CN111211204A

CN111211204A - Flip chip light emitting module

Info

Publication number: CN111211204A
Application number: CN201811397413.2A
Authority: CN
Inventors: 金川
Original assignee: Azurewave Technology Shanghai Co ltd
Current assignee: Azurewave Technology Shanghai Co ltd
Priority date: 2018-11-22
Filing date: 2018-11-22
Publication date: 2020-05-29

Abstract

The invention discloses a flip chip type light emitting module which comprises a main circuit board, a heat dissipation substrate, a packaging assembly and a light emitting chip. The packaging assembly comprises a frame body surrounding the heat dissipation substrate and a lens unit arranged on the frame body. The frame body comprises a first conductive path and at least two second conductive paths separated from each other, and the first conductive path and the second conductive path are both electrically connected to the main circuit board. The light emitting chip is arranged on the heat dissipation substrate and comprises a top end conductive contact and a light emitting surface which are positioned on the same side. The top conductive contact is electrically connected to the first conductive path through a conductor. The lens unit is provided with at least one light-transmitting conductive layer electrically connected with the at least two second conductive paths. Therefore, whether the light-transmitting conducting layer is conducted or not can be detected to know whether the optical component falls off or not and corresponding protective measures are executed.

Description

Flip-chip type light emitting module

Technical Field

The present invention relates to a light emitting module, and more particularly, to a flip chip type light emitting module.

Background

The human life cannot be kept away from lighting, and the lighting device has been gradually replaced by other light emitting components from the traditional incandescent lamp, such as: a light emitting diode. Because the light emitting diode has the advantages of small volume, low energy consumption and low driving voltage, the light emitting diode can be applied to other equipment to be used as a light source after being assembled with the main circuit board comprising the driving circuit to form the light emitting module. Such light emitting modules have been widely used for, for example: the fingerprint sensor comprises a household article indicator light, a backlight source of a display, a lighting module of a portable electronic device, a light source of a detection device, a car light, or a light sensing module used as a fingerprint identifier.

Under normal use, the light emitting module is difficult to avoid being rocked or collided, and the optical assembly is gradually loosened and even slides out of the bracket. However, the conventional light emitting module does not have any design for sensing whether the optical assembly is detached, and thus there is a need for improvement.

Disclosure of Invention

The present invention is directed to a flip chip light emitting module, which can detect whether an optical element is detached through a circuit in a circuit board, in order to overcome the disadvantages of the prior art.

In order to solve the above technical problems, one of the technical solutions of the present invention is to provide a flip chip type light emitting module, which includes a main circuit board, a heat dissipating substrate, a package assembly and a light emitting chip. The packaging assembly comprises a frame body surrounding the heat dissipation substrate and a lens unit arranged on the frame body. The frame body comprises a first conductive path and at least two second conductive paths separated from each other, and the first conductive path and the second conductive path are both electrically connected to the main circuit board. The light emitting chip is arranged on the heat dissipation substrate. The light emitting chip comprises a top end conductive contact and a light emitting surface which are positioned on the same side. The top conductive contact is electrically connected to the first conductive path through a conductor. The lens unit is provided with at least one light-transmitting conductive layer electrically connected with the at least two second conductive paths.

In order to solve the above technical problem, another technical solution of the present invention is to provide a flip chip type light emitting module, which includes a main circuit board, a frame, a lens unit and a light emitting chip. The heat dissipation substrate is disposed on the heat dissipation substrate. The frame body is arranged on the main circuit substrate. The lens unit is arranged on the frame body. The light-emitting chip is arranged on the heat dissipation substrate and comprises a top end conductive contact and a light-emitting surface which are positioned on the same side. The frame body comprises a first conductive path and at least two second conductive paths separated from each other, and the first conductive path and the second conductive path are both electrically connected to the main circuit board. The lens unit comprises at least one light-transmitting conductive layer, and the at least one light-transmitting conductive layer is electrically connected with the at least two second conductive paths. Wherein the first conductive path, the at least two second conductive paths, and the at least one light-transmitting conductive layer are connected in series with each other.

