CN111477563A - Alignment tool for fusing and sealing semiconductor device - Google Patents

Abstract

The present invention provides an alignment tool for sealing semiconductor devices, comprising a tool body, a first groove formed on the tool body, a second groove formed on the bottom surface of the first groove, and a tool body formed on the tool body The first groove is used for accommodating the device body; the second groove is used for accommodating the cover, and the first groove and the second groove together form a The stepped groove of the stepped surface; the abdication groove is used to provide a space for advancing and retreating a clamp, and the clamp is used to clamp the device main body and the cover piece stacked together in the stepped groove, and drive the The device body and the cover exit the tool body. The alignment tool used for melting and sealing of semiconductor devices of the present invention can not only realize the rapid alignment of the device body and the cover in the semiconductor device, but also greatly improve the alignment accuracy.

Description

Alignment tooling for semiconductor device sealing

technical field

The invention relates to the field of semiconductor device packaging, in particular to an alignment tool for sealing semiconductor devices.

Background technique

Fusion sealing is a commonly used sealing technology in the packaging process of semiconductor devices. The semiconductor device packaged by the sealing technology includes the device body (also known as the shell base) and the cover attached to the device body (such as the fusion sealing cover plate). ), in order to achieve the sealing of the device body and the cover, a ring of frit ring (also called a solder ring) is placed on the cover, and the outer edge of the cover is smaller than the outer edge of the device body. At present, when sealing, the cover and the device body are stacked together and aligned. After the alignment is completed, the cover and the device body are clamped together by a clamp, and the pressed device body and the device body are pressed together. The cover piece together with the jig is put into a melting and sealing furnace for heating, so that the frit ring is melted, connected and sealed between the device body and the cover piece. At present, for small batches of semiconductor devices that need to be sealed, the alignment is usually achieved by hand without using other tools after wearing finger cots or gloves. The relative position of the cover and the device body is prone to shift, and the alignment cannot be guaranteed. The accuracy often leads to inconsistent appearance of the same batch of semiconductor devices of the same model, and in severe cases, even affects the air tightness of the product.

SUMMARY OF THE INVENTION

The main purpose of the present invention is to provide an alignment tool for the sealing of semiconductor devices, so that the alignment accuracy can be improved so as to improve product quality.

For achieving the above-mentioned purpose and other related purposes, the technical scheme of the present invention is as follows:

An alignment tool for sealing a semiconductor device, wherein the semiconductor device includes a device body and a cover, and the cover is provided with a frit ring, wherein the alignment tool of the present invention includes:

Including tooling body,

a first groove, which is opened on the tool body, and the first groove is used for accommodating the device body;

The second groove is opened on the bottom surface of the first groove, the second groove is used for accommodating the cover, the first groove and the second groove together form a stepped surface stepped grooves; and

An escape slot is provided on the tool body, and the escape slot is used to provide a space for advancing and retreating a clamp, and the clamp is used to clamp the device main body, the device body and the The cover is driven, and the device body and the cover are driven to exit the tool body.

Optionally, the device body includes an outer pin and a first surface for contacting the frit ring, and the depth of the first groove is less than or equal to the distance between the outer pin and the first surface. distance.

Optionally, a barrier protection piece is movably arranged in the second groove, the barrier protection piece and the tool body are respectively arranged independently, and the barrier protection piece is used to be placed at the bottom of the second groove, The device main body, the cover member and the barrier protection member are sequentially stacked and then clamped by the clamp.

Optionally, the abdication groove is an open groove, the abdication groove completely penetrates the tool body along a first direction, the first direction is the depth direction of the second groove, and the ablution groove is along the first direction. One side in two directions penetrates through the tool body, and the second direction faces the inner wall of the stepped groove.

Optionally, the clamp includes a first clamping arm and a second clamping arm, an end of the first clamping arm is pressed against the device body during clamping, and the second clamping arm is The end of the squeegee is pressed against the barrier protector during clamping;

The width of the opening slot is larger than the width of the second clamping arm in the clamp, and the width of the opening slot is smaller than the width of the barrier protection member.

Optionally, the depth of the second groove is greater than the thickness of the barrier protection member, and is less than or equal to the sum of the thicknesses of the barrier protection member and the cover member after overlapping.

Optionally, the depth of the second groove is greater than the sum of the thicknesses of the barrier protection member and the cover member after overlapping.

Optionally, the outline dimension of the inner wall of the first groove is larger than the outline dimension of the outer wall of the device body, so that when the device body is placed in the first groove, the outer wall of the device body and the first clearance fit between the inner walls of the groove,

The outline dimension of the inner wall of the second groove is larger than the outline dimension of the outer wall of the cover, so that when the main body of the cover is placed in the second groove, the outer wall of the cover and the second groove are separated. Clearance fit between inner walls.

Optionally, the first groove is a rectangular groove or a circular groove.

Optionally, the device body is a rectangular piece, and the size of each rectangular side on the first groove is correspondingly larger than the size of each rectangular side on the device body by 0.1-0.2 mm.

Optionally, the device body is a circular piece, and the diameter of the first groove is 0.05-0.15 mm larger than the outer diameter of the device body.

Optionally, the second groove is a rectangular groove or a circular groove.

Optionally, the covering member is a rectangular member, and the size of each rectangular side on the second groove is correspondingly larger than the size of each rectangular side on the covering member by 0.1-0.2 mm.

Optionally, the barrier protection member is also a rectangular member, and the size of each rectangular side on the barrier protection member is correspondingly 0.05-0.15 mm smaller than the size of each rectangular side on the cover member.

Optionally, the cover is a circular piece, and the diameter of the second groove is 0.05-0.15 mm larger than the diameter of the cover.

Optionally, the barrier protection member is also a circular member, and the diameter of the barrier protection member is 0.05-0.15 m smaller than the diameter of the cover member.

Optionally, the cover member is a cover plate, and the barrier protection member is a thin plate member.

Optionally, the barrier protection member is a silicon wafer.

The present invention has at least the following beneficial effects:

The alignment tool used for melting and sealing of semiconductor devices of the present invention can not only realize the rapid alignment of the device body and the cover in the semiconductor device, but also greatly improve the alignment accuracy.

Description of drawings

Fig. 1 shows the positional relationship diagram of the fusing tool of the present invention and the semiconductor device when used;

Fig. 2 shows the exploded schematic diagram of Fig. 1;

FIG. 3 is a schematic partial cross-sectional view of FIG. 1 corresponding to an embodiment;

FIG. 4 is a schematic partial cross-sectional view of FIG. 1 corresponding to another embodiment;

Figure 5 shows a top view of the main body of the tooling;

Fig. 6 shows the A-A cross-sectional schematic diagram of Fig. 5;

FIG. 7 is a diagram showing the positional relationship between the jig and the fusing tool and the semiconductor device of the present invention when the jig is used.

Description of reference numerals in the embodiment: tool body 1, barrier protection member 2, clamp 3, device main body 4, cover member 5, first groove 11, second groove 12, escape groove 13, outer pin 41 , the first surface 42 , the molten material ring 51 , the first clamping arm 31 , and the second clamping arm 32 .

Detailed ways

In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without one or more of these details. In other instances, some technical features known in the art have not been described in order to avoid obscuring the present invention.

It should be understood that the present invention may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the same reference numerals refer to the same components throughout.

The semiconductor devices applicable to the alignment tool in the following embodiments all include a device body and a cover, and the outline dimension of the outer wall of the device body of the semiconductor device is larger than that of the cover, and the accessory is provided with a frit ring. .

Referring to Fig. 1, Fig. 2, Fig. 5, Fig. 6, an alignment tool for sealing semiconductor devices, including:

Including tooling body 1,

a first groove 11 , which is opened on the tool body 1 , and the first groove 11 is used for accommodating the device body 4 ;

The second groove 12 is formed on the bottom surface of the first groove 11 , the second groove 12 is used for accommodating the cover 5 , and the first groove 11 and the second groove 12 share the same forming a stepped groove having a stepped face; and

A recess 13 is provided on the tooling body 1 , and the recess 13 is used to provide a space for advancing and retreating a clamp 3 , and the clamp 3 is used to clamp the stacked layers in the stepped groove. The device body 4 and the cover 5 are driven to exit the tool body 1 by driving the device body 4 and the cover 5 .

When aligning, the cover 5 is placed in the second groove 12, and then the device body 4 is placed in the first groove 11, referring to FIG. The parts 5 are clamped into one, and finally the clamp 3 is grasped to clamp the device body 4 and the cover 5 out of the tool body 1, and put them into the melting furnace together. 13 or the space jointly formed by the abdication groove 13 and the stepped groove realizes clamping and withdrawal.

In the alignment tooling for semiconductor device sealing of the present invention, the first groove 11 is matched with the device body 4, and the second groove 12 is matched with the cover 5, which can not only realize the device tool body 1 and the cover 5 in the semiconductor device fast alignment, and the alignment accuracy is greatly improved.

