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CN111289169A - Passive wireless temperature and pressure integrated sensor based on LC resonance and preparation method thereof - Google Patents

Passive wireless temperature and pressure integrated sensor based on LC resonance and preparation method thereof Download PDF

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Publication number
CN111289169A
CN111289169A CN202010090844.5A CN202010090844A CN111289169A CN 111289169 A CN111289169 A CN 111289169A CN 202010090844 A CN202010090844 A CN 202010090844A CN 111289169 A CN111289169 A CN 111289169A
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temperature
sensing unit
pressure
ring
sleeve
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CN111289169B (en
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杨雷
武湛君
刘科海
高东岳
申薛靖
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Dalian University of Technology
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/007Transmitting or indicating the displacement of flexible diaphragms using variations in inductance
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/34Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using capacitative elements
    • G01K7/343Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using capacitative elements the dielectric constant of which is temperature dependant
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0073Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm

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Abstract

The invention discloses a passive wireless temperature and pressure integrated sensor based on LC resonance and a preparation method thereof, wherein the sensor comprises: a temperature sensing unit for sensing temperature and a pressure sensing unit for sensing pressure; the temperature sensing unit comprises an opening resonant ring, the outside of the opening resonant ring is wrapped with a dielectric ceramic material, and the dielectric ceramic material has a dielectric constant which linearly changes along with the temperature; the pressure sensing unit comprises an opening resonance ring I and a flexible diaphragm, the opening resonance ring I is adhered to the center of the flexible diaphragm, and the flexible diaphragm is made of high-temperature-resistant rubber material; the temperature sensing unit and the pressure sensing unit are connected through a sleeve to form an integrated sensor; the sensor is calibrated at different temperatures and pressures, so that the temperature and the pressure can be simultaneously monitored; the sensor of the invention has a very simple structure and is easy to realize low-cost manufacture.

Description

基于LC谐振的无源无线温度压强集成式传感器及其制备方法Passive wireless temperature and pressure integrated sensor based on LC resonance and preparation method thereof

技术领域technical field

本发明涉及传感器技术领域,尤其涉及一种基于LC谐振的无源无线温度、压强集成式传感器及其制备方法。The invention relates to the technical field of sensors, in particular to a passive wireless temperature and pressure integrated sensor based on LC resonance and a preparation method thereof.

背景技术Background technique

在航空航天、火力发电、核工业等领域通常需要同时对温度和压强进行实时监测。传统的温度或压强传感器往往需要引线进行连接,但在一些旋转、腐蚀、密闭等特殊条件下,有线传感器的使用变得相对困难。此时,不需要电源供电且无需引线的传感器将具有显著的优势。另一方面,单一参量传感器只能对一个参数进行测量,如果要同时测量多个参数,则需要使用多个传感器,这不利于系统集成。In aerospace, thermal power generation, nuclear industry and other fields, it is usually necessary to monitor temperature and pressure in real time at the same time. Traditional temperature or pressure sensors often require leads for connection, but under some special conditions such as rotation, corrosion, and airtightness, the use of wired sensors becomes relatively difficult. At this point, a sensor that does not require a power supply and requires no leads would have significant advantages. On the other hand, a single parameter sensor can only measure one parameter. If multiple parameters are to be measured at the same time, multiple sensors need to be used, which is not conducive to system integration.

发明内容SUMMARY OF THE INVENTION

根据现有技术存在的问题,本发明公开了一种基于LC谐振的无源无线温度、压强集成式传感器;包括:对温度进行感应的温度感应单元和对压强进行感应的压强感应单元,所述温度感应单元和压强感应单元通过套筒连接构成集成式传感器;所述温度感应单元包括开口谐振环,所述开口谐振环的外部包裹有介电陶瓷材料,所述介电陶瓷材料具有随温度线性变化的介电常数;According to the problems existing in the prior art, the present invention discloses a passive wireless temperature and pressure integrated sensor based on LC resonance; including: a temperature sensing unit for sensing temperature and a pressure sensing unit for sensing pressure, the The temperature sensing unit and the pressure sensing unit are connected by a sleeve to form an integrated sensor; the temperature sensing unit includes a split resonant ring, the outside of the split resonant ring is wrapped with a dielectric ceramic material, and the dielectric ceramic material has a linearity with temperature changing dielectric constant;

