CN111554603B - Square silicon chip processing conveying system with holes - Google Patents

Abstract

The invention relates to the technical field of semiconductor material processing. It discloses a processing and conveying system for square silicon wafers with holes, which solves the technical problem of low efficiency of the traditional wafer uniform development operation on the rubber development machine, including adsorption devices, A square sheet with holes and a conveying arm device. The adsorption device includes a cylinder and an adsorption rack. The adsorption rack is composed of a plurality of intersecting horizontal bars. The multiple horizontal bars intersect at one point, and the column is located at the intersection point and perpendicular to the adsorption On the plane where the rack is located, suction cups are provided at both ends of the horizontal bar. There is a vacuum groove on the suction cup, and a ventilation groove on the horizontal bar. One end of the vacuum groove is connected to the ventilation groove, and the other end of the ventilation groove is connected to the inside of the cylinder. The cylinder has a hollow structure . According to the above technical proposal, two sets of tools can be used to simultaneously carry out glue leveling and developing operations and conveying operations, and the tools for glue leveling and developing operations can be applied to square sheets with holes, thereby achieving the purpose of improving work efficiency.

Description

A square silicon wafer processing transmission system with holes

technical field

The invention relates to the technical field of semiconductor material processing, more specifically, it relates to a square silicon wafer processing conveying system with holes.

Background technique

The square sheet with holes refers to the substrate for manufacturing semiconductor transistors or integrated circuits. The materials of the square sheet with holes include silicon, germanium, GaAs, InP, GaN, etc. Since silicon is the most commonly used, if the crystal material is not specified, it usually refers to a silicon square with holes. In the actual product, the wafer needs to be developed for uniform film development, and the film film development process is completed by the film film developer.

During the gluing operation of sizing and developing, it is very important to install and transfer the wafer. In the traditional technology, the wafer is glued on the transfer arm and transported through the transfer arm. Since the glue application and transportation cannot be carried out simultaneously, the work efficiency is relatively low. Moreover, when the transfer arm is used for gluing, the size of the transfer arm is relatively single. For different sizes of wafers, the transfer arm needs to be replaced with different sizes, and the process adjustment needs to be carried out again after the replacement of the transfer arm, which further reduces the work efficiency.

Contents of the invention

Aiming at the technical problem of the low efficiency of the rubber leveling and developing operation of the traditional square sheet with holes on the rubber leveling and developing machine proposed in the background technology, the present invention aims to provide a method that can perform the rubber leveling, developing and conveying operations simultaneously using two sets of tools. , and the tool for leveling and developing operations can be applied to square sheets with holes, so as to achieve the purpose of improving work efficiency.

To achieve the above object, the present invention provides the following technical solutions:

A processing and conveying system for square silicon wafers with holes, including an adsorption device, a square wafer with holes and a conveying arm device,

The adsorption device includes a cylinder and an adsorption rack. The adsorption rack is composed of a plurality of intersecting horizontal bars. The plurality of horizontal bars intersect at one point, and the column is located at the intersection point and perpendicular to the The plane where the adsorption rack is located, the two ends of the horizontal bar are provided with suction cups, the suction cup has a vacuum groove, the horizontal bar has a ventilation groove, the vacuum groove is connected to one end of the ventilation groove, and the ventilation groove The other end communicates with the interior of the column, and the column has a hollow structure;

The conveying arm device includes a cantilever, an opening frame and a receiving piece, the cantilever is fixedly connected to the opening frame, one side of the opening frame has an opening for the column to pass through, and the receiving piece has a Z-shaped structure , one end of the receiving piece is fixed on the opening frame, and the other end is used as the receiving surface of the square piece with holes;

The square sheet with holes is a semiconductor thin plate, and the adsorption device absorbs from the bottom surface of the square sheet with holes through its suction cup. The receiving surface of the receiving sheet lifts the square sheet with holes for transmission.

Through the above-mentioned technical solution, the present invention aims to provide a system capable of synchronously carrying out the gluing process and the conveying process of gluing and developing with two sets of tools respectively. The working process of the system: the adsorption device in the system absorbs the square sheet with holes, and then installs the adsorption device on the motor rod through its cylinder to rotate. The square sheet is rotated to achieve even glue coating on the glue leveling and developing machine. After the first group of square sheets with holes is evenly developed, the transfer arm moves to the position of the square sheets with holes, and the square sheets with holes are placed on the receiving sheet. At this time, the adsorption device releases the adsorption of the square sheets with holes, thereby Through the conveying arm device, the perforated square sheets completed by gluing are turned over. When the conveying arm is turning over the perforated squares completed in the gluing process, the adsorption device can absorb a new set of perforated squares for glue leveling and development, so as to realize the simultaneous operation of two groups of perforated squares and improve work efficiency. At the same time, because the suction cup of the adsorption device can vacuum different positions of the square sheet with holes, it can be applied to the gluing process of square sheets with holes in different sizes.

The present invention is further provided that: the cylinder is a hollow cylindrical structure, and a positioning pin hole penetrating through the cylinder is opened on the peripheral side.

Through the above technical solution, when the adsorption device is connected to the motor rod through its column, the positioning pin hole and the positioning pin can be used to fix the two.

The present invention is further configured as follows: the end of the cylinder close to the adsorption frame is provided with a connecting circular plate, and a detachable fixing hole is opened on the connecting circular plate.

Through the above technical solution, the connecting circular plate and the detachable fixing hole can detachably connect the cylinder and the adsorption rack.

The present invention is further configured as follows: an air circuit board is provided at the intersecting points of the plurality of horizontal bars, and an air inlet and outlet connected to the column is provided on the air circuit board; The ventilation grooves are one-to-one corresponding and connected air distribution grooves.

The present invention is further configured as follows: a plurality of the horizontal bars are connected with reinforcing arcs, and the plurality of reinforcing arcs together form a complete ring.

The present invention is further provided that: the adsorption device is made of aluminum.

In the present invention, it is further set that: the square sheet with holes is uniformly opened with a number of through holes.

The present invention is further provided that: the cantilever is provided with a slot for fixing the cantilever, and the cantilever is also provided with a plurality of through fixing holes.

The present invention is further provided that: the square sheet with holes is made of silicon dioxide material.

The present invention is further provided that: the cantilever and the opening frame are both made of aluminum, and the receiving piece is made of PEEK material.

In summary, the present invention has the following beneficial effects:

(1) Systematic processing to improve operating efficiency;

(2) The operation method is simple and saves labor.

Description of drawings

Fig. 1 is the three-dimensional structure schematic diagram of adsorption device;

Fig. 2 is a split structure schematic diagram of the three-dimensional structure of the adsorption device;

Fig. 3 is the structural representation of the square sheet with holes;

4 is a schematic diagram of a three-dimensional structure of a transmission arm device;

Fig. 5 is a schematic structural diagram of the cooperative use of the adsorption device and the transfer arm device;

Fig. 6 is a schematic diagram of the structure of the square sheet with holes transferred from the adsorption device to the transfer arm device.

Reference signs: 100, adsorption device; 101, cylinder; 1011, positioning pin hole; 102, adsorption frame; 103, horizontal bar; 1031, ventilation groove; 104, suction cup; 1041, vacuum groove; 105, connecting circular plate; 1051, detachable fixing hole; 106, air circuit board; 1061, air inlet and outlet; 1062, air distribution groove; 107, reinforced arc; 200, square piece with hole; 201, hole point; 300, transmission arm device; Cantilever; 3011, card slot; 3012, fixing hole; 302, opening frame; 3021, opening; 303, receiving piece.

Detailed ways

The present invention will be further described in detail below in conjunction with the embodiments and the accompanying drawings, but the embodiments of the present invention are not limited thereto.

A processing and conveying system for square silicon wafers with holes, as shown in FIG. 1 and 2, it can be seen that the adsorption device 100 includes a cylinder 101 and an adsorption rack 102. The adsorption rack 102 is composed of a plurality of horizontal bars 103 intersecting each other. The plurality of horizontal bars 103 intersect at one point, and the column 101 Located at the intersection point and perpendicular to the plane where the adsorption rack 102 is located, both ends of the horizontal bar 103 are provided with suction cups 104, the suction cup 104 has a vacuum groove 1041, and the horizontal bar 103 has a ventilation groove 1031, a vacuum groove 1041 and a ventilation groove 1031 One end is connected, and the other end of the ventilation groove 1031 is connected with the interior of the cylinder 101, and the cylinder 101 has a hollow structure.

4 and 5, it can be seen that the transfer arm device 300 includes a cantilever 301, an opening frame 302 and a receiving piece 303, the cantilever 301 and the opening frame 302 are fixedly connected, and one side of the opening frame 302 has an opening 3021 through which the column 101 can pass. The sheet 303 has a Z-shaped structure, and one end of the receiving sheet 303 is fixed on the opening frame 302 , and the other end is used as the receiving surface of the square sheet 200 with holes. The cantilever 301 is provided with a slot 3011 for fixing the cantilever 301 , and the cantilever 301 is also provided with a plurality of through fixing holes 3012 . Both the cantilever 301 and the opening frame 302 are made of aluminum, and the receiving piece 303 is made of PEEK material.

