CN111604566A - A circuit board welding tool - Google Patents
A circuit board welding tool Download PDFInfo
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- CN111604566A CN111604566A CN202010615937.5A CN202010615937A CN111604566A CN 111604566 A CN111604566 A CN 111604566A CN 202010615937 A CN202010615937 A CN 202010615937A CN 111604566 A CN111604566 A CN 111604566A
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- circuit board
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- Mechanical Engineering (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
本发明提供一种电路板焊接工装,涉及电子器件技术领域,包括基座和锁定部。其中,锁定部设置在基座上,同时,在基座上还设置有引导通孔。基座通过锁定部和电路板锁定,使得引导通孔能够与电路板上的焊接孔对应。此时,待焊接元器件的引脚可以通过基座上的引导通孔时,经其引导后准确的插入电路板上的焊接孔内,方便后续工艺进行焊接,避免了因先焊接产生装配应力使得待焊接元器件的损坏。同时,也避免了现有焊接时,采用过量扩大电路板焊孔的方式来吸收引脚与焊孔的装配误差,有利于提高焊接的良率,有效减少焊接过程中溢锡、焊接不良等现象,改善了电路板与待焊接元器件的装配效率及成品率。
The invention provides a circuit board welding tool, which relates to the technical field of electronic devices, and includes a base and a locking portion. Wherein, the locking part is arranged on the base, and at the same time, a guiding through hole is also arranged on the base. The base is locked with the circuit board by the locking portion, so that the guiding through holes can correspond to the soldering holes on the circuit board. At this time, when the pins of the components to be soldered can pass through the guiding through holes on the base, they can be accurately inserted into the soldering holes on the circuit board after being guided, which facilitates soldering in the subsequent process and avoids assembly stress caused by first soldering. Damage to the components to be welded. At the same time, it also avoids the use of excessively expanding the solder holes of the circuit board to absorb the assembly errors of the pins and solder holes during the existing soldering process, which is conducive to improving the yield of soldering and effectively reducing the phenomenon of overflowing tin and poor soldering during the soldering process. , which improves the assembly efficiency and yield of circuit boards and components to be soldered.
Description
技术领域technical field
本发明涉及电子器件技术领域,具体而言,涉及一种电路板焊接工装。The invention relates to the technical field of electronic devices, in particular to a circuit board welding tool.
背景技术Background technique
电子产品内的印制电路板上面大部分是焊接的元器件,行业内通常的做法是,元器件先在印制电路板上焊接,然后再将印制电路板安装到散热器等电子产品封装上。这样虽然可以简化操作工艺,但是,对于一些比较大的器件,如果采用上述方法预先将元器件焊接在印制电路板上,然后在将印制电路板安装在散热器或者封装上的时候,印制电路板将承受较大的变形应力,可能会导致印制电路板上的一些器件受损。Most of the printed circuit boards in electronic products are soldered components. The usual practice in the industry is to solder the components on the printed circuit board first, and then install the printed circuit board to the radiator and other electronic product packages. superior. Although this can simplify the operation process, for some relatively large devices, if the above method is used to pre-solder the components on the printed circuit board, and then when the printed circuit board is mounted on the heat sink or package, the printed circuit board is The printed circuit board will be subjected to large deformation stress, which may cause damage to some components on the printed circuit board.
针对上述的行业问题,也有一些新方法试图采用先锁紧元器件及印制电路板,后焊接的工艺,由于这种工艺需要元器件的焊接引脚能够顺利放入到印制电路板的焊接孔内,通常的做法是扩大印制电路板的焊接孔来吸收与焊接引脚的装配误差,但该种做法往往会使得焊接孔过大,导致后续焊接的不良、溢锡等,进而使得产品良率较低。In view of the above-mentioned industry problems, there are also some new methods that try to use the process of locking the components and the printed circuit board first, and then soldering, because this process requires the welding pins of the components to be smoothly placed into the printed circuit board. In the hole, the usual practice is to expand the welding hole of the printed circuit board to absorb the assembly error with the welding pin, but this method often makes the welding hole too large, resulting in poor subsequent welding, overflowing tin, etc., which in turn makes the product Yield is low.