所述压强感应单元包括开口谐振环I和柔性膜片,所述开口谐振环I粘贴在柔性膜片的中心,所述柔性膜片为耐高温橡胶材料;The pressure sensing unit includes a split resonant ring I and a flexible diaphragm, the split resonant ring I is pasted at the center of the flexible diaphragm, and the flexible diaphragm is made of high-temperature resistant rubber material;

所述套筒套接在温度感应单元的外部,所述柔性膜片粘贴在套筒的上表面,工作状态下当外界压强变化时,柔性膜片发生变形使膜片上的开口谐振环I与下方的介电陶瓷材料之间的距离发生变化,导致开口谐振环I的谐振频率相应发生变化从而实现对压强的感应。The sleeve is sleeved on the outside of the temperature sensing unit, and the flexible diaphragm is pasted on the upper surface of the sleeve. In the working state, when the external pressure changes, the flexible diaphragm is deformed, so that the split resonant ring I on the diaphragm is connected to the upper surface of the sleeve. The distance between the dielectric ceramic materials below changes, resulting in a corresponding change in the resonant frequency of the split resonant ring I to achieve pressure induction.

进一步的,当温度T变化时,温度感应单元和压强感应单元的谐振频率都发生变化;当压强P变化时,只有压强感应单元的谐振频率发生变化;Further, when the temperature T changes, the resonant frequencies of the temperature sensing unit and the pressure sensing unit change; when the pressure P changes, only the resonance frequency of the pressure sensing unit changes;

fT=c1·T+c2 f T =c 1 ·T+c 2

fP=c3·T+c4·P+c5 f P =c 3 ·T+c 4 ·P+c 5

通过对温度和压强进行标定确定上式中的各个系数,实现对温度和压强的同时测量,其中,fT和fP分别为温度感应单元和压强感应单元的谐振频率。By calibrating the temperature and pressure to determine each coefficient in the above formula, the simultaneous measurement of temperature and pressure is realized, where f T and f P are the resonant frequencies of the temperature sensing unit and the pressure sensing unit, respectively.

进一步的,所述开口谐振环和开口谐振环I的尺寸相同,但由于周围介质的区别,谐振频率不同。Further, the size of the split resonator and the split resonator I are the same, but due to the difference of the surrounding medium, the resonant frequencies are different.

进一步的,所述套筒稍高于温度感应单元的高度。Further, the sleeve is slightly higher than the height of the temperature sensing unit.

一种基于LC谐振的无源无线温度、压强集成式传感器的制备方法,包括如下步骤:A preparation method of a passive wireless temperature and pressure integrated sensor based on LC resonance, comprising the following steps:

采用机械冲压或激光切割制作开口谐振环;Use mechanical stamping or laser cutting to make split resonator rings;

制作温度感应单元:采用放电等离子烧结技术,先将适量陶瓷粉末倒入磨具并压实,然后将开口谐振环平放于中心位置,再倒入等量陶瓷粉末,在高温高压下烧结成型;Making the temperature sensing unit: using spark plasma sintering technology, first pour an appropriate amount of ceramic powder into the grinding tool and compact it, then place the open resonant ring in the center position, then pour the same amount of ceramic powder, and sinter it under high temperature and high pressure;

制作压强感应单元:将开口谐振环I用高温胶粘贴于柔性膜片上,在套筒上表面涂抹高温胶,将柔性膜片张紧粘贴于套筒上,开口谐振环I朝下并位于套筒中心位置,裁剪掉多余的柔性膜片;Making the pressure sensing unit: paste the split resonator ring I on the flexible diaphragm with high temperature glue, apply high temperature glue on the upper surface of the sleeve, and stick the flexible diaphragm tension on the sleeve, with the split resonator ring I facing down and located in the At the center of the sleeve, cut off the excess flexible diaphragm;

将压强感应单元套接在温度感应单元外部。Sleeve the pressure sensing unit outside the temperature sensing unit.

由于采用了上述技术方案,本发明提供的一种基于LC谐振的无源无线温度、压强集成式传感器,该结构包含温度感应单元和压强感应单元。温度感应单元由介电陶瓷材料包裹一个开口谐振环组成。压强感应单元由套筒和粘贴于套筒上表面的柔性膜片以及粘贴于膜片中心的开口谐振环I组成。套筒套于陶瓷基体外部,组合成温度、压强集成式传感器。通过在不同的温度和压强下对传感器进行标定,就可以实现对温度和压强的同时监测;本发明的传感器结构非常简单,易于实现低成本制造。Due to the adoption of the above technical solutions, the present invention provides a passive wireless temperature and pressure integrated sensor based on LC resonance, the structure including a temperature sensing unit and a pressure sensing unit. The temperature sensing unit consists of a split resonant ring wrapped with dielectric ceramic material. The pressure sensing unit is composed of a sleeve, a flexible diaphragm pasted on the upper surface of the sleeve, and an open resonant ring I pasted in the center of the diaphragm. The sleeve is sleeved on the outside of the ceramic base, and is combined to form an integrated temperature and pressure sensor. Simultaneous monitoring of temperature and pressure can be achieved by calibrating the sensor under different temperatures and pressures; the sensor of the present invention has a very simple structure and is easy to manufacture at low cost.

附图说明Description of drawings

为了更清楚地说明本申请实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请中记载的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the accompanying drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only These are some embodiments described in this application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without any creative effort.

图1为开口谐振环示意图及其等效LC电路图;Fig. 1 is the schematic diagram of split resonant ring and its equivalent LC circuit diagram;

图2为基于LC谐振的无源无线温度、压强集成式传感器的结构示意图;FIG. 2 is a schematic structural diagram of a passive wireless temperature and pressure integrated sensor based on LC resonance;

图3为图2所示传感器在进行测量时的电磁感应耦合原理图。FIG. 3 is a schematic diagram of electromagnetic induction coupling of the sensor shown in FIG. 2 during measurement.

图中:1、开口谐振环,2、介电陶瓷材料,3、套筒,4、开口谐振环I,5、柔性膜片。In the figure: 1, split resonator ring, 2, dielectric ceramic material, 3, sleeve, 4, split resonator ring I, 5, flexible diaphragm.

具体实施方式Detailed ways

为使本发明的技术方案和优点更加清楚,下面结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚完整的描述:In order to make the technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present invention:

如图1和图2所示的一种基于LC谐振的无源无线温度、压强集成式传感器,包含温度感应单元和压强感应单元两部分。As shown in Figures 1 and 2, a passive wireless temperature and pressure integrated sensor based on LC resonance includes two parts: a temperature sensing unit and a pressure sensing unit.

所述的温度感应单元由介电陶瓷材料2包裹一个开口谐振环1组成。所述的介电陶瓷材料2具有随温度线性变化的介电常数,如氧化铝、钛酸钡等。所述的开口谐振环1为金属材料,如铝、铜等,其直径为6~8mm,开口宽度为1~1.5mm。所述开口谐振环1可以等效为一个LC谐振电路,谐振频率为

Figure BDA0002383659830000031
其中电感L由环的尺寸决定,电容C由开口大小和基体材料的介电常数决定。当温度变化时,基体材料的介电常数将发生变化,导致开口谐振环1的谐振频率相应地发生偏移,从而实现对温度的感应。The temperature sensing unit is composed of a dielectric ceramic material 2 wrapped around a split resonant ring 1 . The dielectric ceramic material 2 has a dielectric constant that varies linearly with temperature, such as aluminum oxide, barium titanate, and the like. The split resonant ring 1 is made of metal materials, such as aluminum, copper, etc., with a diameter of 6-8 mm and an opening width of 1-1.5 mm. The split resonant ring 1 can be equivalent to an LC resonant circuit, and the resonant frequency is
Figure BDA0002383659830000031
The inductance L is determined by the size of the loop, and the capacitance C is determined by the size of the opening and the dielectric constant of the base material. When the temperature changes, the dielectric constant of the base material will change, causing the resonant frequency of the split resonant ring 1 to shift accordingly, thereby realizing temperature sensing.

所述的压强感应单元由柔性膜片5和粘贴于其中心的另一个开口谐振环I4组成。所述的柔性膜片5为耐高温的橡胶材料,如氟橡胶、硅橡胶等。所述的开口谐振环I4与温度感应单元相同。The pressure sensing unit is composed of a flexible diaphragm 5 and another open resonant ring I4 pasted at the center thereof. The flexible diaphragm 5 is made of high temperature resistant rubber material, such as fluorine rubber, silicon rubber and the like. The split resonant ring I4 is the same as the temperature sensing unit.

所述温度感应单元和压强感应单元通过套筒3组合成集成式传感器,所述套筒3直径为2~3cm,高度为5~8mm,套于温度感应器外部套筒3高度比温度感应单元高1~1.5mm,所述柔性膜片5粘贴于套筒3上表面。当外界压强变化时,柔性膜片5发生变形,使得柔性膜片5上的开口谐振环I4与下方的介电材料之间的距离发生变化,导致开口谐振环I4的谐振频率相应地发生变化,从而实现对压强的感应。The temperature sensing unit and the pressure sensing unit are combined into an integrated sensor through a sleeve 3. The sleeve 3 has a diameter of 2-3 cm and a height of 5-8 mm. The sleeve 3 is sleeved on the outside of the temperature sensor. The height of the sleeve 3 is higher than that of the temperature sensing unit. The height is 1-1.5 mm, and the flexible membrane 5 is pasted on the upper surface of the sleeve 3 . When the external pressure changes, the flexible diaphragm 5 is deformed, so that the distance between the split resonant ring I4 on the flexible diaphragm 5 and the dielectric material below changes, resulting in a corresponding change in the resonant frequency of the split resonant ring I4. So as to realize the induction of pressure.

如图3所示,所述温度感应单元和压强感应单元的两个开口谐振环的尺寸相同,但由于周围介质的差异,使得它们的谐振频率不同。利用网络分析仪通过天线与两个开口谐振环之间的电磁耦合,可以读取两个谐振频率。当温度T变化时,温度感应部分和压强感应部分的谐振频率都会发生变化;当压强P变化时,只有压强感应部分的谐振频率会发生变化。As shown in FIG. 3 , the size of the two split resonant rings of the temperature sensing unit and the pressure sensing unit are the same, but their resonant frequencies are different due to the difference of the surrounding medium. The two resonant frequencies can be read using a network analyzer through the electromagnetic coupling between the antenna and the two split resonant rings. When the temperature T changes, the resonant frequency of the temperature sensing part and the pressure sensing part will change; when the pressure P changes, only the resonant frequency of the pressure sensing part will change.

fT=c1·T+c2 f T =c 1 ·T+c 2

fP=c3·T+c4·P+c5 f P =c 3 ·T+c 4 ·P+c 5

通过对温度和压强进行标定,可以确定出上式中的各个系数,就可以实现对温度和压强的同时测量。By calibrating temperature and pressure, each coefficient in the above formula can be determined, and simultaneous measurement of temperature and pressure can be realized.

一种基于LC谐振的无源无线温度、压强集成式传感器的制备方法,包括以下步骤:A preparation method of a passive wireless temperature and pressure integrated sensor based on LC resonance, comprising the following steps:

(1)制作开口谐振环。可采用机械冲压或激光切割等工艺。(1) Make a split resonator ring. Processes such as mechanical stamping or laser cutting can be used.

(2)制作温度感应部分。采用放电等离子烧结技术,先将适量陶瓷粉末倒入磨具并稍微压实,然后将开口谐振环1平放于中心位置,再倒入等量陶瓷粉末,在高温高压下烧结成型。(2) Making a temperature sensing part. Using spark plasma sintering technology, first pour an appropriate amount of ceramic powder into the grinding tool and compact it slightly, then place the split resonator ring 1 flat in the center position, then pour the same amount of ceramic powder, and sinter it under high temperature and high pressure.

(3)制作压强感应部分。将开口谐振环I4用高温胶粘贴于橡胶薄膜5上,在套筒3上表面涂抹高温胶,将柔性膜片5张紧粘贴于套筒3上(开口谐振环I4朝下并位于套筒中心位置),然后裁剪掉多余的柔性膜片5。(3) Making the pressure sensing part. Paste the split resonator ring I4 on the rubber film 5 with high temperature glue, apply high temperature glue on the upper surface of the sleeve 3, and stick the flexible diaphragm 5 on the sleeve 3 (the split resonator ring I4 faces down and is located on the sleeve 3). center position), and then cut off the excess flexible diaphragm 5.

(4)组合成集成式传感器。将压强感应单元套在温度感应器外部即可。(4) Combined into an integrated sensor. Just put the pressure sensing unit on the outside of the temperature sensor.

实施例1:Example 1:

本实施例的无源无线温度、压强集成式传感器,包括温度感应单元和压强感应单元两部分。温度感应单元由氧化铝陶瓷包裹一个开口谐振环1形成。开口谐振环1的直径为6mm,开口宽度为1mm,材料为铜。压强感应单元由套筒3和粘贴于套筒3上表面的柔性膜片5以及粘贴于柔性膜片5中心的开口谐振环I4组成,柔性膜片5材料为硅橡胶。套筒3的直径为2cm,高度为5mm。套筒3套于氧化铝陶瓷外部,形成温度、压强集成式传感器。套筒3高度比氧化铝陶瓷高1mm。The passive wireless temperature and pressure integrated sensor in this embodiment includes two parts: a temperature sensing unit and a pressure sensing unit. The temperature sensing unit is formed by wrapping a split resonant ring 1 with alumina ceramics. The diameter of the split resonator 1 is 6 mm, the width of the opening is 1 mm, and the material is copper. The pressure sensing unit is composed of a sleeve 3, a flexible diaphragm 5 pasted on the upper surface of the sleeve 3, and an open resonator ring I4 pasted in the center of the flexible diaphragm 5. The material of the flexible diaphragm 5 is silicone rubber. The diameter of the sleeve 3 is 2 cm and the height is 5 mm. The sleeve 3 is set outside the alumina ceramic to form an integrated temperature and pressure sensor. The height of the sleeve 3 is 1 mm higher than that of the alumina ceramic.

实施例2Example 2

本实施例的无源无线温度、压强集成式传感器,包括温度感应单元和压强感应单元两部分。温度感应单元由钛酸钡陶瓷包裹一个开口谐振环1形成。开口谐振环1的直径为6mm,开口宽度为1mm,材料为铝。压强感应单元由套筒3和粘贴于套筒3上表面的柔性膜片5以及粘贴于柔性膜片5中心的开口谐振环I4组成,柔性膜片5的材料为氟橡胶。套筒3的直径为2cm,高度为5mm。套筒3套于钛酸钡陶瓷外部,形成温度、压强集成式传感器。套筒3高度比钛酸钡陶瓷高1mm。The passive wireless temperature and pressure integrated sensor in this embodiment includes two parts: a temperature sensing unit and a pressure sensing unit. The temperature sensing unit is formed by wrapping a split resonant ring 1 with barium titanate ceramics. The diameter of the split resonator 1 is 6 mm, the width of the opening is 1 mm, and the material is aluminum. The pressure sensing unit is composed of a sleeve 3, a flexible diaphragm 5 pasted on the upper surface of the sleeve 3, and an open resonant ring I4 pasted in the center of the flexible diaphragm 5. The material of the flexible diaphragm 5 is fluorine rubber. The diameter of the sleeve 3 is 2 cm and the height is 5 mm. The sleeve 3 is set outside the barium titanate ceramic to form an integrated temperature and pressure sensor. The height of the sleeve 3 is 1 mm higher than that of the barium titanate ceramic.

实施例3:Example 3:

本实施例的无源无线温度、压强集成式传感器,包括温度感应单元和压强感应单元两部分。温度感应单元由氧化铝陶瓷包裹一个开口谐振环1形成。开口谐振环1的直径为8mm,开口宽度为1.2mm,材料为铜。压强感应单元由套筒3和粘贴于套筒3上表面的柔性膜片5以及粘贴于膜片中心的开口谐振环I4组成,柔性膜片5材料为硅橡胶。套筒3的直径为3cm,高度为8mm。套筒3套于氧化铝陶瓷外部,形成温度、压强集成式传感器。套筒3高度比氧化铝陶瓷高1.5mm。The passive wireless temperature and pressure integrated sensor in this embodiment includes two parts: a temperature sensing unit and a pressure sensing unit. The temperature sensing unit is formed by wrapping a split resonant ring 1 with alumina ceramics. The diameter of the split resonator 1 is 8 mm, the width of the opening is 1.2 mm, and the material is copper. The pressure sensing unit is composed of a sleeve 3, a flexible diaphragm 5 pasted on the upper surface of the sleeve 3, and an open resonant ring I4 pasted in the center of the diaphragm. The material of the flexible diaphragm 5 is silicone rubber. The diameter of the sleeve 3 is 3 cm and the height is 8 mm. The sleeve 3 is set outside the alumina ceramic to form an integrated temperature and pressure sensor. The height of the sleeve 3 is 1.5 mm higher than that of the alumina ceramic.

以上所述,仅为本发明较佳的具体实施方式,但本发明的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,根据本发明的技术方案及其发明构思加以等同替换或改变,都应涵盖在本发明的保护范围之内。The above description is only a preferred embodiment of the present invention, but the protection scope of the present invention is not limited to this. The equivalent replacement or change of the inventive concept thereof shall be included within the protection scope of the present invention.

Claims (5)

1. A passive wireless temperature, pressure integrated sensor based on LC resonance, characterized by comprising: a temperature sensing unit for sensing temperature and a pressure sensing unit for sensing pressure;
the temperature sensing unit comprises an open resonant ring (1), the outside of the open resonant ring (1) is wrapped with a dielectric ceramic material (2), and the dielectric ceramic material (2) has a dielectric constant which linearly changes with temperature;
the pressure sensing unit comprises an opening resonance ring I (4) and a flexible diaphragm (5), the opening resonance ring I (4) is adhered to the center of the flexible diaphragm (5), and the flexible diaphragm (5) is made of high-temperature-resistant rubber materials;
the temperature sensing unit and the pressure sensing unit are connected through a sleeve (3) to form an integrated sensor; the sleeve (3) is sleeved outside the temperature sensing unit, the flexible diaphragm (5) is adhered to the upper surface of the sleeve (3), and when the external pressure changes in a working state, the flexible diaphragm (5) deforms to change the distance between the opening resonance ring I (4) on the diaphragm and the dielectric ceramic material (2) below the opening resonance ring I (4), so that the resonance frequency of the opening resonance ring I (4) changes correspondingly to achieve the pressure sensing.
2. The integrated sensor of claim 1, further characterized by: when the temperature T changes, the resonant frequency of the temperature sensing unit and the resonant frequency of the pressure sensing unit both change; when the pressure P changes, only the resonance frequency of the pressure induction unit changes;
fT=c1·T+c2
fP=c3·T+c4·P+c5
the temperature and the pressure are calibrated to determine each coefficient in the formula, so that the temperature and the pressure can be measured simultaneously, wherein fTAnd fPThe resonant frequencies of the temperature sensing unit and the pressure sensing unit are respectively.
3. The integrated sensor of claim 1, further characterized by: the size of the split resonance ring (1) is the same as that of the split resonance ring I (4), but the resonance frequency is different due to the difference of surrounding media.
4. The integrated sensor of claim 1, further characterized by: the sleeve (3) is slightly higher than the height of the temperature sensing unit.
5. A method of manufacturing an integrated sensor according to claims 1-4, wherein: the method comprises the following steps:
manufacturing an open resonant ring by adopting mechanical stamping or laser cutting;
manufacturing a temperature sensing unit: adopting a spark plasma sintering technology, firstly pouring a proper amount of ceramic powder into a grinding tool and compacting, then horizontally placing an open resonant ring at a central position, then pouring an equal amount of ceramic powder, and sintering and molding at high temperature and high pressure;
manufacturing a pressure induction unit: sticking the split resonant ring I (4) on the flexible membrane (5) by using high-temperature glue, coating the high-temperature glue on the upper surface of the sleeve (3), tensioning and sticking the flexible membrane (5) on the sleeve (3), wherein the split resonant ring I (4) is downward and positioned at the central position of the sleeve (3), and cutting off the redundant flexible membrane (5);
the pressure intensity sensing unit is sleeved outside the temperature sensing unit.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115128702A (en) * 2022-06-07 2022-09-30 江南大学 Composite microwave sensor and detection method

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4025912A (en) * 1976-07-19 1977-05-24 The United States Of America As Represented By The Secretary Of The Navy Method and apparatus for remotely transducing and transmitting pressure and temperature changes
US5339051A (en) * 1991-12-09 1994-08-16 Sandia Corporation Micro-machined resonator oscillator
CN1947302A (en) * 2004-04-26 2007-04-11 传感技术有限公司 Split-ring coupler incorporating dual resonant sensors
US20110068794A1 (en) * 2007-02-06 2011-03-24 Chevron U.S.A., Inc. Temperature and pressure transducer
US20110152725A1 (en) * 2008-09-02 2011-06-23 Christian M. Puttlitz Consulting, Llc Biomems sensor and apparatuses and methods therefor
US20130316329A1 (en) * 2010-10-05 2013-11-28 Chris Chang Yu Micro-devices for disease detection
CN103698060A (en) * 2013-12-25 2014-04-02 中北大学 Wireless passive high-temperature pressure sensor with temperature compensation and temperature compensation algorithm thereof
CN104064840A (en) * 2014-07-09 2014-09-24 南京师范大学 Miniaturized Bandstop Frequency Selective Surface
US20150312654A1 (en) * 2014-04-29 2015-10-29 General Electric Company Passive wireless sensors
CN107076621A (en) * 2014-10-30 2017-08-18 3M创新有限公司 The capacitance temperature sensing of electric conductor
CN206422238U (en) * 2016-12-28 2017-08-18 华南理工大学 A kind of three frequency filter antennas with high-frequency selectivity
US20180195879A1 (en) * 2017-01-06 2018-07-12 Florida State University Research Foundation, Inc. Temperature and pressure sensors and methods
CN109616724A (en) * 2018-12-11 2019-04-12 四川众为创通科技有限公司 Miniaturized Frequency Selective Surface Based on Double Split Resonator
CN109728441A (en) * 2018-12-20 2019-05-07 西安电子科技大学 A Reconfigurable Universal Metamaterial

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4025912A (en) * 1976-07-19 1977-05-24 The United States Of America As Represented By The Secretary Of The Navy Method and apparatus for remotely transducing and transmitting pressure and temperature changes
US5339051A (en) * 1991-12-09 1994-08-16 Sandia Corporation Micro-machined resonator oscillator
CN1947302A (en) * 2004-04-26 2007-04-11 传感技术有限公司 Split-ring coupler incorporating dual resonant sensors
US20110068794A1 (en) * 2007-02-06 2011-03-24 Chevron U.S.A., Inc. Temperature and pressure transducer
US20110152725A1 (en) * 2008-09-02 2011-06-23 Christian M. Puttlitz Consulting, Llc Biomems sensor and apparatuses and methods therefor
US20130316329A1 (en) * 2010-10-05 2013-11-28 Chris Chang Yu Micro-devices for disease detection
CN103698060A (en) * 2013-12-25 2014-04-02 中北大学 Wireless passive high-temperature pressure sensor with temperature compensation and temperature compensation algorithm thereof
US20150312654A1 (en) * 2014-04-29 2015-10-29 General Electric Company Passive wireless sensors
CN104064840A (en) * 2014-07-09 2014-09-24 南京师范大学 Miniaturized Bandstop Frequency Selective Surface
CN107076621A (en) * 2014-10-30 2017-08-18 3M创新有限公司 The capacitance temperature sensing of electric conductor
CN206422238U (en) * 2016-12-28 2017-08-18 华南理工大学 A kind of three frequency filter antennas with high-frequency selectivity
US20180195879A1 (en) * 2017-01-06 2018-07-12 Florida State University Research Foundation, Inc. Temperature and pressure sensors and methods
CN109616724A (en) * 2018-12-11 2019-04-12 四川众为创通科技有限公司 Miniaturized Frequency Selective Surface Based on Double Split Resonator
CN109728441A (en) * 2018-12-20 2019-05-07 西安电子科技大学 A Reconfigurable Universal Metamaterial

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
BENJAMIN WILTSHIRE 等: "Robust and sensitive frost and ice detection via planar microwave resonator sensor", 《SENSORS AND ACTUATORS B: CHEMICAL》 *
卢凤翔: "基于开口环谐振器超材料的薄膜型微波传感器的设计与研究", 《中国优秀硕士学位论文全文数据库工程科技Ⅰ辑》 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115128702A (en) * 2022-06-07 2022-09-30 江南大学 Composite microwave sensor and detection method
CN115128702B (en) * 2022-06-07 2023-07-04 江南大学 Composite microwave sensor and detection method

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