CN111565279A - Camera module and electronic equipment - Google Patents

Abstract

The invention discloses a camera module and electronic equipment, wherein the camera module comprises a lens component, a sensor component and an optical filter; the lens assembly comprises a base and a lens, the base is provided with a cavity, and the lens is arranged in the cavity; the sensor assembly comprises a circuit board, a photosensitive chip and a golden finger group, the photosensitive chip is arranged at the first end of the circuit board and is contained in the cavity, and the golden finger group is arranged at the second end of the circuit board; the optical filter is arranged in the cavity, and the optical filter, the lens and the light sensing chip are communicated in an optical path. According to the invention, the golden finger group is adopted to replace the traditional connector, so that the assembly process is simplified, and the cost of the golden finger group is far lower than that of the connector, so that the manufacturing cost of the camera module can be further saved.

Description

Camera module and electronic equipment

technical field

The present invention relates to the technical field of cameras, in particular to a camera module and an electronic device.

Background technique

With the continuous progress of electronic technology and the rapid development of mobile communications, portable electronic devices such as mobile phones are becoming more and more popular in people's lives, and as a portable intelligent electronic device, a camera is one of the indispensable standard equipment. At the same time, as consumers are becoming more and more demanding about the camera effect, the pixel requirements for mobile phone cameras are also getting higher and higher. However, while the pixels of mobile phone cameras are increasing, the cost of camera modules is also getting higher and higher, and the corresponding mobile phone prices It will also increase accordingly, so it will have a certain impact on mobile phone sales.

SUMMARY OF THE INVENTION

The main purpose of the present invention is to provide a camera module and an electronic device to solve the problem of high cost of the existing camera module.

In order to achieve the above object, a camera module proposed by the present invention, the camera module includes:

a lens assembly, the lens assembly includes a base and a lens, the base is provided with a cavity, and the lens is installed in the cavity;

A sensor assembly, the sensor assembly includes a circuit board, a photosensitive chip and a gold finger set, the photosensitive chip is arranged on the first end of the circuit board and is accommodated in the cavity, and the gold finger set is arranged on the the second end of the circuit board;

The optical filter is arranged in the cavity, and the optical path of the optical filter, the lens and the photosensitive chip is connected.

Preferably, the circuit board includes a first substrate, a flexible board and a second substrate that are connected in sequence, the photosensitive chip is arranged on the first substrate, the gold finger group is arranged on the second substrate, so The photosensitive chip is arranged on the same side as the golden finger group.

Preferably, the second substrate extends in a direction away from the flexible board, the gold finger group includes multiple rows of gold fingers, each row of the gold fingers extends in the same direction as the second substrate, and the multiple rows of the gold fingers extend in the same direction as the second substrate. The gold fingers are arranged at intervals along the extending direction perpendicular to the second substrate.

Preferably, the plurality of rows of the gold fingers are evenly spaced along the extending direction perpendicular to the second substrate, and the interval between any two adjacent rows of the gold fingers is 2 mm˜3 mm.

Preferably, a hard insulating sheet is further provided on the side of the first substrate away from the base, the rigid insulating sheet is arranged corresponding to the base, and the side of the second substrate away from the gold finger group is further provided with a rigid insulating sheet. An insulating glue is provided, and the insulating glue is arranged corresponding to the gold finger group.

Preferably, the base includes a mounting part and a fixing part, the cavity includes a receiving cavity and a mounting cavity, the receiving cavity is communicated with the mounting cavity, the receiving cavity is arranged on the fixing part, and the mounting cavity The cavity is arranged on the installation portion, the lens is arranged in the installation cavity, and the optical filter and the photosensitive chip are both accommodated in the accommodation cavity.

Preferably, the lens includes a lens body and a lens, the lens, the filter and the photosensitive chip are connected in an optical path, and the lens body is detachably connected to the inner wall of the installation cavity.

Preferably, the lens body is provided with an external thread, and the inner side wall of the mounting cavity is provided with an internal thread, so that the lens body is threadedly connected to the inner side wall of the mounting cavity.

Preferably, a plurality of notches are provided at one end of the fixing portion facing away from the circuit board, the plurality of notches are arranged at intervals around the receiving cavity, and the directions of the notches are away from the circuit board.

In addition, the present invention also provides an electronic device, the electronic device includes the above-mentioned camera module.

In the technical solution of the present invention, a cavity is opened at the base of the lens assembly, the lens is installed in the cavity, the circuit board in the sensor assembly is disposed under the base corresponding to the base, the photosensitive chip is disposed on the first end of the circuit board, and the photosensitive chip is disposed on the first end of the circuit board. The chip is accommodated in the cavity, and an optical filter is also arranged in the cavity. The optical filter is disposed corresponding to the side of the lens facing the circuit board, so that the optical filter, the photosensitive chip and the optical path of the lens are communicated. The light ingested from the outside enters the filter in the cavity through the lens, and part of the light filtered by the filter is received by the photosensitive chip, and the optical signal is converted into an electrical signal; and gold is arranged on the second end of the circuit board. The finger group, the gold finger group is connected with the external structure of the electronic device, and converts the electrical signal into a digital signal, and the digital signal is processed to display an image. In the present invention, in the process of assembling the camera module, the golden finger group can be directly integrated with the circuit board, which can simplify the assembly process and reduce the manufacturing cost; The cost of the module is much lower than that of the connector, which can further save the manufacturing cost of the camera module.

Description of drawings

In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can also be obtained according to the structures shown in these drawings without creative efforts.

Fig. 1 is the exploded schematic diagram of the camera module of the present invention;

2 is a schematic top view of the camera module of the present invention;

3 is a schematic front view of the camera module of the present invention;

FIG. 4 is a schematic cross-sectional view of A-A in FIG. 3 of the present invention.

Description of reference numbers:

label name label name 10 lens assembly 122 lens 11 base 20 sensor assembly 111 cavity twenty one circuit board 1111 mounting cavity 211 first substrate 1112 containment cavity 212 soft board 112 Installation Department 213 second substrate 113 Fixed part twenty two Photosensitive chip 12 lens twenty three Gold finger group 121 lens body 231 Goldfinger 1211 thread part 30 filter 1212 bulge 40 gap

The realization, functional characteristics and advantages of the present invention will be further described with reference to the accompanying drawings in conjunction with the embodiments.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relationship between various components under a certain posture (as shown in the accompanying drawings). The relative positional relationship, the movement situation, etc., if the specific posture changes, the directional indication also changes accordingly.

In addition, descriptions such as "first", "second", etc. in the present invention are only for descriptive purposes, and should not be construed as indicating or implying their relative importance or implicitly indicating the number of indicated technical features. Thus, a feature delimited with "first", "second" may expressly or implicitly include at least one of that feature. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise expressly and specifically defined.

In the present invention, unless otherwise expressly specified and limited, the terms "connected", "fixed" and the like should be understood in a broad sense, for example, "fixed" may be a fixed connection, a detachable connection, or an integrated; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be an internal communication between two elements or an interaction relationship between the two elements, unless otherwise explicitly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but must be based on the realization by those of ordinary skill in the art. When the combination of technical solutions is contradictory or cannot be realized, it should be considered that the combination of technical solutions does not exist and is not within the scope of protection claimed by the present invention.

Referring to FIG. 1 , in an embodiment of the present invention, a camera module is provided. The camera module includes a lens assembly 10 , a sensor assembly 20 and a filter 30 . The lens assembly 10 includes a base 11 and a lens 12, the base 11 is provided with a cavity 111, and the lens 12 is installed in the cavity 111; the sensor assembly 20 includes a circuit board 21, a photosensitive chip 22 and a gold finger group 23, and the photosensitive chip 22 is provided with At the first end of the circuit board 21 and accommodated in the cavity 111, the gold finger group 23 is arranged at the second end of the circuit board 21; the filter 30 is arranged in the cavity 111, the filter 30, the lens 12 and the photosensitive The optical path of the chip 22 is connected. In this embodiment, a cavity 111 is opened on the base 11 of the lens assembly 10, the lens 12 is installed in the cavity 111, the circuit board 21 in the sensor assembly 20 is disposed corresponding to the lower part of the base 11, and the photosensitive chip 22 is disposed At the first end of the circuit board 21 and the photosensitive chip 22 is accommodated in the cavity 111, a filter 30 is also arranged in the cavity 111, and the filter 30 is arranged corresponding to the side of the lens 12 facing the circuit board 21, thereby The photosensitive chip 22 and the filter 30 are connected to the optical path of the lens 12 . The lens 12 in the present invention is used to receive external light, and the light ingested from the outside enters the filter 30 through the lens 12, and part of the light filtered by the filter 30 is received by the photosensitive chip 22 on the circuit board 21. The chip 22 converts the optical signal into an electrical signal; and a gold finger group 23 is arranged on the second end of the circuit board 21, and the gold finger group 23 is connected with the external structure of the electronic device, and converts the electrical signal into a digital signal. The image is displayed after processing. Among them, the photosensitive chip 22 is preferably a CMOS (Complementary Metal Oxide Semiconductor) photosensitive element. In the present invention, in the process of assembling the camera module, the golden finger group 23 can be directly integrated with the circuit board 21, which can simplify the assembly process and reduce the manufacturing cost; Since the cost of the gold finger set 23 is much lower than that of the connector, the manufacturing cost of the camera module can be further saved.

As shown in FIG. 1 and FIG. 3 , the circuit board 21 includes a first substrate 211 , a soft board 212 and a second substrate 213 connected in sequence, the photosensitive chip 22 is disposed on the first substrate 211 , and the gold finger group 23 is disposed on the second substrate On 213 , the photosensitive chip 22 is disposed on the same side as the gold finger group 23 . In this embodiment, the circuit board 21 includes a first substrate 211 , a second substrate 213 , and a soft board 212 connecting the first substrate 211 and the second substrate 213 , the middle soft board 212 is made of a flexible material, and the soft board 212 The widths of both are smaller than the widths of the first substrate 211 and the second substrate 213 . When the circuit board 21 is bent, the flexible board 212 in the middle is subjected to the bending force and is not easily broken, which is beneficial to the bending of the first substrate 211 and the second substrate 213 to both sides. The photosensitive chip 22 is disposed on the first substrate 211 , and the gold finger group 23 is disposed on the second substrate 213 . The photosensitive chip 22 and the golden finger group 23 are both set away from the ground, so that the photosensitive chip 22 and the golden finger group 23 can be better protected; and the photosensitive chip 22 and the golden finger group 23 are set on the same side, so that the golden finger group can be 23 is better electrically connected with the photosensitive chip 22, which is beneficial to the transmission of signals. In a preferred embodiment, the circuit board 21 is a flexible circuit board 21 or a rigid-flex circuit board 21 .

As shown in FIG. 2 , the second substrate 213 extends in a direction away from the flexible board 212 , the gold finger group 23 includes multiple rows of gold fingers 231 , each row of gold fingers 231 extends in the same direction as the second substrate 213 , and the multiple rows of gold fingers 231 They are arranged at intervals along the extending direction perpendicular to the second substrate 213 . The plurality of rows of gold fingers 231 are evenly spaced along the extending direction perpendicular to the second substrate 213 , and the interval between any two adjacent rows of gold fingers 231 is 2 mm˜3 mm. In this embodiment, as shown in FIG. 2 , multiple rows of gold fingers 231 are spread along the front and rear directions of the second substrate 213 , and each row of gold fingers 231 extends along the left and right directions, so that each row of gold fingers 231 can be connected to the photosensitive chip 22 . It is electrically connected to better receive the signal of the photosensitive chip 22 . In addition, the spacing between any two adjacent rows of gold finger groups 23 is set to 2 mm to 3 mm. This setting can facilitate the cutting of damaged gold fingers 231 in each row without affecting the use of each row of gold fingers 231 , and The space utilization ratio of this interval setting is high. In other embodiments, the interval between any two adjacent rows of gold fingers 231 can be set according to actual production requirements.

In addition, the side of the first substrate 211 away from the base 11 is also provided with a rigid insulating sheet (not shown), the rigid insulating sheet is provided corresponding to the base 11 , and the side of the second substrate 213 away from the gold finger group 23 is also provided with an insulating sheet glue (not shown in the figure), the insulating glue is set corresponding to the gold finger group 23 . In a preferred embodiment, the side of the first substrate 211 away from the base 11 is pasted with a first rigid insulating sheet through PI glue (polyimide glue), and the first rigid insulating sheet is set corresponding to the position of the base 11; The side of the two substrates 213 facing away from the gold finger group 23 is further affixed with insulating glue, and the insulating glue is disposed corresponding to the position of the gold finger group 23 . The first rigid insulating sheet and the insulating glue respectively play the role of insulating isolation, preventing damage to the photosensitive chip 22 and the gold finger group 23 . Secondly, the grounding resistance value of the first rigid insulating sheet is less than 2 ohms, and the surfaces of the first rigid insulating sheet are respectively subjected to anti-oxidation treatment to prolong the service life. Wherein, the first rigid insulating sheet may preferably be a steel sheet, the insulating glue may preferably be PI glue, and the thickness of the steel sheet is preferably 2.5 mm.

As shown in FIG. 1 and FIG. 4 , the base 11 includes a mounting part 112 and a fixing part 113 , the cavity 111 includes a receiving cavity 1112 and an installation cavity 1111 , the receiving cavity 1112 communicates with the mounting cavity 1111 , and the receiving cavity 1112 is arranged on the fixing part 113 , the installation cavity 1111 is arranged on the installation part 112 , the lens 12 is arranged in the installation cavity 1111 , and the optical filter 30 and the photosensitive chip 22 are both accommodated in the accommodation cavity 1112 . In a preferred embodiment, the base 11 includes a mounting portion 112 and a fixing portion 113 disposed below the mounting portion 112 . The mounting portion 112 is in the shape of a circular ring, and a cylindrical mounting cavity 1111 is opened in the middle. The mounting cavity 1111 is used for mounting the lens 12; the fixing portion 113 is used for supporting the mounting portion 112, thereby further fixing the lens 12. A directional receiving cavity 1112 is opened in the fixing portion 113 . The receiving cavity 1112 is located on the side close to the circuit board 21 . The mounting cavity 1111 and the receiving cavity 1112 communicate with each other. In addition, the accommodating cavity 1112 is provided corresponding to one side of the circuit board 21, so that the filter 30 and the photosensitive chip 22 on the circuit board 21 can be accommodated in the accommodating cavity 1112, so as to realize the filter 30, the photosensitive chip 22 and the lens. The optical path of 12 is connected.

As shown in FIG. 1 and FIG. 4 , the lens 12 includes a lens body 121 and a lens 122 . The lens 122 , the filter 30 and the photosensitive chip 22 are optically connected. The lens body 121 is detachably connected to the inner wall of the mounting cavity 1111 . In a preferred embodiment, the lens body 121 includes a threaded portion 1211 and a raised portion 1212 . During the installation process, the threaded portion 1211 is detachably connected to the inner wall of the installation cavity 1111 , and the raised portion 1212 extends above the installation cavity 1111 , the lens 122 is arranged in the convex portion 1212, and the filter 30 is arranged in the receiving cavity 1112 and faces the side of the lens body 121 facing the circuit board 21, so as to realize the optical path of the filter 30, the photosensitive chip 22 and the lens 122 In this way, the external light enters through the lens 122, and a part of the light is filtered by the filter 30 to reach the photosensitive chip 22, and then the photosensitive chip 22 converts the absorbed light signal into an electrical signal. The material of the filter 30 is white glass.

In addition, the lens body 121 is provided with external threads, and the inner wall of the mounting cavity 1111 is provided with internal threads, so that the lens body 121 is threadedly connected to the inner side wall of the mounting cavity 1111 . In a preferred embodiment, the size of the lens body 121 is adapted to the mounting cavity 1111 , the outer circumference of the lens body 121 is provided with an external thread, and the inner wall of the mounting cavity 1111 is provided with an inner thread adapted to the external thread of the lens body 121 . threaded, so that the lens body 121 and the inner wall of the mounting cavity 1111 are threadedly connected. In addition, in order to further strengthen the connection strength between the lens body 121 and the base 11 , the end of the lens body 121 close to the circuit board 21 is also provided with PI glue, and the lens body 121 and the base 11 are further fixedly connected by PI glue.

