CN111816640A - A BGA electromagnetic shielding package structure and manufacturing method thereof - Google Patents

Abstract

The invention relates to a BGA electromagnetic shielding packaging structure and a manufacturing method thereof, wherein the packaging structure comprises a substrate (1), an element (2) is attached to the surface of the substrate (1), two rows of copper columns (3) which are arranged in a staggered mode are arranged on the periphery of the element (2), a plastic packaging material (4) is encapsulated in the peripheral area of the element (2) and the copper columns (3), the top of each copper column (3) is exposed out of the upper surface of the plastic packaging material (4), sputtering layers (5) are arranged on the upper surfaces of the plastic packaging material (4) and the copper columns (3), and metal balls (6) are arranged on the back surface of the substrate (1). The invention relates to a BGA electromagnetic shielding packaging structure and a manufacturing method thereof, which can solve the problems that the side sputtering quality of the existing product is poor and the shielding requirement is difficult to meet.

Description

A BGA electromagnetic shielding package structure and manufacturing method thereof

technical field

The invention relates to a BGA electromagnetic shielding packaging structure and a manufacturing method thereof, belonging to the technical field of semiconductor packaging.

Background technique

During the sputtering process of BGA products, the bottom solder balls need to be protected to avoid short circuit caused by conduction between the sputtered metal layer and the bottom solder balls during the sputtering process. The solution to this problem in the prior art is:

Step 1: Press the encapsulated whole product on the first protective film. The first protective film can protect the bottom pins or solder balls to prevent the bottom pins or solder balls from being plated on the bottom pins or solder balls during sputtering;

Step 2: Cut the whole product into single products;

Step 3: Transfer a single product to the PI film, and arrange it on the PI film in an array with a certain spacing;

Step 4: Sputtering a metal layer on the top surface and surrounding sides of the single product completed in Step 3;

Step 5: peel off the PI film on the single product after sputtering;

Step 6: Paste a second protective film with higher viscosity on the first protective film, so that the first protective film can be separated from the single product after sputtering through the second protective film.

The above-mentioned prior art process is relatively complicated, and each step is indispensable, which is time-consuming and labor-intensive, and leads to increased cost. In addition, the sputtering quality of the side surface of the product obtained by the above-mentioned solution is poor, so that it is difficult to meet the shielding requirements.

SUMMARY OF THE INVENTION

The technical problem to be solved by the present invention is to provide a BGA electromagnetic shielding package structure and a manufacturing method for the above-mentioned prior art, which can solve the problem that the side sputtering quality of the existing product is poor and it is difficult to meet the shielding requirements.

The technical scheme adopted by the present invention to solve the above problems is:

A BGA electromagnetic shielding package structure comprises a substrate, the surface of the substrate is mounted with elements, the outer periphery of the element is provided with two rows of staggered inner and outer copper pillars, and the peripheral area of the element and the copper pillars is encapsulated with a plastic sealing compound, The top of the copper column is exposed on the upper surface of the plastic sealing compound, the plastic sealing compound and the upper surface of the copper column are provided with a sputtering layer, and the backside of the substrate is provided with metal balls.

A BGA electromagnetic shielding package structure comprises a substrate, the surface of the substrate is mounted with elements, the outer periphery of the element is provided with two rows of staggered inner and outer copper pillars, and the peripheral area of the element and the copper pillars is encapsulated with a plastic sealing compound, The upper surface of the plastic sealing compound is provided with openings at the corresponding positions of the copper pillars, the openings expose the tops of the copper pillars, and a sputtering layer is arranged on the upper surface of the plastic sealing compound and in the openings, and the sputtering layers are in phase with the tops of the copper pillars. connection, the back of the substrate is provided with metal balls.

A manufacturing method of a BGA electromagnetic shielding package structure, the method comprises the following steps:

Step 1. Lay dry film on the surface of the substrate;

Step 2, exposure and development to remove the dry film in the area that needs to be electroplated on the copper column subsequently;

Step 3, electroplating copper pillars, and plating two rows of interlaced copper pillars on the edge of each unit product;

Step 4, remove the remaining dry film;

Step 5. Mount components on the inner area of the copper column on the surface of the substrate;

Step 6: Encapsulate the surface of the substrate, and encapsulate the mounted components and the copper pillars with plastic encapsulating compound;

Step 7, thinning the upper surface of the molding compound or exposing the top of the copper column by drilling;

Step 8, sputtering the upper surface of the entire packaged product, and the sputtering layer covers the exposed copper column and the upper surface of the plastic sealing compound;

Step 9. Carry out ball planting at the bottom of the entire packaged product;

Step 10. Cut the entire packaged product into single products.

Preferably, in step 3, the two rows of copper pillars include an inner row of copper pillars and an outer row of copper pillars, both of which are composed of a plurality of copper pillars.

Preferably, in step 3, the height of the copper column is less than 100um.

Preferably, in step 3, there are gaps between the copper pillars, the gaps between the inner row of copper pillars and the outer row of copper pillars are staggered, and the gap distance is less than 100um.

Compared with the prior art, the advantages of the present invention are:

1. The present invention realizes electromagnetic shielding around the product by plating two rows of staggered copper posts on the substrate, and then sputtering is performed on the upper surface of the entire packaged product, so that the copper posts around and the sputtering on the upper surface are sputtered. The metal layer can meet the overall electromagnetic shielding requirements;

2. In the present invention, when the metal layer is sputtered, the whole packaged product is operated without a single operation, and the sputtering process does not require the bottom film to protect the solder balls before the solder balls are prepared, which saves the production cost and reduces the manufacturing process. Process flow, improve production efficiency;

3. The present invention does not have some defects of the existing BGA sputtering products, such as residual glue, overplating, burrs, etc., and improves the product quality.

Description of drawings

FIG. 1 is a schematic diagram of Embodiment 1 of a BGA electromagnetic shielding package structure according to the present invention.

2 to 11 are schematic diagrams of each process flow of Embodiment 1 of a method for manufacturing a BGA electromagnetic shielding package structure according to the present invention, wherein FIG. 5 is a top view of FIG. 4 .

FIG. 12 is a schematic diagram of Embodiment 2 of a BGA electromagnetic shielding package structure according to the present invention.

13 to 22 are schematic diagrams of each process flow of Embodiment 1 of a method for manufacturing a BGA electromagnetic shielding package structure according to the present invention, wherein FIG. 16 is a top view of FIG. 15 .

in:

Substrate 1

Element 2

copper pillar 3

Plastic compound 4

Sputtering layer 5

Metal Ball 6

Opening 7.

Detailed ways

The present invention will be further described in detail below with reference to the embodiments of the accompanying drawings.

Example 1:

As shown in FIG. 1 , a BGA electromagnetic shielding package structure involved in the present invention includes a substrate 1 , and an element 2 is mounted on the surface of the substrate 1 , and two rows of copper pillars 3 staggered inside and outside are arranged on the periphery of the element 2 . , the peripheral area of the element 2 and the copper column 3 is encapsulated with a plastic sealing compound 4, the top of the copper column 3 is exposed on the upper surface of the plastic sealing compound 4, and the upper surface of the plastic sealing compound 4 and the copper column 3 is provided with a sputtering layer 5, so The backside of the substrate 1 is provided with metal balls 6;

Its manufacturing method includes the following steps:

Step 1. Referring to Figure 2, dry film is laid on the surface of the substrate;

Step 2: Referring to Figure 3, the dry film is exposed and developed, part of the dry film is removed, and the copper column area that needs to be electroplated later is exposed;

Step 3: Referring to Figure 4 and Figure 5, electroplating copper pillars in the area where the dry film is exposed, and plating the edges of each unit product with two rows of staggered inner and outer copper pillars;

The height of the copper pillars is less than 100um, the inner row of copper pillars and the outer row of copper pillars are composed of multiple copper pillars, there are gaps between the copper pillars, the gap distance is less than 100um, and the gaps between the inner row of copper pillars and the outer row of copper pillars are staggered;

Step 4. Referring to Figure 6, remove the remaining dry film;

Step 5. Referring to Figure 7, mount components on the inner area of the inner row of copper columns on the surface of the substrate;

Step 6. Referring to FIG. 8 , encapsulate the surface of the substrate, and encapsulate the copper pillars and the mounted components with plastic sealing compound;

Step 7. Referring to Figure 9, thin the plastic sealing compound on the upper surface until the copper pillars are exposed;

Step 8. Referring to Figure 10, sputtering is performed on the upper surface of the entire packaged product, and the sputtering layer covers the exposed copper pillar and the upper surface of the plastic sealing compound;

Step 9. Referring to Figure 11, ball-planting is performed at the bottom of the entire packaged product;

Step 10. Cut the entire packaged product into single products.

Example 2:

As shown in FIG. 12 , a BGA electromagnetic shielding package structure involved in the present invention includes a substrate 1 , and an element 2 is mounted on the surface of the substrate 1 , and the outer periphery of the element 2 is provided with two rows of staggered copper pillars 3 . , the peripheral area of the element 2 and the copper column 3 is encapsulated with a plastic sealing compound 4, and the upper surface of the plastic sealing compound 4 is provided with an opening 7 at the corresponding position of the copper column 3, and the opening 7 exposes the top of the copper column 3, so A sputtering layer 5 is provided on the upper surface of the plastic sealing compound 4 and in the opening 7, the sputtering layer 5 is connected with the top of the copper column 3, and the backside of the substrate 1 is provided with a metal ball 6;

Its manufacturing method includes the following steps:

Step 1. Referring to Figure 13, lay dry film on the surface of the substrate;

Step 2: Referring to Figure 14, the dry film is exposed and developed, part of the dry film is removed, and the copper column area that needs to be electroplated later is exposed;

Step 3: Referring to Figure 15 and Figure 16, electroplating copper posts in the exposed area of the dry film, and electroplating two rows of staggered inner and outer copper posts on the edge of each unit product;

Step 4. Referring to Figure 17, remove the remaining dry film;

Step 5. Referring to Figure 18, mount components in the inner area of the inner row of copper columns on the surface of the substrate;

Step 6. Referring to Fig. 19, encapsulate the surface of the substrate, and encapsulate the copper pillars and the mounted components with plastic encapsulating compound;

Step 7. Referring to Figure 20, the upper surface of the copper pillar is exposed by means of mechanical drilling, chemical etching or laser drilling;

Step 8. Referring to Figure 21, sputtering is performed on the upper surface of the entire packaged product, and the sputtering layer covers the exposed copper column and the upper surface of the plastic sealing compound;

Step 9. Referring to Figure 22, ball-mounting is performed at the bottom of the entire packaged product;

Step 10. Cut the entire packaged product into single products.

In addition to the above-mentioned embodiments, the present invention also includes other embodiments, and all technical solutions formed by equivalent transformation or equivalent replacement shall fall within the protection scope of the claims of the present invention.

Claims (6)

1. A BGA electromagnetic shielding package structure is characterized in that: it comprises a substrate (1), the surface of the substrate (1) is mounted with an element (2), and the periphery of the element (2) is provided with two rows of inside and outside staggered arrangement The copper pillar (3) of the copper pillar (3), the element (2) and the peripheral area of the copper pillar (3) are encapsulated with a plastic sealing compound (4), and the top of the copper pillar (3) is exposed on the upper surface of the plastic sealing compound (4). The upper surfaces of the plastic sealing compound (4) and the copper pillar (3) are provided with a sputtering layer (5), and the back surface of the substrate (1) is provided with metal balls (6). 2. A BGA electromagnetic shielding package structure, characterized in that: it comprises a substrate (1), the surface of the substrate (1) is mounted with an element (2), and the periphery of the element (2) is provided with two rows of inner and outer staggered arrangement The copper pillar (3), the element (2) and the peripheral area of the copper pillar (3) are encapsulated with a plastic sealing compound (4), and the upper surface of the plastic sealing compound (4) is provided with an opening at the corresponding position of the copper pillar (3). A hole (7), the opening (7) exposes the top of the copper column (3), a sputtering layer (5) is provided on the upper surface of the plastic sealing compound (4) and in the opening (7), and the sputtering layer ( 5) Connected to the top of the copper column (3), and a metal ball (6) is arranged on the back of the substrate (1). 3. a manufacturing method of BGA electromagnetic shielding package structure is characterized in that described method comprises the following steps: Step 1. Lay dry film on the surface of the substrate; Step 2, exposure and development to remove the dry film in the area that needs to be electroplated on the copper column subsequently; Step 3, electroplating copper pillars, and plating two rows of interlaced copper pillars on the edge of each unit product; Step 4, remove the remaining dry film; Step 5. Mount components on the inner area of the copper column on the surface of the substrate; Step 6: Encapsulate the surface of the substrate, and encapsulate the mounted components and the copper pillars with plastic encapsulation compound; Step 7, thinning the upper surface of the molding compound or exposing the top of the copper column by drilling; Step 8, sputtering the upper surface of the entire packaged product, and the sputtering layer covers the exposed copper pillars and the surface of the plastic sealing compound; Step 9. Carry out ball planting at the bottom of the entire packaged product; Step 10. Cut the entire packaged product into single products. 4 . The method for manufacturing a BGA electromagnetic shielding package structure according to claim 3 , wherein in step 3, the two rows of copper pillars include an inner row of copper pillars and an outer row of copper pillars, both of which are composed of a plurality of copper pillars. 5 . 5 . The method for manufacturing a BGA electromagnetic shielding package structure according to claim 3 , wherein in step 3, the height of the copper column is less than 100um. 6 . 6. The method for manufacturing a BGA electromagnetic shielding package structure according to claim 4, wherein in step 3, there are gaps between the copper pillars, the gaps between the inner row of copper pillars and the outer row of copper pillars are staggered, and the gap distance less than 100um.

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