The flip chip light emitting module provided by the invention has one of the advantages that the flip chip light emitting module provided by the invention can detect whether the light transmitting conductive layer is conducted or not through a packaging assembly which comprises a frame body surrounding the heat dissipation substrate and a lens unit arranged on the frame body, wherein the frame body comprises a first conductive path and at least two second conductive paths separated from each other, and the first conductive path and the second conductive paths are both electrically connected with the main circuit board, and the lens unit is provided with at least one light transmitting conductive layer electrically connected with the at least two second conductive paths, so that whether the optical component falls off or not can be known, and corresponding protection measures can be executed.

For a better understanding of the features and technical content of the present invention, reference should be made to the following detailed description of the invention and accompanying drawings, which are provided for purposes of illustration and description only and are not intended to limit the invention.

Drawings

Fig. 1 is a first side cross-sectional view of a first embodiment of the present invention.

Fig. 2 is a cross-sectional view of a second side view of the first embodiment of the invention, illustrating a first conductive path formed on an outer surface of the frame body.

Fig. 3 is a third side cross-sectional view illustrating a first conductive path formed inside a frame body according to the first embodiment of the invention.

Fig. 4 is a cross-sectional view of a fourth side of the first embodiment of the present invention.

FIG. 5 is a cross-sectional side view of the first embodiment of the present invention.

Fig. 6 is a schematic view of a light-transmitting conductive layer according to a first embodiment of the present invention.

Fig. 7 is a schematic view of a light-transmitting conductive layer according to a second embodiment of the present invention.

FIG. 8 is a cross-sectional side view of a second embodiment of the present invention.

FIG. 9 is a schematic cross-sectional side view of a third embodiment of the present invention.

FIG. 10 is a schematic cross-sectional side view of a fourth embodiment of the present invention.

FIG. 11 is a first side cross-sectional view of a fifth embodiment of the present invention.

Fig. 12 is a cross-sectional view of a fifth embodiment of the present invention from a second side.

Fig. 13 is a first side cross-sectional view of a sixth embodiment of the present invention.

Fig. 14 is a cross-sectional view of a sixth embodiment of the present invention from a second side.

Detailed Description

By removing the support 441 (see fig. 2), the height of the flip-chip light emitting module can be further reduced, and the overall size can be further reduced. Thus, the third embodiment of the present invention not only has the advantages of the first embodiment, but also can further reduce the volume. The following is a description of the embodiments of the "flip-chip light emitting module" disclosed in the present invention with reference to specific embodiments, and those skilled in the art can understand the advantages and effects of the present invention from the disclosure of the present specification. The invention is capable of other and different embodiments and its several details are capable of modification and various other changes, which can be made in various details within the specification and without departing from the spirit and scope of the invention. The drawings of the present invention are for illustrative purposes only and are not intended to be drawn to scale. The following embodiments will further explain the related art of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention.

It will be understood that, although the terms "first," "second," "third," etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are used primarily to distinguish one element from another element or from one signal to another signal. In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be.

[ first embodiment ]

Referring to fig. 1 and 2, a flip-chip light emitting module according to a first embodiment of the present invention is adapted to be mounted on a main circuit board 7 to cooperate with the main circuit board 7, or alternatively, the flip-chip light emitting module can be electrically connected to an external power source to be driven to operate. The manner and area of usage, which are not important to the present invention, are not discussed in detail herein.

Further, the flip-chip light emitting module of the present invention includes a heat dissipating substrate 1, a light emitting chip 2, a conductive adhesive layer 3, a package assembly 4, a conductive body 6 and a main circuit board 7.

The heat dissipation substrate 1 is selected from an aluminum substrate, a copper substrate, or any substrate that includes heat conducting or dissipating capabilities. One side of the heat dissipation substrate 1 can be used to electrically connect with the main circuit board 7, and the other side is electrically connected with the light emitting chip 2.

The light emitting chip 2 is disposed on the heat dissipating substrate 1 and includes a top conductive contact 21, a bottom conductive contact 22, a light emitting surface 23, and an optical axis L extending outward from the light emitting surface 23. The top conductive contact 21 and the light-emitting surface 23 are located on the same side opposite to the heat dissipation substrate 1. The bottom conductive contact 22 is electrically connected to the heat dissipation substrate 1, and preferably, the bottom conductive contact 22 is adhered to the heat dissipation substrate 1 through the conductive adhesive layer 3. The top conductive contact 21 is one of a positive or negative electrode, and the bottom conductive contact 22 is the other of the positive or negative electrode. The light emitting chip 2 is selected from a Light Emitting Diode (LED), a Resonant Cavity Light Emitting Diode (RCLED), or a vertical cavity laser diode (VCSEL). In the first embodiment, a surface emitting laser chip is used as an example for illustration. However, the above-mentioned examples are only one possible embodiment and are not intended to limit the present invention.

The package assembly 4 defines an optical channel 5 extending along the optical axis L and includes a frame 41, a first conductive path 42, at least two second conductive paths 43, a lens unit 44 and a filling adhesive layer 45. The frame 41 surrounds the heat dissipating substrate 1 and includes a sidewall 411 surrounding the outside of the heat dissipating substrate 1 and an extending wall 412 extending from the sidewall 411 toward the top conductive contact 21. The extended wall portion 412 and the tip conductive contact 21 are opposed to each other. The frame 41 may be made of a plastic material, a ceramic material or any insulating material, wherein the ceramic material has better mechanical strength and heat resistance, and therefore the first embodiment is illustrated by taking the ceramic material as an example. However, the above-mentioned examples are only one possible embodiment and are not intended to limit the present invention.

The first conductive path 42 is disposed on the frame 41 and includes a first external connection end 421, a first internal connection end 422, and a first path body 423 extending between the first external connection end 421 and the first internal connection end 422. The first external connection end 421 is located on the sidewall 411 of the frame body 41 and is used for electrically connecting with the main circuit board 7 or external components. The first inner connection terminal 422 is located on the extending wall 412 of the frame 41 and electrically connected to the top conductive contact 21. The first path body 423 may be disposed on the frame body 41, and may be formed on an inner surface of the frame body 41 (see fig. 2), an outer surface of the frame body 41 (see fig. 3), or embedded in the frame body 41 (see fig. 4). In this embodiment, the first path body 423 is disposed on an inner surface of the frame body 41. The first conductive path 42 can be a conductive wire, a metal spring, or the like with conductive property. The first embodiment is explained by taking a conducting wire as an example. However, the above-mentioned examples are only one possible embodiment and are not intended to limit the present invention.

At least two second conductive paths 43 may be disposed on the frame body 41 and the lens unit 44, and at least two second conductive paths 43 may be separated from each other, that is, two second conductive paths 43 may be separated from each other, and each second conductive path 43 may also be separated into two parts according to the design of the frame body 41 and the bracket 441 of the lens unit 44, but not limited thereto, the second conductive paths 43 may also be formed after the frame body 41 and the bracket 441 are assembled. Each of the second conductive paths 43 may include a second external connection end 431, a second internal connection end 432, and a second path body 433 extending between the second external connection end 431 and the second internal connection end 432. The second outer connection end 431 is located at the support 441 of the lens unit 44. The second inner connection terminal 432 is located on the frame 41 and is used for electrically connecting with the main circuit board 7 or an external device. The second path body 433 may be disposed on the outer surfaces of the frame body 41 and the support 441 (see fig. 2), or may be embedded inside the frame body 41 and the support 441 (see fig. 11), and when the second path body 433 and the first path body 423 are also formed on the outer surface of the frame body 41, the second path body 433 is not in electrical contact with the first conductive path 42 (see fig. 3). In the present embodiment, the second path body 433 is disposed on the outer surfaces of the frame body 41 and the bracket 441. The second conductive path 43 can be a conductive wire, a metal spring, or the like with conductive property. The first embodiment is explained by taking a conducting wire as an example. However, the above-mentioned examples are only one possible embodiment and are not intended to limit the present invention.

