CN111744836A

CN111744836A - Wafer cleaning device and control system

Info

Publication number: CN111744836A
Application number: CN201910253278.2A
Authority: CN
Inventors: 何雨
Original assignee: China Core Integrated Circuit Ningbo Co Ltd
Current assignee: China Core Integrated Circuit Ningbo Co Ltd
Priority date: 2019-03-29
Filing date: 2019-03-29
Publication date: 2020-10-09
Anticipated expiration: 2039-03-29
Also published as: CN111744836B

Abstract

The invention provides a wafer cleaning device and a control system, which comprise a bearing part, a cleaning brush, a spraying part and a control structure, wherein the control structure comprises a driving unit and a control unit, the control unit is used for controlling the driving unit to work according to a second setting mode, and the driving unit is used for driving the bearing part, the cleaning brush and the spraying part to work; the second setting mode includes: when the carrying part is in a rotating state, the washing brush is in a washing position and moves according to the first setting mode, and the first spraying unit is in the spraying position. The invention can realize the synchronization of brushing and washing for cleaning the wafer, and the chemical method and the physical method are combined, thereby improving the removal efficiency, reducing the selection dependence on chemical reagents, improving the stability of semiconductor devices and improving the yield of products.

Description

Wafer cleaning device and control system

Technical Field

The invention relates to the technical field of integrated circuit manufacturing, in particular to a wafer cleaning device and a control system.

Background

In the manufacture of integrated circuits, photoresist is spin-coated on a semiconductor substrate through a photolithography process, an etched or ion-implanted region is defined after the photoresist layer is exposed and developed, and the photoresist on the semiconductor substrate is removed after the etching or ion implantation is completed. The existing method for removing the photoresist mainly adopts a method combining dry removal and wet cleaning, but in the dry removal, etching gas can react with the photoresist to generate etching reactant particles, and the etching reactant particles are difficult to remove cleanly in the subsequent wet cleaning process to form defects, so that the product yield is influenced. In addition, in the ion implantation process, part of ions are adsorbed to the surface of the photoresist and even doped into the photoresist to harden the surface of the photoresist to form a very dense hard shell, so that it is difficult to completely remove all the photoresist by dry removal, and relatively serious photoresist residues (PR Reside) are easily caused, which can bring many negative effects to the subsequent process, thereby reducing the stability of the semiconductor device and causing the reduction of the yield of the product.

Therefore, it is one of the technical problems to be solved by those skilled in the art how to provide a method for removing photoresist residue and etching reactant particles.

Disclosure of Invention

The invention provides a wafer cleaning device and a control system, which are used for removing photoresist residues and etching reactant particles.

The invention provides a wafer cleaning device, comprising:

the bearing part is provided with a wafer bearing surface and can be switched between a static state and a rotating state;

the cleaning device comprises a cleaning brush, a first control module and a second control module, wherein the cleaning brush can be switched between a cleaning position and a non-cleaning position, the cleaning position is located above a wafer bearing surface, the cleaning brush and the wafer bearing surface have a set distance, and the cleaning brush can move relative to the wafer bearing surface in a first set mode when in the cleaning position;

the spraying part comprises a first spraying unit, the first spraying unit is provided with a spraying position, and the first spraying unit faces the wafer bearing surface.

Optionally, the wafer cleaning device further includes a control structure, where the control structure includes a driving unit and a control unit, the control unit is configured to control the driving unit to operate according to a second setting manner, and the driving unit is configured to drive the carrying portion, the cleaning brush, and the spraying portion to operate; the second setting mode includes: when the carrying part is in a rotating state, the washing brush is in a washing position and moves according to the first setting mode, and the first spraying unit is in the spraying position.

Optionally, the first setting manner includes: the cleaning brush moves relative to the wafer bearing surface in the direction parallel to the wafer bearing surface.

Optionally, the first setting manner includes: and the cleaning brush moves back and forth from the central area of the wafer bearing surface to the edge of the wafer bearing surface.

Optionally, the first setting manner includes: the cleaning brush is perpendicular to rotation in the direction of wafer loading end, just the rotation direction of cleaning brush with the direction of rotation of load-bearing part is opposite.

Optionally, the driving unit includes: the first driving structure is connected with the bearing part and used for driving the bearing part to switch between a static state and a rotating state;

the second driving structure is connected with the cleaning brush and used for driving the cleaning brush to be switched between the cleaning position and the non-cleaning position so that the cleaning brush is located at the cleaning position and moves according to the first set mode;

and the third driving structure is connected with the spraying part and used for driving the spraying part to move to the spraying position.

Optionally, the second driving structure includes: the mechanical arm and a first driving piece, a second driving piece and a third driving piece which are connected with the mechanical arm; wherein,

the robot arm includes: the arm main body is connected with the cleaning brush;

the first driving part is used for driving the mechanical arm to move so as to drive the cleaning brush to move relative to the wafer bearing surface in a direction parallel to the wafer bearing surface;

the second driving part is used for driving the mechanical arm to move so as to drive the cleaning brush to move relative to the wafer bearing surface in the direction vertical to the wafer bearing surface;

the third driving piece is used for driving the arm main body to rotate so as to drive the cleaning brush to rotate.

Optionally, the control unit includes:

the instruction input unit is used for receiving a wafer cleaning instruction input from the outside;

and the drive triggering unit is used for receiving the wafer cleaning instruction and triggering the drive unit to drive the bearing part, the cleaning brush and the spraying part to work according to the wafer cleaning instruction.

