CN111808539A - Hot-melt OCA optical adhesive film and preparation method thereof - Google Patents
Hot-melt OCA optical adhesive film and preparation method thereof Download PDFInfo
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- CN111808539A CN111808539A CN202010942881.4A CN202010942881A CN111808539A CN 111808539 A CN111808539 A CN 111808539A CN 202010942881 A CN202010942881 A CN 202010942881A CN 111808539 A CN111808539 A CN 111808539A
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- 239000012943 hotmelt Substances 0.000 title claims abstract description 88
- 230000003287 optical effect Effects 0.000 title claims abstract description 64
- 239000002313 adhesive film Substances 0.000 title claims abstract description 57
- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- 229920005989 resin Polymers 0.000 claims abstract description 103
- 239000011347 resin Substances 0.000 claims abstract description 103
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 74
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 47
- 125000003944 tolyl group Chemical group 0.000 claims abstract description 46
- -1 polysiloxane Polymers 0.000 claims abstract description 41
- LAQFLZHBVPULPL-UHFFFAOYSA-N methyl(phenyl)silicon Chemical compound C[Si]C1=CC=CC=C1 LAQFLZHBVPULPL-UHFFFAOYSA-N 0.000 claims abstract description 26
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 22
- 239000010703 silicon Substances 0.000 claims abstract description 22
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 21
- 239000004970 Chain extender Substances 0.000 claims abstract description 20
- 239000000654 additive Substances 0.000 claims abstract description 20
- 230000000996 additive effect Effects 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 18
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 18
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 13
- 239000003112 inhibitor Substances 0.000 claims description 33
- 238000004898 kneading Methods 0.000 claims description 29
- 229920002050 silicone resin Polymers 0.000 claims description 28
- 239000002994 raw material Substances 0.000 claims description 17
- 239000003054 catalyst Substances 0.000 claims description 16
- 229910020388 SiO1/2 Inorganic materials 0.000 claims description 15
- 150000001875 compounds Chemical class 0.000 claims description 14
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 claims description 13
- 238000000576 coating method Methods 0.000 claims description 13
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 13
- 239000003795 chemical substances by application Substances 0.000 claims description 12
- 238000001816 cooling Methods 0.000 claims description 12
- 125000000217 alkyl group Chemical group 0.000 claims description 11
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 10
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 claims description 7
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 7
- 229920001903 high density polyethylene Polymers 0.000 claims description 7
- 239000004700 high-density polyethylene Substances 0.000 claims description 7
- 125000000962 organic group Chemical group 0.000 claims description 7
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 claims description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 6
- 238000003490 calendering Methods 0.000 claims description 6
- 229920001577 copolymer Polymers 0.000 claims description 6
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 6
- 239000012528 membrane Substances 0.000 claims description 6
- 229920002545 silicone oil Polymers 0.000 claims description 6
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 claims description 5
- 235000010290 biphenyl Nutrition 0.000 claims description 5
- 239000004305 biphenyl Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 5
- 238000007711 solidification Methods 0.000 claims description 5
- 230000008023 solidification Effects 0.000 claims description 5
- VMAWODUEPLAHOE-UHFFFAOYSA-N 2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 VMAWODUEPLAHOE-UHFFFAOYSA-N 0.000 claims description 4
- LBZNVMHSRIIVQE-UHFFFAOYSA-N C1(=CC=CC=C1)[Pt] Chemical compound C1(=CC=CC=C1)[Pt] LBZNVMHSRIIVQE-UHFFFAOYSA-N 0.000 claims description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 claims description 4
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 4
- 125000003261 o-tolyl group Chemical group [H]C1=C([H])C(*)=C(C([H])=C1[H])C([H])([H])[H] 0.000 claims description 4
- QCRRJEABYLEFAE-UHFFFAOYSA-N (1-hydroperoxycyclohexyl)benzene Chemical compound C=1C=CC=CC=1C1(OO)CCCCC1 QCRRJEABYLEFAE-UHFFFAOYSA-N 0.000 claims description 3
- DTGUZRPEDLHAAO-UHFFFAOYSA-N 3-methylhex-1-yn-3-ol Chemical compound CCCC(C)(O)C#C DTGUZRPEDLHAAO-UHFFFAOYSA-N 0.000 claims description 3
- 125000004122 cyclic group Chemical group 0.000 claims description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 3
- 125000000040 m-tolyl group Chemical group [H]C1=C([H])C(*)=C([H])C(=C1[H])C([H])([H])[H] 0.000 claims description 3
- 125000001037 p-tolyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])[H] 0.000 claims description 3
- KNCZPLRYWQLPQT-UHFFFAOYSA-N 1-tert-butyl-2-propan-2-ylbenzene Chemical compound CC(C)C1=CC=CC=C1C(C)(C)C KNCZPLRYWQLPQT-UHFFFAOYSA-N 0.000 claims description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 229920002554 vinyl polymer Polymers 0.000 description 5
- 238000012545 processing Methods 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- WVGXBYVKFQJQGN-UHFFFAOYSA-N 1-tert-butylperoxy-2-propan-2-ylbenzene Chemical compound CC(C)C1=CC=CC=C1OOC(C)(C)C WVGXBYVKFQJQGN-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229920001621 AMOLED Polymers 0.000 description 1
- CMGIWZLQPKFQBS-UHFFFAOYSA-N C[SiH](C)OC1(CCCCC1)C#C Chemical compound C[SiH](C)OC1(CCCCC1)C#C CMGIWZLQPKFQBS-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 241000519995 Stachys sylvatica Species 0.000 description 1
- 230000006750 UV protection Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/06—Properties of polyethylene
- C08L2207/062—HDPE
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a hot-melt OCA optical adhesive film and a preparation method thereof, wherein the hot-melt OCA optical adhesive film is a novel optical material taking hot-melt resin and organic silicon resin as main bodies, the hot-melt resin comprises thermosetting resin and thermoplastic resin, and the organic silicon resin comprises: reactive methyl phenyl polysiloxane, methyl phenyl T resin, methyl phenyl silicon resin, a phenyl cross-linking agent, a phenyl chain extender and an additive. Compared with the traditional OCA, the invention has excellent light transmission, bonding strength, cold and hot impact resistance and weather resistance.