The lens unit 44 is disposed on the frame 41 and includes a support 441, a lens 442 and at least one light-transmissive conductive layer 443. The frame 441 is made of a light-proof material, extends from the frame 41 along the optical axis L, and defines the light-emitting channel 5 together with the frame 41 around the optical axis L. The manner of mounting the bracket 441 to the frame 41 is not limited, and any manner may be adopted, and the first embodiment is described by using an example of bonding the two by using an adhesive. Further, the support 441 has a plurality of grooves, which are formed by recessing the outer wall surface or both the inner and outer wall surfaces of the body of the support 441, and are used for accommodating the second conductive paths 43. The lens 442 is disposed on the support 441 and located in the light channel 5, wherein the lens unit 44 may be rectangular, but not limited thereto. The lens 442 may be a planar lens, a condensing lens, an astigmatic lens, or other types of lenses. The lens 442 may be made of transparent plastic or glass. The transparent plastic may be selected from poly (methyl methacrylate, PMMA), Polycarbonate (PC), Polyetherimide (PEI), Cyclic Olefin Copolymer (COC), or a mixture of a plurality thereof. In the first embodiment, the lens 442 is a planar lens 442 and is made of glass as an example. However, the choice of the above-mentioned structures and materials is merely exemplary and not limited thereto.

It should be noted that the number of the lenses 442 in the lens unit 44 may also be two or more, and the types or materials of the lenses may be the same or different, as required.

The at least one light-transmissive conductive layer 443 extends from a corner adjacent to the lens 442 to a corner adjacent to the opposite corner. The light-transmissive conductive layer 443 includes a main body section 4431 and a plurality of conducting terminals 4332. The main body portion 4431 of the transparent conductive layer 443 can be located on the upper surface or the lower surface of the lens 442, which is exemplified by the upper surface in the first embodiment. The shape of the main body segment 4431 may be S-shaped (as shown in fig. 7) or elongated (as shown in fig. 8), and the S-shape is exemplified in the first embodiment, but not limited thereto. The conducting terminals 4332 are electrically connected to the second conducting paths 43 respectively, and the conducting terminals 4332 may be located on the same surface as the main body 4431 (as shown in fig. 2) or on the side of the lens 442 (as shown in fig. 11), without any limitation, as long as they are electrically connected to the second external connection terminal 431 of the second conducting path 43, which is located on the upper surface of the lens 442 in the first embodiment. The width of the light-transmitting conductive layer 443 may be greater than, less than, or equal to the width of the second conductive path 43, without any limitation, and in the embodiment, the width of the light-transmitting conductive layer 443 is smaller than the width of the second conductive path 43 (as shown in fig. 1). Also, the light-transmitting conductive layer 443 may be made of a material that is light-transmitting and has conductivity, and the material is selected from, but not limited to: metals, indium oxide doped tin (In2O3: Sn, ITO), tin dioxide doped fluorine (SnO2: F, FTO), tin dioxide doped antimony (SnO2: Sb, ATO), and zinc oxide doped aluminum (ZnO: Al, AZO). When a metal is used, the thickness thereof is less than 10nm, and the material can be, but not limited to, gold, silver, platinum, copper, aluminum, chromium, palladium, and rhodium. In the first embodiment, indium oxide doped tin (ITO) is taken as an example. However, the selection of the above-mentioned structure and material is only exemplary and not limited thereto.

The filling adhesive layer 45 is disposed on the inner side of the frame body 41 and connected to the heat dissipation substrate 1 and the light emitting chip 2. Therefore, the adhesive layer 45 is filled in the gap formed between the frame 41 and the heat dissipation substrate 1 and the light emitting chip 2, so that the bonding between the frame and the heat dissipation substrate is more stable, and the overall structural strength of the flip chip type light emitting module is improved. However, the above-mentioned examples are only one possible embodiment and are not intended to limit the present invention.

The conductive body 6 is disposed between the light emitting chip 2 and the package 4, and electrically connects the first conductive path 42 to the top conductive contact 21 of the light emitting chip 2. The conductive body 6 is a solder ball, and is sandwiched between the extending wall 412 of the frame 41 and the top conductive contact 21 of the light emitting chip 2, so that after the reflow process, the first conductive path 42 on the extending wall 412 is electrically connected to the top conductive contact 21. However, the above-mentioned examples are only one possible embodiment and are not intended to limit the present invention.

Through the structural design of the packaging component 4, the light-emitting chip 2 can be assembled by adopting a flip chip packaging technology, the assembly is simple, the manufacturing speed can be effectively improved, and the productivity can be increased. In addition, the method can avoid the defect that wire bonding needs to reserve space for electrically connecting wires, effectively reduces the volume of the flip chip type light-emitting module, and is beneficial to being applied to miniature products.

It should be noted that the top conductive contacts 21 and the bottom conductive contacts 22 of the light emitting chip 2 are arranged in different directions, and the wires in the package 4 are also adjusted accordingly. Referring to fig. 5, in another variation of the first embodiment, the light emitting chip 2 further includes another top conductive contact 21, and the top conductive contacts 21 are respectively located on two opposite sides of the light emitting surface 23, and the package assembly 4 further includes another first conductive path 42. The flip-chip light emitting module further comprises another electrical conductor 6, wherein the electrical conductor 6 electrically connects the top conductive contacts 21 to the first conductive paths 42, respectively. In this variation, the bottom conductive contact 22 serves as one of the positive or negative electrodes, and the top conductive contact 21 serves as the other of the positive or negative electrodes. It should be noted that one of the top conductive contacts 21 may also be used as a conductive contact for transmitting signals. Referring to fig. 6, in a further variation of the first embodiment, the light emitting chip 2 does not have the bottom conductive contact 22, but includes two top conductive contacts 21, where the top conductive contacts 21 are respectively used as a positive electrode and a negative electrode. Two first conductive paths 42 of the package assembly 4 are correspondingly connected to the top conductive contacts 21. However, regardless of the arrangement of the conductive contacts of the light emitting chip 2, the structural design of the package assembly 4 still allows the light emitting chip 2 to be assembled by using the flip chip packaging technique, which has the same technical effect. However, the above-mentioned example is only one possible embodiment and is not intended to limit the present invention.

In addition, the first conductive path 42, the second conductive path 43, and the light-transmitting conductive layer 443 may be connected in series, but not limited thereto; that is, the first conductive path 42, the second conductive path 43 and the light-transmitting conductive layer 443 may be connected in parallel, however, in the parallel connection embodiment, the flip-chip light-emitting module may be provided with a monitoring component or a monitoring circuit on the circuit, and when it is detected that the light-transmitting conductive layer 443 is not over-current, the current is stopped from being transmitted to the light-emitting chip 2, so as to prevent the light-emitting chip 2 from generating a light source.

Accordingly, when the lens 442 is disposed on the support 441, the conductive ends 4332 of the transparent conductive layer 443 are electrically connected to the second external connection ends 431 of the second conductive paths 43, and then electrically connected to the detection circuit through the second conductive paths 43, so as to form a protection circuit. By detecting the resistance or current value in the protection circuit, the detection circuit can know whether the second conductive path 43 and the transparent conductive layer 443 are electrically connected. Thus, when the lens 442 is released and separated from the support 441, the transparent conductive layer 443 is separated from the second conductive path 43, i.e. is open, and the detection circuit detects that the protection circuit is open and cuts off the operation of the driving circuit, so as to stop the operation of the light emitting chip 2, thereby preventing the light emitting chip 2 from being damaged; alternatively, when the driving circuit of the light emitting chip 2 is used as the detection circuit, the protection circuit is connected in series with the driving circuit, and when the light-transmitting conductive layer 443 is disconnected from the second conductive path 43 to be broken, the driving circuit is also cut off, and the light emitting chip 2 is stopped.

From the above description, the advantages of the first embodiment of the present invention can be summarized as follows:

the circuit in the flip-chip light emitting module can detect whether the lens 442 is detached through the second conductive path 43 disposed on the support 441, and perform corresponding protection measures.

Second, the circuit in the flip-chip light-emitting module can know whether the lens 442 falls off by detecting whether the transparent conductive layer 443 is turned on, and perform corresponding protection measures.

Third, the transparent conductive layer 443 is disposed on the upper surface of the lens 442 for sensing the wear of the lens 442. When the foreign object is rubbed on the upper surface of the lens 442, the transparent conductive layer 443 is rubbed at the same time, so that if the lens 442 is rubbed too much, the transparent conductive layer 443 is easily rubbed off the lens 442, the protection circuit is opened, and the operation of the light emitting chip 2 is stopped.

The transparent conductive layer 443 is in an S-shape, so that the transparent conductive layer 443 can be ensured on all parts of the surface of the lens 442, such as: the corners, the periphery, the center, etc. are thus configured to further ensure that the transparent conductive layer 443 can be rubbed while the lens 442 is rubbed by a foreign object, thereby improving the ability of sensing the wear of the lens 442.

Fifthly, when the conducting end 4332 of the transparent conductive layer 443 extends to the side of the lens 442, the structure can increase the contact area with the second conductive path 43, thereby ensuring effective electrical connection therebetween. Therefore, only when the lens 442 is completely or almost completely separated from the support 441, the transparent conductive layer 443 will not contact the second conductive path 43 to open the protection circuit. Therefore, the second conductive path 43 and the transparent conductive layer 443 can be prevented from being staggered and broken due to slight shaking, so that the detection circuit can be prevented from misjudging.

Sixth, since the width of the second conductive path 43 is larger than the width of the transparent conductive layer 443, the two conductive paths are not easily connected electrically due to errors generated during manufacturing.

[ second embodiment ]

Referring to fig. 8, the second embodiment of the present invention is substantially the same as the first embodiment, except that: the light emitting chip 2 includes two top conductive contacts 21 and two bottom conductive contacts 22, and correspondingly, the heat dissipating substrate 1 includes two spaced plates 11. Two adjacent plates 11 define a heat dissipation channel 12.

The number of the plate members 11 may be two, three, or more than four, and the number may be adjusted according to actual needs, in this embodiment, the number of the plate members 11 is two, and the number of the heat dissipation channels 12 is one.

Thus, the second embodiment of the present invention not only has the advantages of the first embodiment, but also discloses another possible structure of the light emitting chip 2, which includes a plurality of bottom conductive contacts 22. Corresponding to the structure, the heat dissipation substrate 1 can be formed by adopting a plurality of plates 11, and the heat dissipation effect can be further improved through the heat dissipation channel 12 therein.

It should be noted that even if only one bottom conductive contact 22 is provided, the heat dissipation substrate 1 can be formed by using a plurality of plates 11, that is, one bottom conductive contact 22 is attached to two or more than three plates 11, in this way, the heat dissipation substrate 1 can have a conductive function, and the heat dissipation effect can be further improved through the heat dissipation channel 12.

However, the above-mentioned example is only one possible embodiment and is not intended to limit the present invention.

[ third embodiment ]

Referring to fig. 9, the third embodiment of the present invention is substantially the same as the first embodiment, except that: lens unit 44 does not include a bracket 441 (see fig. 2), and lens 442 is disposed directly on frame 41, i.e., frame 41 also serves as bracket 441.

It should be noted that, in the present embodiment, the light-transmitting conductive layer 443 can be located on the lower surface of the lens 442. Therefore, the conductive ends 4332 of the transparent conductive layer 443 can be electrically connected to the second conductive paths 43, so as to achieve the technical effect of detecting whether the lens 442 is detached.

In addition, the configuration of the conductive contacts of the light emitting chip 2 in the third embodiment is the same as that of any one of the embodiments shown in the first embodiment, and a user can adjust the configuration according to actual requirements without any limitation. However, for convenience of illustration, the light emitting chip 2 of the third embodiment of the present invention is implemented by using two top conductive contacts 21 and one bottom conductive contact 22.

[ fourth embodiment ]

Referring to fig. 10, the fourth embodiment of the present invention is substantially the same as the first embodiment, and the main difference is: the holder 441 is integrally formed with the holder body 41.

By integrally molding the holder 441 and the frame body 41, the assembly of the flip-chip light-emitting module is not required, and the strength of the structure of the package assembly 4 can be further enhanced.

Thus, the fourth embodiment of the present invention not only has the advantages of the first embodiment, but also has the advantages of simplifying the manufacturing process and improving the structural strength.

In addition, the configuration of the conductive contacts of the light emitting chip 2 in the fourth embodiment of the present invention is the same as that of any one of the embodiments shown in the first embodiment, and a user can adjust the configuration according to actual requirements without any limitation. However, for convenience of illustration, the light emitting chip 2 of the fourth embodiment adopts two top conductive contacts 21 and one bottom conductive contact 22.