In addition, as shown in FIG. 1 and FIG. 3 , the end of the fixing portion 113 facing away from the circuit board 21 is provided with a plurality of notches 40 . In this way, when the lens 12 is assembled, external dust and burrs can preferentially fall into the notch 40 , thereby preventing the lens body 121 from being damaged by impurities such as dust.

In addition, the present invention also provides an electronic device, the electronic device includes the above-mentioned camera module. The electronic device may be a mobile phone, a camera, or a computer. The specific structure of the camera module refers to the above-mentioned embodiments. Since the electronic device adopts all the technical solutions of the above-mentioned embodiments, it has at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be repeated here. .

The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the patent of the present invention. Under the conception of the present invention, the equivalent structural transformation made by the contents of the description and drawings of the present invention, or directly/indirectly applied to other related All technical fields are included in the scope of patent protection of the present invention.

Claims (10)

1. a camera module, is characterized in that, described camera module comprises: a lens assembly, the lens assembly includes a base and a lens, the base is provided with a cavity, and the lens is installed in the cavity; A sensor assembly, the sensor assembly includes a circuit board, a photosensitive chip and a gold finger set, the photosensitive chip is arranged on the first end of the circuit board and is accommodated in the cavity, and the gold finger set is arranged on the the second end of the circuit board; The optical filter is arranged in the cavity, and the optical path of the optical filter, the lens and the photosensitive chip is connected. 2 . The camera module according to claim 1 , wherein the circuit board comprises a first substrate, a flexible board and a second substrate which are connected in sequence, and the photosensitive chip is arranged on the first substrate, 2 . The golden finger group is arranged on the second substrate, and the photosensitive chip is arranged on the same side as the golden finger group. 3 . The camera module of claim 2 , wherein the second substrate extends in a direction away from the soft board, the gold finger group comprises multiple rows of gold fingers, and each row of the gold fingers is the same as the The extending direction of the second substrate is the same, and the plurality of rows of the gold fingers are arranged at intervals along the extending direction perpendicular to the second substrate. 4 . The camera module according to claim 3 , wherein the plurality of rows of the gold fingers are evenly spaced along the extending direction perpendicular to the second substrate, and between any two adjacent rows of the gold fingers. 5 . The interval is 2mm ~ 3mm. 5. The camera module according to claim 4, wherein a side of the first substrate away from the base is further provided with a rigid insulating sheet, the rigid insulating sheet is disposed corresponding to the base, and the An insulating glue is also disposed on the side of the second substrate away from the gold finger group, and the insulating glue is disposed corresponding to the gold finger group. 6. The camera module according to any one of claims 1 to 5, wherein the base comprises an installation part and a fixing part, the cavity comprises an accommodation cavity and an installation cavity, and the accommodation cavity is connected to the The installation cavity is connected, the receiving cavity is arranged on the fixing part, the installation cavity is arranged on the installation part, the lens is arranged in the installation cavity, the filter and the photosensitive chip are accommodated in the accommodating cavity. 7 . The camera module according to claim 6 , wherein the lens comprises a lens body and a lens, the lens, the filter and the photosensitive chip are optically connected, and the lens body and the The inner side wall of the installation cavity is detachably connected. 8 . The camera module according to claim 7 , wherein the lens body is provided with an external thread, and the inner wall of the mounting cavity is provided with an internal thread, so that the lens body and the mounting cavity are provided with an internal thread. 9 . The inner side wall is threaded. 9 . The camera module according to claim 7 , wherein a plurality of notches are provided at one end of the fixing portion facing away from the circuit board, and a plurality of the notches are arranged at intervals around the receiving cavity, and each of the The directions of the notches are all away from the circuit board. 10. An electronic device, wherein the electronic device comprises the camera module according to any one of claims 1 to 9.

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