CN111411396A - A kind of preparation method of transparent colored silicon carbide polycrystalline plate - Google Patents
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims abstract description 110
- 229910010271 silicon carbide Inorganic materials 0.000 title claims abstract description 108
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 79
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 79
- 239000010439 graphite Substances 0.000 claims abstract description 79
- 239000013078 crystal Substances 0.000 claims abstract description 43
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 238000000034 method Methods 0.000 claims abstract description 21
- 239000002994 raw material Substances 0.000 claims abstract description 15
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 4
- 239000011261 inert gas Substances 0.000 claims description 4
- 239000012159 carrier gas Substances 0.000 claims description 2
- 239000007789 gas Substances 0.000 claims description 2
- 229910052757 nitrogen Inorganic materials 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 1
- 239000000919 ceramic Substances 0.000 abstract description 8
- 238000005520 cutting process Methods 0.000 abstract description 2
- 238000000227 grinding Methods 0.000 abstract description 2
- 238000005498 polishing Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 8
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910001404 rare earth metal oxide Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B28/00—Production of homogeneous polycrystalline material with defined structure
- C30B28/12—Production of homogeneous polycrystalline material with defined structure directly from the gas state
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/36—Carbides
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Abstract
Description
技术领域technical field
本发明涉及一种碳化硅多晶制备方法,具体涉及一种透明彩色碳化硅多晶板的制备方法。The invention relates to a preparation method of silicon carbide polycrystalline, in particular to a preparation method of a transparent colored silicon carbide polycrystalline plate.
背景技术Background technique
碳化硅材料主要在两类领域中有重要的应用。一类为碳化硅单晶形态。主要应用于半导体领域,作为第三代半导体材料,其具有宽禁带、高热导率、大饱和电子漂移速率及大击穿电压等特点,同时也具备较低的介电常数和极好的化学稳定性。上述特性使其在高温、高频、大功率及耐辐射器件上具有重要的应用价值。碳化硅材料特性使其器件在应用集成化、微型化等方面得到重点关注。另一类则为碳化硅陶瓷形态。碳化硅陶瓷具有极好的力学特性,其具有较高的抗弯强度、极好的耐腐蚀性、优秀的抗氧化性及较高的耐磨损性。碳化硅陶瓷材料的结构及特性使其在高温条件下仍具有极好的力学性能。因而碳化硅陶瓷器件可以在很高的温度下稳定工作,其工作温度可以达到1500℃以上。而且碳化硅陶瓷具有极好的热传导性,其已被广泛应用于航空航天、电力电子及通信等设备领域。Silicon carbide materials have important applications in two main fields. One is the single crystal form of silicon carbide. Mainly used in the semiconductor field, as a third-generation semiconductor material, it has the characteristics of wide band gap, high thermal conductivity, large saturation electron drift rate and large breakdown voltage, as well as low dielectric constant and excellent chemical properties. stability. The above characteristics make it have important application value in high temperature, high frequency, high power and radiation resistant devices. The material properties of silicon carbide make its devices focus on application integration and miniaturization. The other type is the form of silicon carbide ceramics. Silicon carbide ceramics have excellent mechanical properties, high flexural strength, excellent corrosion resistance, excellent oxidation resistance and high wear resistance. The structure and properties of silicon carbide ceramic materials make it still have excellent mechanical properties under high temperature conditions. Therefore, the silicon carbide ceramic device can work stably at a very high temperature, and its working temperature can reach more than 1500 ℃. And silicon carbide ceramics have excellent thermal conductivity, which has been widely used in aerospace, power electronics and communication equipment fields.
