CN111274079A - Memory module testing temperature control device, control method, computer equipment and storage medium - Google Patents

Abstract

The invention relates to a memory module testing temperature control device, a control method, computer equipment and a storage medium, wherein the control device comprises: the testing mainboard, the temperature control module, high temperature lid subassembly and fretwork board, it has a plurality of internal memory modules that await measuring to peg graft on the testing mainboard, the fretwork board sets up in the top of testing the mainboard, the top of internal memory module is worn out the fretwork board and is partly exposed in the fretwork board top, the high temperature lid subassembly sets up in the top of fretwork board, and cover and establish around the internal memory module, the testing mainboard is connected to the input of temperature control module, the high temperature lid subassembly is connected to the output, the temperature control module receives the internal memory temperature data from the testing mainboard, and issue the control by temperature change instruction to the high temperature lid subassembly, adjust the test. Through setting up the fretwork board in the top of testing the mainboard to place the high temperature lid subassembly on the fretwork board, reduce the control by temperature change space of high temperature lid subassembly and accelerate temperature regulation, can separate test mainboard and high temperature lid subassembly simultaneously, improve life.

Description

Memory module testing temperature control device, control method, computer equipment and storage medium

technical field

The invention relates to the field of memory module testing, in particular to a memory module testing temperature control device, a control method, computer equipment and a storage medium.

Background technique

The industry currently uses a high-temperature cabinet to perform high-temperature testing on DRAM memory modules. By placing the test motherboard in the high-temperature cabinet and setting the temperature of the high-temperature cabinet, the high-temperature test of DRAM memory modules under the system is realized. At the same time, the testing equipment used in the testing process is expensive. Quantities are scarce.

The existing DRAM memory module test has the following shortcomings:

1. The high temperature test memory under the DRAM memory module system is inconvenient to plug and unplug, the test equipment is expensive, and the cost is high:

2. The mainboard is tested in a high temperature cabinet under high temperature. The operating environment temperature of the mainboard is high, which affects the work of the mainboard components and reduces the test performance;

3. The high temperature cabinet can only control the ambient temperature of the DRAM memory module, but cannot precisely control the surface temperature of the DRAM memory module;

4. The high temperature cabinet has a large temperature control space and high test power consumption.

Therefore, in order to solve the above problems, it is necessary to provide a temperature control device and control method for testing a memory module.

SUMMARY OF THE INVENTION

The purpose of the present invention is to overcome the defects of the prior art, and to provide a memory module testing temperature control device, a control method, a computer device and a storage medium.

To achieve the above object, the present invention adopts the following technical solutions:

In the first aspect, the present invention provides a memory module testing temperature control device, which includes a test mainboard, a temperature control module, a high-temperature cover assembly and a hollow plate. A plurality of memory modules to be tested are plugged into the test mainboard, so The hollow plate is provided with a through hole, the hollow plate is arranged above the test motherboard, the top of the memory module penetrates the hollow plate and is partially exposed above the hollow plate, and the high temperature cover assembly is arranged on the hollow plate. Above, and the cover is arranged around the memory module, the input end of the temperature control module is connected to the test motherboard, and the output end is connected to the high temperature cover assembly. The temperature control module receives the memory temperature data from the test motherboard, and sends a temperature control command to the high temperature Cover assembly to adjust the test temperature of the memory module.

In a second aspect, the present invention provides a method for controlling the temperature of a memory module test, comprising the following steps:

Obtain the memory temperature data of the memory module from the test motherboard and transmit it to the temperature control module;

Compare the acquired memory temperature data with the target test temperature to obtain the comparison result between the memory temperature and the target test temperature;

If the comparison result is that the memory temperature is greater than the target test temperature, the temperature control module sends a cooling instruction, starts the fan, and cools the memory module;

If the comparison result is that the memory temperature is lower than the target test temperature, the temperature control module sends a heating command, activates the heating chip, and cools the memory module.

In a third aspect, the present invention provides a computer device, the computer device includes a memory and a processor, the memory stores a computer program, and the processor implements the above-mentioned memory module test when executing the computer program temperature control method.

In a fourth aspect, the present invention provides a storage medium, where a computer program is stored in the storage medium, and when the computer program is executed by a processor, the above-mentioned method for controlling the temperature of a memory module test can be implemented.

Compared with the prior art, the present invention has the following beneficial effects: in the present invention, the hollow plate is arranged above the test mainboard, the top of the memory module penetrates the hollow plate and is exposed above the hollow plate, and a high temperature cover is placed on the hollow plate. components, reduce the temperature control space of the high-temperature cover assembly and speed up the temperature adjustment. At the same time, by setting a hollow plate on the test motherboard, the test motherboard and the high-temperature cover assembly can be effectively separated, so as to avoid the temperature of the test motherboard being too high during use, and improve the performance of the test motherboard. Test equipment life and reduce test costs.

The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

Description of drawings

In order to explain the technical solutions of the embodiments of the present invention more clearly, the following briefly introduces the accompanying drawings used in the description of the embodiments. Obviously, the drawings in the following description are some embodiments of the present invention, which are of great significance to the art For those of ordinary skill, other drawings can also be obtained from these drawings without any creative effort.

1 is a schematic structural diagram of a memory module testing temperature control device according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram from another angle of a memory module testing temperature control device according to an embodiment of the present invention;

3 is a schematic structural diagram of a high temperature cover assembly of a memory module testing temperature control device according to an embodiment of the present invention;

4 is a schematic structural diagram of a hollow plate of a memory module testing temperature control device according to an embodiment of the present invention;

5 is a schematic block diagram of the structure of a memory module testing temperature control device according to an embodiment of the present invention;

6 is a schematic structural block diagram of a temperature control device for testing a memory module according to another embodiment of the present invention;

FIG. 7 is a schematic flowchart of a method for controlling temperature for testing a memory module according to an embodiment of the present invention;

FIG. 8 is a schematic block diagram of a method for controlling temperature for testing a memory module according to an embodiment of the present invention;

FIG. 9 is a schematic block diagram of a computer device according to an embodiment of the present invention.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

It is to be understood that, when used in this specification and the appended claims, the terms "comprising" and "comprising" indicate the presence of the described features, integers, steps, operations, elements and/or components, but do not exclude one or The presence or addition of a number of other features, integers, steps, operations, elements, components, and/or sets thereof.

It is also to be understood that the terminology used in this specification of the present invention is for the purpose of describing particular embodiments only and is not intended to limit the present invention. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural unless the context clearly dictates otherwise.

It should further be understood that, as used in this specification and the appended claims, the term "and/or" refers to and including any and all possible combinations of one or more of the associated listed items .

Referring to FIGS. 1-6 , the present invention proposes a temperature control device for testing memory modules, including a test motherboard 10 , a temperature control module 20 , a high temperature cover assembly 40 and a hollow plate 30 . For the memory module 50, as shown in FIG. 4, the hollow plate 30 is provided with a through hole 31, the hollow plate 30 is disposed above the test motherboard 10, and the top of the memory module 50 protrudes through the hollow plate 30 and is partially exposed above the hollow plate 30 , the high temperature cover assembly 40 is arranged above the hollow plate 30, and the cover is arranged around the memory module 50, the input end of the temperature control module 20 is connected to the test motherboard 10, the output end is connected to the high temperature cover assembly 40, and the temperature control module 20 receives From the memory temperature data of the test motherboard 10 , a temperature control command is sent to the high temperature cover assembly 40 to adjust the test temperature of the memory module 50 .

As shown in FIG. 5 , when in use, the memory module 50 is provided with a temperature sensor, and the temperature sensor is used to acquire memory temperature data of the memory module 50 and transmit it to the test motherboard 10 . The temperature sensor can measure the temperature of the memory surface. You can use the test program to access the PCIE address space of the test motherboard 10 to read the temperature data of the temperature sensor, that is, the memory temperature data. After the memory temperature data is obtained, the serial port of the test motherboard 10 can be used Send the memory temperature data to the temperature control module 20, and the temperature control module 20 issues a temperature control instruction according to the received memory temperature data, controls the corresponding components to start, and adjusts the test temperature of the memory module 50. In the process of adjusting the temperature, The temperature data of the memory module 50 can be received at intervals in real time, and the temperature of the memory module 50 can be adjusted continuously.

Referring to FIG. 2 , the hollow plate 30 is disposed above the test mainboard 10 through the support member 60 , and a temperature insulating layer is formed between the lower surface of the hollow plate 30 and the test mainboard 10 . By installing the hollow plate 30 on the test motherboard 10 and the high temperature cover assembly 40 on the hollow plate 30, the high temperature cover assembly 40 is separated from the surface of the test motherboard 10 to protect the components of the test motherboard 10 and reduce the size of the memory module 50 of the heating space, to ensure the tightness of the high temperature cover, and to avoid the high temperature cover assembly 40 causing wear on the resistance components near the memory slot during the process of repeatedly inserting and unplugging the memory, and to prevent the high temperature environment from affecting the performance of the resistance components near the memory socket. influences.

As shown in FIG. 5 , the temperature control module 20 includes a temperature control board for issuing temperature control instructions according to the memory temperature. The temperature control board is connected to the serial port of the test motherboard 10 through a serial port converter, and receives the data from the test motherboard 10 through the serial port converter. Memory temperature data. The temperature control board receives data from the test motherboard 10 through the serial port and the serial port adapter. As shown in Figures 1 and 6, one temperature control board can be connected to multiple different test motherboards 10 or memory modules 50 at the same time, and receive multiple Memory module temperature data.

In this embodiment, the temperature control board is an STM8 temperature control board.

As shown in FIG. 3 , the high temperature cover assembly 40 includes a cover body 41 covering the memory module 50 , a fan 43 and a heating piece 42 arranged on the cover body 41 , and the fan 43 and the heating piece 42 are both electrically connected to the temperature control board. The fan 43 is used to start when the temperature control module 20 issues a cooling instruction, and continuously extracts the air inside the cover 41 to achieve the cooling of the memory module 50; the heating sheet 42 is used for the temperature control module 20 to issue a heating instruction The heating is started, and the internal temperature of the cover body 41 is raised.

Specifically, the cover body 41 is provided with an installation through hole, the fan 43 is installed in the installation through hole, and the fan 43 is installed in the through hole. When the fan 43 is working, the air inside the cover body 41 is extracted from the installation through hole.

Specifically, the test motherboard 10 is provided with a memory slot, the memory slot is connected with a transfer slot, and the memory module 50 is inserted into the transfer slot. The resistive components near the grooves cause wear and reduce the service life of the test motherboard 10 .

In the present invention, the hollow plate 30 is arranged above the test motherboard 10, the top of the memory module 50 is partially exposed above the hollow plate 30 through the hollow plate 30, and the high temperature cover assembly 40 is placed on the hollow plate 30 to reduce the high temperature cover. The temperature control space of the component 40 can speed up the temperature adjustment. At the same time, by disposing the hollow plate 30 on the test main board 10, the test main board 10 and the high temperature cover assembly 40 can be effectively separated, so as to avoid the temperature of the test main board 10 being too high during use, and improve the performance of the test main board 10. Test equipment life and reduce test costs.

FIG. 7 is a schematic flowchart of a method for controlling temperature of a memory module test provided by an embodiment of the present invention. As shown in FIG. 7 , the method includes the following steps S110 to S150.

S110: Acquire memory temperature data of the memory module from the test motherboard and transmit it to the temperature control module.

In this embodiment, a temperature sensor is provided on the temperature sensor, and the temperature sensor is used to acquire memory temperature data of the memory module and transmit it to the test motherboard. The temperature sensor can measure the temperature of the memory surface. You can use the test program to access the PCIE address space of the test motherboard to read the temperature data of the temperature sensor, that is, the memory temperature data. The temperature data is sent to the temperature control module, and the temperature control module issues a temperature control command according to the received memory temperature data, controls the corresponding components to start, and adjusts the test temperature of the memory module. During the process of adjusting the temperature, the memory can be received at real-time intervals. The temperature data of the module, and continuously adjust the temperature of the memory module.

Referring to FIG. 8, in another embodiment of the present invention, steps S111-S113 are further included before step S110.

S111 , setting the hollow plate on the test motherboard.

In this embodiment, the hollow plate is disposed above the test mainboard through the support member 60, and a temperature insulating layer is formed between the lower surface of the hollow plate and the test mainboard. By installing the hollow board on the test motherboard, and placing the high temperature cover assembly on the hollow board, the high temperature cover component is separated from the surface of the test motherboard to protect the components of the test motherboard, reduce the heating space of the memory module, and ensure high temperature. The cover is tight, and at the same time, it avoids the wear of the high-temperature cover components on the resistance components near the memory slots during the repeated insertion and removal of the memory, and avoids the impact of the high temperature environment on the performance of the resistance components near the memory sockets.

S112. Connect the memory module to be tested with the test motherboard.

In this implementation, the temperature sensor is provided with a temperature sensor, and the temperature sensor is used to acquire memory temperature data of the memory module. The temperature sensor can measure the temperature of the memory surface. You can use the test program to access the PCIE address space of the test motherboard to read the temperature data of the temperature sensor, that is, the memory temperature data. The temperature data is sent to the temperature control module, and the temperature control module issues a temperature control command according to the received memory temperature data, controls the corresponding components to start, and adjusts the test temperature of the memory module. During the process of adjusting the temperature, the memory can be received at real-time intervals. The temperature data of the module, and continuously adjust the temperature of the memory module.

S113 , disposing the high temperature cover assembly on the hollow plate and covering it over the corresponding memory module.

In this embodiment, the high-temperature cover assembly includes a cover body covering the memory module, and a fan and a heating plate disposed on the cover body. Both the fan and the heating plate are electrically connected to the temperature control board, and the fan is used under the temperature control module. It starts when a cooling command is issued, and the air inside the cover is continuously pumped out to cool the memory module; the heating plate is used to start heating when the temperature control module issues a heating command, and increase the temperature inside the cover.

S120. Compare the acquired memory temperature data with the target test temperature to obtain a comparison result between the memory temperature and the target test temperature.

S130. If the comparison result is that the memory temperature is greater than the target test temperature, the temperature control module sends a cooling instruction, starts the fan, and cools the memory module.

S140. If the comparison result is that the memory temperature is lower than the target test temperature, the temperature control module issues a heating instruction, activates the heating sheet, and heats the memory module.

In this embodiment, for steps S120-S140, the target test temperature may be a temperature value point or a temperature range, and the temperature control module can determine by comparing the acquired memory temperature data with the target test temperature. Find out whether the temperature of the memory module currently under test is high or low, and after judging the result, issue a corresponding temperature control command, where the temperature control command includes a cooling command and a heating command. Specifically, if a cooling instruction is issued, the fan is activated to cool the memory module; if a heating instruction is issued, the heating chip is activated to cool the memory module.

In the present invention, the hollow plate is arranged above the test mainboard, the top of the memory module penetrates the hollow plate and the part is exposed above the hollow plate, and a high temperature cover assembly is placed on the hollow plate, so as to reduce the temperature control space of the high temperature cover assembly and speed up the temperature At the same time, by setting a hollow plate on the test main board, the test main board and the high temperature cover components can be effectively separated, so as to avoid the high temperature of the test main board during use, improve the service life of the test equipment, and reduce the test cost.

Please refer to FIG. 9, which is a schematic block diagram of a computer device provided by an embodiment of the present application. The computer device 500 may be a terminal or a server, wherein the terminal may be an electronic device with communication functions, such as a smart phone, a tablet computer, a notebook computer, a desktop computer, a personal digital assistant, and a wearable device. The server can be an independent server or a server cluster composed of multiple servers.

Referring to FIG. 9 , the computer device 500 includes a processor 502 , a memory and a network interface 505 connected through a system bus 501 , wherein the memory may include a non-volatile storage medium 503 and an internal memory 504 .

The nonvolatile storage medium 503 can store an operating system 5031 and a computer program 5032 . The computer program 5032 includes program instructions, which, when executed, can cause the processor 502 to execute a temperature control method for testing a memory module.

The processor 502 is used to provide computing and control capabilities to support the operation of the entire computer device 500 .

The internal memory 504 provides an operating environment for the computer program 5032 in the non-volatile storage medium 503. When the computer program 5032 is executed by the processor 502, the processor 502 can execute a temperature control method for testing a memory module.

The network interface 505 is used for network communication with other devices. Those skilled in the art can understand that the structure shown in FIG. 9 is only a block diagram of a partial structure related to the solution of the present application, and does not constitute a limitation on the computer device 500 to which the solution of the present application is applied. The specific computer device 500 may include more or fewer components than shown, or combine certain components, or have a different arrangement of components.

The processor 502 is used for running the computer program 5032 stored in the memory.

It should be understood that, in this embodiment of the present application, the processor 502 may be a central processing unit (Central Processing Unit, CPU), and the processor 502 may also be other general-purpose processors, digital signal processors (Digital Signal Processor, DSP), application-specific integrated circuits ( Application Specific Integrated Circuit, ASIC), off-the-shelf Programmable Gate Array (Field-Programmable Gate Array, FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, and the like. Wherein, the general-purpose processor can be a microprocessor or the processor can also be any conventional processor or the like.

It can be understood by those skilled in the art that all or part of the processes in the methods for implementing the above embodiments can be completed by instructing relevant hardware through a computer program. The computer program includes program instructions, and the computer program can be stored in a storage medium, and the storage medium is a computer-readable storage medium. The program instructions are executed by at least one processor in the computer system to implement the flow steps of the above-described method embodiments.

Therefore, the present invention also provides a storage medium. The storage medium may be a computer-readable storage medium.

The storage medium may be various computer-readable storage media that can store program codes, such as a U disk, a removable hard disk, a read-only memory (Read-Only Memory, ROM), a magnetic disk, or an optical disk.

Those of ordinary skill in the art can realize that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. Interchangeability, the above description has generally described the components and steps of each example in terms of function. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Skilled artisans may implement the described functionality using different methods for each particular application, but such implementations should not be considered beyond the scope of the present invention.

In the several embodiments provided by the present invention, it should be understood that the disclosed apparatus and method may be implemented in other manners. For example, the apparatus embodiments described above are merely illustrative. For example, the division of each unit is only a logical function division, and other division methods may be used in actual implementation. For example, multiple units or components may be combined or may be integrated into another system, or some features may be omitted, or not implemented.

The steps in the method of the embodiment of the present invention may be adjusted, combined and deleted in sequence according to actual needs. Units in the apparatus of the embodiment of the present invention may be combined, divided, and deleted according to actual needs. In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically alone, or two or more units may be integrated into one unit.

The integrated unit, if implemented in the form of a software functional unit and sold or used as an independent product, may be stored in a storage medium. Based on this understanding, the technical solution of the present invention is essentially or a part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium , including several instructions to cause a computer device (which may be a personal computer, a terminal, or a network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention.

The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited to this. Any person skilled in the art can easily think of various equivalents within the technical scope disclosed by the present invention. Modifications or substitutions should be included within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims (10)

1. The device is characterized by comprising a test mainboard, a temperature control module, a high-temperature cover assembly and a hollow plate, wherein a plurality of memory modules to be tested are inserted into the test mainboard in an inserting mode, through holes are formed in the hollow plate, the hollow plate is arranged above the test mainboard, the top end of each memory module penetrates out of the hollow plate and is partially exposed above the hollow plate, the high-temperature cover assembly is arranged above the hollow plate and covers the periphery of the memory modules, the input end of the temperature control module is connected with the test mainboard, the output end of the temperature control module is connected with the high-temperature cover assembly, the temperature control module receives memory temperature data from the test mainboard and issues a temperature control instruction to the high-temperature cover assembly, and the test temperature of the memory modules is adjusted.

2. The device as claimed in claim 1, wherein the temperature control module comprises a temperature control board for issuing a temperature control command according to the memory temperature, the temperature control board is connected to the serial port of the test motherboard via a serial port converter, and the memory temperature data from the test motherboard is received via the serial port converter.

3. The device as claimed in claim 2, wherein the memory module is provided with a temperature sensor, and the temperature sensor is configured to obtain memory temperature data of the memory module and transmit the memory temperature data to the test motherboard.

4. The apparatus as claimed in claim 1, wherein the high temperature lid assembly comprises a lid covering the memory module, and a fan and a heater plate disposed on the lid, the fan and the heater plate being electrically connected to the thermal control board.

5. The device as claimed in claim 1, wherein the test motherboard has a memory slot, the memory slot is connected to a socket, and the memory module is plugged into the socket.

6. The apparatus according to claim 1, wherein the stencil is disposed above the test motherboard by a support member, and a thermal insulation layer is formed between a lower surface of the stencil and the test motherboard.

7. A method for controlling the test temperature of a memory module is characterized by comprising the following steps:

acquiring memory temperature data of the memory module from the test mainboard and transmitting the memory temperature data to the temperature control module;

comparing the acquired memory temperature data with a target test temperature to obtain a comparison result of the memory temperature and the target test temperature;

if the comparison result shows that the memory temperature is higher than the target test temperature, the temperature control module issues a cooling instruction, and the fan is started to cool the memory module;

if the comparison result shows that the memory temperature is lower than the target test temperature, the temperature control module issues a heating instruction, and the heating sheet is started to heat the memory module.

8. The method as claimed in claim 7, wherein the step of obtaining the memory temperature data of the memory module from the test motherboard and transmitting the memory temperature data to the temperature control module comprises:

arranging the hollow board on the test mainboard;

connecting the memory module to be tested with the test mainboard;

and arranging the high-temperature cover assembly on the hollow plate and covering the high-temperature cover assembly above the corresponding memory module.

9. A computer device, characterized in that the computer device comprises a storage and a processor, the storage stores a computer program, and the processor executes the computer program to realize the memory module test temperature control method according to claim 7 or 8.

10. A storage medium storing a computer program which, when executed by a processor, implements the memory module test temperature control method according to claim 7 or 8.

Images