[go: up one dir, main page]

CN111623801A - Laser gyro electrode indium seal enhancement device and method - Google Patents

Laser gyro electrode indium seal enhancement device and method Download PDF

Info

Publication number
CN111623801A
CN111623801A CN202010532384.7A CN202010532384A CN111623801A CN 111623801 A CN111623801 A CN 111623801A CN 202010532384 A CN202010532384 A CN 202010532384A CN 111623801 A CN111623801 A CN 111623801A
Authority
CN
China
Prior art keywords
sealing
laser gyro
cylinder
electrode
indium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010532384.7A
Other languages
Chinese (zh)
Inventor
王飞
卢广锋
王凡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hunan 2008 Advanced Technology Co ltd
Original Assignee
Hunan 2008 Advanced Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hunan 2008 Advanced Technology Co ltd filed Critical Hunan 2008 Advanced Technology Co ltd
Priority to CN202010532384.7A priority Critical patent/CN111623801A/en
Publication of CN111623801A publication Critical patent/CN111623801A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01CMEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C25/00Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01CMEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/58Turn-sensitive devices without moving masses
    • G01C19/64Gyrometers using the Sagnac effect, i.e. rotation-induced shifts between counter-rotating electromagnetic beams
    • G01C19/66Ring laser gyrometers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Power Engineering (AREA)
  • Gyroscopes (AREA)

Abstract

本发明提出一种激光陀螺电极铟封增强装置,所述装置呈倒置圆筒状,圆筒内径与电极底部外径一致,圆筒厚度能够配合封接面,圆筒封接面为弧形。本发明还提出一种激光陀螺电极铟封增强方法,包括:1)在电极与谐振腔封接面周围增加铟圈封接材料;2)使用增强装置向下施压,加热软化所述铟圈;3)当增强装置到达封接处的最低端面时,保持封接压力和温度设定的时间;4)热压冷却后,对电极进行高压老化。本发明使得电极密封性能增强,有效保障了谐振腔的气密性,增大了激光陀螺阴极和谐振腔铟封接接触面,降低了封接漏气概率,提高了激光陀螺的寿命和可靠性。

Figure 202010532384

The invention provides an indium sealing enhancement device for a laser gyro electrode. The device is in the shape of an inverted cylinder, the inner diameter of the cylinder is the same as the outer diameter of the bottom of the electrode, the thickness of the cylinder can match the sealing surface, and the sealing surface of the cylinder is arc-shaped. The present invention also proposes a method for enhancing indium sealing of a laser gyro electrode, including: 1) adding an indium ring sealing material around the sealing surface between the electrode and the resonant cavity; 2) using a reinforcing device to press down to soften the indium ring by heating ; 3) When the reinforcement device reaches the lowest end face of the seal, keep the sealing pressure and temperature for the set time; 4) After the hot-pressed cooling, the electrodes are subjected to high-pressure aging. The invention enhances the sealing performance of the electrodes, effectively ensures the air tightness of the resonant cavity, increases the indium sealing contact surface between the cathode of the laser gyro and the resonant cavity, reduces the probability of air leakage in the sealing and improves the life and reliability of the laser gyro .

Figure 202010532384

Description

一种激光陀螺电极铟封增强装置和增强方法A kind of laser gyro electrode indium sealing enhancement device and enhancement method

技术领域technical field

本发明涉及激光陀螺电极技术领域,更具体地,涉及一种激光陀螺电极铟封增强装置和增强方法。The present invention relates to the technical field of laser gyro electrodes, and more particularly, to an indium sealing enhancement device and enhancement method for laser gyro electrodes.

背景技术Background technique

在激光陀螺制造中,考虑了阴极的自身寿命——发射电子能力与抗溅射能力,通常采用发射电子能力较强的高纯铝作为阴极材料,使用无氧铜或者钛作为阳极,激光陀螺腔体一般采用接近零膨胀的微晶玻璃。为了实现膨胀系数匹配性差的两种材料间的高真空密封,采用延展性良好的金属铟作为密封过渡材料。In the manufacture of laser gyroscopes, the lifespan of the cathode—the ability to emit electrons and the ability to resist sputtering is considered. Usually, high-purity aluminum with strong electron-emitting ability is used as the cathode material, oxygen-free copper or titanium is used as the anode, and the cavity of the laser gyroscope is used. The body is generally made of glass-ceramic with near zero expansion. In order to achieve high vacuum sealing between two materials with poor expansion coefficient matching, metal indium with good ductility is used as the sealing transition material.

铟封接作为一种非匹配封接工艺,具有封接面平整、结合强度大、真空性能优等特点。但是微晶谐振腔真空气密性要求较高,需降低封接泄漏的影响,引起泄漏的原因为封接残余应力,主要来自于:(1)电极材料与微晶腔体热膨胀系数匹配不一致,激光陀螺反复高低温环境中密封性能减弱甚至失效;(2)电极和谐振腔的封接接触面有限,一旦一处出现泄漏,将危及整个谐振腔。As a non-matching sealing process, indium sealing has the characteristics of flat sealing surface, high bonding strength and excellent vacuum performance. However, the vacuum airtightness of the microcrystalline cavity is relatively high, and the influence of sealing leakage needs to be reduced. The reason for the leakage is the residual stress of the sealing, which mainly comes from: (1) The matching of the thermal expansion coefficient of the electrode material and the microcrystalline cavity is inconsistent, The sealing performance of the laser gyroscope is weakened or even fails in repeated high and low temperature environments; (2) the sealing contact surface between the electrode and the resonator is limited, and once leakage occurs in one place, the entire resonator will be endangered.

目前大多数激光陀螺电极封接时,采用铟圈加热机械加压法,如图1所示,以阴极为例,在谐振腔和阴极底部压一层铟圈密封。其有效封接面积为电极与谐振腔接触面之间,面积有限。反复高低温测试后,由于膨胀系数匹配的问题,封接处容易出现泄漏,从而导致陀螺失效。At present, most laser gyroscope electrodes are sealed by using an indium ring heating and mechanical pressing method. The effective sealing area is between the electrode and the contact surface of the resonant cavity, and the area is limited. After repeated high and low temperature tests, due to the expansion coefficient matching problem, the sealing joints are prone to leakage, resulting in the failure of the gyroscope.

发明内容SUMMARY OF THE INVENTION

为解决上述技术问题,本发明提出一种激光陀螺电极铟封增强装置,所述装置呈倒置圆筒状,圆筒内径与电极底部外径一致,圆筒厚度能够配合封接面,圆筒封接面为弧形。In order to solve the above technical problems, the present invention proposes a laser gyro electrode indium sealing enhancement device, the device is in the shape of an inverted cylinder, the inner diameter of the cylinder is consistent with the outer diameter of the bottom of the electrode, the thickness of the cylinder can match the sealing surface, and the cylinder seals. The junction is curved.

可选地,所述圆筒封接面为1/4圆弧状。Optionally, the cylindrical sealing surface is in a 1/4 arc shape.

可选地,圆筒内径与电极的底部外径一致。Optionally, the inner diameter of the cylinder is the same as the outer diameter of the bottom of the electrode.

可选地,内部设置有加热头和温度传感器。Optionally, a heating head and a temperature sensor are provided inside.

本发明还提出一种激光陀螺电极铟封增强方法,包括:1)在电极与谐振腔封接面周围增加铟圈封接材料;2)使用增强装置向下施压,加热软化所述铟圈;3)当增强装置到达封接处的最低端面时,保持封接压力和温度设定的时间;4)热压冷却后,对电极进行高压老化。The present invention also proposes a method for enhancing indium sealing of a laser gyro electrode, which includes: 1) adding an indium ring sealing material around the sealing surface between the electrode and the resonant cavity; 2) using a reinforcing device to press down to soften the indium ring by heating ; 3) When the reinforcement device reaches the lowest end face of the seal, keep the sealing pressure and temperature for the set time; 4) After the hot-pressed cooling, the electrodes are subjected to high-pressure aging.

优选地,在步骤4)中,通过在电极和陀螺腔体之间加载高压交流电进行高压老化。Preferably, in step 4), high-voltage aging is performed by loading a high-voltage alternating current between the electrode and the gyro cavity.

优选地,所述增强装置呈倒置圆筒状,圆筒内径与电极底部外径一致,圆筒厚度能够配合封接面,圆筒封接面为弧形。Preferably, the reinforcing device is in the shape of an inverted cylinder, the inner diameter of the cylinder is the same as the outer diameter of the bottom of the electrode, the thickness of the cylinder can match the sealing surface, and the sealing surface of the cylinder is arc-shaped.

优选地,所述增强装置内部设置有加热头和温度传感器。Preferably, a heating head and a temperature sensor are arranged inside the enhancing device.

优选地,在步骤2)中,封接压力随着所述增强装置的下降而增加。Preferably, in step 2), the sealing pressure is increased as the reinforcing means is lowered.

优选地,在步骤4)中施加的交流电为1000V,1KHz,持续时间2-4小时。Preferably, the alternating current applied in step 4) is 1000V, 1KHz, and the duration is 2-4 hours.

本发明的优点是:使得电极密封性能增强,有效保障了谐振腔的气密性;增大激光陀螺阴极和谐振腔铟封接接触面,降低封接漏气概率,提高了激光陀螺的寿命和可靠性;装置结构简单,易加工装配,成本低。The advantages of the invention are: the sealing performance of the electrodes is enhanced, and the air tightness of the resonant cavity is effectively guaranteed; the indium sealing contact surface between the cathode of the laser gyro and the resonator cavity is enlarged, the probability of air leakage of the sealing is reduced, and the life and the life of the laser gyro are improved. Reliability; the device has a simple structure, is easy to process and assemble, and has a low cost.

附图说明Description of drawings

为了更容易理解本发明,将通过参照附图中示出的具体实施方式更详细地描述本发明。这些附图只描绘了本发明的典型实施方式,不应认为对本发明保护范围的限制。For easier understanding of the present invention, the present invention will be described in more detail by referring to specific embodiments shown in the accompanying drawings. These drawings depict only typical embodiments of the invention and should not be considered as limiting the scope of the invention.

图1为传统阴极封接剖面示意图。FIG. 1 is a schematic cross-sectional view of a conventional cathode sealing.

图2为本发明的激光陀螺阴极密封性增强的铟封装置的剖面示意图。FIG. 2 is a schematic cross-sectional view of the indium sealing device with enhanced sealing performance of the cathode of the laser gyro according to the present invention.

图3为本发明的激光陀螺阴极密封性增强的铟封装置的结构示意图。FIG. 3 is a schematic structural diagram of the indium sealing device with enhanced sealing performance of the cathode of the laser gyro according to the present invention.

图4为本发明的增强装置改进的阴极封接剖面示意图。4 is a schematic cross-sectional view of the improved cathode sealing of the reinforcing device of the present invention.

图5为本发明的增强装置改进的阴极封接效果示意图。FIG. 5 is a schematic diagram of the improved cathode sealing effect of the reinforcing device of the present invention.

图6为本发明的激光陀螺阴极密封性增强的铟封装置热压示意图。FIG. 6 is a schematic diagram of hot pressing of the indium sealing device with enhanced sealing of the cathode of the laser gyro according to the present invention.

图7为本发明的激光陀螺阴极铟封高压老化示意图。FIG. 7 is a schematic diagram of high-voltage aging of the laser gyro cathode indium sealing in accordance with the present invention.

图8为本发明的激光陀螺阴极铟封的检测结果表。FIG. 8 is a table of detection results of the laser gyro cathode indium seal of the present invention.

附图标记reference number

1-电极;2-传统封接部位;3-增强封接部位;4-谐振腔;5-铟封加强装置;6-柔性贴合电极;7-高压交流电源。1-electrode; 2-traditional sealing part; 3-enhanced sealing part; 4-resonant cavity; 5-indium sealing strengthening device; 6-flexible bonding electrode; 7-high voltage AC power supply.

具体实施方式Detailed ways

下面参照附图描述本发明的实施方式,其中相同的部件用相同的附图标记表示。在不冲突的情况下,下述的实施例及实施例中的技术特征可以相互组合。Embodiments of the present invention are described below with reference to the accompanying drawings, wherein like components are designated by like reference numerals. In the case of no conflict, the following embodiments and technical features in the embodiments can be combined with each other.

本发明提供一种激光陀螺电极铟封增强装置5,如图2和图3所示。The present invention provides an indium sealing enhancement device 5 for a laser gyro electrode, as shown in FIG. 2 and FIG. 3 .

铟封增强装置5为倒置圆筒状,圆筒具有一定厚度,圆筒厚度与电极1的封接面一致。圆筒内径与电极1(见图4)的底部外径一致。圆筒封接面为弧形。圆筒外径为圆筒内径与所述弧形半径之和。圆筒的厚度半径能够配合封接面,优选地与封接面一致。The indium sealing enhancement device 5 is in the shape of an inverted cylinder, the cylinder has a certain thickness, and the thickness of the cylinder is consistent with the sealing surface of the electrode 1 . The inner diameter of the cylinder corresponds to the outer diameter of the bottom of the electrode 1 (see Figure 4). The sealing surface of the cylinder is arc-shaped. The outer diameter of the cylinder is the sum of the inner diameter of the cylinder and the radius of the arc. The thickness radius of the cylinder can be adapted to the sealing surface, preferably coincident with the sealing surface.

圆筒封接面可以是其他形状或大小,只要把电极1的外部侧面也密封起来就可以。The cylindrical sealing surface may be of other shapes or sizes, as long as the outer side surface of the electrode 1 is also sealed.

优选地,圆筒封接面为1/4圆弧,此时,圆半径=圆筒厚度=阴极侧面封接高1/4圆弧度+底面封接铟膜厚度,圆筒外径为圆筒内径与圆弧半径之和。在一个实施方式中,圆筒封接面为1/4圆弧时,电极1的底部传统封接部位2的铟膜厚度约0.2mm,圆筒封接面为约2.2mm。圆筒内径为25mm,圆筒外径为27.2mm。Preferably, the sealing surface of the cylinder is a 1/4 arc, at this time, the radius of the circle = the thickness of the cylinder = the sealing height of the cathode side is 1/4 arc + the thickness of the indium film sealed on the bottom surface, and the outer diameter of the cylinder is a circle The sum of the inner diameter of the cylinder and the radius of the arc. In one embodiment, when the cylindrical sealing surface is a 1/4 arc, the thickness of the indium film at the conventional sealing portion 2 at the bottom of the electrode 1 is about 0.2 mm, and the cylindrical sealing surface is about 2.2 mm. The inner diameter of the cylinder is 25 mm, and the outer diameter of the cylinder is 27.2 mm.

该增强装置内可以设置加热头和薄膜式铂电阻温度传感器,温度传感器测温范围为-70℃~+300℃,精度为1/3B级。A heating head and a thin-film platinum resistance temperature sensor can be set in the enhancement device. The temperature measurement range of the temperature sensor is -70℃~+300℃, and the accuracy is 1/3B.

本发明在原有的底部封接面旁边,增加一层封接面,且将面扩展至电极侧面,以阴极为例,如图4-图6所示。这将降低激光陀螺漏气的可能性,起到双重保护的作用。In the present invention, a layer of sealing surface is added beside the original bottom sealing surface, and the surface is extended to the side of the electrode, taking the cathode as an example, as shown in Figures 4-6. This will reduce the possibility of air leakage of the laser gyroscope and play a dual protection role.

本发明还提出一种激光陀螺电极铟封增强方法,包括:1)在电极1与谐振腔4的封接面周围增加铟圈封接材料;2)使用增强装置向下施压,加热软化所述铟圈,所述装置的结构呈如前所述;3)当增强装置到达封接最低端面时,保持封接压力和温度,稳定设定时间。4)热压冷却后,对电极进行高压老化。The present invention also proposes an indium sealing enhancement method for a laser gyro electrode, which includes: 1) adding an indium ring sealing material around the sealing surface of the electrode 1 and the resonant cavity 4; 2) using a strengthening device to apply downward pressure to heat and soften the For the indium ring, the structure of the device is as described above; 3) When the reinforcing device reaches the lowest end face of the sealing, keep the sealing pressure and temperature, and stabilize the set time. 4) After hot pressing and cooling, the electrodes are subjected to high pressure aging.

下面详细描述本发明的方法和使用铟封增强装置5的封接步骤。The method of the present invention and the sealing step using the indium sealing enhancement device 5 are described in detail below.

S1,抛光电极封接面:选择粒度为纳米级的SiO2溶胶为抛光液,在转速30转/分钟的抛光盘中抛光5小时,使微晶玻璃表面粗糙度Ra达到0.3nm。电极封接面经过抛光后,能使表面更加平整,有利于铟封密封性。S1, polishing the electrode sealing surface: select SiO 2 sol with a particle size of nano-scale as the polishing solution, and polish it in a polishing disc with a rotating speed of 30 rpm for 5 hours, so that the surface roughness Ra of the glass-ceramics reaches 0.3nm. After the electrode sealing surface is polished, the surface can be made more flat, which is beneficial to the sealing performance of the indium sealing.

S2,清洗电极:采用RCA湿法化学清洗工艺。S2, cleaning electrode: RCA wet chemical cleaning process is adopted.

(1)将微晶玻璃浸没于丙酮中加热至50℃超声清洗30分钟;(1) Immerse the glass-ceramic in acetone and heat to 50°C for ultrasonic cleaning for 30 minutes;

(2)用酒精将微晶玻璃上残留丙酮冲洗干净,随后在酒精中超声10分钟;(2) Rinse the residual acetone on the glass-ceramic with alcohol, then ultrasonicate in alcohol for 10 minutes;

(3)取出玻璃衬底,采用去离子水将衬底冲洗干净,然后在混合溶液(浓H2SO4/H2O2=7/3)中浸泡4小时以上;(3) Take out the glass substrate, rinse the substrate with deionized water, and then soak it in a mixed solution (concentrated H 2 SO 4 /H 2 O 2 =7/3) for more than 4 hours;

(4)取出玻璃衬底,采用去离子水将衬底冲洗干净,高纯氮气吹干备用。(4) Take out the glass substrate, rinse the substrate with deionized water, and dry it with high-purity nitrogen for use.

S3,铟封:使用时根据铟圈材料性质,温度设置为140℃,增强装置温感灵敏度±1℃。封接过程中,封接压力通过直线推杆的下压产生,通过控制直线推杆的位移,间接控制封接压力。当热压头(增强装置的圆筒下端)接触零件上表面后,铟圈受热软化,封接压力将随着热压头的下降而增加。当铟封加强装置5到达封接最低端面时(如图6),保持封接压力、温度稳定30分钟。封接完成后缓慢释放压力,防止压力快速释放可能对压封质量或者工件造成不必要的损伤。S3, indium seal: according to the material properties of the indium ring, the temperature is set to 140°C to enhance the temperature sensitivity of the device by ±1°C. During the sealing process, the sealing pressure is generated by the downward pressure of the linear push rod, and the sealing pressure is indirectly controlled by controlling the displacement of the linear push rod. When the thermal indenter (the lower end of the cylinder of the reinforcing device) contacts the upper surface of the part, the indium ring is heated and softened, and the sealing pressure will increase with the decrease of the thermal indenter. When the indium sealing strengthening device 5 reaches the lowest end face of the sealing (as shown in FIG. 6 ), keep the sealing pressure and temperature stable for 30 minutes. After the sealing is completed, release the pressure slowly to prevent the rapid release of the pressure from causing unnecessary damage to the sealing quality or the workpiece.

S4,高压老化:热压冷却后,在电极和陀螺腔体之间通过加载高压交流电源7(1000V、1KHz,电流很小,因为腔体是微晶玻璃的并非电的良导体,但是有部分离子可以导电,这个过程中电流实际上是通过铟环流过去的)。如图7所示,谐振腔4内贴一柔性贴合电极6,交流高压电源7连接激光陀螺的(阴极)电极1和激光陀螺谐振腔4内的柔性贴合电极6,在高频高压电场作用下,铟原子会向阴极(铝)和腔体(微晶玻璃)表层内部扩散,加电过程需要2-4小时。高压老化过程可以使得铟向电极、腔体的接触面中扩散,增强铟与两个接触面的封接牢度。S4, high-voltage aging: after hot-press cooling, load a high-voltage AC power supply 7 (1000V, 1KHz) between the electrode and the gyro cavity, the current is very small, because the cavity is glass-ceramic and not a good conductor of electricity, but some parts The ions can conduct electricity, and the current actually flows through the indium loop in the process). As shown in FIG. 7 , a flexible bonding electrode 6 is attached in the resonator 4, and the AC high-voltage power supply 7 is connected to the (cathode) electrode 1 of the laser gyro and the flexible bonding electrode 6 in the laser gyro resonator 4. In the high-frequency high-voltage electric field Under the action, the indium atoms will diffuse to the inside of the cathode (aluminum) and the cavity (glass-ceramic), and the power-on process takes 2-4 hours. The high-voltage aging process can make indium diffuse into the contact surface of the electrode and the cavity, and enhance the sealing fastness of the indium and the two contact surfaces.

通过测试,本发明的装置具有更好的技术效果,如图8所示。用本发明的增强装置对激光陀螺阴、阳极封接后,在高低温箱进行反复高低温冲击试验,再用氦质谱检漏仪测定激光陀螺的氦泄漏率。试验温度为-60℃~+80℃,升降温速率为5℃/min,具体试验过程为:Through testing, the device of the present invention has better technical effects, as shown in FIG. 8 . After sealing the cathode and anode of the laser gyro with the enhancing device of the present invention, repeated high and low temperature impact tests are carried out in a high and low temperature box, and then the helium leak rate of the laser gyro is measured by a helium mass spectrometer leak detector. The test temperature is -60℃~+80℃, and the temperature rise and fall rate is 5℃/min. The specific test process is as follows:

(1)选择10个密封良好的传统封接的激光陀螺,编号1-(1~10),和10个改进封接工艺的激光陀螺,编号2-(1~10)。采用氦质谱检漏仪测定激光陀螺漏率,记入表格,见图8(单位:Pa·m3/s,当激光陀螺氦泄漏率低于10×10-10时,认为检漏不合格);(1) Select 10 well-sealed traditionally sealed laser gyroscopes, numbered 1-(1-10), and 10 laser gyroscopes with improved sealing process, numbered 2-(1-10). The laser gyro leak rate was measured by a helium mass spectrometer leak detector and recorded in the table, as shown in Figure 8 (unit: Pa·m 3 /s, when the helium leak rate of the laser gyro was lower than 10×10 -10 , the leak detection was considered unqualified) ;

(2)将激光陀螺放入高低温箱,设置试验温度为-60℃~+80℃,升降温速率为5℃/min,每次到达温度高点和低点均保持60分钟,重复50个周期,然后采用氦质谱检漏,测定激光陀螺漏率,记入表格(2) Put the laser gyro into the high and low temperature box, set the test temperature to -60℃~+80℃, the temperature rise and fall rate is 5℃/min, keep the high and low temperature points for 60 minutes each time, repeat 50 times cycle, and then use helium mass spectrometry to detect leaks, measure the leak rate of the laser gyro, and record it in the table

(3)重复步骤(2),重复20个周期,测定激光陀螺漏率,记入表格(3) Repeat step (2) for 20 cycles, measure the leak rate of the laser gyro, and record it in the table

(4)继续重复步骤(2),重复30个周期,测定激光陀螺漏率,记入表格。(4) Continue to repeat step (2) for 30 cycles, measure the leakage rate of the laser gyro, and record it in the table.

结果表明,在相同的高低温试验条件下,传统封接工艺循环50圈开始出现漏气,数量1个,循环70圈和100圈相继出现更多漏气陀螺。而本发明的改进封接工艺,循环70圈漏气1个,循环100圈漏气2个,密封性能明显提升。表明本发明的装置结构设计简单,易加工装配,成本低,密封可靠性高,密封性能好。The results show that under the same high and low temperature test conditions, the traditional sealing process starts to leak after 50 cycles, and the number is 1, and there are more leaking gyroscopes after 70 cycles and 100 cycles. On the other hand, in the improved sealing process of the present invention, there is one air leak in 70 cycles, and two air leaks in 100 cycles, and the sealing performance is obviously improved. It shows that the device of the present invention is simple in structure design, easy to process and assemble, low in cost, high in sealing reliability and good in sealing performance.

以上所述的实施例,只是本发明较优选的具体实施方式,本领域的技术人员在本发明技术方案范围内进行的通常变化和替换都应包含在本发明的保护范围内。The above-mentioned embodiments are only preferred specific embodiments of the present invention, and the usual changes and substitutions made by those skilled in the art within the scope of the technical solutions of the present invention should be included in the protection scope of the present invention.

Claims (10)

1.一种激光陀螺电极铟封增强装置,其特征在于,1. a laser gyro electrode indium sealing enhancement device, is characterized in that, 所述装置呈倒置圆筒状,圆筒内径与电极底部外径一致,圆筒厚度能够配合封接面,圆筒封接面为弧形。The device is in the shape of an inverted cylinder, the inner diameter of the cylinder is consistent with the outer diameter of the bottom of the electrode, the thickness of the cylinder can match the sealing surface, and the sealing surface of the cylinder is arc-shaped. 2.根据权利要求1所述的激光陀螺电极铟封增强装置,其特征在于,2. The laser gyro electrode indium sealing enhancement device according to claim 1, characterized in that, 所述圆筒封接面为1/4圆弧状。The cylindrical sealing surface is in a 1/4 arc shape. 3.根据权利要求1所述的激光陀螺电极铟封增强装置,其特征在于,3. The laser gyro electrode indium sealing enhancement device according to claim 1, characterized in that, 圆筒内径与电极的底部外径一致。The inner diameter of the cylinder is the same as the outer diameter of the bottom of the electrode. 4.根据权利要求1所述的激光陀螺电极铟封增强装置,其特征在于,4. The laser gyro electrode indium sealing enhancement device according to claim 1, wherein, 内部设置有加热头和温度传感器。There is a heating head and a temperature sensor inside. 5.一种激光陀螺电极铟封增强方法,其特征在于,包括:5. A laser gyro electrode indium sealing enhancement method, characterized in that, comprising: 1)在电极与谐振腔封接面周围增加铟圈封接材料;1) Add indium ring sealing material around the sealing surface of the electrode and the resonant cavity; 2)使用增强装置向下施压,加热软化所述铟圈;2) Use the strengthening device to apply downward pressure to soften the indium ring by heating; 3)当增强装置到达封接处的最低端面时,保持封接压力和温度设定的时间;3) When the reinforcement device reaches the lowest end face of the seal, keep the sealing pressure and temperature setting time; 4)热压冷却后,对电极进行高压老化。4) After hot pressing and cooling, the electrodes are subjected to high pressure aging. 6.根据权利要求5所述的激光陀螺电极铟封增强方法,其特征在于,还包括:6. The laser gyro electrode indium sealing enhancement method according to claim 5, further comprising: 通过在电极和陀螺腔体之间加载高压交流电进行高压老化。High-voltage aging is performed by loading a high-voltage alternating current between the electrodes and the gyro cavity. 7.根据权利要求5所述的激光陀螺电极铟封增强方法,其特征在于,7. The laser gyro electrode indium sealing enhancement method according to claim 5, wherein, 所述增强装置呈倒置圆筒状,圆筒内径与电极底部外径一致,圆筒厚度能够配合封接面,圆筒封接面为弧形。The reinforcing device is in the shape of an inverted cylinder, the inner diameter of the cylinder is consistent with the outer diameter of the bottom of the electrode, the thickness of the cylinder can match the sealing surface, and the sealing surface of the cylinder is arc-shaped. 8.根据权利要求7所述的激光陀螺电极铟封增强方法,其特征在于,8. The laser gyro electrode indium sealing enhancement method according to claim 7, wherein, 所述增强装置内部设置有加热头和温度传感器。A heating head and a temperature sensor are arranged inside the enhancing device. 9.根据权利要求5所述的激光陀螺电极铟封增强方法,其特征在于,9. The laser gyro electrode indium sealing enhancement method according to claim 5, wherein, 在步骤2)中,封接压力随着所述增强装置的下降而增加。In step 2), the sealing pressure is increased as the reinforcement means is lowered. 10.根据权利要求6所述的激光陀螺电极铟封增强方法,其特征在于,10. The laser gyro electrode indium sealing enhancement method according to claim 6, wherein, 在步骤4)中施加的交流电为1000V,1KHz,持续时间2-4小时。The alternating current applied in step 4) is 1000V, 1KHz, and the duration is 2-4 hours.
CN202010532384.7A 2020-06-12 2020-06-12 Laser gyro electrode indium seal enhancement device and method Pending CN111623801A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010532384.7A CN111623801A (en) 2020-06-12 2020-06-12 Laser gyro electrode indium seal enhancement device and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010532384.7A CN111623801A (en) 2020-06-12 2020-06-12 Laser gyro electrode indium seal enhancement device and method

Publications (1)

Publication Number Publication Date
CN111623801A true CN111623801A (en) 2020-09-04

Family

ID=72258534

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010532384.7A Pending CN111623801A (en) 2020-06-12 2020-06-12 Laser gyro electrode indium seal enhancement device and method

Country Status (1)

Country Link
CN (1) CN111623801A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113690387A (en) * 2021-08-17 2021-11-23 晟合微电子(肇庆)有限公司 Hot pressing component, hot pressing device, hot pressing method and storage medium
CN114019641A (en) * 2021-11-19 2022-02-08 南方科技大学 Double-indium-ring sealing structure and application thereof
CN115326044A (en) * 2022-10-14 2022-11-11 天津集智航宇科技有限公司 Laser gyroscope and sealing method thereof
CN115479596A (en) * 2022-09-02 2022-12-16 天津集智航宇科技有限公司 Laser gyro electrode and manufacturing method
CN115540842A (en) * 2022-08-29 2022-12-30 北京航天时代激光导航技术有限责任公司 A Method for Simultaneous Indium Sealing of Multiple Electrodes of Laser Gyro

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2689440Y (en) * 2004-01-08 2005-03-30 东南大学 Binding structure of vacuum device
CN1714444A (en) * 2002-11-21 2005-12-28 日本电气株式会社 Semiconductor device, wiring substrate, and method for manufacturing wiring substrate
CN1959912A (en) * 2006-10-20 2007-05-09 四川天微电子有限责任公司 Indium seal type luminescent screen, and technique for preparing the display tube of using the luminescent screen
US20110290021A1 (en) * 2010-05-30 2011-12-01 Honeywell International Inc. Hemitoroidal resonator gyroscope
CN203464170U (en) * 2013-08-07 2014-03-05 邓素琼 Reflecting panel for surface light source
CN103674003A (en) * 2012-09-07 2014-03-26 中国航空工业第六一八研究所 Solenoid drive type laser gyroscope shaking mechanism
US20150132599A1 (en) * 2013-11-08 2015-05-14 Thales Electrode of metallic material, and gyrolaser comprising at least one such electrode
CN204633119U (en) * 2015-06-11 2015-09-09 中国船舶重工集团公司第七一七研究所 A ring laser electrode indium sealing device
CN204854757U (en) * 2014-12-19 2015-12-09 北京航天时代激光导航技术有限责任公司 Highly reliable sealed laser gyro integration negative pole
CN105490058A (en) * 2016-01-11 2016-04-13 华中科技大学 Insulated sealing electrode component
CN106449333A (en) * 2016-12-09 2017-02-22 北方夜视技术股份有限公司 Large-size indium seal disc sealing and connecting method based on cathode transfer equipment
CN108417885A (en) * 2018-02-23 2018-08-17 中澳科创(深圳)新材料有限公司 Compound pole structure and the compound glass method for sealing of aluminum hull power lithium-ion battery
CN212179926U (en) * 2020-06-12 2020-12-18 湖南二零八先进科技有限公司 Laser gyro electrode indium seals reinforcing means

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1714444A (en) * 2002-11-21 2005-12-28 日本电气株式会社 Semiconductor device, wiring substrate, and method for manufacturing wiring substrate
CN2689440Y (en) * 2004-01-08 2005-03-30 东南大学 Binding structure of vacuum device
CN1959912A (en) * 2006-10-20 2007-05-09 四川天微电子有限责任公司 Indium seal type luminescent screen, and technique for preparing the display tube of using the luminescent screen
US20110290021A1 (en) * 2010-05-30 2011-12-01 Honeywell International Inc. Hemitoroidal resonator gyroscope
CN102506841A (en) * 2010-05-30 2012-06-20 霍尼韦尔国际公司 Hemitoroidal resonator gyroscope
CN103674003A (en) * 2012-09-07 2014-03-26 中国航空工业第六一八研究所 Solenoid drive type laser gyroscope shaking mechanism
CN203464170U (en) * 2013-08-07 2014-03-05 邓素琼 Reflecting panel for surface light source
US20150132599A1 (en) * 2013-11-08 2015-05-14 Thales Electrode of metallic material, and gyrolaser comprising at least one such electrode
CN204854757U (en) * 2014-12-19 2015-12-09 北京航天时代激光导航技术有限责任公司 Highly reliable sealed laser gyro integration negative pole
CN204633119U (en) * 2015-06-11 2015-09-09 中国船舶重工集团公司第七一七研究所 A ring laser electrode indium sealing device
CN105490058A (en) * 2016-01-11 2016-04-13 华中科技大学 Insulated sealing electrode component
CN106449333A (en) * 2016-12-09 2017-02-22 北方夜视技术股份有限公司 Large-size indium seal disc sealing and connecting method based on cathode transfer equipment
CN108417885A (en) * 2018-02-23 2018-08-17 中澳科创(深圳)新材料有限公司 Compound pole structure and the compound glass method for sealing of aluminum hull power lithium-ion battery
CN212179926U (en) * 2020-06-12 2020-12-18 湖南二零八先进科技有限公司 Laser gyro electrode indium seals reinforcing means

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113690387A (en) * 2021-08-17 2021-11-23 晟合微电子(肇庆)有限公司 Hot pressing component, hot pressing device, hot pressing method and storage medium
CN114019641A (en) * 2021-11-19 2022-02-08 南方科技大学 Double-indium-ring sealing structure and application thereof
CN115540842A (en) * 2022-08-29 2022-12-30 北京航天时代激光导航技术有限责任公司 A Method for Simultaneous Indium Sealing of Multiple Electrodes of Laser Gyro
CN115479596A (en) * 2022-09-02 2022-12-16 天津集智航宇科技有限公司 Laser gyro electrode and manufacturing method
CN115326044A (en) * 2022-10-14 2022-11-11 天津集智航宇科技有限公司 Laser gyroscope and sealing method thereof
CN115326044B (en) * 2022-10-14 2023-01-20 天津集智航宇科技有限公司 Laser gyroscope and sealing method thereof

Similar Documents

Publication Publication Date Title
CN111623801A (en) Laser gyro electrode indium seal enhancement device and method
CN212179926U (en) Laser gyro electrode indium seals reinforcing means
JP4082924B2 (en) Electrostatic chuck holder and substrate processing apparatus
CN105029991B (en) A kind of manufacturing process of three layers of vacuum cup with phase-change material
JP3686286B2 (en) Arc tube and manufacturing method thereof
CN1267242C (en) Anode welding process for metal-glass and metal-ceram
CN111595463B (en) Split type Dewar cold platform with low contact thermal resistance and coupling stress isolation
CN113697761A (en) Resonant pressure sensitive chip probe of isolation packaging structure and packaging method thereof
US4153317A (en) Indium seal for gas laser
JP2004265753A (en) Short arc type ultra-high pressure discharge lamp
CN114046895B (en) Packaging structure of thin film thermocouple sensor chip
CN103943437A (en) Shaping device and method for field emission electron source emitter tip
CN103026455A (en) Field emission light source device and manufacturing method thereof
JP3678212B2 (en) Super high pressure mercury lamp
JP5194377B2 (en) Discharge lamp and discharge lamp device
CN220917196U (en) Heating element and cooking equipment
CN105156888B (en) A kind of dual temperature area apparatus for baking and implementation method for separated type Dewar aerofluxuss
CN205037069U (en) Be used for carminative couple of warm area baking equipment of separated type dewar
CN222321800U (en) Medical device with vacuum insulation performance
CN216698111U (en) Extremely low temperature electrolytic capacitor
CN110398525B (en) The sealing method of ZrO2-based oxygen sensitive element and metal flange
CN106328836A (en) A power battery and its high-temperature adhesive cover assembly
CN100385608C (en) Low-pressure gas discharge lamp
JP4273589B2 (en) light bulb
CN115863123A (en) Degassing method for body of gyrotron

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination