CN111333026A - Force-electricity coupling loading platform capable of reconstructing three-dimensional microstructure and preparation method thereof - Google Patents

Abstract

The invention provides a reconfigurable three-dimensional micro-structured electromechanical coupling loading platform and a preparation method thereof. The loading platform includes: a force loading assembly, and the force loading assembly includes a chassis, a plurality of clamping parts, a moving mechanism and an elastic base, and a plurality of At least one of the clamping members is connected to a moving mechanism, the clamping member clamps an elastic base, the elastic base is film-shaped, the moving mechanism can drive the clamping member to move, and the elastic base can be deformed by the movement of the clamping member; and electric loading The component, the electrical loading component includes a wire, the wire is connected to the elastic base and used to energize the elastic base, the positive and negative sides of the elastic base are respectively connected to the positive and negative electrodes of the power source through the wire, and the elastic base is made of electroactive polymer. By adopting the above technical solution, the combination of the force loading assembly and the electric loading assembly can form a richer reconfigurable three-dimensional microstructure configuration compared with the prior art, and it is easy to achieve rapid reconstruction of the three-dimensional microstructure.

Description

Electromechanical coupling loading platform with reconfigurable three-dimensional microstructure and preparation method thereof

technical field

The invention belongs to the technical field of advanced manufacturing, and in particular relates to an electromechanical coupling loading platform with a reconfigurable three-dimensional microstructure and a electromechanical coupling loading platform with a reconfigurable three-dimensional microstructure and a preparation method thereof.

Background technique

In recent years, three-dimensional microstructures, especially reconfigurable three-dimensional microstructures, have received more and more attention in the fields of biomedical devices, robots, metamaterials, and microelectromechanical systems, attracting many research institutions and scholars at home and abroad. attention. Reconfigurable three-dimensional microstructures refer to structures that can be reversibly transformed from one three-dimensional configuration to other different three-dimensional configurations through a certain loading or transformation method. Practical reconfigurable 3D microstructures, such as reconfigurable micro-antennas, reconfigurable magnetically controlled soft robots, and reconfigurable medical devices based on self-assembly methods, have been successively studied and reported.

In the prior art, the buckling-induced three-dimensional microstructure assembly method is a reliable preparation method. In the method, the elastic substrate is partially released after pre-stretching, so that the two-dimensional configuration partially adhered to the elastic substrate undergoes buckling deformation under the action of compressive strain to form a three-dimensional microstructure.

The above-mentioned buckling-induced three-dimensional microstructure assembly method relies on the release of a pre-stretched elastic substrate, thereby realizing the assembly of three-dimensional microstructures. This method can realize the assembly of three-dimensional microstructures, but to reconstruct three-dimensional microstructures, it is necessary to restore the assembled three-dimensional microstructures to two-dimensional structures, and then reconstruct by changing the loading path.

SUMMARY OF THE INVENTION

Based on the above-mentioned problems in the prior art, the present invention aims to provide a mechanoelectric coupling loading platform with a reconfigurable three-dimensional microstructure and a preparation method thereof, so that the three-dimensional microstructure can be easily reconstructed and transformed into a three-dimensional configuration.

The present invention provides an electromechanical coupling loading platform with a reconfigurable three-dimensional microstructure, and the loading platform includes:

A force loading assembly comprising a chassis, a plurality of clamps, a moving mechanism and an elastic base, at least one of the plurality of clamps being connected to the moving mechanism, the clamps clamping the elastic a base, the elastic base is in the shape of a film, the moving mechanism can drive the clamping member to move, and the elastic base can be deformed by the movement of the clamping member; and

an electric loading assembly, the electric loading assembly includes a wire, the wire is connected to the elastic base and used to energize the elastic base, the positive and negative sides of the elastic base are respectively connected to the positive and negative electrodes of the power supply through the wire, The elastic substrate is made of an electroactive polymer.

Preferably, the electrical loading assembly further includes electrodes, the electrodes are disposed on the front and back sides of the elastic base, and the wires are connected to the elastic base through the electrodes.

Preferably, the electrode is made of a deformable conductive material, so that the electrode can deform together with the elastic substrate.

Preferably, the elastic substrate is made of a dielectric elastomer material.

Preferably, the clamping member is provided with a wire insertion portion and a wire outlet portion, the wire insertion portion is connected to the wire, and the wire outlet portion is connected to the power source.

Preferably, the electrical loading assembly further includes a transformer connected between the power source and the wire, the transformer capable of converting alternating current to direct current and increasing the voltage.

Preferably, the transformer is capable of an output voltage ranging from two kilovolts to ten thousand volts.

The present invention also provides a method for preparing a reconfigurable three-dimensional microstructure, the method comprising:

Partially adhering a planar structure capable of forming a reconfigurable three-dimensional microstructure to an elastic substrate;

connecting the elastic base to the clamping part of the force-loading component, and the clamping part moves to deform the elastic base, thereby causing the planar structure or the three-dimensional microstructure formed after the deformation to buckling, deforming, or reconstructing;

The elastic substrate is energized to deform the elastic substrate, and the elastic substrate deforms, thereby causing the planar structure or the three-dimensional microstructure formed after the deformation to buckling, deforming, or reconstructing.

Preferably, the preparation method uses the electromechanical coupling loading platform of the reconfigurable three-dimensional microstructure described in any one of the above technical solutions.

Preferably, the preparation method includes applying direct current to the elastic substrate.

By adopting the above technical solution, the combination of the force loading assembly and the electric loading assembly can form a richer reconfigurable three-dimensional microstructure configuration compared with the prior art, and it is easy to achieve rapid reconstruction of the three-dimensional microstructure.

Description of drawings

FIG. 1 shows a schematic structural diagram of a loading platform according to an embodiment of the present invention.

FIG. 2 shows a schematic structural diagram of a force loading assembly (without an elastic base) of a loading platform according to an embodiment of the present invention.

FIG. 3 shows a schematic structural diagram of the clamping part of the force loading assembly of the loading platform and the wire entry part and the wire outlet part of the electric loading assembly according to an embodiment of the present invention.

Figures 4a to 4d show schematic diagrams of the formation of three-dimensional microstructures from planar structures.

Figure 5 shows a schematic diagram of another three-dimensional microstructure formed from a planar structure.

Description of reference numerals

1 Force Loading Assembly 11 Chassis 12 Clamp 121 Groove 122 Extrusion 123 Screw 13 Moving Mechanism 131 Slide Rail 132 Lead Screw 133 Motor 14 Elastic Base

2 Electric loading components 21, 21a, 21b electrodes 22 Lead wires 23 Lead wire access parts 24 Lead wire connection parts

X first direction Y second direction.

Detailed ways

Exemplary embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood that these specific descriptions are only used to teach those skilled in the art how to implement the present invention, and are not used to exhaust all possible ways of the present invention, nor to limit the scope of the present invention.

In the prior art, the fabrication of reconfigurable 3D microstructures based on buckling-induced methods has the following disadvantages:

(1) The loading platform is realized by mechanical loading, so that the loading path is single and the loading speed is slow.

(2) The loading path of the fixture is not easy to change, and the three-dimensional microstructures of two different configurations cannot be directly converted, but need to be restored to the plane state and then converted to another three-dimensional configuration. The method of using buckling induction is not suitable for assembly. Reconstruct 3D microstructure.

(3) After the elastic substrate is loaded by the movement of the clamp, the distribution of the strain field formed by the elastic substrate is relatively simple, and a complex strain field cannot be formed, and thus a complex three-dimensional microstructure cannot be formed.

As shown in FIG. 1 to FIG. 4 , the present invention proposes a force-electric coupling loading platform with a reconfigurable three-dimensional microstructure, which includes a force-loading component 1 and an electric-loading component 2, and the force-loading component 1 and the electric-loading component 2 are connected to Together, the planar structure can be deformed into a three-dimensional microstructure by applying external force and voltage, and the three-dimensional microstructure can be reconfigured into another configuration by changing the electrical loading. The dimensions of three-dimensional microstructures are usually nanoscale or microscale.

As shown in FIGS. 1 and 2 , the force loading assembly 1 includes a chassis 11 , a clamping member 12 , a moving mechanism 13 and an elastic base 14 . There are a plurality of clamping members 12 , and the plurality of clamping members 12 are connected to each other through the moving mechanism 13 . The chassis 11 and the clamping member 12 can be moved relative to the chassis 11 by the driving of the moving mechanism 13 . The elastic base 14 is clamped by the clamping members 12, and the elastic base 14 is film-shaped. The elastic base 14 can be stretched by the movement of the clamping members 12 away from each other or pre-tensioned by the movement of the clamping members 12 towards each other. The stretched elastic substrate 14 releases the pre-stretched deformation.

In this embodiment, four moving mechanisms 13 and clamping members 12 are provided, the moving mechanism 13 can drive the clamping members 12 to move along the first direction X and the second direction Y, and two of the four clamping members can be Moving along the first direction X, the other two may move along the second direction Y, and the first direction X and the second direction Y may be perpendicular to each other.

The elastic substrate 14 may be an electroactive polymer film, such as a dielectric elastomer, a silicone rubber with electrodeformation effect, or a hydrogel.

As shown in FIG. 2 , the moving mechanism 13 includes a slide rail 131 , a lead screw 132 and a motor 133 . The motor 133 is fixedly connected to the chassis 11 , and the lead screw 132 is connected to the output shaft of the motor 133 . The slide rail 131 is connected to the chassis 11 , the slide rail 131 is arranged in parallel with the lead screw 132 , the clamping piece 12 is sleeved on the lead screw 132 and is screwed together, and the clamping piece 12 is connected with the slide rail 131 so that the clamping piece 12 can move along the The extending direction of the slide rail 131 slides.

As shown in FIG. 3 , the clamping member 12 is provided with an edge groove 121 capable of accommodating the elastic base 14 , and a pressing portion 122 is provided in the groove 121 , and the pressing portion 122 may be plate-shaped. The screw 123 is connected to the clamping member 12 through screw fitting, and the screw 123 is rotatably connected to the pressing portion 122 . By rotating the screw 123 , the pressing portion 122 can approach the side wall of the groove 121 , and the elastic base 14 is fixed by the pressing portion 122 and the side wall of the groove 121 .

The motor 133 is connected to the motor signal controller, the rotation of the motor can be controlled by the motor signal controller, and then the clamping member 12 is moved along the slide rail 131 through the rotation of the motor. The configuration of the three-dimensional microstructure is related to the movement amount of the clamping member 12 .

As shown in FIGS. 1 and 3 , the electrical loading assembly 2 includes a flexible electrode 21 , a wire 22 , a wire insertion part 23 , a wire outlet part 24 and a transformer. It should be understood that only one wire 22 is exemplarily shown in FIG. 3 , and there may be multiple wires 22 , and the plurality of wires 22 may be electrically connected to the wire access portion and the wire outlet portion at one or more clamping members 12 . connect.

The elastic base 14 is connected with electrodes 21. The electrodes 21 and the wires 22 can be made of elastically deformable conductive materials such as graphite carbon paste. The electrodes 21 can be respectively arranged on the front and back sides of the elastic base 14, and each electrode 21 is connected to Wire 22, graphite carbon paste can be applied to form a circle. The front and back sides of the elastic base 14 are respectively connected to the positive and negative electrodes of the power source through the wires 22 .

The wire insertion portion 23 and the wire outlet portion 24 are disposed on the clamping portion 12, the wire 22 is connected to the wire inlet portion 23, and the wire outlet portion 24 is connected to the transformer through wires (not shown). The wire 22 is connected conveniently and conveniently through the wire insertion portion 23 and the wire outlet portion 24 . A transformer capable of converting alternating current to direct current and boosting the voltage is connected between the power source and the conductors 22 .

Although the embodiments of the present invention have been described in detail above, the following points need to be noted.

(1) Although in the above embodiment, each clamping member 12 is connected to the chassis 11 through the moving mechanism 13, the present invention is not limited to this, and some of the clamping members 12 among the plurality of clamping members 12 may also be fixedly connected on chassis 11.

(2) Although in the above-mentioned embodiment, four clamping members 12 are provided, and the direction in which the moving mechanism 13 drives the clamping members 12 to move is the first direction X and the second direction Y which are perpendicular to each other. However, the present invention is not limited thereto, and the specific number of the clamping members 12 and the moving direction and positional relationship of the moving mechanism 13 can be set according to the specific form of the reconfigurable three-dimensional microstructure to be assembled.

(3) Although in the above embodiment, the electrodes 21 are circular, the present invention is not limited thereto, and the shape and quantity of the electrodes can be set according to the specific form of the reconfigurable three-dimensional microstructure to be assembled.

(4) Although in the above embodiment, the moving mechanism 13 uses the motor 133 to drive the lead screw 132 to drive the clamping member 12 to move, but the present invention is not limited to this, and the moving mechanism may also use pneumatic guide rails, hydraulic guide rails, or manual operation, etc. .

(5) Although the specific structure of the clamping portion 12 is disclosed in the above-mentioned embodiment, the present invention is not limited to this. The clamping portion 12 only needs to be able to clamp the elastic base 14, and conventional clamping can be used. parts instead.

Referring to Fig. 4a to Fig. 4d, the present invention also provides a method for preparing a reconfigurable three-dimensional microstructure, the method comprising the following steps or procedures.

Preparatory work, prepare a planar structure 100 capable of forming a reconfigurable three-dimensional microstructure (hereinafter referred to as a planar structure) as shown in FIG. 4a, print electrodes 21a, 21b on the elastic substrate 14 and bond the planar structure 100 to the elastic substrate 14, and install the elastic base 14 on the above-mentioned loading platform. The loading platform can stretch the elastic substrate or release the pre-tensioning strain from the pre-stretched elastic substrate, and can energize the electrode 21a.

When the force is loaded, an external force is applied to the elastic substrate 14 to elastically deform the elastic substrate 14 , so that the planar structure bonded to the elastic substrate 14 undergoes out-of-plane buckling to form an intermediate three-dimensional configuration 200 . As shown in FIG. 4b, the pre-stretching strain is released to the pre-stretched elastic substrate 14, so that the planar structure of FIG. 4a is deformed into the three-dimensional configuration 200 of the intermediate state of FIG. 4b.

For electrical loading, the counter electrode 21 is supplied with high voltage direct current, and the voltage is, for example, two kilovolts to ten thousand volts, preferably three kilovolts to six kilovolts. Due to the electro-deformation effect of the elastic substrate 14, the region of the electrode 21 will expand in-plane, thereby driving the three-dimensional configuration 200 in the intermediate state to deform again. Fig. 4c shows the positional relationship between the electrodes 21a and 21b and the three-dimensional configuration 200 in the intermediate state. After the electrode 21a is electrified, the elastic substrate 14 will undergo electro-deformation in the area of the electrode 21a, forming a three-dimensional structure as shown in Fig. 4d. Microstructure 300 .

By changing the position, shape or voltage of the electrode 21, the same three-dimensional microstructure can be deformed differently. For example, the electrode 21b shown in FIG. 4c can be formed as shown in FIG. 5 after the electrode 21b is energized. The three-dimensional microstructure 400. By changing the position, shape or voltage of the electrodes, the 3D microstructure 300 shown in FIG. 4d can also be directly reconstructed into the 3D microstructure 400 shown in FIG. 5 , which is easy to achieve rapid reconstruction of the 3D microstructure.

It can be understood that all or part of the electrodes may be energized at the same time, which is not limited in this application. Where multiple electrodes are provided, different three-dimensional microstructures can be reconstructed with these electrodes.

It can be understood that the electrodes 21 with different properties have different electro-induced deformations after being energized, and thus the strain field distribution of the elastic matrix 14 is different. Compared with the buckling-induced multiaxial stretching, electrical loading can generate a more complex strain field distribution, thereby forming Complex and variable three-dimensional microstructural configuration.

In the above embodiment, the force loading is performed first and then the electrical loading is performed, but the present invention is not limited thereto, and the order of the force loading and the electrical loading can be changed, for example, the electrical loading is performed first and then the force loading is performed, or the force loading and the electrical loading are performed simultaneously. During electrical loading, force loading can be maintained or stopped; during force loading, electrical loading can be maintained or stopped. A variety of different reconfigurable three-dimensional microstructures can be formed by adjusting the order of force loading and electrical loading.

Claims (10)

1. a reconfigurable three-dimensional microstructure electromechanical coupling loading platform, is characterized in that, described loading platform comprises: A force loading assembly (1) comprising a chassis (11), a plurality of clamps (12), a moving mechanism (13) and an elastic base (14), the plurality of clamps ( At least one of 12) is connected to a moving mechanism (13), the clamping member (12) clamps the elastic base (14), the elastic base (14) is film-shaped, and the moving mechanism (13) The clamping member (12) can be driven to move, and the elastic base (14) can be deformed by the movement of the clamping member (12); and An electrical loading assembly (2) comprising a wire (22) connected to the elastic base (14) and for energizing the elastic base (14), the The positive and negative sides of the elastic substrate (14) are respectively connected to the positive electrode and the negative electrode of the power source through the wires (22), and the elastic substrate (14) is made of electroactive polymer. 2 . The electromechanical coupling loading platform for reconfigurable three-dimensional microstructures according to claim 1 , wherein the electrical loading assembly ( 2 ) further comprises an electrode ( 21 ), and the electrode ( 21 ) is arranged on the The front and back sides of the elastic base (14), the wires (22) are connected to the elastic base (14) through the electrodes (21). 3 . The electromechanical coupling loading platform for reconfigurable three-dimensional microstructures according to claim 2 , wherein the electrodes ( 21 ) are made of deformable conductive materials, so that the electrodes ( 21 ) can interact with The elastic base (14) deforms together. 4. The electromechanical coupling loading platform for reconfigurable three-dimensional microstructures according to claim 1, wherein the elastic substrate (14) is made of a dielectric elastomer material. 5 . The electromechanical coupling loading platform for reconfigurable three-dimensional microstructures according to claim 1 , wherein the clamping member ( 12 ) is provided with a wire access portion ( 23 ) and a wire outlet portion ( 24 ). 6 . ), the wire access portion (23) is connected to the wire (22), and the wire outlet portion (24) is connected to the power supply. 6. The electromechanical coupling loading platform for reconfigurable three-dimensional microstructures according to claim 1, wherein the electric loading assembly (2) further comprises a transformer, and the transformer is connected to the power supply and the wire (22), the transformer can convert alternating current into direct current and increase the voltage. 7 . The electromechanical coupling loading platform for reconfigurable three-dimensional microstructures according to claim 6 , wherein the transformer can make the output voltage range from two kilovolts to ten thousand volts. 8 . 8. A method for preparing a reconfigurable three-dimensional microstructure, wherein the method comprises: partially adhering a planar structure capable of forming a reconfigurable three-dimensional microstructure to an elastic substrate (14); The elastic base (14) is connected to the clamping portion (12) of the force-loading assembly (1), the clamping portion (12) moving to deform the elastic base (14), thereby causing the planar structure or The three-dimensional microstructure formed after its deformation is buckling or reconstructed; The elastic substrate (14) is energized to deform the elastic substrate (14), the elastic substrate (14) is deformed, and the planar structure or the three-dimensional microstructure formed after the deformation is buckled, deformed, or reconstructed. 9 . The method for preparing a reconfigurable three-dimensional microstructure according to claim 8 , wherein the method uses the electromechanical coupling loading of the reconfigurable three-dimensional microstructure according to any one of claims 1 to 7 . platform. 10. The method for preparing a reconfigurable three-dimensional microstructure according to claim 8, wherein the method comprises applying a direct current to the elastic substrate (14).

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