[ fifth embodiment ]

Referring to fig. 11, the fifth embodiment of the present invention is substantially the same as the first embodiment, and the main difference is: the light-transmissive conductive layer 443 is disposed on the lower surface of the lens 442, and the second external connection end 431 of the second conductive path 43 extends to be adjacent to the lower surface of the lens 442. Therefore, the second conductive path 43 can be electrically connected to the light-transmitting conductive layer 443.

Referring to fig. 12, in another variation of the fifth embodiment of the present invention, the transparent conductive layer 443 is mainly located on the lower surface of the lens 442, and the conductive end 4332 of the transparent conductive layer 443 extends to the side edge of the lens 442. Also, the second conductive path 43 is provided inside the support 441.

Further, the second conductive path 43 is disposed inside the support 441, and is adjusted according to the material and manufacturing process of the support 441. When the support 441 is made of a thermoplastic material, the second conductive path 43 may be placed in a mold for manufacturing the support 441, and then the second conductive path 43 is coated with a plastic material and further cured to form the support 441; when the frame 441 is made of a ceramic material, the second conductive path 43 may be first placed in the blank, and then sintered together, so that the second conductive path 43 is embedded in the frame 441. However, the manufacturing method can be adjusted according to any conventional method, and is not limited thereto.

Therefore, when the second conductive path 43 is embedded in the frame 441, the second conductive path 43 can be further prevented from being damaged by the friction of an external object, and it can be further ensured that the lens 442 is separated from the frame 441 or the transparent conductive layer 443 is damaged instead of the second conductive path 43 itself being damaged.

As described above, the second embodiment has the advantages of the first embodiment, and the accuracy of whether or not the detection lens 442 is detached from the holder 441 or excessively worn can be further ensured by embedding the second conductive path 43 in the holder 441.

In addition, the configuration of the conductive contacts of the light emitting chip 2 in the fifth embodiment of the present invention is the same as that of any one of the embodiments shown in the first embodiment, and a user can adjust the configuration according to actual requirements without any limitation.

[ sixth embodiment ]

Referring to fig. 13, the sixth embodiment of the present invention is substantially the same as the first embodiment, and the main difference is: the conductive end 4332 of the light-transmitting conductive layer 443 extends to the side of the lens 442, and the second external connection end 431 of one of the second conductive paths 43 extends to the lower surface adjacent to the lens 442.

Referring to fig. 14, in another variation of the sixth embodiment of the present invention, the second conductive path 43 is mainly disposed inside the support 441, and the disposing manner of the second conductive path 43 is the same as that of the another variation of the fifth embodiment, and is not repeated herein. .

As described above, the sixth embodiment of the present invention has the advantages of the first embodiment, and can further ensure the accuracy of whether or not the detection lens 442 is detached from the holder 441 or excessively worn by embedding the second conductive path 43 in the holder 441.

In addition, the configuration of the conductive contacts of the light emitting chip 2 in the sixth embodiment of the present invention is the same as that of any one of the embodiments shown in the first embodiment, and a user can adjust the configuration according to actual requirements without any limitation.

[ advantageous effects of the embodiments ]

In summary, the flip-chip light emitting module provided by the present invention can detect whether the transparent conductive layer 443 is conductive, that is, whether the lens 442 falls off, and perform corresponding protection measures by "a package assembly 4 including a frame body 41 surrounding the heat dissipating substrate 1 and a lens unit 44 disposed on the frame body 41, wherein the frame body 41 includes a first conductive path 42 and at least two second conductive paths 43 separated from each other, the first conductive path 42 and the second conductive path 43 are both electrically connected to the main circuit board 7" and "the lens unit 44 has at least one transparent conductive layer 443 electrically connected to the at least two second conductive paths 43".

The disclosure is only a preferred embodiment of the invention, and is not intended to limit the scope of the claims, so that all technical equivalents and modifications using the contents of the specification and drawings are included in the scope of the claims.

