CN111623801A - Laser gyro electrode indium seal enhancement device and method - Google Patents
Laser gyro electrode indium seal enhancement device and method Download PDFInfo
- Publication number
- CN111623801A CN111623801A CN202010532384.7A CN202010532384A CN111623801A CN 111623801 A CN111623801 A CN 111623801A CN 202010532384 A CN202010532384 A CN 202010532384A CN 111623801 A CN111623801 A CN 111623801A
- Authority
- CN
- China
- Prior art keywords
- sealing
- laser gyro
- cylinder
- electrode
- indium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 title claims abstract description 49
- 229910052738 indium Inorganic materials 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000007789 sealing Methods 0.000 claims abstract description 105
- 230000032683 aging Effects 0.000 claims abstract description 9
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 9
- 238000001816 cooling Methods 0.000 claims abstract description 5
- 230000002708 enhancing effect Effects 0.000 claims abstract description 5
- 230000002787 reinforcement Effects 0.000 claims abstract description 4
- 239000003566 sealing material Substances 0.000 claims abstract description 4
- 238000005728 strengthening Methods 0.000 claims description 4
- 238000007731 hot pressing Methods 0.000 claims description 3
- 239000002241 glass-ceramic Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 239000001307 helium Substances 0.000 description 5
- 229910052734 helium Inorganic materials 0.000 description 5
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 239000010406 cathode material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000009863 impact test Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004949 mass spectrometry Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C25/00—Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/58—Turn-sensitive devices without moving masses
- G01C19/64—Gyrometers using the Sagnac effect, i.e. rotation-induced shifts between counter-rotating electromagnetic beams
- G01C19/66—Ring laser gyrometers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Power Engineering (AREA)
- Gyroscopes (AREA)
Abstract
本发明提出一种激光陀螺电极铟封增强装置,所述装置呈倒置圆筒状,圆筒内径与电极底部外径一致,圆筒厚度能够配合封接面,圆筒封接面为弧形。本发明还提出一种激光陀螺电极铟封增强方法,包括:1)在电极与谐振腔封接面周围增加铟圈封接材料;2)使用增强装置向下施压,加热软化所述铟圈;3)当增强装置到达封接处的最低端面时,保持封接压力和温度设定的时间;4)热压冷却后,对电极进行高压老化。本发明使得电极密封性能增强,有效保障了谐振腔的气密性,增大了激光陀螺阴极和谐振腔铟封接接触面,降低了封接漏气概率,提高了激光陀螺的寿命和可靠性。
The invention provides an indium sealing enhancement device for a laser gyro electrode. The device is in the shape of an inverted cylinder, the inner diameter of the cylinder is the same as the outer diameter of the bottom of the electrode, the thickness of the cylinder can match the sealing surface, and the sealing surface of the cylinder is arc-shaped. The present invention also proposes a method for enhancing indium sealing of a laser gyro electrode, including: 1) adding an indium ring sealing material around the sealing surface between the electrode and the resonant cavity; 2) using a reinforcing device to press down to soften the indium ring by heating ; 3) When the reinforcement device reaches the lowest end face of the seal, keep the sealing pressure and temperature for the set time; 4) After the hot-pressed cooling, the electrodes are subjected to high-pressure aging. The invention enhances the sealing performance of the electrodes, effectively ensures the air tightness of the resonant cavity, increases the indium sealing contact surface between the cathode of the laser gyro and the resonant cavity, reduces the probability of air leakage in the sealing and improves the life and reliability of the laser gyro .
Description
技术领域technical field
本发明涉及激光陀螺电极技术领域,更具体地,涉及一种激光陀螺电极铟封增强装置和增强方法。The present invention relates to the technical field of laser gyro electrodes, and more particularly, to an indium sealing enhancement device and enhancement method for laser gyro electrodes.
