CN111446235A - A light-emitting body and light-emitting module - Google Patents

Abstract

The present invention relates to the technical field of LED packaging, and provides a light-emitting body and a light-emitting module, wherein the light-emitting body comprises: an integrated circuit chip with a number of electrical contacts on the lower surface; a pin electrode layer with a number of pin electrodes, the pin electrodes The layer is arranged on the lower surface of the integrated circuit chip, and the arrangement positions of the plurality of pin electrodes correspond to the arrangement positions of the plurality of electrical contacts, respectively. around the surface; a plurality of light-emitting chips, disposed on the upper surface of the integrated circuit chip and electrically connected to the integrated circuit chip through protruding parts; and a packaging structure, wrapping the plurality of light-emitting chips and the integrated circuit chip, and the packaging structure is connected to the pin electrode layer; The light-emitting module includes the above-mentioned light-emitting body; the light-emitting body and the light-emitting module provided by the present invention have the following advantages: the light-emitting body can be made smaller, and the volume of the light-emitting body is reduced.

Description

A light-emitting body and light-emitting module

technical field

The present invention relates to the technical field of LED packaging, and more particularly, to a light-emitting body and a light-emitting module.

Background technique

LED (Light Emitting Diode) is a solid-state semiconductor device that can convert electrical energy into visible light. It can directly convert electrical energy into light and is a green energy source. With the continuous improvement of science and technology and people's living standards, the application fields of LEDs are becoming more and more extensive. In order to save the design space of LEDs, the design of IC (Integrated Circuit) chips on the application side is slowly changing from the exterior of the LED to the package. In the interior of the LED and this method has gradually become the mainstream of the market, but to make some smaller size LEDs, because the space is too small, the IC chip still cannot be packaged inside the LED, the LED is used in some special fields and occasions has been greatly restricted.

SUMMARY OF THE INVENTION

The purpose of the present invention is to provide a light-emitting body and a light-emitting module to solve the technical problem of the large size of the LED package in the prior art.

In order to achieve the above purpose, the technical solution adopted in the present invention is a luminous body, including:

The integrated circuit chip has an upper surface and a lower surface, and the lower surface has a plurality of electrical contacts;

The lead electrode layer has a plurality of lead electrodes, the lead electrode layer is arranged on the lower surface of the integrated circuit chip, and the arrangement positions of the plurality of lead electrodes respectively correspond to the positions of the plurality of electrical contacts. In a setting position, at least part of the plurality of lead electrodes each has a protruding part, and the protruding part protrudes from the periphery of the lower surface of the integrated circuit chip;

a plurality of light-emitting chips disposed on the upper surface of the integrated circuit chip and each electrically connected to the integrated circuit chip through the protruding portion; and

A package structure wraps the plurality of light-emitting chips and the integrated circuit chips, and the package structure is connected to the lead electrode layer.

In one embodiment, the light-emitting body further includes a bracket on which a accommodating cavity is formed, the bracket has a plurality of metal wirings, and the plurality of metal wirings form the lead electrode layer, and the lead electrode layer Exposed in the accommodating cavity, the packaging structure fills the accommodating cavity.

In one embodiment, the plurality of lead electrodes penetrate through the lead electrode layer, the upper surfaces of the plurality of lead electrodes are exposed on the upper surface of the lead electrode layer, and are respectively electrically connected to the plurality of electrical contacts , the lower surfaces of the plurality of pin electrodes are exposed on the lower surface of the pin electrode layer.

In one embodiment, the light-emitting body further includes a bracket, the bracket has a plurality of metal wirings, and the packaging structure includes an inner packaging layer for wrapping the plurality of light-emitting chips and the integrated circuit chip and an inner packaging layer for wrapping all the light-emitting chips and the integrated circuit chips. The outer encapsulation layer of the inner encapsulation layer, the lower surface of the lead electrode is connected to the several metal wirings of the part, and the part of the several lead electrodes protrudes from the periphery of the lower surface of the inner encapsulation layer and is blocked. The outer encapsulation layer wraps and is used for connecting the several metal wirings of the part.