In some embodiments, referring to FIG. 1 , FIG. 2 , and FIG. 7 , a barrier protection member 2 is movably disposed in the second groove 12 , and the barrier protection member 2 and the tooling body 1 are respectively arranged independently. The barrier protection member 2 is used to be placed at the bottom of the second groove 12 , so that the device body 4 , the cover member 5 and the barrier protection member 2 are stacked in sequence and then clamped by the clamp 3 . In a specific real-time process, in order to realize the stacking of the cover member 5 and the barrier protection member 2 , the surface contour of the barrier protection member 2 in contact with the cover member 5 needs to be aligned with the second groove 12 on the cover member 5 . to match the surface contour of the face.

When aligning, first place the barrier protection member 2 in the second groove 12, then place the cover member 5 in the second groove 12, and then place the device body 4 in the first groove 11, and then use The fixture 3 clamps and presses the device body 4, the cover 5 and the barrier protection piece 2 that are sequentially stacked in the stepped groove into one, and the device body 4, the cover piece 5, and the barrier protection piece 23 are removed together by the fixture 3. The tool body 1 is clamped out, wherein the device main body 4, the cover 5, and the barrier protection member 2 are all taken out from the opening direction of the stepped groove, and the clamp 3 is taken out through the stepped groove and the vacant space. The barrier protection member 2 and the tooling body 1 are arranged independently of each other, so that the barrier protection member 2 can be taken out together with the semiconductor device that has been aligned and to be sealed, and the cover member 5 can be isolated from the fixture 3, not only The surface of the cover 5 can be prevented from being damaged by the clamp 3 during clamping, and the cover 5 can also be protected during sealing.

In some embodiments, referring to FIG. 1 , FIG. 5 , and FIG. 6 , the escape groove 13 is an open groove, and the escape groove 13 completely penetrates the tool body 1 along a first direction, and the first direction is In the depth direction of the second groove 12 , the escape groove 13 penetrates the tool body 1 on one side along the second direction, and the second direction faces the inner wall of the stepped groove.

In some embodiments, referring to FIG. 2 and FIG. 7 , the clamp 3 may be a clamp 3 including a first clamp arm 31 and a second clamp arm 32 , and the end of the first clamp arm 31 Pressed on the device main body 4 when clamping, the end of the second clamping arm 32 is pressed on the blocking protection member 2 when clamping; the width of the opening slot is larger than the width of the The width of the second clamping arm 32 in the fixture 3, and the width of the opening slot is smaller than the width of the barrier protection member 2, which is conducive to the more reliable clamping of the second clamping arm 32 on the barrier protection member 2, and It is ensured that the second clamping arm 32 can exit the tool body 1 along the direction from the second groove 12 to the first groove 11 .

In some embodiments, referring to FIGS. 3 and 4 , the device body 4 includes an outer lead 41 and a first surface 42 for contacting the frit ring 51, and the depth of the first groove 11 The distance between the outer pin 41 and the first surface 42 is less than or equal to the distance between the outer pin 41 and the surface of the tooling body 1 , which can prevent deformation or damage caused by the interference between the outer pin 41 and the surface of the tool body 1 .

In some embodiments, referring to FIG. 3 , the depth of the second groove 12 is greater than the sum of the thicknesses of the barrier protection member 2 and the cover member 5 after overlapping. In this way, the device body 4 and the cover member The parts 5 do not contact each other in the stepped groove. When the clamp 3 clamps out the stacked device body 4 , the cover 5 and the barrier protection part 2 , the barrier protection part 2 and the cover part 5 need to be driven by the clamp 3 to move. Only a certain distance can overlap with the device body 4 . In other embodiments, referring to FIG. 4 , the depth of the second groove 12 is greater than the thickness of the barrier protection member 2 , and is less than or equal to the thickness of the barrier protection member 2 after overlapping the cover member 5 . In this way, the device body 4 and the cover member 5 are in contact with each other in the stepped groove. When the clamp 3 clamps out the stacked device body 4, the cover member 5 and the barrier protection member 2, the cover member 5 and the The distance that the barrier layer passes through the second groove 12 is smaller, and the pinching out is smoother.

In some embodiments, the contour size of the inner wall of the first groove 11 is larger than the contour size of the outer wall of the device body 4 , so that when the device body 4 is placed in the first groove 11 , the device body 4 There is clearance fit between the outer wall of the first groove 11 and the inner wall of the first groove 11; the contour size of the inner wall of the second groove 12 is larger than the outer wall contour size of the cover 5, so that the main body of the cover 5 is placed in the When the second groove 12 is used, the outer wall of the cover 5 and the inner wall of the second groove 12 are in clearance fit. When the first groove 11 is in clearance fit with the device body 4 , and when the second groove 12 is in clearance fit with the cover 5 , not only can the alignment accuracy be ensured, but also the device body 4 and the cover 5 can be taken out more smoothly , which also helps to maintain the alignment accuracy.

In some embodiments, the first groove 11 may be a rectangular groove, a circular groove or a groove of other shapes, the specific shape of which is determined according to the shape of the device body 4; similarly, the second groove 12 It can also be a rectangular groove, a circular groove or a groove of other shapes. The shape of the first groove 11 is determined according to the shape of the device body 4 , and the shape of the second groove 12 is determined by the shape of the cover 5 . Referring to FIG. 1 , in this embodiment, the first groove 11 is a rectangular groove, and the second groove 12 is also a rectangular groove, that is, the device body 4 and the cover 5 are both rectangular.

In some embodiments, the device main body 4 is a rectangular part, and the size of each rectangular side on the first groove 11 is correspondingly larger than the size of each rectangular side on the device main body 4 by 0.1-0.2 mm; in other implementations In an example, the device main body 4 is a circular piece, and the diameter of the first groove 11 is 0.05-0.15 mm larger than the outer diameter of the device main body 4 . All of these are beneficial to the device body 4 entering and exiting the first groove 11 smoothly, and the alignment accuracy can be controlled more precisely.

In some embodiments, the cover member 5 is a rectangular member, and the size of each rectangular side on the second groove 12 is correspondingly larger than the size of each rectangular side on the cover member 5 by 0.1-0.2 mm. In other implementations In an example, the covering member 5 is a circular member, and the diameter of the second groove 12 is larger than that of the covering member 5 by 0.05-0.15 mm. All of these are beneficial to the covering member 5 entering and exiting the second groove 12 smoothly, and the alignment accuracy can be controlled more precisely.

When the cover member 5 is a rectangular member, the barrier protection member 2 is also a rectangular member, and the size of each rectangular side on the barrier protection member 2 is correspondingly smaller than the size of each rectangular side on the cover member 5 by 0.05-0.15 mm, under this size, the barrier protection member 2 can not only prevent the cover member 5 from discoloring under the action of high temperature and pressure, but also effectively prevent the molten material (solder) from climbing on the cover member during the melting process, which is beneficial to ensure the appearance of the finished product regardless of Whether it is color or detail structure is consistent.

When the single cover 5 is a circular piece, the barrier protection piece 2 is also a circular piece, and the diameter of the barrier protection piece 2 is 0.05-0.15m smaller than the diameter of the cover piece 5, which can also prevent coverage. The discoloration of the parts and the effect of preventing the molten material (solder) from crawling onto the cover when it melts.

In some embodiments, when the cover member 5 is a cover plate, the barrier protection member 2 is a silicon wafer, so that the barrier protection member can be obtained by dicing from waste silicon wafers on the production line, which is convenient to obtain materials and easy to prepare. It is beneficial to reduce the cost of the entire alignment tool, and the silicon wafer can effectively reduce the absorption of heat energy during the sealing process of the semiconductor device.

Specifically, when the barrier protection member is a silicon wafer, its thickness ranges from 200 to 800um, and existing waste silicon wafers of 4 to 12 inches can be used to prepare the barrier protection member.

Optionally, the material of the tool body 1 includes a rust-proof metal material. In this embodiment, the material of the tooling body 1 is hard aluminum, which is not only easy to obtain, easy to process, but also not easy to rust, which is conducive to keeping the workshop clean, and can also reduce the possibility of other particles entering the device when the semiconductor device is assembled. In the specific implementation process of preventing PIND failure, ten-gauge steel can also be used, but it needs to be electroplated.

In some embodiments, the tool body 1 is provided with a plurality of the stepped grooves in an array, which can realize the alignment of a plurality of semiconductor devices at the same time.

In the description of the present invention, unless otherwise expressly specified and limited, a first feature "on" or "under" a second feature may include direct contact between the first and second features, or may include the first and second features The features are not in direct contact but through additional features between them.

In describing the present invention, the singular forms "a", "an" and "the/the" are intended to include the plural forms as well, unless the context clearly dictates otherwise. It will also be understood that the terms "compose" and/or "include", when used in this specification, identify the presence of stated features, integers, steps, operations, components and/or parts, but do not exclude one or more other The presence or addition of features, integers, steps, operations, components, parts and/or groups.

The above-mentioned embodiments merely illustrate the principles and effects of the present invention, but are not intended to limit the present invention. Anyone skilled in the art can modify or change the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed in the present invention should still be covered by the claims of the present invention.

Claims (17)

1. The utility model provides a counterpoint frock for semiconductor device seals by fusing, semiconductor device includes device main part, covering, be provided with the melting ring on the covering, its characterized in that:

comprises a tool body, a tool body and a tool body,

the first groove is formed in the tool body and used for accommodating the device main body in a matched mode;

the second groove is formed in the bottom surface of the first groove and used for accommodating the covering piece in a matched mode, and the first groove and the second groove jointly form a stepped groove with a stepped surface; and

the tool body is provided with a stepped groove, the stepped groove is arranged on the tool body and used for providing a driving and reversing space of a clamp, and the clamp is used for clamping the device main body and the covering piece which are stacked together in the stepped groove and driving the device main body and the covering piece to exit from the tool body.

2. The aligning tool for the melt sealing of the semiconductor device according to claim 1, wherein: the device body comprises an outer pin and a first surface used for being in contact with the melt ring, and the depth of the first groove is smaller than or equal to the distance between the outer pin and the first surface.

3. The aligning tool for the melt sealing of the semiconductor device according to claim 1, wherein: and a barrier protection piece is movably arranged in the second groove, the barrier protection piece and the tool body are respectively and independently arranged, and the barrier protection piece is arranged at the bottom of the second groove, so that the device main body, the covering piece and the barrier protection piece are sequentially stacked and then clamped by the clamp.

4. The aligning tool for the melt sealing of the semiconductor device according to claim 3, wherein: the tool body is provided with a notch, the notch is an open groove, the notch is completely penetrated through along a first direction, the first direction is the depth direction of the second groove, the notch penetrates through the tool body along a second direction on one side, and the second direction faces towards the inner wall of the stepped groove.

5. The aligning tool for the melt-sealing of the semiconductor device according to claim 4, wherein:

the clamp includes a first clamp arm whose end portion is pressed against the device body when clamped, and a second clamp arm whose end portion is pressed against the barrier protector when clamped,

the width of the open slot is greater than the width of the second clamping arm in the clamp, and the width of the open slot is less than the width of the barrier protection.

6. The aligning tool for the melt sealing of the semiconductor device according to claim 3, wherein: the depth of the second groove is larger than the thickness of the barrier protection piece and is smaller than or equal to the sum of the thicknesses of the barrier protection piece and the covering piece after overlapping.

7. The aligning tool for the melt sealing of the semiconductor device according to claim 3, wherein: the depth of the second groove is greater than the sum of the thicknesses of the barrier protector and the cover after overlapping.

8. The aligning tool for the melt sealing of the semiconductor device according to claim 2, wherein:

the contour dimension of the inner wall of the first groove is larger than that of the outer wall of the device main body, so that when the device main body is placed in the first groove, the outer wall of the device main body is in clearance fit with the inner wall of the first groove,

the contour dimension of the inner wall of the second groove is larger than that of the outer wall of the covering piece, so that when the covering piece main body is placed into the second groove, the outer wall of the covering piece is in clearance fit with the inner wall of the second groove.

9. The aligning tool for the melt-sealing of the semiconductor device according to claim 8, wherein: the first groove includes one of a rectangular groove or a circular groove, and the second groove protects the one of the rectangular groove or the circular groove.

10. The semiconductor melt-sealing alignment tool according to claim 9, wherein: the device main part is a rectangular part, and the size of each rectangular side on the first groove is 0.1-0.2 mm larger than that of each rectangular side on the device main part correspondingly.

11. The semiconductor melt-sealing alignment tool according to claim 9, wherein: the device main part is circular, the diameter ratio of first recess is 0.05 ~ 0.15mm more than the external diameter of device main part.

12. The aligning tool for the melt-sealing of the semiconductor device according to claim 9, wherein: the covering piece is a rectangular piece, and the size of each rectangular side on the second groove is correspondingly larger than that of each rectangular side on the covering piece by 0.1-0.2 mm.

13. The alignment tool for the melt-sealing of the semiconductor device according to claim 12, wherein: the barrier protection member is also a rectangular member, and the dimension of each rectangular side on the barrier protection member is correspondingly smaller than the dimension of each rectangular side on the covering member by 0.05-0.15 mm.

14. The alignment tool for the melt-sealing of the semiconductor device according to claim 11, wherein: the covering piece is a round piece, and the diameter of the second groove is 0.05-0.15 mm larger than that of the covering piece.

15. The aligning tool for the melt-sealing of the semiconductor device according to claim 14, wherein: the barrier protector is also a circular piece, and the diameter of the barrier protector is 0.05-0.15 m smaller than that of the covering piece.

16. The aligning tool for the melt sealing of the semiconductor device according to claim 2, wherein: the cover is a cover plate and the barrier protector is a sheet.

17. The alignment tool for the melt-sealing of the semiconductor device according to claim 16, wherein: the barrier protector is a silicon wafer.

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