CN111408515A - Dispensing device, dispensing method and electronic device - Google Patents
Dispensing device, dispensing method and electronic device Download PDFInfo
- Publication number
- CN111408515A CN111408515A CN201910011218.XA CN201910011218A CN111408515A CN 111408515 A CN111408515 A CN 111408515A CN 201910011218 A CN201910011218 A CN 201910011218A CN 111408515 A CN111408515 A CN 111408515A
- Authority
- CN
- China
- Prior art keywords
- electric field
- conducting layer
- glue
- light
- dispensing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 25
- 239000003292 glue Substances 0.000 claims abstract description 67
- 230000005684 electric field Effects 0.000 claims abstract description 55
- 238000000016 photochemical curing Methods 0.000 claims abstract description 52
- 238000001723 curing Methods 0.000 claims abstract description 37
- 238000007711 solidification Methods 0.000 claims abstract description 10
- 230000008023 solidification Effects 0.000 claims abstract description 10
- 230000000694 effects Effects 0.000 claims abstract description 6
- 239000000853 adhesive Substances 0.000 claims description 47
- 230000001070 adhesive effect Effects 0.000 claims description 47
- 239000000835 fiber Substances 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims description 2
- 230000002349 favourable effect Effects 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 71
- 239000011521 glass Substances 0.000 description 4
- 239000002923 metal particle Substances 0.000 description 4
- 238000009825 accumulation Methods 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 230000002776 aggregation Effects 0.000 description 2
- 238000004220 aggregation Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/002—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the work consisting of separate articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
- B05D1/04—Processes for applying liquids or other fluent materials performed by spraying involving the use of an electrostatic field
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The application provides a dispensing device and a dispensing method, which are used for dispensing light curing glue between a first part and a second part of an electronic device, and a conducting layer is arranged between the first part and the second part. This application is connected to the negative pole of power first part with conducting layer between the second part is in order to form an electric field, the nozzle to spout photocuring glue in the electric field, photocuring glue is in stretched into fibrous and being in under the effect of electric field the surface gathering of conducting layer, light source irradiation are located the photocuring of conducting layer surface is glued so that its solidification, and photocuring glue is in the surface of conducting layer gathers layer upon layer, the light source is to photocuring glue real-time curing, makes range upon range of and is in the photocuring of conducting layer surface is glued uniformly once only solidification design, has guaranteed the connection stability between first part and the second part among the electron device, is favorable to electron device's follow-up assembly and use.
Description
Technical Field
The invention relates to the technical field of dispensing, in particular to a dispensing device, a dispensing method and an electronic device.
Background
The UV (ultraviolet rays) glue has the characteristics of environmental protection, safety, high bonding strength, quick curing and the like, and is widely applied to the fields of technical glass, electronic and electrical products and optics. However, UV glue must be cured by irradiation with ultraviolet rays to achieve stable connection between parts. At present, people mainly adopt the UV lamp to solidify UV glue, although the ultraviolet ray has fine penetrating quality, often can't penetrate the UV glue film completely, can't realize the even solidification to UV glue, lead to being connected unstablely between part and the part, seriously influenced the assembly and the use of device follow-up process.
Disclosure of Invention
An object of this application is to provide a dispensing device for to point scribble photocuring between first part and the second part of electron device and glue, and the uniform cure is located first part with photocuring between the second part glues, improves in the electron device first part with connection stability between the second part makes things convenient for electron device's follow-up assembly and use.
The application also provides a dispensing method and an electronic device.
This application dispensing device includes power, nozzle and light source, the negative pole of power is connected conducting layer in the gap is in order to provide an electric field, the nozzle be used for to spout photocuring in the electric field and glue, photocuring glues to be in the effect of electric field is in down the surface gathering of conducting layer, the light source is used for shining and is located photocuring on conducting layer surface glues and makes and is located the photocuring on conducting layer surface glues the solidification, in order to realize right first part with point between the second part is glued and is glued the uniform cure who glues to photocuring, improves first part with connection stability between the second part.
The voltage provided by the power supply is more than 7kv, so that the light-cured adhesive sprayed from the nozzle enters the electric field, is stretched into a fiber shape under the action of the high-voltage electric field, and is gathered on the surface of the conductive layer.