背景技术Background technique
在激光陀螺制造中,考虑了阴极的自身寿命——发射电子能力与抗溅射能力,通常采用发射电子能力较强的高纯铝作为阴极材料,使用无氧铜或者钛作为阳极,激光陀螺腔体一般采用接近零膨胀的微晶玻璃。为了实现膨胀系数匹配性差的两种材料间的高真空密封,采用延展性良好的金属铟作为密封过渡材料。In the manufacture of laser gyroscopes, the lifespan of the cathode—the ability to emit electrons and the ability to resist sputtering is considered. Usually, high-purity aluminum with strong electron-emitting ability is used as the cathode material, oxygen-free copper or titanium is used as the anode, and the cavity of the laser gyroscope is used. The body is generally made of glass-ceramic with near zero expansion. In order to achieve high vacuum sealing between two materials with poor expansion coefficient matching, metal indium with good ductility is used as the sealing transition material.
铟封接作为一种非匹配封接工艺,具有封接面平整、结合强度大、真空性能优等特点。但是微晶谐振腔真空气密性要求较高,需降低封接泄漏的影响,引起泄漏的原因为封接残余应力,主要来自于:(1)电极材料与微晶腔体热膨胀系数匹配不一致,激光陀螺反复高低温环境中密封性能减弱甚至失效;(2)电极和谐振腔的封接接触面有限,一旦一处出现泄漏,将危及整个谐振腔。As a non-matching sealing process, indium sealing has the characteristics of flat sealing surface, high bonding strength and excellent vacuum performance. However, the vacuum airtightness of the microcrystalline cavity is relatively high, and the influence of sealing leakage needs to be reduced. The reason for the leakage is the residual stress of the sealing, which mainly comes from: (1) The matching of the thermal expansion coefficient of the electrode material and the microcrystalline cavity is inconsistent, The sealing performance of the laser gyroscope is weakened or even fails in repeated high and low temperature environments; (2) the sealing contact surface between the electrode and the resonator is limited, and once leakage occurs in one place, the entire resonator will be endangered.
目前大多数激光陀螺电极封接时,采用铟圈加热机械加压法,如图1所示,以阴极为例,在谐振腔和阴极底部压一层铟圈密封。其有效封接面积为电极与谐振腔接触面之间,面积有限。反复高低温测试后,由于膨胀系数匹配的问题,封接处容易出现泄漏,从而导致陀螺失效。At present, most laser gyroscope electrodes are sealed by using an indium ring heating and mechanical pressing method. The effective sealing area is between the electrode and the contact surface of the resonant cavity, and the area is limited. After repeated high and low temperature tests, due to the expansion coefficient matching problem, the sealing joints are prone to leakage, resulting in the failure of the gyroscope.
发明内容SUMMARY OF THE INVENTION
为解决上述技术问题,本发明提出一种激光陀螺电极铟封增强装置,所述装置呈倒置圆筒状,圆筒内径与电极底部外径一致,圆筒厚度能够配合封接面,圆筒封接面为弧形。In order to solve the above technical problems, the present invention proposes a laser gyro electrode indium sealing enhancement device, the device is in the shape of an inverted cylinder, the inner diameter of the cylinder is consistent with the outer diameter of the bottom of the electrode, the thickness of the cylinder can match the sealing surface, and the cylinder seals. The junction is curved.
可选地,所述圆筒封接面为1/4圆弧状。Optionally, the cylindrical sealing surface is in a 1/4 arc shape.
可选地,圆筒内径与电极的底部外径一致。Optionally, the inner diameter of the cylinder is the same as the outer diameter of the bottom of the electrode.
可选地,内部设置有加热头和温度传感器。Optionally, a heating head and a temperature sensor are provided inside.
本发明还提出一种激光陀螺电极铟封增强方法,包括:1)在电极与谐振腔封接面周围增加铟圈封接材料;2)使用增强装置向下施压,加热软化所述铟圈;3)当增强装置到达封接处的最低端面时,保持封接压力和温度设定的时间;4)热压冷却后,对电极进行高压老化。The present invention also proposes a method for enhancing indium sealing of a laser gyro electrode, which includes: 1) adding an indium ring sealing material around the sealing surface between the electrode and the resonant cavity; 2) using a reinforcing device to press down to soften the indium ring by heating ; 3) When the reinforcement device reaches the lowest end face of the seal, keep the sealing pressure and temperature for the set time; 4) After the hot-pressed cooling, the electrodes are subjected to high-pressure aging.
优选地,在步骤4)中,通过在电极和陀螺腔体之间加载高压交流电进行高压老化。Preferably, in step 4), high-voltage aging is performed by loading a high-voltage alternating current between the electrode and the gyro cavity.