In one embodiment, the light-emitting chip is electrically connected to the protruding portion of the lead electrode through a bonding wire, and the bonding wire is wrapped by the packaging structure.

In one embodiment, the light-emitting chip is electrically connected to the protruding portion of the lead electrode through a metal post, wherein the packaging structure has an inner packaging layer and an outer packaging layer, and the inner packaging layer wraps the metal post and the integrated circuit chip, the outer packaging layer is a light-transmitting layer that wraps the plurality of light-emitting chips and is located on the outer packaging layer.

In one embodiment, the surrounding area of the lead electrode layer protrudes from the periphery of the lower surface of the integrated circuit chip, and the package structure adheres to the surrounding area of the lead electrode layer.

In one embodiment, the lead electrode layer has a sheet region surrounding the plurality of lead electrodes, the upper surfaces of the plurality of lead electrodes protrude from the upper surface of the sheet region, and the plurality of lead electrodes The lower surface of the lamellae is flush with the lower surface of the lamella region.

Another object of the present invention is to provide a light-emitting module, which includes a circuit board and the above-mentioned light-emitting body disposed on the circuit board.

Another object of the present invention is to provide a light-emitting module comprising:

a plurality of integrated circuit chips, the integrated circuit chip has an upper surface and a lower surface, and the lower surface of the integrated circuit chip has a plurality of electrical contacts;

The circuit board has several setting areas, the setting area has several lead electrodes, the lower surface of the integrated circuit chip is set in the setting area, and the several lead electrodes in the setting area are The setting positions respectively correspond to the setting positions of the plurality of electrical contacts of the integrated circuit chip, and at least part of the plurality of lead electrodes in the setting area each has a protruding portion, and the protruding portion protrudes from the integrated circuit around the lower surface of the circuit chip;

a plurality of light-emitting chip sets, the light-emitting chip set has a plurality of light-emitting chips, the plurality of light-emitting chips of the light-emitting chip set are disposed on the upper surface of the integrated circuit chip and each pass through the the protruding portion of the lead electrode is electrically connected to the integrated circuit chip; and

A package structure wraps the plurality of light-emitting chip groups and the plurality of integrated circuit chips, and the package structure is connected to the circuit board.

The beneficial effects of the light-emitting body and light-emitting module provided by the present invention are:

Compared with the prior art, the luminous body of the present invention does not have a support substrate in structure, so its thickness can be made thinner, and at the same time, the integrated circuit chip, the pin electrode layer and the light emitting chip are stacked and arranged to reduce the size of the luminous body. The lateral dimension of the luminous body also reduces the volume of the luminous body, so the luminous body can be made smaller through the design of the present invention.

Description of drawings

In order to illustrate the technical solutions in the embodiments of the present invention more clearly, the following briefly introduces the drawings required in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained from these drawings without any creative effort.

1 is a cross-sectional view of a luminous body provided by an embodiment of the present invention;

2 is a top view of a luminous body provided by an embodiment of the present invention;

3 is a cross-sectional view of a luminous body provided by another embodiment of the present invention;

4 is a cross-sectional view of a luminous body provided by another embodiment of the present invention;

5 is a cross-sectional view of a luminous body provided by another embodiment of the present invention;

6 is a top view of a first light-emitting module provided by another embodiment of the present invention;

7 is a top view of a second light-emitting module provided by another embodiment of the present invention;

Figure 8 is an enlarged view at "A" of Figure 4;

Fig. 9 is an enlarged view at "B" of Fig. 5;

10 is a cross-sectional view of a light emitting module provided by another embodiment of the present invention.

The reference numbers in the figure are:

Integrated circuit chip-1; electrical contact-11;

Pin electrode layer-2; pin electrode-21; slice area-22;

light-emitting chip-3;

Encapsulation structure-4; inner encapsulation layer-41; outer encapsulation layer-42;

bondwire-5;

metal post-6;

circuit board-7;

Light-8; FDI pin 81; VDD pin 82; GND pin 83; DIN pin 84; DO pin 85;

Bracket 9; Metal wiring 91.

