CN111403884A - How to make a patch circulator - Google Patents

Abstract

The invention discloses a manufacturing method of a patch-type circulator. The metal parts are injection-molded to obtain a metal injection-molded component; a capacitor and a resistor are respectively mounted on the metal injection-molded component; Bonding PI film; Bending the branch of the integrated central conductor with the PI film along the outer sidewall of the ferrite used to make the SMD circulator to make the projection of the center of the PI film in the vertical direction Overlapping with the projection of the center of the ferrite in the vertical direction to obtain a central conductor assembly; assembling the central conductor assembly and the metal injection assembly, and then assembling the capacitor and the resistor with the integrated The central conductor is fixed to obtain a main body assembly; the lower casing, the upper casing with permanent magnets and the main body assembly are assembled and fixed to obtain the patch type circulator. The manufacturing precision and assembly efficiency can be effectively improved, and the circulator can be developed in the direction of miniaturization.

Description

How to make a patch circulator

technical field

The invention relates to the technical field of circulators, in particular to a manufacturing method of a patch type circulator.

Background technique

With the popularization of microwave communication systems, circulators have been an important part of microwave communication systems since their inception. Circulators have been widely used in 5G working base stations, and the demand will be huge in the future. At the same time, circulators are also developing towards miniaturization of devices. , which brings new challenges to the mass production and manufacturing assembly process of the SMD circulator.

SUMMARY OF THE INVENTION

The technical problem to be solved by the present invention is to provide a manufacturing method of a patch type circulator, which can effectively improve the manufacturing efficiency and assembly precision.

In order to solve the above-mentioned technical problems, the technical scheme adopted in the present invention is:

A method for manufacturing a patch-type circulator, the metal parts used for manufacturing the patch-type circulator are injection-molded to obtain a metal injection-molded component; the capacitors and resistors used for manufacturing the patch-type circulator are respectively mounted on the On the metal injection molding assembly; glue the PI film on the branch of the one-piece center conductor for making the SMD circulator; attach the branch of the center conductor with the PI film along the iron used for making the SMD circulator The outer side wall of the oxygen body is bent so that the projection of the center of the PI film in the vertical direction overlaps with the projection of the center of the ferrite in the vertical direction to obtain a center conductor assembly; The metal injection molding assembly is assembled, and then the capacitor and the resistor are respectively fixed with the integrated central conductor to obtain the main assembly; the lower casing, the upper casing with the permanent magnet and the main assembly are assembled fixed to obtain the patch-type circulator.

The beneficial effect of the present invention is that: the central conductor adopts an integrated structure, and only needs to be bent along the outer side wall of the ferrite when bending, which can effectively reduce the production process, improve the production efficiency, and can also reduce the size of the circulator. The internal space of the circulator is conducive to the miniaturization of the circulator; the metal injection components, capacitors and resistors can all use the material tape as the component carrier, which is convenient for positioning during processing and assembly, and improves the assembly accuracy and efficiency.

Description of drawings

1 is a schematic structural diagram of a metal part in a SMD circulator according to Embodiment 1 of the present invention;

FIG. 2 is a partial structural schematic diagram of the SMD circulator according to Embodiment 1 of the present invention;

3 is a schematic structural diagram of a SMD circulator in a manufacturing process according to Embodiment 1 of the present invention;

4 is a schematic structural diagram of another part of the SMD circulator according to Embodiment 1 of the present invention;

5 is a schematic structural diagram of another part of the SMD circulator according to Embodiment 1 of the present invention;

FIG. 6 is a schematic diagram of the overall structure of the SMD circulator according to the first embodiment of the present invention.

Label description:

1. Metal parts; 2. Metal injection components; 3. Capacitor; 4. Resistor; 5. One-piece center conductor; 6. PI film; 7. Center conductor assembly; 8. Ferrite; 9. Lower shell; 10 , the upper shell.

Detailed ways

In order to describe in detail the technical content, achieved objects and effects of the present invention, the following descriptions are given with reference to the embodiments and the accompanying drawings.

The key concept of the present invention is that the central conductor adopts an integrated structure, and only needs to be bent along the outer side wall of the ferrite when bending, which can effectively reduce the manufacturing process and improve the manufacturing efficiency.

Please refer to FIG. 1 to FIG. 6 , a method of manufacturing a patch-type circulator. The metal part 1 used for making the patch-type circulator is injection-molded to obtain a metal injection component 2; The capacitor 3 and the resistor 4 of the device are respectively mounted on the metal injection component 2; the PI film 6 is bonded on the branch of the integrated central conductor 5 used for making the SMD circulator; the PI film 6 will be bonded The branch of the center conductor is bent along the outer side wall of the ferrite 8 used to make the SMD circulator, so that the projection of the center of the PI film 6 in the vertical direction is in the vertical direction with the center of the ferrite 8. The projections in the straight direction are overlapped to obtain the center conductor assembly 7; the center conductor assembly 7 is assembled with the metal injection molding assembly 2, and then the capacitor 3 and the resistor 4 are respectively fixed with the integrated center conductor 5 , the main body assembly is obtained; the lower casing 9 , the upper casing 10 with permanent magnets and the main body assembly are assembled and fixed to obtain the patch type circulator.

It can be seen from the above description that the beneficial effects of the present invention are: the central conductor adopts an integrated structure, and only needs to be bent along the outer side wall of the ferrite when bending, which can effectively reduce the production process, improve the production efficiency, and also The internal space of the circulator can be reduced, which is conducive to the development of the circulator towards miniaturization; the metal injection components, capacitors and resistors can all use the material tape as the component carrier, which is convenient for positioning during processing and assembly, and improves assembly accuracy and efficiency.

Further, the metal material strip is punched and formed to obtain the metal piece 1 .

Further, solder paste is applied on the metal part 1 of the metal injection molding assembly 2 , and then the capacitor 3 and the resistor 4 are respectively mounted on the metal part 1 by a robot.

It can be seen from the above description that the placement accuracy and efficiency can be improved by manipulator operation.

Further, the PI film 6 is obtained by processing by means of die-cutting.

Further, the one-piece center conductor 5 is obtained by processing by means of die-cutting.

It can be seen from the above description that both the PI film and the one-piece center conductor are processed by die-cutting molding, and the positioning methods of the two are consistent, which can improve assembly accuracy and efficiency.

Further, the one-piece central conductor 5 includes three branches with an angle of 120° to each other, and a PI film 6 is adhered to each of the branches.

It can be seen from the above description that each branch is separated by a PI film after bending.

Further, solder paste is applied on the capacitor 3 , the resistor 4 and the one-piece center conductor 5 respectively, and then the center conductor assembly 7 is assembled with the metal injection molding assembly 2 .

Further, the capacitor 3 and the resistor 4 are respectively welded and fixed with the integrated central conductor 5 .

Further, the main body assembly is assembled between the upper casing 10 and the lower casing 9 , and then the upper casing 10 and the lower casing 9 are welded and fixed.

It can be seen from the above description that the upper casing and the lower casing are welded and fixed, and the fixing effect is good.

Further, the patch-type circulator is inspected, coded and packaged in sequence.

Please refer to FIG. 1 to FIG. 6 , the first embodiment of the present invention is:

A manufacturing method of a patch-type circulator, comprising the following steps:

1. Carry out injection molding of the metal part 1 used for making the patch circulator to obtain a metal injection molding component 2 .

In this embodiment, the metal strip needs to be punched and formed first to obtain the metal piece 1 , and the structure of the obtained metal piece 1 is shown in FIG. 1 . Then, the metal part 1 is injection-molded by an injection mold to obtain a metal injection-molded component 2, and the material belt for transporting the metal injection-molded component 2 is provided with a round hole for positioning in the subsequent assembly process.

2. Mount the capacitor 3 and the resistor 4 for making the SMD circulator on the metal injection component 2 respectively.

First, smear solder paste on the metal part 1 of the metal injection molding assembly 2, and then use a robot to mount the capacitor 3 and the resistor 4 on the metal part 1 respectively to obtain the structure shown in FIG. 2 . Capacitor 3 and Resistor 4 are packaged with blue film, which is convenient for visual positioning during placement and easy for manipulators to grip.

3. Adhere the PI film 6 on the branch of the one-piece center conductor 5 for making the SMD circulator.

In this embodiment, the PI film 6 and the integrated central conductor 5 are obtained by die-cutting, and glue is applied to one side of the PI film 6 before bonding. As shown in FIG. 3 , the integrated central conductor 5 includes three branches with an angle of 120° to each other, and a PI film 6 is adhered to each of the branches. The PI film 6 and the one-piece center conductor 5 are transported using material tapes with the same positioning holes, so that the subsequent PI film 6 can be accurately bonded to the designated position of the one-piece center conductor 5 .

4. Bend the branch of the integrated central conductor 5 with the PI film 6 along the outer side wall of the ferrite 8 used to make the SMD circulator, so that the center of the PI film 6 is in the vertical direction. The projection overlaps with the projection of the center of the ferrite 8 in the vertical direction, and the center conductor assembly 7 is obtained.

As shown in FIG. 4 , the shape of the ferrite 8 is cylindrical, and the PI film 6 is circular. After bending, the ferrite 8 is wrapped in the one-piece center conductor 5 , and each branch is separated by the PI film 6 .

5. Assemble the central conductor assembly 7 and the metal injection assembly 2, and then fix the capacitor 3 and the resistor 4 with the integrated central conductor 5 respectively to obtain a main body assembly.

Before assembly, apply solder paste on the capacitor 3, the resistor 4 and the integrated center conductor 5 respectively; after assembly, the capacitor 3 and the resistor 4 are respectively welded and fixed with the integrated center conductor 5, and finally the The structure shown in Figure 5.

6. Assemble and fix the lower casing 9, the upper casing 10 with permanent magnets, and the main body assembly to obtain the patch-type circulator.

In this embodiment, the materials of the upper casing 10 and the lower casing 9 are both metal, and the permanent magnets are adsorbed on the upper casing 10 by magnetic attraction. First, the main body assembly is assembled between the upper casing 10 and the lower casing 9, and then the upper casing 10 and the lower casing 9 are welded and fixed to obtain the patch ring as shown in FIG. 6 . device.

Finally, the patch circulator is inspected, coded and packaged in sequence.

To sum up, the manufacturing method of a patch-type circulator provided by the present invention can effectively improve the manufacturing efficiency and assembly accuracy, and is conducive to the miniaturization of the circulator.

The above descriptions are only examples of the present invention, and are not intended to limit the scope of the present invention. Any equivalent transformations made by using the contents of the description and drawings of the present invention, or directly or indirectly applied in related technical fields, are similarly included in the within the scope of patent protection of the present invention.

Claims (10)

1. a manufacture method of a patch type circulator, it is characterized in that, will be used for making the metal part of patch type circulator to carry out injection molding, obtain metal injection molding assembly; The resistors are respectively mounted on the metal injection components; the PI film is bonded on the branch of the integrated central conductor used for making the SMD circulator; the branch of the integrated central conductor with the PI film is bonded along the branch used for The outer side wall of the ferrite for making the patch circulator is bent so that the projection of the center of the PI film in the vertical direction overlaps with the projection of the center of the ferrite in the vertical direction to obtain a center conductor assembly ; Assemble the center conductor assembly and the metal injection molding assembly, and then fix the capacitor and the resistor with the integrated center conductor respectively to obtain a main body assembly; Assemble the lower shell, the upper shell with permanent magnets The body and the body assembly are assembled and fixed to obtain the patch-type circulator. 2 . The method for manufacturing a patch-type circulator according to claim 1 , wherein the metal piece is obtained by punching and forming a metal material strip. 3 . 3. The manufacturing method of a patch type circulator according to claim 1, characterized in that, smearing solder paste on the metal parts of the metal injection molding assembly, and then using a robot to mount the capacitor and the resistor on the metal respectively on the piece. 4 . The method for manufacturing a patch-type circulator according to claim 1 , wherein the PI film is obtained by processing by means of die-cutting. 5 . 5 . The method for manufacturing a patch-type circulator according to claim 1 , wherein the one-piece central conductor is obtained by processing by means of die-cutting. 6 . 6 . The manufacturing method of a patch type circulator according to claim 5 , wherein the one-piece central conductor comprises three branches with an angle of 120° to each other, and each of the branches is bonded with a PI film. 7 . The method for manufacturing a chip circulator according to claim 1 , wherein solder paste is applied on the capacitor, the resistor and the integrated center conductor respectively, and then the center conductor assembly is combined with the metal Injection molded components for assembly. 8 . The method for manufacturing a chip circulator according to claim 7 , wherein the capacitor and the resistor are respectively welded and fixed to the integral central conductor. 9 . 9 . The method for manufacturing a patch-type circulator according to claim 1 , wherein the main body assembly is assembled between the upper casing and the lower casing, and then the upper casing and the lower casing are assembled together. 10 . The shell is welded and fixed. 10 . The method for manufacturing a patch-type circulator according to claim 1 , wherein the patch-type circulator is inspected, sprayed, and packaged in sequence. 11 .

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