CN111247407A - Temperature sensor and method of making the same - Google Patents
Temperature sensor and method of making the same Download PDFInfo
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- CN111247407A CN111247407A CN201880068847.XA CN201880068847A CN111247407A CN 111247407 A CN111247407 A CN 111247407A CN 201880068847 A CN201880068847 A CN 201880068847A CN 111247407 A CN111247407 A CN 111247407A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
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- G—PHYSICS
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- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
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- H—ELECTRICITY
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- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
- H01C1/028—Housing; Enclosing; Embedding; Filling the housing or enclosure the resistive element being embedded in insulation with outer enclosing sheath
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- H—ELECTRICITY
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- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
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Abstract
本发明涉及对热敏电阻元件进行了树脂模制的温度传感器及其制造方法,提供一种提高对于热敏电阻元件的气密性,提高制造时的性能的稳定性及成品率的温度传感器及其制造方法。温度传感器及其制造方法中,温度传感器具备由热敏电阻元件(1)和连接端子(2)构成的传感器部(A)、与连接端子(2)连接的线缆部(B)、覆盖传感器部(A)的整体及线缆部(B)的前端部的包覆部(C),其中,包覆部(C)具备:传感器壳体(5),具备中空部(5a),该中空部(5a)随着朝向收纳热敏电阻元件(1)的前端部中央而变细;弹性树脂涂敷层(6),覆盖热敏电阻元件(1)的整个面;及填充树脂层(7),填满传感器壳体(5)的内表面与弹性树脂涂敷层(6)之间。
This invention relates to a temperature sensor and its manufacturing method that uses resin molding of a thermistor element. It provides a temperature sensor and its manufacturing method that improve the airtightness of the thermistor element, enhance the stability of performance during manufacturing, and increase yield. The temperature sensor and its manufacturing method include a sensor portion (A) consisting of a thermistor element (1) and a connecting terminal (2), a cable portion (B) connected to the connecting terminal (2), and a covering portion (C) covering the entire sensor portion (A) and the front end of the cable portion (B). The covering portion (C) includes: a sensor housing (5) having a hollow portion (5a) that tapers towards the center of the front end of the thermistor element (1); an elastic resin coating layer (6) covering the entire surface of the thermistor element (1); and a filling resin layer (7) filling the space between the inner surface of the sensor housing (5) and the elastic resin coating layer (6).
Description
技术领域technical field
本发明涉及对热敏电阻元件进行树脂模制的温度传感器及其制造方法。The present invention relates to a temperature sensor in which a thermistor element is resin-molded and a method for manufacturing the same.
背景技术Background technique
温度传感器已知有将热敏电阻元件和连接端子(铜线或铜铍铁镍合金线等)通过导线连接的传感器部向金属制的壳体插入,通过由模制树脂形成的树脂模制部对壳体的开口部进行封口的结构(例如参照下述专利文献1)。A temperature sensor is known to have a sensor portion in which a thermistor element and a connection terminal (copper wire or copper beryllium-iron-nickel alloy wire, etc.) are connected by lead wires are inserted into a metal case, and a resin molded portion formed of a molded resin is passed through. The structure which seals the opening part of a case (for example, refer following patent document 1).
这样的温度传感器由于水分的浸入引起的金属合金的腐蚀等而成为传感器部的断线或短路等的原因,因此确保传感器部内的气密性的情况极其重要。Such a temperature sensor may cause disconnection or short-circuit of the sensor portion due to corrosion of the metal alloy due to infiltration of moisture, etc. Therefore, it is extremely important to ensure the airtightness in the sensor portion.
因此,提出了向金属制的壳体的开口部插入树脂制的绝缘帽,向该绝缘帽的开口部插入传感器部,在该状态下将壳体及绝缘帽的开口部通过树脂进行模制成形并封口的结构。Therefore, it has been proposed to insert an insulating cap made of resin into the opening of a metal case, insert a sensor portion into the opening of the insulating cap, and mold the opening of the case and the insulating cap with resin in this state. and sealed structure.
在该例中,通过在绝缘帽及树脂模制部采用相同树脂,成为在模制成形时该界面熔敷并将水分的浸入路径隔断的结构。In this example, by using the same resin for the insulating cap and the resin mold portion, the interface is welded during molding, and the water penetration path is blocked.
这样的温度传感器通常多使用热敏电阻元件,但是热敏电阻表面也存在由极脆的保护膜覆盖的情况。Such a temperature sensor usually uses a thermistor element, but the thermistor surface is sometimes covered with a very brittle protective film.
在先技术文献prior art literature
专利文献Patent Literature
专利文献1:日本特开2014-77678号公报Patent Document 1: Japanese Patent Laid-Open No. 2014-77678
发明内容SUMMARY OF THE INVENTION
发明要解决的课题The problem to be solved by the invention
然而,如果要将这样的温度传感器小型化,则将水分的浸入路径隔断的熔敷部分的沿面距离缩短,存在对于热敏电阻元件的气密性下降这样的问题。However, if such a temperature sensor is to be miniaturized, the creepage distance of the welded portion that blocks the penetration path of moisture is shortened, and there is a problem that the airtightness with respect to the thermistor element decreases.
另外,模制树脂在固化时,在有限的空隙内膨胀,成为使热敏电阻元件的保护膜破损的原因,使制造时的成品率下降。In addition, when the mold resin is cured, it expands in a limited space, which causes damage to the protective film of the thermistor element, and reduces the yield at the time of manufacture.
此外,这样的模制类型的温度传感器由于壳体内的热敏电阻元件的模制位置的差异而传感器的灵敏度或特性变化,也存在品质不稳定这样的问题。In addition, such a mold-type temperature sensor has a problem that the sensitivity and characteristics of the sensor change due to the difference in the molding position of the thermistor element in the housing, and the quality is not stable.
本发明鉴于上述实际情况而作出,涉及对热敏电阻元件进行了树脂模制的温度传感器及其制造方法,目的在于提供一种提高对于热敏电阻元件的气密性,提高制造时的性能的稳定性及成品率的温度传感器及其制造方法。The present invention has been made in view of the above-mentioned actual conditions, and relates to a temperature sensor in which a thermistor element is resin-molded and a method for manufacturing the same, and aims to provide a temperature sensor with improved airtightness to the thermistor element and improved performance during manufacturing. A temperature sensor for stability and yield and a method for manufacturing the same.
用于解决课题的方案solutions to problems
为了解决上述课题而作出的本发明的温度传感器具备:传感器部,由热敏电阻元件和连接端子构成;线缆部,与连接端子连接;及包覆部,覆盖传感器部的整体及线缆部的前端部,其中,包覆部具备:传感器壳体,具备中空部,该中空部随着朝向收纳热敏电阻元件的前端部中央而变细;弹性树脂涂敷层,覆盖热敏电阻元件的整个面;及填充树脂层,填满传感器壳体的内表面与弹性树脂涂敷层之间。In order to solve the above-mentioned problems, the temperature sensor of the present invention includes: a sensor part composed of a thermistor element and a connection terminal; a cable part connected to the connection terminal; and a covering part covering the entire sensor part and the cable part The front end portion of the cladding portion, wherein the covering portion includes: a sensor case having a hollow portion that tapers toward the center of the front end portion where the thermistor element is accommodated; and an elastic resin coating layer covering the thermistor element the entire surface; and a filling resin layer filling between the inner surface of the sensor housing and the elastic resin coating layer.
也可以设为具备覆盖线缆部的前端部的底漆层的温度传感器。The temperature sensor may be provided with a primer layer covering the front end portion of the cable portion.
另外,也可以采用在热敏电阻元件的整个面及从该热敏电阻元件的整个面至线缆部的前端部的区域连续地设置弹性树脂涂敷层的结构。In addition, a structure in which the elastic resin coating layer is continuously provided on the entire surface of the thermistor element and the region from the entire surface of the thermistor element to the distal end portion of the cable portion may be employed.