Detailed ways

In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

It should be noted that when a component is referred to as being "fixed on" or "disposed on" another component, it can be directly on the other component or indirectly on the other component. When an component is referred to as being "connected to" another component, it can be directly connected or indirectly connected to the other component.

It is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "bottom", "inside", "outside", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, only for the convenience of describing the present invention, rather than indicating that the device or component must have a specific orientation, It is constructed and operated in a particular orientation and is therefore not to be construed as a limitation of the present invention.

Furthermore, the terms "first" and "second" are used for descriptive purposes only, and should not be understood as indicating relative importance or indicating the number of technical features. In the description of the present invention, "plurality" means two or more, unless otherwise expressly and specifically defined. The specific implementation of the present invention is described in more detail below in conjunction with specific embodiments:

As shown in FIG. 1 and FIG. 2 , a light-emitting body 8 provided by an embodiment of the present invention includes:

The integrated circuit chip 1 has an upper surface and a lower surface, and the lower surface has a plurality of electrical contacts 11;

The lead electrode layer 2 has a plurality of lead electrodes 21 . The lead electrode layer 2 is disposed on the lower surface of the integrated circuit chip 1 and the positions of the plurality of lead electrodes 21 correspond to the plurality of electrical contacts 11 of the integrated circuit chip 1 respectively. At the setting position, at least part of the plurality of pin electrodes 21 each has a protruding part, and the protruding part protrudes from the periphery of the lower surface of the integrated circuit chip 1;

A plurality of light-emitting chips 3 are disposed on the upper surface of the integrated circuit chip 1 and each is electrically connected to the integrated circuit chip 1 through corresponding protruding parts, so as to be controlled by the integrated circuit chip 1; and

The package structure 4 encapsulates several light-emitting chips 3 and the integrated circuit chips 1 , and the package structure 4 is connected to the lead electrode layer 2 , wherein the package structure 4 is a cured transparent encapsulant to protect the light-emitting chips 3 and the integrated circuit chips 1 And the light energy of the plurality of light-emitting chips 3 is emitted out of the light-emitting body 8 .

The beneficial effects of the luminous body 8 provided in this embodiment are:

Compared with the prior art, the luminous body 8 of the present invention does not have a support substrate in structure, so its thickness can be made thinner, and at the same time, the integrated circuit chip 1, the lead electrode layer 2 and the light emitting chip 3 are stacked and arranged. The lateral dimension of the light-emitting body 8 is reduced, and the volume of the light-emitting body 8 is also reduced. Therefore, the light-emitting body 8 can be made smaller through the design of the present invention.

In addition, the protruding portion facilitates the electrical connection between the light-emitting chip 3 and the pin electrode 21 of the pin electrode layer 2, so that the light-emitting chip 3 is controlled by the integrated circuit chip 1, and the manufacturing process thereof is simple and convenient.

Wherein, the lead electrode layer 2 is in the shape of a membrane, and several lead electrodes 21 are made of metal material, which can be pure metal or alloy material, preferably copper; the packaging structure 4 includes but is not limited to silica gel and epoxy glue. one or a mixture of both, etc.

Specifically, an adhesive is provided between several electrical contacts 11 of the integrated circuit chip 1 and the lead electrodes 21 . It can be understood that, by providing the adhesive, the plurality of electrical contacts 11 of the integrated circuit chip 1 can be firmly attached to the lead electrodes 21 and be electrically connected to each other.

Finely, the adhesive includes silver paste, flux and solder paste.

As shown in FIG. 3 , in one embodiment, the light-emitting body 8 further includes a bracket 9 on which a accommodating cavity is formed. The bracket 9 has several metal wirings 91 and the several metal wirings 91 form a pin electrode layer 2 , and the pin electrodes The layers are exposed in the accommodating cavity, and the encapsulation structure 4 fills the accommodating cavity.