苛刻的使用环境对于材料的要求也更高。传统碳化硅陶瓷材料的致密性和热导率均匀性等方面的局限使其在应用领域受到限制。而碳化硅单晶材料尽管性能方面更为优越,但其制备技术难度大、成本高,目前市场上最大尺寸碳化硅单晶材料产品为6英寸直径,没有更大尺寸产品出售。当前碳化硅陶瓷产品通常使用稀土氧化物作为烧结助剂,从而提高碳化硅陶瓷的致密性,但会影响其力学性能。The harsh use environment also has higher requirements on materials. The limitations of traditional silicon carbide ceramic materials in terms of compactness and uniformity of thermal conductivity limit their application. Although silicon carbide single crystal material is more superior in performance, its preparation technology is difficult and high cost. At present, the largest size silicon carbide single crystal material product on the market is 6 inches in diameter, and there is no larger size product for sale. Current silicon carbide ceramic products usually use rare earth oxides as sintering aids to improve the compactness of silicon carbide ceramics, but affect their mechanical properties.
发明内容SUMMARY OF THE INVENTION
发明目的:针对上述问题,本发明提供了一种透明彩色碳化硅多晶板的制备方法,通过采用石墨坩埚作为生长容器,石墨坩埚由石墨坩埚盖和石墨坩埚腔体组成;使用图形化碳化硅单晶或多晶衬底片,将衬底片背面固定在石墨坩埚盖内侧,石墨坩埚底部放入碳化硅原料,将石墨坩埚放入高温生长炉中,使石墨坩埚底部位于高温区,顶部位于较低温度区,采用物理气相传输法在图形化碳化硅衬底上生长出碳化硅多晶块;其中,图形化碳化硅单晶或多晶衬底片的厚度为0.2-1毫米,在碳化硅多晶块生长过程中,生长温度为1800℃-2400℃,生长压力保持1-5kPa,生长时间大于30小时,石墨坩埚轴向温度梯度范围在3℃-8℃每厘米。Purpose of the invention: In view of the above problems, the present invention provides a method for preparing a transparent colored silicon carbide polycrystalline plate. By using a graphite crucible as a growth vessel, the graphite crucible is composed of a graphite crucible cover and a graphite crucible cavity; using patterned silicon carbide Single crystal or polycrystalline substrate, fix the back of the substrate on the inside of the graphite crucible cover, put the silicon carbide raw material at the bottom of the graphite crucible, and put the graphite crucible into the high temperature growth furnace, so that the bottom of the graphite crucible is located in the high temperature area, and the top is located in the lower In the temperature zone, a silicon carbide polycrystalline block is grown on a patterned silicon carbide substrate by a physical vapor transport method; wherein, the thickness of the patterned silicon carbide single crystal or polycrystalline substrate is 0.2-1 mm, and the thickness of the patterned silicon carbide single crystal or polycrystalline substrate is 0.2-1 mm. During the growth of the block, the growth temperature is 1800°C-2400°C, the growth pressure is maintained at 1-5kPa, the growth time is more than 30 hours, and the axial temperature gradient of the graphite crucible is in the range of 3°C-8°C per centimeter.
技术方案:为了解决上述技术问题,本发明采用的技术方案为:Technical scheme: in order to solve the above-mentioned technical problems, the technical scheme adopted in the present invention is:
一种透明彩色碳化硅多晶板的制备方法,包括如下步骤:A preparation method of a transparent colored silicon carbide polycrystalline plate, comprising the following steps:
步骤1、准备装置:采用石墨坩埚作为生长容器,所述石墨坩埚由石墨坩埚盖和石墨坩埚腔体组成;Step 1, preparation device: use a graphite crucible as a growth vessel, and the graphite crucible is composed of a graphite crucible cover and a graphite crucible cavity;
步骤2、放置原料:使用图形化碳化硅单晶或多晶衬底片,将所述图形化碳化硅单晶或多晶衬底片背面固定在石墨坩埚盖内侧,石墨坩埚底部放入碳化硅原料,将石墨坩埚放入高温生长炉中,使石墨坩埚底部位于高温区,顶部位于较低温度区;
步骤3、生长碳化硅多晶块:采用物理气相传输法在所述图形化碳化硅衬底上生长出碳化硅多晶块;其中,所述图形化碳化硅单晶或多晶衬底片的厚度为0.2-1mm,在碳化硅多晶块生长过程中,生长温度为1800℃-2400℃,生长压力保持1-5kPa,生长时间大于30h,石墨坩埚轴向温度梯度范围在3℃-8℃每厘米。
进一步的,所述步骤1中,所述石墨坩埚为圆柱壳形,所述石墨坩埚盖通过螺纹与所述石墨坩埚腔体封闭相连。Further, in the step 1, the graphite crucible is in the shape of a cylindrical shell, and the graphite crucible cover is closed and connected to the graphite crucible cavity through threads.