需要说明的是,底漆是通常作为粘接促进剂或底处理剂使用的结构,具有提高构件间的粘接性的效果。In addition, the primer is a structure normally used as an adhesion promoter or a primer treatment agent, and has the effect of improving the adhesiveness between members.
为了解决上述课题而作出的本发明的温度传感器的制造方法中,所述温度传感器具备:传感器部,由热敏电阻元件和连接端子构成;线缆部,与连接端子连接;及包覆部,覆盖传感器部的整体及线缆部的前端部,所述温度传感器的制造方法包括以下工序:连接工序,将线缆部的导线连结于传感器部的连接端子;涂敷工序,在传感器部的热敏电阻元件的整个面附着弹性树脂涂敷层;基底形成工序,在线缆部的前端部附着底漆层;装填工序,将经过了所述各工序的热敏电阻元件向具备中空部的传感器壳体的中空部的前端插入,该中空部随着朝向收纳热敏电阻元件的前端部中央而变细;填充工序,使填充树脂层填满传感器壳体的内表面与弹性树脂涂敷层之间;及固化工序,使填充树脂层固化。In the method for manufacturing a temperature sensor of the present invention, which has been devised to solve the above-mentioned problems, the temperature sensor includes: a sensor part composed of a thermistor element and a connection terminal; a cable part connected to the connection terminal; and a covering part, Covering the entire sensor portion and the front end portion of the cable portion, the temperature sensor manufacturing method includes the following steps: a connecting step of connecting a lead wire of the cable portion to a connection terminal of the sensor portion; a coating step of applying heat to the sensor portion. The elastic resin coating layer is attached to the entire surface of the thermistor element; the base forming step is to attach a primer layer to the front end of the cable part; The front end of the hollow part of the housing is inserted, and the hollow part becomes thinner toward the center of the front end part where the thermistor element is accommodated; in the filling process, the filling resin layer fills the inner surface of the sensor housing and the elastic resin coating layer. and a curing process to cure the filled resin layer.
发明效果Invention effect
根据本发明的温度传感器及其制造方法,将传感器壳体的中空部的形状设为具备随着朝向收纳热敏电阻元件的前端部中央而变细的中空部的形状,由此在热敏电阻元件与壳体的内表面的前端抵接时,自动地进行向该传感器壳体的前端部中央的定位,因此能够更简单且准确地确定该热敏电阻元件的位置。According to the temperature sensor and the method for manufacturing the same of the present invention, the shape of the hollow portion of the sensor case is provided with the hollow portion that becomes thinner toward the center of the front end portion where the thermistor element is accommodated, whereby the thermistor When the element comes into contact with the front end of the inner surface of the case, the positioning to the center of the front end portion of the sensor case is automatically performed, so that the position of the thermistor element can be more easily and accurately determined.
另外,由于中空部前端变细,因此在热敏电阻元件的附近存在的填充树脂的量减少,与填充树脂的膨胀相伴的压力朝向传感器壳体的开口部的情况相辅,能缓和向该热敏电阻元件施加的应力。In addition, since the front end of the hollow portion is tapered, the amount of the filling resin existing in the vicinity of the thermistor element is reduced, and the pressure caused by the expansion of the filling resin is directed toward the opening of the sensor case, thereby reducing the amount of heat applied to the sensor case. The stress exerted by the varistor element.
此外,通过具备覆盖热敏电阻元件的整个面的弹性树脂涂敷层,利用其缓冲作用,能够避免由于填充树脂固化时产生的压力而热敏电阻元件的表面具备的保护膜破损的不良情况。In addition, by providing the elastic resin coating layer covering the entire surface of the thermistor element, it is possible to avoid the inconvenience that the protective film provided on the surface of the thermistor element is damaged due to the pressure generated when the filling resin is cured due to its cushioning effect.
此外,通过采用还在直至线缆部的前端部的区域连续地设置该弹性树脂涂敷层的结构,也能够防止将该传感器部向包覆部装填时的连接端子的变形引起的短路。In addition, by adopting a structure in which the elastic resin coating layer is continuously provided in the region up to the front end of the cable portion, it is also possible to prevent a short circuit due to deformation of the connection terminal when the sensor portion is mounted on the covering portion.