As shown in FIG. 4 , the light-emitting body 8 further includes a bracket 9, and the bracket 9 has several metal wirings 91. The packaging structure 4 includes an inner packaging layer 41 for wrapping a plurality of light-emitting chips 3 and integrated circuit chips 1, and an inner packaging layer for wrapping the inner packaging layer 41. In the outer packaging layer 42 of 41, the lower surface of the pin electrode 21 is connected to some metal wirings 91, and some of the pin electrodes 21 protrude around the lower surface of the inner packaging layer 41, and are used for connecting some metal wirings 91 of the part. For example, a portion of the metal wiring 91 is connected by the bonding wire 5 , and the lead electrode 21 protruding from the periphery of the lower surface of the inner encapsulation layer 41 is wrapped by the outer encapsulation layer 42 .

In one embodiment, the light-emitting chip 3 is electrically connected to the protruding parts of the lead electrodes 21 through bonding wires 5 , and the bonding wires 5 are wrapped by the packaging structure 4 , for example, by the inner packaging layer 41 as shown in FIG. 4 . In this embodiment, the light-emitting chip 3 is electrically connected to the protruding portion of the lead electrode 21 through the bonding wire 5, which has a simple, stable and reliable structure. In addition, the bonding wire 5 is wrapped by the packaging structure 4, which improves the stability of the bonding wire 5. sex.

Specifically, the bonding wire 5 includes one of pure gold wire, aluminum wire, copper wire or iron wire, or a mixture of the two.

In one embodiment, the plurality of lead electrodes 21 penetrate through the lead electrode layer 2 , the upper surfaces of the plurality of lead electrodes 21 are exposed on the upper surface of the lead electrode layer 2 and are respectively electrically connected to the corresponding electrical contacts 11 , and the plurality of leads The lower surface of the electrode 21 is exposed to the lower surface of the lead electrode layer 2 for being electrically connected to an external circuit board. It can be understood that the upper surface of the pin electrode 21 is used to electrically connect the electrical contacts 11 of the integrated circuit chip 1 , and the lower surface of the pin electrode 21 is used to electrically connect to the external circuit board. This design can make the integrated circuit chip 1 . The pin electrode layer 2 and the external circuit board are stacked and arranged, so that the lateral size of the entire luminous body 8 can be reduced, and the volume of the luminous body 8 can be reduced.

As shown in FIG. 5 , in one embodiment, the light-emitting chip 3 is electrically connected to the protruding portion of the pin electrode 21 through the metal column 6 .

The encapsulation structure 4 has an inner encapsulation layer 41 and an outer encapsulation layer 42 , the upper surface of the inner encapsulation layer 41 can be arranged with metal lines connected to the metal posts 6 , and a plurality of light-emitting chips 3 are arranged on the upper surface of the inner encapsulation layer 41 and are electrically connected to each other. Metal wiring for easy installation and setup. The inner encapsulation layer 41 wraps the metal post 6 and the integrated circuit chip 1. In this embodiment, the metal post 6 penetrates the inner encapsulation layer 41, and its two ends are respectively electrically connected to the light-emitting chip 3 and the protruding part of the lead electrode 21; the outer packaging layer 42 is a light-transmitting layer, which wraps several light-emitting chips 3 and is located on the inner packaging layer 41 . In this embodiment, the metal post 6 and the integrated circuit chip 1 are supported by the inner packaging layer 41 to have a preset mechanical strength, and the light-emitting chip 3 is fixed by the outer packaging layer 42 .

In one embodiment, the surrounding area of the pin electrode layer 2 protrudes from the periphery of the lower surface of the integrated circuit chip 1 , and the package structure 4 is bonded to the surrounding area of the pin electrode layer 2 . It can be understood that, bonding the package structure 4 to the surrounding area can further increase the stability of the lead electrode layer 2 .

In one embodiment, the lead electrode layer 2 has a lamella region 22 surrounding a plurality of lead electrodes 21 , the upper surfaces of the lead electrodes 21 protrude from the upper surface of the lamella region 22 , and the lower surfaces of the lead electrodes 21 are aligned with each other. Flat to the lower surface of the lamella region 22 . It can be understood that by staggering the upper surface of the lead electrode 21 and the slice region 22 , the electrical connection between the lead electrode 21 and the plurality of electrical contacts 11 of the integrated circuit chip 1 is facilitated, even during the process.

In one embodiment, the plurality of light-emitting chips 3 include red light-emitting chips 3 , green light-emitting chips 3 and blue light-emitting chips 3 . In this embodiment, the integrated circuit chip 1 controls the working states of the red light emitting chip 3, the green light emitting chip 3 and the blue light emitting chip 3 respectively, so that the light emitting body 8 emits light of different colors to meet the needs of users.

As shown in FIG. 6 to FIG. 9 , this embodiment further provides a light-emitting module, which includes a circuit board 7 and a plurality of light-emitting bodies 8 disposed on the circuit board 7 .

It can be understood that the light-emitting body 8 can be separately formed into a whole light-emitting body 8 and then disposed on the circuit board 7, or the integrated circuit chip 1 and the light-emitting chip 3 can be stacked and arranged on the circuit board 7 in sequence, and then bonded together. The wires 5 are electrically connected, and finally the integrated circuit chip 1 , the light-emitting chip 3 and the bonding wires 5 are packaged by the packaging structure 4 . The material of the circuit board 7 can be glass or a printed circuit board.

Specifically, FIG. 6 shows that luminous bodies 8 with a size of 1 by 4 are arranged in an array on the circuit board 7 , and FIG. 5 is an array of luminous bodies 8 with a size of 3 by 3 arranged on the circuit board 7 . Several pin electrodes 21 of the pin electrode layer 2 include FDI pin 81, VDD pin 82, GND pin 83, DIN pin 84 and DO pin 85, FDI pin 81 is used for backup signal input, VDD pin 82 Used for power input, GND pin 83 is used to connect the ground wire, DIN pin 84 is used for signal input, DO pin 85 is used for signal output, whereby the luminous body 8 is electrically connected to the circuit board through a number of pin electrodes 21 7, to obtain the required electrical signal from the circuit board 7.

As shown in FIG. 2 and FIG. 10 , this embodiment also provides another light-emitting module, which integrates the aforementioned plurality of light-emitting bodies 8 and the circuit board 7 to form a light-emitting module with a display function, including:

a plurality of integrated circuit chips 1, the integrated circuit chip 1 has an upper surface and a lower surface, and the lower surface of the integrated circuit chip 1 has a plurality of electrical contacts 11;

The circuit board 7 has a plurality of setting areas 71, and the setting area 71 has a plurality of lead electrodes 21. The lower surface of the integrated circuit chip 1 is arranged in the setting area 71 and the setting positions of the plurality of lead electrodes 21 in the setting area 71 correspond respectively. At the setting positions of the plurality of electrical contacts 11 of the integrated circuit chip 1, at least part of the plurality of lead electrodes 21 in the setting area 71 each has a protruding portion, and the protruding portion protrudes from the periphery of the lower surface of the integrated circuit chip 1;

A plurality of light-emitting chip sets, the light-emitting chip set has a plurality of light-emitting chips 3, and the plurality of light-emitting chips 3 of the light-emitting chip set are arranged on the upper surface of the integrated circuit chip 1 and are electrically connected and integrated through the protruding parts of the pin electrodes 21 in the setting area 71. circuit chip 1; and

The package structure 4 encapsulates a number of light-emitting chip groups 3 and a number of integrated circuit chips 1 , and the package structure is connected to the circuit board 7 .

The above descriptions are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention shall be included in the protection of the present invention. within the range.

Claims (10)

1. A luminous body, characterized in that, comprising: The integrated circuit chip has an upper surface and a lower surface, and the lower surface has a plurality of electrical contacts; The lead electrode layer has a plurality of lead electrodes, the lead electrode layer is arranged on the lower surface of the integrated circuit chip, and the arrangement positions of the plurality of lead electrodes respectively correspond to the positions of the plurality of electrical contacts. In a setting position, at least part of the plurality of lead electrodes each has a protruding part, and the protruding part protrudes from the periphery of the lower surface of the integrated circuit chip; a plurality of light-emitting chips disposed on the upper surface of the integrated circuit chip and each electrically connected to the integrated circuit chip through the protruding portion; and A package structure wraps the plurality of light-emitting chips and the integrated circuit chips, and the package structure is connected to the lead electrode layer. 2 . The light-emitting body according to claim 1 , wherein the light-emitting body further comprises a support, a accommodating cavity is formed on the support, the support has a plurality of metal wirings, and the plurality of metal wirings form the lead. 3 . A pin electrode layer is exposed in the accommodating cavity, and the package structure fills the accommodating cavity. 3 . The light-emitting body according to claim 1 , wherein the plurality of lead electrodes penetrate through the lead electrode layer, and the upper surfaces of the plurality of lead electrodes are exposed on the upper surface of the lead electrode layer. 4 . The plurality of electrical contacts are respectively electrically connected, and the lower surfaces of the plurality of lead electrodes are exposed on the lower surface of the lead electrode layer. 4 . The light-emitting body according to claim 3 , wherein the light-emitting body further comprises a bracket, the bracket has a plurality of metal wirings, and the packaging structure includes a structure for wrapping the plurality of light-emitting chips and the integrated circuit. 5 . The inner encapsulation layer of the chip and the outer encapsulation layer for wrapping the inner encapsulation layer, the lower surface of the lead electrode is connected to the several metal wirings of the part, and the part of the several lead electrodes protrudes from the Around the lower surface of the inner encapsulation layer and surrounded by the outer encapsulation layer, the metal wirings of the connection part are used. 5 . The light-emitting body according to claim 3 , wherein the light-emitting chip is electrically connected to the protruding portion of the lead electrode through a bonding wire, and the bonding wire is wrapped by the packaging structure. 6 . 6 . The light-emitting body of claim 3 , wherein the light-emitting chip is electrically connected to the protruding portion of the lead electrode through a metal column, wherein the packaging structure has an inner packaging layer and an outer packaging layer, 7 . The inner packaging layer wraps the metal post and the integrated circuit chip, and the outer packaging layer is a light-transmitting layer that wraps the plurality of light-emitting chips and is located on the outer packaging layer. 7 . The light-emitting body according to claim 1 , wherein the surrounding area of the lead electrode layer protrudes from the periphery of the lower surface of the integrated circuit chip, and the package structure adheres to the lead electrode. 8 . the surrounding area of the layer. 8 . The light-emitting body according to claim 1 , wherein the lead electrode layer has a sheet region surrounding the plurality of lead electrodes, and the upper surfaces of the plurality of lead electrodes protrude from the sheet region. 9 . The upper surface of the plurality of lead electrodes is flush with the lower surface of the sheet region. 9 . A light-emitting module, characterized in that it comprises a circuit board and a plurality of the luminous bodies according to any one of claims 1 to 8 arranged on the circuit board. 10 . 10. A light-emitting module, characterized in that it comprises a plurality of integrated circuit chips, the integrated circuit chip has an upper surface and a lower surface, and the lower surface of the integrated circuit chip has a plurality of electrical contacts; The circuit board has several setting areas, the setting area has several lead electrodes, the lower surface of the integrated circuit chip is set in the setting area, and the several lead electrodes in the setting area are The setting positions respectively correspond to the setting positions of the plurality of electrical contacts of the integrated circuit chip, and at least part of the plurality of lead electrodes in the setting area each has a protruding portion, and the protruding portion protrudes from the integrated circuit around the lower surface of the circuit chip; a plurality of light-emitting chip sets, the light-emitting chip set has a plurality of light-emitting chips, the plurality of light-emitting chips of the light-emitting chip set are disposed on the upper surface of the integrated circuit chip and each pass through the the protruding portion of the lead electrode is electrically connected to the integrated circuit chip; and A package structure wraps the plurality of light-emitting chip groups and the plurality of integrated circuit chips, and the package structure is connected to the circuit board.

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