发明内容SUMMARY OF THE INVENTION
本发明的目的在于,针对上述现有技术中的不足,提供一种电路板焊接工装,以解决现有电路板在焊接时因焊接孔过大导致产品良率较低的问题。The purpose of the present invention is to provide a circuit board welding tool in view of the above-mentioned deficiencies in the prior art, so as to solve the problem of low product yield due to excessively large welding holes during welding of the existing circuit boards.
为实现上述目的,本发明实施例采用的技术方案如下:To achieve the above purpose, the technical solutions adopted in the embodiments of the present invention are as follows:
本发明实施例的一方面,提供一种电路板焊接工装,用于辅助电路板上待焊接元器件的焊接,包括:基座和设置在基座上的锁定部;基座用于通过锁定部与电路板锁定;在基座上还设置有与电路板上的焊接孔对应的引导通孔,用于引导待焊接元器件的引脚经引导通孔插入电路板上的焊接孔。In one aspect of the embodiments of the present invention, a circuit board welding tool is provided, which is used to assist the welding of components to be welded on the circuit board, including: a base and a locking portion disposed on the base; the base is used for passing through the locking portion It is locked with the circuit board; the base is also provided with guide through holes corresponding to the welding holes on the circuit board, which are used to guide the pins of the components to be welded into the welding holes on the circuit board through the guide through holes.
可选的,锁定部包括相对配合设置在基座上的第一弹性件和第二弹性件;在第一弹性件和第二弹性件的另一端分别设置有延伸部,延伸部的延伸方向与弹性件的轴向相交;第一弹性件和第二弹性件沿其轴向插接于电路板的锁孔,且和锁孔内壁张紧后,通过延伸部与电路板抵接以使基座与电路板卡接。Optionally, the locking portion includes a first elastic member and a second elastic member which are relatively matched and arranged on the base; an extension portion is respectively provided at the other end of the first elastic member and the second elastic member, and the extension direction of the extension portion is the same as that of the base. The axial direction of the elastic member intersects; the first elastic member and the second elastic member are inserted into the lock hole of the circuit board along their axial direction, and after being tensioned with the inner wall of the lock hole, they abut with the circuit board through the extension part to make the base Connect with the circuit board.
可选的,在延伸部上还形成有导向面,用于引导第一弹性件和第二弹性件插入电路板的锁孔内。Optionally, a guide surface is further formed on the extension part for guiding the first elastic member and the second elastic member to be inserted into the locking hole of the circuit board.
可选的,锁定部包括设置在基座上的锁定柱以及设置在锁定柱外周的外螺纹,锁定柱通过外螺纹与电路板的锁孔螺纹连接。Optionally, the locking portion includes a locking post provided on the base and an external thread provided on the outer periphery of the locking post, and the locking post is threadedly connected to the locking hole of the circuit board through the external thread.
可选的,引导通孔靠近电路板一侧的孔径小于远离电路板一侧的孔径。Optionally, the hole diameter of the guiding through hole on the side close to the circuit board is smaller than the hole diameter on the side away from the circuit board.
可选的,引导通孔为锥形孔。Optionally, the guide through hole is a tapered hole.
可选的,基座包括基座本体以及设置在基座本体上的隔离凸台;隔离凸台与锁定部同侧设置,且隔离凸台用于在锁定部与电路板锁定后与电路板抵接。Optionally, the base includes a base body and an isolation boss disposed on the base body; the isolation boss is provided on the same side as the locking portion, and the isolation boss is used to abut against the circuit board after the locking portion and the circuit board are locked. catch.
可选的,隔离凸台位于基座本体和锁定部之间。Optionally, the isolation boss is located between the base body and the locking portion.
可选的,基座为绝缘材料。Optionally, the base is made of insulating material.
可选的,锁定部包括多个,多个锁定部间隔设置在基座的同侧;引导通孔包括多个,多个引导通孔与电路板上的多个焊接孔一一对应。Optionally, the locking portion includes a plurality of locking portions, and the locking portions are arranged on the same side of the base at intervals; the guiding through holes include a plurality, and the plurality of guiding through holes correspond to the plurality of welding holes on the circuit board one-to-one.
本发明的有益效果包括:The beneficial effects of the present invention include:
本发明提供了一种电路板焊接工装,包括基座和锁定部。其中,锁定部设置在基座上,同时,在基座上还设置有引导通孔。基座通过锁定部和电路板锁定,使得引导通孔能够与电路板上的焊接孔对应。此时,待焊接元器件的引脚可以通过基座上的引导通孔时,经其引导后准确的插入电路板上的焊接孔内,方便后续工艺进行焊接,避免了因先焊接产生装配应力使得待焊接元器件的损坏。同时,也避免了现有焊接时,采用过量扩大电路板焊孔的方式来吸收引脚与焊孔的装配误差,有利于提高焊接的良率,有效减少焊接过程中溢锡、焊接不良等现象,改善了电路板与待焊接元器件的装配效率及成品率。The invention provides a circuit board welding tool, which includes a base and a locking part. Wherein, the locking part is arranged on the base, and at the same time, a guiding through hole is also arranged on the base. The base is locked with the circuit board by the locking portion, so that the guiding through holes can correspond to the soldering holes on the circuit board. At this time, when the pins of the components to be soldered can pass through the guiding through holes on the base, they can be accurately inserted into the soldering holes on the circuit board after being guided, which is convenient for subsequent soldering processes and avoids assembly stress caused by first soldering. Damage to the components to be welded. At the same time, it also avoids the use of excessively expanding the solder holes of the circuit board to absorb the assembly errors of the pins and solder holes during the existing soldering process, which is conducive to improving the yield of soldering and effectively reducing the phenomenon of overflowing tin and poor soldering during the soldering process. , which improves the assembly efficiency and yield of circuit boards and components to be soldered.
附图说明Description of drawings
为了更清楚地说明本发明实施例的技术方案,下面将对实施例中所需要使用的附图作简单地介绍,应当理解,以下附图仅示出了本发明的某些实施例,因此不应被看作是对范围的限定,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他相关的附图。In order to illustrate the technical solutions of the embodiments of the present invention more clearly, the following briefly introduces the accompanying drawings used in the embodiments. It should be understood that the following drawings only show some embodiments of the present invention, and therefore do not It should be regarded as a limitation of the scope, and for those of ordinary skill in the art, other related drawings can also be obtained according to these drawings without any creative effort.
图1为本发明实施例提供的一种电路板焊接工装的结构示意图之一;1 is one of the structural schematic diagrams of a circuit board welding tool provided in an embodiment of the present invention;
图2为本发明实施例提供的一种电路板焊接工装的结构示意图之二;FIG. 2 is a second schematic structural diagram of a circuit board welding tool provided in an embodiment of the present invention;
图3为本发明实施例提供的一种电路板焊接工装的结构示意图之三;3 is a third schematic structural diagram of a circuit board welding tool provided in an embodiment of the present invention;
图4为本发明实施例提供的一种电路板焊接工装的结构示意图之四;FIG. 4 is a fourth schematic structural diagram of a circuit board welding tool provided by an embodiment of the present invention;
图5为本发明实施例提供的一种电路板焊接工装的结构示意图之五;5 is a fifth schematic structural diagram of a circuit board welding tool provided by an embodiment of the present invention;
图6为本发明实施例提供的一种电路板焊接工装的结构示意图之六。FIG. 6 is a sixth schematic structural diagram of a circuit board soldering tool provided by an embodiment of the present invention.
图标:1-电路板焊接工装;3-电路板;4-待焊接元器件;41-引脚;6-散热器;11-基座本体;12-引导通孔;13-锁定部;131-第一弹性件;132-第二弹性件;133-延伸部;14-隔离凸台。Icon: 1- circuit board welding tool; 3- circuit board; 4- components to be welded; 41- pin; 6- heat sink; 11- base body; 12- guide through hole; 13- locking part; 131- 132-second elastic part; 133-extension part; 14-isolation boss.
具体实施方式Detailed ways
为使本发明实施例的目的、技术方案和优点更加清楚,下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例是本发明一部分实施例,而不是全部的实施例。通常在此处附图中描述和示出的本发明实施例的组件可以以各种不同的配置来布置和设计。In order to make the purposes, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments These are some embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the drawings herein may be arranged and designed in a variety of different configurations.
因此,以下对在附图中提供的本发明的实施例的详细描述并非旨在限制要求保护的本发明的范围,而是仅仅表示本发明的选定实施例。需要说明的是,在不冲突的情况下,本发明的实施例中的各个特征可以相互结合,结合后的实施例依然在本发明的保护范围内。Thus, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but is merely representative of selected embodiments of the invention. It should be noted that, in the case of no conflict, various features in the embodiments of the present invention may be combined with each other, and the combined embodiments still fall within the protection scope of the present invention.
应注意到:相似的标号和字母在下面的附图中表示类似项,因此,一旦某一项在一个附图中被定义,则在随后的附图中不需要对其进行进一步定义和解释。It should be noted that like numerals and letters refer to like items in the following figures, so once an item is defined in one figure, it does not require further definition and explanation in subsequent figures.
在本发明的描述中,需要说明的是,术语“中心”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,或者是该发明产品使用时惯常摆放的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。此外,术语“第一”、“第二”、“第三”等仅用于区分描述,而不能理解为指示或暗示相对重要性。In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the product of the invention is usually placed in use, only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying The device or element referred to must have a particular orientation, be constructed and operate in a particular orientation, and therefore should not be construed as limiting the invention. Furthermore, the terms "first", "second", "third", etc. are only used to differentiate the description and should not be construed as indicating or implying relative importance.
此外,术语“水平”、“竖直”等术语并不表示要求部件绝对水平或悬垂,而是可以稍微倾斜。如“水平”仅仅是指其方向相对“竖直”而言更加水平,并不是表示该结构一定要完全水平,而是可以稍微倾斜。Furthermore, the terms "horizontal", "vertical" and the like do not imply that a component is required to be absolutely horizontal or overhang, but rather may be slightly inclined. For example, "horizontal" only means that its direction is more horizontal than "vertical", it does not mean that the structure must be completely horizontal, but can be slightly inclined.
在本发明的描述中,还需要说明的是,除非另有明确的规定和限定,术语“设置”、“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本发明中的具体含义。In the description of the present invention, it should also be noted that, unless otherwise expressly specified and limited, the terms "arranged", "installed", "connected" and "connected" should be understood in a broad sense, for example, it may be a fixed connection, It can also be a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or the internal communication between the two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.
随着经济的快速发展,生活节奏的加快,人们往往通过自动化的手段来提高生活效率。而现有实现自动化的方式主要以电路板作为载体在其上布设电子元器件,从而通过软硬件的结合实现自动化控制。为了提高电子元器件的使用范围,需要将元器件、电路板和电子产品进行固定,从而来使得电子元器件能够具有一定程度的防震抗摔的性能。行业内传统的做法是,先将元器件焊接在电路板上,然后再将电路板安装在电子产品的封装上,该种作业工艺虽然简单,但在对于一些较为大型的器件,将较大的电路板安装在电子产品的封装上时,电路板将承受较大的变形应力,进而导致已经焊接完毕的元器件易受到损坏。为了避免该种情况,现行行业内的做法通常是,先将电子元器件、电路板和电子产品封装进行锁定后,再进行焊接的工艺。但是在该种工艺过程中,需要使得电子元器件的引脚能够准确伸入到电路板上的焊接孔内,由于实际作业安装时,不可避免会产生一定的公差,为了吸收公差往往是将电路板上的焊接孔增大,从而提高装配的成功率。但在实际生产中,由于增大了焊接孔直径,故,在焊接时,容易发生焊接不良、溢锡等现象,导致最终产品的良率较低。本申请基于上述问题,提供一种电路板焊接工装,利用其来吸收装配产生的公差进而在改善装配的成功率的基础上,提高产品的良率。With the rapid development of the economy and the acceleration of the pace of life, people often improve the efficiency of life by means of automation. However, the existing automation method mainly uses the circuit board as a carrier to arrange electronic components on it, so as to realize automatic control through the combination of software and hardware. In order to improve the use range of electronic components, components, circuit boards and electronic products need to be fixed, so that electronic components can have a certain degree of anti-shock and anti-drop performance. The traditional practice in the industry is to solder the components on the circuit board first, and then install the circuit board on the package of the electronic product. When the circuit board is installed on the package of an electronic product, the circuit board will be subjected to a large deformation stress, which will lead to the vulnerable components that have been soldered. In order to avoid this situation, the current practice in the industry is usually to lock the electronic components, circuit boards and electronic product packages first, and then perform the soldering process. However, in this kind of process, it is necessary to make the pins of electronic components can accurately extend into the welding holes on the circuit board. Due to the actual operation and installation, certain tolerances will inevitably occur. In order to absorb the tolerances, the circuit is often used. The welding holes on the board are enlarged, thereby improving the success rate of assembly. However, in actual production, due to the increased diameter of the welding hole, poor welding and tin overflow are likely to occur during welding, resulting in a low yield of the final product. Based on the above problems, the present application provides a circuit board soldering tool, which is used to absorb the tolerance generated by the assembly and improve the yield of the product on the basis of improving the success rate of the assembly.
本发明实施例的一方面,参照图1,提供一种电路板焊接工装1,用于辅助电路板3上待焊接元器件4的焊接,包括:基座和设置在基座上的锁定部13;基座用于通过锁定部13与电路板3锁定;在基座上还设置有与电路板3上的焊接孔对应的引导通孔12,用于引导待焊接元器件4的引脚41经引导通孔12插入电路板3上的焊接孔。In one aspect of the embodiment of the present invention, referring to FIG. 1 , a circuit
示例的,如图1所示,该工装包括基座、锁定部13以及引导通孔12。其中,引导通孔12位于基座上,锁定部13则位于基座的一侧,其负责与电路板3上的对应部位进行锁定,以便于使得基座能够和电路板3固定在一起,同时,在基座和电路板3固定后,位于基座上的引导通孔12能够和电路板3上的焊接孔进行对应,需要说明的是,该种对应关系为引导通孔12靠近电路板3一侧的开孔与电路板3上焊接孔靠近基座一侧的开孔位置相对应,如图4所示。待焊接元器件4上的引脚41在插入电路板3上的焊接孔前,需要先插入基座上的引导通孔12内,通过引导通孔12来吸收装配时产生的公差,同时,利用引导通孔12还可以引导待焊接元器件4的引脚41能够准确的插入电路板3上的焊接孔内,从而完成对待焊接元器件4和电路板3的装配。通过将装配有待焊接元器件4的电路板3与电子产品进行安装固定后,方便后续工艺将待焊接元器件4的引脚41焊接至电路板3上,不仅避免了因先焊接,后安装电路板3时产生装配应力造成待焊接元器件4的损坏。同时,也避免了现有焊接时,采用过量扩大电路板3焊孔的方式来吸收引脚41与焊孔的装配误差导致的焊接不良。有利于提高焊接的良率,减少焊接过程中溢锡、焊接不良等现象,改善了电路板3与待焊接元器件4的装配效率及成品率。Illustratively, as shown in FIG. 1 , the tool includes a base, a locking
同时,通过采用本申请中的工装,不仅可以保证待焊接元器件4引脚41准确插入电路板3上焊接孔内,同时还可以利用先装配后焊接的工艺,在将待焊接元器件4焊接前,先将对于有散热需求的待焊接元器件4贴合在散热器6件上,而后在焊接,有效的避免了现有对于一些需要贴紧散热器6的元器件采用先焊接后固定的工艺,造成一些元器件由于制造或装配误差带来的贴不紧或者存在较大应力的风险。进一步的改善了最终产品的性能。At the same time, by using the tooling in the present application, not only can the
对于基座和电路板3的固定方式,取决于锁定部13的具体设置形式,以下示意性的给出三种固定的方式:For the fixing method of the base and the
其中的一种:one of a kind:
可选的,锁定部13包括相对配合设置在基座上的第一弹性件131和第二弹性件132;在第一弹性件131和第二弹性件132的另一端分别设置有延伸部133,延伸部133的延伸方向与弹性件的轴向相交;第一弹性件131和第二弹性件132沿其轴向插接于电路板3的锁孔,且和锁孔内壁张紧后,通过延伸部133与电路板3抵接以使基座与电路板3卡接。Optionally, the locking
示例的,锁定部13可以是通过卡扣的形式与电路板3进行连接,具体的,可以是由第一弹性件131、第二弹性件132以及设置在它两端部的延伸部133组成一个弹性卡扣的结构。如图6所示,第一弹性件131和第二弹性件132相对设置在基座的同一侧,且第一弹性件131和第二弹性件132之间形成有间隙,即第一弹性件131和第二弹性件132配合基座能够形成通槽。同时,在第一弹性件131和第二弹性件132靠近电路板3的端部设置有延伸部133,其中,延伸部133的延伸方向与第一弹性件131和第二弹性件132的轴线方向相交,即在第一弹性件131和第二弹性件132的侧壁上向外凸出,且第一弹性件131上的延伸部133与第二弹性件132上的延伸部133的延伸方向相反。该通槽用于在第一弹性件131和第二弹性件132设置有延伸部133的一端伸入电路板3上的锁孔内时,容纳第一弹性件131和第二弹性件132相向弯折变形时产生的沿锁孔径向的弯折长度。因此,第一弹性件131和第二弹性件132之间的间隙的宽度必须大于或等于上述第一弹性件131和第二弹性件132沿锁孔径向产生的弯折长度之和。在第一弹性件131和第二弹性件132由于锁孔内壁限位相互弯折后,持续将基座箱靠近电路板3的方向推进,直至设置在第一弹性件131和第二弹性件132端部的延伸部133完全穿过锁孔,此时,第一弹性件131和第二弹性件132会产生恢复形变前的回弹力,促使两延伸部133远离。如图6所示,两延伸部133最远点之间的距离大于电路板3上的锁孔的孔径,此时,两延伸部133会与电路板3远离基座的一侧进行抵接,从而完成基座和电路板3的锁定,同时,也使得基座上的引导通孔12与电路板3上的焊接孔的孔位对应。如图6所示,第一弹性件131和第二弹性件132与锁孔内壁配合部分的最远点之间的距离应小于锁孔内壁的直径。Exemplarily, the locking
在另一种实施例中,第一弹性件131和第二弹性件132还可以是分开设置,其位于基座的两端,同样在两者的端部还可以设置有延伸部133,两延伸部133的延伸方向可以相向,也可以是相反。通过在将两者相对应设置在电路板3上的锁孔内进行压入时,同样第一弹性件131和第二弹性件132会产生弯折,在延伸部133穿过锁孔后,两者产生回弹力,使得延伸部133能够与电路板3抵接完成对基座和电路板3的锁定。In another embodiment, the first
弹性卡扣的结构设置,不仅可以使得基座和电路板3形成可拆卸的连接关系,同时,还可以利用柔性卡接的方式减少对电路板3的应力冲击,减少因装配导致的不必要的损坏。The structural arrangement of the elastic buckle can not only form a detachable connection between the base and the
需要说明的是,第一弹性件131和第二弹性件132指其本身具有可变形性,且在其变形后具有恢复变形前的回弹力。第一弹性件131和第二弹性件132的设置高度,即两者的轴线方向的长度,应以两者端部设置的延伸部133能够通过焊接孔且能够与电路板3抵接为宜。在实际设置时,可以在延伸部133和电路板3之间形成有一定的微小间隙。第一弹性件131和第二弹性件132可以是如图2所示的弹性柱,也可以是弹性片等等。It should be noted that, the first
可选的,在延伸部133上还形成有导向面,用于引导第一弹性件131和第二弹性件132插入电路板3的锁孔内。Optionally, a guide surface is also formed on the
示例的,如图5所示,为了能够便于将第一弹性件131和第二弹性件132插入电路板3上的锁孔内,还可以在延伸部133上设置有导向面,通过导向斜面的引导作用,引导第一弹性件131和第二弹性件132能够快速的插入电路板3的锁孔内。可以有效的利用引导斜面吸收装配公差,同时,还可以提高整个产品的装配效率。需要说明的是,导向面可以是斜面,也可以是弧面,本申请对其不做限定。For example, as shown in FIG. 5 , in order to facilitate the insertion of the first
另一种锁定形式:Another form of locking:
可选的,锁定部13包括设置在基座上的锁定柱以及设置在锁定柱外周的外螺纹,锁定柱通过外螺纹与电路板3的锁孔螺纹连接。Optionally, the locking
示例的,在电路板3上的锁孔内设置有螺纹,同时,在基座上的同一侧设置有锁定柱,在锁定柱的外周面设置有外螺纹,通过将锁定柱和电路板3的锁孔内壁螺纹连接,从而将两者形成固定关系。螺纹连接的形式,制造工艺更加成熟,制造成本更低。Illustratively, a thread is provided in the locking hole on the
再一种锁定形式:Another form of locking:
基座通过胶液粘结的方式与电路板3进行固定,从而便于引导通孔12便捷的将待焊接元器件4的引脚41引入电路板3上的焊接孔内。粘结的方式装配成本较低,不需设置额外的硬件,可以有效的降低制造成本。The base is fixed with the
可选的,引导通孔12靠近电路板3一侧的孔径小于远离电路板3一侧的孔径。Optionally, the diameter of the guide through
示例的,为了便于将待焊接元器件4快速准确的引入电路板3上的焊接孔内,还可以将引导通孔12靠近电路板3一侧的孔径设置的小于其远离电路板3一侧的孔径。即如图4所示,形成类似于喇叭形状的通孔,为便于描述本申请中将引导通孔12靠近电路板3一侧的孔径称为内孔径,将其远离电路板3一侧的孔径称为外孔径。在待焊接元器件4引脚41的端部因公差偏离焊接孔一定的距离(该距离应小于外孔径)后,由于待焊接元器件4的引脚41为柔性材质,故其会首先经外孔径的一端伸入引导通孔12,并与引导通孔12的内壁进行抵接,由于喇叭形通孔的设置,引脚41会发生变形从而在引导通孔12的内壁的引导下伸出内孔径的一侧,最终进入与内孔径侧开口对应的焊接孔内。需要说明的是,如图4所示,焊接孔靠近引导通孔12一侧的孔径大小因大于或等于引导通孔12内孔径侧的开孔直径,从而便于引脚41顺利伸入焊接孔内。引导通孔12内孔径的大小应大于待焊接元器件4的引脚41直径。For example, in order to quickly and accurately introduce the
可选的,引导通孔12为锥形孔。Optionally, the guide through
示例的,如图2所示,引导通孔12为锥形孔,即引导通孔12的内壁为锥面,在引脚41的端部与引导通孔12的锥形内壁抵接时,可以有效的降低两者的接触应力,相比弧形的内壁,对引脚41产生的冲击更小,在引导引脚41吸收装配公差时,能够更加顺畅。For example, as shown in FIG. 2 , the guide through
此外,如图2所示,还可以在锥形孔的小孔径端设置有一小段柱形孔,便于提高引导通孔12在此处的强度,提高本申请中工装的使用寿命。In addition, as shown in FIG. 2 , a small section of cylindrical hole can also be provided at the small diameter end of the tapered hole, which is convenient to improve the strength of the guide through
可选的,基座包括基座本体11以及设置在基座本体11上的隔离凸台14;隔离凸台14与锁定部13同侧设置,且隔离凸台14用于在锁定部13与电路板3锁定后与电路板3抵接。Optionally, the base includes a
示例的,为了避免基座对电路板3产生过多的干涉,还可以在基座本体11和电路板3之间,即在基座本体11与锁定部13的同侧设置有隔离凸台14,在基座本体11通过锁定部13和电路板3锁定后,两者之间可以通过隔离凸台14进行隔离,避免由于基座本体11大面积贴合电路板3对电路板3上的结构产生不必要的损坏。隔离凸台14的设置可以是多个,其可以是均布设置在基座本体11上,也可以是随机设置在基座本体11上,其高度(从基座至电路板3的方向)可以是一致的,也可以不一致,具体设置可以根据实际需求进行合理选择。For example, in order to avoid excessive interference of the base with the
可选的,隔离凸台14位于基座本体11和锁定部13之间。Optionally, the
示例的,如图6所示,隔离凸台14还可以直接设置在基座本体11和锁定部13之间,即在基座上依次设置隔离凸台14,在隔离凸台14上在设置锁定部13。在锁定后,隔离凸台14刚好位于电路板3和基座本体11之间,需要说明的是,如图6所示,隔离凸台14的直径因大于锁孔的直径。For example, as shown in FIG. 6 , the
可选的,基座为绝缘材料。Optionally, the base is made of insulating material.
示例的,为了避免对电路板3和元器件等产生干扰,可以将基座设置为绝缘材料,从而对电路板3等形成绝缘保护,避免因基座为导电材料致使电路板3发生漏电、短路现象。可以是塑料,例如聚氯乙烯、聚丙烯等等。还可以是橡胶等等。For example, in order to avoid interference with the
可选的,锁定部13包括多个,多个锁定部13间隔设置在基座的同侧;引导通孔12包括多个,多个引导通孔12与电路板3上的多个焊接孔一一对应。Optionally, the locking
示例的,如图2所示,锁定部13可以是多个,例如、两个、三个、四个等等,其设置时,可以是间隔一定的间距(不同锁定部13之间的间距可以不同,具体可以根据实际生产需求进行合理设置)进行设置。为了形成较为稳定的锁定,还可以将多个锁定部13设置在基座的同一侧。同理,引导通孔12也可以是多个,其在设置时,应在基座和电路板3锁定时,与电路板3上的多个焊接孔一一对应,从而便于后续待焊接元器件4的引脚41能够顺利插入焊接孔。Exemplarily, as shown in FIG. 2 , the locking
如图3所示,在对本申请中的工装进行使用时,可以先在多个引导通孔12及多个锁定部13对应的电路板3的位置上开适当大小的锁孔。然后将锁定部13插入到电路板3对应的锁孔内进行锁定。如果待焊接元器件4有散热需求,将待焊接元器件4固定在散热器6合适的位置上,将装在电路板3上的工装朝向待焊接元器件4,电路板3在其他辅助导向的作用下,固定在散热器6对应的位置上,过程中,待焊接元器件4的引脚41会自动沿着引导通孔12滑入电路板3对应的焊接孔内,锁紧电路板3后即完成装配,可以开始后续焊接。As shown in FIG. 3 , when using the tooling in the present application, lock holes of appropriate size may be opened at the positions of the
以上所述仅为本发明的优选实施例而已,并不用于限制本发明,对于本领域的技术人员来说,本发明可以有各种更改和变化。凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113628929A (en) * | 2021-08-10 | 2021-11-09 | 珠海格力电器股份有限公司 | Liquid level switch installation structure, liquid level switch and electrical equipment |
| CN113628929B (en) * | 2021-08-10 | 2025-10-31 | 珠海格力电器股份有限公司 | Liquid level switch mounting structure, liquid level switch and electrical equipment |
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| CN111604566B (en) | 2025-03-25 |
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Country or region after: China Address after: 313300 No. 505, Wenchang Road, Dipu street, Anji County, Huzhou City, Zhejiang Province Applicant after: Zhejiang Fute Technology Co.,Ltd. Address before: 310000 floor 1-5, building 7, No.6 xiyuanjiu Road, Xihu District, Hangzhou City, Zhejiang Province Applicant before: HANGZHOU EV-TECH CO.,LTD. Country or region before: China |
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Application publication date: 20200901 Assignee: Foote Intelligent (Hangzhou) Information Technology Co.,Ltd. Assignor: Zhejiang Fute Technology Co.,Ltd. Contract record no.: X2025980024971 Denomination of invention: A circuit board welding fixture Granted publication date: 20250325 License type: Common License Record date: 20250925 |