另一方面,如果采用含有玻璃纤维或无机填料等强化材料的PPS等导热率高的原料作为传感器壳体的原料,则与热敏电阻元件附近存在的填充树脂的厚度变薄相辅,而能够提高向中空部装填的热敏电阻元件的热响应性。On the other hand, if a material with high thermal conductivity, such as PPS containing reinforcing materials such as glass fibers or inorganic fillers, is used as the material for the sensor case, the thickness of the filling resin existing near the thermistor element is reduced, so that it is possible to improve the thermal conductivity. Thermal responsiveness of hollow-packed thermistor elements.
另外,通过经由在线缆部的前端部附着底漆层的基底形成工序,线缆的包覆与填充树脂的紧贴性提高,避免沿线缆的表面的空气、湿气或油分的浸入,能够长期进行良好的温度检测。In addition, through the base forming step of attaching the primer layer to the front end of the cable portion, the adhesion between the coating of the cable and the filling resin is improved, and the infiltration of air, moisture or oil along the surface of the cable is avoided, A good temperature detection can be performed for a long time.
附图说明Description of drawings
图1是表示本发明的温度传感器的一例的剖视图。FIG. 1 is a cross-sectional view showing an example of a temperature sensor of the present invention.
图2(A)、(B)及(C)是表示本发明的温度传感器的构成要素的一例的分解图。2(A), (B) and (C) are exploded views showing an example of the constituent elements of the temperature sensor of the present invention.
图3是表示本发明的温度传感器的制造方法的一个工序的说明图。FIG. 3 is an explanatory diagram showing one step of the manufacturing method of the temperature sensor of the present invention.
图4是表示本发明的温度传感器的制造方法的一个工序的说明图。FIG. 4 is an explanatory diagram showing one step of the method of manufacturing the temperature sensor of the present invention.
图5是表示本发明的温度传感器的制造方法的一个工序的说明图。FIG. 5 is an explanatory diagram showing one step of the method of manufacturing the temperature sensor of the present invention.
图6是将本发明的温度传感器的传感器壳体的例(A)、(B)与以往的温度传感器的一例(C)进行对比地表示的剖视图。6 is a cross-sectional view showing examples (A) and (B) of the sensor housing of the temperature sensor of the present invention in comparison with an example (C) of a conventional temperature sensor.
具体实施方式Detailed ways
以下,基于附图对本发明的温度传感器的实施方式及其制造方法一起进行详细说明。Hereinafter, an embodiment of the temperature sensor of the present invention and its manufacturing method will be described in detail based on the drawings.
本发明的温度传感器具备:传感器部A,由热敏电阻元件1和连接端子2构成;线缆部B,由与连接端子2连接的导线3及对各铜线进行绝缘并保护的护套4构成;及包覆部C,覆盖传感器部A的整体及线缆部B的前端部。The temperature sensor of the present invention includes: a sensor part A consisting of a
传感器部A具备表面由玻璃制的保护膜1a覆盖的玻璃密封型的热敏电阻元件1及使该热敏电阻元件1与温度控制电路之间通电的一对连接端子2、2。The sensor unit A includes a glass-sealed
线缆部B具备一对导线3、3和将其侧面包覆的由氟橡胶等构成的护套4,一对导线3、3分别被焊接于一对连接端子2、2。The cable portion B includes a pair of