Claims

1. A flip-chip light emitting module, comprising:

a main circuit board;

the heat dissipation substrate is arranged on the main circuit board;

a package assembly including a frame surrounding the heat sink substrate and a lens unit disposed on the frame, the frame including a first conductive path and at least two second conductive paths separated from each other, the first and second conductive paths both being electrically connected to the main circuit board; and

a light emitting chip disposed on the heat dissipation substrate, the light emitting chip including a top conductive contact and a light emitting surface on the same side, the top conductive contact being electrically connected to the first conductive path through a conductor;

the lens unit is provided with at least one transparent conducting layer electrically connected with the at least two second conducting paths.

2. The flip-chip light module as claimed in claim 1, wherein the frame body includes a sidewall surrounding the heat sink substrate and an extended wall extending from the sidewall toward the top conductive contact, the first conductive path includes a first external connection terminal located at the sidewall and a first internal connection terminal located at the extended wall and electrically connected to the top conductive contact through the electrical conductor; the first conductive path further includes a first path body extending between the first outer connection end and the first inner connection end, the first path body being located on one of an inner surface, an outer surface, and an interior of the frame body.

3. The flip-chip light emitting module of claim 1, wherein the heat-dissipating substrate is a metal plate, and the light emitting chip further comprises a bottom conductive contact electrically connected to the heat-dissipating substrate.

4. The flip-chip light module of claim 1 wherein the light emitting chip further comprises another top conductive contact, the package further comprises another first conductive path, the flip-chip light module further comprises another electrical conductor electrically connecting the top conductive contact to the first conductive path, respectively; the radiating substrate is composed of a plurality of spaced plates, the plates are metal plates, two adjacent plates define a radiating channel together, the light-emitting chip further comprises a plurality of bottom conductive contacts, and the bottom conductive contacts are electrically connected with the plates respectively.

5. The flip-chip light module as claimed in claim 1, wherein the light chip further comprises an optical axis extending outward from the light emitting surface, the lens unit further comprises a support disposed on the frame and a lens, the support and the frame together define a light channel around the optical axis, and the lens is disposed on the support and located in the light channel; wherein the bracket and the frame body are manufactured in an integrated manner.

6. The flip-chip light emitting module of claim 1, wherein the package assembly further comprises a filling adhesive layer filled between the frame and the heat dissipation substrate.

7. The flip-chip light module as claimed in claim 1, wherein the frame of the package is made of a ceramic material, the light emitting chip is selected from a light emitting diode, a cavity light emitting diode, or a surface emitting laser chip, the conductive body is a solder ball, and the first conductive path is a wire.

8. The flip-chip light module as claimed in claim 1, wherein the light-transmissive conductive layer is disposed on one of an outer surface and an inner surface of the lens unit, and the light-transmissive conductive layer includes two conductive terminals disposed on both side edges of the lens unit; the second conductive path is arranged on one of an outer wall surface, an inner wall surface and an inner part of the bracket; the second conductive path comprises a second external connecting end, and the second external connecting end extends to the inner wall surface of the bracket and is electrically connected with the conducting end; when the lens unit is loosened from the support, the light-transmitting conductive layer is not electrically connected with the second conductive path.

9. The flip-chip light module of claim 1, wherein the lens unit is rectangular, and the light-transmissive conductive layer extends from adjacent one corner of the lens unit to adjacent an opposite corner thereof; the light-transmitting conductive layer is in one of an S shape and a long strip shape, and the width of the second conductive path is larger than that of the transparent conductive layer.

10. A flip-chip light emitting module, comprising:

a main circuit board;

a heat dissipation substrate disposed on the heat dissipation substrate;

the frame body is arranged on the main circuit substrate;

the lens unit is arranged on the frame body; and

the light-emitting chip is arranged on the heat dissipation substrate and comprises a top end conductive contact and a light-emitting surface which are positioned on the same side;

the frame body comprises a first conductive path and at least two second conductive paths separated from each other, and the first conductive path and the second conductive path are both electrically connected to the main circuit board;

the lens unit comprises at least one light-transmitting conductive layer, and the at least one light-transmitting conductive layer is electrically connected with the at least two second conductive paths;

wherein the first conductive path, the at least two second conductive paths, and the at least one light-transmitting conductive layer are connected in series with each other.