Description
Technical Field
The invention belongs to the technical field of OCA (optically clear adhesive) optical adhesive, and relates to a hot-melt OCA optical adhesive film and a preparation method thereof.
Background
Global smart mobile phone, wearable intelligent product and touch display screen etc. explosive increases, come sufficient order and development space for OCA optical adhesive tape, and traditional OCA makes no substrate with optics ya keli, then respectively laminates one deck release film (also generally called light from type membrane and heavy from type membrane) again at upper and lower bottom, and many high-end users still require to carry out a action of changing the membrane again in product production process, and it is super from type membrane that high-speed cross cutting technology is changed to original heavy from type membrane of OCA optical adhesive coating production laminating. Because no base material is used, the performance of the OCA optical adhesive is determined to be soft adhesive, and a plurality of difficulties are brought to OCA optical adhesive manufacturers only by two processing technologies of film changing and die cutting: 1, the production must be carried out in an environment with high cleanliness, and the replacement film and the die-cutting rule are ensured not to have broken filaments, broken bits, dirt, foreign matters and the like; 2, the release film is replaced, the die-cutting rule is smooth and the antistatic performance is ensured, and the unevenness under any microscopic condition can generate variable influences on the stability, the atmospheric exposure resistance and the non-transferability of the release force; 3, the phenomena of air bubbles, glue pulling and the like are easily generated in the film changing and die cutting processes, and high-pressure defoaming and the like are needed besides paying attention to keeping the lifting angle of the discharged waste constant and reducing glue overflow. Meanwhile, in the attaching process of the OCA optical adhesive film, defects such as white spots, indentations, bubbles, warping, wrinkles and the like are often generated due to uneven pressure, warm and humid environment, material properties and the like.
Disclosure of Invention
The invention aims to provide a hot-melt OCA optical adhesive film and a preparation method thereof.
In order to achieve the above objects and other related objects, the present invention provides the following technical solutions: the raw material formula of the hot-melt OCA optical adhesive film comprises a hot-melt resin and an organic silicon resin, wherein the ratio of the total mass of the hot-melt resin to the total mass of the organic silicon resin is less than or equal to 0.5 and is greater than or equal to 0.2; the raw material formula of the organic silicon resin comprises the following raw materials in percentage by mass:
50% -90% of reactive methyl phenyl polysiloxane;
10% -50% of methyl phenyl T resin;
10% -30% of methyl phenyl silicone resin;
1% -10% of a phenyl cross-linking agent;
1% -10% of a phenyl chain extender;
0-10% of additive.
The preferable technical scheme is as follows: the hot-melt resin includes a thermosetting resin and a thermoplastic resin; the thermosetting resin is at least one of POSS resin and MQ resin; POSS resins have the general formula:
MQ resin with the general formula (Me)3SiO1/2）n（PhSiO3/2）mMe represents methyl, Ph represents phenyl; wherein n/m is not less than 1/5 and not more than 1/2; the thermoplastic resin is at least one of EVA, TPR, PA, PEA, PES, LOPE and HDPE.
The preferable technical scheme is as follows: each R independently represents an alkyl group, an aralkyl group or other organic group; the alkyl is a straight chain, branched chain or cyclic chain alkyl with 1-10 carbon atoms; the aralkyl is an aralkyl with 7-15 carbon atoms; the other organic groups are EVA group, TPR group, PA group, PEA group, PES group, LOPE group and HDPE group which are respectively removed with one hydrogen atom; the thermoplastic resin is at least one of EVA and TPR.
The preferable technical scheme is as follows: the alkyl is methyl, ethyl, n-propyl or isopropyl; the aralkyl group is p-tolyl, o-tolyl, or m-tolyl; the thermoplastic resin is EVA, and the mass percentage content of the vinyl acetate is 5-20%.
The preferable technical scheme is as follows: the reactive methyl phenyl polysiloxane is at least one of vinyl-terminated dimethyl diphenyl polysiloxane corresponding to a general formula (a), a general formula (b) and a general formula (c),
wherein n =1-20, m =1-20, and n/m ≦ 1/2;
wherein n =1-20, m =1-20, and n/m is not less than 2;
wherein n = 1-10.
The preferable technical scheme is as follows: the methyl phenyl T resin is at least one of the compounds corresponding to the following general formula,
wherein n = 1-10.
The preferable technical scheme is as follows: the methyl phenyl silicone resin is at least one of a copolymer of trimethyl siloxane and vinyl-terminated methyl phenyl polysiloxane, and the molecular structural formula of the methyl phenyl silicone resin is as follows:
（ViMe2SiO1/2）1（Me2SiO）x（Ph2SiO）ySiMe3or (ViMe)2SiO1/2）1（Me2SiO）x（MePhSiO）ySiMe3(ii) a Wherein Vi represents a vinyl group, Me represents a methyl group, Ph represents a phenyl group, x =1-10, and y = 1-10.
The preferable technical scheme is as follows: the phenyl cross-linking agent is hydrogen-terminated T-type phenyl polysiloxane; the structural formula is as follows:
wherein n = 1-5.
The preferable technical scheme is as follows: the phenyl chain extender is linear phenyl silicone oil with a hydrogen end capping, has a functional bond with a Si-H terminal, and has a structural formula as follows:
wherein n = 1-10.
The preferable technical scheme is as follows: the additive includes at least one of a structure control agent, an inhibitor, and a phenyl catalyst.
The preferable technical scheme is as follows: the structure control agent is at least one of compounds in accordance with the following structural formula;
the preferable technical scheme is as follows: the inhibitor is at least one of a silicone-based inhibitor, an alkynol-based inhibitor and a silanol-terminated polymethylvinyl dimethylsiloxane.
The preferable technical scheme is as follows: the silicone-based inhibitor is at least one of tetramethyldivinyldisiloxane and tetramethyltetravinylcyclotetrasiloxane; the alkynol-based inhibitor is at least one of 3-methyl-1-butyn-3-ol, 1-ethynylcyclohexanol, 3-propyl-1-butyn-3-ol and 1-dimethylhydrosiloxy-1-ethynyl-cyclohexane.
The preferable technical scheme is as follows: the phenyl catalyst is at least one of dicumyl peroxide, tert-butyl isopropyl benzene peroxide, 1-phenyl cyclohexyl hydroperoxide and phenyl platinum catalyst.
In order to achieve the above objects and other related objects, the present invention provides the following technical solutions: a preparation method of a hot-melt OCA optical adhesive film comprises the following steps:
step 1: adding reactive methyl phenyl polysiloxane, methyl phenyl T resin, methyl phenyl silicone resin, a phenyl cross-linking agent, a phenyl chain extender and hot-melt resin into a kneader, kneading uniformly at high temperature until colorless and transparent, cooling to room temperature, adding an additive, and kneading uniformly under negative pressure to obtain a hot-melt OCA optical adhesive film base material;
step 2: uniformly calendering or coating the hot-melt OCA optical adhesive film base material on a heavy release film by a calender or a coating machine, heating for solidification, cooling, and then covering a light release film to obtain the hot-melt OCA optical adhesive film.
The preferable technical scheme is as follows: in the step 1, the temperature under the high-temperature condition is 150-300 ℃, and the kneading time under the high-temperature condition is 4-8 hours; the rotating speed of a kneading paddle during kneading is 500-1000 r/min; the vacuum gauge pressure under the negative pressure condition is-0.09 to-0.1 MPa.
Due to the application of the technical scheme, compared with the prior art, the invention has the advantages that:
1. the hot-melt OCA optical adhesive film solves the problems of defects and limitations of the traditional OCA and overcomes the defects and problems caused by the influence of factors such as process, environment and the like in the laminating process of the OCA optical adhesive film. The film does not need to be changed in the manufacturing process, the processing is simple, the adhesion to the base material is high after heat treatment, and the reject ratio is low. Meanwhile, based on the excellent transmittance of the organic silicon material and chemical inertness such as high and low temperature resistance, weather resistance, ultraviolet resistance and the like, the hot-melt OCA can reduce the loss of light emitted by the AMOLED display, increase the brightness of the display, improve the transmittance, reduce the energy consumption, enlarge the visible area and the like.
2. Compared with the traditional OCA, the hot-melt OCA optical adhesive film has excellent light transmittance, bonding strength, cold and hot impact resistance and weather resistance, simplifies the process flows of manufacturing, die cutting processing, TP attaching, reworking and the like, greatly improves the efficiency and yield of attaching the touch screen, and is currently used in the fields of military industry, industrial control, vehicle-mounted and the like in batches. Through tests, the basic performance of the material is as follows: the refractive index is more than or equal to 1.51, the light transmittance is more than or equal to 95% (ITO glass + adhesive layer + ITO glass, OCA is about 90.8%), the haze is less than or equal to 0.1%, the relative dielectric constant is less than or equal to 4, the adhesion force is more than or equal to 200N/25mm (the peeling force is more than or equal to 500N), the pH value is =7 (25 ℃), after double 85 tests and cold-heat impact (-60-90 ℃) for 1000 hours, the light transmission loss rate is less than or equal to 5%, and the adhesion strength loss rate is less than or equal to 10.
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will become apparent to those skilled in the art from the present disclosure.
Example 1: hot-melt OCA optical adhesive film and preparation method thereof
The hot-melt OCA optical adhesive film is an optical grade material taking hot-melt resin and organic silicon resin as main bodies, wherein the hot-melt resin comprises thermoplastic resin, and the organic silicon resin comprises: reactive methyl phenyl polysiloxane, methyl phenyl T resin, methyl phenyl silicone resin, a phenyl cross-linking agent, a phenyl chain extender and an additive; wherein, in the thermoplastic resin and the silicone resin:
the basic condition is that M (hot melt resin)/M (organic silicon resin) is more than or equal to 1/5 and less than or equal to 1/2, wherein M (hot melt resin) is the total mass of the hot melt resin, and M (organic silicon resin) is the total mass of the organic silicon resin. This example M (hot melt resin)/M (silicone resin) = 0.3.
In the silicone resin, by mass fraction:
75 percent of reactive methyl phenyl polysiloxane,
10% of methyl phenyl T resin;
10% of methyl phenyl silicone resin;
2% of a phenyl crosslinking agent;
2.5% of a phenyl chain extender;
0.5 percent of additive.
The hot-melt resin comprises a thermosetting resin and a thermoplastic resin, wherein the thermosetting resin is preferably POSS and MQ, and the POSS has the following molecular structural formula:
in POSS, R is independently selected from the same or different alkyl, aralkyl, or other organic groups; the alkyl is C1-C10 linear chain, branched chain or cyclic chain alkyl, preferably C1-C5 linear chain, branched chain or cyclic alkyl, further preferably C1-C3 linear chain, branched chain or cyclic alkyl, such as methyl, ethyl, n-propyl or isopropyl; and/or the aralkyl is C7-C15 aralkyl, preferably C7-C10 aralkyl, and further preferably C7-C8 aralkyl, such as tolyl, p-tolyl, o-tolyl or m-tolyl; they may in turn each be further substituted with one or more thermoplastic resin organic groups selected from: EVA group, TPR group, PA group, PEA group, PES group, LOPE group, or HDPE group, etc., wherein the EVA-based organic group moiety may include further substitution forms.
Or MQ of the formula (Me)3SiO1/2）n（PhSiO3/2）m(ii) a Wherein n/m is more than or equal to 1/5 and less than or equal to 1/2.
The thermoplastic resin comprises one or more of EVA, TPR, PA, PEA, PES, LOPE or HDPE, EVA and TPR are preferably selected, EVA is further preferably selected, namely an ethylene (E) -Vinyl Acetate (VA) copolymer, and the content of the Vinyl Acetate (VA) is within 5-20%. EVA is specifically selected for the hot-melt resin of this example, and the content of Vinyl Acetate (VA) is 12.4%.
The reactive methyl phenyl polysiloxane is vinyl terminated dimethyl diphenyl polysiloxane, and the structural formula is as follows:
wherein n =1-20, m =1-20, and n/m is less than or equal to 1/2;
wherein n =1-20, m =1-20, and n/m is more than or equal to 2;
wherein n = 1-10.
This example specifically selects a compound according to structural formula (a) with n =10, m =20, n/m = 1/2.
The structural formula of the methyl phenyl T resin is as follows:
wherein n =1~ 10. This embodiment n = 3.
The methyl phenyl silicone resin is an end-capped methyl phenyl polysiloxane copolymer of trimethyl siloxane and vinyl, and the molecular structural formula of the methyl phenyl silicone resin is as follows: (ViMe)2SiO1/2）1（Me2SiO）x（Ph2SiO）ySiMe3Or (ViMe)2SiO1/2）1（Me2SiO）x（MePhSiO）ySiMe3. This example is specifically (ViMe)2SiO1/2）1（Me2SiO）x（Ph2SiO）ySiMe3Wherein x =3 and y = 5.
The phenyl cross-linking agent is hydrogen-terminated T-type phenyl polysiloxane, and the structural formula of the phenyl cross-linking agent is as follows:
wherein n = 1-5. This embodiment n = 1.
The phenyl chain extender is linear phenyl silicone oil with a hydrogen end capping, has a functional bond with a Si-H terminal, and has a structural formula as follows:
wherein n = 1-10. This embodiment n = 2.
The additive comprises one or more of a structure control agent, an inhibitor and a phenyl catalyst. Wherein the structure control agent comprises one or more of the following:
in this example, a compound of formula (d) was specifically selected.
The inhibitor comprises one or more of the following: silicone-based inhibitors, alkynol inhibitors and silanol-terminated polymethylvinyldimethylsiloxanes, and further, the silicone-based inhibitors are preferably tetramethyldivinyldisiloxane, tetramethyltetravinylcyclotetrasiloxane, and the alkynol compounds are preferably 3-methyl-1-butyn-3-ol, 1-ethynylcyclohexanol, 3-propyl-1-butyn-3-ol and 1-dimethylsiloxy-1-ethynylcyclohexane. This example specifically selects 1-ethynylcyclohexanol.
The phenyl catalyst comprises dicumyl peroxide, tert-butylisopropylphenyl peroxide, 1-phenylcyclohexyl hydroperoxide or a phenyl platinum catalyst (CAT-PL-50T). Dicumyl peroxide was specifically chosen for this example.
The preparation method comprises the following steps:
A) adding reactive methyl phenyl polysiloxane, methyl phenyl T resin, methyl phenyl silicone resin, a phenyl cross-linking agent, a phenyl chain extender and hot-melt resin into a kneader, kneading uniformly at high temperature until colorless and transparent, cooling to room temperature, adding an additive, and kneading uniformly under negative pressure to obtain a hot-melt OCA optical adhesive film base material;
B) uniformly calendering or coating the hot-melt OCA optical adhesive film base material on a heavy release film by a calender or a coating machine, heating and curing, cooling, then covering a light release film, and processing to obtain the hot-melt OCA optical adhesive film;
the rotation speed of the kneading paddle is 750r/min, the vacuum negative pressure is-0.095 MPa, the temperature under the high-temperature condition is 200 ℃, and the high-temperature kneading time is within 6 hours.
Example 2: hot-melt OCA optical adhesive film and preparation method thereof
A raw material formula of the hot-melt OCA optical adhesive film comprises hot-melt resin and organic silicon resin, wherein the ratio of the total mass of the hot-melt resin to the total mass of the organic silicon resin is 0.35; the raw material formula of the organic silicon resin comprises the following raw materials in percentage by mass
50% of reactive methyl phenyl polysiloxane;
37% of methyl phenyl T resin;
10% of methyl phenyl silicone resin;
1% of a phenyl crosslinking agent;
1% of phenyl chain extender;
1% of additive.
The preferred embodiment is: the hot-melt resin comprises a mixture of a thermosetting resin and a thermoplastic resin in a mass ratio of 1: 1; the thermosetting resin is POSS resin; POSS resins have the general formula:
r represents different groups, R above the structural formula represents methyl, and R above the structural formula represents o-tolyl.
The thermoplastic resin is TPR and HDPE according to a ratio of 1: 2 in mass ratio.
The preferred embodiment is: the reactive methylphenylpolysiloxane is a vinyl terminated dimethyldiphenylpolysiloxane corresponding to general formula (b) and general formula (c) according to 1:1 in a mass ratio.
Wherein n =8, m =4, and n/m = 2;
in the formula, n = 3.
The preferred embodiment is: the methyl phenyl T resin is a compound conforming to the following general formula,
wherein n = 5.
The preferred embodiment is: the methyl phenyl silicone resin is a copolymer of trimethyl siloxane and vinyl-terminated methyl phenyl polysiloxane, and the molecular structural formula of the methyl phenyl silicone resin is as follows:
（ViMe2SiO1/2）1（Me2SiO）x（Ph2SiO）ySiMe3in the formula, Vi represents a vinyl group, Me represents a methyl group, Ph represents a phenyl group, x =5, and y = 10.
The preferred embodiment is: the phenyl cross-linking agent is hydrogen-terminated T-type phenyl polysiloxane; the structural formula is as follows:
wherein n = 5.
The preferred embodiment is: the phenyl chain extender is linear phenyl silicone oil with a hydrogen end capping, has a functional bond with a Si-H terminal, and has a structural formula as follows:
wherein n = 5.
The preferred embodiment is: the additive includes a structure control agent, an inhibitor, and a phenyl catalyst according to a ratio of 1: 1:1 in a mass ratio.
The preferred embodiment is: the structure controlling agent is a compound corresponding to the following structural formula (a) and a compound of structural formula (b) according to 1:1 in a mass ratio.
The preferred embodiment is: the inhibitor is a silicone-based inhibitor and an alkynol-based inhibitor, wherein the ratio of the silicone-based inhibitor to the alkynol-based inhibitor is 1: 5 in mass ratio.
The preferred embodiment is: the silicone-based inhibitor is tetramethyldivinyldisiloxane; the alkynol-based inhibitor is 3-methyl-1-butyn-3-ol, 1-ethynylcyclohexanol is prepared according to the following weight ratio of 1: 3 in a mass ratio.
The preferred embodiment is: the phenyl catalyst is dicumyl peroxide.
The preparation method comprises the following steps:
step 1: adding reactive methyl phenyl polysiloxane, methyl phenyl T resin, methyl phenyl silicone resin, a phenyl cross-linking agent, a phenyl chain extender and hot-melt resin into a kneader, kneading uniformly at high temperature until colorless and transparent, cooling to room temperature, adding an additive, and kneading uniformly under negative pressure to obtain a hot-melt OCA optical adhesive film base material;
step 2: uniformly calendering or coating the hot-melt OCA optical adhesive film base material on a heavy release film by a calender or a coating machine, heating for solidification, cooling, and then covering a light release film to obtain the hot-melt OCA optical adhesive film.
The preferred embodiment is: in the step 1, the temperature under the high-temperature condition is 280 ℃, and the kneading time under the high-temperature condition is 5 hours; the rotating speed of a kneading paddle during kneading is 800 r/min; the vacuum gauge pressure under the negative pressure condition is-0.095 MPa.
Example 3: hot-melt OCA optical adhesive film and preparation method thereof
A raw material formula of the hot-melt OCA optical adhesive film comprises hot-melt resin and organic silicon resin, wherein the ratio of the total mass of the hot-melt resin to the total mass of the organic silicon resin is equal to; the raw material formula of the organic silicon resin comprises the following raw materials in percentage by mass
63% of reactive methyl phenyl polysiloxane;
13.5 percent of methyl phenyl T resin;
15% of methyl phenyl silicone resin;
3% of a phenyl crosslinking agent;
3% of phenyl chain extender;
2.5 percent of additive.
The preferred embodiment is: the hot-melt resin is prepared from a thermosetting resin and a thermoplastic resin according to the ratio of 1: 3 in a mass ratio; the thermosetting resin is MQ resin;
MQ resin with the general formula (Me)3SiO1/2）n（PhSiO3/2）mMe represents methyl, Ph represents phenyl wherein n/m = 1/3; the thermoplastic resin is EVA and TPR according to the ratio of 1:1, in a mass ratio of 1.
The preferred embodiment is: the reactive methyl phenyl polysiloxane is vinyl terminated dimethyl diphenyl polysiloxane corresponding to a general formula (c),
wherein n = 10.
The preferred embodiment is: the methyl phenyl T resin is at least one of the compounds corresponding to the following general formula,
in the formula, n = 2.
The preferred embodiment is: the methyl phenyl silicone resin is at least one of a copolymer of trimethyl siloxane and vinyl-terminated methyl phenyl polysiloxane, and the molecular structural formula of the methyl phenyl silicone resin is as follows:
（ViMe2SiO1/2）1（Me2SiO）x（MePhSiO）ySiMe3(ii) a In the formula, Vi represents a vinyl group, Me represents a methyl group, Ph represents a phenyl group, x =10, and y = 5.
The preferred embodiment is: the phenyl cross-linking agent is hydrogen-terminated T-type phenyl polysiloxane; the structural formula is as follows:
wherein n = 5.
The preferred embodiment is: the phenyl chain extender is linear phenyl silicone oil with a hydrogen end capping, has a functional bond with a Si-H terminal, and has a structural formula as follows:
wherein n = 5.
The preferred embodiment is: the additive includes a structure control agent, an inhibitor, and a phenyl catalyst according to a ratio of 1: 1:1 in a mass ratio.
The preferred embodiment is: the structure control agent is a compound conforming to the following structural formula;
the preferred embodiment is: the inhibitor is a silicone-based inhibitor, an alkynol-based inhibitor and a silanol-terminated polymethylvinyl dimethylsiloxane in a weight ratio of 1: 1:1 in a mass ratio.
The preferred embodiment is: the silicone-based inhibitor is tetramethyltetravinylcyclotetrasiloxane; the alkynol-based inhibitor is 3-methyl-1-butyn-3-ol, 1-ethynylcyclohexanol is prepared according to the following weight ratio of 1:1 in a mass ratio.
The preferred embodiment is: the phenyl catalyst is dicumyl peroxide, tert-butyl isopropyl phenyl peroxide according to the weight ratio of 1:1 in a mass ratio.
The preparation method comprises the following steps:
step 1: adding reactive methyl phenyl polysiloxane, methyl phenyl T resin, methyl phenyl silicone resin, a phenyl cross-linking agent, a phenyl chain extender and hot-melt resin into a kneader, kneading uniformly at high temperature until colorless and transparent, cooling to room temperature, adding an additive, and kneading uniformly under negative pressure to obtain a hot-melt OCA optical adhesive film base material;
step 2: uniformly calendering or coating the hot-melt OCA optical adhesive film base material on a heavy release film by a calender or a coating machine, heating for solidification, cooling, and then covering a light release film to obtain the hot-melt OCA optical adhesive film.
The preferred embodiment is: in the step 1, the temperature under the high-temperature condition is 300 ℃, and the kneading time under the high-temperature condition is 4 hours; the rotating speed of a kneading paddle during kneading is 1000 r/min; the vacuum gauge pressure under the negative pressure condition is-0.09 MPa.
Example 4: hot-melt OCA optical adhesive film and preparation method thereof
A raw material formula of the hot-melt OCA optical adhesive film comprises hot-melt resin and organic silicon resin, wherein the ratio of the total mass of the hot-melt resin to the total mass of the organic silicon resin is equal to 0.2; the raw material formula of the organic silicon resin comprises the following raw materials in percentage by mass
67% of reactive methyl phenyl polysiloxane;
13% of methyl phenyl T resin;
12% of methyl phenyl silicone resin;
5% of a phenyl crosslinking agent;
1% of phenyl chain extender;
2 percent of additive.