Referring to FIG. 3 , the square sheet with holes 200 is a semiconductor thin plate, and several holes 201 are evenly opened on the square sheet with holes 200 , and the square sheet with holes 200 is made of silicon dioxide glass material. The adsorption device 100 is adsorbed from the bottom surface of the square sheet with holes 200 through its suction cup 104, and the square sheet with holes 200 is carried out on the adsorption device 100 for uniform glue development, and the opening frame 302 takes the square sheet 200 with holes through the receiving surface of its receiving sheet 303. Hold up for delivery. The column body 101 is a hollow cylindrical structure, and the peripheral side of the column body 101 is provided with a through positioning pin hole 1011 . One end of the cylinder 101 close to the adsorption frame 102 is provided with a connecting circular plate 105 , and a detachable fixing hole 1051 is opened on the connecting circular plate 105 .

The intersection point of a plurality of horizontal bars 103 is provided with an air circuit board 106, and the air circuit board 106 is provided with an air inlet and outlet 1061 communicating with the cylinder 101. Gas distribution groove 1062.

Reinforcing arcs 107 are connected between the plurality of horizontal bars 103, and the plurality of reinforcing arcs 107 together form a complete ring. The adsorption device 100 is made of aluminum.

The above descriptions are only preferred implementations of the present invention, and the protection scope of the present invention is not limited to the above-mentioned embodiments, and all technical solutions under the idea of the present invention belong to the protection scope of the present invention. It should be pointed out that for those skilled in the art, some improvements and modifications without departing from the principles of the present invention should also be regarded as the protection scope of the present invention.

Claims (10)

1. A processing transmission system for square silicon wafers with holes, comprising an adsorption device (100), a square sheet with holes (200) and a transmission arm device (300), characterized in that: The adsorption device (100) includes a cylinder (101) and an adsorption rack (102), the adsorption rack (102) is composed of a plurality of intersecting horizontal bars (103), and the plurality of horizontal bars (103) intersect At one point, and the column (101) is located at the intersection point and is perpendicular to the plane where the adsorption rack (102) is located, the two ends of the bar (103) are provided with suction cups (104), and the suction cups (104) has a vacuum groove (1041), the horizontal bar (103) has a ventilation groove (1031), the vacuum groove (1041) communicates with one end of the ventilation groove (1031), and the ventilation groove (1031 ) the other end communicates with the interior of the cylinder (101), and the cylinder (101) has a hollow structure; The transfer arm device (300) includes a cantilever (301), an opening frame (302) and a receiving piece (303), the cantilever (301) is fixedly connected to the opening frame (302), and the opening frame (302) One side has an opening (3021) through which the column (101) can pass, the receiving piece (303) has a Z-shaped structure, one end of the receiving piece (303) is fixed on the opening frame (302), and the other end As the receiving surface of the square sheet with holes (200); The square sheet with holes (200) is a semiconductor thin plate, and the adsorption device (100) is adsorbed from the bottom surface of the square sheet with holes (200) through its suction cup (104), and the square sheet with holes (200) is placed on the On the adsorption device (100), the glue leveling and development work is carried out, and the opening frame (302) lifts the square sheet with holes (200) through the receiving surface of its receiving sheet (303) for transmission. 2. A square silicon wafer processing and conveying system with holes according to claim 1, characterized in that: the cylinder (101) is a hollow cylindrical structure, and the circumference of the cylinder (101) is opened There are dowel pin holes (1011) through. 3. A square silicon wafer processing and conveying system with holes according to claim 1, characterized in that: the end of the cylinder (101) close to the adsorption rack (102) is provided with a connecting circular plate (105), A detachable fixing hole (1051) is opened on the connecting circular plate (105). 4. A square silicon wafer processing and conveying system with holes according to claim 3, characterized in that: an air circuit board (106) is provided at the intersection points of a plurality of said horizontal bars (103), and said air circuit board (106) is provided with an air inlet and outlet (1061) communicating with the cylinder (101), and the air circuit board (106) is also provided with a gas distribution port corresponding to and communicating with the ventilation groove (1031). Groove (1062). 5. A processing and conveying system for square silicon wafers with holes according to claim 1, characterized in that: reinforcing circular arcs (107) are connected between a plurality of said horizontal bars (103), and a plurality of said reinforcing circles The arcs (107) together form a complete circle. 6. A square silicon wafer processing and conveying system with holes according to any one of claims 1-5, characterized in that the adsorption device (100) is made of aluminum. 7. A square silicon wafer processing and conveying system with holes according to claim 1, characterized in that: said square silicon wafer with holes (200) is uniformly opened with several holes (201) running through it. 8. A square silicon wafer processing and conveying system with holes according to claim 1, characterized in that: said cantilever (301) is provided with a slot (3011) for fixing the cantilever (301), and said cantilever (301) is also provided with several through fixing holes (3012). 9. A processing and conveying system for square silicon wafers with holes according to claim 1, characterized in that: the square wafers with holes (200) are made of silicon dioxide. 10. A square silicon wafer processing and conveying system with holes according to claim 1 or 8, characterized in that: the cantilever (301) and the opening frame (302) are both made of aluminum, and the receiving piece (303 ) is made of PEEK material.

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