包覆部C具备:传感器壳体5,具备中空部5a,该中空部5a随着朝向收纳热敏电阻元件1的前端部中央而变细;弹性树脂涂敷层6,覆盖热敏电阻元件1的整个面;填充树脂层7,填满传感器壳体5的内表面与弹性树脂涂敷层6之间。The covering portion C includes a
传感器壳体5是采用了导热性比较高且具有绝缘性的合成树脂等的保护壳体,在该例中,采用PPS(聚苯硫醚)。The
该例的传感器壳体5具有便于设置的长方体状的外形,在其中央部具备前端变细的中空部5a。The
中空部5a具备能将热敏电阻元件1保持于传感器壳体5的前端部的大致固定位置的平面状、球面状或棱锥状的支承面5b,且具备从该支承面5b连续或断续地逐渐扩展的引导面5c(例如参照图6(A)或(B))。The
由于这样的传感器壳体5的外形及中空部5a的形状的关系,该传感器壳体5的前端部的左右的厚度增大,而该前端部的前后方向的厚度变薄。Due to the relationship between the outer shape of the
这样,由于卷绕热敏电阻元件1的环境,该热敏电阻元件1的灵敏度根据方向而不同的情况不可否认,但是作为传感器壳体5的原料的PPS是导热性比较高的绝缘原料,因此能够缓和该热敏电阻元件1的灵敏度的方向性所导致的差异。In this way, it is undeniable that the sensitivity of the
需要说明的是,在要求更高的响应性的情况下,只要含有玻璃纤维或无机填料等来提高导热性,或者使能够减薄传感器壳体5的壁厚的前端部朝向应进行温度检测的方向即可。It should be noted that, when higher responsiveness is required, it is only necessary to include glass fibers, inorganic fillers, etc. to improve thermal conductivity, or to orient the front end portion of the
该例的弹性树脂涂敷层6例如采用硅树脂等的硬度低的树脂材料,形成于热敏电阻元件1的整个面及线缆部B的前端部。The elastic
另外,该例的填充树脂层7采用环氧系树脂,以填满传感器壳体5的内表面与底漆层8之间的间隙的方式形成。In addition, the filled
<制造方法><Manufacturing method>
上述温度传感器通过将温度传感器的各构成要素在成形空间内一边抑制热敏电阻元件1的配置变动一边组装的制造方法,经由如下工序来制造:连接工序(参照图2),将线缆部B的导线3、3通过使用了激光或超声波或软钎焊等的方法焊接于传感器部A的连接端子2、2;涂敷工序(参照图3),通过使传感器部A的热敏电阻元件1在硅树脂中浸渍固化而在该热敏电阻元件1的整个面附着弹性树脂涂敷层6;基底形成工序(参照图4),通过使热敏电阻元件1的前端至线缆部B的前端部在底漆中浸渍干燥而在热敏电阻元件1的整个面及线缆部B的前端部附着底漆层8;装填工序(参照图5),将经过了所述各工序的热敏电阻元件1向传感器壳体5的中空部5a的前端的支承面5b插入;填充工序,使由环氧树脂构成的填充树脂填满传感器壳体5的内表面与底漆层8之间;及固化工序(参照图1),一边维持热敏电阻元件1的位置一边对经过了填充工序的传感器壳体5进行加热并使填充树脂固化(形成填充树脂层7)。The above-mentioned temperature sensor is manufactured through the following steps: a connection step (refer to FIG. 2 ), by a manufacturing method in which each component of the temperature sensor is assembled in the molding space while suppressing the disposition variation of the
根据该制造方法,通过经过涂敷工序,弹性树脂涂敷层6的弹性与传感器壳体5的中空部5a的逐渐扩展的方式相辅,能够防止由于固化工序之际或在使用时受到高温负载之际的填充树脂的膨胀而玻璃制的保护膜1a破损的情况。According to this manufacturing method, through the coating process, the elasticity of the elastic
另外,在填充工序之前,通过经由在热敏电阻元件1的整个面及线缆部B的前端部附着底漆层8的基底形成工序,在固化工序之际,填充树脂7与线缆部B的护套4的亲和性提高,传感器部A周边的气密性自不必说,关于该传感器部A的前端部,能够确保比以往的不经过基底形成工序的利用填充工序的水分的隔断结构更高的气密性。In addition, before the filling step, through the base forming step of adhering the
标号说明Label description
A传感器部、B线缆部、C包覆部、A sensor part, B cable part, C covering part,
1热敏电阻元件、1a保护膜、1 thermistor element, 1a protective film,
2连接端子、2 connection terminals,
3导线、4护套、3 wires, 4 sheaths,
5传感器壳体、5a中空部、5b支承面、5c引导面、5 sensor housing, 5a hollow portion, 5b support surface, 5c guide surface,
6弹性树脂涂敷层、6 elastic resin coating layer,
7填充树脂层、8底漆层。7 filling resin layer, 8 primer layer.
Claims (4)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-208683 | 2017-10-28 | ||
| JP2017208683A JP6944341B2 (en) | 2017-10-28 | 2017-10-28 | Temperature sensor and its manufacturing method |
| PCT/JP2018/037152 WO2019082618A1 (en) | 2017-10-28 | 2018-10-04 | Temperature sensor and manufacturing method for same |
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| CN111247407A true CN111247407A (en) | 2020-06-05 |
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| CN201880068847.XA Pending CN111247407A (en) | 2017-10-28 | 2018-10-04 | Temperature sensor and method of making the same |
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| JP (1) | JP6944341B2 (en) |
| CN (1) | CN111247407A (en) |
| WO (1) | WO2019082618A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117501077A (en) * | 2022-01-18 | 2024-02-02 | 株式会社芝浦电子 | Temperature sensor and method of manufacturing temperature sensor |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR102351955B1 (en) * | 2020-02-24 | 2022-01-17 | 주식회사 한성시스코 | A valve with a built-in temperature sensor and an automatic flow control hot water heating system using it |
| CN115307766B (en) | 2021-05-08 | 2025-06-03 | 热敏碟公司 | Temperature sensor probe |
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| JPS6333633A (en) * | 1986-07-28 | 1988-02-13 | Sanyo Electric Co Ltd | Manufacture of temperature detector |
| JPH01191026A (en) * | 1988-01-27 | 1989-08-01 | Mitsui Mining & Smelting Co Ltd | Cold and heat resisting shock structure for thermistor used in molten metal or the like |
| JPH0894452A (en) * | 1994-09-21 | 1996-04-12 | Mitsubishi Materials Corp | Resin mold thermistor sensor |
| JP3055727U (en) * | 1998-07-10 | 1999-01-29 | 株式会社芝浦電子 | Thermistor temperature sensor for air conditioner discharge pipe with improved water resistance and thermal shock resistance |
| KR101162301B1 (en) * | 2011-09-06 | 2012-07-04 | 주식회사 디케이쎈서 | Temperature sensor having silicone housing and process of the same |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0575631U (en) * | 1992-03-17 | 1993-10-15 | ティーディーケイ株式会社 | Temperature sensor |
| JP3378930B2 (en) * | 1994-01-31 | 2003-02-17 | 株式会社大泉製作所 | Hot water sensor |
-
2017
- 2017-10-28 JP JP2017208683A patent/JP6944341B2/en active Active
-
2018
- 2018-10-04 CN CN201880068847.XA patent/CN111247407A/en active Pending
- 2018-10-04 WO PCT/JP2018/037152 patent/WO2019082618A1/en not_active Ceased
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6333633A (en) * | 1986-07-28 | 1988-02-13 | Sanyo Electric Co Ltd | Manufacture of temperature detector |
| JPH01191026A (en) * | 1988-01-27 | 1989-08-01 | Mitsui Mining & Smelting Co Ltd | Cold and heat resisting shock structure for thermistor used in molten metal or the like |
| JPH0894452A (en) * | 1994-09-21 | 1996-04-12 | Mitsubishi Materials Corp | Resin mold thermistor sensor |
| JP3055727U (en) * | 1998-07-10 | 1999-01-29 | 株式会社芝浦電子 | Thermistor temperature sensor for air conditioner discharge pipe with improved water resistance and thermal shock resistance |
| KR101162301B1 (en) * | 2011-09-06 | 2012-07-04 | 주식회사 디케이쎈서 | Temperature sensor having silicone housing and process of the same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117501077A (en) * | 2022-01-18 | 2024-02-02 | 株式会社芝浦电子 | Temperature sensor and method of manufacturing temperature sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6944341B2 (en) | 2021-10-06 |
| WO2019082618A1 (en) | 2019-05-02 |
| JP2019082342A (en) | 2019-05-30 |
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