优选地,所述增强装置呈倒置圆筒状,圆筒内径与电极底部外径一致,圆筒厚度能够配合封接面,圆筒封接面为弧形。Preferably, the reinforcing device is in the shape of an inverted cylinder, the inner diameter of the cylinder is the same as the outer diameter of the bottom of the electrode, the thickness of the cylinder can match the sealing surface, and the sealing surface of the cylinder is arc-shaped.
优选地,所述增强装置内部设置有加热头和温度传感器。Preferably, a heating head and a temperature sensor are arranged inside the enhancing device.
优选地,在步骤2)中,封接压力随着所述增强装置的下降而增加。Preferably, in step 2), the sealing pressure is increased as the reinforcing means is lowered.
优选地,在步骤4)中施加的交流电为1000V,1KHz,持续时间2-4小时。Preferably, the alternating current applied in step 4) is 1000V, 1KHz, and the duration is 2-4 hours.
本发明的优点是:使得电极密封性能增强,有效保障了谐振腔的气密性;增大激光陀螺阴极和谐振腔铟封接接触面,降低封接漏气概率,提高了激光陀螺的寿命和可靠性;装置结构简单,易加工装配,成本低。The advantages of the invention are: the sealing performance of the electrodes is enhanced, and the air tightness of the resonant cavity is effectively guaranteed; the indium sealing contact surface between the cathode of the laser gyro and the resonator cavity is enlarged, the probability of air leakage of the sealing is reduced, and the life and the life of the laser gyro are improved. Reliability; the device has a simple structure, is easy to process and assemble, and has a low cost.
附图说明Description of drawings
为了更容易理解本发明,将通过参照附图中示出的具体实施方式更详细地描述本发明。这些附图只描绘了本发明的典型实施方式,不应认为对本发明保护范围的限制。For easier understanding of the present invention, the present invention will be described in more detail by referring to specific embodiments shown in the accompanying drawings. These drawings depict only typical embodiments of the invention and should not be considered as limiting the scope of the invention.
图1为传统阴极封接剖面示意图。FIG. 1 is a schematic cross-sectional view of a conventional cathode sealing.
图2为本发明的激光陀螺阴极密封性增强的铟封装置的剖面示意图。FIG. 2 is a schematic cross-sectional view of the indium sealing device with enhanced sealing performance of the cathode of the laser gyro according to the present invention.
图3为本发明的激光陀螺阴极密封性增强的铟封装置的结构示意图。FIG. 3 is a schematic structural diagram of the indium sealing device with enhanced sealing performance of the cathode of the laser gyro according to the present invention.
图4为本发明的增强装置改进的阴极封接剖面示意图。4 is a schematic cross-sectional view of the improved cathode sealing of the reinforcing device of the present invention.
图5为本发明的增强装置改进的阴极封接效果示意图。FIG. 5 is a schematic diagram of the improved cathode sealing effect of the reinforcing device of the present invention.
图6为本发明的激光陀螺阴极密封性增强的铟封装置热压示意图。FIG. 6 is a schematic diagram of hot pressing of the indium sealing device with enhanced sealing of the cathode of the laser gyro according to the present invention.
图7为本发明的激光陀螺阴极铟封高压老化示意图。FIG. 7 is a schematic diagram of high-voltage aging of the laser gyro cathode indium sealing in accordance with the present invention.
图8为本发明的激光陀螺阴极铟封的检测结果表。FIG. 8 is a table of detection results of the laser gyro cathode indium seal of the present invention.
附图标记reference number
1-电极;2-传统封接部位;3-增强封接部位;4-谐振腔;5-铟封加强装置;6-柔性贴合电极;7-高压交流电源。1-electrode; 2-traditional sealing part; 3-enhanced sealing part; 4-resonant cavity; 5-indium sealing strengthening device; 6-flexible bonding electrode; 7-high voltage AC power supply.
具体实施方式Detailed ways
下面参照附图描述本发明的实施方式,其中相同的部件用相同的附图标记表示。在不冲突的情况下,下述的实施例及实施例中的技术特征可以相互组合。Embodiments of the present invention are described below with reference to the accompanying drawings, wherein like components are designated by like reference numerals. In the case of no conflict, the following embodiments and technical features in the embodiments can be combined with each other.
本发明提供一种激光陀螺电极铟封增强装置5,如图2和图3所示。The present invention provides an indium sealing enhancement device 5 for a laser gyro electrode, as shown in FIG. 2 and FIG. 3 .
铟封增强装置5为倒置圆筒状,圆筒具有一定厚度,圆筒厚度与电极1的封接面一致。圆筒内径与电极1(见图4)的底部外径一致。圆筒封接面为弧形。圆筒外径为圆筒内径与所述弧形半径之和。圆筒的厚度半径能够配合封接面,优选地与封接面一致。The indium sealing enhancement device 5 is in the shape of an inverted cylinder, the cylinder has a certain thickness, and the thickness of the cylinder is consistent with the sealing surface of the electrode 1 . The inner diameter of the cylinder corresponds to the outer diameter of the bottom of the electrode 1 (see Figure 4). The sealing surface of the cylinder is arc-shaped. The outer diameter of the cylinder is the sum of the inner diameter of the cylinder and the radius of the arc. The thickness radius of the cylinder can be adapted to the sealing surface, preferably coincident with the sealing surface.
圆筒封接面可以是其他形状或大小,只要把电极1的外部侧面也密封起来就可以。The cylindrical sealing surface may be of other shapes or sizes, as long as the outer side surface of the electrode 1 is also sealed.
优选地,圆筒封接面为1/4圆弧,此时,圆半径=圆筒厚度=阴极侧面封接高1/4圆弧度+底面封接铟膜厚度,圆筒外径为圆筒内径与圆弧半径之和。在一个实施方式中,圆筒封接面为1/4圆弧时,电极1的底部传统封接部位2的铟膜厚度约0.2mm,圆筒封接面为约2.2mm。圆筒内径为25mm,圆筒外径为27.2mm。Preferably, the sealing surface of the cylinder is a 1/4 arc, at this time, the radius of the circle = the thickness of the cylinder = the sealing height of the cathode side is 1/4 arc + the thickness of the indium film sealed on the bottom surface, and the outer diameter of the cylinder is a circle The sum of the inner diameter of the cylinder and the radius of the arc. In one embodiment, when the cylindrical sealing surface is a 1/4 arc, the thickness of the indium film at the
该增强装置内可以设置加热头和薄膜式铂电阻温度传感器,温度传感器测温范围为-70℃~+300℃,精度为1/3B级。A heating head and a thin-film platinum resistance temperature sensor can be set in the enhancement device. The temperature measurement range of the temperature sensor is -70℃~+300℃, and the accuracy is 1/3B.
本发明在原有的底部封接面旁边,增加一层封接面,且将面扩展至电极侧面,以阴极为例,如图4-图6所示。这将降低激光陀螺漏气的可能性,起到双重保护的作用。In the present invention, a layer of sealing surface is added beside the original bottom sealing surface, and the surface is extended to the side of the electrode, taking the cathode as an example, as shown in Figures 4-6. This will reduce the possibility of air leakage of the laser gyroscope and play a dual protection role.
本发明还提出一种激光陀螺电极铟封增强方法,包括:1)在电极1与谐振腔4的封接面周围增加铟圈封接材料;2)使用增强装置向下施压,加热软化所述铟圈,所述装置的结构呈如前所述;3)当增强装置到达封接最低端面时,保持封接压力和温度,稳定设定时间。4)热压冷却后,对电极进行高压老化。The present invention also proposes an indium sealing enhancement method for a laser gyro electrode, which includes: 1) adding an indium ring sealing material around the sealing surface of the electrode 1 and the
下面详细描述本发明的方法和使用铟封增强装置5的封接步骤。The method of the present invention and the sealing step using the indium sealing enhancement device 5 are described in detail below.
S1,抛光电极封接面:选择粒度为纳米级的SiO2溶胶为抛光液,在转速30转/分钟的抛光盘中抛光5小时,使微晶玻璃表面粗糙度Ra达到0.3nm。电极封接面经过抛光后,能使表面更加平整,有利于铟封密封性。S1, polishing the electrode sealing surface: select SiO 2 sol with a particle size of nano-scale as the polishing solution, and polish it in a polishing disc with a rotating speed of 30 rpm for 5 hours, so that the surface roughness Ra of the glass-ceramics reaches 0.3nm. After the electrode sealing surface is polished, the surface can be made more flat, which is beneficial to the sealing performance of the indium sealing.
S2,清洗电极:采用RCA湿法化学清洗工艺。S2, cleaning electrode: RCA wet chemical cleaning process is adopted.
(1)将微晶玻璃浸没于丙酮中加热至50℃超声清洗30分钟;(1) Immerse the glass-ceramic in acetone and heat to 50°C for ultrasonic cleaning for 30 minutes;
(2)用酒精将微晶玻璃上残留丙酮冲洗干净,随后在酒精中超声10分钟;(2) Rinse the residual acetone on the glass-ceramic with alcohol, then ultrasonicate in alcohol for 10 minutes;
(3)取出玻璃衬底,采用去离子水将衬底冲洗干净,然后在混合溶液(浓H2SO4/H2O2=7/3)中浸泡4小时以上;(3) Take out the glass substrate, rinse the substrate with deionized water, and then soak it in a mixed solution (concentrated H 2 SO 4 /H 2 O 2 =7/3) for more than 4 hours;
(4)取出玻璃衬底,采用去离子水将衬底冲洗干净,高纯氮气吹干备用。(4) Take out the glass substrate, rinse the substrate with deionized water, and dry it with high-purity nitrogen for use.
S3,铟封:使用时根据铟圈材料性质,温度设置为140℃,增强装置温感灵敏度±1℃。封接过程中,封接压力通过直线推杆的下压产生,通过控制直线推杆的位移,间接控制封接压力。当热压头(增强装置的圆筒下端)接触零件上表面后,铟圈受热软化,封接压力将随着热压头的下降而增加。当铟封加强装置5到达封接最低端面时(如图6),保持封接压力、温度稳定30分钟。封接完成后缓慢释放压力,防止压力快速释放可能对压封质量或者工件造成不必要的损伤。S3, indium seal: according to the material properties of the indium ring, the temperature is set to 140°C to enhance the temperature sensitivity of the device by ±1°C. During the sealing process, the sealing pressure is generated by the downward pressure of the linear push rod, and the sealing pressure is indirectly controlled by controlling the displacement of the linear push rod. When the thermal indenter (the lower end of the cylinder of the reinforcing device) contacts the upper surface of the part, the indium ring is heated and softened, and the sealing pressure will increase with the decrease of the thermal indenter. When the indium sealing strengthening device 5 reaches the lowest end face of the sealing (as shown in FIG. 6 ), keep the sealing pressure and temperature stable for 30 minutes. After the sealing is completed, release the pressure slowly to prevent the rapid release of the pressure from causing unnecessary damage to the sealing quality or the workpiece.
S4,高压老化:热压冷却后,在电极和陀螺腔体之间通过加载高压交流电源7(1000V、1KHz,电流很小,因为腔体是微晶玻璃的并非电的良导体,但是有部分离子可以导电,这个过程中电流实际上是通过铟环流过去的)。如图7所示,谐振腔4内贴一柔性贴合电极6,交流高压电源7连接激光陀螺的(阴极)电极1和激光陀螺谐振腔4内的柔性贴合电极6,在高频高压电场作用下,铟原子会向阴极(铝)和腔体(微晶玻璃)表层内部扩散,加电过程需要2-4小时。高压老化过程可以使得铟向电极、腔体的接触面中扩散,增强铟与两个接触面的封接牢度。S4, high-voltage aging: after hot-press cooling, load a high-voltage AC power supply 7 (1000V, 1KHz) between the electrode and the gyro cavity, the current is very small, because the cavity is glass-ceramic and not a good conductor of electricity, but some parts The ions can conduct electricity, and the current actually flows through the indium loop in the process). As shown in FIG. 7 , a flexible bonding electrode 6 is attached in the
通过测试,本发明的装置具有更好的技术效果,如图8所示。用本发明的增强装置对激光陀螺阴、阳极封接后,在高低温箱进行反复高低温冲击试验,再用氦质谱检漏仪测定激光陀螺的氦泄漏率。试验温度为-60℃~+80℃,升降温速率为5℃/min,具体试验过程为:Through testing, the device of the present invention has better technical effects, as shown in FIG. 8 . After sealing the cathode and anode of the laser gyro with the enhancing device of the present invention, repeated high and low temperature impact tests are carried out in a high and low temperature box, and then the helium leak rate of the laser gyro is measured by a helium mass spectrometer leak detector. The test temperature is -60℃~+80℃, and the temperature rise and fall rate is 5℃/min. The specific test process is as follows:
(1)选择10个密封良好的传统封接的激光陀螺,编号1-(1~10),和10个改进封接工艺的激光陀螺,编号2-(1~10)。采用氦质谱检漏仪测定激光陀螺漏率,记入表格,见图8(单位:Pa·m3/s,当激光陀螺氦泄漏率低于10×10-10时,认为检漏不合格);(1) Select 10 well-sealed traditionally sealed laser gyroscopes, numbered 1-(1-10), and 10 laser gyroscopes with improved sealing process, numbered 2-(1-10). The laser gyro leak rate was measured by a helium mass spectrometer leak detector and recorded in the table, as shown in Figure 8 (unit: Pa·m 3 /s, when the helium leak rate of the laser gyro was lower than 10×10 -10 , the leak detection was considered unqualified) ;
(2)将激光陀螺放入高低温箱,设置试验温度为-60℃~+80℃,升降温速率为5℃/min,每次到达温度高点和低点均保持60分钟,重复50个周期,然后采用氦质谱检漏,测定激光陀螺漏率,记入表格(2) Put the laser gyro into the high and low temperature box, set the test temperature to -60℃~+80℃, the temperature rise and fall rate is 5℃/min, keep the high and low temperature points for 60 minutes each time, repeat 50 times cycle, and then use helium mass spectrometry to detect leaks, measure the leak rate of the laser gyro, and record it in the table
(3)重复步骤(2),重复20个周期,测定激光陀螺漏率,记入表格(3) Repeat step (2) for 20 cycles, measure the leak rate of the laser gyro, and record it in the table
(4)继续重复步骤(2),重复30个周期,测定激光陀螺漏率,记入表格。(4) Continue to repeat step (2) for 30 cycles, measure the leakage rate of the laser gyro, and record it in the table.
结果表明,在相同的高低温试验条件下,传统封接工艺循环50圈开始出现漏气,数量1个,循环70圈和100圈相继出现更多漏气陀螺。而本发明的改进封接工艺,循环70圈漏气1个,循环100圈漏气2个,密封性能明显提升。表明本发明的装置结构设计简单,易加工装配,成本低,密封可靠性高,密封性能好。The results show that under the same high and low temperature test conditions, the traditional sealing process starts to leak after 50 cycles, and the number is 1, and there are more leaking gyroscopes after 70 cycles and 100 cycles. On the other hand, in the improved sealing process of the present invention, there is one air leak in 70 cycles, and two air leaks in 100 cycles, and the sealing performance is obviously improved. It shows that the device of the present invention is simple in structure design, easy to process and assemble, low in cost, high in sealing reliability and good in sealing performance.
以上所述的实施例,只是本发明较优选的具体实施方式,本领域的技术人员在本发明技术方案范围内进行的通常变化和替换都应包含在本发明的保护范围内。The above-mentioned embodiments are only preferred specific embodiments of the present invention, and the usual changes and substitutions made by those skilled in the art within the scope of the technical solutions of the present invention should be included in the protection scope of the present invention.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010532384.7A CN111623801A (en) | 2020-06-12 | 2020-06-12 | Laser gyro electrode indium seal enhancement device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010532384.7A CN111623801A (en) | 2020-06-12 | 2020-06-12 | Laser gyro electrode indium seal enhancement device and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111623801A true CN111623801A (en) | 2020-09-04 |
Family
ID=72258534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010532384.7A Pending CN111623801A (en) | 2020-06-12 | 2020-06-12 | Laser gyro electrode indium seal enhancement device and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111623801A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113690387A (en) * | 2021-08-17 | 2021-11-23 | 晟合微电子(肇庆)有限公司 | Hot pressing component, hot pressing device, hot pressing method and storage medium |
| CN114019641A (en) * | 2021-11-19 | 2022-02-08 | 南方科技大学 | Double-indium-ring sealing structure and application thereof |
| CN115326044A (en) * | 2022-10-14 | 2022-11-11 | 天津集智航宇科技有限公司 | Laser gyroscope and sealing method thereof |
| CN115479596A (en) * | 2022-09-02 | 2022-12-16 | 天津集智航宇科技有限公司 | Laser gyro electrode and manufacturing method |
| CN115540842A (en) * | 2022-08-29 | 2022-12-30 | 北京航天时代激光导航技术有限责任公司 | A Method for Simultaneous Indium Sealing of Multiple Electrodes of Laser Gyro |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2689440Y (en) * | 2004-01-08 | 2005-03-30 | 东南大学 | Binding structure of vacuum device |
| CN1714444A (en) * | 2002-11-21 | 2005-12-28 | 日本电气株式会社 | Semiconductor device, wiring substrate, and method for manufacturing wiring substrate |
| CN1959912A (en) * | 2006-10-20 | 2007-05-09 | 四川天微电子有限责任公司 | Indium seal type luminescent screen, and technique for preparing the display tube of using the luminescent screen |
| US20110290021A1 (en) * | 2010-05-30 | 2011-12-01 | Honeywell International Inc. | Hemitoroidal resonator gyroscope |
| CN203464170U (en) * | 2013-08-07 | 2014-03-05 | 邓素琼 | Reflecting panel for surface light source |
| CN103674003A (en) * | 2012-09-07 | 2014-03-26 | 中国航空工业第六一八研究所 | Solenoid drive type laser gyroscope shaking mechanism |
| US20150132599A1 (en) * | 2013-11-08 | 2015-05-14 | Thales | Electrode of metallic material, and gyrolaser comprising at least one such electrode |
| CN204633119U (en) * | 2015-06-11 | 2015-09-09 | 中国船舶重工集团公司第七一七研究所 | A ring laser electrode indium sealing device |
| CN204854757U (en) * | 2014-12-19 | 2015-12-09 | 北京航天时代激光导航技术有限责任公司 | Highly reliable sealed laser gyro integration negative pole |
| CN105490058A (en) * | 2016-01-11 | 2016-04-13 | 华中科技大学 | Insulated sealing electrode component |
| CN106449333A (en) * | 2016-12-09 | 2017-02-22 | 北方夜视技术股份有限公司 | Large-size indium seal disc sealing and connecting method based on cathode transfer equipment |
| CN108417885A (en) * | 2018-02-23 | 2018-08-17 | 中澳科创(深圳)新材料有限公司 | Compound pole structure and the compound glass method for sealing of aluminum hull power lithium-ion battery |
| CN212179926U (en) * | 2020-06-12 | 2020-12-18 | 湖南二零八先进科技有限公司 | Laser gyro electrode indium seals reinforcing means |
-
2020
- 2020-06-12 CN CN202010532384.7A patent/CN111623801A/en active Pending
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1714444A (en) * | 2002-11-21 | 2005-12-28 | 日本电气株式会社 | Semiconductor device, wiring substrate, and method for manufacturing wiring substrate |
| CN2689440Y (en) * | 2004-01-08 | 2005-03-30 | 东南大学 | Binding structure of vacuum device |
| CN1959912A (en) * | 2006-10-20 | 2007-05-09 | 四川天微电子有限责任公司 | Indium seal type luminescent screen, and technique for preparing the display tube of using the luminescent screen |
| US20110290021A1 (en) * | 2010-05-30 | 2011-12-01 | Honeywell International Inc. | Hemitoroidal resonator gyroscope |