Optionally, the instruction input unit includes: the device comprises a wafer motion input module, a cleaning brush motion input module and a cleaning reagent spraying input module;

the wafer motion input module is used for receiving the position, the rotation direction and the rotation speed instruction of the wafer;

the cleaning brush motion input module is used for receiving the position, the motion direction and the speed instruction of the relevant cleaning brush;

the cleaning agent spraying input module is used for receiving instructions about the position of the spraying part, the spraying dosage and the spraying speed.

Optionally, the driving trigger unit includes: the device comprises a wafer motion triggering module, a cleaning brush motion triggering module and a cleaning reagent spraying triggering module;

the wafer motion triggering module is used for receiving the instruction of the wafer motion input module and triggering the wafer to move according to the received instruction of the wafer motion input module;

the cleaning brush motion triggering module is used for receiving an instruction of the cleaning brush motion input module and triggering the cleaning brush to move according to the received instruction of the cleaning brush motion input module;

the cleaning reagent spraying triggering module is used for receiving an instruction of the cleaning agent spraying input module and triggering the spraying part to work according to the received instruction of the cleaning agent spraying input module.

Optionally, the wafer cleaning device further comprises a brush cleaning structure, wherein the brush cleaning structure is arranged at any position different from the wafer carrying surface and used for cleaning the cleaning brush.

Optionally, the brush cleaning structure includes: friction unit, washing unit and drying unit, friction unit be used for providing the friction surface with the friction takes place for the cleaning brush, washing unit is used for providing the washing reagent in order to wash the cleaning brush, drying unit is used for providing dry gas with the drying the cleaning brush.

Optionally, the driving unit further includes: and the fourth driving structure is connected with the brush cleaning structure and used for driving the brush cleaning structure to clean the cleaning brush.

Optionally, the fourth driving structure includes: a fourth driving member, a fifth driving member and a sixth driving member;

the fourth driving piece is connected with the friction unit and used for driving the friction unit to move and generate friction with the cleaning brush;

the fifth driving piece is connected with the washing unit and used for driving the washing unit to spray a washing reagent to the washing brush;

and the sixth driving piece is connected with the drying unit and used for driving the drying unit to spray dry gas to the cleaning brush.

Optionally, the friction unit is a brush, the washing unit is a first nozzle capable of spraying a cleaning agent, and the drying unit is a second nozzle capable of spraying a drying gas.

Optionally, the control unit is further configured to control the driving unit to operate according to a third setting manner, the driving unit is configured to drive the carrying portion, the cleaning brush, the spraying portion, and the brush cleaning structure to operate, and the third setting manner includes: when the carrying part is in a static state, the cleaning brush is in a non-cleaning position and moves according to a fourth set mode, the first injection unit is not in the injection position, and the brush cleaning structure cleans the cleaning brush.

Optionally, the fourth setting mode movement includes: the cleaning brush moves to the friction unit and is in contact with the friction unit and moves relatively; the cleaning brush moves to the washing range of the washing unit; the washing brush moves to the drying range of the drying unit.

Optionally, the instruction input unit may receive a washing and rinsing instruction;

the command input unit further comprises a brush cleaning input module for receiving commands related to the positions of the friction unit, the flushing unit and the drying unit in the brush cleaning structure and the type and dosage of the sprayed cleaning agent or gas;

the driving trigger unit further includes: and the brush cleaning triggering module is used for receiving the instruction of the brush cleaning triggering input module and triggering the brush cleaning structure to clean the cleaning brush according to the received instruction of the brush cleaning triggering input module.

Optionally, the first spraying unit is disposed on the cleaning brush.

Optionally, the spraying part further includes a second spraying unit, the second spraying unit is disposed at any position different from the first spraying unit, and a spraying range of the second spraying unit at least covers a part of the wafer bearing surface.

Optionally, the material of the cleaning brush includes PVDF.

Optionally, the wafer cleaning device is used for removing photoresist residues and/or etching reactant particles on the wafer.

The present invention also provides a wafer cleaning control system for controlling the wafer cleaning apparatus, comprising:

the command input unit is used for receiving a wafer cleaning command and a cleaning brush cleaning command which are input from the outside;

and the driving triggering unit is used for receiving the instruction input by the instruction input unit and triggering the driving unit to drive the bearing part, the cleaning brush, the spraying part and the brush cleaning structure for cleaning the cleaning brush to work according to the instruction input by the instruction input unit.

Optionally, the instruction input unit includes: the cleaning device comprises a wafer motion input module, a cleaning brush motion input module, a cleaning agent spraying input module and a brush cleaning input module;

the cleaning agent spraying input module is used for receiving the position of the spraying part, the spraying dosage and the speed instruction;

the brush cleaning structure input module is used for receiving the position of the friction unit, the positions of the flushing unit and the drying unit, and the type and dosage instructions of the sprayed cleaning agent or gas.

Optionally, the driving trigger unit includes: the cleaning device comprises a wafer movement trigger module, a cleaning brush movement trigger module, a cleaning agent spraying trigger module and a brush cleaning trigger module;

the cleaning agent spraying triggering module is used for receiving an instruction of the cleaning agent spraying input module and triggering the spraying part to work according to the received instruction of the cleaning agent spraying input module;

the brush cleaning triggering module is used for receiving the instruction of the brush cleaning triggering input module and triggering the brush cleaning structure to clean the cleaning brush according to the received instruction of the brush cleaning triggering input module.

In summary, the present invention provides a wafer cleaning device, which includes a carrying portion, a cleaning brush, a spraying portion and a control structure, wherein the control structure includes a driving unit and a control unit, the control unit is configured to control the driving unit to operate according to a second setting manner, and the driving unit is configured to drive the carrying portion, the cleaning brush and the spraying portion to operate; the second setting mode includes: when the carrying part is in a rotating state, the washing brush is in a washing position and moves according to the first setting mode, and the first spraying unit is in the spraying position. The invention can realize the synchronization of brushing and washing for cleaning the wafer, and the chemical method and the physical method are combined, thereby improving the removal efficiency, reducing the selection dependence on chemical reagents, improving the stability of semiconductor devices and improving the yield of products.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1-4 are schematic structural views of a wafer cleaning apparatus according to an embodiment of the present invention in different working states;

FIG. 5 is a schematic structural diagram illustrating a brush cleaning structure of a wafer cleaning apparatus according to an embodiment of the present invention;

fig. 6 is a schematic structural diagram of a cleaning brush in the wafer cleaning apparatus according to the embodiment of the present invention;

fig. 7 is a top view of a cleaning brush in the wafer cleaning apparatus according to the embodiment of the present invention.

Description of reference numerals:

10-a wafer to be cleaned; 11-a carrier; 11 a-a wafer carrying surface; 12-a spraying section; 121-a first injection unit; 121-second spraying unit 13-lifting baffle; 14-a robotic arm; 15-cleaning brushes; 151-a brush head; 16-a brush cleaning configuration; 161-cavity; 162-a friction unit; 163-a flushing unit; 164-a drying unit; 17-protective retainer ring.

Detailed Description

In the existing photoresist removing process, a method combining dry removal and wet cleaning is generally adopted, and the main steps are as follows: firstly, performing a dry removal process, and removing the photoresist through oxygen plasma; the surface of the wafer is then cleaned by a wet process. However, in the process of removing the photoresist, etching reactant particles and photoresist residues are easily caused, which affects the subsequent process, thereby reducing the stability of the semiconductor device and causing the reduction of the yield of the product. To solve the above problems, the inventors have tried to adopt the following scheme: firstly, after the dry removal, the photoresist surface is soaked, softened and etched by using a chemical reagent with high selectivity, but the process consumes long time and is very dependent on the selection of the chemical reagent, so that the large-scale mass production requirement is not met; and secondly, residual photoresist and etching reactant particles are stripped from the surface of the wafer by using a rotating centrifugal force with the help of a chemical reagent, but the removal effect of the method is relatively limited, and the method also depends on the selection of the chemical reagent very much, and is not beneficial to large-scale mass production.

Based on the above research, an embodiment of the present invention provides a wafer cleaning device, including a carrying portion, a spraying unit and a cleaning brush, where the carrying portion is configured to carry a wafer to be cleaned and drive the wafer to be cleaned to rotate, and the spraying unit is configured to spray a cleaning reagent to the wafer to be cleaned, so as to rub against the surface of the wafer to be cleaned, so as to remove a foreign substance on the wafer to be cleaned. According to the invention, the cleaning brush rubs the surface of the wafer to be cleaned to remove the foreign matters on the surface of the wafer to be cleaned, and the spraying unit sprays the first cleaning reagent to the surface of the wafer to be cleaned during rubbing, so that the synchronization of brushing and cleaning is realized, the chemical method and the physical method are combined, the removal efficiency is improved, the selective dependence on the chemical reagent is reduced, the stability of a semiconductor device is improved, and the product yield is improved.

The wafer cleaning apparatus and the wafer cleaning method according to the present invention will be described in detail with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become more apparent from the following description and drawings, it being understood, however, that the concepts of the present invention may be embodied in many different forms and should not be construed as limited to the specific embodiments set forth herein. The drawings are in simplified form and are not to scale, but are provided for convenience and clarity in describing embodiments of the invention.

The terms "first," "second," and the like in the description and in the claims, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the invention described herein are, for example, capable of operation in other sequences than described or illustrated herein. Similarly, if the method described herein comprises a series of steps, the order in which these steps are presented herein is not necessarily the only order in which these steps may be performed, and some of the described steps may be omitted and/or some other steps not described herein may be added to the method. Although elements in one drawing may be readily identified as such in other drawings, the present disclosure does not identify each element as being identical to each other in every drawing for clarity of description.

Fig. 1 is a schematic structural diagram of the wafer cleaning apparatus provided in this embodiment before operation, and fig. 4 is a schematic structural diagram of the wafer cleaning apparatus provided in this embodiment during operation. Referring to fig. 1 and 4, the present embodiment provides a wafer cleaning apparatus, including: the wafer cleaning device comprises a bearing part 11, a cleaning device and a cleaning device, wherein the bearing part 11 is provided with a wafer bearing surface 11a, and the bearing part 11 can be switched between a static state and a rotating state and is used for bearing a wafer 10 to be cleaned and driving the wafer 10 to be cleaned to rotate; a spraying part 12 including a first spraying unit 121, the first spraying unit 121 having a spraying position at which the first spraying unit 121 sprays toward the wafer carrying surface 11 a; a brush 15 that is switchable between a cleaning position and a non-cleaning position, the cleaning position being located above the wafer supporting surface 11a, the brush 15 being located at a set distance from the wafer supporting surface 11a, and the brush 15 being movable relative to the wafer supporting surface 11a in a first set manner at the cleaning position; the control structure comprises a driving unit and a control unit, the control unit is used for controlling the driving unit to work according to a second setting mode, and the driving unit is used for driving the carrying part 11, the cleaning brush 15 and the spraying part 12 to work; the second setting mode includes: when the carrying part 11 is rotated, the washing brush 15 is in the washing position and moves in the first setting manner, and the first ejecting unit is in the ejecting position.

Wherein the driving unit includes: the first driving structure is connected with the bearing part 11 and used for driving the bearing part 11 to switch between a static state and a rotating state; the second driving structure is connected with the cleaning brush and used for driving the cleaning brush to be switched between the cleaning position and the non-cleaning position so that the cleaning brush is located at the cleaning position and moves according to the first set mode; and the third driving structure is connected with the spraying part and used for driving the spraying part to move to the spraying position.

The second driving structure includes: the robot arm 14, and a first driving member, a second driving member and a third driving member connected to the robot arm 14. The mechanical arm 14 comprises an arm main body, and the arm main body is connected with the cleaning brush 15; the first driving component is used for driving the mechanical arm 14 to move so as to drive the cleaning brush 15 to move relative to the wafer carrying surface 11a in a direction parallel to the wafer carrying surface 11 a; the second driving component is used for driving the mechanical arm 14 to move so as to drive the cleaning brush 15 to move relative to the wafer carrying surface 11a in a direction perpendicular to the wafer carrying surface 11 a; the third driving member is used for driving the arm main body to rotate so as to drive the cleaning brush 15 to rotate.

Specifically, robotic arm 14 is scalable arm, robotic arm 14 can follow the perpendicular to concertina movement is done to the direction of wafer loading end 11a, drives cleaning brush 15 is kept away from or is close to in the vertical direction wafer loading end 11a, simultaneously robotic arm 14 also can drive cleaning brush 15 is being on a parallel with the direction motion of wafer loading end 11a makes cleaning brush 15 is in remove between washing position and the non-position of wasing, or make cleaning brush 15 is in horizontal motion on wafer loading end 11 a. In addition, the robot arm 14 may rotate the washing brush 15 around the central axis OO' of the washing brush main body. Preferably, as shown in fig. 6, a protection ring 17 is arranged at the connection part between the washing brush 15 and the mechanical arm 14 (the arm main body), and for example, the protection ring 17 may be an annular cover and is arranged at the periphery of the connection part between the washing brush 15 and the mechanical arm 14, so as to protect the connection part between the washing brush 15 and the mechanical arm 14 from being eroded by the washing reagent during the washing process, and enhance the connection stability between the washing brush 15 and the mechanical arm 14.

The control unit includes: the instruction input unit is used for receiving a wafer cleaning instruction input from the outside; and the driving triggering unit is used for receiving the wafer cleaning instruction and triggering the driving unit to drive the carrying part 11, the cleaning brush 15 and the spraying part 12 to work according to the wafer cleaning instruction. The instruction input unit includes: the device comprises a wafer motion input module, a cleaning brush motion input module and a cleaning reagent spraying input module. The wafer motion input module is used for receiving instructions related to the position, the rotation direction, the rotation speed and the like of the wafer; the cleaning brush motion input module is used for receiving instructions related to the position, the motion direction, the speed and the like of the cleaning brush; the cleaning agent spraying input module is used for receiving instructions about the position of the spraying part, the spraying dosage and speed and the like. The driving trigger unit includes: the device comprises a wafer motion triggering module, a cleaning brush motion triggering module and a cleaning reagent spraying triggering module. The wafer motion triggering module is used for receiving an instruction of the wafer motion input module and triggering the first driving structure to drive the wafer to move according to the received instruction of the wafer motion input module; the cleaning brush motion triggering module is used for receiving an instruction of the cleaning brush motion input module and triggering the second driving structure to drive the cleaning brush to move according to the received instruction of the cleaning brush motion input module; the cleaning reagent spraying triggering module is used for receiving an instruction of the cleaning agent spraying input module and triggering the third driving structure to drive the spraying part to work according to the received instruction of the cleaning agent spraying input module.

The spraying part 12 includes a first spraying unit 121 and a second spraying unit 122, the first spraying unit 121 is disposed on the cleaning brush 15, and is configured to spray a first cleaning reagent to the wafer 10 to be cleaned adsorbed on the wafer carrying surface 11a, the second spraying unit 122 is disposed at any position different from the first spraying unit 122, and a spraying range of the second spraying unit 122 at least covers a part of the wafer carrying surface 11a, and is configured to spray a second cleaning reagent to the wafer 10 to be cleaned on the wafer carrying surface 11 a. The first and

second spray units

121 and 122 are composed of a plurality of spray heads, and each has a respective spray position at which the first and

second spray units

121 and 122 face the wafer carrying surface 11 a. The spraying positions of the first spraying unit 121 and the second spraying unit 122 may be any positions on the wafer 10 to be cleaned, and it is understood that the spraying positions of the first spraying unit 121 and the second spraying unit 122 may also be a distance from the wafer 10 to be cleaned, where the distance is smaller than the spraying range of the first spraying unit 121 and the second spraying unit 122, so as to ensure that the cleaning reagent is sprayed at a specified position.

In addition, the wafer cleaning apparatus in this embodiment further includes a first cleaning reagent storage device and a second cleaning reagent storage device, the first spraying unit 121 is connected to the first cleaning reagent storage device through a first liquid pipeline, and the second spraying unit 122 is connected to the second cleaning reagent storage device through a first liquid pipeline. And flowmeter electromagnetic valves are arranged on the first liquid pipeline and the second liquid pipeline and used for controlling the flow of the first cleaning reagent and the second cleaning reagent. Of course, a manual flow valve is further disposed on the first liquid pipeline and the second liquid pipeline, and the injection conditions of the first injection unit 121 and the second injection unit 122 can be manually controlled.

The first spraying unit 121 is disposed on the cleaning brush 15, and may move together with the cleaning brush, for example, may move together with the cleaning brush 15 with respect to the wafer supporting surface 11a, and when moving together with the cleaning brush 15 with respect to the wafer supporting surface 11a, may spray a first cleaning reagent to the wafer 10 to be cleaned on the wafer supporting surface 11a when moving to the spraying position of the first spraying unit 121.

Fig. 6 is a schematic structural diagram of the brush 15 in the wafer cleaning apparatus according to the present embodiment, and fig. 7 is a plan view of the brush 15 in the wafer cleaning apparatus according to the present embodiment. As shown in fig. 6 and 7, the washing brush 15 includes a washing brush main body (not shown in the drawings) and a brush head 151, the robot arm 14 is connected to one end of the washing brush main body to move the washing brush 15, and the brush head 151 and the first spraying unit 121 are provided at the other end of the washing brush main body. The brush head 151 is formed by arranging and combining a plurality of bristles. Illustratively, the brush head 151 is disposed around the first spraying unit 121, the first spraying unit 121 may be a circular area formed by a plurality of spraying heads, and the brush head 151 surrounds the first spraying unit 121 in a circular ring shape. The diameter D1 of the washing brush 15 is, for example, 4 to 6cm, such as D1 equal to 5cm, the diameter of the area where the first spray unit 121 is located is, for example, D2 equal to 1 to 1.5cm, such as D2 equal to 1cm, the height D3 of the brush head 151 of the washing brush 15 is, for example, 1.5 to 2.5cm, such as D3 equal to 2cm, and the height D4 of the protective collar 17 is, for example, 1.5 to 2.5cm, such as D4 equal to 2 cm. The above is only given as an example, the size of the washing brush 15 and the protection ring 17 is not limited in the present invention, and those skilled in the art can set the size of the washing brush 15 and the protection ring 17 according to actual needs. In other embodiments of the present invention, the brush head 151 and the first spray unit 121 may be alternately disposed at intervals, for example, the entire washing brush 15 may be disposed in a rectangular shape, and the brush head 151 and the first spray unit 121 may be sequentially disposed in parallel on the brush main body. It is understood that those skilled in the art can specifically set the shape of the washing brush 15, the positions of the brush head 151 and the first spray unit 121, the density of the bristles on the brush head 151, etc. according to the actual circumstances, and the present invention is not particularly limited thereto.

The brush head 151 of the washing brush 15 in this embodiment is made of a material having abrasion and corrosion resistant characteristics, such as polyvinylidene fluoride (PVDF), Polytetrafluoroethylene (PTFE), or the like. Through control the lift of robotic arm 14 control the cleaning brush 15 with the surface contact of waiting to wash wafer 10, ensure that the brush head 151 of cleaning brush 15 with the surface of waiting to wash wafer 10 produces certain friction and simultaneously can not cause the damage to the surface of waiting to wash wafer 10, the frictional force between the brush head 151 and the surface of waiting to wash wafer 10 in this embodiment is 50PSI-210PSI, for example 100PSI, 150PSI, 200PSI etc.

The first setting mode includes: the cleaning brush 15 moves relative to the wafer carrying surface 11a in a direction parallel to the wafer carrying surface 11a, the brush head 151 and the surface of the wafer 10 to be cleaned generate friction, and meanwhile, the first spraying unit 121 sprays a first cleaning reagent to the surface of the wafer 10 to be cleaned, so that the surface of the wafer 10 to be cleaned is cleaned.

Specifically, firstly, the wafer 10 to be cleaned is adsorbed on the wafer carrying surface 11a, the first driving structure triggers the carrying part 11 to rotate and drives the wafer 10 to be cleaned to rotate, and the rotation rate of the wafer 10 to be cleaned is 200rpm to 400 rpm. Then, the second driving mechanism drives the brush 15 to be transferred to the cleaning position, and the third driving mechanism drives the spraying unit 12 to spray a cleaning reagent, which may be the first cleaning reagent sprayed from the first spraying unit 121, the second cleaning reagent sprayed from the second spraying unit 122, or both of them may be operated simultaneously, onto the surface of the wafer 10 to be cleaned. The first cleaning reagent and the second cleaning reagent may be the same or different, and those skilled in the art may select the types of the first cleaning reagent and the second cleaning reagent and the dosage of the two cleaning reagents according to the type and adhesion condition of the foreign matter on the surface of the wafer 10 to be cleaned. After the reagent to be cleaned is uniformly distributed on the surface of the wafer 10 to be cleaned, the second driving structure drives the cleaning brush 15 to move relative to the wafer 10 to be cleaned, as shown in fig. 4. The wafer 10 to be cleaned is driven by the carrying part 11 to continue to rotate, the brush head 151 of the cleaning brush 15 generates friction with the surface of the wafer 10 to be cleaned, and the friction between the brush head 151 of the cleaning brush 15 and the surface of the wafer 10 to be cleaned is utilized to remove the foreign matters on the surface of the wafer 10 to be cleaned. In addition, while the brush head 151 of the cleaning brush 15 and the surface of the wafer 10 to be cleaned are rubbed to remove the foreign substances, the first spraying unit 121 may continuously spray the first cleaning reagent to the surface of the wafer 10 to be cleaned, so that the cleaning brush 15 is brushed and flushed in synchronization, and the cleaning brush 15 and the flushing brush are matched with each other, thereby increasing the cleaning capability of the cleaning brush 15 and improving the cleaning efficiency of the wafer cleaning apparatus. The first spraying unit 121 sprays the first cleaning reagent onto the surface of the wafer 10 to be cleaned at a flow rate of 0.5L/min-2L/min, such as 0.8L/min, 1L/min, and 1.2L/min.

The cleaning brush 15 can move regularly on the surface of the wafer 10 to be cleaned under the driving of the second driving structure, so as to enhance the cleaning effect. For example, the cleaning brush 15 reciprocates from the central area of the surface of the wafer 10 to be cleaned to the edge of the surface of the wafer 10 to be cleaned. Further, the cleaning brush 15 keeps rotating while moving back and forth, so that the friction between the cleaning brush 15 and the surface of the wafer 10 to be cleaned is increased, and the brushing force of the cleaning brush 15 is increased. In the present invention, the rotation direction of the carrying unit 11 and the rotation direction of the brush 15 are not limited, and for example, the rotation direction of the brush 15 and the rotation direction of the wafer 10 to be cleaned may be adjusted according to actual cleaning conditions, and the rotation direction of the brush 15 and the rotation direction of the wafer 10 to be cleaned may be the same in a certain period of time, and the rotation direction of the brush 15 and the rotation direction of the wafer 10 to be cleaned may be opposite in a subsequent period of time, and may be circulated at intervals.

The wafer cleaning apparatus provided in this embodiment further includes a brush cleaning structure 16, as shown in fig. 1 and 5, the brush cleaning structure 16 is disposed at any position different from the wafer carrying surface 11a, and is used for cleaning the cleaning brush 15. The cleaning brush 15 is right the in-process of scrubbing is waited to wash wafer 10, it has the stain to exempt from on the brush head 151 of cleaning brush 15, the cleaning brush 15 gets into the operation of wasing is washd again after the structure 16 washs to the brush, can improve the rate of utilization of cleaning brush 15, reduces the consumption of production consumptive material.

The brush cleaning structure 16 includes a rubbing unit 162, a rinsing unit 163, and a drying unit 164. The friction unit 162 is used for providing a friction surface to rub with the washing brush 15, for example, the friction unit may be a brush; the washing unit 163 is used for supplying washing reagent to wash the washing brush 15, and may be, for example, a spray head capable of spraying liquid; the drying unit 164 is used for supplying drying air to dry the washing brush 15, and may be, for example, a nozzle capable of spraying air, but of course, the washing unit 163 and the drying unit 164 may be the same nozzle capable of intermittently spraying liquid or air according to a certain rule.

The driving unit further includes a fourth driving structure, and the fourth driving structure is connected to the brush cleaning structure 16 and is configured to drive the brush cleaning structure 16 to clean the cleaning brush 15. The fourth driving structure comprises a fourth driving piece, a fifth driving piece and a sixth driving piece. The fourth driving part is connected with the friction unit 162 and is used for driving the friction unit 162 to move and generate friction with the cleaning brush 15; the fifth driving member is connected to the washing unit 163, and is configured to drive the washing unit 163 to spray the washing reagent to the washing brush 15; the sixth driving member is connected to the drying unit 164, and is configured to drive the drying unit 164 to spray the drying gas to the cleaning brush 15.

The control unit in the control structure in this embodiment is further configured to control the driving unit to operate according to a third setting manner, and the driving unit is configured to drive the carrying part 11, the cleaning brush 15, the spraying part 12, and the brush cleaning structure 16 to operate. The third setting mode includes: when the carrying part 11 is in the stationary state, the brush 15 is in the non-cleaning position and moves in the fourth setting manner, the first ejecting unit 121 is not in the ejecting position, and the brush cleaning structure 16 cleans the brush 15. The fourth setting manner movement includes: the washing brush 15 moves to the friction unit 162 and contacts with the friction unit 162 and moves relatively, the washing brush 15 moves to the washing range of the washing unit 163, and the washing brush 15 moves to the drying range of the drying unit 164.

In the control structure of this embodiment, the instruction input unit may also receive a cleaning instruction of the cleaning brush. The command input unit further comprises a brush cleaning input module for receiving commands regarding the position of the friction unit 162, the positions of the rinsing unit 163 and the drying unit 164, and the type and amount of the sprayed cleaning agent or gas in the brush cleaning structure 16. The driving trigger unit further includes: and the brush cleaning triggering module is configured to receive an instruction of the brush cleaning triggering input module, and trigger the fourth driving mechanism to drive the brush cleaning structure 16 to clean the cleaning brush 15 according to the received instruction of the brush cleaning triggering input module.

For example, fig. 5 is a schematic structural diagram of a brush cleaning structure 16 in the wafer cleaning apparatus according to the embodiment, and as shown in fig. 5, the brush cleaning structure 16 includes:

the cavity 161, the top of the cavity 161 is provided with an opening, and the cleaning brush 15 enters and exits from the opening. The chamber 161 is, for example, a cylindrical structure, and an opening is provided at an upper center position of the cylindrical chamber.

The fixed brush (friction unit 162) is disposed at the bottom of the cavity 161, and particularly, may be disposed at a central position of the bottom of the cavity 161. The stationary brush is arranged opposite to the washing brush 15, i.e., the brush head of the stationary brush 162 faces the brush head 151 of the washing brush 15. After the cleaning brush 15 enters the cavity 161 of the brush cleaning structure 16, the fixed brush face is toward the cleaning brush 15, the cleaning brush 15 moves downward and contacts with the fixed brush, and the brush head 151 of the cleaning brush 15 and the brush head 151 of the fixed brush generate friction to remove the residue on the brush head 151 of the cleaning brush 15 through the rotation of the cleaning brush 15.

And a first spray head (washing unit 163) disposed on the inner wall of the chamber 161, the first spray head spraying a third washing reagent to wash the washing brush 15. The first nozzle is fixed on the inner wall of the chamber 161 by, for example, bonding or welding.

And a second nozzle (drying unit 164) disposed on an inner wall of the cavity 161 and between the first nozzle and the fixed brush, the second nozzle being capable of spraying gas to dry the washed washing brush 15. Similarly, the second nozzle may be fixed on the inner wall of the chamber 161 by bonding or welding

After cleaning wafer 10, cleaning brush 15 is shifted to the non-cleaning position and is located by the cleaning position 16 department of brush cleaning structure, works as cleaning brush 15 moves down to first shower nozzle department, first shower nozzle sprays third cleaning reagent and washes cleaning brush 15, the third cleaning reagent of first shower nozzle spraying can be the same with first cleaning reagent and second cleaning reagent, also can be deionized water or select other cleaning reagents.

After the brush head 151 of the cleaning brush 15 and the brush head of the fixed brush are rubbed with each other to remove the residue on the brush head 151 of the cleaning brush 15, the cleaning brush 15 may be moved upward to the first nozzle for cleaning again, then moved downward to the second nozzle for drying, or directly moved to the second nozzle for drying. The second nozzle sprays the gas to dry the brush 15 by the fluidity of the gas, and the gas sprayed from the second nozzle may be air, nitrogen, or the like, but the present invention is not limited thereto. In addition, the cleaning brush 15 is rotated at a high speed while the first and second nozzles wash and dry the cleaning brush 15, so that the washing and drying efficiency is improved. It is understood that the position and time of the rotation of the brush 15 in the brush cleaning structure 16 may be specifically set according to actual circumstances. For example, the washing brush 15 may be rotated while moving up and down in the brush washing structure 16, may be rotated only by rubbing against the fixed brush or by washing and drying at the first and second nozzles, and may be rotated at all times. In addition, the cleaning brush 15 moves up and down in the brush cleaning structure 16, and the cavity 161 of the brush cleaning structure 16 may rotate to drive the fixed brush, and the first nozzle and the second nozzle 1 rotate relative to the cleaning brush 15, so as to achieve the purposes of rapid friction, washing and drying.

The wafer cleaning structure in this embodiment further includes a wafer protection structure. The wafer protection structure is used for isolating the wafer from the outside when the wafer is cleaned, and for example, the wafer protection structure comprises a lifting baffle 13. As shown in fig. 1, the lifting baffle 13 is disposed around the carrying portion 11, and the lifting baffle 13 is lifted during the cleaning process to isolate the wafer 10 to be cleaned from the outside, thereby preventing the cleaning agent from splashing out. After cleaning, the lifting baffle 13 can be lowered to facilitate taking and placing the wafer 10 to be cleaned. In addition, a drain pipe is connected to the bottom of the lifting baffle 13 for discharging the cleaned cleaning agent (accompanied by foreign matters on the wafer) out of the cleaning device, for example, the drain pipe is connected to a liquid storage tank, and the drain pipe is a filter for filtering out large particles of foreign matters or large photoresist which are not dissolved by the cleaning agent, and the filter element of the filter is periodically replaced to smoothly drain the liquid from the drain pipe. The control part further comprises a fifth driving structure for driving the lifting baffle 13 to lift. The control unit command input unit further comprises a wafer protection input module for receiving commands related to the position and height of the lifting baffle 13. The driving triggering unit further comprises a wafer protection triggering module, receives an instruction input by the wafer protection input module, and triggers the fifth driving structure to adjust the position and height of the lifting baffle 13 according to the instruction.

The embodiment further provides a wafer cleaning control system for controlling the wafer cleaning apparatus, including:

and the driving triggering unit is used for receiving the instruction input by the instruction input unit and triggering the driving unit to drive the bearing part, the cleaning brush, the spraying part and the brush cleaning structure to work according to the instruction input by the instruction input unit.

Optionally, the instruction input unit includes: the cleaning device comprises a wafer motion input module, a cleaning brush motion input module, a cleaning agent spraying input module and a brush cleaning input module. The wafer motion input module is used for receiving instructions related to the position, the rotation direction, the rotation speed and the like of the wafer 10; the cleaning brush movement input module is used for receiving instructions related to the position, the movement direction, the speed and the like of the cleaning brush 11; the cleaning agent spraying input module is used for receiving instructions related to the position, the spraying dosage, the spraying speed and the like of the spraying part 12; the brush cleaning structure input module is used for receiving instructions about the position of the friction unit 162, the positions of the washing unit 163 and the drying unit 164, the type and dosage of the sprayed cleaning agent or gas, and the like.

Optionally, the driving trigger unit includes: the cleaning device comprises a wafer movement trigger module, a cleaning brush movement trigger module, a cleaning agent spraying trigger module and a brush cleaning trigger module. The wafer movement triggering module is used for receiving the instruction of the wafer movement input module and triggering the wafer 10 to move according to the received instruction of the wafer movement input module; the cleaning brush motion triggering module is used for receiving an instruction of the cleaning brush motion input module and triggering the cleaning brush 15 to move according to the received instruction of the cleaning brush motion input module; the cleaning agent spraying triggering module is used for receiving an instruction of the cleaning agent spraying input module and triggering the spraying part 12 to work according to the received instruction of the cleaning agent spraying input module; the brush cleaning triggering module is configured to receive an instruction of the brush cleaning triggering input module, and trigger the brush cleaning structure 16 to clean the cleaning brush according to the received instruction of the brush cleaning triggering input module.

In summary, the present invention provides a wafer cleaning device and a control system, including a carrying portion, a cleaning brush, a spraying portion and a control structure, where the control structure includes a driving unit and a control unit, the control unit is configured to control the driving unit to operate according to a second setting manner, and the driving unit is configured to drive the carrying portion, the cleaning brush and the spraying portion to operate; the second setting mode includes: when the carrying part is in a rotating state, the washing brush is in a washing position and moves according to the first setting mode, and the first spraying unit is in the spraying position. The invention can realize the synchronization of brushing and washing for cleaning the wafer, and the chemical method and the physical method are combined, thereby improving the removal efficiency, reducing the selection dependence on chemical reagents, improving the stability of semiconductor devices and improving the yield of products.

The above description is only for the purpose of describing the preferred embodiments of the present invention and is not intended to limit the scope of the claims of the present invention, and any person skilled in the art can make possible the variations and modifications of the technical solutions of the present invention using the methods and technical contents disclosed above without departing from the spirit and scope of the present invention, and therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention belong to the protection scope of the technical solutions of the present invention.

Claims

1. A wafer cleaning apparatus, comprising:

2. The wafer cleaning device according to claim 1, further comprising a control structure, wherein the control structure comprises a driving unit and a control unit, the control unit is configured to control the driving unit to operate according to a second setting mode, and the driving unit is configured to drive the carrying part, the cleaning brush and the spraying part to operate; the second setting mode includes: when the carrying part is in a rotating state, the washing brush is in a washing position and moves according to the first setting mode, and the first spraying unit is in the spraying position.

3. The wafer cleaning apparatus according to claim 2, wherein the first setting manner comprises: the cleaning brush moves relative to the wafer bearing surface in the direction parallel to the wafer bearing surface.

4. The wafer cleaning apparatus according to claim 3, wherein the first setting manner comprises: and the cleaning brush moves back and forth from the central area of the wafer bearing surface to the edge of the wafer bearing surface.

5. The wafer cleaning apparatus according to claim 2, wherein the first setting manner comprises: the cleaning brush is perpendicular to rotation in the direction of wafer loading end, just the rotation direction of cleaning brush with the direction of rotation of load-bearing part is opposite.

6. The wafer cleaning apparatus according to claim 1, wherein the driving unit comprises: the first driving structure is connected with the bearing part and used for driving the bearing part to switch between a static state and a rotating state;

7. The wafer cleaning apparatus of claim 5, wherein the second driving structure comprises: the mechanical arm and a first driving piece, a second driving piece and a third driving piece which are connected with the mechanical arm; wherein,

the robot arm includes: the arm main body is connected with the cleaning brush;

8. The wafer cleaning apparatus according to claim 2, wherein the control unit comprises:

9. The wafer cleaning apparatus according to claim 8, wherein the command input unit comprises: the device comprises a wafer motion input module, a cleaning brush motion input module and a cleaning reagent spraying input module;

10. The wafer cleaning apparatus as claimed in claim 9, wherein the driving triggering unit comprises: the device comprises a wafer motion triggering module, a cleaning brush motion triggering module and a cleaning reagent spraying triggering module;

11. The wafer cleaning device according to claim 8, further comprising a brush cleaning structure disposed at any position different from the wafer carrying surface for cleaning the cleaning brush.

12. The wafer cleaning apparatus according to claim 11, wherein the brush cleaning structure comprises a rubbing unit for providing a rubbing surface to rub the cleaning brush, a rinsing unit for providing a cleaning reagent to rinse the cleaning brush, and a drying unit for providing a drying gas to dry the cleaning brush.

13. The wafer cleaning apparatus according to claim 12, wherein the driving unit further comprises: and the fourth driving structure is connected with the brush cleaning structure and used for driving the brush cleaning structure to clean the cleaning brush.

14. The wafer cleaning apparatus according to claim 13,

the fourth driving structure includes: a fourth driving member, a fifth driving member and a sixth driving member;

15. The apparatus as claimed in claim 12, wherein the rubbing unit is a brush, the rinsing unit is a first nozzle capable of spraying a cleaning agent, and the drying unit is a second nozzle capable of spraying a drying gas.

16. The wafer cleaning device according to claim 12, wherein the control unit is further configured to control the driving unit to operate according to a third setting mode, the driving unit is configured to drive the carrier, the cleaning brush, the spraying unit, and the brush cleaning structure to operate, and the third setting mode includes: when the carrying part is in a static state, the cleaning brush is in a non-cleaning position and moves according to a fourth set mode, the first injection unit is not in the injection position, and the brush cleaning structure cleans the cleaning brush.

17. The wafer cleaning apparatus of claim 16, wherein the fourth setting motion comprises: the cleaning brush moves to the friction unit and is in contact with the friction unit and moves relatively; the cleaning brush moves to the washing range of the washing unit; the washing brush moves to the drying range of the drying unit.

18. The wafer cleaning apparatus as claimed in claim 12, wherein the command input unit is capable of receiving a cleaning brush cleaning command;

19. The wafer cleaning apparatus according to claim 1, wherein the first spray unit is disposed on the cleaning brush.

20. The wafer cleaning device according to claim 1, wherein the spraying part further comprises a second spraying unit, the second spraying unit is disposed at any position different from the first spraying unit, and the spraying range of the second spraying unit at least covers a part of the wafer carrying surface.

21. The wafer cleaning device according to claim 1, wherein the material of the cleaning brush comprises PVDF.

22. The wafer cleaning device according to claim 1, wherein the wafer cleaning device is used for removing photoresist residues and/or etching reactant particles on a wafer.

23. A wafer cleaning control system for controlling the wafer cleaning apparatus as set forth in claim 1, comprising:

24. The wafer cleaning control system of claim 23, wherein the command input unit comprises: the cleaning device comprises a wafer motion input module, a cleaning brush motion input module, a cleaning agent spraying input module and a brush cleaning input module;

25. The wafer cleaning control system of claim 24, wherein the drive trigger unit comprises: the cleaning device comprises a wafer movement trigger module, a cleaning brush movement trigger module, a cleaning agent spraying trigger module and a brush cleaning trigger module;