进一步的,所述步骤2中,所述图形化碳化硅单晶或多晶衬底片的开孔深度为10μm-50μm,图形宽度10μm-50μm,图形间距10μm-50μm。Further, in the
进一步的,所述步骤2中,所述图形化碳化硅单晶或多晶衬底片的厚度为0.2-0.8mm。Further, in the
进一步的,所述步骤2中,所述碳化硅原料为纯碳化硅粉,纯度大于99%。Further, in the
进一步的,所述步骤3中,所述生长时间为40-100h。Further, in the
进一步的,所述步骤3中,所述石墨坩埚轴向温度梯度范围在3℃-8℃每厘米。Further, in the
进一步的,所述步骤3中,所述生长方法中,载气为惰性气体与氮气的混合气体。Further, in the
有益效果如下:本发明提供了一种透明彩色碳化硅多晶板的制备方法,制备方法简单,通过使用图形化碳化硅单晶或多晶衬底,得到的透明彩色碳化硅多晶板,不仅色彩明丽,而且致密性及热导率均优于传统碳化硅陶瓷,而且其纯度更高,均匀性好,可以促进碳化硅材料的更广泛应用,其经济成本远远低于单晶材料。The beneficial effects are as follows: the present invention provides a preparation method of a transparent colored silicon carbide polycrystalline plate, the preparation method is simple, and by using a patterned silicon carbide single crystal or polycrystalline substrate, the obtained transparent colored silicon carbide polycrystalline plate not only The color is bright, and the density and thermal conductivity are better than traditional silicon carbide ceramics, and its purity is higher and the uniformity is good, which can promote the wider application of silicon carbide materials, and its economic cost is much lower than that of single crystal materials.
附图说明Description of drawings
图1为本发明的工作示意图。Fig. 1 is the working schematic diagram of the present invention.
其中,1、图形化碳化硅衬底,2、石墨坩埚,3、碳化硅原料,4、加热线圈,5、绝热材料。Among them, 1, patterned silicon carbide substrate, 2, graphite crucible, 3, silicon carbide raw material, 4, heating coil, 5, heat insulating material.
具体实施方式Detailed ways
为了使本专业领域人员更好地理解本发明的技术方案,下面我们将结合具体实施例对本发明作进一步的详细说明。下面描述的实施例为示例性的,仅仅用于解释本发明,而不能理解为对本发明的限制。In order to make those skilled in the art better understand the technical solutions of the present invention, the present invention will be further described in detail below with reference to specific embodiments. The embodiments described below are exemplary, only used to explain the present invention, and should not be construed as a limitation of the present invention.
针对现有技术中存在的上述问题,本发明提供了一种透明彩色碳化硅多晶板的制备方法,通过采用石墨坩埚作为生长容器,石墨坩埚由石墨坩埚盖和石墨坩埚腔体组成;使用图形化碳化硅单晶或多晶衬底片,将衬底片背面固定在石墨坩埚盖内侧,石墨坩埚底部放入碳化硅原料,将石墨坩埚放入高温生长炉中,使石墨坩埚底部位于高温区,顶部位于较低温度区,采用物理气相传输法在图形化碳化硅衬底上生长出碳化硅多晶块;其中,图形化碳化硅单晶或多晶衬底片的厚度为0.2-1毫米,在碳化硅多晶块生长过程中,生长温度为1800℃-2400℃,生长压力保持1-5kPa,生长时间大于30小时,石墨坩埚轴向温度梯度范围在3℃-8℃每厘米。In view of the above problems existing in the prior art, the present invention provides a method for preparing a transparent colored silicon carbide polycrystalline plate. By using a graphite crucible as a growth vessel, the graphite crucible is composed of a graphite crucible cover and a graphite crucible cavity; using a graph Silicon carbide single crystal or polycrystalline substrate, fix the back of the substrate on the inside of the graphite crucible cover, put the silicon carbide raw material at the bottom of the graphite crucible, put the graphite crucible into the high temperature growth furnace, so that the bottom of the graphite crucible is located in the high temperature area, and the top Located in a lower temperature region, a silicon carbide polycrystalline block is grown on a patterned silicon carbide substrate by a physical vapor transport method; wherein, the thickness of the patterned silicon carbide single crystal or polycrystalline substrate is 0.2-1 mm, and the thickness of the patterned silicon carbide single crystal or polycrystalline substrate is 0.2-1 mm. During the growth of the silicon polycrystalline block, the growth temperature is 1800°C-2400°C, the growth pressure is maintained at 1-5kPa, the growth time is more than 30 hours, and the axial temperature gradient of the graphite crucible is in the range of 3°C-8°C per centimeter.
为了解决上述技术问题,本发明采用的技术方案为:如图1所示,一种透明彩色碳化硅多晶板的制备方法,包括下述步骤:In order to solve the above-mentioned technical problems, the technical solution adopted in the present invention is: as shown in Figure 1, a preparation method of a transparent colored silicon carbide polycrystalline plate, comprising the following steps:
1通过采用石墨坩埚2作为生长容器,石墨坩埚2外包裹绝热材料5,石墨坩埚由高纯石墨制成,其由石墨坩埚盖和石墨坩埚腔体组成,石墨坩埚盖通过螺纹与石墨坩埚腔体密封。根据本发明的具体实施例,制备碳化硅多晶板的尺寸要求可在2-10英寸范围选择合适直径的石墨坩埚。1. By using a
2使用图形化碳化硅单晶或多晶衬底片1,将衬底片背面固定在石墨坩埚盖内侧,石墨坩埚底部放入碳化硅原料3,将石墨坩埚放入高温生长炉中,使石墨坩埚底部位于高温区,顶部位于较低温度区。2 Use the patterned silicon carbide single crystal or polycrystalline substrate sheet 1, fix the back of the substrate sheet on the inside of the graphite crucible cover, put the silicon carbide raw material at the bottom of the
根据本发明的具体实施例,所述图形化碳化硅单晶或多晶衬底的晶型、材质和图形化开孔结构的具体形状不受具体限制。根据本发明具体的一些实施例,所述图形化碳化硅单晶或多晶衬底片的材质为碳化硅单晶片及多晶片,晶型为2H-、4H-、6H-、15R-或其它α型结构碳化硅晶片。所述图形化碳化硅单晶或多晶衬底片的开孔形状包括但不限于条纹形、波浪纹形、圆锥形、三棱锥形、圆弧形、方形、倒梯形;所述图形化碳化硅单晶或多晶衬底片的开孔结构的开孔深度为10μm-50μm,图形宽度10μm-50μm,图形间距10μm-50μm。根据本发明的具体实施例,所述图形化碳化硅单晶或多晶衬底的厚度为0.2-1毫米。According to specific embodiments of the present invention, the crystal form, material and specific shape of the patterned open-pore structure of the patterned silicon carbide single crystal or polycrystalline substrate are not particularly limited. According to some specific embodiments of the present invention, the material of the patterned silicon carbide single crystal or polycrystalline substrate sheet is silicon carbide single crystal wafer and polycrystalline wafer, and the crystal form is 2H-, 4H-, 6H-, 15R- or other α Type structure silicon carbide wafers. The shape of the openings of the patterned silicon carbide single crystal or polycrystalline substrate sheet includes, but is not limited to, stripe, wavy, cone, triangular pyramid, arc, square, and inverted trapezoid; the patterned silicon carbide The opening depth of the opening structure of the single crystal or polycrystalline substrate sheet is 10 μm-50 μm, the pattern width is 10 μm-50 μm, and the pattern spacing is 10 μm-50 μm. According to a specific embodiment of the present invention, the thickness of the patterned silicon carbide single crystal or polycrystalline substrate is 0.2-1 mm.
根据本发明的具体实施例,所述图形化碳化硅单晶或多晶衬底与坩埚上盖内侧面之间的固定方式不受具体限制。根据本发明具体的一些实施例,所述图形化碳化硅单晶或多晶衬底通过粘结方式固定在坩埚上盖内侧面。图形化衬底面与碳化硅原料相对放置。碳化硅原料3放于石墨坩埚2内底部,根据本发明的具体实施例,所述碳化硅原料纯度为99.5%,封闭的石墨坩埚放入加热炉中。根据本发明的具体实施例,石墨坩埚放入加热炉后,炉腔密封抽真空,通入惰性气体,根据本发明的具体实施例,所述惰性气体为氩气。所述加热炉的加热线圈4围绕炉腔进行加热,通过石墨坩埚位置上下调节获得合适的热场,根据本发明的具体实施例,所述热场轴向温度梯度范围在3℃-8℃每厘米。According to the specific embodiment of the present invention, the fixing manner between the patterned silicon carbide single crystal or polycrystalline substrate and the inner side surface of the upper cover of the crucible is not particularly limited. According to some specific embodiments of the present invention, the patterned silicon carbide single crystal or polycrystalline substrate is fixed on the inner side of the upper cover of the crucible by means of bonding. The patterned substrate surface is placed opposite the silicon carbide feedstock. The silicon carbide
3采用物理气相传输法在图形化碳化硅衬底上生长出碳化硅多晶块。根据本发明的具体实施例,所述碳化硅多晶块生长生长温度为1800℃-2400℃,生长压力保持1-5kPa,生长时间为50-120小时,石墨坩埚轴向温度梯度范围在3℃-8℃每厘米。3. The silicon carbide polycrystalline block is grown on the patterned silicon carbide substrate by the physical vapor transport method. According to a specific embodiment of the present invention, the growth temperature of the silicon carbide polycrystalline block is 1800°C-2400°C, the growth pressure is maintained at 1-5kPa, the growth time is 50-120 hours, and the axial temperature gradient range of the graphite crucible is 3°C -8°C per cm.
由此,本发明提供了一种透明彩色碳化硅多晶板的制备方法,通过使用图形化碳化硅单晶或多晶衬底片,将石墨坩埚放入加热炉中进行碳化硅晶体生长,生长温度1800℃-2400℃,生长压力1-5kPa,得到的碳化硅多晶体通过切割、研磨、抛光,可以得到透明彩色碳化硅多晶板。Thus, the present invention provides a method for preparing a transparent colored silicon carbide polycrystalline plate. By using a patterned silicon carbide single crystal or polycrystalline substrate sheet, the graphite crucible is put into a heating furnace to grow silicon carbide crystals. The growth temperature is 1800℃-2400℃, the growth pressure is 1-5kPa, and the obtained silicon carbide polycrystal can be cut, ground and polished to obtain a transparent colored silicon carbide polycrystal plate.
在本说明书的描述中,参考术语“实施例”、“具体实施例”、“一些实施例”等的描述意指结合该实施例或示例描述的具体特征、材料、结构或者特点包含于本发明的至少一个实施例中。在本说明书中,对上述术语的示意性表述不一定指的是相同的实施例。而且,描述的具体特征、材料、结构或者特点可以在任何的一个或多个实施例中以合适的方式结合。In the description of this specification, description with reference to the terms "embodiment," "specific embodiments," "some embodiments," etc. means that a particular feature, material, structure, or characteristic described in connection with the embodiment or example is included in the present invention at least one embodiment of . In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment. Furthermore, the particular features, materials, structures or characteristics described may be combined in any suitable manner in one or more embodiments.
尽管给出和描述了本发明的实施例,本领域的技术人员可以理解:在不脱离本发明的原理和宗旨的情况下可以对这些实施例进行多种变化、修改、替换和变型,本发明的范围由权利要求及其等同物限定。Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope is defined by the claims and their equivalents.
具体实施例1Specific Example 1
首先将图形化腐蚀处理的直径3英寸碳化硅多晶衬底片用石墨胶粘在石墨坩埚盖内测面,石墨坩埚腔体底部放入纯度99.6%的碳化硅原料,将石墨坩埚盖旋紧,用保温毡包裹严密放入加热炉中,控制碳化硅原料置于高温区,石墨坩埚盖置于低温区,控制石墨坩埚轴向温度梯度为3℃/cm。将真空度抽至小于1.5×10-2帕斯卡,充入氩气使炉内压强为20Torr,升温至生长温度2150℃,生长80小时,程序控制降温至室温,打开加热炉,开石墨坩埚,即可在石墨坩埚盖上得到厚度为12毫米的碳化硅多晶体,通过切割、研磨、抛光可得透明彩色碳化硅多晶板,总厚度0.9毫米,直径为76毫米。First, the 3-inch-diameter silicon carbide polycrystalline substrate that has been patterned and corroded is glued to the inner measuring surface of the graphite crucible cover with graphite. The bottom of the graphite crucible cavity is put into the silicon carbide raw material with a purity of 99.6%, and the graphite crucible cover is screwed tightly. It is tightly wrapped with thermal insulation felt and placed in the heating furnace, the silicon carbide raw material is controlled to be placed in the high temperature area, the graphite crucible cover is placed in the low temperature area, and the axial temperature gradient of the graphite crucible is controlled to be 3°C/cm. Pump the vacuum to less than 1.5 × 10 -2 Pascals, fill with argon to make the pressure in the furnace 20 Torr, heat up to the growth temperature of 2150 ° C, grow for 80 hours, program control to cool down to room temperature, open the heating furnace, and open the graphite crucible, that is, Silicon carbide polycrystals with a thickness of 12 mm can be obtained on the graphite crucible cover, and transparent colored silicon carbide polycrystalline plates can be obtained by cutting, grinding and polishing, with a total thickness of 0.9 mm and a diameter of 76 mm.
碳化硅晶体生长通常继承籽晶的晶型结构,但是也与籽晶生长面有关,浅黄色4H-晶型晶体可在(000-1)面生长,绿色6H-晶型晶体和褐色的15R-晶型晶体可在(11-20)面或(1-100)面生长。所以本发明选择图形化碳化硅晶体衬底,可以提供分散多区域的不同生长面。因而可获得透明彩色碳化硅多晶板。Silicon carbide crystal growth usually inherits the crystal structure of the seed crystal, but it is also related to the growth surface of the seed crystal. The light yellow 4H-crystal can grow on the (000-1) plane, the green 6H-crystal and the brown 15R- The crystal form can be grown on the (11-20) plane or the (1-100) plane. Therefore, the present invention selects the patterned silicon carbide crystal substrate, which can provide different growth surfaces with dispersed multiple regions. Thus, a transparent colored silicon carbide polycrystalline plate can be obtained.
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| CN106757355A (en) * | 2016-12-09 | 2017-05-31 | 河北同光晶体有限公司 | A kind of growing method of gemstones formed of silicon carbide |
| CN110042469A (en) * | 2019-04-29 | 2019-07-23 | 南通大学 | A kind of preparation method of pattern gemstones formed of silicon carbide |
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| CN106757355A (en) * | 2016-12-09 | 2017-05-31 | 河北同光晶体有限公司 | A kind of growing method of gemstones formed of silicon carbide |
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