| CN102506841A (en) * | 2010-05-30 | 2012-06-20 | 霍尼韦尔国际公司 | Hemitoroidal resonator gyroscope |
| CN103674003A (en) * | 2012-09-07 | 2014-03-26 | 中国航空工业第六一八研究所 | Solenoid drive type laser gyroscope shaking mechanism |
| CN203464170U (en) * | 2013-08-07 | 2014-03-05 | 邓素琼 | Reflecting panel for surface light source |
| US20150132599A1 (en) * | 2013-11-08 | 2015-05-14 | Thales | Electrode of metallic material, and gyrolaser comprising at least one such electrode |
| CN204854757U (en) * | 2014-12-19 | 2015-12-09 | 北京航天时代激光导航技术有限责任公司 | Highly reliable sealed laser gyro integration negative pole |
| CN204633119U (en) * | 2015-06-11 | 2015-09-09 | 中国船舶重工集团公司第七一七研究所 | A ring laser electrode indium sealing device |
| CN105490058A (en) * | 2016-01-11 | 2016-04-13 | 华中科技大学 | Insulated sealing electrode component |
| CN106449333A (en) * | 2016-12-09 | 2017-02-22 | 北方夜视技术股份有限公司 | Large-size indium seal disc sealing and connecting method based on cathode transfer equipment |
| CN108417885A (en) * | 2018-02-23 | 2018-08-17 | 中澳科创(深圳)新材料有限公司 | Compound pole structure and the compound glass method for sealing of aluminum hull power lithium-ion battery |
| CN212179926U (en) * | 2020-06-12 | 2020-12-18 | 湖南二零八先进科技有限公司 | Laser gyro electrode indium seals reinforcing means |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113690387A (en) * | 2021-08-17 | 2021-11-23 | 晟合微电子(肇庆)有限公司 | Hot pressing component, hot pressing device, hot pressing method and storage medium |
| CN114019641A (en) * | 2021-11-19 | 2022-02-08 | 南方科技大学 | Double-indium-ring sealing structure and application thereof |
| CN115540842A (en) * | 2022-08-29 | 2022-12-30 | 北京航天时代激光导航技术有限责任公司 | A Method for Simultaneous Indium Sealing of Multiple Electrodes of Laser Gyro |
| CN115479596A (en) * | 2022-09-02 | 2022-12-16 | 天津集智航宇科技有限公司 | Laser gyro electrode and manufacturing method |
| CN115326044A (en) * | 2022-10-14 | 2022-11-11 | 天津集智航宇科技有限公司 | Laser gyroscope and sealing method thereof |
| CN115326044B (en) * | 2022-10-14 | 2023-01-20 | 天津集智航宇科技有限公司 | Laser gyroscope and sealing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111623801A (en) | Laser gyro electrode indium seal enhancement device and method | |
| CN212179926U (en) | Laser gyro electrode indium seals reinforcing means | |
| JP4082924B2 (en) | Electrostatic chuck holder and substrate processing apparatus | |
| CN105029991B (en) | A kind of manufacturing process of three layers of vacuum cup with phase-change material | |
| JP3686286B2 (en) | Arc tube and manufacturing method thereof | |
| CN1267242C (en) | Anode welding process for metal-glass and metal-ceram | |
| CN111595463B (en) | Split type Dewar cold platform with low contact thermal resistance and coupling stress isolation | |
| CN113697761A (en) | Resonant pressure sensitive chip probe of isolation packaging structure and packaging method thereof | |
| US4153317A (en) | Indium seal for gas laser | |
| JP2004265753A (en) | Short arc type ultra-high pressure discharge lamp | |
| CN114046895B (en) | Packaging structure of thin film thermocouple sensor chip | |
| CN103943437A (en) | Shaping device and method for field emission electron source emitter tip | |
| CN103026455A (en) | Field emission light source device and manufacturing method thereof | |
| JP3678212B2 (en) | Super high pressure mercury lamp | |
| JP5194377B2 (en) | Discharge lamp and discharge lamp device | |
| CN220917196U (en) | Heating element and cooking equipment | |
| CN105156888B (en) | A kind of dual temperature area apparatus for baking and implementation method for separated type Dewar aerofluxuss | |
| CN205037069U (en) | Be used for carminative couple of warm area baking equipment of separated type dewar | |
| CN222321800U (en) | Medical device with vacuum insulation performance | |
| CN216698111U (en) | Extremely low temperature electrolytic capacitor | |
| CN110398525B (en) | The sealing method of ZrO2-based oxygen sensitive element and metal flange | |
| CN106328836A (en) | A power battery and its high-temperature adhesive cover assembly | |
| CN100385608C (en) | Low-pressure gas discharge lamp | |
| JP4273589B2 (en) | light bulb | |
| CN115863123A (en) | Degassing method for body of gyrotron |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |