CN111565906A - Resin molded body and method for producing same, physical quantity sensor and method for producing same, insert member and method for producing same, system for producing resin molded body, and method for producing resin molded body using same - Google Patents

Abstract

In a resin molded body in which a metal member (50) is covered with a resin member (40) made of a resin material in a state in which a part of the metal member (50) is exposed, a joint section (53) made of irregularities having a 1 st irregularity (71) and a 2 nd irregularity (72) formed at a position including the 1 st irregularity (71) and having a difference in level smaller than that of the 1 st irregularity (71) is formed at a portion of the metal member (50) covered with the resin member (40). Then, the resin material is caused to enter the irregularities to join the resin member (40) to the joint portion (53).

Description

Resin molded body and its manufacturing method, physical quantity sensor and its manufacturing method, insert member and its manufacturing method, manufacturing system of resin molded body, and manufacturing method of resin molded body using the same

Cross-referencing of related applications

This application is based on Japanese Patent Application No. 2017-254374, Japanese Patent Application No. 2017-254375, Japanese Patent Application No. 2017-254376, and Japanese Patent Application No. 2017-254377 for which it applied on December 28, 2017, which is hereby incorporated by reference. It is cited in its entirety by reference.

technical field

The present disclosure relates to a resin molded body and its manufacturing method, a physical quantity sensor and its manufacturing method, an insert member and its manufacturing method, a resin molded body manufacturing system, and a resin molded body manufacturing method using the same.

Background technique

Conventionally, a resin molded body in which a sensor chip and a metal terminal are covered with a case made of a thermoplastic resin has been proposed (for example, see Patent Document 1). Specifically, in this resin molded body, the sensor chip and the metal terminal are electrically connected via bonding wires, and the side of the metal terminal opposite to the side to which the sensor chip is connected is exposed from the housing. In addition, such a resin molded body is used by electrically connecting the metal terminal exposed from the housing to the external connector.

The above-mentioned resin molded body is produced as follows. That is, first, the sensor chip and the metal terminal are connected to form a structure. And this structure is arrange|positioned in a metal mold|die. Then, it is manufactured by pouring molten resin into a mold to form a case.

prior art literature

Patent Literature

Patent Document 1: Japanese Patent Laid-Open No. 2017-128902

SUMMARY OF THE INVENTION

However, in the above resin molded body, the metal terminal as the metal member and the case as the resin member are joined by different materials, and since the case is difficult to adhere to the metal terminal, the bondability between the metal terminal and the case decreases. Therefore, when the metal terminal exposed from the case is exposed to the external environment, there is a possibility that foreign matter such as water or oil may enter through the gap between the metal terminal and the case.

Therefore, it is conceivable to arrange another resin member around the metal terminal exposed from the case by freshly potting or the like so as to prevent foreign matter from entering through the gap between the metal terminal and the case. However, in this structure, it is necessary to arrange other resin parts, which increases the number of parts.

An object of the present disclosure is to provide a resin molded body, a method for producing the same, a physical quantity sensor and a method for producing the same, an insert member and a method for producing the same, and a resin molding capable of improving the bondability between a metal member and a resin member while suppressing an increase in the number of parts A system for producing a body and a method for producing a resin molded body using the same.

According to one aspect of the present disclosure, a resin molded body includes: a metal member; and a resin member covering the metal member in a state where a part of the metal member is exposed; and a portion of the metal member covered with the resin member is formed with a The junction of the first concavity and convexity and the second concavity and convexity, the second concavity and convexity is formed at the position of the surface including the first concavity and convexity, and the height difference is smaller than that of the first concavity and convexity; the resin member enters the concavity and convexity through the resin material so as to be engaged with the engaging portion.

Thereby, since the joining portion is formed in the metal member, and the joining portion is joined to the resin member, the bondability between the metal member and the resin member can be improved. In addition, since the resin member and the metal member are joined by forming the joint portion in the metal member, the number of parts is not increased.

Further, according to another aspect of the present disclosure, in the method of manufacturing a resin molded body, the steps of: preparing a metal member; and forming a resin member covering the metal member in a state where a part of the metal member is exposed; before forming the resin member, performing In the part of the metal member covered by the resin member, a junction portion is formed by concavities and convexities having first concavities and convexities and second concavities and convexities, the second concavities and convexities being formed at the positions of the surface including the first concavities and convexities, and being connected with the first concavities and convexities The height difference is smaller than that; in forming the resin member, the joint portion is joined to the resin member.

Thereby, since the joining portion is formed in the metal member and the joining portion is joined to the resin member, it is possible to manufacture a resin molded body in which the bondability between the metal member and the resin member is improved. In addition, since the resin member and the metal member are joined by forming the joint portion in the metal member, the number of parts does not increase.

In addition, according to another technical solution of the present disclosure, the physical quantity sensor includes: a sensor unit that outputs a sensor signal; a metal terminal that is electrically connected to the sensor unit and has a portion extending in one direction; and a housing, at least one of the metal terminals Cover the metal terminal with one end on the opposite side of the end connected to the sensor unit exposed; cover the part of the metal terminal covered by the housing and between the end and one end on the side connected to the sensor unit. Between them, a joint part is formed, the joint part is composed of unevenness, and the surface of the metal terminal is wound around the axial direction with the extending direction of the metal terminal as the axial direction (one circle); The material enters the unevenness and joins with the joint portion.

Thereby, since the junction part is formed in the metal terminal, and the junction part is joined to the case, the bondability between the metal terminal and the case can be improved. In addition, since the case and the metal terminal are joined by forming the joint portion in the metal terminal, the number of parts is not increased.

Further, according to another aspect of the present disclosure, in a method of manufacturing a physical quantity sensor, the following steps are performed: preparing a sensor unit; preparing a metal terminal having a portion extended in one direction; and electrically connecting the sensor unit and the metal terminal to form a structure prepare a cavity in which the structure is arranged, and a mold for allowing molten resin to flow into the cavity from the injection gate; arrange the structure into the cavity; and by making the molten resin flow into the cavity from the injection gate and solidify, In this way, at least one end of the metal terminal opposite to the end on the side connected to the sensor unit is exposed, and a case is formed that covers the metal terminal. Furthermore, in the method of manufacturing the physical quantity sensor, before forming the case, the metal terminal is formed with concavities and convexities, and the surface of the metal terminal is wound around the axial direction with the extending direction of the metal terminal as the axial direction. ; In forming the casing, the engaging portion is engaged with the casing.

Thereby, since the junction part is formed in the metal terminal, and the junction part is joined to the case, it is possible to manufacture a physical quantity sensor in which the bondability between the metal terminal and the case is improved. In addition, since the case and the metal terminal are joined by forming the joint portion in the metal terminal, the number of parts is not increased.

Further, according to another aspect of the present disclosure, the insert member includes a metal member; the metal member includes a base body made of a metal material and a metal thin film formed on the surface of the base body; and a portion of the metal thin film covered by the resin member is formed with a A joint portion made of concavities and convexities to which resin parts are joined.

As a result, the metal thin film constituting the metal member is formed with a joint portion made of irregularities at the portion covered with the resin member. Therefore, the bondability between the metal member and the resin member can be improved. In addition, since the bonding portion is formed in the metal thin film to improve the bondability between the metal member and the resin member, the number of parts does not increase.

Further, according to another aspect of the present disclosure, in a method of manufacturing an insert member, the steps of: preparing a metal plate; forming a base from the metal plate; forming a metal thin film on the surface of the base to form a metal member; after forming the metal member, The portion of the metal thin film covered with the resin member is irradiated with a laser beam to form a joint portion composed of irregularities.

As a result, the metal thin film is formed with a junction portion composed of irregularities. Therefore, when the metal member is covered with the resin member, the bondability between the metal member and the resin member can be improved. In addition, since the joining portion is formed in the metal thin film, there is no need to provide other components, and the number of components does not increase.

Further, according to another aspect of the present disclosure, a manufacturing system for a resin molded body includes: a metal member forming apparatus for forming a metal member; a joint portion forming apparatus for forming a joint portion made of irregularities on the metal member; and a resin member forming apparatus, A resin member is formed that exposes a part of the metal member and covers the part of the metal member including the junction; the junction is formed by the junction forming device before the resin member is formed by the resin member forming device.

As a result, a joint portion is formed in the metal member. Therefore, when the resin member is formed by the resin member molding apparatus, the joint portion of the metal member can be joined to the resin member. Therefore, it is possible to manufacture a resin molded body with improved bondability between the metal member and the resin member. In addition, since the resin member and the metal member are joined by forming the joint portion in the metal member, the number of parts is not increased.

Further, according to another aspect of the present disclosure, in a method of manufacturing a resin molded body, the steps of: preparing a metal member; and forming a resin member covering the metal member in a state where a part of the metal member is exposed; before forming the resin member, are A joint portion made of unevenness is formed at a portion of the metal member covered with the resin member.

Thereby, the joint portion is formed on the metal member before the resin member is formed. Therefore, when the resin member is formed, the joint portion of the metal member can be joined to the resin member. Therefore, it is possible to manufacture a resin molded body with improved bondability between the metal member and the resin member. In addition, since the resin member and the metal member are joined by forming the joint portion in the metal member, the number of parts is not increased.

In addition, the code|symbol in parenthesis in the above-mentioned and a claim shows the correspondence relationship between the term described in a claim, and the concrete thing etc. which exemplifies the term described in the embodiment described later.

Description of drawings

FIG. 1 is a cross-sectional view showing a configuration of a rotation angle sensor according to the first embodiment.

FIG. 2 is a cross-sectional view different from FIG. 1 , and is a partial cross-sectional view showing a connector housing and the like in cross-section.

FIG. 3 is a perspective view of a portion of the rotation angle sensor shown in FIG. 1 from which a connector housing is removed.

FIG. 4A is an enlarged view of a junction formed in the terminal.

FIG. 4B is a schematic diagram showing the actual state of the second unevenness in the region IVB surrounded by the two-dot chain line in FIG. 4A .

FIG. 5 is a schematic diagram showing the configuration of a manufacturing system.

FIG. 6 is a perspective view showing a metal plate that constitutes a base by being cut.

FIG. 7 is a schematic diagram showing the configuration of a laser irradiation apparatus.

FIG. 8 is a schematic diagram showing the interval between the irradiation spot system of the laser beam and the irradiation spot.

9A is a cross-sectional view showing a step of forming a joint portion.

FIG. 9B is a cross-sectional view showing a step of forming a junction.

FIG. 10A is a partial cross-sectional view of the second structure disposed on the mold.

FIG. 10B is a cross-sectional view of the second structure disposed on the mold.

11 is a partial cross-sectional view showing a configuration of a rotation angle sensor according to a second embodiment.

FIG. 12 is a partial cross-sectional view of the second structure disposed on the mold.

13A is a schematic cross-sectional view showing a state in which molten resin has flowed between a joint portion formed in the insert and the mold.

13B is a schematic cross-sectional view showing a state in which a hardened portion is formed between the joint portion formed in the insert and the mold.

13C is a schematic cross-sectional view showing a state in which a vacuum void is generated between a joint formed in the insert and the mold.

14 is a schematic cross-sectional view showing a state in which a vacuum void is generated between a portion of the insert where the joint portion is not formed and the mold.

FIG. 15 is a view showing a state when the insert is joined to the resin member.

16 is a cross-sectional view of a rotation angle sensor according to a third embodiment.

17A is a cross-sectional view of a rotation angle sensor according to a fourth embodiment.

17B is a cross-sectional view of a rotation angle sensor according to a modification of the fourth embodiment.

FIG. 18 is a partial cross-sectional view of the second structure disposed in the mold.

FIG. 19 is a graph showing the relationship between filling time, flow cross-sectional area, and pressure.

20 is a cross-sectional view of a rotation angle sensor according to a fifth embodiment.

FIG. 21 is a perspective view showing the vicinity of a joint portion of the terminal shown in FIG. 20 .

FIG. 22 is a perspective view showing a metal plate which is cut to form a base body.

FIG. 23 is a partial cross-sectional view of the second structure disposed in the mold.

24 is a cross-sectional view of a rotation angle sensor according to a sixth embodiment.

FIG. 25 is a partial cross-sectional view of the second structure disposed in the mold.

26 is a cross-sectional view of a rotation angle sensor according to a seventh embodiment.

FIG. 27 is a perspective view showing the vicinity of a joint portion of the terminal shown in FIG. 26 .

28A is a perspective view showing the vicinity of a joint portion of a terminal according to a modification of the seventh embodiment.

28B is a perspective view showing the vicinity of a joint portion of a terminal according to a modification of the seventh embodiment.

28C is a perspective view showing the vicinity of a joint portion of a terminal of a modification of the seventh embodiment.

FIG. 29 is a perspective view showing the vicinity of a joint portion of a terminal according to a modification of the seventh embodiment.

30A is a perspective view showing a flow direction of molten resin with respect to the terminal shown in FIG. 29 .

FIG. 30B is a schematic view showing a state in which air bubbles are formed when the terminal shown in FIG. 29 is viewed from the other surface side.

31 is a cross-sectional view of a terminal of the eighth embodiment.

FIG. 32 is a perspective view showing the vicinity of a joint portion of a terminal according to a ninth embodiment.

FIG. 33 is a schematic view showing a metal plate constituting the terminal.

34 is a cross-sectional view in a case where the terminal is arranged on the mounting surface of the housing member.

35 is a perspective view showing the vicinity of a junction portion of a terminal according to a modification of the ninth embodiment.

FIG. 36 is a perspective view showing the vicinity of a joint portion of a terminal according to a tenth embodiment.

FIG. 37 is a side view of the terminal shown in FIG. 36 .

38 is a perspective view showing the vicinity of a junction portion of a terminal according to a modification of the tenth embodiment.

FIG. 39 is a side view of the terminal shown in FIG. 38 .

40 is a perspective view showing the vicinity of a junction portion of a terminal according to a modification of the tenth embodiment.

41 is a perspective view showing the vicinity of a junction portion of a terminal according to a modification of the tenth embodiment.

42A is a perspective view showing a processed surface when a base body is formed from a metal plate according to the eleventh embodiment.

Fig. 42B is a cross-sectional view along XLIIB-XLIIB in Fig. 42A.

43A is a perspective view showing a processed surface when a base body is formed from a metal plate according to the eleventh embodiment and then trimming is performed.

FIG. 43B is a cross-sectional view taken along line XLIIIB-XLIIIB in FIG. 43A.

FIG. 44 is a perspective view showing the vicinity of a joint portion of each terminal according to the twelfth embodiment.

45A is a schematic diagram when a laser beam is irradiated from one surface side of each terminal.

FIG. 45B is a schematic diagram when a laser beam is irradiated from the side surface side of each terminal.

FIG. 45C is a schematic diagram when a laser beam is irradiated from the other surface side of each terminal.

FIG. 45D is a schematic diagram showing a case where the side surface side of each terminal is irradiated with a laser beam.

FIG. 46 is a schematic cross-sectional view showing a step of forming a junction in the thirteenth embodiment.

47 is a cross-sectional view of a rotation angle sensor according to a fourteenth embodiment.

FIG. 48 is a perspective view showing the vicinity of a joint portion of the terminal shown in FIG. 47 .

FIG. 49 is a schematic diagram showing a manufacturing system according to the fourteenth embodiment.

50A is a cross-sectional view showing a terminal bending process.

FIG. 50B is a cross-sectional view showing a terminal bending step subsequent to FIG. 50A .

51 is a side view showing a terminal bending step and a junction portion forming step in the fifteenth embodiment.

52 is a perspective view showing a housing member according to a sixteenth embodiment.

Fig. 53 is a perspective view when the first structure is placed on the housing member shown in Fig. 52 .

FIG. 54 is a schematic diagram showing a manufacturing system according to a seventeenth embodiment.

Fig. 55 is a schematic plan view showing the holding jig.

56 is a schematic plan view showing a holding jig according to a modification of the seventeenth embodiment.

57 is a cross-sectional view for explaining a problem of the resin-made housing member according to the eighteenth embodiment.

Fig. 58 is a cross-sectional view of the housing member according to the eighteenth embodiment.

59 is a cross-sectional view for explaining a problem of a paper-made storage member according to a modification of the eighteenth embodiment.

60 is a cross-sectional view of a storage member according to a modification of the eighteenth embodiment.

FIG. 61 is a side view of a storage member according to a modification of the eighteenth embodiment.

Fig. 62 is a cross-sectional view showing a connection step of the nineteenth embodiment.

FIG. 63 is a cross-sectional view showing a connection step of a modification of the nineteenth embodiment.

64A is a cross-sectional view showing a terminal bending step of the twentieth embodiment.

FIG. 64B is a cross-sectional view showing a terminal bending step subsequent to FIG. 64A .

65 is a cross-sectional view showing a step of forming a junction portion according to the twentieth embodiment.

66A is a cross-sectional view of a physical quantity sensor according to another embodiment.

66B is a cross-sectional view of a physical quantity sensor according to another embodiment.

66C is a cross-sectional view of a physical quantity sensor according to another embodiment.

Detailed ways

Hereinafter, embodiments of the present disclosure will be described based on the drawings. In addition, in each following embodiment, the same code|symbol is attached|subjected to the mutually same or equivalent part, and is demonstrated.

(first embodiment)

The first embodiment will be described with reference to the drawings. In this embodiment, an example in which a resin molded body is applied to a rotation angle sensor as a physical quantity sensor will be described. In addition, this rotation angle sensor is suitably mounted in a vehicle such as an automobile, for example, and is used for detecting the rotation speed of the wheel. First, the configuration of the rotation angle sensor will be described.

As shown in FIGS. 1 to 3 , the rotation angle sensor of the present embodiment has a structure including a mold IC 10 , a magnet 20 , a cap 30 , a connector housing 40 , a terminal 50 , and the like. In addition, in FIG. 2, the mold resin 14, the magnet 20, the cap 30, and the connector housing 40 which will be described later in the mold IC 10 are shown as cross sections. Moreover, the terminal part 11a and the terminal 50 mentioned later in the mold IC10 are shown as a plan view. In addition, in the following partial cross-sectional view similar to FIG. 2, the terminal part 11a and the terminal 50 are shown as a plan view, and other parts are shown as a cross-sectional view.

In the mold IC 10 , the sensor chip 12 and the circuit chip 13 are mounted on the lead frame 11 via bonding members (not shown), and these are integrally formed by the mold resin 14 . In addition, in the present embodiment, the mold IC 10 corresponds to the sensor unit.

In the present embodiment, the lead frame 11 is formed by, for example, press forming or etching a metal conductor plate such as copper alloy, and has three terminal portions 11 a. The sensor chip 12 is configured as a magnetoresistive element (ie, MRE), and outputs a sensor signal corresponding to the applied magnetism. The circuit chip 13 is formed with a signal processing circuit and the like, and performs predetermined processing and the like on the sensor signal.

In addition, the sensor chip 12 and the circuit chip 13 are electrically connected via bonding wires or the like not shown. Further, the circuit chip 13 is electrically connected to each terminal portion 11 a of the lead frame 11 .

The mold resin 14 is made of thermosetting resin or the like, and seals the lead frame 11 , the sensor chip 12 , and the circuit chip 13 so that the terminal portion 11 a of the lead frame 11 is exposed. In addition, in the sensor chip 12 and the circuit chip 13, the sensor chip 12 is arranged on the opposite side of the lead frame 11 from the terminal portion 11a side, and the circuit chip 13 is arranged between the sensor chip 12 and the terminal portion 11a.

The magnet 20 applies a bias magnetic field to the magnetoresistive element of the sensor chip 12 . In the present embodiment, the magnet 20 has a cylindrical shape having a hollow portion, and the inner wall surface forming the hollow portion is formed into a shape corresponding to the outer shape of the mold IC 10 . In addition, the mold IC 10 is arranged in the magnet 20 such that the terminal portion 11 a protrudes from the hollow portion of the magnet 20 . In addition, the magnet 20 has a recessed portion 21 formed on the inner wall surface at the end side of the side where the terminal portion 11 a is located, so that a part of the connector housing 40 is inserted between the mold IC 10 and the magnet 20 .

The cap 30 is made of thermoplastic resin or the like, and has a bottomed cylindrical shape having a hollow portion. In addition, in the cap 30, the magnet 20 in which the mold IC 10 is arranged is arranged so that the terminal portion 11a protrudes from the cap 30. In addition, the portion of the outer wall surface of the cap 30 which is covered by the connector housing 40 is formed with a convex portion 31 that makes one turn (one turn) of the outer wall surface in the circumferential direction. The convex portion 31 is a portion that functions as a welding portion to be welded with the connector housing 40 when the connector housing 40 is formed. 3 shows a state before the connector housing 40 is formed, and after the connector housing is formed, as shown in FIGS. 1 and 2 , the shape of the convex portion 31 changes.

The connector housing 40 is made of, for example, polyphenylene sulfide (ie, PPS), polybutylene terephthalate (ie, PBT), polyamide, liquid crystal polymer (ie, LCP), polyurethane, nylon, polycarbonate ( That is, thermoplastic resins such as PC) and silicone are molded and formed. In addition, the connector housing 40 may be formed by, for example, molding a thermosetting resin such as epoxy resin or phenolic resin. In addition, in this embodiment, the connector housing 40 corresponds to a resin member.

The connector housing 40 is formed into a substantially cylindrical shape, and one end side is a connector part connected to an external connector, and the other end side is a cover part covering the mold IC 10 , the cap 30 , and the like. The connector housing 40 has an opening 41 formed on one end side. In addition, the connector housing 40 is attached to the cap 30 so that the bottom of the cap 30 is exposed on the other end side. In addition, the connector housing 40 and the cap 30 are joined by welding.

As shown in FIG. 4A , the terminal 50 is formed by forming a metal thin film 62 on the surface of a base 61 made of a conductive metal material. In the present embodiment, the base body 61 is made of an alloy or pure metal containing at least one of copper (Cu), iron (Fe), and aluminum (Al) as a main component. The metal thin film 62 is composed of a plated film, and is composed of at least one of gold (Au), tin (Sn), nickel (Ni), palladium (Pd), silver (Ag), and copper (Cu) as a main component. In addition, in this embodiment, the terminal 50 corresponds to a metal terminal or a metal member.

In addition, as shown in FIG. 3, in this embodiment, the terminal 50 has one surface 50a, the other surface 50b opposite to the one surface 50a, and the side surfaces 50c and 50d connecting the one surface 50a and the other surface 50b. A rectangular column bar that extends in the direction. In addition, the side surfaces 50c and 50d here are side surfaces extending along the extending direction of the terminal 50 . In addition, in the present embodiment, when the length of each of the surfaces 50a to 50d in the direction intersecting the extending direction of the terminal 50 is defined as the width of the terminal 50, the width of the one surface 50a and the other surface 50b is higher than that of the side surface 50c, 50d wide cross-sectional rectangular shape.

In the present embodiment, three terminals 50 are provided, and the one surface 50a and the other surface 50b of each other are arranged on the same surface. In addition, the respective terminals 50 are arranged in the connector housing 40 , respectively. Specifically, each terminal 50 is arranged in the connector housing 40 in a state where one end side is exposed from the opening 41 and the other end side is connected to the terminal portion 11a.

In addition, the terminal 50 is formed with a through hole 51 on the other end side into which the terminal portion 11 a can be inserted. Then, after the terminal 50 is inserted into the lead frame 11 in the through hole 51, the other end is caulked to be electrically and mechanically connected to the terminal portion 11a.

In addition, the terminal 50 has a positioning hole 52 formed on the side to be joined to the terminal portion 11a. This positioning hole 52 is appropriately used when adjusting the position of the terminal 50 in each process described later.

Here, the terminal 50 of the present embodiment is formed with an engaging portion 53 to be engaged with the connector housing 40 at a portion covered by the connector housing 40 . In the present embodiment, the engaging portion 53 is formed at the portion on the one end side of the terminal 50 , and the extending direction of the terminal 50 is assumed to be the axial direction (hereinafter simply referred to as the axial direction), and the connecting portion 53 is formed along the direction intersecting the axial direction. The direction is formed in a way that circles the surface. In addition, although FIG. 3 is not a cross-sectional view, the junction part 53 is hatched for easy understanding. In addition, in the following description, for easy understanding, there may be a case where the hatching is used to describe the part where the joint portion 53 is formed, although it is not a cross-sectional view.

As shown in FIG. 4A , the joint portion 53 is configured by forming the second unevenness 72 on the surface and the periphery of the first unevenness 71 with a smaller height difference than the first unevenness 71 . Specifically, the joint portion 53 is configured by forming the second unevenness 72 of the order of nanometers on the surface and the periphery of the first unevenness of the order of micrometers 71 . In addition, the joint portion 53 is formed only on the metal thin film 62 and is not formed on the base body 61 . In addition, in FIG. 4A, the 2nd unevenness|corrugation 72 is simplified and shown for easy understanding, but as shown in FIG. 4B, the 2nd unevenness|corrugation 72 is formed in an irregular state actually.

The first concavities and convexities 71 are substantially circular in the shape of a crater, and have concavities and convexities having an outer diameter of about 5 to 300 μm. In the present embodiment, such first concavities and convexities 71 are formed by irradiating the terminal 50 with a pulsed laser beam, as will be described later. That is, the first concavities and convexities 71 in the present embodiment can also be said to be laser irradiation marks. In addition, one substantially circular shape constituting the first concavo-convex 71 is formed by irradiating a pulsed laser beam once.

Moreover, the convex part 71a in the 1st unevenness|corrugation 71 is comprised by the convex part (henceforth a 1st convex part 71a) in a crater-shaped unevenness|corrugation, and has a height of 0.5-50 micrometers. That is, the first concavities and convexities 71 are formed as concavities and convexities on the order of micrometers. In FIG. 4A, the height of the 1st convex part 71a is shown by arrow H1.

The second unevenness 72 is formed on the surface of the first unevenness 71 and its surroundings, and has a height of 0.5 to 500 nm and a width of 1 to 300 nm. In FIG. 4A, the height of the convex part (henceforth a 2nd convex part) 72a of the 2nd unevenness|corrugation 72 is shown by arrow H2.

In addition, in the present embodiment, the height of the first convex portion 71a is a direction orthogonal to the in-plane direction when the second convex portion 72a is smoothed to form a virtual cross-sectional curve L1 of the first concavo-convex 71 The upper part is the distance between the highest position and the lowest position of the first convex portion 71a. In addition, the height of the second convex portion 72a is the highest position and the lowest position of the second convex portion 72a in the direction orthogonal to the horizontal line L2 when the above-mentioned virtual cross-sectional curve of the first convex portion 71a is extended horizontally. the distance between. That is, in FIG. 4A , the distance between the highest position and the lowest position in the vertical direction on the paper surface is the height of each convex portion 71a, 72a. The width of the second convex portion 72a is the distance between two adjacent lowest positions of the second convex portion 72a in the direction orthogonal to the direction defining the height of the second convex portion 72a.

In the present embodiment, such a joint portion 53 is formed by irradiating a laser beam as described later. In addition, as long as such a joint part 53 is constituted, the joint part 53 may be formed by plasma irradiation, ultraviolet irradiation, sand blasting, chemical treatment, chemical coating, rough plating, or the like. However, the single first concavity and convexity 71 and the plurality of second concavities and convexities 72 constituting the joint portion 53 may be formed by irradiating the laser beam once without performing other preceding and subsequent steps as long as they are laser beams. Therefore, by forming the above-mentioned joining portion 53 with a laser beam, it can be suppressed that the process of forming the joining portion 53 becomes complicated.

In addition, the terminal 50 is engaged with the connector housing 40 at the engaging portion 53 . Specifically, the joint portion 53 is joined to the connector housing 40 by the thermoplastic resin constituting the connector housing 40 into the above-mentioned irregularities, and is joined to the connector housing 40 by an anchor effect.

According to the study of the present inventors, it was confirmed that the bonding between the connector housing 40 and the bonding portion 53 can be improved by forming the bonding portion 53 having the first unevenness 71 and the second unevenness 72 as described above.

The above is the configuration of the rotation angle sensor of the present embodiment.

Next, the manufacturing system for manufacturing the said rotation angle sensor is demonstrated. As shown in FIG. 5 , the manufacturing system of the present embodiment includes a mold IC manufacturing apparatus 100, a terminal forming apparatus 110, a connecting apparatus 120, a tie rod cutting apparatus 130, a junction forming apparatus 140, an inspection apparatus 150, an assembling apparatus 160, and a connector. Shell forming device 170 . In addition, the manufacturing system is further provided with each conveying apparatus 181-187 grade|etc., which conveys a to-be-processed object between each apparatus 100-170. In addition, each conveying apparatus 181-187 is comprised with a conveyor etc., for example.

The mold IC manufacturing apparatus 100 is an apparatus which manufactures mold IC10, and performs the process of manufacturing mold IC10. Specifically, the mold IC manufacturing apparatus 100 forms the lead frame 11 by press forming or the like from a metal plate, and mounts the sensor chip 12 and the circuit chip 13 on the lead frame 11 . Next, the mold IC manufacturing apparatus 100 electrically connects the sensor chip 12 and the circuit chip 13 via bonding wires, and electrically connects the circuit chip 13 and the lead frame 11 via bonding wires. Then, the mold IC manufacturing apparatus 100 integrates the sensor chip 12 , the circuit chip 13 , and the lead frame 11 with the mold resin 14 so that the terminal portions 11 a of the lead frame 11 are exposed, thereby manufacturing the mold IC 10 . Then, the mold IC manufacturing apparatus 100 sends the manufactured mold IC 10 to the conveying apparatus 181 .

The terminal forming apparatus 110 is an apparatus for forming the terminal 50 , and performs a process of forming the terminal 50 . Specifically, the terminal forming apparatus 110 forms the base body 61 constituting the terminal 50 by press forming or the like from a metal plate first. In the present embodiment, the three base bodies 61 are integrated by tie rods. Then, the terminal forming device 110 performs a plating process such as electroless plating to form the metal thin film 62 on the base body 61 to constitute the terminal 50 , and sends the terminal 50 to the conveying device 182 . Moreover, as a metal plate, the hoop-shaped structure as shown in FIG. 6 is used, for example. In addition, in this embodiment, the terminal forming apparatus 110 corresponds to a metal member forming apparatus.

The connection device 120 is a device that electrically and mechanically connects the mold IC 10 and the terminal 50 , and performs a process of electrically and mechanically connecting the mold IC 10 and the terminal 50 . Specifically, the connection device 120 connects the mold IC 10 and the terminal 50 to form the first structure 81 when the mold IC 10 is transported into the mold IC 10 by the transport device 181 and the terminal 50 is transported into the terminal 50 by the transport device 182 . In the present embodiment, the connection device 120 inserts the terminal portion 11 a of the mold IC 10 into the through hole 51 formed on the other end side of the terminal 50 , and caulks the other end of the terminal 50 to form the first structure. 81. Then, the connecting device 120 sends out the first structure 81 to the conveying device 183 .

The tie rod cutting device 130 is a device for cutting tie rods, and performs a tie rod cutting process. Specifically, since each terminal 50 of the first structure 81 is integrated by the tie rod, the tie rod cutting device cuts the tie rod and separates each terminal 50 . Then, the first structure 81 is sent out to the conveying device 184 .

The junction portion forming apparatus 140 is an apparatus for forming the junction portion 53 on the terminal 50 , and performs a step of forming the junction portion 53 on the terminal 50 . In the present embodiment, the bonding portion forming apparatus 140 includes a laser irradiation apparatus 200 as shown in FIG. 7 . Here, the structure of the laser irradiation apparatus 200 of this embodiment is demonstrated.

The laser irradiation device 200 includes a receiving jig 210 and a sending jig 220 that pick up and move the first structure 81 and release it, and a conveying device 230 provided with a tray 231 on which the first structure 81 is placed. Moreover, the laser irradiation apparatus 200 is provided with the laser beam irradiation part 250 which irradiates a laser beam to the terminal 50 in the divided room 240, and the dust collector 262 which collects the dust in the room 240 through the exhaust port 260 and the exhaust duct 261. Furthermore, the laser irradiation apparatus 200 is provided with the controller 270 which is connected to the conveyance apparatus 230, the laser beam irradiation part 250, etc., and controls these. In addition, although the laser irradiation apparatus 200 is not shown in particular, in the room 240, the position adjustment jig etc. which are not shown for adjusting the position, inclination, etc. of the 1st structure 81 are provided. In addition, in FIG. 7, the arrow extending from the laser beam irradiation part 250 shows a laser beam.

Further, the laser irradiation apparatus 200 is configured to be able to change the position of the terminal 50 to be irradiated with the laser beam when the terminal 50 is irradiated with the laser beam from the laser beam irradiation unit 250 . In the present embodiment, the laser beam irradiation unit 250 and the tray 231 are configured to be relatively movable. However, when the laser beam irradiating unit 250 uses a Galvano scanner capable of scanning a laser beam by rotating a mirror, it is not necessary to configure the laser beam irradiating unit 250 and the tray 231 to be relatively movable. .

In the present embodiment, the laser beam irradiation unit 250 uses, for example, Nd:YAG (neodymium-doped yttrium aluminum garnet) or the like as a laser light source. When Nd:YAG is used as the laser light source, the wavelength of the laser beam is 1064 nm which is the fundamental wavelength, or 533 nm or 355 nm which is the harmonic. In addition, when Nd:YAG is used as the laser light source, the irradiation spot diameter of the laser beam is 5 to 300 μm, the energy density is 5 to 100 J/cm ² , and the pulse width (that is, the irradiation time per spot) is 10 ~1000ns.

In addition, the laser irradiation device 200 irradiates the terminal 50 with a laser beam under the above-mentioned conditions, so that the metal thin film 62 is melted or vaporized, and the solidification and deposition of the metal accompanying it occurs. As a result, as shown in FIG. 4A , the joint portion 53 having the first unevenness 71 and the second unevenness 72 is formed. Specifically, the first concavities and convexities 71 are formed by irradiating a laser beam, and the second concavities and convexities 72 are formed by depositing a metal, an oxide of the metal, or the like by the irradiating a laser beam.

Here, it is preferable that the wavelength of the laser beam is selected to have a high absorption rate in the metal material to be processed. For example, for copper or gold, it is easier to form unevenness by irradiating a laser beam with a wavelength of 532 nm with a high absorption rate than by irradiating a laser beam with a wavelength of 1064 nm with a low absorption rate. In addition, even when the laser beam is continuous oscillation instead of pulse oscillation, and other conditions are the same as the above-mentioned conditions, unevenness is not formed.

In this regard, it is presumed that since the evaporation of the metal is less likely to occur, the amount of re-stacking of the evaporated particles forming the unevenness is reduced.

Therefore, in this embodiment, the wavelength of the laser beam is set to 0.2 to 11 μm, the energy density is set to 100 J/cm ² or less, and the pulse width is set to be 1 μs or less. In addition, in the present embodiment, the metal thin film 62 is constituted by at least one of gold, tin, nickel, palladium, and silver as the main component as described above. Therefore, as shown in FIG. 4A , the joint portion 53 having the first unevenness 71 and the second unevenness 72 is formed.

In addition, since the laser beam is pulsed, it is irradiated according to the irradiation spot. The inventors of the present invention have confirmed that when the interval between adjacent irradiation spots is too large, the amount of re-stacking of evaporated particles forming irregularities decreases, so that the second irregularities 72 are not sufficiently formed, and the junction 53 and the connector are not formed. There is a possibility that the joinability of the case 40 is lowered.

Therefore, in this embodiment, as shown in FIG. 8 , if the diameter of the irradiation spot S of the laser beam is x, and the intervals between the centers of the adjacent irradiation spots S are y1 and y2, y1 and y2≦20x The terminal 50 is irradiated with a laser beam in a manner. Thereby, as shown in FIG. 4A , the junction portion 53 having the first unevenness 71 and the second unevenness 72 is appropriately formed. In addition, as shown in FIG. 8 , if one direction is set as the first direction and the direction orthogonal to the first direction is set as the second direction, the laser beam is scanned in the first direction, shifted in the second direction, and then shifted again in the second direction. Scan along the 1st direction. Therefore, in the interval between the centers of the adjacent irradiation spots S, the interval y1 in the first direction and the interval y2 in the second direction may be set to different values.

In addition, in this embodiment, the laser irradiation apparatus 200 makes the terminal 50 in the state inclined with respect to the irradiation direction. When the laser irradiation device 200 scans the laser beam, one of the one surface 50a and the other surface 50b and one of the two side surfaces 50c and 50d are respectively irradiated to the junction formation region 53a. For example, the laser irradiation apparatus 200 is first shown in FIG. 9A so that the laser beam is irradiated to the one surface 50a and the side surface 50d when the laser beam is scanned. Then, as shown in FIG. 9B , the laser irradiation apparatus 200 remounts the first structure 81 on the tray 231 with an adjustment jig arranged in the room 240 so that the laser beam is directed toward the other surface 50b when the laser beam is scanned. And the side 50c is irradiated. As a result, the terminal 50 is formed with a joint portion 53 that goes around the surface once in a direction intersecting with the axial direction.

In this case, the inventors have confirmed that the side surfaces 50c and 50d of the terminals 50 may not be properly irradiated with the laser beam if the interval between the adjacent terminals 50 is too close. Specifically, according to the research of the present inventors, it was confirmed that when the thickness of the terminals 50 is T and the interval between the adjacent terminals 50 is L, the laser beam cannot be irradiated to the side surface when T/L>10 50c, 50d. Therefore, in the present embodiment, in the above-mentioned terminal forming step, the terminal 50 is formed so that T/L≦10. In addition, the thickness of the terminal 50, in other words, the length between the one surface 50a and the other surface 50b, is also the width of the side surfaces 50c and 50d.

The above is the configuration of the laser irradiation apparatus 200 of the present embodiment. Then, when the joint portion forming apparatus 140 is carried into the first structure body 81 by the conveying device 184 , the first structure body 81 is held by the receiving jig 210 and placed on the tray 231 . Then, the junction forming device 140 forms the junction 53 with the laser beam irradiation part 250 , and sends the first structure 81 to the conveying device 185 by the sending jig 220 .

Here, as shown in FIGS. 5 and 7 , the conveying device 185 includes a storage member 190 . In this embodiment, the accommodating member 190 is constituted by a box-shaped accommodating tray made of resin or the like, and is configured to be capable of accommodating the plurality of first structures 81 . Then, when the predetermined number of first structures 81 are accommodated in the accommodation member 190 , the transport device 185 transports the accommodation member 190 to the inspection apparatus 150 .

The inspection apparatus 150 is an apparatus for inspecting the shape of the joint portion 53 , and performs a process of inspecting the shape of the joint portion 53 . For example, the inspection device 150 is configured using an image inspection camera capable of grasping the shape of the joint portion 53 , a control unit for performing abnormality determination, and the like. When the inspection device 150 is carried into the first structural body 81 from the conveying device 185, the inspection device 150 recognizes the shape of the junction portion 53, performs an abnormality determination as to whether the junction portion 53 has proper unevenness or not, and judges that the first structure is normal. The structure 81 is sent out to the conveying device 186. In addition, the inspection apparatus 150 should just be able to grasp|ascertain the shape of the junction part 53, for example, the structure which has a laser etc. may be sufficient as it.

The assembling device 160 is a device for assembling the first structure 81 and the magnet 20 to the cap 30 , and performs a process of assembling the first structure 81 and the magnet 20 to the cap 30 to form the second structure 82 . Then, the assembling device 160 sends out the second structure 82 to the conveying device 187 . In addition, the magnet 20 and the cap 30 are prepared separately from each process performed by each of the above-mentioned apparatuses, and are appropriately carried into the assembling apparatus 160 . However, the magnet 20 and the cap 30 may be stored in the assembly device 160 in advance, or may be formed in the manufacturing system.

The connector housing forming apparatus 170 is an apparatus for forming the connector housing 40 , and performs a process of forming the connector housing 40 . As shown in FIGS. 10A and 10B , the connector housing molding apparatus 170 includes a mold 300 including an upper mold 310 , a lower mold 320 , and a slide mold 370 , and a cavity is formed between the upper mold 310 and the lower mold 320 330. Further, in the mold 300 , an injection gate 340 for injecting the molten resin 40 a into the cavity 330 , a runner 350 communicating with the injection gate 340 , and a sprue 360 communicating with the runner 350 are formed.

In addition, FIG. 10A corresponds to the cross section along the line XA-XA in FIG. 10B . In addition, in the present embodiment, the injection gate 340 is formed so as to be located at a portion facing the mold IC 10 rather than a portion facing the bonding portion 53 when the second structure 82 is arranged in the cavity 330 . side. More specifically, the injection gate 340 is formed in a portion facing the vicinity of the joint portion of the terminal portion 11 a and the terminal 50 when the second structure 82 is arranged in the cavity 330 . In addition, in this embodiment, the connector housing molding apparatus 170 corresponds to a resin member molding apparatus.

When the second structure 82 is disposed in the mold 300 , the connector housing molding apparatus 170 injects the molten resin 40 a into the cavity 330 from the injection gate 340 via the sprue 360 and the runner 350 . Then, by cooling and solidifying the molten resin 40a, the connector housing 40 covering the second structure 82 is manufactured.

In addition, as described above, the terminal 50 is formed into a quadrangular column shape with a rectangular cross section, and the widths of the one surface 50a and the other surface 50b are set to be longer than the widths of the side surfaces 50c and 50d. That is, the terminal 50 has a structure that is easier to bend when an external force is applied to the one surface 50a and the other surface 50b than when an external force is applied to the side surfaces 50c and 50d. Therefore, in the present embodiment, the second structure 82 is arranged in the mold 300 so that the arrangement direction of the terminals 50 is substantially parallel to the direction in which the molten resin 40a flows from the injection gate 340 . Thereby, the molten resin 40a flowing in from the injection gate 340 tends to reach the side surfaces 50c and 50d of the terminals 50 first, and it is possible to suppress the bending of the terminals 50 .

The above is the configuration of the manufacturing system of the present embodiment. In addition, in this embodiment, the above-mentioned rotation angle sensor is manufactured using the above-mentioned manufacturing system.

Briefly, the mold IC 10 is manufactured by the mold IC manufacturing apparatus 100 . The terminal 50 is formed by the terminal forming apparatus 110 . And the terminal part 11a and the terminal 50 are connected by the connection apparatus 120, and the 1st structure body 81 is formed.

Next, the tie rods connecting the terminals 50 are cut by the tie rod cutting device 130 . Then, the junction part 53 is formed by irradiating the terminal 50 with a laser beam by the junction part forming device 140 . Then, abnormality determination of the joint portion 53 is performed by the inspection device 150 . Next, the magnet 20 and the first structure 81 are assembled to the cap 30 by the assembling device 160 to form the second structure 82 . Then, the second structure 82 composed of the first structure 81 is arranged in the mold 300 of the connector housing molding apparatus 170 . Then, by pouring the molten resin 40a into the mold 300 and solidifying, the connector housing 40 is formed so that one end portion of the terminal 50 is exposed. As described above, the above-mentioned rotation angle sensor is manufactured.

As described above, in the present embodiment, the terminal 50 is formed with the junction portion 53 . Also, the connector housing 40 and the engaging portion 53 are engaged. Therefore, the bondability between the connector housing 40 and the terminal 50 can be improved, and the intrusion of foreign matter such as water or oil from the opening portion 41 side of the connector housing 40 can be suppressed. Therefore, it is possible to suppress a decrease in reliability of the rotation angle sensor.

In addition, by forming the engaging portion 53 in the terminal 50 and engaging with the connector housing 40 , intrusion of foreign matter is suppressed. Therefore, an increase in the number of parts can be suppressed.

In addition, the first concavities and convexities 71 have a height of 0.5 to 50 μm, and the second concavities and convexities 72 have a height of 0.5 to 500 nm. Therefore, the sealability (ie, bonding property) can be exhibited by the first concavities and convexities 71 , and the stress applied to the first concavities and convexities can be relieved by the second concavities and convexities 72 . Therefore, the bondability between the connector housing 40 and the engaging portion 53 can be improved.

Furthermore, in this embodiment, the terminal 50 is configured by forming the metal thin film 62 on the surface of the base body 61 . In addition, the metal thin film 62 is composed of at least one of gold, tin, nickel, palladium, and silver as a main component. Therefore, when the joining portion 53 is formed by irradiating the laser beam, the joining portion 53 having the appropriate first irregularities 71 and second irregularities 72 is formed.

In addition, in this embodiment, the wavelength is set to 0.2 to 11 μm, the energy density is set to 100 J/cm ² or less, and the pulse width is set to 1 μs or less. Therefore, when the junction 53 is formed by irradiating the laser beam, the junction 53 having the appropriate first irregularities 71 and second irregularities 72 is formed.

Furthermore, in the present embodiment, if the diameter of the irradiation spot S of the laser beam is x, and the interval between the centers of the adjacent irradiation spots S is y1 and y2, then 0.01x≤y1, y2≤20x, The terminal 50 is irradiated with a laser beam. Therefore, when the junction 53 is formed by irradiating the laser beam, the second unevenness 72 formed by the previous laser beam can be suppressed from disappearing by the subsequent laser beam, and the second unevenness 72 can be formed at appropriate intervals. Therefore, it is possible to suppress deterioration of the bondability between the connector housing 40 and the engaging portion 53 .

In addition, if the thickness of the terminal 50 is T, and the interval between the adjacent terminals 50 in the portion where the joint portion 53 is formed is L, T/L≦10. Therefore, it can be suppressed that the bonding portion 53 is not formed on the side surfaces 50 c and 50 d of the terminal 50 when the bonding portion 53 is formed by irradiating the laser beam. Therefore, it is possible to suppress deterioration of the bondability between the connector housing 40 and the engaging portion 53 .

(Second Embodiment)

The second embodiment will be described. In this embodiment, the thickness of the portion of the connector housing 40 that covers the junction portion 53 is reduced as compared with the first embodiment. The rest is the same as that of the first embodiment, so the description is omitted here.

In the present embodiment, as shown in FIG. 11 , the thickness of the portion of the connector housing 40 that covers the engaging portion 53 of the terminal 50 is thinner than the thickness of the portion different from the portion that covers the engaging portion 53 . . Specifically, the connector housing 40 forms the concave portion 42 that goes around the outer wall surface of the connector housing 40 along the portion corresponding to the engaging portion 53 at the portion where the engaging portion 53 is covered, thereby allowing the cover to engage. The thickness of the portion of the portion 53 is reduced.

In addition, the thickness of the part which covers the terminal 50 of the connector housing 40 is the length between each surface 50a-50d of the terminal 50 and the outer wall surface which opposes each surface 50a-50d. That is, the thickness of the portion of the connector housing 40 that covers the engaging portion 53 is the thickness of the portion where the engaging portion 53 is formed among the surfaces 50 a to 50 d of the terminal 50 and the connector housing 40 facing the portion. Length between outer walls. In addition, the thickness of the part of the connector housing 40 that is different from the part covering the junction part is the part where the junction part 53 is not formed among the surfaces 50a to 50d of the terminal 50 and the connector housing facing the part. The length between the outer walls of the body 40 .

Such a rotation angle sensor is manufactured by changing the mold 300 in the step of forming the connector housing 40 in the first embodiment described above. That is, in this embodiment, as shown in FIG. 12 , the upper mold 310 is provided with a convex portion for forming a concave portion protruding toward the cavity 330 side, and the lower mold 320 is formed with a concave portion forming portion protruding toward the cavity 330 side. The structure of the convex portion 321 serves as the mold 300 . In addition, the convex part for concave part formation formed in the upper mold|type 310 is formed in the cross section different from that of FIG. 12 . Then, by flowing the molten resin 40 a into the cavity 330 , a connector housing in which the concave portion 42 is formed by the convex portion for forming a concave portion formed on the upper die 310 and the convex portion 321 for forming a concave portion formed on the lower die 320 is manufactured. 40.

Here, the present inventors have studied a resin molded body formed of a metal material and formed with the above-described joint portion 53 in a resin molded body covered with a resin member, and confirmed that the following problems occur.

That is, in order to manufacture such a resin molded body, as shown in FIG. 13A , first, the insert 400 having the junction 53 formed thereon is placed in the mold 300 , and the molten resin 410 covering the insert 400 is poured into the mold 300 . In addition, the insert 400 shown in FIG. 13A has the engaging portion 53 having the above-mentioned shape formed on the surface. In addition, the insert 400 has the same structure as the terminal 50 described above.

Then, as shown in FIG. 13B , when the temperature of the molten resin 410 drops, the surface of the molten resin 410 , that is, the surface in contact with the insert 400 and the mold 300 starts to harden. Then, after the molten resin 410 forms the hardened portion 411a on the insert 400 side and forms the hardened portion 411b on the mold 300 side, cooling solidification and shrinkage of the unhardened portion 412 that is not hardened proceed. At this time, the hardened portion 411 a is hardened with respect to the joint portion 53 in a state of being joined to the joint portion 53 .

Then, as shown in FIG. 13C , in the unhardened portion 412 on the insert 400 side, since the hardened portion 411 a is joined to the insert 400 , the hardened portion 411 a is in a state where no gap is formed with the insert 400 . , the internal cooling solidification and shrinkage progress. On the other hand, in the unhardened portion 412 on the side of the mold 300, since the hardened portion 411b is not joined to the mold 300, the hardened portion 411b forms a gap with the mold 300, and the cooling solidification and shrinkage of the inside progresses. .

Therefore, the portion of the uncured portion 412 on the side of the insert 400 is relatively more likely to become a negative pressure than the other uncured portions 412 . Therefore, in the uncured portion 412 , the vacuum voids 420 are likely to be concentrated in the vicinity of the cured portion 411 a on the insert 400 side, and the vacuum voids 420 may be connected in the vicinity of the cured portion 411 a (hereinafter referred to as vacuum void connection). Case. In this case, the vacuum void connection reduces the bonding strength between the insert 400 and the resin member 430 , which is a cause of lowering the bonding between these members.

In addition, the portion of the insert 400 where the engaging portion 53 is not formed is as shown in FIG. 14 . That is, in this portion, when the temperature of the molten resin 410 decreases, the hardened portion 411a is formed on the insert 400 side and the hardened portion 411b is formed on the mold 300 side, which is the same as the portion where the joint portion 53 is formed. However, since the hardened portion 411 a is not joined to the insert 400 , cooling, solidification and shrinkage of the unhardened portion 412 progress in a state where a gap is also formed between the hardened portion 411 a and the insert 400 . Therefore, scattered vacuum voids 420 are easily formed between the hardened portion 411 a and the hardened portion 411 b of the molten resin 410 , and vacuum void connection is less likely to occur.

Furthermore, the inventors of the present invention obtained the results shown in FIG. 15 after further special research on vacuum void connection. FIG. 15 is a view showing a resin molded body composed of an insert 400 and a resin member 430 formed of a thermoplastic resin covering a part of the insert 400 . In addition, in FIG. 15, the insert 400 has the joining part 53 formed in a part of the surface, and the remaining part of the surface is the unprocessed part 401 in which the joining part 53 is not formed. Furthermore, in FIG. 15 , a portion of the resin member 430 covering the joint portion 53 is formed as a thick portion 430a having a relatively thick wall, and the remaining portion is formed as a thin portion 430b with a relatively thin wall thickness. In addition, the part which covers the unprocessed part 401 in the resin member 430 is made into a thick structure.

As shown in FIG. 15 , it was confirmed that a vacuum void 420 and a vacuum void connection portion were generated in the thick portion 430 a in the portion of the resin member 430 covering the joint portion 53 . However, in the thin portion 430b of the resin member 430, it was confirmed that the vacuum voids 420 and vacuum voids were hardly connected. This is because when the thickness of the resin member 430 is thick, it takes time until the uncured portion 412 is cured, so as shown in FIG. 13C described above, the shrinkage stress is concentrated in the vicinity of the cured portion 411a in the uncured portion 412 This state lasts for a long time, and vacuum pore connection is easy to occur.

In addition, it was confirmed that the portion of the resin member 430 covering the unprocessed portion 401 had vacuum voids 420 scattered inside. In addition, the region R1 shown in FIG. 15 is a region corresponding to FIGS. 13A to 13C , and the region R2 is a region corresponding to FIG. 14 .

As described above, by reducing the thickness of the portion of the connector housing 40 that covers the joint portion 53 , the occurrence of vacuum void connection can be suppressed, and the bondability between the joint portion 53 and the connector housing 40 can be suppressed from decreasing. The inventors have confirmed that the reduction effect of the vacuum voids 420 can be remarkably obtained when the thickness of the portion covering the joint portion 53 is, for example, 2 mm or less, and the effect can be better obtained when the thickness is 1 mm or less. Therefore, in this embodiment, the thickness of the connector housing in the vicinity of the joint portion is 2 mm or less.

As described above, in the present embodiment, the connector housing 40 is formed with the concave portion 42 , and the thickness of the portion of the terminal 50 that covers the engaging portion 53 is larger than the thickness of the portion of the terminal 50 that covers the portion different from the engaging portion 53 . Thin thickness. Therefore, it is possible to suppress the formation of vacuum void connection in the portion of the connector housing 40 on the side of the joint portion 53 . Therefore, it is possible to suppress a decrease in the joint strength between the joint portion 53 and the connector housing 40 .

(Variation of the second embodiment)

A modification of the above-described second embodiment will be described. In the above-described second embodiment, the concave portion 42 does not need to be formed in a shape that goes around the outer wall surface of the connector housing 40 . For example, the concave portion 42 may be formed only in the portion of the outer wall surface of the connector housing 40 facing the joint portion 53 formed on the one surface 50a and the other surface 50b. Even with such a structure, since vacuum void connection is unlikely to occur in the vicinity of the joint portion 53 formed on the one surface 50a and the other surface 50b, the same effects as those of the second embodiment described above can be obtained.

(third embodiment)

The third embodiment will be described. In this embodiment, a through hole is formed in the connector housing 40 instead of forming the recessed portion 42 as compared with the second embodiment. The rest is the same as that of the second embodiment, so the description is omitted here.

In the present embodiment, as shown in FIG. 16 , through holes 43 are formed at positions corresponding to the engaging portions 53 in the connector housing 40 . In the present embodiment, the through holes 43 are formed at positions corresponding to the junctions 53 formed on the one surface 50 a and the other surface 50 b of the terminal 50 . Therefore, in this rotation angle sensor, occurrence of vacuum void connection in the vicinity of the joint portion 53 formed on the one surface 50a and the other surface 50b is suppressed.

In addition, in the present embodiment, the interval between the engaging portion 53 and the through hole 43 is the thickness of the portion of the connector housing 40 that covers the engaging portion 53 . Therefore, when the through-hole 43 is formed in the connector housing 40 , it is preferable to set the interval between the joint portion 53 and the through-hole 43 to be 2 mm or less. In addition, in the present embodiment, the concave portion 42 is not formed on the outer wall surface of the connector housing 40 . Therefore, the length of the outer circumference of the connector housing 40 in which the outer wall surface makes one turn in the circumferential direction along the axial direction is substantially equal.

Such a rotation angle sensor is manufactured by changing the mold 300 in the step of forming the connector housing 40 in the first embodiment described above. That is, although not particularly shown in the drawings, a structure in which through-hole forming protrusions corresponding to the forming through-holes 43 are formed is prepared as the mold 300 . Then, by flowing the molten resin 40a into the cavity 330, the connector housing 40 in which the through-hole 43 is formed by the through-hole forming convex portion is manufactured.

As described above, even if the thickness of the portion covering the joint portion 53 is reduced by forming the through hole 43 in the connector housing 40, the same effect as that of the second embodiment described above can be obtained.

In addition, in the present embodiment, since the thickness of the portion of the connector housing 40 covering the engaging portion 53 is reduced by forming the through-hole 43 in the connector housing 40 , the connector housing 40 does not need to be formed in the connector housing 40 . A concave portion 42 is formed on the outer wall surface of the . Therefore, for example, it is possible to cope with the case where the concave portion 42 cannot be formed on the outer wall surface due to restrictions on the side of the mounted device such as a vehicle.

(Variation of the third embodiment)

A modification of the third embodiment will be described. In the third embodiment, an example in which the through-holes 43 are formed at positions corresponding to the junctions 53 formed on the one surface 50a and the other surface 50b of the terminal 50 of the connector housing 40 has been described. However, the through holes 43 may be formed in the connector housing 40 at positions corresponding to the engaging portions 53 formed on the side surfaces 50 c and 50 d of the terminals 50 . In this case, the occurrence of vacuum void connection in the vicinity of the joint portion 53 formed on the side surfaces 50c and 50d is suppressed.

(fourth embodiment)

The fourth embodiment will be described. In this embodiment, a groove portion is formed in the connector housing 40 as compared with the first embodiment. The rest is the same as that of the first embodiment, so the description is omitted here.

In the present embodiment, as shown in FIG. 17A , in the connector housing 40 , the thickness of the portion covering the one end side of the connector housing 40 is set to be more than the portion covering the engaging portion 53 in the terminal 50 It is thinner than the part covering the joint part 53 . Specifically, the outer wall surface of the connector housing 40 that covers the portion covering the joint portion 53 on the one end side is formed with the groove portion 44 that is wound once in the circumferential direction with respect to the axial direction.

Such a rotation angle sensor is manufactured by changing the mold 300 in the step of forming the connector housing 40 in the first embodiment described above. That is, in the present embodiment, as shown in FIG. 18 , the upper mold 310 is prepared to form a groove portion forming convex portion protruding toward the cavity 330 side, and the lower mold 320 to form a groove portion protruding toward the cavity 330 side. The structure of the convex portion 322 is used as the mold 300 . In addition, the groove part forming convex part formed in the upper mold|type 310 is formed in the cross section different from that of FIG. 18 .

Then, by flowing the molten resin 40a into the cavity 330, a connector housing in which the grooves 44 are formed by the groove-forming protrusions formed in the upper mold 310 and the groove-forming protrusions 322 formed in the lower mold 320 is manufactured. body 40. In addition, the other structure of the mold 300 of this embodiment is the same as that of the above-mentioned first embodiment, and the injection gate 340 is formed so as to be located closer to the mold than the joint portion 53 when the second structure 82 is arranged in the cavity 330 . IC10 side. That is, the rotation angle sensor is manufactured by forming the connector housing 40 in which the portion covering the region on the downstream side of the joint portion 53 in the flow direction of the molten resin 40 a is thinner than the portion covering the joint portion 53 .

At this time, the groove-forming protrusions of the upper mold 310 and the groove-forming protrusions 322 of the lower mold 320 are located downstream of the joint portion 53 in the flow direction of the molten resin 40a injected from the injection gate 340 . Therefore, as shown in FIG. 19 , after the molten resin 40 a is injected into the cavity 330 , it passes between the groove-forming protrusions of the upper mold 310 and the groove-forming protrusions 322 of the lower mold 320 and the terminals 50 . , the flow cross-sectional area becomes smaller. Therefore, when the molten resin 40a reaches the groove-forming protrusions of the upper mold 310 and the groove-forming protrusions 322 of the lower mold 320, the resin pressure becomes high, and it tends to flow into the concavities and convexities formed in the joint part 53. That is, the groove portion forming convex portion of the upper mold and the groove portion forming convex portion of the lower mold function as the throttle portion. Therefore, the bondability between the connector housing 40 and the terminal 50 can be improved.

In addition, the flow cross-sectional area here is the area of the flow front of the molten resin 40a.

As described above, in the present embodiment, in the connector housing 40 , the groove portion 44 is formed in the portion of the outer wall surface on the one end side of the portion facing the engaging portion 53 . In addition, when the connector housing 40 is formed, the molten resin 40 a injected from the injection gate 340 reaches the portion where the groove portion 44 is formed after reaching the joint portion 53 . That is, when the connector housing 40 is formed, the flow cross-sectional area of the molten resin 40 a injected from the injection gate 340 becomes smaller after reaching the joint portion 53 . Therefore, when the connector housing 40 is formed, the resin pressure of the molten resin 40 a in the vicinity of the joint portion 53 can be increased, and the bondability between the connector housing 40 and the joint portion 53 can be improved.

(Variation of the fourth embodiment)

A modification of the fourth embodiment will be described. In the fourth embodiment, an example in which the injection gate 340 is formed so as to be located closer to the mold IC 10 than the joint portion 53 when the second structure 82 is arranged in the cavity 330 has been described. However, when the second structure 82 is arranged in the cavity 330 , the injection gate 340 may be located on the opposite side to the mold IC 10 side than the joint portion 53 . That is, the injection gate 340 may be arranged on the one end side of the terminal 50 rather than the joint portion 53 . In this case, the groove-forming protrusions of the upper mold 310 and the groove-forming protrusions 322 of the lower mold 320 are located closer to the joint portion 53 than the joint portion 53 when the second structure 82 is arranged in the cavity 330 . Type IC10 side is fine. That is, in the present embodiment, the groove portion 44 of the connector housing 40 is formed in the groove portion 44 of the connector housing 40 as long as the flow cross-sectional area becomes smaller on the downstream side than the joint portion 53 in the flow direction of the molten resin 40 a injected from the injection gate 340 . The position can be changed appropriately.

In addition, in the above-described fourth embodiment, the groove portion 44 does not have to be formed in a shape in which the outer wall surface of the connector housing 40 is wound around once. For example, the groove portion 44 may be formed only in the portion of the outer wall surface of the connector housing 40 facing the joint portion 53 formed on the one surface 50a and the other surface 50b. Even with such a configuration, since the molten resin 40a easily flows into the joint portion 53 formed on the one surface 50a and the other surface 50b, the same effects as those of the fourth embodiment described above can be obtained.

Furthermore, in the above-described fourth embodiment, as shown in FIG. 17B , the joint portion 53 may be formed closer to the vicinity of the opening portion 41 . Even with such a configuration, since the flow cross-sectional area is reduced in the portion constituting the opening portion 41, the same effect as that of the above-described fourth embodiment can be obtained.

Furthermore, the above-described fourth embodiment may be combined with the above-described second embodiment. In this case, the depth of the groove portion 44 may be made deeper than the depth of the recessed portion 42 .

(Fifth Embodiment)

The fifth embodiment will be described. In this embodiment, a thick portion is formed in the terminal 50 compared to the fourth embodiment. The rest is the same as that of the fourth embodiment, so the description is omitted here.

In the present embodiment, as shown in FIGS. 20 and 21 , in the terminal 50 , a thick portion 54 is formed on one end side of the portion where the joint portion 53 is formed. The thick portion 54 is configured to be larger than the portion where the joint portion 53 is formed in terms of the size of the cross-section with the axial direction being the normal direction. In the present embodiment, the size of the cross-section of the thick portion 54 in the normal direction to the axial direction is made larger on the sides of the surfaces 50a to 50d as a whole than the portion where the joint portion 53 is formed. Further, the terminals 50 located at both ends in the arrangement direction of the terminals 50 are formed so as to be thicker on the side opposite to the side of the terminal 50 located in the center. In addition, FIG. 21 is a perspective view of the vicinity of the joint portion 53 of the terminal 50 located on the lowermost side of the paper surface in FIG. 20 .

Such a rotation angle sensor is manufactured by, for example, changing the base body 61 constituting the terminal 50 in the step of forming the terminal 50 in the above-described first embodiment. That is, in the process of forming the terminal 50, for example, as shown in FIG. 22, the metal plate 90 which formed the convex part 91 by rolling, cutting, etc. is prepared. In addition, in FIG. 22, the metal plate 90 formed in the hoop shape after forming the convex part 91 is shown.

Further, in the step of forming the terminal 50 , when the metal plate 90 is press-molded to form the base body 61 , the press-molding is performed so as to form a convex portion connected to the convex portion 91 also on the cut surface. Then, the terminal 50 is formed by forming the metal thin film 62 on the base 61, and the terminal 50 having the thick portion 54 formed thereon is prepared.

Then, as shown in FIG. 23 , the second structure 82 having the terminal 50 having the thick portion 54 formed thereon is placed in the mold 300 to form the connector housing 40 . Thereby, the rotation angle sensor shown in FIG. 22 is manufactured.

At this time, the thick portion 54 narrows the interval between the thick portion 54 and the mold 300 . That is, as in the above-described fourth embodiment, after the molten resin 40 a is injected into the cavity 330 , the flow cross-sectional area becomes smaller when passing between the thick portion 54 and the mold 300 . Therefore, the bondability between the connector housing 40 and the terminal 50 can be improved.

As described above, by forming the thick portion 54 in the terminal 50, even if the flow cross-sectional area of the molten resin 40a is reduced after reaching the joint portion 53, the same effects as those of the fourth embodiment described above can be obtained. In addition, in the present embodiment, since the distance between the thick portion 54 and the mold 300 can be adjusted by changing the shape of the thick portion 54 of the terminal 50 , the distance between the thick portion 54 and the mold 300 can be adjusted, so compared with the case where the convex portion or the like is changed on the mold 300 , for example. , design changes can be easily made.

(Variation of the fifth embodiment)

A modification of the fifth embodiment will be described. Like the modification of the fourth embodiment, the injection gate 340 may be located on the opposite side to the mold IC 10 side than the joint portion 53 when the second structure 82 is arranged in the cavity 330 . In this case, the thick part 54 of the terminal 50 may be formed on the one end side rather than the joint part 53 .

Moreover, in the said 5th Embodiment, the thick part 54 may be the shape which protrudes only to the side of one surface 50a and the other surface 50b, for example.

(Sixth Embodiment)

The sixth embodiment will be described. In this embodiment, a thick portion is formed in the terminal 50 compared to the first embodiment. The rest is the same as that of the first embodiment, so the description is omitted here.

In the present embodiment, as shown in FIG. 24 , in the terminal 50 , a thick portion 55 is formed at a portion on the side of the terminal portion 11 a from a portion where the joint portion 53 is formed. In addition, the shape of the thick portion 55 is the same as that of the thick portion 54 of the fifth embodiment described above. That is, in the present embodiment, the thickness of the portion of the connector housing 40 that covers the junction portion 53 of the terminal 50 and the portion that covers the other end side of the connector housing 40 is made larger than that of the portion that covers the junction portion 53 . part is thin.

Such a rotation angle sensor is manufactured as follows. First, in the step of forming the terminal 50 in the fifth embodiment described above, the base body 61 is formed by preparing the metal plate 90 in which the location where the convex portion 91 is to be formed has been changed. Then, as shown in FIG. 25 , the connector housing 40 is formed by arranging the second structure 82 having the terminal 50 formed with the thick portion 55 in the mold 300 . Also, in the mold 300 of the present embodiment, as in the first embodiment described above, the injection gate 340 is formed so as to be located closer to the mold IC 10 than the joint portion 53 when the second structure 82 is arranged in the cavity 330 . That is, the rotation angle sensor is manufactured by forming the connector housing 40 in which the portion covering the region on the upstream side in the flow direction of the molten resin 40 a from the joint portion 53 is thinner than the portion covering the joint portion 53 . .

At this time, the molten resin 40a injected from the injection gate 340 spreads in the axial direction from the injection gate 340, but this expansion is suppressed by the thick portion 55, and it is easy to spread also in the circumferential direction with respect to the axial direction. That is, the junction of the molten resin 40a injected from the injection gate 340 formed in the upper mold 310 and the molten resin 40a injected from the injection gate 340 formed in the lower mold 320 tends to be closer to the injection gate 340 than the thick portion 55 occur. That is, the junction portion of the molten resin 40a injected from the injection gate 340 formed in the upper mold 310 and the molten resin 40a injected from the injection gate 340 formed in the lower mold 320 is less likely to be in the vicinity of the joint portion 53 . Therefore, it is possible to suppress the formation of a solder surface on the connector housing 40 in the vicinity of the joint portion 53 .

As described above, in the present embodiment, in the terminal 50 , the thick portion 55 is formed at the portion on the terminal portion 11 a side from the portion where the joint portion 53 is formed. Then, when the connector housing 40 is formed, the molten resin 40 a injected from the injection gate 340 flows toward the joint portion 53 after reaching the thick portion 55 . Therefore, it is possible to suppress the formation of a welding surface in the vicinity of the joint portion 53 when the connector housing 40 is formed, and it is possible to suppress deterioration of the bondability between the connector housing 40 and the joint portion 53 .

(Variation of the sixth embodiment)

A modification of the sixth embodiment will be described. In the above-mentioned sixth embodiment, the example in which the thick portion 55 is formed in the terminal 50 has been described, but a protrusion corresponding to the thick portion may be formed on the die 300 . However, when the terminal 50 is formed with the thick portion 55, the design change is easier.

In addition, in the above-described sixth embodiment, similarly to the modification of the fourth embodiment, the injection gate 340 may be located closer to the mold IC 10 than the joint portion 53 when the second structure 82 is arranged in the cavity 330 . the opposite side of the side. In this case, the thick part 55 of the terminal 50 may be formed on the one end side rather than the joint part 53 . That is, in the sixth embodiment, as long as the flow cross-sectional area becomes smaller on the upstream side than the joint portion 53 in the flow direction of the molten resin 40a injected from the injection gate 340, the formation site of the thick portion 55 can be appropriately changed.

In addition, in the above-described sixth embodiment, for example, when the injection gate 340 is located further to the left side of the drawing in FIG. 25 , a convex portion corresponding to the thick portion 55 may be formed on the cap 30 or the mold IC 10 . Wait. That is, as long as the junction portion of the molten resin 40a injected from the injection gate 340 formed in the upper mold 310 and the molten resin 40a injected from the injection gate 340 formed in the lower mold 320 does not easily become the vicinity of the joint portion 53, the The terminal 50 does not form the thick portion 55 .

Furthermore, in the above-described sixth embodiment, the thick portion 54 may be formed, for example, in a shape protruding only toward the one surface 50a and the other surface 50b.

(Seventh Embodiment)

A seventh embodiment will be described. In this embodiment, as compared with the first embodiment, air bubbles are formed in the connector housing 40 . The rest is the same as that of the first embodiment, so the description is omitted here.

In the present embodiment, as shown in FIGS. 26 and 27 , in the terminal 50 , a plurality of through holes 56 a are formed in a portion different from the joint portion 53 . Specifically, the through hole 56a is formed between the positioning hole 52 and the engaging portion 53 and between the engaging portion 53 and one end portion so as to penetrate between the one surface 50a and the other surface 50b. In addition, in the connector housing 40, air bubbles 45 are formed around the portion where the through-hole 56a is formed. In addition, in this embodiment, the through-hole 56a corresponds to a bubble formation part.

Such a rotation angle sensor is manufactured as follows. First, in the step of forming the terminal 50 in the above-described first embodiment, the through-hole 56a is formed by performing press forming, laser processing, or the like after forming the terminal 50 . Then, the connector housing 40 is formed using the terminal 50 .

At this time, since the through-hole 56a is formed in the terminal 50, when the molten resin 40a reaches the through-hole 56a, the air is likely to be sucked in. Therefore, when the molten resin 40a is cooled and solidified to form the connector housing 40, the air bubbles 45 are formed by the expansion of the sucked air. That is, in the present embodiment, the air bubbles 45 are actively formed in a portion of the connector housing 40 that is different from the portion covered with the joint portion 53 .

As described above, in the present embodiment, in the connector housing 40 , the air bubbles 45 are formed in a portion different from the portion covering the joint portion 53 . In addition, such a connector housing 40 is formed when the connector housing 40 is formed of the molten resin 40a. Therefore, when the molten resin 40a is cooled and solidified, the portion in the vicinity of the joint portion 53 is less likely to become a negative pressure due to air bubbles, and the shrinkage stress generated in the joint portion 53 can be reduced. Therefore, vacuum void connection is less likely to occur in the vicinity of the joint portion 53 in the connector housing 40 , and it is possible to suppress deterioration of the bondability between the joint portion 53 and the connector housing 40 .

(Variation of the seventh embodiment)

In the seventh embodiment, an example in which the through-hole 56a as the bubble-forming portion is formed in the terminal 50 has been described, but the bubble-forming portion is not limited to this. For example, as shown in FIG. 28A , the bubble forming portion may be constituted by a plurality of through holes 56a. In addition, although not shown in particular, the bubble forming portion may be a through hole penetrating the side surfaces 50c and 50d of the terminal 50 or a hole not penetrating the terminal 50 . Furthermore, as shown in FIG. 28B , the air bubble forming portion may be a groove portion 56 b formed on one surface 50 a of the terminal 50 . In this case, as shown in FIG. 28C , the groove portion 56b may be formed in a lattice shape. 28B and 28C , the other surface 50b or the side surfaces 50c and 50d of the terminal 50 may also be appropriately formed with grooves 56b.

Furthermore, as shown in FIG. 29 , the bubble forming portion may be constituted by a bent portion 56c formed by bending the terminal 50 . In addition, in FIG. 29, the bending part 56c which the other surface 50b was bend|folded toward the one surface 50a side is shown.

When the connector housing 40 is formed using such a terminal 50, as shown in FIGS. 30A and 30B , the molten resin 40a merges on the downstream side of the flow direction of the molten resin 40a in the bent portion 56c. At this time, in the confluence portion, air is easily sucked in (bite in). Therefore, the air bubbles 45 are formed around the bent portion 56c.

(8th embodiment)

An eighth embodiment will be described. In this embodiment, the thickness of the metal thin film 62 of the terminal 50 is changed from that of the first embodiment. The rest is the same as that of the first embodiment, so the description is omitted here.

In the present embodiment, as shown in FIG. 31 , the metal thin film 62 of the terminal 50 is thicker at the part where the junction 53 is formed than at the part different from the part where the junction 53 is formed. In the present embodiment, the portion of the metal thin film 62 where the bonding portion 53 is formed is thicker than the portion exposed from the opening portion 41 .

Such a terminal 50 is formed by, for example, performing the step of forming the metal thin film 62 twice in the step of forming the terminal 50 in the first embodiment described above. For example, by forming the first metal thin film 62 at the portion including the junction portion 53 on the base 61 and then forming the second metal thin film 62 on the entire body, the metal thin film 62 at the portion where the junction portion 53 is formed can be made smaller than the other portions. The metal film is 62 thick.

As described above, in the present embodiment, the portion of the metal thin film 62 of the terminal 50 where the junction portion 53 is formed is thicker than the portion where the junction portion 53 is formed. Therefore, compared with the case where the thickness of the thin portion of the metal thin film 62 is constant, for example, when the bonding portion 53 is formed by irradiating a laser beam, the metal thin film 62 is penetrated and the base body 61 is prevented from being exposed. That is, it is possible to suppress that the junction portion 53 is not properly formed in the terminal 50 . Furthermore, compared with the case where the thickness of the thick part of the metal thin film 62 is made constant, for example, it is possible to reduce the material constituting the metal thin film 62 .

(Ninth Embodiment)

A ninth embodiment will be described. Compared with the first embodiment, the present embodiment has a configuration in which a recessed portion is formed in the terminal 50 and a joint portion 53 is formed in the recessed portion. The rest is the same as that of the first embodiment, so the description is omitted here.

In the present embodiment, as shown in FIG. 32 , the terminal 50 has recesses 57 formed on one surface 50a and the other surface 50b. Also, the engaging portion 53 is formed on the bottom surface of the recessed portion 57 . That is, the junction part 53 is formed in the position which is recessed from the surroundings in the one surface 50a and the other surface 50b.

Such a terminal 50 is formed by changing the step of forming the terminal 50 and the step of forming the joint portion 53 in the first embodiment described above.

That is, in the process of forming the terminal 50 , for example, the metal plate 90 forming the base body 61 is changed. For example, in the process of forming the terminal 50, as shown in FIG. 33, the metal plate 90 in which the recessed part 92 was formed by rolling, cutting, etc. is prepared. Then, the base body 61 constituting the terminal 50 is formed from the metal plate 90 by press forming or the like. Then, by forming the metal thin film 62 on the base 61, the terminal 50 in which the recessed portion 57 is formed is formed.

In addition, in the step of forming the bonding portion 53 , the bonding portion 53 is formed so as to include the bottom surface of the recessed portion 57 by irradiating a laser beam. Thereby, the terminal 50 shown in FIG. 32 is formed.

As explained above, in the present embodiment, the engaging portion 53 is formed at the recessed portion 57 of the terminal 50 . Therefore, as shown in FIGS. 7 and 34 , when the first structure 81 is placed on the accommodating member 190 after the step of forming the joint portion 53 , the mounting surface 190 a facing the accommodating member 190 on the one surface 50 a side or the other surface 50 b side Therefore, it is difficult for the engaging portion 53 to come into contact with the accommodating member 190 . Therefore, it is possible to prevent the concavities and convexities constituting the engaging portion 53 from being broken, and it is possible to suppress the decrease in the bondability between the engaging portion 53 and the connector housing 40 . In addition, in this embodiment, since the accommodating member 190 consists of a box-shaped accommodating tray, the mounting surface 190a consists of the bottom surface of a accommodating tray.

(Variation of the ninth embodiment)

A modification of the ninth embodiment will be described. In the ninth embodiment, as shown in FIG. 35 , the terminal 50 may also have the recessed portions 57 formed on the side surfaces 50c and 50d. In addition, the joint portion 53 may be formed on the bottom surface of the recessed portion 57 formed on each of the surfaces 50a to 50d. Thereby, the joint portion 53 can be further protected, and it is possible to suppress deterioration of the joinability between the joint portion 53 and the connector housing 40 .

In addition, such a terminal 50 is formed, for example, by using a pressing device capable of forming the recessed portions 57 also on the side surfaces 50c and 50d when the base body 61 constituting the terminal 50 is formed of the metal plate 90 .

Further, in the ninth embodiment described above, for example, as long as it is placed on the housing member 190, it is determined that the other surface 50b side is disposed toward the mounting surface 190a side of the housing member 190, and the recessed portion 57 may be formed only on the other surface 50b. side.

(Tenth Embodiment)

A tenth embodiment will be described. In the present embodiment, as compared with the first embodiment, a convex portion is formed around the joint portion 53 of the terminal 50 . The rest is the same as that of the first embodiment, so the description is omitted here.

In the present embodiment, as shown in FIG. 36 , the terminal 50 has a first convex portion 58 a and a second convex portion 58 b formed by bending the terminal 50 around the joint portion 53 . Specifically, in the terminal 50 , two first protrusions 58 a are formed so as to protrude to the one surface 50 a side from the engaging portion 53 and sandwich the engaging portion 53 . Moreover, in the terminal 50, two 2nd convex parts 58b are formed so that it may protrude toward the other surface 50b side rather than the junction part 53, and the junction part 53 may be pinched|interposed therebetween. That is, the junction part 53 is located between the 1st convex part 58a and the 2nd convex part 58b, and is formed in the position which is recessed from the surroundings in the one surface 50a and the other surface 50b.

Moreover, since the 1st convex part 58a and the 2nd convex part 58b are comprised by being bent, they are formed in the whole between the opposing side surfaces 50c and 50d.

Such a terminal 50 is formed by changing the step of forming the terminal 50 and the step of forming the joint portion 53 in the first embodiment described above. That is, in the step of forming the terminal 50, the terminal 50 is bent with a jig or the like to form the first convex portion 58a and the second convex portion 58b. In addition, in the step of forming the joint portion 53, the joint portion 53 is formed between the two first convex portions 58a. In this way, the terminal 50 of the present embodiment is formed.

As described above, in the present embodiment, the terminal 50 has the first convex portion 58 a and the second convex portion 58 b formed around the joint portion 53 . Therefore, as in the ninth embodiment described above, when the first structure 81 is placed on the accommodating member 190 , the one surface 50 a side or the other surface 50 b side is directed toward the mounting surface 190 a side of the accommodating member 190 , thereby suppressing the The unevenness constituting the joint portion 53 is broken. Therefore, it is possible to suppress deterioration of the joinability between the joint portion 53 and the connector housing 40 .

(Variation of the tenth embodiment)

A modification of the tenth embodiment will be described. In the tenth embodiment described above, the second convex portion 58b is formed on the opposite side surface of the other surface 50b for the entirety between the opposing side surfaces 50c and 50d on the one surface 50a. Although the example of the whole between 50c and 50d was demonstrated, it is not limited to this. For example, as shown in FIGS. 38 and 39 , the first convex portion 58a may be formed in a substantially central portion between the opposing side surfaces 50c and 50d of the one surface 50a. Moreover, the 2nd convex part 58b may be formed in the substantially center part between the side surfaces 50c and 50d which oppose in the other surface 50b. In addition, such a 1st convex part 58a and a 2nd convex part 58b are respectively formed by pressing with a punch etc., respectively.

Furthermore, as shown in FIG. 40 , the first convex portion 58a may be formed on the side surfaces 50c and 50d of one surface 50a, and the second convex portion 58b may be formed on the side surfaces 50c and 50d of the other surface 50b.

In addition, as shown in FIG. 41 , when forming the base body 61 constituting the terminal 50 , claw portions may be formed on the side surfaces 50 c and 50 d , and the first convex portion 58 a and the second convex portion 58 b may be formed by bending the claw portions. .

(11th embodiment)

An eleventh embodiment will be described. In this embodiment, as compared with the first embodiment, the base body 61 constituting the terminal 50 is trimmed. The rest is the same as that of the first embodiment, so the description is omitted here.

Here, as described above, in the step of forming the terminal 50 , the terminal 50 is configured using the base body 61 formed by press-forming the metal plate 90 . At this time, as shown in FIGS. 42A and 42B , the processed surface 61a of the base body 61 formed by the press forming is a surface in which the sag 61b, the sheared surface 61c, and the fractured surface 61d are mixed.

In this case, when the terminal 50 is formed using the base 61 , the laser beam may be scattered when the laser beam is irradiated on the surface (for example, the side surfaces 50c and 50d ) constituted by the processed surface 61a to form the joint 53 . That is, when the terminal 50 is constituted using the above-described base body 61 , there is a possibility that the bonding portion 53 having appropriate unevenness may not be formed even if the laser beam is irradiated.

Therefore, in the present embodiment, as shown in FIGS. 43A and 43B , in the step of forming the terminal 50 , after the base body 61 is formed by press-forming the metal plate 90 , the processed surface 61 a formed by the press-forming is trimmed. processing. Thereby, the processed surface 61a can be made into the shearing surface 61c with high smoothness substantially. Therefore, when forming the joint portion 53 by irradiating a laser beam to the surface constituted by the processed surface 61a of the terminal 50, it can be suppressed that the unevenness is not properly formed and the joint portion 53 is not formed.

As described above, in the present embodiment, after the base body 61 is formed from the metal plate 90, the processing surface 61a is trimmed. Therefore, it can be suppressed that the unevenness is not properly formed when the terminal 50 is formed using the base body 61 . Therefore, it is possible to suppress deterioration of the bondability between the connector housing 40 and the engaging portion 53 .

(Variation of the eleventh embodiment)

A modification of the eleventh embodiment will be described. As described above, the trimming process is performed in order to remove the sag 61b and the fractured surface 61d, and to make the processed surface 61a the sheared surface 61c. Therefore, the base body 61 may be formed from the metal plate 90 by a processing method in which the sag 61b or the fracture surface 61d is less likely to occur, and the trimming process may not be performed. For example, the base body 61 may be formed from the metal plate 90 by fine blanking. In addition, the base body 61 may be formed from the metal plate 90 by etching, for example. Thereby, it is possible to reduce the number of steps.

(12th embodiment)

A twelfth embodiment will be described. In the present embodiment, the height of the portion where the joint portion 53 of each terminal 50 is formed is changed from the first embodiment. The rest is the same as that of the first embodiment, so the description is omitted here.

In the present embodiment, as shown in FIG. 44 , each terminal 50 has a portion having a relatively different height on a line along the arrangement direction. Also, the engaging portions 53 are respectively formed at portions having relatively different heights in the respective terminals.

Specifically, one of the terminals 50 (ie, the terminal 50 on the front side in the drawing in FIG. 44 ) is formed with a first convex portion 59a that protrudes toward the other surface 50b. Moreover, the 1st convex part 59a is comprised so that the one surface 50a of the 1st convex part 59a may be located below the other surface 50b which does not comprise the 1st convex part 59a. One of the terminals 50 (that is, the terminal 50 at the center of the paper surface in FIG. 44 ) is formed with a second convex portion 59b that protrudes toward the one surface 50a side. Moreover, the 2nd convex part 59b is comprised so that the other surface 50b of the 2nd convex part 59b may be located above the surface 50a which does not comprise the 2nd convex part 59b. One of the terminals 50 (that is, the terminal 50 on the back side of the drawing in FIG. 44 ) is not formed with the first convex portion 59a and the second convex portion 59b.

In addition, in each terminal 50 , a joint portion 53 is formed at a position including the first convex portion 59 a and the second convex portion 59 b along the same line along the arrangement direction of each terminal 50 .

Such a terminal 50 is formed by making the step of forming the terminal 50 and the step of forming the joint portion 53 in the first embodiment described above as follows.

That is, in the step of forming the terminal 50 , press forming or the like is performed so that the heights of the portions where the joint portions 53 are formed are different. Specifically, in the step of forming the terminal 50 , the first convex portion 59 a is formed on one terminal 50 , and the second convex portion 59 b is formed on one terminal 50 .

In addition, in the step of forming the bonding portion 53 , the laser beam is irradiated from the normal direction of each of the surfaces 50 a to 50 d of the terminal 50 . For example, as shown in FIGS. 45A to 45D , the bonding portion 53 is formed by irradiating a laser beam on one surface 50a, side surface 50c, other surface 50b, and side surface 50d of the terminal 50 in this order. In addition, in the step of forming the joint portion 53 of the present embodiment, the first structure 81 is held from the tray 231 by another holding jig, and the laser beam is irradiated while being held by the other holding jig.

At this time, the terminals 50 are arranged along the surface direction of the one surface 50a and the other surface 50b. Further, the heights of the junction forming regions 53a on the side surfaces 50c and 50d of the respective terminals 50 are relatively different from each other. Therefore, as shown in FIGS. 45A and 45C , when the laser beams are irradiated to the one surface 50a and the other surface 50b of the terminals 50 , the laser beams are not interrupted by the mutual terminals 50 . 45B and 45D , when the laser beams are irradiated from the respective side surfaces 50c and 50d of the terminals 50, since the heights of the junction forming regions 53a are different, the mutual terminals 50 do not cut the laser beams. Therefore, the joint portion 53 can be easily formed in each terminal 50 .

As described above, in the present embodiment, the heights of the junction portion forming regions 53 a in which the junction portion 53 is formed are relatively different. Therefore, even if the laser beam is irradiated from a direction normal to each of the surfaces 50a to 50d of the terminal 50 when forming the junction 53, the mutual terminals 50 do not obstruct the laser beam, and it is possible to prevent the junction 53 from not being formed. . Therefore, it is possible to suppress deterioration of the bondability between the connector housing 40 and the engaging portion 53 .

In addition, when forming the bonding portion 53 , the laser beam only needs to be irradiated from the direction normal to each of the surfaces 50 a to 50 d of the terminal 50 , so that the positional relationship between the irradiation direction of the laser beam and the terminal 50 can be easily adjusted. Therefore, simplification of the manufacturing process can be achieved.

(Variation of the twelfth embodiment)

A modification of the twelfth embodiment will be described. In the twelfth embodiment, the terminal 50 forming the first convex portion 59a and the second convex portion 59b can be appropriately changed. In addition, each terminal 50 only needs to have a relatively different height of the junction forming region 53a. Therefore, for example, the two terminals 50 may be respectively formed with the first convex portion 59a protruding toward the other surface 50b, and the mutual first convex portion 59a may be formed. different heights.

(13th embodiment)

A thirteenth embodiment will be described. In the present embodiment, compared with the first embodiment, in the step of forming the joint portion 53 , the laser beam is irradiated in a state where the joint portion forming region 53 a of the terminal 50 is twisted. The rest is the same as that of the first embodiment, so the description is omitted here.

In the present embodiment, as shown in FIG. 46 , in the step of forming the junction portion 53 , the junction portion forming region 53 a in the terminal 50 is brought into a twisted state, and the laser beam is irradiated in this state. In the present embodiment, each terminal 50 is twisted so that the one surface 50a and the other surface 50b are 45° with respect to the irradiation direction of the laser beam. That is, each terminal 50 is twisted so as to form a joint portion 53 whose surface is wound once by irradiation of laser beams from both directions. In addition, in the step of forming the joint portion 53 of the present embodiment, the first structure 81 is held from the tray 231 by another holding jig, and the terminal 50 is in a twisted state using the other holding jig or another jig. .

As described above, in the present embodiment, the terminal 50 is brought into a twisted state, and the joint portion 53 is formed by irradiating the laser beam in this state. Therefore, compared with the case where each terminal 50 is inclined and irradiated with the laser beam (for example, FIGS. 9A and 9B ), the difference in the irradiation distance of the laser beam irradiated to each terminal 50 can be reduced. Therefore, the shape deviation of the joint part 53 can be suppressed.

In addition, in the case where the terminals 50 are in a twisted state, it is preferable that the variation in the plane direction of each terminal 50 is also reduced. For example, it is preferable to make the deviation of the surface direction of the one surface 50a of each terminal 50 small. In this way, by reducing the variation in the plane directions of the terminals 50 , the difference in the irradiation angle can also be reduced, so that the variation in the shape of the joint portion 53 can be further suppressed.

Further, by irradiating the terminals 50 with a laser beam in a twisted state, the interval between the terminals 50 (ie, L shown in FIGS. 9A and 9B ) can be shortened. Therefore, miniaturization of the rotation angle sensor can also be achieved.

Furthermore, since the terminal 50 is in a twisted state and the laser beam is irradiated, there is no need to change the equipment on the side of the laser beam irradiating part 250 in particular, and the manufacturing apparatus is not complicated.

(14th embodiment)

A fourteenth embodiment will be described. In the present embodiment, the one end side of the terminal 50 is bent relative to the first embodiment. The rest is the same as that of the first embodiment, so the description is omitted here.

In the rotation angle sensor of the present embodiment, as shown in FIG. 47 , one end side of the connector housing 40 and one end side of the terminal 50 are bent. In this embodiment, the terminal 50 is bent so that one end side is substantially perpendicular to the axial direction.

In addition, the terminal 50 has the recessed part 57 formed in the one surface 50a and the other surface 50b similarly to the said ninth embodiment. However, in the present embodiment, the recessed portion 57 is a bent portion of the terminal 50 , and is formed at a portion covered by the connector housing 40 . In addition, as shown in FIG. 48, the recessed part 57 of this embodiment is formed in a V-shape in plan view. That is, the recessed part 57 is made into the structure which has the part inclined with respect to the virtual straight line which connects the part located in each side surface 50c, 50d. And the joint part 53 is formed in the bottom surface and the side surfaces 50c and 50d of the recessed part 57 formed in the one surface 50a and the other surface 50b. In addition, when it is set as such a structure, it corresponds to the part extended in one direction in the part in which the junction part 53 was formed. That is, in the present embodiment, the terminal 50 corresponds to a portion extending in one direction from the bent portion.

Such a rotation angle sensor is manufactured by changing the step of forming the terminal 50 and the step of forming the joint portion 53 in the first embodiment described above, and then performing a bending step of bending the terminal 50 .

Here, the manufacturing system of this embodiment is demonstrated. As shown in FIG. 49 , the manufacturing system of the present embodiment is basically the same as the above-described first embodiment, but includes a bending device 180 .

The bending device 180 is a device for bending the terminal 50 , and performs a process of bending the terminal 50 . Specifically, when the bending device 180 is carried into the first structure 81 by the conveying device 184, the terminal is bent using a jig. In the present embodiment, the bending device 180 includes a pressing jig 501 , a receiving jig 502 , and a bending jig 503 as shown in FIG. 50A . Then, the bending device 180 holds the terminal 50 between the pressing jig 501 and the bending jig 503 , and makes the bending jig 503 abut against the bent portion of the terminal 50 . Then, as shown in FIG. 50B , the terminal 50 is bent by moving the bending jig 503 . Then, the first structure 81 in which the terminal 50 is bent is sent out to the conveying device 188 .

The above is the configuration of the bending device 180 of the present embodiment. When forming the terminal 50 as described above, first, in the step of forming the terminal 50, the V-shaped recessed portion 57 in plan view is formed on the one surface 50a and the other surface 50b. Then, in the step of bending the terminal 50, as shown in FIG. 50B, the terminal 50 is bent by moving the bending jig 503.

At this time, since the recessed portion 57 is formed into a V-shape in plan view, the bending jig 503 is prevented from falling into the recessed portion 57 when the bending jig 503 is moved. Therefore, it is possible to suppress roughening of the bottom surface of the recessed portion 57 when the terminal 50 is bent. That is, it is possible to suppress roughening of the junction forming region 53a. Therefore, in the step of forming the bonding portion 53 performed after the bending step, it can be suppressed that the bonding portion 53 having appropriate unevenness is not formed.

Then, the above-described rotation angle sensor shown in FIG. 47 is manufactured by performing a step of forming the connector housing 40 with respect to the second structure 82 in which the terminals 50 are bent.

As described above, in the present embodiment, the terminal 50 is formed with the V-shaped recessed portion 57 in plan view, and the joint portion 53 is formed so as to include the bottom surface of the recessed portion 57 . Therefore, by bending the terminal 50 with the bending jig 503 from the surface of the side where the recessed part 57 is formed, the bending jig 503 can be suppressed from falling into the recessed part 57 . Therefore, it can be suppressed that the junction 53 having appropriate unevenness is not formed when the junction 53 is formed in the terminal 50 .

(Variation of the fourteenth embodiment)

A modification of the fourteenth embodiment will be described. In the fourteenth embodiment, the portion where the recessed portion 57 is formed may be held by the pressing jig 501 and the receiving jig 502, and the terminal 50 may be bent by contacting the bending jig 503 with the portion where the recessed portion 57 is not formed. Even in such a case, the pressing jig 501 and the receiving jig 502 are less likely to fall into the bottom surface of the recessed portion 57, so that it is possible to suppress roughening of the joint portion forming region 53a.

Further, in the fourteenth embodiment, in the manufacturing system, the bending device 180 may bend the terminal 50 before forming the first structure 81 by the connecting device 120 , or may bend the terminal 50 after forming the junction 53 . In addition, when the terminal 50 is bent after the bonding portion 53 is formed, it is possible to prevent the unevenness of the bonding portion 53 from being broken.

Furthermore, in the fourteenth embodiment, the recessed portion 57 may be formed into a U-shape in plan view.

(15th Embodiment)

A fifteenth embodiment will be described. In the present embodiment, the step of forming the terminal 50 and the step of forming the joint portion 53 are changed from those of the fourteenth embodiment. The rest is the same as that of the fourteenth embodiment, so the description is omitted here.

In the present embodiment, in the step of bending the terminals 50 , as shown in FIG. 51 , the angles at which the terminals 50 are bent are different. Specifically, when each terminal 50 is viewed from the side surface 50c side, a part of the side surface 50c of each terminal 50 is not overlapped. In other words, when each terminal 50 is observed from the side surface 50c side, a part of the side surface 50c of each terminal 50 can be visually confirmed. That is, the relative heights of the junction forming regions 53a in the respective terminals 50 are made different. In addition, in FIG. 51, although the recessed part 57 is not formed in the terminal 50, the recessed part 57 may be formed in the terminal 50.

In addition, in the step of forming the bonding portion 53 , as in the twelfth embodiment, the laser beam is irradiated from the normal direction of each of the surfaces 50 a to 50 d of the terminal 50 . At this time, when the laser beam is irradiated from the side surfaces 50c and 50d of the terminal 50, the laser beam can be prevented from being cut off by the mutual terminals 50 by irradiating the area A in FIG. 51 with the laser beam. Therefore, it can be suppressed that the joint portion 53 having appropriate unevenness is not formed.

Further, after the step of forming the joint portion 53 , the step of forming the connector housing 40 may be performed by appropriately performing a bending step such that the respective terminals 50 have the same angle.

As described above, in the present embodiment, when viewed from the side surfaces 50c and 50d, parts of the side surfaces 50c and 50d are not overlapped. And in this state, a laser beam is irradiated, and the joining part 53 is formed. Therefore, even if the laser beam is irradiated from a direction normal to each of the surfaces 50a to 50d of the terminal 50 when the joint portion 53 is formed, the laser beam is not interrupted by the mutual terminals 50, and it is possible to suppress that the joint portion 53 is not formed. Happening. Therefore, it is possible to suppress a decrease in the bondability between the connector housing 40 and the engaging portion 53 .

(Variation of the fifteenth embodiment)

A modification of the fifteenth embodiment will be described. In the fifteenth embodiment described above, the rotation angle sensor in which each terminal 50 is bent has been described, but it can also be applied to a rotation angle sensor in which each terminal 50 is not bent. In this case, for example, the step of extending the terminal 50 may be performed after the joining portion 53 is formed.

(16th embodiment)

A sixteenth embodiment will be described. In this embodiment, the shape of the mounting surface 190 a of the housing member 190 is changed from the first embodiment. The rest is the same as that of the first embodiment, so the description is omitted here.

In this embodiment, as shown in FIG. 52 , the housing member 190 has a housing recess 191 corresponding to the outer shape of the first structure body 81 formed on the mounting surface 190 a. Further, in the housing recessed portion 191 , recessed portions 191 a are formed at respective positions corresponding to the joint portions 53 formed in the terminal 50 when the first structural body 81 is placed. That is, the accommodating member 190 is configured so as not to come into contact with the engaging portion 53 when the first structural body 81 is placed thereon.

In the step of forming the joint portion 53, after the joint portion 53 is formed, as shown in FIG. As a result, it is possible to prevent the joint portion 53 from contacting the accommodating member 190 and breaking the unevenness.

As described above, in the present embodiment, the housing member 190 is formed with the recessed portion 191 a so as not to abut against the engaging portion 53 when the first structural body 81 is placed. Therefore, when the first structural body 81 is placed on the accommodating member 190 , it can be suppressed that the unevenness constituting the joint portion 53 is broken. Therefore, it is possible to suppress deterioration of the bondability between the connector housing 40 and the terminal 50 .

(Variation of the sixteenth embodiment)

A modification of the sixteenth embodiment will be described. In the sixteenth embodiment, the description has been given after the joint portion 53 is formed, but the above-described housing member 190 can also be applied to the terminal 50 or the first structure 81 before the joint portion 53 is formed. Thereby, deformation and the like of the bonding portion forming region 53a in the terminal 50 due to adhesion of foreign matter and the like are suppressed. Therefore, it is possible to suppress that the joint portion 53 having appropriate unevenness is not formed.

(17th embodiment)

A seventeenth embodiment will be described. In this embodiment, the conveying device 185 and the like are changed with respect to the first embodiment. The rest is the same as that of the first embodiment, so the description is omitted here.

First, in each of the above-described embodiments, the manufacturing system for forming the junction portion 53 by the junction portion forming device 140 after the first structure 81 is formed by connecting the mold IC 10 and the terminal 50 by the connecting device 120 has been described. However, as shown in FIG. 54 , the manufacturing system may connect the mold IC 10 and the terminal 50 with the connecting device 120 after the bonding portion 53 is formed on the terminal 50 by the bonding portion forming device 140 .

In this case, if the terminal 50 in which the junction part 53 is formed is conveyed by the conveying device 185 constituted by a conveyor or the like, the unevenness of the junction part 53 may be broken.

Therefore, in the present embodiment, as shown in FIG. 55 , the conveying device 185 is configured to include two holding jigs 511 having a pair of holding parts 511 a for holding and holding the terminals 50 . In addition, the two holding jigs 511 respectively hold and hold a portion of the terminal 50 that is different from the engaging portion 53 and located on the opposite side across the engaging portion 53 . Therefore, in the conveying apparatus 185 of the present embodiment, the terminal 50 can be conveyed without making the joint portion 53 abut the conveying apparatus 185 .

As described above, the junction portion 53 may be formed on the terminal 50 before the formation of the first structure 81 . In this case, by using the holding jig 511 that grips and holds a portion different from the joint portion 53 after the joint portion 53 is formed, it is possible to prevent the unevenness of the joint portion 53 from being broken. Therefore, it is possible to suppress deterioration of the bondability between the connector housing 40 and the engaging portion 53 .

(Variation of the seventeenth embodiment)

A modification of the seventeenth embodiment will be described. In the seventeenth embodiment, as shown in FIG. 56, the terminal 50 may be sandwiched by one holding jig 511 having a pair of holding portions 511a. In this case, it is sufficient to form the recessed portion 511b in the holding jig 511, and to arrange the engaging portion 53 in the recessed portion 511b. Even in this way, the joint portion 53 can be suppressed from being broken.

In addition, in the seventeenth embodiment, the description has been given after the joint portion 53 is formed, but the terminal 50 before the joint portion 53 is formed may be held by the holding jig 511 so as not to be formed with the joint portion where the joint portion 53 is formed. The area 53a abuts. Thereby, it is suppressed that the junction part formation area|region 53a in the terminal 50 adheres to a foreign material, and deforms. Therefore, it can be suppressed that the joint portion 53 having appropriate unevenness is not formed.

(18th embodiment)

An eighteenth embodiment will be described. In this embodiment, the structure of the accommodating member 190 that accommodates the first structural body 81 in which the junction portion 53 is formed is changed from the first embodiment. The rest is the same as that of the first embodiment, so the description is omitted here.

First, in the above-described first embodiment, an example in which the first structure 81 is placed on the accommodating member 190 after the first structure 81 is formed by the connection device 120 has been described. In this case, as shown in FIG. 57, if the accommodating member 190 is composed of a material containing a plasticizer 192a or a mold release agent 192b, the plasticizer 192a or the mold release agent 192b is densely packed on the mounting surface 190a, and there is a possibility that Attached to the engaging portion 53 . Furthermore, if the plasticizer 192a, the mold release agent 192b, or the like adheres to the joint portion 53, there is a possibility that the bondability between the connector housing 40 and the joint portion 53 may decrease.

Therefore, in this embodiment, as shown in FIG. 58, the housing member 190 is made of resin which does not contain the plasticizer 192a and the mold release agent 192b. That is, in the present embodiment, the accommodating member 190 is made of a non-contaminating material that does not have exudation properties. Therefore, when the first structure 81 is placed in the housing member 190 , the plasticizer 192 a and the mold release agent 192 b can be suppressed from adhering to the joint portion 53 .

As described above, in the present embodiment, the housing member 190 is made of resin that does not contain the plasticizer 192a and the mold release agent 192b. Therefore, the plasticizer 192 a and the mold release agent 192 b can be suppressed from adhering to the joint portion 53 , and it is possible to suppress deterioration of the bondability between the connector housing 40 and the joint portion 53 .

(Variation of the eighteenth embodiment)

A modification of the eighteenth embodiment will be described. In the eighteenth embodiment, the housing member 190 may be formed of paper instead of resin. However, when it consists of paper, as shown in FIG. 59, the paper dust 192c may adhere to the mounting surface 190a. In this case, if the scraps of paper 192c are attached to the joint portion 53, it will cause the bondability between the connector housing 40 and the joint portion 53 to decrease. Therefore, when the mounting surface 190a of the accommodating member 190 is made of paper, as shown in FIG. 60, it is preferable to perform a paper dust removal process. In addition, the paper dust removal process is performed by, for example, blowing, brushing, or the like.

Furthermore, in the above-mentioned eighteenth embodiment, the housing member 190 after the joining portion 53 is formed has been described, but it can also be applied before the joining portion 53 is formed. That is, the terminal 50 or the first structure 81 may be accommodated in the accommodation member 190 from before the joining portion 53 is formed. In this case, it is possible to prevent foreign matter from adhering to the junction forming region 53a in the terminal 50 by having the accommodating member 190 having the same structure as described above, and it is possible to prevent that the junction 53 having appropriate unevenness is not formed.

Moreover, when forming the junction part 53 in the terminal 50 before forming the 1st structure 81, as shown in FIG. Specifically, the accommodating member 193 has a protective member 193a and a protective sheet 193b formed in a roll shape, and the terminal 50 is sandwiched between the protective member 193a and the protective sheet 193b to protect the terminal 50 while holding it. In this case, for example, the protective member 193a and the protective sheet 193b are made of paper, and each surface is subjected to a paper dust removal process, whereby the adhesion of foreign matter to the joint portion 53 can be suppressed.

(19th embodiment)

A nineteenth embodiment will be described. In the present embodiment, compared with the first embodiment, a protective jig is used in the step of connecting the mold IC 10 and the terminal 50 . The rest is the same as that of the first embodiment, so the description is omitted here.

In the present embodiment, as shown in FIG. 62 , the step of forming the first structure 81 by joining the mold IC 10 and the terminal 50 is performed using the protective jig 520 provided in the connection device 120 . The protection jig 520 includes a first jig 521 having one surface 521a, and a second jig 522 having a recess 522b formed on the side of the surface 522a facing the first jig 521 .

Furthermore, in the step of forming the first structure 81 , first, the mold IC 10 and the terminal 50 are arranged so that the other end side of the terminal portion 11 a and the terminal 50 is located in the recessed portion 522 b of the protective jig 520 . At this time, the engaging portion forming region 53a in the terminal 50 is positioned outside the recessed portion 522b. That is, the junction forming region 53 a and the portion where caulking is performed are demarcated by the protection jig 520 . In addition, in the step of forming the first structure 81 , the other end of the terminal 50 is crimped in the recessed portion 522b, whereby the terminal portion 11a and the terminal 50 are electrically and mechanically connected.

At this time, the metal particles 523 may be scattered due to the caulking, but the metal particles 523 hardly reach the junction forming region 53 a due to the protective jig 520 . Therefore, the metal particles 523 are suppressed from adhering to the junction forming region 53a.

As described above, in the present embodiment, the step of forming the first structure 81 is performed in the protective jig 520 that is partitioned from the junction portion forming region 53a. Therefore, the metal particles 523 that may occur when the other end of the terminal 50 is caulked can be suppressed from adhering to the junction forming region 53a. Therefore, it is possible to suppress that the bonding portion 53 having appropriate unevenness is not formed when the bonding portion 53 is formed by irradiating the laser beam to the bonding portion forming region 53 a, and it is possible to suppress deterioration of the bondability between the connector housing 40 and the bonding portion 53 .

In addition, the first jig 521 and the second jig 522 may also be used as electrodes. That is, the first structure 81 may be configured by thermal caulking in which the caulking process is performed by the first jig 521 and the second jig 522 while passing an electric current.

(Variation of the nineteenth embodiment)

A modification of the nineteenth embodiment will be described. In the above-mentioned nineteenth embodiment, the example in which the terminal portion 11 a and the terminal 50 are connected by crimping has been described. However, the terminal portion 11a and the terminal 50 may be joined by resistance welding or the like. In this case, for example, as shown in FIG. 63 , the first jig 521 may be provided with the first electrode 524 and the second jig 522 may be provided with the second electrode 525 . In this way, since the metal particles 523 are also scattered when the terminal portion 11a and the terminal 50 are connected by resistance welding, the metal particles 523 can be prevented from adhering to the junction forming region 53a by performing this in the protective jig 520 .

(Twentieth Embodiment)

A twentieth embodiment will be described. In the present embodiment, the steps of forming the joint portion 53 and the like are changed from the fourteenth embodiment. The rest is the same as that of the fourteenth embodiment, so the description is omitted here.

The rotation angle sensor of the present embodiment is the same as that of FIG. 47 described in the above-mentioned fourteenth embodiment. That is, the terminal 50 is in a state in which one end side is bent.

Next, the step of bending the terminal 50, the step of forming the joint portion 53, and the inspection step of the present embodiment will be described. In the present embodiment, in the step of bending the terminal 50, as shown in FIGS. 64A and 64B , the bending holding jig 530 provided in the bending device 180 is used.

The bending holding jig 530 includes a pair of a first jig 531 and a second jig 532 . The first jig 531 has a first fulcrum surface 531a which is a flat surface, and a first action point surface 531b which is a flat surface inclined with respect to the first fulcrum surface 531a. A first opening 531c through which the first jig 531 penetrates is formed therebetween. The second jig 532 has a second fulcrum surface 532a which is a flat surface, and a second action point surface 532b which is a flat surface inclined with respect to the second fulcrum surface 532a, between the second fulcrum surface 532a and the second action point surface 532b A second opening 532c through which the second jig 532 penetrates is formed therebetween.

Moreover, the 1st jig|tool 531 and the 2nd jig|tool 532 are arrange|positioned so that the mutual fulcrum surface 531a, 532a and the mutual action point surface 531b, 532b may oppose. More specifically, the first jig 531 and the second jig 532 are configured and arranged so that the mutual fulcrum surfaces 531a and 532a are parallel to each other and the mutual action point surfaces 531b and 532b are parallel to each other.

In addition, in FIG. 64A, the part which has the 1st fulcrum surface 531a and the part which has the 1st action point surface 531b are shown separately, but in the cross section different from FIG. 64A, each part is connected. Similarly, in FIG. 64A, the part having the second fulcrum surface 532a and the part having the second action point surface 532b are shown separately, but in a cross section different from that in FIG. 64A, the second fulcrum surface 532a and the second action point The face 532b is joined.

Then, when the terminal 50 is bent, the first jig 531 and the second jig 532 are arranged so as to sandwich the terminal 50 . Then, as shown in FIG. 64B , for example, by displacing the second jig 532 to the first jig 531 side, and pressing the terminal 50 with the second action point surface 532b, the terminal 50 is bent along the second action point surface 532b. Angle. Then, the terminal 50 is held by the first jig 531 and the second jig 532 .

Next, in the step of forming the joint portion 53 , the terminal 50 is irradiated with a laser beam while the terminal 50 is held by the bending holding jig 530 . Specifically, as shown in FIG. 65 , the joining portion 53 is formed by irradiating a laser beam through the first opening 531 c formed in the first jig 531 and the second opening 532 c formed in the second jig 532 . That is, in the present embodiment, the bending holding jig 530 is initially equipped in the bending device 180 , but is carried into the joint portion forming device 140 by the conveying device 188 as it is.

Next, although not particularly shown, in the step of inspecting the joint portion 53 , the joint portion 53 is inspected in the state where the terminal 50 is held by the bending holding jig 530 . Specifically, the inspection of the joint portion 53 is performed through the first opening portion 531 c formed in the first jig 531 and the second opening portion 532 c formed in the second jig 532 .

As described above, in the present embodiment, the step of forming the junction portion 53 and the step of inspecting the junction portion 53 are performed while the terminal 50 is held by the bending holding jig 530 used in the step of bending the terminal 50 . Therefore, compared to the case where, for example, different jigs are used to hold the terminals 50 in each process, the process of changing the jig is not required, and simplification can be achieved.

(Twenty-first embodiment)

A twenty-first embodiment will be described. In this embodiment, the terminal 50 is heated before the connector housing 40 is formed, as compared with the first embodiment. The rest is the same as that of the first embodiment, so the description is omitted here.

In the present embodiment, in the step of forming the connector housing 40 , as shown in FIGS. 10A and 10B , after the second structure 82 is placed in the mold 300 , the molten resin 40 a is poured into the cavity 330 . The process of heating the terminal 50 is performed before the inflow. This heating process is performed at 200 degreeC for 5 minutes, for example. Then, the molten resin 40a is poured into the cavity 330, and the connector housing 40 is formed.

As described above, in the present embodiment, the terminal 50 is heated before the molten resin 40 a flows into the chamber 330 . Therefore, when the molten resin 40a is poured into the cavity 330 and the molten resin 40a contacts the terminal 50, the temperature of the molten resin 40a is less likely to drop, and the inflow of the molten resin 40a to the joint portion 53 can be suppressed from being hindered. Therefore, it is possible to suppress deterioration of the bondability between the connector housing 40 and the engaging portion 53 .

(Other Embodiments)

The present disclosure has been described based on the embodiment, but it should be understood that the present disclosure is not limited to the embodiment and the structure. The present disclosure also includes various modifications and modifications within an equivalent range. In addition, various combinations and forms, and other combinations and forms including only one element in them, or more or less than that, also fall within the scope or range of ideas of the present disclosure.

For example, in each of the above-described embodiments, the rotation angle sensor has been described as an example, but each of the embodiments can also be applied to a pressure sensor.

In addition, in each of the above-described embodiments, the terminal 50 may also be exposed from the casing 40 on the other end side connected to the sensor unit 10 as shown in, for example, FIGS. 66A to 66C . In this case, as shown in FIGS. 66A and 66B , as long as the sensor unit 10 has a structure including the sensor chip 12 , it does not need to be covered with the mold resin 14 , and does not have to include the lead frame 11 . That is, the sensor unit 10 may be configured to have at least the sensor chip 12 .

In addition, in each of the above-described embodiments, the metal thin film 62 may not be a metal thin film formed by plating. For example, the metal thin film 62 may be formed by vapor deposition or the like.

Furthermore, in each of the above-described embodiments, the terminal 50 has been described as having a quadrangular pole shape. However, the terminal 50 may be, for example, a cylindrical rod shape, or a square pole shape other than a quadrangular pole.

In addition, in each of the above-described embodiments, an example in which the manufacturing system includes various apparatuses 100 to 180 has been described, but not all apparatuses may be provided, as long as at least the joint portion forming apparatus 140 and the connector housing forming apparatus 170 are provided. can. For example, in the above-mentioned manufacturing system, the mold IC manufacturing apparatus 100 may not be provided, and the mold IC 10 manufactured in another process may be carried in. In addition, in the manufacturing system of each of the above-described embodiments, when not all the apparatuses are provided, the apparatuses that are not provided can be appropriately changed in each of the embodiments.

Furthermore, in each of the above-described embodiments, when another metal member is provided in place of or in addition to the terminal 50 , the above-described junction portion 53 can be formed on the metal member. Moreover, as another metal member, the structural parts, such as a metal case, are mentioned, for example. In addition, when replacing the connector housing 40 or covering the metal member with another resin member, the same structure as the connector housing 40 can be appropriately adopted for the other resin member.

Furthermore, it is needless to say that each of the above-described embodiments can be appropriately combined. For example, in each of the above-described embodiments, one end portion side of the terminal 50 may be bent as in the above-described fourteenth embodiment. In this case, as shown in FIG. 47 , the engaging portion 53 may also be formed at a portion of the terminal 50 that is bent and covered by the connector housing 40 . In addition, even when the one end portion side of the terminal 50 is bent, the joint portion 53 may be formed at a portion of the terminal 50 that is not bent.

Claims (51)

1. A resin molded body, a metal member (50) is covered with a resin member (40) made of a resin material in a state where a part of the metal member is exposed,

the resin molded article includes:

the above-described metal member; and

a resin member covering the metal member with a part of the metal member exposed;

a joining section (53) formed of an uneven surface having a 1 st uneven surface (71) and a 2 nd uneven surface (72) formed at a position including a surface of the 1 st uneven surface and having a smaller height difference than the 1 st uneven surface is formed in a portion of the metal member covered with the resin member;

the resin member is joined to the joint portion by the resin material entering the unevenness.

2. The resin molded body according to claim 1,

the metal member has a base (61) and a metal thin film (62) formed on the surface of the base;

the substrate is made of an alloy or a pure metal containing at least 1 of copper, iron, and aluminum as a main component;

the metal thin film is composed mainly of at least 1 of gold, tin, nickel, palladium, silver, and copper;

the joint portion is formed on the metal thin film.

3. The resin molded body according to claim 1 or 2,

the resin member is made of polyphenylene sulfide, polybutylene terephthalate, epoxy resin, polyamide, liquid crystal polymer, polyurethane, or silicone.

4. The resin molded body according to any one of claims 1 to 3,

the height of the 1 st unevenness is 0.5 to 50 μm.

5. The resin molded body according to any one of claims 1 to 4,

the height of the 2 nd concavoconvex is 0.5 to 500 nm.

6. The resin molded body according to any one of claims 1 to 5,

the metal component is provided with a plurality of columnar metal terminals which extend along one direction;

the plurality of metal terminals are arranged along a direction intersecting the one direction, and have portions having relatively different heights in the intersecting direction;

the engaging portions are formed at the portions of the plurality of metal terminals where the heights are relatively different, respectively.

7. A method for manufacturing a resin molded article in which a metal member (50) is covered with a resin member (40) made of a resin material in a state where a part of the metal member is exposed,

the method for producing the resin molded body comprises the following steps:

preparing the metal component; and

forming the resin member covering the metal member in a state where a part of the metal member is exposed;

before forming the resin member: forming a joint portion (53) composed of irregularities on a portion of the metal member to be covered with the resin member, the irregularities having a 1 st irregularity (71) and a 2 nd irregularity which is formed at a position including a surface of the 1 st irregularity and has a smaller level difference than the 1 st irregularity;

in forming the resin member, the joining portion is joined to the resin member.

8. The method for producing a resin molded article according to claim 7,

the joining portion is formed by irradiating a laser beam to a joining portion forming region (53a) of the metal member.

9. The method for producing a resin molded article according to claim 8,

the junction is formed at a wavelength of 0.2 to 11 μm and an energy density of 100J/cm²The laser beam having a pulse width of 1 μ s or less is irradiated onto the bonding portion forming region to form the bonding portion.

10. The method for producing a resin molded article according to claim 8,

when the diameter of the irradiation spot (S) of the laser beam is x and the distance between the centers of the adjacent irradiation spots is y, the laser beam is irradiated to the joint forming region so that y is less than or equal to 20x, thereby forming the joint.

11. The method for producing a resin molded article according to any one of claims 8 to 10,

preparing a plurality of metal terminals as the metal member, the plurality of metal terminals extending in one direction and having a columnar shape, the plurality of metal terminals being arranged in a direction intersecting the one direction;

preparing a plurality of metal terminals, wherein T/L is less than or equal to 10, when L is an interval between adjacent metal terminals and T is a thickness of the metal terminals in a direction perpendicular to the interval;

the laser beam is irradiated while the plurality of metal terminals are inclined, and the joint portion is formed so as to be circumferentially wound around the axial direction with the extending direction of the metal terminals as the axial direction.

12. The method for producing a resin molded article according to any one of claims 8 to 10,

in preparing the metal member, the following steps are carried out: preparing a plurality of metal terminals as the metal member, the plurality of metal terminals extending in one direction and being columnar, the plurality of metal terminals being arranged in a direction intersecting the one direction;

preparing the plurality of metal terminals, which are relatively different in height in the intersecting direction, among the plurality of metal terminals;

the laser beam irradiation includes irradiating the portions having the relatively different heights with the laser beam in the intersecting direction, thereby forming the joint portion that is formed around the axial direction with the extending direction of the metal terminal as the axial direction.

13. The method for producing a resin molded article according to any one of claims 8 to 10,

in preparing the metal member, the following steps are carried out: preparing a plurality of metal terminals as the metal member, the plurality of metal terminals extending in one direction and being columnar, the plurality of metal terminals being arranged in a direction intersecting the one direction;

when the laser beam is irradiated, the metal terminal is extended in an axial direction, and a portion of the metal terminal including the joint portion forming region is twisted around the axial direction, and the laser beam is irradiated, whereby the joint portion is formed so as to make one turn around the axial direction.

14. A sensor unit (10) for outputting a sensor signal corresponding to a physical quantity is electrically connected to a metal terminal (50) covered with a case (40),

the physical quantity sensor includes:

the sensor unit outputs the sensor signal;

the metal terminal, electrically connected to the sensor unit, having a portion extending in one direction; and

a case that covers at least the metal terminal in a state where at least one end portion of the metal terminal opposite to the end portion of the sensor unit connected thereto is exposed;

a joint portion (53) is formed between the end portion of the metal terminal on the side of being covered by the housing and connected to the sensor unit and the one end portion, the joint portion (53) being formed of a concave-convex shape, and a surface of the metal terminal is wound around the axial direction by one turn with the extending direction of the metal terminal being the axial direction;

the case is made of a resin material, and is joined to the joint portion by the resin material entering the unevenness.

15. The physical quantity sensor according to claim 14,

the thickness of a portion of the case covering the joint portion of the metal terminal is thinner than the thickness of at least a portion of the case covering a region of the metal terminal other than the joint portion.

16. The physical quantity sensor according to claim 15,

the housing has a recess (42) formed in a portion of an outer wall surface of the housing that faces the joint.

17. The physical quantity sensor according to claim 15,

the housing is formed with a through hole (43) penetrating the housing at a portion between the outer wall surface of the housing and the joint portion.

18. The physical quantity sensor according to any one of claims 14 to 17,

the thickness of the portion of the case covering the region of the metal terminal closer to the one end than the joint portion is thinner than the thickness of the portion of the case covering the joint portion.

19. The physical quantity sensor according to any one of claims 14 to 18,

the thickness of a portion of the case covering a region of the metal terminal on a side connected to the sensor unit with respect to the joint portion is thinner than the thickness of a portion of the case covering the joint portion of the metal terminal.

20. The physical quantity sensor according to any one of claims 14 to 19,

the metal terminal is provided with bubble forming parts (56 a-56 c);

the housing forms air bubbles (45) around the air bubble forming portion at a portion different from a portion covering the joint portion.

21. The physical quantity sensor according to any one of claims 14 to 20,

a cap (30) for accommodating the sensor unit;

the housing covers the cap and also engages the cap.

22. A method for manufacturing a physical quantity sensor in which a sensor cell (10) that outputs a sensor signal corresponding to a physical quantity is electrically connected to a metal terminal (50) covered with a case (40),

the method for manufacturing the physical quantity sensor includes:

preparing the sensor unit;

preparing the metal terminal having a portion extending in one direction;

forming a structure (81) by electrically connecting the sensor unit and the metal terminal;

preparing a mold (300) which is provided with a cavity (330) configured with the structure and enables molten resin (40a) to flow into the cavity from an injection gate (340);

disposing the structure in the chamber; and

forming the housing in which at least one end of the metal terminal opposite to an end of the metal terminal connected to the sensor unit is exposed and covered by the molten resin by flowing the molten resin into the cavity from the injection gate and solidifying the molten resin;

before forming the housing: forming a joint portion (53) on the metal terminal, wherein the joint portion (53) is formed by concave-convex, and the surface of the metal terminal is wound by one circle around the axial direction by taking the extending direction of the metal terminal as the axial direction;

the housing is formed such that the engaging portion is engaged with the housing.

23. The manufacturing method of a physical quantity sensor according to claim 22,

in the case, a thickness of a portion of the case covering the joint portion of the metal terminal is thinner than a thickness of at least a portion of the case covering a region of the metal terminal different from the joint portion.

24. The manufacturing method of a physical quantity sensor according to claim 22 or 23,

preparing a structure in which the injection gate is formed in the mold, the injection gate being formed in a portion different from a portion facing the joint portion when the structural body is disposed;

in the forming of the housing, the housing is formed such that a portion covering a region on a downstream side in a flow direction of the molten resin with respect to the joint portion is thinner than a portion covering the joint portion, of a portion covering the metal terminal.

25. The method for manufacturing a physical quantity sensor according to any one of claims 22 to 24,

preparing a structure in which the injection gate is formed in the mold, the injection gate being formed at a portion different from a portion facing the joint portion when the structural body is disposed;

in the forming of the housing, the housing is formed such that a portion of the portion covering the metal terminal, which covers a region on an upstream side in a flow direction of the molten resin with respect to the joint portion, is thinner than a portion of the portion covering the joint portion.

26. The method of manufacturing a physical quantity sensor according to any one of claims 22 to 25,

preparing a structure in which bubble forming portions (56 a-56 c) are formed on the metal terminals as the structure before the structure is disposed;

in forming the housing, when the molten resin is caused to flow in from the injection gate, the bubble forming portion is in a state of being caught by air, and the housing in which bubbles (45) are formed around the bubble forming portion is formed.

27. The method for manufacturing a physical quantity sensor according to any one of claims 22 to 26,

after the structure is arranged and before the case is formed, the metal terminal in the structure is heated.

28. An insert member, a metal member (50) is covered with a resin member (40) made of a resin material in a state where a part of the metal member is exposed,

the insertion member includes the metal member;

the metal member includes: a base (61) made of a metal material, and a metal thin film (62) formed on the surface of the base;

the metal thin film is formed with a joining portion (53) formed of projections and recesses to be joined to the resin member at a portion covered with the resin member.

29. The insert member according to claim 28,

the thickness of the portion of the metal thin film where the joint is formed is larger than the thickness of the portion of the metal thin film different from the portion where the joint is formed.

30. The insert part of claim 28 or 29,

a plurality of convex parts (58a, 58b) are formed on the metal component at the part covered by the resin component;

the joint portion is formed to include a portion located between the convex portions.

31. The insert of any one of claims 28 to 30,

a recess (57) is formed in a portion of the metal member covered with the resin member;

the engaging portion is formed to include a portion in the recessed portion.

32. The insert member according to claim 31,

the metal component has a surface (50a) extending in one direction;

the recessed portion has a portion that is inclined with respect to an imaginary line that is orthogonal to the direction in which the one surface extends and that is along the surface direction of the one surface.

33. A method for manufacturing an insert member, in which a metal member (50) is covered with a resin member (40) made of a resin material in a state where a part of the metal member is exposed,

the method for manufacturing the insert member includes:

preparing a metal plate (90);

forming a base body (61) from the metal plate; and

forming a metal thin film (62) on a surface of the base to form the metal member;

after the metal member is constructed: a laser beam is irradiated to a portion of the metal thin film covered with the resin member to form a joint portion (53) having a concave-convex structure.

34. The method of manufacturing an insert member according to claim 33,

in the metal member, the metal thin film is formed so that a thickness of a portion of the metal thin film where the joint portion is formed is larger than a thickness of a portion of the metal thin film different from the portion where the joint portion is formed.

35. The method of manufacturing an insert member according to claim 33 or 34,

in forming the above matrix: press-forming the metal plate, and dressing the press-formed work surface (61 a).

36. The method of manufacturing an insert member according to claim 33 or 34,

in forming the base, the metal plate is fine-blanked to form the base.

37. The method of manufacturing an insert member according to any one of claims 33 to 36,

the method for manufacturing the insert member includes:

a surface (50a) extending in one direction, the surface being formed with a recess (57) having a portion inclined with respect to an imaginary line perpendicular to the direction in which the surface extends and along the surface direction of the surface;

a jig (503) is brought into contact with the one surface to bend the metal member.

38. A system for manufacturing a resin molded body, wherein a metal member (50) of the resin molded body is covered with a resin member (40) made of a resin material in a state where a part of the metal member is exposed,

the system for manufacturing the resin molded body comprises:

a metal member forming device (110) for forming the metal member;

a joint forming device (140) for forming a joint (53) formed by concave and convex on the metal member; and

a resin member molding device (170) that forms the resin member so as to expose a portion of the metal member and cover a portion of the metal member including the joint;

the joint portion is formed by the joint portion forming device before the resin member is formed by the resin member forming device.

39. The system for manufacturing a resin molded body according to claim 38,

a conveying device (182-188) for conveying the metal component between the metal component forming device and the resin component forming device;

the conveying device conveys the metal parts in a state that the joint parts of the metal parts or joint part forming areas (53) of the metal parts forming the joint parts are not in contact with the conveying device.

40. The system for manufacturing a resin molded body according to claim 39,

the conveying device is provided with a containing component (190) for placing the metal component;

the housing member has a recess (191a) formed at a position corresponding to the joint portion or a position corresponding to the joint portion forming region.

41. The system for manufacturing a resin molded body according to claim 39,

the conveying device is provided with a holding clamp (511) for holding and holding the metal component;

the holding jig holds and holds a portion different from the joint portion or the joint portion forming region.

42. The system for manufacturing a resin molded body according to claim 38,

a conveying device (182-188) for conveying the metal component between the metal component forming device and the resin component forming device;

the conveying device conveys the metal parts in a state that a non-polluting surface is in contact with the joint parts of the metal parts or joint part forming areas (53) of the metal parts, where the joint parts are formed.

43. The system for manufacturing a resin molded body according to claim 42,

the conveying device is provided with a containing component (190) for placing the metal component;

the housing member is configured to contain no exudative substance.

44. The system for manufacturing a resin molded body according to claim 42,

the conveying device is provided with accommodating components (190, 193) made of paper;

the surface of the housing member that abuts the joint or joint forming region of the metal member is subjected to paper dust removal processing.

45. The system for manufacturing a resin molded body according to any one of claims 38 to 44,

a joining device (120) for joining the metal member to a metal member (11a) different from the metal member before the resin member is formed by the resin member forming device;

the joining device has a protection jig (520) for dividing a position where the two metal members are joined and the joining portion or a joining portion forming region (53a) where the joining portion is formed.

46. The system for manufacturing a resin molded body as defined in any one of claims 38 to 45,

a bending device (180) for bending the metal member before the resin member is formed by the resin member forming device;

the bending device is provided with a bending holding clamp (530) for bending the metal component;

the joint forming device forms the joint in a state where the metal member is held by the bending holding jig.

47. A method for manufacturing a resin molded article in which a metal member (50) is covered with a resin member (40) made of a resin material in a state where a part of the metal member is exposed,

the method for producing the resin molded body comprises the following steps:

preparing the metal component; and

a resin member formed to cover the metal member with a part of the metal member exposed;

before the resin member is formed, a joint portion (53) formed of projections and recesses is formed in a portion of the metal member covered with the resin member.

48. The method of manufacturing a resin molded body according to claim 47,

before or after the joint is formed, the metal member is conveyed in a state where a joint forming region (53a) where the joint is formed or the joint is not in contact with a conveying device (182-188) for conveying the metal member.

49. The method of manufacturing a resin molded body according to claim 47,

before or after the joint is formed, the metal member is conveyed in a state where a joint forming region (53a) where the joint is formed or the joint is in contact with a non-contaminating surface of a conveying device (182-188) for conveying the metal member.

50. The method for producing a resin molded article according to any one of claims 47 to 49,

before forming the resin member: joining the metal member with a metal member (11a) different from the metal member;

in the joining, the joining is performed in a state where a portion where the two metal members are joined and the joining portion or a joining portion forming region (53a) where the joining portion is formed are partitioned.

51. The method for producing a resin molded article according to any one of claims 47 to 50,

before forming the resin member: bending the metal member using a bending holding jig (530);

the forming of the joint portion is forming the joint portion in a state where the metal member is held by the bending holding jig.

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