixed mounting and is in support host computer (1) right-hand member, its characterized in that:

wafer placement machine constructs (7) including placing deckle board (71), cylinder (72), clamping machine structure (73), plummer (74), place deckle board (71) bottom surface fixed mounting and support host computer (1) right-hand member, it is equipped with cylinder (72) to place deckle board (71) outside to cylinder (72) output is fixed mutually with clamping machine structure (73), clamping machine structure (73) are located and place deckle board (71) inside, plummer (74) fixed mounting is in placing deckle board (71) inboard bottom surface, and plummer (74) are located clamping machine structure (73) below.

2. The semiconductor wafer processing apparatus of claim 1, wherein: clamping mechanism (73) are including connecting block (731), pulley (732), stop gear (733), push rod (734), clamping head (735), connecting block (731) are fixed with cylinder (72) output, connecting block (731) right-hand member is equipped with pulley (732) to pulley (732) and push rod (734) inner wall sliding connection, connecting block (731) and push rod (734) internal connection department fixed mounting have stop gear (733), push rod (734) right-hand member is equipped with clamping head (735).

3. The semiconductor wafer processing apparatus of claim 2, wherein: stop gear (733) includes turning block (33 a), screens bull stick (33 b), solid fixed ring (33 c), positioning groove (33 d), turning block (33 a) is fixed mutually with push rod (734) inside, turning block (33 a) outside fixed mounting has screens bull stick (33 b), turning block (33 a) outside is equipped with solid fixed ring (33 c) and is located same centre of a circle, gu fixed ring (33 c) is fixed mutually with connecting block (731) right-hand member, gu fixed ring (33 c) inner wall is equipped with positioning groove (33 d) to screens bull stick (33 b) is connected with positioning groove (33 d) block.

4. The semiconductor wafer processing apparatus of claim 2, wherein: dress chuck (735) is including card sideboard (35 a), spring (35 b), clamping piece (35 c), guide bar (35 d), card sideboard (35 a) inner wall fixed mounting has spring (35 b), spring (35 b) are fixed mutually with clamping piece (35 c) to clamping piece (35 c) are located inside card sideboard (35 a), guide bar (35 d) fixed mounting is inside card sideboard (35 a) to guide bar (35 d) adopt clearance fit to run through inside clamping piece (35 c).

5. The semiconductor wafer processing apparatus of claim 4, wherein: the clamping piece (35 c) comprises a clamping plate (c 1), a hinge plate (c 2) and a rotating wheel (c 3), the hinge plate (c 2) is fixedly installed inside the clamping plate (c 1), the guide rod (35 d) penetrates through the clamping plate (c 1) in a clearance fit mode, and the hinge plate (c 2) is connected with the rotating wheel (c 3) through a shaft.

6. The semiconductor wafer processing apparatus of claim 1, wherein: the bearing table (74) comprises a telescopic device (741), an abutting panel (742) and an adsorption mechanism (743), wherein the bottom surface of the telescopic device (741) is fixedly installed on the bottom surface of the inner side of the placement frame plate (71), the bottom of the abutting panel (742) is installed inside the upper end of the telescopic device (741) in a clearance fit mode, and the adsorption mechanism (743) is arranged inside the upper end of the abutting panel (742).

7. The semiconductor wafer processing apparatus of claim 6, wherein: the adsorption mechanism (743) comprises a suction disc (43 a), an air pipe (43 b), a piston plate (43 c), a connecting disc (43 d), a traction rope (43 e), a pull rod (43 f) and a clamping rod (43 g), wherein the suction disc (43 a) is embedded in the upper surface of the inner part of the collision panel (742), the air pipe (43 b) is arranged at the lower end of the suction disc (43 a), the piston plate (43 c) is installed at the lower end of the inner part of the air pipe (43 b) in a clearance fit mode, the lower end of the piston plate (43 c) is fixed with the upper surface of the connecting disc (43 d), the lower end of the connecting disc (43 d) is wound with the head end of the traction rope (43 e), the tail end of the traction rope (43 e) is wound with the pull rod (43 f), the pull rod (43 f) penetrates through the collision panel (742) in a clearance fit mode, and the clamping rod (43 g) is fixedly, the clamping rod (43 g) is connected with the inner part of the pull rod (43 f) in a clamping way.