Wherein the nozzle is made of a conductive material, and a positive electrode of the power supply is connected to the nozzle to form the electric field between the nozzle and the conductive layer.
The dispensing device further comprises a conductive piece, a through hole is formed in the conductive piece, the nozzle is opposite to the through hole, and the positive electrode of the power supply is connected with the conductive piece so as to form the electric field between the conductive piece and the conductive layer.
The voltage provided by the power supply is more than 10kv, so that the photocuring glue can be fully stretched into a fiber shape, and can be gathered on the surface of the conductive layer by layer.
The dispensing method comprises the following steps:
the method comprises the following steps that firstly, a power supply is started to form an electric field, wherein the conducting layer is connected with the negative electrode of the power supply;
secondly, spraying light curing glue into the electric field by a nozzle, wherein the light curing glue is gathered on the surface of the conducting layer under the action of the electric field;
and thirdly, irradiating the light-cured glue on the surface of the conducting layer by a light source to cure the light-cured glue on the surface of the conducting layer.
The voltage provided by the power supply is more than 7kv, so that the light-cured adhesive sprayed from the nozzle enters the electric field, is stretched into a fiber shape under the action of the high-voltage electric field, and is gathered on the surface of the conductive layer.
In the second step, the light-cured adhesive is stretched into a fiber shape under the action of the electric field and is gathered on the surface of the conductive layer so as to realize layer-by-layer accumulation on the surface of the conductive layer, and the light source is convenient for curing and shaping the light-cured adhesive in real time.
The dispensing method further comprises the following steps:
and a fifth step of repeating the second step and the third step until a light-curing adhesive is filled between the first component and the second component to connect the first component and the second component.
This application electronic device includes first part and second part, first part with be equipped with the conducting layer between the second part and cover the photocuring glue film of conducting layer, photocuring glue film is connected first part with the second part.
This application adhesive deposite device and adhesive deposite method are connected to the negative pole of power in the electron device conducting layer between first part and the second part in order to form an electric field, the nozzle to spout photocuring glue in the electric field, photocuring glue is in stretched into the fibre form under the effect of electric field is in the surface gathering of conducting layer, light source irradiation are located the photocuring on conducting layer surface is glued so that its solidification, and photocuring is glued and is in the surface of conducting layer gathers layer upon layer, the light source is glued real-time curing to photocuring, makes photocuring in the gap glues once only solidification uniformly, has guaranteed the connection stability between first part and the second part among the electron device, is favorable to electron device's follow-up assembly and use.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an embodiment of a dispensing apparatus according to the present application.
Fig. 2 is a schematic structural view of a conventional electronic device.
Fig. 3 is a schematic structural diagram of another embodiment of a dispensing apparatus according to the present application.
Fig. 4 is a schematic flow chart of a dispensing method according to the present application.
Fig. 5 is a schematic structural view of an electronic device according to the present application.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, the present application provides a dispensing apparatus 100 for dispensing a photo-curable adhesive between a first part 210 and a second part 220 of an electronic device 200, wherein a conductive layer 230 is disposed between the first part 210 and the second part 220. The dispensing device 100 includes a power source 10, a nozzle 20, and a light source 30. The power source 10 provides an electric field, the negative electrode is connected with the conductive layer 230, and the nozzle 20 sprays light-curing glue into the electric field, wherein the light-curing glue is gathered on the surface of the conductive layer 230 under the action of the electric field. The light source 30 irradiates the light-curing adhesive on the surface of the conductive layer 230 to cure the light-curing adhesive on the surface of the conductive layer 230. In this embodiment, the light-curing adhesive is an ultraviolet light-curing adhesive, and the light source 30 is an ultraviolet lamp.
