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CN111316402B - 基板处理方法及基板处理装置 - Google Patents

基板处理方法及基板处理装置 Download PDF

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Publication number
CN111316402B
CN111316402B CN201880072183.4A CN201880072183A CN111316402B CN 111316402 B CN111316402 B CN 111316402B CN 201880072183 A CN201880072183 A CN 201880072183A CN 111316402 B CN111316402 B CN 111316402B
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China
Prior art keywords
flow path
valve
discharge
substrate
end flow
Prior art date
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Active
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CN201880072183.4A
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English (en)
Chinese (zh)
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CN111316402A (zh
Inventor
田中孝佳
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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Publication of CN111316402A publication Critical patent/CN111316402A/zh
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Classifications

    • H10P72/0448—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/005—Drying solid materials or objects by processes not involving the application of heat by dipping them into or mixing them with a chemical liquid, e.g. organic; chemical, e.g. organic, dewatering aids
    • H10P52/00—
    • H10P70/20—
    • H10P72/0408—
    • H10P72/0414—
    • H10P76/00—

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Molecular Biology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN201880072183.4A 2017-11-08 2018-10-30 基板处理方法及基板处理装置 Active CN111316402B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017215295A JP6986933B2 (ja) 2017-11-08 2017-11-08 基板処理方法および基板処理装置
JP2017-215295 2017-11-08
PCT/JP2018/040403 WO2019093200A1 (fr) 2017-11-08 2018-10-30 Procédé de traitement de substrat et dispositif de traitement de substrat

Publications (2)

Publication Number Publication Date
CN111316402A CN111316402A (zh) 2020-06-19
CN111316402B true CN111316402B (zh) 2024-12-06

Family

ID=66437746

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880072183.4A Active CN111316402B (zh) 2017-11-08 2018-10-30 基板处理方法及基板处理装置

Country Status (5)

Country Link
JP (1) JP6986933B2 (fr)
KR (1) KR102378913B1 (fr)
CN (1) CN111316402B (fr)
TW (1) TWI704966B (fr)
WO (1) WO2019093200A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7292120B2 (ja) * 2019-06-17 2023-06-16 東京エレクトロン株式会社 基板処理方法および基板処理装置
KR102346529B1 (ko) * 2019-06-24 2021-12-31 세메스 주식회사 액 공급 유닛, 그리고 이를 가지는 기판 처리 장치 및 방법
JP7384658B2 (ja) * 2019-12-24 2023-11-21 株式会社Ｓｃｒｅｅｎホールディングス 配管洗浄方法
CN115516607A (zh) * 2020-05-14 2022-12-23 东京毅力科创株式会社 液供给机构、基板处理装置以及基板处理方法
JP7628033B2 (ja) * 2021-03-12 2025-02-07 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
TWI811028B (zh) * 2022-07-19 2023-08-01 凱爾迪科技股份有限公司 自吸回收系統

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017034188A (ja) * 2015-08-05 2017-02-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および処理液吐出方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5471886B2 (ja) * 2010-06-25 2014-04-16 東京エレクトロン株式会社 高温、高圧処理方法及び高温、高圧処理装置並びに記憶媒体
JP5753352B2 (ja) 2010-07-20 2015-07-22 株式会社Ｓｃｒｅｅｎホールディングス ダイヤフラムバルブおよびこれを備えた基板処理装置
JP5891065B2 (ja) * 2012-02-22 2016-03-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および処理液吸引方法
JP6320805B2 (ja) * 2014-03-17 2018-05-09 株式会社Ｓｃｒｅｅｎホールディングス 処理液供給装置
JP6439964B2 (ja) * 2014-09-17 2018-12-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6512554B2 (ja) * 2014-09-29 2019-05-15 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP2016127080A (ja) * 2014-12-26 2016-07-11 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6319117B2 (ja) * 2015-01-26 2018-05-09 東京エレクトロン株式会社 処理液供給装置、処理液供給方法及び記憶媒体
JP2017183568A (ja) * 2016-03-31 2017-10-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017034188A (ja) * 2015-08-05 2017-02-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および処理液吐出方法

Also Published As

Publication number Publication date
CN111316402A (zh) 2020-06-19
JP2019087652A (ja) 2019-06-06
KR102378913B1 (ko) 2022-03-24
JP6986933B2 (ja) 2021-12-22
TW201936272A (zh) 2019-09-16
TWI704966B (zh) 2020-09-21
WO2019093200A1 (fr) 2019-05-16
KR20200070388A (ko) 2020-06-17

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