The preferred embodiment is: the hot-melt resin is thermosetting resin; the thermosetting resin is POSS resin and MQ resin according to the proportion of 1:1 in a mass ratio; POSS resins have the general formula:
MQ resin with the general formula (Me)3SiO1/2）n（PhSiO3/2）mMe represents methyl and Ph represents phenyl wherein n/m = 1/4.
The preferred embodiment is: r represents n-propyl.
The preferred embodiment is: the reactive methyl phenyl polysiloxane is vinyl terminated dimethyl diphenyl polysiloxane corresponding to a general formula (b),
wherein n =12, m =3, and n/m = 4.
The preferred embodiment is: the methyl phenyl T resin is at least one of the compounds corresponding to the following general formula,
wherein n = 7.
Preference is given toThe implementation mode of (1) is as follows: the methyl phenyl silicone resin is at least one of a copolymer of trimethyl siloxane and vinyl-terminated methyl phenyl polysiloxane, and the molecular structural formula of the methyl phenyl silicone resin is as follows: (ViMe)2SiO1/2）1（Me2SiO）x（MePhSiO）ySiMe3(ii) a In the formula, Vi represents a vinyl group, Me represents a methyl group, Ph represents a phenyl group, x =1, and y = 5.
The preferred embodiment is: the phenyl cross-linking agent is hydrogen-terminated T-type phenyl polysiloxane; the structural formula is as follows:
in the formula, n = 1.
The preferred embodiment is: the phenyl chain extender is linear phenyl silicone oil with a hydrogen end capping, has a functional bond with a Si-H terminal, and has a structural formula as follows:
in the formula, n = 9.
The preferred embodiment is: the additive includes a structure control agent, an inhibitor, and a phenyl catalyst according to a ratio of 1: 1: 5 in mass ratio.
The preferred embodiment is: the structure control agent is a mixture of compounds in accordance with the following structural formula according to the same proportion;
the preferred embodiment is: the inhibitor is silanol-terminated polymethylvinyl dimethylsiloxane.
The preferred embodiment is: the phenyl catalyst is dicumyl peroxide and a phenyl platinum catalyst according to the weight ratio of 1:1 in a mass ratio.
A preparation method of a hot-melt OCA optical adhesive film comprises the following steps:
step 1: adding reactive methyl phenyl polysiloxane, methyl phenyl T resin, methyl phenyl silicone resin, a phenyl cross-linking agent, a phenyl chain extender and hot-melt resin into a kneader, kneading uniformly at high temperature until colorless and transparent, cooling to room temperature, adding an additive, and kneading uniformly under negative pressure to obtain a hot-melt OCA optical adhesive film base material;
step 2: uniformly calendering or coating the hot-melt OCA optical adhesive film base material on a heavy release film by a calender or a coating machine, heating for solidification, cooling, and then covering a light release film to obtain the hot-melt OCA optical adhesive film.
The preferred embodiment is: in the step 1, the temperature under the high-temperature condition is 150 ℃, and the kneading time under the high-temperature condition is 8 hours; the rotating speed of a kneading paddle during kneading is 500 r/min; the vacuum gauge pressure under negative pressure condition is-0.1 MPa.
The foregoing is illustrative of the preferred embodiment of the present invention and is not to be construed as limiting thereof in any way, and any modifications or variations thereof that fall within the spirit of the invention are intended to be included within the scope thereof.
Claims (16)
1. A hot melt type OCA optics glued membrane which characterized in that: the raw material formula of the hot-melt OCA optical adhesive film comprises hot-melt resin and organic silicon resin, wherein the ratio of the total mass of the hot-melt resin to the total mass of the organic silicon resin is less than or equal to 0.5 and is greater than or equal to 0.2; the raw material formula of the organic silicon resin comprises the following raw materials in percentage by mass:
50% -90% of reactive methyl phenyl polysiloxane;
10% -50% of methyl phenyl T resin;
10% -30% of methyl phenyl silicone resin;
1% -10% of a phenyl cross-linking agent;
1% -10% of a phenyl chain extender;
0-10% of additive.
2. The hot-melt OCA optical adhesive film according to claim 1, wherein: the hot-melt resin includes a thermosetting resin and a thermoplastic resin; the thermosetting resin is at least one of POSS resin and MQ resin; POSS resins have the general formula:
MQ resin with the general formula (Me)3SiO1/2）n（PhSiO3/2）mMe represents methyl, Ph represents phenyl; wherein n/m is not less than 1/5 and not more than 1/2; the thermoplastic resin is at least one of EVA, TPR, PA, PEA, PES, LOPE and HDPE.
3. The hot-melt OCA optical adhesive film according to claim 2, wherein: each R independently represents an alkyl group, an aralkyl group or other organic group; the alkyl is a straight chain, branched chain or cyclic chain alkyl with 1-10 carbon atoms; the aralkyl is an aralkyl with 7-15 carbon atoms; the other organic groups are EVA group, TPR group, PA group, PEA group, PES group, LOPE group and HDPE group which are respectively removed with one hydrogen atom; the thermoplastic resin is at least one of EVA and TPR.