The in-process that the photocuring glued is scribbled to adhesive deposite device 100 that this application shows, power 10 provides an electric field and negative pole and connects conducting layer 230, nozzle 20 to spout photocuring in the electric field and glue, photocuring glues to be in under the effect of electric field to the surface gathering of conducting layer 230, light source 30 shines the photocuring that is located conducting layer 230 surface and glues, makes the photocuring that is located conducting layer 230 surface glue solidify in real time. The light-cured glue is gathered on the surface of the conducting layer 230 layer by layer, and ultraviolet rays can uniformly cure the light-cured glue from inside to outside, so that the light-cured glue is cured and shaped at one time, the problems of glue partial gathering after glue dispensing or glue shrinkage caused by subsequent high-temperature cured glue are effectively avoided, and the subsequent assembly and use of the electronic device 200 are facilitated.
Before understanding the dispensing apparatus 100 of the present application, the electronic device 200 will be described. Referring to fig. 2, in the present embodiment, the conductive layer 230 is made of a metal material. The conductive layer 230 is disposed on a surface of the second member 220 facing the first member 210, and a gap 240 is formed between the conductive layer 230 and the first member 210. The gap 240 is filled with a light-curable adhesive. The conductive layer 230 is connected to the negative electrode of the power supply 10, and the light-curing adhesive is uniformly gathered on the surface of the conductive layer 230 under the action of the electric field force to fill the gap 240. In this application, the conductive layer 230 may be a part of the electronic device 200 itself, or the conductive layer 230 may be a part that is subsequently added between the first part 210 and the first part 220. It is understood that the electronic device 200 may be a camera module or other electronic devices that require a light-cured adhesive to increase the connection firmness between the components, and the present application is not limited thereto.
Referring again to fig. 1, the nozzle 20 is made of a conductive material, and the positive electrode of the power supply 10 is connected to the nozzle 20 to form the electric field between the nozzle 20 and the conductive layer 230. In this embodiment, the voltage supplied by the power supply 10 is above 7kv to form a high voltage electric field, so that the light-curing adhesive sprayed from the nozzle 20 enters the electric field and is stretched into a fiber shape, and the fiber-shaped light-curing adhesive is gathered on the surface of the conductive layer 230 along with the direction of the electric field. Preferably, the voltage supplied by the power source 10 is above 10kv to ensure that the light-curable adhesive can be sufficiently stretched into fiber shape, so as to be gathered on the surface of the conductive layer 230 layer by layer. In other embodiments, the nozzle may be made of a non-conductive material such as glass or plastic (tetrafluoroethylene). The emitting electrode adopts a glass tube, the rear end of the glass tube adopts a metal plate, and the metal plate is connected with the anode to form an electric field. In other words, the glue is in the electric field as long as the electric field is formed between the nozzle 20 and the conductive layer 230.
Further, the dispensing apparatus 100 includes a syringe 201, and the nozzle 20 is a metal needle of the syringe 201. Specifically, the syringe 201 further includes a syringe 21 and a plunger 22. The syringe 21 is communicated with the nozzle 20, and the light curing adhesive is stored in the syringe 21. One end of the push rod 22 is accommodated in the syringe 21, and the other end extends out of the syringe 21, so as to push the push rod 22 to move toward the nozzle 20, so as to extrude the light-cured adhesive in the syringe 21 out of the nozzle 20. It should be noted that, in the embodiment, the pushing rod 22 is a micro pushing ram to precisely control the amount of the photo-curing adhesive, so as to effectively avoid the problem that the connection between the components of the electronic device 200 is not firm due to too small amount of the photo-curing adhesive, or the product yield is affected due to local aggregation of the photo-curing adhesive due to too much amount of the photo-curing adhesive.
Referring to fig. 3, another embodiment of the dispensing device 100 is different from the above embodiments in that the dispensing device 100 includes a conductive member 40, the conductive member 40 has a through hole 41, the nozzle 20 faces the through hole 41, and the positive electrode of the power source 10 is connected to the conductive member 40 to form an electric field between the conductive member 40 and the conductive layer 230. Specifically, the nozzle 20 extends into the through hole 41 to directly spray the light-curing adhesive into the electric field. It is understood that, in the present embodiment, the nozzle 20 may be made of an insulating material or a conductive material, and the present embodiment is not particularly limited thereto.
Referring to fig. 1 and 3 again, in the present application, there are two light sources 30, and the two light sources 30 irradiate the light-cured adhesive on the surface of the conductive layer 230 in real time. It should be understood that a plurality of metal particles are disposed in the light curing adhesive, and when the ultraviolet light is irradiated on the light curing adhesive, the plurality of metal particles absorb the ultraviolet light to cause the light curing adhesive and the ultraviolet light to resonate to generate heat, so that the ultraviolet light can cure the light curing adhesive in real time. It is understood that the number of the light sources 30 may be one or more than three, which is not limited in the present application.
Referring to fig. 4, the present application provides a dispensing method, which applies a light curing adhesive between a first component 210 and a second component 220 of an electronic device 200 by using the dispensing apparatus 100 according to the first embodiment, and a conductive layer 220 is disposed between the first component 210 and the second component 220. The dispensing method comprises the following steps:
in the first step, the power source 10 is activated to form an electric field, wherein the negative electrode of the power source 10 is connected to the conductive layer 230. Specifically, referring to fig. 2, the positive electrode of the power source 10 is connected to the nozzle 20 to form the electric field between the nozzle 20 and the conductive layer 230. Further, the voltage supplied by the power source 10 is above 7kv to form a high voltage electric field. Preferably, the voltage supplied by the power supply 10 is above 10 kv.
In the second step, the nozzle 20 sprays light-curing adhesive into the electric field, and the light-curing adhesive is gathered on the surface of the conductive layer 230 under the action of the electric field. Specifically, the light-curable adhesive is ejected from the conductive nozzle and then stretched into a fiber shape under the action of the electric field, and the fiber-shaped light-curable adhesive is gathered layer by layer on the surface of the conductive layer 230 according to the direction of the electric field force of the electric field.
In the third step, the light source 30 irradiates the light-curing adhesive on the surface of the conductive layer 230 to cure the light-curing adhesive on the surface of the conductive layer 230. Specifically, a plurality of metal particles are arranged in the photo-curing adhesive, and when ultraviolet light irradiates the photo-curing adhesive, the plurality of metal particles absorb the ultraviolet light, so that the photo-curing adhesive and the ultraviolet light resonate to generate heat, and the photo-curing adhesive is cured.
In addition, the dispensing method further comprises the following steps:
and a fourth step of repeating the second step and the third step until the space between the first component and the second component is filled with the light-curing glue. Specifically, the light source 30 cures the photo-curing adhesive in real time, the photo-curing adhesive is stacked on the surface of the conductive layer 230 layer by layer, and the ultraviolet light heats and cures the photo-curing adhesive layer by layer until the gap 240 is completely stacked by the cured photo-curing adhesive, so as to connect the first component 210 and the second component 220, thereby completing the dispensing process of the electronic device 200. In this embodiment, the good penetrating ability of the ultraviolet rays enables the photo-curing glue on the surface of the conductive layer 230 to be uniformly heated and cured from inside to outside, so that one-time curing of the photo-curing glue is realized, the problems of local aggregation of glue after glue dispensing and shrinkage caused by subsequent high-temperature curing glue are effectively avoided, the product yield of the electronic device 200 is improved, and the subsequent assembly and use of the electronic device 200 are facilitated.
Referring to fig. 5, the present application further provides an electronic device 300, where the electronic device 300 includes a first component 310 and a second component 320, a conductive layer 330 and a light-curing adhesive layer 340 covering the conductive layer 330 are disposed between the first component 310 and the second component 320, and the light-curing adhesive layer 340 connects the first component 310 and the second component 320.
This application the method is glued to point adopts contactless point and glues the method, utilize high-tension electric field's effort, make the photocuring glue that erupts from nozzle 20 under the effect of high-tension electric field and stretched into fibrous, and gather at electron device 200's conducting layer 230 surface along the direction of electric field force, adopt light source 30 to shine real-time solidification in real time again, photocuring glue is at the surface layer-by-layer accumulation of conducting layer 230, light source 30 has realized rising the solidification from inside to outside uniformly to the photocuring glue of accumulation, and realized the disposable solidification of photocuring glue and qualitative, glue local gathering after the point is glued or follow-up high temperature curing glue has effectively been avoided making bad problems such as glue water glue shrinkage, electronic device 200 product yield has been promoted, be favorable to electron device 200's follow-up assembly and use.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.
Claims (10)
1. The utility model provides a dispensing device for to point scribble photocuring glue between electron device's the first part and the second part, wherein, the first part with be provided with the conducting layer between the second part, a serial communication port, dispensing device includes power, nozzle and light source, the power provides an electric field just the negative pole of power is connected the conducting layer, the nozzle be used for to spout photocuring glue in the electric field, photocuring glue is in under the effect of electric field the surface gathering of conducting layer, the light source is used for shining and is located the photocuring glue on conducting layer surface makes and is located the photocuring glue solidification on conducting layer surface.
2. The dispensing device of claim 1, wherein the voltage provided by the power source is above 7 kv.
3. A dispensing apparatus according to claim 1 or 2, wherein the nozzle is made of an electrically conductive material, and the positive pole of the power source is connected to the nozzle to form the electric field between the nozzle and the electrically conductive layer.
4. The dispensing device of claim 1 or 2, further comprising a conductive member, wherein the conductive member has a through hole, the nozzle faces the through hole, and the positive electrode of the power source is connected to the conductive member to form the electric field between the conductive member and the conductive layer.
5. The dispensing device of claim 2, wherein the voltage provided by the power source is above 10 kv.
6. A method of dispensing a light curable adhesive between a first component and a second component of an electronic device, wherein a conductive layer is disposed between the first component and the second component, the method comprising:
the method comprises the following steps that firstly, a power supply is started to form an electric field, wherein the negative pole of the power supply is connected with the conducting layer;
secondly, spraying light curing glue into the electric field by a nozzle, wherein the light curing glue is gathered on the surface of the conducting layer under the action of the electric field;
and thirdly, irradiating the light-cured glue on the surface of the conducting layer by a light source to cure the light-cured glue on the surface of the conducting layer.
7. The method of dispensing of claim 6, wherein the voltage provided by the power source is above 7 kv.
8. The dispensing method of claim 6, wherein in the second step, the light-curable adhesive is stretched into a fiber shape under the action of the electric field and gathered on the surface of the conductive layer.
9. A method of dispensing in accordance with any of claims 6 to 8, wherein said method further comprises:
and a fifth step of repeating the second step and the third step until the space between the first component and the second component is filled with the light-curing glue.
10. An electronic device, characterized in that, electronic device includes first part and second part, be provided with the conducting layer between first part with the second part and cover the photocuring of conducting layer is glued, photocuring glue connect first part with the second part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910011218.XA CN111408515A (en) | 2019-01-07 | 2019-01-07 | Dispensing device, dispensing method and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910011218.XA CN111408515A (en) | 2019-01-07 | 2019-01-07 | Dispensing device, dispensing method and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111408515A true CN111408515A (en) | 2020-07-14 |
Family
ID=71486826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910011218.XA Pending CN111408515A (en) | 2019-01-07 | 2019-01-07 | Dispensing device, dispensing method and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111408515A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113013045A (en) * | 2021-03-09 | 2021-06-22 | 鑫金微半导体(深圳)有限公司 | Novel rapid packaging method for COB packaged integrated circuit |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59127840A (en) * | 1983-01-13 | 1984-07-23 | Toshiba Corp | Deposition of organic film and device therefor |
| CN103560075A (en) * | 2013-09-25 | 2014-02-05 | 友达光电股份有限公司 | Method of Bonding and Separating Substrates |
| CN103717688A (en) * | 2011-07-22 | 2014-04-09 | H.B.富勒公司 | A reactive hot-melt adhesive for use on electronics |
| CN105116629A (en) * | 2015-09-16 | 2015-12-02 | 京东方科技集团股份有限公司 | Frame sealing glue combination, display panel, preparation method of display panel and display device |
| CN105196550A (en) * | 2015-10-30 | 2015-12-30 | 兰红波 | Multi-material multi-scale 3D (3-dimensional) printing device provided with single spray nozzle as well as working method of 3D printing device |
| CN107214945A (en) * | 2017-06-30 | 2017-09-29 | 青岛理工大学 | Electric field driven jet deposition 3D printing device and working method thereof |
-
2019
- 2019-01-07 CN CN201910011218.XA patent/CN111408515A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59127840A (en) * | 1983-01-13 | 1984-07-23 | Toshiba Corp | Deposition of organic film and device therefor |
| CN103717688A (en) * | 2011-07-22 | 2014-04-09 | H.B.富勒公司 | A reactive hot-melt adhesive for use on electronics |
| CN103560075A (en) * | 2013-09-25 | 2014-02-05 | 友达光电股份有限公司 | Method of Bonding and Separating Substrates |
| CN105116629A (en) * | 2015-09-16 | 2015-12-02 | 京东方科技集团股份有限公司 | Frame sealing glue combination, display panel, preparation method of display panel and display device |
| CN105196550A (en) * | 2015-10-30 | 2015-12-30 | 兰红波 | Multi-material multi-scale 3D (3-dimensional) printing device provided with single spray nozzle as well as working method of 3D printing device |
| CN107214945A (en) * | 2017-06-30 | 2017-09-29 | 青岛理工大学 | Electric field driven jet deposition 3D printing device and working method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113013045A (en) * | 2021-03-09 | 2021-06-22 | 鑫金微半导体(深圳)有限公司 | Novel rapid packaging method for COB packaged integrated circuit |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE102005034155B3 (en) | Lens for focusing electromagnetic radiation in forming layers in three-dimensional rapid prototyping includes a heating element in the exit window | |
| CN104488121B (en) | For connecting the method and device of the part of fuel cell | |
| WO2014044711A1 (en) | Device and method for the application of light-curing composites | |
| US20150004556A1 (en) | Thin LED Film-based Curing Light System | |
| DE19723202A1 (en) | Crack resistant semiconductor component production | |
| CN111408515A (en) | Dispensing device, dispensing method and electronic device | |
| CN201588015U (en) | A Novel Electrospinning Device for Polymer Melt | |
| CN101752468A (en) | Suspending manufacture process of light emitting diode (LED) fluorescent powder | |
| CN102230231A (en) | Infrared-radiation-assisted high-voltage static spray device with coaxial spinning nozzle and application thereof | |
| WO2024109854A1 (en) | Flexible optical electrode and preparation method therefor | |
| CN108748976A (en) | A kind of polyimides, which is directly write, increases material and preparation method thereof | |
| CN204396271U (en) | A kind of metal coating device conducting electricity optical fiber | |
| CN103741476A (en) | Self-sticking type easily-washed polytetrafluoroethylene de-molded cloth for autoclave molding composite material and preparation method thereof | |
| CN106098913A (en) | A kind of improve the white light LEDs trial method than testing efficiency | |
| WO2005064626A2 (en) | Optoelectronic module, and method for the production thereof | |
| DE102012101116B4 (en) | Molding device and molding method | |
| CN104473718A (en) | Current-conducting and light-guiding artificial cochlea electrode and manufacturing method thereof | |
| DE102008009171B4 (en) | Method for bonding silicone and elastomer components | |
| CN109411459B (en) | A high-power purple LED lamp containing a silicone lens | |
| DE102005010350A1 (en) | LED manufacturing process | |
| CN108170326B (en) | A kind of processing technology and its process equipment of capacitance touch screen | |
| CN111112023A (en) | Glue injection process and curing device for connector | |
| DE102007039904A1 (en) | Heat-conductive material layer manufacturing method, involves inserting fibers in field area and transporting towards carrier layer, where fibers have large heat-conductivity toward fiber longitudinal direction than other direction | |
| CN109961876B (en) | Roller hot-pressing fusion type graphene material layer setting method | |
| CN105185468B (en) | Preparation method of transparent conductive film metal grid |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 510660 No.7, Shenzhou Road, Science City, high tech Industrial Development Zone, Guangzhou City, Guangdong Province Applicant after: Guangzhou delta Imaging Technology Co.,Ltd. Address before: 510660 No.7, Shenzhou Road, Science City, high tech Industrial Development Zone, Guangzhou City, Guangdong Province Applicant before: O-FILM IMAGE TECHNOLOGY (GUANGZHOU) Co.,Ltd. |
|
| CB02 | Change of applicant information | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200714 |
|
| RJ01 | Rejection of invention patent application after publication |