4. The hot-melt OCA optical adhesive film according to claim 3, wherein: the alkyl is methyl, ethyl, n-propyl or isopropyl; the aralkyl group is p-tolyl, o-tolyl, or m-tolyl; the thermoplastic resin is EVA, and the mass percentage content of the vinyl acetate is 5-20%.
5. The hot-melt OCA optical adhesive film according to claim 1, wherein: the reactive methyl phenyl polysiloxane is at least one of vinyl-terminated dimethyl diphenyl polysiloxane corresponding to a general formula (a), a general formula (b) and a general formula (c),
wherein n =1-20, m =1-20, and n/m ≦ 1/2;
wherein n =1-20, m =1-20, and n/m is not less than 2;
wherein n = 1-10.
6. The hot-melt OCA optical adhesive film according to claim 1, wherein: the methyl phenyl T resin is at least one of the compounds corresponding to the following general formula,
wherein n = 1-10.
7. The hot-melt OCA optical adhesive film according to claim 1, wherein: the methyl phenyl silicone resin is at least one of a copolymer of trimethyl siloxane and vinyl-terminated methyl phenyl polysiloxane, and the molecular structural formula of the methyl phenyl silicone resin is as follows:
（ViMe2SiO1/2）1（Me2SiO）x（Ph2SiO）ySiMe3or (ViMe)2SiO1/2）1（Me2SiO）x（MePhSiO）ySiMe3(ii) a Wherein Vi represents a vinyl group, Me represents a methyl group, Ph represents a phenyl group, x =1-10, and y = 1-10.
8. The hot-melt OCA optical adhesive film according to claim 1, wherein: the phenyl cross-linking agent is hydrogen-terminated T-type phenyl polysiloxane; the structural formula is as follows:
wherein n = 1-5.
9. The hot-melt OCA optical adhesive film according to claim 1, wherein: the phenyl chain extender is linear phenyl silicone oil with a hydrogen end capping, has a functional bond with a Si-H terminal, and has a structural formula as follows:
wherein n = 1-10.
10. The hot-melt OCA optical adhesive film according to claim 1, wherein: the additive includes at least one of a structure control agent, an inhibitor, and a phenyl catalyst.
11. The hot-melt OCA optical adhesive film according to claim 10, wherein: the structure control agent is at least one of compounds in accordance with the following structural formula;
12. the hot-melt OCA optical adhesive film according to claim 10, wherein: the inhibitor is at least one of a silicone-based inhibitor, an alkynol-based inhibitor and a silanol-terminated polymethylvinyl dimethylsiloxane.
13. The hot-melt OCA optical adhesive film according to claim 12, wherein: the silicone-based inhibitor is at least one of tetramethyldivinyldisiloxane and tetramethyltetravinylcyclotetrasiloxane; the alkynol-based inhibitor is at least one of 3-methyl-1-butyn-3-ol, 1-ethynylcyclohexanol, 3-propyl-1-butyn-3-ol and 1-dimethylhydrosiloxy-1-ethynyl-cyclohexane.
14. The hot-melt OCA optical adhesive film according to claim 10, wherein: the phenyl catalyst is at least one of dicumyl peroxide, tert-butyl isopropyl benzene peroxide, 1-phenyl cyclohexyl hydroperoxide and phenyl platinum catalyst.
15. A preparation method of a hot-melt OCA optical adhesive film is characterized by comprising the following steps: the raw material formula of the hot-melt OCA optical adhesive film adopts the raw material formula of the hot-melt OCA optical adhesive film as described in any one of claims 1 to 14, and the preparation method comprises the following steps:
step 1: adding reactive methyl phenyl polysiloxane, methyl phenyl T resin, methyl phenyl silicone resin, a phenyl cross-linking agent, a phenyl chain extender and hot-melt resin into a kneader, kneading uniformly at high temperature until colorless and transparent, cooling to room temperature, adding an additive, and kneading uniformly under negative pressure to obtain a hot-melt OCA optical adhesive film base material;
step 2: uniformly calendering or coating the hot-melt OCA optical adhesive film base material on a heavy release film by a calender or a coating machine, heating for solidification, cooling, and then covering a light release film to obtain the hot-melt OCA optical adhesive film.
16. The method for preparing a hot-melt OCA optical adhesive film according to claim 15, wherein: in the step 1, the temperature under the high-temperature condition is 150-300 ℃, and the kneading time under the high-temperature condition is 4-8 hours; the rotating speed of a kneading paddle during kneading is 500-1000 r/min; the vacuum gauge pressure under the negative pressure condition is-0.09 to-0.1 MPa.
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| PCT/CN2020/114766 WO2022052035A1 (en) | 2020-09-09 | 2020-09-11 | Hot-melt optical clear adhesive (oca) film and preparation method |
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Application publication date: 20201023 |